Liquid cooling module with movable radiator and computing device using the same

Abstract

The present invention discloses a liquid cooling module with a movable radiator and a computing device using the same, wherein the computing device includes a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating electronic component, the at least one additional electronic component, and the liquid cooling module are all located within the housing. The liquid cooling module is used to cool the heat-generating electronic component and includes at least one movable radiator. The at least one movable radiator is used to move between a first position and a second position. When the at least one movable radiator is in the first position, the at least one movable radiator prevents access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

Description

Technical Field

[0001] The present invention relates to a liquid cooling module, and more particularly, to a liquid cooling module with a movable heat sink for selectively allowing and preventing access to electronic components within a computing device. Background Art

[0002] Computing devices (e.g., servers) typically include one or more heat-generating electronic components, such as a central processing unit (CPU) and a graphics processing unit (GPU). To help cool these heat-generating electronic components, a liquid cooling module may be used. A liquid cooling module utilizes a coolant to transfer heat away from the heat-generating components. However, due to the size and configuration of the electronic components within the computing device's housing, the size and configuration of the liquid cooling module are often limited, which can reduce the cooling efficiency provided by the liquid cooling module.

[0003] Therefore, there is a need for improved liquid cooling modules that can more effectively remove heat from heat-generating electronic components within computing devices. Summary of the Invention

[0004] The term embodiment and similar terms are intended to refer broadly to all subject matter of the present invention and the claims. Statements containing these terms should be understood not to limit the subject matter described herein or to limit the meaning or scope of the claims. The embodiments of the invention covered herein are defined by the claims, not by this Summary. This Summary is a high-level overview of various aspects of the invention and introduces some concepts that are further described in the Detailed Description section below. This Summary is not intended to identify key or essential features of the claimed subject matter; nor is it intended to be used alone to determine the scope of the claimed subject matter. This subject matter should be understood by reference to appropriate portions of the entire specification of the present invention, any or all of the drawings, and each claim.

[0005] Various examples of the present invention are directed to a liquid cooling module for cooling electronic components. In a first embodiment of the present invention, the liquid cooling module includes a fluid tank, at least one movable radiator, and one or more cooling tubes. The fluid tank is configured to contain a cooling fluid therein. The at least one movable radiator is configured to move between a first position relative to the fluid tank and a second position relative to the fluid tank. The one or more cooling tubes are fluidically connected to the fluid tank and the at least one movable radiator to allow the cooling fluid to flow between the fluid tank and the at least one movable radiator. When the at least one movable radiator is in the first position relative to the fluid tank, the at least one movable radiator extends from the fluid tank in a first direction. When the at least one movable radiator is in the second position relative to the fluid tank, the at least one movable radiator extends from the fluid tank in a second direction. The second direction is different from the first direction.

[0006] In a second embodiment of the present invention, a computing device includes a housing, a heat-generating electronic component, at least one additional electronic component, and a liquid cooling module. The heat-generating electronic component, the at least one additional electronic component, and the liquid cooling module are all located within the housing. The liquid cooling module is used to cool the heat-generating electronic component. The liquid cooling module includes a fluid tank, at least one movable radiator, and one or more cooling tubes. The fluid tank is used to contain a cooling fluid therein. The at least one movable radiator is connected to the fluid tank and is used to move between a first position relative to the fluid tank and a second position relative to the fluid tank. The one or more cooling tubes connect the fluid tank and the at least one movable radiator to allow the cooling fluid to flow between the fluid tank and the at least one movable radiator. When the at least one movable radiator is in the first position relative to the fluid tank, the at least one movable radiator prevents access to the at least one additional electronic component within the housing. When the at least one movable radiator is in the second position relative to the fluid tank, the at least one movable radiator allows access to the at least one additional electronic component within the housing.

[0007] The above summary of the invention is not intended to represent every embodiment or every aspect of the present invention. Rather, the foregoing summary merely provides examples of some of the novel aspects and features set forth herein. The above-mentioned features and advantages, as well as other features and advantages of the present invention, will become apparent from the following detailed description of representative embodiments and modes for carrying out the invention, when taken in conjunction with the accompanying drawings and the appended claims.

