Fixing device and fixing method for chip testing, and testing equipment

Abstract

The embodiments of the present application disclose a fixing device and fixing method and testing equipment for chip testing. The device includes: a carrier, which has a fixing cavity formed inside for fixing the chip, and a plurality of adjustment devices are provided on the side walls of the fixing cavity for adjusting the position of the chip in two orthogonal directions in the horizontal plane; a top cover, which is used to cooperate with the carrier to fix the chip in the vertical direction; wherein, at least one adjustable pressure cover is provided at the lower end of the top cover to autonomously adjust the pressure applied to the chip by the pressure cover in the vertical direction. The present application can be applied to the horizontal and vertical fixing of chips of various dimensions and thicknesses, and can adaptively adjust the pressure of the pressure cover during high-temperature testing of the chip to avoid damaging the chip solder balls and affecting the test results.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor testing equipment, and more specifically, to a fixing device and fixing method for chip testing, and testing equipment. Background Art

[0002] In the field of semiconductor production, the main links include wafer manufacturing and packaging testing. In these two links, two inspection steps need to be completed respectively: wafer inspection and functional testing (FT, Function Test). When testing the various functional indicators of the chip in these two steps, the chip needs to be connected to the test circuit. Therefore, a chip fixing system or device is required to ensure that the pins of the chip can be in stable contact with the test circuit, especially to ensure that the vertical direction of the chip is in good contact with the ejector pins of the test circuit. The package dimensions of various chips are different. If a custom fixture is customized for each package dimension of the chip, it will increase a lot of costs. Therefore, a fixture with customizable size adjustment is needed.

[0003] With the widespread adoption of BGA (Ball Grid Array Package) packaging, BGA-based chips are widely adopted. BGA chips use solder balls instead of pins. These balls expand during high-temperature testing. If the chip fixture fails to adaptively adjust its position based on the ball's expansion stress, it can compress the ball, causing deformation and impacting other tests. Existing technical solutions have yet to address the issue of chip fixation during high-temperature testing when the ball deforms. Summary of the Invention

[0004] In view of this, the purpose of the embodiments of the present application is to provide a new type of chip testing fixture and fixing method, and testing equipment, which can accurately position and fix the chip to be tested in the horizontal and vertical directions respectively, and can be suitable for chips of different sizes and thicknesses without damaging the solder balls on the chip.

[0005] According to the first aspect of the present application, a fixing device for chip testing is provided, which includes: a carrier, a fixing cavity for fixing the chip to be tested is formed inside the carrier, and a plurality of adjustment devices are provided on the side walls of the fixing cavity, which are used to adjust the position of the chip to be tested in two orthogonal directions in the horizontal plane; a top cover, which is used to cooperate with the carrier to fix the chip to be tested in the vertical direction; wherein, the lower end of the top cover is provided with at least one adjustable pressure cover to autonomously adjust the cover pressure applied by the pressure cover to the chip to be tested in the vertical direction.

[0006] Optionally, a plurality of adjustment devices are respectively formed on a plurality of side walls of the fixed cavity and are symmetrically distributed in two orthogonal directions in a horizontal plane.

[0007] Optionally, each adjustment device includes an adjustment plate and an adjustment knob, the adjustment plate is telescopically adjusted by the adjustment knob connected thereto, and / or each adjustment plate is formed as an elastic member.

[0008] Optionally, the adjustment plate is made of a plastic polymer.

[0009] Optionally, the adjusting device is a spring leaf.

[0010] Optionally, length scales are provided on at least two side walls of the fixed cavity, and the origin of the length scales is set to the center of the corresponding fixed cavity.

[0011] Optionally, each gland is detachably connected to one or more gaskets.

[0012] Optionally, the gasket is formed as an elastomer.

[0013] Optionally, the pressure cap is formed as an elastic pressure cap to elastically adjust the pressure applied by the pressure cap to the chip.

[0014] Optionally, the elastic pressure cover is formed so that each pressure cover is connected to the corresponding gasket via a plurality of elastic bodies.

[0015] Optionally, each pressure cover is provided with a plurality of vertical slots, and each gasket is provided with a plurality of pins at positions corresponding to the slots, and each pin is inserted into the corresponding slot on the pressure cover so that the gasket only undergoes vertical translational motion.

[0016] Optionally, each of the four corners of the pressure cover is provided with a card slot, and each of the four corners of the gasket is provided with a corresponding pin.

