Dust removal device and vacuum coating equipment

Abstract

The present application relates to a dust removal device and a vacuum coating device, wherein the dust removal device comprises a first dust removal component; and a second dust removal component, which is arranged opposite to and spaced from the first dust removal component to form a gas circulation channel between the two; wherein the first dust removal component and the second dust removal component are configured to simultaneously form a temperature field and an electrostatic field with overlapping areas in the gas circulation channel, and both the temperature field and the electrostatic field can provide a force to move the dust toward the second dust removal component. When the dust passes through the dust removal device, the dust can be collected on the second dust removal component under the dual effects of the temperature field and the electrostatic field without blocking the entire gas circulation channel, thereby ensuring the effective pumping speed of the vacuum coating equipment and improving the stability of the coating process and the repeatability of the large-scale coating quality.

Description

Technical Field

[0001] The present application relates to the technical field of dust removal equipment, and in particular to a dust removal device and vacuum coating equipment. Background Art

[0002] Vacuum coating equipment, especially several typical process (PECVD, ALD, LPCVD, sputtering, etc.) equipment, is widely used in the photovoltaic industry to prepare silicon nitride (SiNx) positive and back films, aluminum oxide, silicon oxide, polysilicon and other functional films. As a result, the number of vacuum coating equipment on large-scale production lines is increasing, so the problem of equipment maintenance is becoming increasingly severe, and the proportion of equipment maintenance in battery preparation costs is increasing.

[0003] One of the most important items is the maintenance of vacuum pumps, pump pipes, butterfly valves and angle valves. The reason is that during the vacuum coating process, a large amount of product dust (such as SiNx, AlOx, etc.) is often generated. The dust is generated at the coating position of the reaction chamber, and then enters the pump pipe along the reaction gas streamline, flows through the butterfly valve and angle valve, and finally enters the vacuum pump. Therefore, the valve components and vacuum pumps used are easy to damage and need to be shut down for maintenance frequently, which significantly affects the machine utilization rate.

[0004] To solve this problem, some existing vacuum coating equipment has installed filters (or catchers) in front of the vacuum pump or valve body, but dust is often captured by increasing the dust flow and multi-layer filter screens. The disadvantage is that the flow resistance of the pump pipe system is increased. As the working time of the equipment increases, dust accumulates inside the filter and the flow resistance of the filter continues to increase, which will cause the effective pumping speed at the reaction chamber exhaust position to continue to decrease, thereby affecting the stability of the process and the repeatability of large-scale coating quality. Summary of the invention

[0005] Based on this, it is necessary to provide a dust removal device and vacuum coating equipment that can ensure the effective pumping speed and improve the stability of the process and the repeatability of large-scale coating quality, in order to address the problem that the filters used in existing vacuum coating equipment will cause the effective pumping speed at the reaction chamber exhaust position to continue to decrease, thereby affecting the stability of the process and the repeatability of large-scale coating quality.

[0006] The present application provides a dust removal device, comprising:

[0007] a first dust removal assembly; and

[0008] A second dust removal assembly is arranged opposite to and spaced from the first dust removal assembly to form a gas flow channel therebetween;

[0009] Among them, the first dust removal component and the second dust removal component are configured to simultaneously form a temperature field and an electrostatic field with overlapping areas in the gas circulation channel, and both the temperature field and the electrostatic field can provide a force to move the dust toward the second dust removal component.

[0010] In one embodiment, the first dust removal assembly includes a heating device and a negative electrode, and the second dust removal assembly includes a cooling device and a positive electrode;

[0011] The heating device is used to heat the gas flowing through the gas flow channel, and the cooling device is used to cool the gas flowing through the gas flow channel. The heating device and the cooling device can form a temperature field in the gas flow channel;

[0012] The negative electrode and the positive electrode can form an electrostatic field in the gas flow channel.

[0013] In one embodiment, the heating device is disposed inside the negative electrode; or

[0014] The heating device is covered on the outer surface of the negative electrode.

[0015] In one embodiment, the cooling device includes a cold trap and a refrigerator, and the refrigerator is used to cool the cold trap.