[0008] In order to better understand the above and other aspects of the present invention, the following embodiments are given and described in detail with reference to the accompanying drawings: BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1A is a schematic diagram of a liquid cooling module with a movable heat sink according to aspects of the present invention, the movable heat sink being in a first position;

[0010] Figure 1BAspects of the present invention Figure 1A A schematic diagram of a liquid cooling module with a movable radiator, wherein the movable radiator is in a second position;

[0011] Figure 1C Aspects of the present invention Figure 1A as well as Figure 1B Exploded view of the liquid cooling module;

[0012] Figure 2A Aspects of the present invention Figures 1A to 1C A schematic diagram of a liquid cooling module installed in a computing device and preventing access to electronic components of the computing device;

[0013] Figure 2B Aspects of the present invention Figures 1A to 1C A schematic diagram of a liquid cooling module installed in a computing device and allowing access to electronic components of the computing device;

[0014] Figure 3 Aspects of the present invention Figure 1A Schematic diagram of a liquid cooling module installed in a computing device.

[0015] Explanation of symbols

[0016] 100:Liquid cooling module

[0017] 101:Cold plate assembly

[0018] 102:Cold plate

[0019] 104: Fluid Pump

[0020] 106: Fluid tank

[0021] 107A: First end

[0022] 107B: Second end

[0023] 108:Fixed radiator

[0024] 109A: First end

[0025] 110: Cooling pipe

[0026] 111A: First end

[0027] 111B: Second end

[0028] 112A, 112B: Removable radiator

[0029] 113A, 113C: First end

[0030] 113B, 113D: Second end

[0031] 114A, 114B: Cooling pipe

[0032] 115A, 115C: First end

[0033] 115B, 115D: Second end

[0034] 116A~116D: Hinge

[0035] A1: First axis

[0036] A2: Second axis

[0037] 200: Plate

[0038] 202, 202A, 202B: Heat-generating electronic components

[0039] 204A, 204A1, 204B, 204B1, 204C1, 204D1: Memory slots

[0040] 300: Computing equipment

[0041] 302: Shell

[0042] 304: Fan module

[0043] 306: Arrow DETAILED DESCRIPTION

[0044] Various embodiments are described with reference to the accompanying drawings, wherein the same reference numerals are used throughout the drawings to represent similar or equivalent elements. The accompanying drawings are not necessarily drawn to scale and are provided only to illustrate aspects and features of the present invention. Many specific details, relationships and methods are set forth to provide a comprehensive understanding of certain aspects and features of the present invention, although those with ordinary knowledge in the relevant fields will recognize that these aspects and features can be put into practice without one or more specific details, with other relationships, or with other methods. In some cases, for illustrative purposes, well-known structures or operations are not shown in detail. The various embodiments disclosed herein are not necessarily limited to the order of the actions or events described, because some actions may occur in different orders and / or occur simultaneously with other actions or events. In addition, not all actions or events of the accompanying drawings are necessary to realize certain aspects and features of the present invention.

[0045] For the purposes of this detailed description, unless otherwise stated and where appropriate, the singular includes the plural and vice versa. The word "including" means "including but not limited to". In addition, approximate words such as "approximately", "almost", "substantially", "about", etc. may be used herein to mean, for example, "at", "close to", "close to", or "within 3-5%", or "within an acceptable manufacturing tolerance", or any logical combination thereof. Similarly, the terms "vertical" or "horizontal" are intended to additionally include "within 3-5%" of the vertical or horizontal direction, respectively. In addition, directional words such as "top", "bottom", "left", "right", "above", and "below" are intended to relate to equivalent directions described in the referenced drawings; to be understood from the context of the object or element to which it is referenced, such as from the usual position of the object or element; or as described herein.

[0046] Figure 1A The figure is a schematic diagram of a liquid cooling module 100 for cooling heat-generating electronic components within a computing device (e.g., a server). Typically, a computing device includes one or more heat-generating electronic components, such as a central processing unit (CPU), a graphics processing unit (GPU), a dual in-line memory module (DIMM), a network interface card (NIC), a hard disk drive (HDD), a solid state drive (SSD), or a field programmable gate array (FPGA). Liquid cooling module 100 can be placed on top of the heat-generating electronic components to help cool them.