[0017] Optionally, the pressure cover and the top cover are connected by screws.

[0018] According to the second aspect of the present application, a chip testing device is provided, which adopts the chip testing fixture provided by the first aspect, including a test board, on which a test circuit including eject pins is provided; the chip testing fixture fixes the chip to be tested on the upper surface of the test circuit so that the solder balls of the chip to be tested contact the eject pins.

[0019] According to a third aspect of the present application, a chip test fixing method is provided, using the chip test fixing device provided in the first aspect, including the following steps: step S1, adjusting each adjustment device 3 to the maximum scale position; step S2, determining the adjustment stroke of the adjustment device 3 in the X and Y directions according to the size of the chip to be tested and the scale information; step S3, placing the chip to be tested into the fixing cavity 2 of the carrier 1; step S4, adjusting the adjustment device 3 to a predetermined position according to the determined adjustment stroke, and fixing the chip to be tested in the horizontal direction; step S5, covering the top cover 4 on the carrier 1, so that the pressure cover 5 is pressed onto the chip to be tested, and fixing the chip to be tested in the vertical direction.

[0020] By setting up a carrier, adjustment device, top cover, and pressure cover assembly and optimizing their combination, the chip testing fixture can support the testing of chips with various package dimensions. More importantly, during high-temperature chip testing, the pressure cover displacement can be adaptively adjusted according to the expansion stress of the solder ball, avoiding the technical problem of excessive contact between the solder ball and the ejector pin in the vertical direction, causing deformation and affecting the test. In addition, the adaptive adjustment of the pressure cover eliminates complex operating steps and does not require the installation of a beam structure, thereby reducing testing costs and avoiding the impact of the beam structure on the pressure cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of a chip testing fixture according to an embodiment of the present application;

[0022] Figure 2 yes Figure 1 An enlarged schematic diagram of the adjustment device in the fixing device shown;

[0023] Figure 3 yes Figure 1 Another schematic diagram of the top cover and gland structure in the fixing device shown;

[0024] Figure 4 yes Figure 1 Schematic diagram of the gland structure in the fixing device shown;

[0025] Figure 5 This is another schematic diagram of a chip testing fixture carrier according to an embodiment of the present application;

[0026] Figure 6 This is a schematic diagram of a fixture for chip testing according to a specific embodiment of the present application;

[0027] Figure 7 This is a schematic diagram of a chip testing device according to an embodiment of the present application;

[0028] Figure 8 It is a flow chart of a chip testing and fixing method according to an embodiment of the present application.

[0029] Reference numerals:

[0030] 1: Carrier; 2: Fixing cavity; 3: Adjustment device; 3-1: Adjustment plate; 4: Top cover; 5: Pressure cover; 6: Gasket; 7: Elastomer; 8: Adjustment knob; 9: Pin; 30: Chip to be tested; 300: Test board. DETAILED DESCRIPTION

[0031] To make the objectives, technical solutions, and advantages of this application more clearly understood, this application is further described below in conjunction with specific embodiments and with reference to the accompanying drawings. It should be understood that these descriptions are merely illustrative and are not intended to limit the scope of this application. In addition, in the following description, descriptions of well-known structures and technologies are omitted to avoid unnecessary confusion in the concepts of this application.

[0032] The accompanying drawings illustrate schematic diagrams of layer structures according to embodiments of the present application. These figures are not drawn to scale; for clarity, some details are exaggerated and some details may be omitted. The shapes of the various regions and layers shown in the figures, as well as their relative sizes and positional relationships, are merely exemplary and may deviate in practice due to manufacturing tolerances or technical limitations. Furthermore, those skilled in the art may design regions / layers with different shapes, sizes, and relative positions as needed.

[0033] Obviously, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making any creative work are within the scope of protection of this application. The following will describe this application in more detail with reference to the accompanying drawings. In the various drawings, the same elements are represented by similar reference numerals. For the sake of clarity, the various parts in the drawings are not drawn to scale.