[0016] In one embodiment, the dust removal device further comprises a temperature controller, which is communicatively connected to the heating device and the cooling device, and is used to control the heating temperature of the heating device within a first preset temperature range, and to control the cooling temperature of the cooling device within a second preset temperature range; and / or

[0017] The dust removal device also includes a field strength controller, which is communicatively connected with the positive electrode and the negative electrode and is used to control the electric field strength of the electrostatic field.

[0018] In one embodiment, the first dust removal assembly extends along the extension direction of the gas flow channel; and / or

[0019] The second dust removal assembly extends along the extension direction of the gas circulation channel.

[0020] In one embodiment, the gas flow channel includes a first sub-channel and a second sub-channel that are connected in sequence along its extension direction, and the first sub-channel is arranged obliquely with respect to the second sub-channel.

[0021] In one embodiment, the first sub-channel and the second sub-channel both include an inlet and an outlet, the outlet of the first sub-channel is arranged closer to the second dust removal component and is inclined relative to the second dust removal component, and the inlet of the second sub-channel is arranged closer to the second dust removal component and is inclined relative to the second dust removal component.

[0022] In one embodiment, the number of the first sub-channels includes at least two, and the first sub-channels and the second sub-channels are arranged alternately in sequence; and / or

[0023] The number of the second sub-channels includes at least two, and the first sub-channels and the second sub-channels are arranged alternately in sequence.

[0024] In one embodiment, the air flow channel is arc-shaped along its extension direction.

[0025] In one embodiment, the first dust removal assembly includes at least two first sub-dust removal assemblies spaced apart from each other, the second dust removal assembly includes at least two second sub-dust removal assemblies spaced apart from each other, and the gas flow channel includes a plurality of sub-channels spaced apart from each other;

[0026] Each first sub-dust removal component is opposite to a corresponding second sub-dust removal component and is arranged at intervals to form a corresponding sub-channel between the two.

[0027] In one of the embodiments, the second dust removal assembly further comprises a dust collection chamber, and the dust collection chamber is communicated with the gas circulation channel.

[0028] In one of the embodiments, one side of the second dust removal component has an opening connected to the dust collection chamber, and the opening is arranged toward the first dust removal component.

[0029] In one embodiment, the dust removal device further comprises an adsorbent, which is disposed in the dust collecting chamber and is used to adsorb dust entering the dust collecting chamber; and / or

[0030] The dust removal device also includes a filter element, which is arranged in the dust collection chamber and is used to absorb the dust entering the dust collection chamber.

[0031] In one embodiment, the dust removal device also includes a shell, the shell has a dust removal chamber, the first dust removal component is arranged in the dust removal chamber, the second dust removal component is arranged on the outside of the shell, and the shell is also provided with a connecting hole, and the second dust removal component is connected to the dust removal chamber through the connecting hole.

[0032] On the other hand, the present application provides a vacuum coating device, including a reaction chamber, a negative pressure device and a dust removal device of any of the above embodiments, wherein the negative pressure device is connected to the reaction chamber and is used to provide negative pressure to the reaction chamber, and the dust removal device is arranged between the reaction chamber and the negative pressure device.

[0033] In one of the embodiments, the vacuum coating equipment further includes a connecting pipe, both ends of which are respectively connected to the reaction chamber and the negative pressure device, and the dust removal device is arranged on the connecting pipe.

[0034] In one embodiment, the vacuum coating device further comprises a butterfly valve, which is arranged on a connecting pipe between the dust removal device and the negative pressure device; and / or

[0035] The vacuum coating equipment also includes an angle valve, which is arranged on the connecting pipeline between the dust removal device and the negative pressure device.

[0036] The above-mentioned dust removal device and vacuum coating equipment can collect dust onto the second dust removal component under the dual effects of temperature field and electrostatic field when the dust passes through the dust removal device, without blocking the entire gas flow channel, thereby ensuring the effective pumping speed of the vacuum coating equipment and improving the stability of the coating process and the repeatability of large-scale coating quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a structural schematic diagram of a vacuum coating device in one embodiment of the present application;

[0038] Figure 2 It is a structural schematic diagram of a dust removal device in one embodiment of the present application;

[0039] Figure 3 It is a structural schematic diagram of a dust removal device in another embodiment of the present application;

[0040] Figure 4 This is a schematic structural diagram of a dust removal device in another embodiment of the present application;

[0041] Figure 5 This is a schematic structural diagram of a dust removal device in yet another embodiment of the present application.