[0047] The liquid cooling module 100 includes a cold plate assembly 101, a fixed radiator 108, a fluid box 106, and two movable radiators 112A and 112B. When the liquid cooling module 100 is installed in a computing device, the liquid cooling module 100 is placed on top of the heat-generating electronic components. When the liquid cooling module 100 is installed, the cold plate assembly 101 contacts the heat-generating electronic components. The heat generated by the heat-generating electronic components is transferred to the cold plate assembly 101. The cooling fluid can then circulate through the liquid cooling module 100 to remove the transferred heat from the liquid cooling module 100. Various different types of cooling fluids can be used with the liquid cooling module 100. Non-limiting examples of cooling fluids include fluorocarbons, water (e.g., deionized water), mixtures including water, and hydrocarbons. In some embodiments, the cooling fluid is thermally conductive and electrically insulating (e.g., a dielectric). In some embodiments, the cooling fluid is selected so that it can easily change between a liquid phase and a gas phase and at a desired temperature.

[0048] In an exemplary embodiment, cold plate assembly 101 includes a cold plate 102 and a fluid pump 104. When liquid cooling module 100 is installed, cold plate 102 contacts heat-generating electronic components. Fluid pump 104 is positioned between cold plate 102 and a stationary heat sink 108. In other embodiments, fluid pump 104 is positioned within cold plate 102. In other embodiments, cold plate assembly 101 includes an additional cold plate, and fluid pump 104 is positioned between cold plate 102 and the additional cold plate, such that fluid pump 104 opens to the exterior of liquid cooling module 100.

[0049] The stationary heat sink 108 is located on top of the fluid pump 104 and is in contact with the fluid pump 104. In some embodiments, the stationary heat sink 108 is also in contact with the cold plate 102. The stationary heat sink 108 includes a cooling tube 110 extending through its interior. The cooling tube 110 is used to allow cooling fluid to flow through the stationary heat sink 108. In an exemplary embodiment, the cooling tube 110 has a continuous loop shape and repeatedly enters and exits the stationary heat sink 108. The loop configuration of the cooling tube 110 increases the distance the cooling tube 110 extends within the stationary heat sink 108. However, in other embodiments, the cooling tube 110 may have a different shape. For example, the cooling tube 110 may enter and exit the stationary heat sink 108 only once, while still having the same continuous loop shape within the stationary heat sink 108. In another example, the cooling tube 110 may extend through the stationary heat sink 108 in a substantially straight line. The fluid pump 104 is in fluid communication with the cooling tube 110 and is operable to flow cooling fluid through the cooling tube 110 .

[0050] Fluid tank 106 is positioned atop and in contact with stationary radiator 108. Fluid tank 106 has a substantially hollow interior that can contain cooling fluid. A first end 111A of cooling tube 110 is fluidly coupled between a first end 109A of stationary radiator 108 and a first end 107A of fluid tank 106. Similarly, a second end 111B of cooling tube 110 is fluidly coupled between a second end (not shown) of stationary radiator 108 and a second end 107B of fluid tank 106. The hollow interior of fluid tank 106 is thus fluidly coupled to cooling tube 110, allowing fluid pump 104 to pump cooling fluid between stationary radiator 108 and fluid tank 106 through cooling tube 110.

[0051] The movable heat sinks 112A and 112B are movably coupled to the fluid tank 106. In some embodiments, the movable heat sinks 112A and 112B are rotatably coupled to the fluid tank 106, allowing the movable heat sinks 112A and 112B to rotate relative to the fluid tank 106. In other embodiments, the movable heat sinks 112A and 112B are slidably coupled to the fluid tank 106, allowing the movable heat sinks 112A and 112B to slide relative to the fluid tank 106. In other embodiments, the movable heat sinks 112A and 112B may be coupled to the fluid tank 106 in other ways to allow the movable heat sinks 112A and 112B to move relative to the fluid tank 106 in different ways.

[0052] Each of the movable heat sinks 112A and 112B has a cooling tube extending therethrough and fluidically connected to the fluid tank 106. Cooling tube 114A extends within the movable heat sink 112A, while cooling tube 114B extends within the movable heat sink 112B. In the exemplary embodiment, cooling tubes 114A and 114B do not repeatedly enter and exit the movable heat sinks 112A and 112B. However, cooling tubes 114A and 114B within the movable heat sinks 112A and 112B may still have the same continuous loop shape as cooling tube 110 within the fixed heat sink 108.