[0034] The purpose of the fixture for chip testing is to fix the chip position from three spatial dimensions, and to fix the chip in the test circuit. By setting and adjusting the fixed dimensions of the three spatial dimensions, it is used to support chips with various package dimensions. According to the fixture for testing provided by the embodiment of the present application, on the one hand, in the horizontal fixing direction, for chips with different numbers of package solder balls and the same number of solder balls but different package dimensions, it can meet the needs of device carriers of different sizes for fixing in the horizontal direction, avoiding waste of resources, cumbersome testing process, and helping to reduce testing costs. On the other hand, in the vertical fixing direction, the pressure cover of the fixed carrier provided by the embodiment of the present application has an autonomous adjustment space. During high temperature testing, the solder balls will expand or soften. The pressure cover that can autonomously adjust the cover pressure will cause the solder balls to be in excessive contact with the ejector pins, resulting in deformation of the solder balls, which will not affect other tests and ensure that the solder balls are not damaged. Furthermore, when testing chips of different thicknesses based on the fixture for testing provided by the embodiment of the present application, not only can the adjustment be made by increasing or decreasing the number of pressure cover gaskets, but the operation is simple and the testing cost is low. In addition, the test fixture and test equipment provided in the embodiments of the present application avoid using an upper crossbeam structure for size adjustment, and therefore will not seriously affect the pressing function of the pressure cover on the chip, thereby avoiding the contact problem between the solder ball and the test circuit pin during testing.

[0035] Figure 1 This is a schematic diagram of a chip testing fixture according to an embodiment of the present application.

[0036] like Figure 1 As shown, the chip testing fixing device provided in the embodiment of the present application mainly includes a carrier 1 for fixing the chip in the horizontal direction and a top cover 4 for fixing the chip in the vertical direction. The carrier 1 and the top cover 4 cooperate with each other to accurately and reliably fix the chip to be tested in the horizontal and vertical directions, ensuring that the multiple solder balls on the chip to be tested and the multiple pins of the test circuit can be accurately contacted without damaging the chip to be tested.

[0037] The carrier 1 of the present embodiment has a fixed cavity 2 formed inside for accommodating and fixing the chip. A plurality of adjustment devices 3 are provided on the sidewalls of the fixed cavity 2 for adjusting the position of the chip in two orthogonal directions in the horizontal direction. The adjustment devices 3 are distributed in two orthogonal directions in the horizontal direction ( Figure 1 The adjusting device 3 is configured to be adjustable in both the X and Y directions, thereby horizontally positioning and securing the chip under test. The adjusting device 3 is adjustable in both the X and Y directions, allowing chips of different package dimensions to be secured within the securing cavity 2.

[0038] The top cover 4 of the embodiment of the present application is used to cooperate with the carrier 1 to fix the chip in the vertical direction. Figure 1 In the Z direction, at least one adjustable pressure cap 5 is provided at its lower end for autonomously adjusting the cover pressure applied by the pressure cap 5 to the chip in the vertical direction. The pressure cap 5 is detachably fixed to the position corresponding to the chip on the top cover 4. Optionally, the pressure cap 5 is configured as an adjustable pressure cap, so as to autonomously adjust the cover pressure applied by the pressure cap to the chip in the vertical direction, adapt to chips of different thicknesses, and avoid damaging the solder balls on the chip. On the one hand, the adjustable pressure cap 5 can fix chips of different thicknesses, and on the other hand, when the stress of the chip solder balls changes, the adjustable pressure cap can be adjusted in the vertical direction to avoid the problem of deformation caused by compression of the solder balls.

[0039] In an optional embodiment, the plurality of adjustment devices 3 are formed on the four side walls of the fixed cavity 2 and are symmetrically distributed in two orthogonal directions in the horizontal plane. Figure 1 As shown, the adjustment device 3 is set at a symmetrical position of the carrier 1 along the X / Y direction, so that when the adjustment device 3 fixes the chip to be tested, the chip to be tested is subjected to uniform force and the stress on the chip to be tested is not deflected, thereby preventing the position of the chip to be tested from being skewed. Figure 1Two adjusting devices 3 are provided in the X / Y directions. It should be noted that one adjusting device 3 is provided in each direction to achieve the purpose of fixation. Two or more adjusting devices 3 are provided to form a stable positioning in the X / Y directions. However, since the size of the chip to be tested in the X / Y direction is several times the size of the adjusting device 3, the positioning strategy of using multiple adjusting devices 3 is adopted at this time to enhance the stability of the adjusting device 3 in fixing the chip to be tested. The provision of adjusting devices 3 in two orthogonal directions of the fixed cavity 2 can achieve the technical effect of fixing the chip to be tested in the horizontal plane. In order to make the chip to be tested bear force evenly, adjusting devices 3 are provided in the X-axis and Y-axis directions, as well as in the opposite directions. Multiple adjusting devices 3 are respectively formed on the four side walls of the fixed cavity 2.