[0042] Reference numerals:

[0043] Dust removal device 100, first dust removal assembly 10, first sub-dust removal assembly 11, second dust removal assembly 20, cooling device 21, positive electrode 22, second sub-dust removal assembly 23, dust collection chamber 24, opening 25, gas flow channel 30, first sub-channel 31, second sub-channel 32, housing 40, communication hole 41;

[0044] Vacuum coating equipment 200 , reaction chamber 210 , negative pressure device 220 , connecting pipe 230 , connecting pipe 231 , connecting pipe 232 , butterfly valve 240 , angle valve 250 . DETAILED DESCRIPTION

[0045] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0047] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0048] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0049] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0050] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0051] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0052] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0053] Figure 1 A schematic structural diagram of a vacuum coating device in one embodiment of the present application is shown.

[0054] Referring to the drawings, an embodiment of the present application provides a dust removal device 100, including a first dust removal component 10 and a second dust removal component. The dust removal device 100 of the present application can be applied to a vacuum coating device 200, and can also be applied to other devices suitable for the dust removal device 100, without limitation.

[0055] The first dust removal assembly 10 and the second dust removal assembly 20 are opposite to each other and spaced apart to form a gas flow passage 30 therebetween.

[0056] Among them, the first dust removal component 10 and the second dust removal component 20 are configured to simultaneously form a temperature field and an electrostatic field with overlapping areas in the gas circulation channel 30, and both the temperature field and the electrostatic field can provide a force to move the dust toward the second dust removal component 20.

[0057] It should be pointed out that the simultaneous formation of a temperature field and an electrostatic field with an overlapping area in the gas circulation channel 30 means that the area where the temperature field is located and the area where the electrostatic field is located at least partially overlap, rather than being arranged sequentially front to back or left to right along the flow direction of the gas flow so that there is no overlapping area between the two.

[0058] In actual applications, when dust follows the airflow into the gas circulation channel 30, under the action of the temperature field, according to the thermophoresis principle, the dust will be deflected toward the second dust removal component 20 and thus collected.

[0059] Furthermore, since the dust generated in the plasma-based coating process is often negatively charged, under the action of the electrostatic field, the dust will be deflected toward the second dust removal component 20 and thus collected.

[0060] Therefore, the dust removal device 100 of the present application can collect dust onto the second dust removal component 20 under the dual effects of the temperature field and the electrostatic field without blocking the entire gas circulation channel 30, thereby ensuring the effective pumping speed of the vacuum coating equipment 200 and improving the stability of the coating process and the repeatability of large-scale coating quality.

[0061] In order to increase the intensity of the electrostatic field, in some embodiments, the first dust removal component 10 extends along the extension direction of the gas circulation channel 30, and the second dust removal component 20 can also extend along the extension direction of the gas circulation channel 30. In other implementations, only one of the first dust removal component 10 or the second dust removal component 20 can extend along the extension direction of the gas circulation channel 30.

[0062] It should be noted that the first dust removal component 10 extends along the extension direction of the gas flow channel 30, and can be extended in a straight line, in a curve, or in other special shapes, which are not specifically limited. Similarly, the extension method of the second dust removal component 20 is similar to that of the first dust removal component 10, and will not be repeated.

[0063] Specifically in the embodiment of the present application, the first dust removal component 10 includes a heating device and a negative electrode, and the second dust removal component 20 includes a cooling device 21 and a positive electrode 22.

[0064] The heating device is used to heat the gas flowing through the gas circulation channel 30 , and the cooling device 21 is used to cool the gas flowing through the gas circulation channel 30 . The heating device and the cooling device 21 can form a temperature field in the gas circulation channel 30 .

[0065] The negative electrode and the positive electrode 22 can form an electrostatic field within the gas flow channel 30 .