[0053] The continuous loop shape of cooling tube 114A is used to extend the distance that cooling tube 114A extends within movable heat sink 112A. Similarly, the continuous loop shape of cooling tube 114B is used to extend the distance that cooling tube 114B extends within movable heat sink 112B. In other embodiments, cooling tubes 114A and 114B may have different shapes. For example, cooling tubes 114A and 114B may repeatedly enter and exit movable heat sinks 112A and 112B, similar to cooling tube 110. In another example, cooling tubes 114A and 114B may extend substantially straight through movable heat sinks 112A and 112B.

[0054] Thus, cooling tubes 114A and 114B fluidly couple movable heat sinks 112A and 112B, respectively, to fluid tank 106, allowing cooling fluid to flow between fluid tank 106 and movable heat sinks 112A and 112B. A first end 115A of cooling tube 114A is fluidly connected between first end 107A of fluid tank 106 and first end 113A of movable heat sink 112A. A second end 115B of cooling tube 114A is fluidly connected between second end 107B of fluid tank 106 and second end 113B of movable heat sink 112A. A first end 115C of cooling tube 114B is fluidly connected between first end 107A of fluid tank 106 and first end 113C of movable heat sink 112B. A second end 115D of cooling tube 114B is fluidly connected between second end 107B of fluid tank 106 and second end 113D of movable heat sink 112B. The cooling tubes 114A and 114B may be formed from a flexible and / or stretchable material such that the cooling tubes 114A and 114B may accommodate movable heat sinks 112A and 112B that may be located in a variety of different physical locations relative to the fluid tank 106 .

[0055] The fluid pump 104, the fixed heat sink 108, the fluid tank 106, and the movable heat sinks 112A and 112B form a cooling loop through which a cooling fluid can flow. During operation of the computing device, heat is transferred from heat-generating electronic components to the cold plate 102 of the cold plate assembly 101. The heat transferred to the cold plate 102 heats any cooling fluid located at or near the cold plate assembly 101 (e.g., any cooling fluid in the fluid pump 104 or cooling tubes 110). The fluid pump 104 then pumps the heated cooling fluid to the fixed heat sink 108 and movable heat sinks 112A and 112B (via the fluid tank 106). In some embodiments, a portion of the cooling tubes 110 may be positioned within or in contact with the cold plate 102 to facilitate heat transfer from the cold plate 102 to the cooling fluid within the cooling tubes 110.

[0056] The computing device may include one or more fans that, when in operation, cause air to flow through the fixed heat sink 108 and the movable heat sinks 112A and 112B. As the air flows through the heat sinks 108, 112A, and 112B, it removes heat from the cooling fluid and the heat sinks 108, 112A, and 112B. The fixed heat sink 108 and the movable heat sinks 112A and 112B may include one or more fins formed on their exteriors. These fins define airflow channels through which air from the fans flows. The airflow channels increase the surface area of ​​the heat sinks 108, 112A, and 112B over which the air flows, which in turn increases the amount of heat removed from the cooling fluid and the heat sinks 108, 112A, and 112B. The cooled cooling fluid then returns to the fluid tank 106, where it may be heated again by the cold plate 102 and / or heat-generating electronic components.

[0057] In some embodiments, the components of the liquid cooling module 100 form a complete circuit through which the cooling fluid flows. The cold plate 102 transfers heat from the heat-generating electronic components to the cooling fluid flowing through the cooling tubes 110 within the fixed heat sink 108. As the cooling fluid is pumped through the cooling tubes 110 by the fluid pump 104, some heat is removed by the air flowing through the fixed heat sink 108. The cooling fluid then enters the fluid tank 106 through the first end 111A or the second end 111B of the cooling tubes 110 and is then pumped to the movable heat sinks 112A and 112B so that more heat can be removed from the cooling fluid. The cooling fluid can be pumped to the movable heat sinks 112A and 112B via the first ends 115A and 115C of the cooling tubes 114A and 114B, respectively. As the cooling fluid flows through the cooling tubes 114A and 114B, any remaining heat in the cooling fluid is removed. The cooled cooling fluid then returns to the fluid tank 106 via the second ends 115B and 115D of the cooling pipes 114A and 114B, respectively. The cooling fluid is then further pumped back to the stationary radiator 108 via the first end 111A or the second end 111B of the cooling pipe 110.