[0040] Figure 2 yes Figure 1 An enlarged schematic diagram of the adjustment device in the fixing device shown.

[0041] like Figure 2 As shown, to facilitate changing the stroke of the adjustment device 3, each adjustment device 3 includes an adjustment plate 3-1 and an adjustment knob 8. The adjustment knob 8 is disposed on the outside of the carrier 1. Each adjustment plate 3-1 is telescopically adjusted by the adjustment knob 8 connected thereto. Optionally, the adjustment knob 8 is a threaded structure. During rotation, the adjustment knob 8 changes the stroke in the X / Y direction, thereby changing the stroke of the adjustment device 3.

[0042] In an optional embodiment, the adjusting device 3 is made of plastic polymer. For example, the diameter of the adjusting device 3 is set to 3-5 mm, and the side thickness of the chip to be tested is generally about 1-3 mm, so the adjusting device 3 can effectively clamp the chip to be tested.

[0043] In one embodiment, a length scale is provided on the edge of the fixed cavity 2 on the carrier 1. Figure 1 As shown, there are scale lines on the edge of the fixed cavity 2. The direction of the length scale is the same as the distribution direction of the adjustment device 3, that is, Figure 1 The 0 point in the X-axis and Y-axis directions is the center coordinate of the fixed cavity 2.

[0044] First, the scale lines can intuitively indicate the actual size of the fixing cavity 2, thereby clearly identifying the maximum chip package size that the fixing device can support. More importantly, it provides a quantitative benchmark for adjusting the stroke of the adjusting device 3. For chips with the same package size, the stroke of the adjusting device 3 is consistent. It should be noted that the adjusting device 3 fixes the chip to be tested in two dimensions in the horizontal plane, so the fixing directions can be orthogonal. The fixing cavity 2 and the adjusting device 3 ensure that the pins or solder balls of the chip to be tested are aligned with the contact points of the test circuit in the horizontal plane.

[0045] For example, Figure 1 As shown, Figure 1 The directions of the X-axis and Y-axis are the two orthogonal directions in the horizontal plane where the carrier 1 is located. The size of the fixed cavity 2 is the upper limit of the size of the chip to be tested, that is, the chip to be tested can only be placed in the fixed cavity 2 if its size is smaller than the fixed cavity 2. The maximum stroke of the adjusting device 3 in the fixed cavity 2 limits the lower limit of the size of the chip to be tested, that is, the lower limit of the size of the chip to be tested must be greater than the size of the fixed cavity 2 minus the maximum stroke of the adjusting device 3 in order to be fixed in the fixed cavity 2. Therefore, the maximum stroke of the fixed cavity 2 and the adjusting device 3 depends on the chip package size that the test fixture needs to support. For example, the chip package size is (7-10)*(9-12) mm. The fixed cavity 2 has a maximum size of 12 mm in the X direction and a maximum size of 14 mm in the Y direction, which can support the fixation of the above two chips.

[0046] Exemplarily, when the upper and lower limits of the size of the chip to be tested are within the support range of the fixing device, the fixing device fixes the chip to be tested from both horizontal and vertical directions.

[0047] When performing horizontal adjustments, first determine the travel range of the X / Y adjustment device 3 based on the package dimensions of the chip under test. For example, if the chip's package dimensions are a*b, and the fixed cavity 2 has a maximum X-direction dimension of A and a maximum Y-direction dimension of B, then the total travel range of the X-direction adjustment device 3 required is Aa, and the total travel range of the Y-direction adjustment device 3 required is Bb. Subsequently, referring to the length scale on the edge of the fixed cavity 2, the X / Y adjustment device 3 is adjusted to achieve travel ranges of Aa and Bb, respectively.