[0066] In actual applications, when dust follows the airflow into the gas circulation channel 30, the heating device can heat the gas flowing through the gas circulation channel 30, and the cooling device 21 can cool the gas flowing through the gas circulation channel 30. Therefore, due to the temperature difference between the two, a temperature field is formed in the gas circulation channel 30. Therefore, under the action of the thermophoresis principle, the dust will be deflected toward the cooling device 21 and collected.

[0067] Furthermore, since the dust generated in the plasma-based coating process is often negatively charged, when there is a potential difference between the negative electrode and the positive electrode 22 , an electrostatic field will be generated. Therefore, the negatively charged dust will tend to deposit on the surface of the positive electrode 22 .

[0068] In some specific embodiments, the heating device may be disposed inside the negative electrode. Furthermore, the heating device may be laid inside the negative electrode. In another specific embodiment, the heating device may also be disposed outside the negative electrode, for example, covered on the outer surface of the negative electrode. In this way, the structure and manufacturing process can be simplified.

[0069] In the embodiments of the present application, the heating device may be at least one of a resistance wire, a heating plate or a heating film, without specific limitation.

[0070] Specifically in some embodiments, the cooling device 21 may be disposed inside the positive electrode 22. Specifically, the cooling device 21 includes a cooling pipe, which may be laid inside the positive electrode 22. Specifically in other embodiments, the cooling device 21 may also be disposed outside the positive electrode 22, for example, covering the outer surface of the positive electrode 22, or being spaced apart from the positive electrode 22, so as to provide a cooling medium to the surface of the positive electrode 22. In this way, the structure and manufacturing process can be simplified.

[0071] In the embodiment of the present application, the cooling device 21 includes a refrigerator. Specifically, the refrigerator may be a water-cooled refrigerator or an air-cooled refrigerator.

[0072] like Figure 2 As shown, in some embodiments, the gas flow channel 30 includes a first sub-channel 31 and a second sub-channel 32 that are connected in sequence along its extension direction, and the first sub-channel 31 is arranged obliquely relative to the second sub-channel 33.

[0073] In this way, after the dust enters the air flow circulation channel 30, it will pass through the first sub-channel 31 and the second sub-channel 32. Since the first sub-channel 31 is inclined relative to the second sub-channel 33, the dust will move in two different directions under the action of the temperature field and the electrostatic field, avoiding movement in a single direction, which makes it difficult for the dust to be deflected to the second dust removal component 20 at the same time and be completely collected.

[0074] Specifically, the first dust removal component 10 includes at least two first sub-dust removal components 11, and the second dust removal component 20 includes at least two second sub-dust removal components 23. Each first sub-dust removal component 11 is opposite to and spaced from a corresponding second sub-dust removal component 23 to form a corresponding sub-channel therebetween.

[0075] One of the first sub-dust removal components 11 is inclined relative to the other first sub-dust removal component 11, and the two second sub-dust removal components 23 corresponding to the two first sub-dust removal components 11 can be arranged opposite to and spaced from the corresponding first sub-dust removal components 11 to form two relatively inclined sub-channels, namely the above-mentioned first sub-channel 31 and second sub-channel 32. More specifically, the two second sub-dust removal components 23 can be arranged in parallel with the corresponding first sub-dust removal components 11, respectively.

[0076] Please continue reading Figure 2 Furthermore, the first sub-channel 31 and the second sub-channel 32 both include an inlet and an outlet. The outlet of the first sub-channel 31 is arranged closer to the second dust removal component 20 and is inclined relative to the second dust removal component 20. The inlet of the second sub-channel 32 is arranged closer to the second dust removal component 20 and is inclined relative to the second dust removal component 20.

[0077] Since the outlet of the first sub-channel 31 is arranged closer to the second dust removal component 20 and is inclined relative to the second dust removal component 20, the dust will move closer to the second dust removal component 20 when moving toward the second sub-channel 32, which is more conducive to the dust being deflected toward the second dust removal component 20. In addition, since the inlet of the second sub-channel 32 is arranged closer to the second dust removal component 20 and is inclined relative to the second dust removal component 20, when the dust enters the second sub-channel 32, it will be difficult to climb the slope toward the outlet, which makes it easier for the dust to be deflected toward the second dust removal component 20 away from the outlet and be collected.