[0058] In some embodiments, the hollow interior of the fluid box 106 is formed into two separate compartments, both of which are sealed. The first compartment of the fluid box 106 includes a first end 107A of the fluid box 106. The first compartment is connected to the first end 111A of the cooling tube 110, the first end 115A of the cooling tube 114A, and the first end 115C of the cooling tube 114B. The second compartment of the fluid box 106 includes a second end 107B of the fluid box 106. The second compartment is connected to the second end 111B of the cooling tube 110, the second end 115B of the cooling tube 114A, and the second end 115D of the cooling tube 114B. The fluid pump 104 can be operated to pump cooling fluid from the fixed radiator 108 and into the first compartment of the fluid box 106 via the first end 111A of the cooling tube 110, and then into the movable radiators 112A and 112B via the first ends 115A and 115C of the cooling tubes 114A and 114B. The cooling fluid flows through movable heat sinks 112A and 112B, then returns to the second compartment of fluid tank 106 via second ends 115B and 115D of cooling tubes 114A and 114B. Finally, the cooling fluid flows back to fixed heat sink 108 through second end 111B of cooling tube 110. The cooling fluid can then flow through fixed heat sink 108 and repeat the process. As the cooling fluid flows through fixed heat sink 108, it is heated by cold plate 102 and / or heat-generating electronic components. As the heated cooling fluid flows through fixed heat sink 108, some heat is removed by air flowing through fixed heat sink 108. As the cooling fluid flows through movable heat sinks 112A and 112B, some or all of this heat is removed by air flowing through movable heat sinks 112A and 112B.

[0059] Figure 1A The liquid cooling module 100 is shown when the movable heat sinks 112A and 112B are in a first position. When the movable heat sinks 112A and 112B are in the first position, the movable heat sinks 112A and 112B extend primarily from the fluid tank 106 along a first axis A1. The movable heat sink 112A extends in a first direction along the first axis A1, while the movable heat sink 112B extends in a second direction along the first axis A1. The first direction along the first axis A1 and the second direction along the first axis A1 are parallel to and opposite to each other. In the illustrated embodiment, when in the first position, the movable heat sinks 112A and 112B extend primarily horizontally away from the fluid tank 106 and are therefore generally in the same vertical position as the fluid tank 106.

[0060] Figure 1BThe liquid cooling module 100 is shown when the movable heat sinks 112A and 112B are in the second position. When the movable heat sinks 112A and 112B are in the second position, the movable heat sinks 112A and 112B extend primarily from the fluid tank 106 along the second axis A2. The second axis A2 is substantially perpendicular to the first axis A1. When the movable heat sinks 112A and 112B are in the second position, the movable heat sinks 112A and 112B extend in the first direction along the second axis A2. Figure 1B As shown, the direction along the second axis A2 is substantially perpendicular to the first direction along the first axis A1 ( Figure 1A The movable heat sink 112A in the first direction and the second direction along the first axis A1 ( Figure 1A In the illustrated embodiment, when in the second position, the movable radiators 112A and 112B extend primarily vertically away from the fluid tank 106 and are therefore generally directly adjacent the fluid tank 106 in a horizontal direction.

[0061] By comparison Figure 1A as well as Figure 1B It can be seen that the cooling tubes 114A and 114B connecting the fluid box 106 to the movable heat sinks 112A and 112B can be bent and / or stretched as needed to accommodate the physical position of the movable heat sinks 112A and 112B. Figure 1A ), the first end 115A and the second end 115B of the cooling tube 114A are arranged between the fluid box 106 and the movable radiator 112A along the first axis A1 in a first direction (eg, relative to Figure 1A Similarly, the first end 115C and the second end 115D of the cooling tube 114B extend in a second direction (e.g., relative to the plane of the fluid box 106 and the movable radiator 112B) along the first axis A1 between the fluid box 106 and the movable radiator 112B. Figure 1A When the radiators 112A and 112B are in the first position, the ends 115A-115D also extend substantially along a third axis (not shown) perpendicular to both the first axis A1 and the second axis A2 (e.g., between the entry and exit points). Figure 1A in the direction of the plane).