[0048] It should be noted that the fixed cavity 2 has a symmetrical structure in the X / Y direction, and the shape of the chip to be tested also has a symmetrical structure in the X / Y direction. In an optional embodiment, the adjustment devices 3 are distributed on the four side walls of the fixed cavity 2. The adjustment devices 3 are symmetrically distributed in the horizontal plane orthogonal direction. In a specific embodiment, Figure 1 As shown, the same number of adjusting devices 3 are provided in each direction. By way of example, the spacing between the adjusting plates of the two adjusting devices 3 in the X direction is, for example, 6-7 mm, and the spacing between the adjusting plates in the Y direction is, for example, 7-8 mm. The adjusting devices 3 are symmetrically distributed in the orthogonal directions of the horizontal plane. In order to achieve the purpose of coinciding the center of the chip to be tested with the center of the fixed cavity 2, the adjustment strokes of the adjusting devices 3 in the X / Y direction and the X / Y reverse direction are the same, that is, the adjustment strokes of the adjusting devices 3 in the X direction toward the fixed cavity 2 are the same. By way of example, the stroke of the adjusting device 3 in the X direction is (Aa) / 2, and the stroke of the adjusting device 3 in the Y direction is (Bb) / 2. According to this symmetrical adjustment method of the adjusting device 3, the center of the chip coincides with the origin of the length scale (the center of the fixed cavity 2).

[0049] When adjusting the vertical direction, the top cover 4 is fixedly connected to the carrier 1. In an optional embodiment, the pressure cover 5 is connected to the top cover 4 by screws. Figure 1 , the pressure cap 5 is fixedly connected to the top cover 4 in the vertical direction by screws. After the fixed connection, the pressure cap 5 generates a pre-tightening force on the chip to be tested through the gasket 6, so that the solder ball of the chip to be tested is in stable contact with the test circuit. The pressure cap 5 is an adjustable pressure cap, and the pre-tightening force generated on the gasket 6 changes with the expansion stress of the solder ball of the chip to be tested. Optionally, when multiple pressure caps 5 are connected to the top cover 4, the multiple pressure caps 5 have the same size, so the gaskets 6 under the multiple pressure caps 5 are in the same horizontal plane, so each pressure cap 5 applies the same pressure to the chip to be tested.

[0050] It should be noted that the adjustment device 3 is distributed in two orthogonal directions in the horizontal direction, and can be adjusted telescopically along the orthogonal directions, which solves the technical problem of fixing the chip to be tested in the horizontal plane; since the adjustment device 3 has a telescopic adjustment function, it supports the fixation of two dimensions in the horizontal plane of chips with different package dimensions. The vertical fixation of the chip to be tested is achieved by setting a pressure cap 5. Since the pressure cap 5 is an adjustable pressure cap, when the solder ball of the chip to be tested expands, the pressure cap 5 will be adjusted in the vertical direction. There is no need to increase or decrease the number of pressure cap gaskets to adapt to chips of different thicknesses, thereby avoiding the technical problem of solder ball deformation caused by excessive contact between the solder ball and the ejector pin, and eliminating the tedious testing process. In addition, the carrier 1 does not have a crossbeam structure, which will not affect the pressure function of the pressure cap 5 on the chip.

[0051] Figure 3 yes Figure 1 Another schematic diagram of the top cover and pressure cover structure in the fixing device shown.

[0052] like Figure 3 As shown, in an optional embodiment of the present application, each pressure cover 5 is provided with one or more movable gaskets 6, and the vertical position of the chip being pressed and the pressure of the cover are adjusted by adjusting the number of movable gaskets 6. Therefore, by increasing or decreasing the movable gaskets 6, chips of different thicknesses can be fixed. In addition, in some embodiments, the movable gaskets 6 are formed as elastic bodies, and when fixing chips of different sizes to be tested, the movable gaskets 6 are compressed into different sizes; the movable gaskets 6 are compressed into different sizes according to the expansion stress of the solder balls of the chip to be tested.

[0053] Figure 4 yes Figure 1 Schematic diagram of the gland structure in the fixing device shown.

[0054] In an optional embodiment, one or more gaskets 6 are detachably connected to each pressure cap 5. The gaskets 6 are between the pressure cap 5 and the chip to be tested, avoiding stress concentration of the pressure cap 5 on the chip to be tested, so that the stress on the chip to be tested is uniform.

[0055] In another optional embodiment of the present application, each pressure cap 5 is configured as an elastic pressure cap, thereby achieving autonomous elastic adjustment of the cover pressure applied by the pressure cap 5 to the chip. Optionally, for example, each pressure cap 5 is connected to the corresponding gasket 6 via a plurality of elastomers 7. In this way, when the cover pressure is applied to the chip in the vertical direction through the pressure cap 5, the elastomer 7 can flexibly expand and contract according to the chips of different thicknesses and the solder balls of different thermal expansion degrees on the chip, thereby autonomously adjusting the size of the cover pressure applied to the chip. In the embodiment of the present application, the elastomer 7 is, for example, a spring, elastic rubber, silicone, or the like. Exemplarily, the initial length of the elastomer 7 is L. After the chip to be tested is fixed, pressure is generated between the elastomer 7 and the chip to be tested, and the length of the elastomer 7 is compressed to L1; when the solder balls of the chip to be tested generate expansion stress due to high temperature, the length of the elastomer 7 is compressed to L2, where L>L1>L2.