[0078] like Figure 3 As shown, in some embodiments, the number of the first sub-channels 31 includes at least two, and the first sub-channels 31 and the second sub-channels 32 are alternately arranged in sequence.

[0079] In this way, on the flow path of the gas, the dust can move under the action of temperature fields and electrostatic fields in multiple different directions, thereby increasing the amount of dust collected.

[0080] In other embodiments, the number of the second sub-channels 32 includes at least two, and the first sub-channels 31 and the second sub-channels 32 are alternately arranged in sequence.

[0081] In other embodiments, the number of the first sub-channels 31 includes at least two, and the number of the second sub-channels 32 includes at least two, and the first sub-channels 31 and the second sub-channels 32 are alternately arranged in sequence.

[0082] like Figure 4 As shown, in some embodiments, a plurality of first sub-dust removal assemblies 11 are spaced apart from each other, a plurality of second sub-dust removal assemblies 23 are spaced apart from each other, and a plurality of sub-channels are spaced apart from each other.

[0083] Multiple sub-channels can form electrostatic fields of different strengths or temperature fields of different temperature differences. Dust enters electric fields and / or temperature fields of different strengths, further improving the dust collection efficiency.

[0084] like Figure 5 As shown, in some embodiments, the air flow channel 30 is arc-shaped along its extension direction.

[0085] The arc-shaped air flow passage 30 changes the direction of dust flow and can also make the dust move under the action of temperature fields and electrostatic fields in different directions, thereby increasing the amount of dust collection.

[0086] Specifically, the first sub-dust removal assembly 10 is arc-shaped, and the second sub-dust removal assembly 20 is also arc-shaped.

[0087] Please continue reading Figure 1 In some embodiments, the dust removal device 100 further includes a housing 40, the housing 40 has a dust removal chamber, the first dust removal assembly 10 is disposed in the dust removal chamber, the second dust removal assembly 20 is disposed outside the housing 40, and the housing 40 is further provided with a connecting hole 41, and the second dust removal assembly 20 is connected to the dust removal chamber through the connecting hole 41. In this way, dust can be deflected from the dust removal chamber to the second dust removal assembly 20 through the connecting hole 41. Since the dust is concentrated on the second dust removal assembly 20, the second dust removal assembly 20 is disposed outside the housing 40, which is convenient for the subsequent timely treatment of the dust, and does not affect the air circulation of the gas circulation channel 30.

[0088] It should be pointed out that the gas circulation channel 30 formed between the first dust removal component 10 and the second dust removal component 20 is at least partially located in the dust removal chamber. Specifically, the side of the first dust removal component 10 facing the second dust removal component 20 is spaced from the cavity wall of the dust removal chamber to form at least a portion of the gas circulation channel 30.

[0089] In other embodiments, the first dust removal assembly 10 may also be disposed on the outside of the shell 40, or the second dust removal assembly 20 may be disposed in the dust removal chamber, which is not limited here.

[0090] Furthermore, the shell 40 is tubular, so that the dust removal device 100 can be connected as a whole to the pump pipe of the vacuum coating equipment 200, thereby simplifying the installation process.

[0091] Specifically, the shell 40 is provided with an inlet and an outlet, and flange structures are provided at the inlet and the outlet. The shell 40 can be connected to the pump pipe through the flange structure.

[0092] Preferably, the inner diameter of the housing 40 may be the same as the inner diameter of the pump tube, thus reducing the introduction of additional flow resistance.

[0093] In the embodiment of the present application, the second dust removal assembly 20 further has a dust collection chamber 23 , and the dust collection chamber 23 is communicated with the gas circulation channel 30 .

[0094] In this way, under the action of the temperature field and the electrostatic field, the dust deflected toward the second dust removal assembly 20 will be deposited in the dust collection chamber 23, and will not affect the gas flow in the gas flow channel 30.

[0095] Specifically, the dust collecting chamber 23 is recessed in a direction away from the first dust removal assembly 10 .