[0062] like Figure 1B As shown, when the movable heat sinks 112A and 112B are in the second position, the ends of the cooling tubes 114A and 114B are bent to accommodate the second position of the movable heat sinks 112A and 112B. The first end 115A and the second end 115B of the cooling tube 114A extend a little further in the first direction along the second axis A2 (e.g., relative to the first axis A2). Figure 1B The plane of the cooling tube 114B is generally upward) to accommodate the movable heat sink 112A moving to the second position. Similarly, the first end 115C and the second end 115D ( Figure 1B (not shown) extends slightly further in the first direction along second axis A2 to accommodate movable heat sink 112B when it is moved to the second position. When movable heat sinks 112A and 112B are in the first position, end portions 115A-115D also extend substantially along a third axis perpendicular to first axis A1 and second axis A2. Therefore, cooling tubes 114A and 114B can bend as needed to accommodate the first and second positions of movable heat sinks 112A and 112B.

[0063] Cooling tubes 114A and 114B can also stretch as needed to accommodate the physical position of movable heat sinks 112A and 112B. For example, when movable heat sinks 112A and 112B move from a first position to a second position, or from a second position to a first position, any of ends 115A-115D of cooling tubes 114A and 114B can move from an unstretched state to a stretched state. In the stretched state, one of ends 115A-115D extends a first distance between (i) fluid tank 106 and (ii) movable heat sink 112A or 112B. When the same end is in the unstretched state, it extends a second distance between (i) fluid tank 106 and (ii) movable heat sink 112A or 112B. The second distance is less than the first distance. Thus, cooling tubes 114A and 114B can stretch as needed to accommodate the first and second positions of movable heat sinks 112A and 112B.

[0064] By using flexible and / or stretchable materials for the cooling tubes 114A and 114B, the movable heat sinks 112A and 112B can be freely moved between the first position and the second position without disconnecting the movable heat sinks 112A and 112B from the fluid tank 106. As the movable heat sinks 112A and 112B move between positions, the ends 115A-115D of the cooling tubes 114A and 114B (or any other portion of the cooling tubes 114A and 114B) can bend, stretch, or both to accommodate the movement of the movable heat sinks 112A and 112B. Figure 1A as well as Figure 1B Although shown in a particular configuration, the cooling tubes 114A and 114B may be positioned in any desired configuration relative to the fluid tank 106 and the movable heat sinks 112A and 112B and may bend and / or stretch in any manner to accommodate movement of the movable heat sinks 112A and 112B.

[0065] Figure 1C An exploded view of the liquid cooling module 100 is shown, including a cold plate 102 , a fluid pump 104 , a fluid tank 106 , a fixed heat sink 108 , cooling pipes 110 , a movable heat sink 112A, a movable heat sink 112B, cooling pipes 114A, and cooling pipes 114B. Figure 1C Also shown are hinges connecting the movable radiators 112A and 112B to the fluid tank 106. The liquid cooling module 100 includes a first pair of hinges 116A and 116B connecting the movable radiator 112A to the fluid tank 106, and a second pair of hinges 116C and 116D connecting the movable radiator 112B to the fluid tank 106. In the illustrated embodiment, each of the hinges 116A-116D is generally formed by two plates that are attached to each other and can rotate relative to each other. One plate of each of the hinges 116A-116D connects to the fluid tank 106, while the other plate of each of the hinges 116A-116D connects to the movable radiator 112A or the movable radiator 112B. The hinges 116A-116D allow the movable radiators 112A and 112B to be in a first position ( Figure 1A ) and the second position ( Figure 1B ) rotate relative to the fluid box 106.