[0056] In an optional embodiment, each pressure cover 5 is provided with a plurality of vertical slots, and each gasket 6 is provided with a plurality of pins 9 at positions corresponding to the slots, and each pin 9 is inserted into the corresponding slot on the pressure cover 5. The pins 9 on the gasket 6 are inserted into the slots on the pressure cover 5, and when the elastic body 7 is adjusted in the vertical direction, the pins 9 limit the horizontal movement of each gasket. That is, the gasket 6 only moves in the vertical direction and will not be skewed in the horizontal direction, and thus the gasket 6 will not be skewed due to differences in the elastic coefficients of the elastomer 7 or uneven expansion stress of the solder ball. The cover pressure of the pressure cover 5 will not be deflected and can be applied vertically to the chip.

[0057] In an alternative embodiment, reference Figure 4 The four corners of the gland 5 are each provided with a slot, and the four corners of each gasket 6 are each provided with a pin 9. It should be noted that the pins at the four corners are symmetrical and parallel, which is more conducive to offsetting the horizontal torque, thereby better ensuring that the gasket 6 is skewed.

[0058] like Figure 4As shown, an elastic member 7 is disposed between the pressure cap 5 and the gasket 6. The pressure cap 5 is used to vertically secure the chip under test. The pressure cap 5 ensures that the pins or solder balls of the chip under test maintain good vertical contact with the contact points of the test circuit. The melting point of tin is 183°C, and the ambient temperature required for high-temperature chip testing can even reach 150°C. Under these conditions, the solder balls of the BGA chip will experience expansion stress. If the pressure cap 5 cannot adjust its vertical fixed position according to the generated expansion stress, it will force the chip under test, causing deformation of the solder balls, thereby affecting other chip tests. Therefore, in this embodiment, a gasket 6 and an elastic member 7 are disposed below the pressure cap 5. The gasket 6 is in direct contact with the chip under test, applying uniform pressure to the chip under test. The elastic member 7 automatically adjusts its expansion and contraction based on the expansion stress of the chip's solder balls. When the solder balls expand, the elastic member 7 is compressed, and when they do not expand, the elastic member 7 extends, thus preventing the solder balls from being squeezed and deformed.

[0059] Figure 5 This is another schematic diagram of a chip testing fixture carrier according to an embodiment of the present application.

[0060] In an alternative embodiment, the adjusting device 3 is an elastic member, such as Figure 5 As shown, the adjustment device 3 is a spring sheet. The advantage of the adjustment device 3 being a spring sheet is that the work of manually adjusting the adjustment device 3 is omitted, and the chip to be tested can be fixed by placing the chip to be tested in the fixing cavity 2.

[0061] Figure 6 This is a schematic diagram of a chip test fixture according to a specific embodiment of the present application.

[0062] like Figure 6 As shown, in this exemplary embodiment, the chip under test 30 has dimensions a*b and a thickness c. In the carrier 1, which holds the chip horizontally, the top cover 4 connects to the pressure cover 5 vertically. The pressure cover 5 applies pressure to the chip under test 30 through the elastic body 7 and the gasket 6, causing the solder balls of the chip under test 30 to contact the test circuit. The adjustment device 3 clamps the chip under test 30, preventing it from moving or deflecting. The pins 9 are inserted into the slots of the pressure cover 5, ensuring that any vertical movement of the gasket 6 is only vertically translatory and prevents twisting. The cooperation between the carrier 1 and the top cover 4 accurately and reliably secures the chip under test in both the horizontal and vertical directions. In the horizontal direction, the travel of the adjustment device 3 varies depending on the chip size. In the vertical direction, the compression degree of the elastic body 7 varies depending on the chip thickness, resulting in different preload forces on the chip under test 30. Therefore, within the compression range that the elastic body 7 can withstand, this embodiment can be applied to secure chips of varying thicknesses.

[0063] Figure 7 This is a schematic diagram of a chip testing device according to an embodiment of the present application.