[0096] In order to allow dust to smoothly enter the dust collecting chamber 23 , further, one side of the second dust removal component 20 has an opening 24 connected to the dust collection chamber 23 , and the opening 24 is arranged toward the first dust removal component 10 .

[0097] More specifically, when the second dust removal assembly 20 is disposed on the outside of the shell 40 , the second dust removal assembly 20 having a side of the opening 24 is disposed toward the connecting hole 41 so that the connecting hole 41 is connected to the dust collecting chamber 23 .

[0098] In some embodiments, the cooling device 21 includes a cold trap having a dust collection chamber 23, and a refrigerator is used to cool the cold trap.

[0099] By providing the cooling device 21 including a cold trap, it can not only provide a low-temperature surface for condensation capture, but also improve the vacuum efficiency.

[0100] Specifically, the refrigerator may be arranged outside the cold trap.

[0101] In some embodiments, the dust removal device 100 further includes an adsorbent, which is disposed in the dust collection chamber 23 and is used to adsorb dust entering the dust collection chamber 23. Specifically, the adsorbent may be an activated carbon adsorbent, etc., which is not specifically limited.

[0102] By arranging an adsorbent in the dust collecting chamber 23, the dust can be adsorbed, which not only increases the dust absorption amount but also prevents the dust from flowing back into the pump pipe to cause secondary pollution.

[0103] In other embodiments, the dust removal device 100 further includes a filter element, which is disposed in the dust collection chamber 23 and is used to filter the dust entering the dust collection chamber 23. Specifically, the filter element includes a filter screen, a filter element, etc., which are not specifically limited.

[0104] By arranging an adsorbent in the dust collecting chamber 23, the dust can be filtered, which not only increases the dust absorption amount but also prevents the dust from flowing back into the pump pipe to cause secondary pollution.

[0105] Preferably, the dust removal device 100 includes an adsorbent, which is arranged in the dust collecting chamber 23 and is used to adsorb dust entering the dust collecting chamber 23, and the dust removal device 100 also includes a filter, which is arranged in the dust collecting chamber 23 and is used to filter the dust entering the dust collecting chamber 23.

[0106] In some embodiments, the dust removal device 100 also includes a temperature controller, which is communicatively connected to the heating device and the cooling device 21, and is used to control the heating temperature of the heating device within a first preset range, and to control the cooling temperature of the cooling device 21 within a second preset temperature range.

[0107] By setting a temperature controller, the temperature difference between the heating device and the cooling device 21 can be controlled, thereby controlling the generation of the temperature field and improving the stability and reliability of the temperature field.

[0108] Specifically, the first preset temperature range is 10 to 50 degrees higher than the indoor temperature, and the second preset temperature range is 10 to 50 degrees lower than the indoor temperature.

[0109] In some embodiments, the dust removal device 100 further includes a field strength controller, which is communicatively connected to the negative electrode and the positive electrode 22 for controlling the electric field strength of the electrostatic field.

[0110] By setting a temperature controller, the electric field strength of the electrostatic field can be controlled, thereby improving the stability and reliability of the electrostatic field.

[0111] Specifically, the electric field strength of the electrostatic field may be controlled by controlling the magnitude of the current introduced into at least one of the negative electrode and the positive electrode 22 .

[0112] Based on the same inventive concept, the present application also provides a vacuum coating device 200, including a reaction chamber 210, a negative pressure device 220 and a dust removal device 100 in any of the above embodiments, the negative pressure device 220 is connected to the reaction chamber 210, and is used to provide negative pressure to the reaction chamber 210, and the dust removal device 100 is arranged between the reaction chamber 210 and the negative pressure device 220.

[0113] It should be pointed out that a large amount of product dust will be generated in the reaction chamber 210 , and under the action of the negative pressure device 220 , the dust can flow toward the negative pressure device 220 .

[0114] By arranging the dust removal device 100 between the reaction chamber 210 and the negative pressure device 220, the dust can be collected on the second dust removal component 20 under the dual effects of the temperature field and the electrostatic field without blocking the entire gas circulation channel 30, thereby not affecting the negative pressure device 220 providing negative pressure to the reaction chamber 210, thereby ensuring the effective pumping speed of the vacuum coating equipment 200 and improving the stability of the coating process and the repeatability of large-scale coating quality.

[0115] Specifically in the embodiments of the present application, the negative pressure device 220 includes a vacuum pump, a fan, etc., which are not specifically limited.

[0116] Furthermore, the vacuum coating equipment 200 also includes a connecting pipe 230 , both ends of which are connected to the reaction chamber 210 and the negative pressure device 220 respectively, and the dust removal device 100 is disposed on the connecting pipe 230 .

[0117] In this way, dust removal can be effectively performed on the path where dust flows toward the negative pressure device 220 , thereby preventing dust from entering the negative pressure device 220 .

[0118] Specifically, the communication pipe 230 includes a first communication pipe 231 and a second communication pipe 232, the two ends of the first communication pipe 231 are respectively connected to the reaction chamber 210 and one end of the dust removal device 100, and the two ends of the second communication pipe 232 are respectively connected to the other end of the dust removal device 100 and communicated with the negative pressure device 220. More specifically, the first communication pipe 231 is communicated with the inlet of the dust removal device 100, and the second communication pipe 232 is communicated with the outlet of the dust removal device 100.

[0119] It should be noted that the connecting pipe 230 is the pump pipe mentioned above.

[0120] In some embodiments, the vacuum coating equipment 200 further includes a butterfly valve 240 , which is disposed on a connecting pipe 230 between the dust removal device 100 and the negative pressure device 220 .

[0121] By arranging the butterfly valve 240 at the downstream end of the dust removal device 100 along the airflow direction, damage to the butterfly valve 240 can be avoided, the shutdown maintenance frequency of the vacuum coating equipment 200 can be reduced, and the machine utilization rate can be improved.

[0122] In some embodiments, the vacuum coating equipment 200 further includes an angle valve 250 , which is disposed on a connecting pipe 230 between the dust removal device 100 and the negative pressure device 220 .

[0123] By arranging the angle valve 250 at the downstream end of the dust removal device 100 along the airflow direction, damage to the angle valve 250 can be avoided, the shutdown maintenance frequency of the vacuum coating equipment 200 can be reduced, and the machine utilization rate can be improved.

[0124] In some embodiments, the vacuum coating equipment 200 may include a butterfly valve 240 and an angle valve 250 at the same time. The butterfly valve 240 and the angle valve 250 are arranged on the connecting pipe 230 between the dust removal device 100 and the negative pressure device 220, and the butterfly valve 240 is arranged closer to the dust removal device 100 than the angle valve 250.

[0125] Compared with the prior art, the dust removal device 100 and the vacuum coating device 200 provided in the embodiment of the present application have the following beneficial effects:

[0126] When the dust passes through the dust removal device 100, the dust can be collected on the second dust removal component 20 under the dual effects of the temperature field and the electrostatic field without blocking the entire gas circulation channel 30, thereby ensuring the effective pumping speed of the vacuum coating equipment 200 and improving the stability of the coating process and the repeatability of large-scale coating quality.

[0127] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A dust removal device, characterized in that: include: a first dust removal component; as well as a second dust removal assembly, which is opposite to and spaced from the first dust removal assembly to form a gas circulation channel therebetween; the second dust removal assembly further comprises a dust collection chamber, the dust collection chamber being in communication with the gas circulation channel; one side of the second dust removal assembly comprises an opening in communication with the dust collection chamber, the opening being arranged toward the first dust removal assembly; The first dust removal assembly and the second dust removal assembly are configured to simultaneously form a temperature field and an electrostatic field with overlapping areas in the gas flow channel, and both the temperature field and the electrostatic field can provide a force to move dust toward the second dust removal assembly; The gas flow channel includes a first sub-channel and a second sub-channel that are connected in sequence along its extension direction, and the first sub-channel is arranged obliquely relative to the second sub-channel; The first sub-channel and the second sub-channel both include an inlet and an outlet, the outlet of the first sub-channel is arranged closer to the second dust removal assembly and is inclined relative to the second dust removal assembly, and the inlet of the second sub-channel is arranged closer to the second dust removal assembly and is inclined relative to the second dust removal assembly; The shell has a dust removal chamber, the first dust removal component is arranged in the dust removal chamber, the second dust removal component is arranged on the outside of the shell, and the shell is also provided with a connecting hole, and the second dust removal component is connected with the dust removal chamber through the connecting hole.