[0064] like Figure 7 As shown, the chip testing equipment includes a test board 300, on which a test circuit including ejector pins is provided; a chip test fixture fixes the chip 30 to be tested on the upper surface of the test circuit so that the solder balls of the chip 30 to be tested contact the ejector pins.

[0065] Fixture carrier 1 horizontally positions and secures the chip under test. Fixture gland 5 is removably secured to top cover 4 at a location corresponding to the chip. Optionally, gland 5 can be configured as an adjustable gland, allowing for vertical adjustment of the pressure applied to the chip to accommodate chips of varying thicknesses and to prevent damage to the solder balls on the chip due to expansion stress.

[0066] Figure 8 It is a flow chart of a chip testing and fixing method according to an embodiment of the present application.

[0067] like Figure 8 As shown, an embodiment of the present application provides a chip testing and fixing method, which uses the chip testing fixing device provided above. The steps of the chip testing and fixing method provided in the embodiment are specifically introduced below.

[0068] Step S1, adjust each adjusting device 3 to the maximum scale position. The adjusting device 3 is telescopically adjusted to change the scale position. When the adjusting device 3 reaches the maximum scale position, the fixed cavity 2 reaches the maximum spatial tolerance. In a specific embodiment, the adjusting device 3 is adjusted to the minimum stroke of the fixed cavity 2, at which time the fixed cavity 2 reaches the maximum tolerance that it can support. In an optional embodiment, the adjusting knob 8 is rotated to make the adjusting device 3 reach the minimum stroke. It should be noted that when the adjusting device 3 is an elastic member, the maximum compression of the elastic member can achieve the fixed cavity 2 reaching the maximum spatial tolerance.

[0069] Step S2: Determine the adjustment strokes of the X- and Y-direction adjustment devices 3 based on the chip size to be tested and the scale information. In one optional embodiment, for example, the chip package dimensions are 9 x 10.5 mm, the maximum dimension of the fixing cavity 2 in the X direction is 12 mm, and the maximum dimension in the Y direction is 14 mm. The total adjustment stroke of the X-direction adjustment device 3 is 12 mm - 9 mm = 3 mm, and the total adjustment stroke of the Y-direction adjustment device 3 is 14 mm - 10.5 mm = 3.5 mm.

[0070] Optionally, when adjustment devices 3 are provided in both the X / Y axis direction and the X / Y axis opposite direction, the adjustment devices 3 are adjusted by 1.5 mm in the X axis direction and the X axis opposite direction, and by 1.75 mm in the Y axis direction and the Y axis opposite direction.

[0071] It should be noted that when the adjustment device 3 is an elastic member, the elastic member automatically stretches to fix the chip to be tested. The adjustment device 3 is used in the horizontal plane to fix chips of different package dimensions. Through quantitative adjustment of the adjustment device 3, the chip is accurately fixed.

[0072] Step S3 , placing the chip to be tested into the fixing cavity 2 of the carrier 1 .

[0073] Alternatively, continuing with the optional embodiment in S2, first align the center of the chip under test with the center of the fixed cavity 2, i.e., the center of the chip under test is at the zero position of the X / Y length scale at the edge of the fixed cavity 2. Furthermore, the edge of the chip under test is aligned with the scale to ensure that the chip under test has no rotation angle relative to the scale. The edges of the chip in the X direction are aligned with the 4.5 mm scale, and the edges of the chip in the Y direction are aligned with the 5.25 mm scale.

[0074] Step S4: Adjust the adjustment device 3 to the predetermined position according to the determined adjustment stroke, and fix the chip to be tested in the horizontal direction. Optionally, continuing with the optional embodiment in S3, the adjustment device 3 is adjusted by 1.5mm in the X-axis direction and the opposite direction of the X-axis, and by 1.75mm in the Y-axis direction and the opposite direction of the Y-axis.