2. The dust removal device according to claim 1, characterized in that: The first dust removal assembly includes a heating device and a negative electrode, and the second dust removal assembly includes a cooling device and a positive electrode; The heating device is used to heat the gas flowing through the gas circulation channel, and the cooling device is used to cool the gas flowing through the gas circulation channel, and the heating device and the cooling device can form the temperature field in the gas circulation channel; The negative electrode and the positive electrode are capable of forming the electrostatic field in the gas flow channel.

3. The dust removal device according to claim 2, characterized in that: The heating device is disposed inside the negative electrode; or The heating device is covered on the outer surface of the negative electrode.

4. The dust removal device according to claim 2, characterized in that: The cooling device comprises a cold trap and a refrigerator, and the refrigerator is used to cool the cold trap.

5. The dust removal device according to claim 2, characterized in that: The dust removal device further comprises a temperature controller, which is communicatively connected with the heating device and the cooling device and is used to control the heating temperature of the heating device to be within a first preset temperature range, and to control the cooling temperature of the cooling device to be within a second preset temperature range; and / or The dust removal device also includes a field strength controller, which is communicatively connected with the positive electrode and the negative electrode and is used to control the electric field strength of the electrostatic field.

6. The dust removal device according to claim 2, characterized in that: The cooling device is disposed inside the positive electrode; or The cooling device is covered on the outer side of the positive electrode.

7. The dust removal device according to any one of claims 1 to 6, characterized in that: The first dust removal assembly extends along the extension direction of the gas circulation channel; and / or The second dust removal assembly extends along an extension direction of the gas circulation channel.

8. The dust removal device according to claim 1, characterized in that: The number of the first sub-channels includes at least two, and the first sub-channels and the second sub-channels are arranged alternately in sequence; and / or The number of the second sub-channels includes at least two, and the first sub-channels and the second sub-channels are arranged alternately in sequence.

9. The dust removal device according to claim 1, characterized in that: The gas flow channel is arc-shaped along its extending direction.

10. The dust removal device according to claim 1, characterized in that: The first dust removal assembly includes at least two first sub-dust removal assemblies spaced apart from each other, the second dust removal assembly includes at least two second sub-dust removal assemblies spaced apart from each other, and the gas flow channel includes a plurality of sub-channels spaced apart from each other; Each of the first dust removal sub-assemblies is opposite to and spaced from a corresponding one of the second dust removal sub-assemblies to form a corresponding one of the sub-channels therebetween.

11. The dust removal device according to claim 1, characterized in that: The dust removal device further comprises an adsorbent, which is disposed in the dust collecting chamber and is used to adsorb the dust entering the dust collecting chamber; and / or The dust removal device also includes a filter element, which is arranged in the dust collection chamber and is used to absorb the dust entering the dust collection chamber.

12. The dust removal device according to claim 1, characterized in that: The dust removal device also includes a shell having a dust removal chamber. The first dust removal component is arranged on the outside of the shell, and the second dust removal component is arranged in the dust removal chamber.

13. A vacuum coating device, characterized in that: It comprises a reaction chamber, a negative pressure device and a dust removal device as described in any one of claims 1 to 12, wherein the negative pressure device is connected to the reaction chamber and is used to provide negative pressure to the reaction chamber, and the dust removal device is arranged between the reaction chamber and the negative pressure device.

14. The vacuum coating equipment according to claim 13, characterized in that: The vacuum coating equipment also includes a connecting pipe, both ends of which are connected to the reaction chamber and the negative pressure device respectively, and the dust removal device is arranged on the connecting pipe.

15. The vacuum coating equipment according to claim 14, characterized in that: The vacuum coating equipment further comprises a butterfly valve, which is arranged on a connecting pipe between the dust removal device and the negative pressure device; and / or The vacuum coating equipment further comprises an angle valve, which is arranged on a connecting pipe between the dust removal device and the negative pressure device.

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