[0075] Step S5, cover the top cover 4 on the carrier 1, so that the pressure cover 5 is pressed onto the chip to be tested, and the chip to be tested is fixed in the vertical direction. Fix the top cover 4 on the carrier 1 so that the pressure cover 5 is pressed on the chip to be tested. In an optional embodiment, the top cover 4 and the carrier 1 are connected by screws. Optionally, after the top cover 4 and the pressure cover 5 are connected by screws, the elastomer 7 is in a compressed state. Under the action of the initial preload force of the elastomer 7, the chip to be tested is in a fixed state in the vertical direction, and the chip solder ball is in good contact with the circuit to be tested. The elastomer 7 will automatically adjust its expansion and contraction according to the expansion stress of the chip solder ball. Thereby achieving the fixation of the chip to be tested in the vertical direction and adaptively adjusting the vertical displacement according to the expansion stress of the solder ball, avoiding the technical problem of excessive contact between the solder ball and the ejector pin in the vertical direction, causing deformation and affecting the test. Optionally, there are several slots on the gland 5, and several pins are provided on the gasket 6. The pins are inserted into the slots so that the gasket 6 can only move in translation, that is, the pins limit the freedom of movement of the gasket 6 except the vertical direction. Figure 4 As shown, the pins on the gasket 6 are inserted into the slots on the pressure cover 5, and the pins are symmetrically distributed, so that the gasket 6 will not be twisted when moving in the vertical direction, and the gasket 6 will not be skewed due to differences in the elastic coefficients of the elastomer 7 or uneven expansion stress of the solder ball.

[0076] It should be understood that the above-mentioned specific embodiments of the present application are merely illustrative or explain the principles of the present application and do not constitute a limitation of the present application. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present application should be included in the scope of protection of the present application. In addition, the claims attached hereto are intended to cover all variations and modifications that fall within the scope and boundaries of the appended claims, or the equivalent forms of such scope and boundaries.

Claims

1. A chip testing fixture, characterized in that: include: A carrier having a fixed cavity formed therein for fixing the chip to be tested, and a plurality of adjustment devices provided on the sidewalls of the fixed cavity for adjusting the position of the chip to be tested in two orthogonal directions in a horizontal plane; The top cover is used to cooperate with the carrier to fix the chip to be tested in the vertical direction; Among them, at least one adjustable pressure cover is provided at the lower end of the top cover to autonomously adjust the cover pressure applied by the pressure cover to the chip to be tested in the vertical direction; each pressure cover is detachably connected to one or more gaskets, each pressure cover is connected to the gasket connected thereto by multiple elastomers, and the corresponding pressure cover is fixedly connected to the top cover by screws, and each pressure cover is provided with multiple vertical slots, and each gasket is provided with multiple pins at positions corresponding to the slots, and each pin is inserted into the corresponding slot on the pressure cover so that the gasket only undergoes vertical translational motion.

2. The chip testing fixture according to claim 1, wherein: The multiple adjustment devices are respectively formed on multiple side walls of the fixed cavity and are symmetrically distributed in two orthogonal directions in a horizontal plane.

3. The chip testing fixture according to claim 1, wherein: Each of the adjusting devices comprises an adjusting plate and an adjusting knob, the adjusting plate is telescopically adjusted via the adjusting knob connected thereto, and / or each of the adjusting plates is formed as an elastic member.

4. The chip testing fixture according to claim 3, wherein: The adjustment plate is made of plastic polymer.

5. The chip testing fixture according to claim 1, wherein: The adjusting device is a spring leaf.

6. The chip testing fixture according to any one of claims 1 to 5, characterized in that: At least two side walls of the fixed cavity are provided with length scales, and the origin of the length scales is set to the center of the corresponding fixed cavity.

7. The chip testing fixture according to claim 1, wherein: The gasket is formed as an elastic body.

8. The chip testing fixture according to claim 1, wherein: The pressure cap is formed as an elastic pressure cap to elastically adjust the pressure applied by the pressure cap to the chip.

9. The chip testing fixture according to claim 1, wherein: Each of the four corners of the pressure cover is respectively provided with a card slot, and each of the four corners of the gasket is respectively provided with a corresponding pin.

10. A chip testing device, using the chip testing fixture according to any one of claims 1 to 9, characterized in that: The device comprises a test board card on which a test circuit including ejector pins is provided; the chip test fixture fixes the chip to be tested on the upper surface of the test circuit so that the solder balls of the chip to be tested contact the ejector pins.

11. A chip testing and fixing method, using the chip testing and fixing device according to any one of claims 1 to 9, characterized in that: The steps include: Step S1, adjusting each adjusting device to the maximum scale position; Step S2, determining the adjustment stroke of the adjustment device in the X and Y directions according to the size of the chip to be tested and the scale information; Step S3, placing the chip to be tested into the fixed cavity of the carrier; Step S4, adjusting the adjustment device to a predetermined position according to the determined adjustment stroke, and fixing the chip to be tested in a horizontal direction; Step S5 , placing the top cover on the carrier, pressing the cover onto the chip to be tested, and fixing the chip to be tested in a vertical direction.

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