[0066] Although Figure 1C A rotating connection between the movable heat sinks 112A and 112B and the fluid tank 106 is shown, but other connections are also contemplated. For example, in some embodiments, the movable heat sinks 112A and 112B can be connected to the fluid tank 106 in a manner that allows the movable heat sinks 112A and 112B to slide between a first position and a second position. In other embodiments, the movable heat sinks 112A and 112B can be connected to the fluid tank 106 in a manner that allows the movable heat sinks 112A and 112B to rotate and slide between the first position and the second position. In further embodiments, the movable heat sinks 112A and 112B can be removably connected to the fluid tank 106. In these embodiments, the movable heat sinks 112A and 112B do not move while connected to the fluid tank 106. Instead, the movable heat sinks 112A and 112B can be removed from the fluid tank 106 while in one position, reoriented to a new position (e.g., the first position or the second position), and then reconnected to the fluid tank 106.

[0067] Figure 2AA board 200 is shown, which may be part of a computing device. The board 200 (which may be a motherboard, a daughterboard, etc.) includes heat-generating electronic components 202 (which may be a CPU, a GPU, etc.) and memory slots 204A and 204B. The computing device also includes a liquid cooling module 100 mounted on top of the heat-generating electronic components 202. Figure 2A In FIG. 1 , the movable heat sinks 112A and 112B of the liquid cooling module 100 are in the first position, and thus extend away from the fluid box 106 along the first axis A1. Figure 2A As shown, when the removable heat sinks 112A and 112B are in the first position, the removable heat sinks 112A and 112B are located above the memory slots 204A and 204B (e.g., a first axis perpendicular to the board 200 may intersect the removable heat sink 112A and the memory slot 204A, and a second axis perpendicular to the board 200 may intersect the removable heat sink 112B and the memory slot 204B). If a user wishes to install a memory module into the memory slots 204A and / or 204B, the user will be unable to do so because the removable heat sinks 112A and 112B block access to the memory slots 204A and 204B.

[0068] Figure 2B Drawing and Figure 2A The same plate 200. The liquid cooling module is mounted on top of the heat generating electronic component 202. However, in Figure 2B In the embodiment, the movable heat sinks 112A and 112B of the liquid cooling module 100 are in the second position. When in the second position, the movable heat sinks 112A and 112B extend above the fluid box 106 along the second axis A2. Figure 2B When the movable heat sinks 112A and 112B are in the second position, the movable heat sinks 112A and 112B are no longer located above the memory slots 204A and 204B (e.g., an axis perpendicular to the plate 200 does not intersect the movable heat sinks 112A and 112B). When the movable heat sinks 112A and 112B are in the second position, the movable heat sinks 112A and 112B allow access to the memory slots 204A and 204B, so that a user can install memory modules into the memory slots 204A and 204B without removing the liquid cooling module 100.

[0069] Figure 3 FIG. 3 shows a liquid cooling module in a computing device 300. Figure 3As shown, computing device 300 includes a housing 302 and a board 200 positioned within housing 302. Heat-generating electronic components 202A and 202B are disposed on board 200, along with memory slots 204A1, 204B1, 204C1, and 204D1. Board 200 and its components are positioned within housing 302. Computing device 300 also includes a fan module 304 for directing air toward heat-generating electronic components 202A and 202B in directions indicated by a series of arrows 306. Board 200 includes two separate liquid cooling modules 100A and 100B. Both liquid cooling modules 100A and 100B may be similar to or identical to liquid cooling module 100 of Figures 1A-1C.

[0070] Reference Figure 3 , the liquid cooling module 100A is fully mounted on the board 200 and positioned over the heat generating electronic component 202A. The movable heat sinks 112A and 112B of the liquid cooling module 100A are in a first position, thereby extending away from the fluid box 106 to be positioned over the memory slots 204A1 and 204B1. Figure 3 The liquid cooling module 100B is further shown when the liquid cooling module 100B is installed on the board 200. The movable heat sinks 112A and 112B of the liquid cooling module 100B are in the second position. Since the liquid cooling module 100B is placed on the heat-generating electronic component 202B, the movable heat sinks 112A and 112B will not be located above the memory slots 204C1 and 204D1. Once the liquid cooling module 100B is fully installed, the movable heat sinks 112A and 112B of the liquid cooling module 100B can be moved to the first position, so that the movable heat sinks 112A and 112B are located above the memory slots 204C1 and 204D1.

[0071] Figure 3 The benefits of the movable heat sinks 112A and 112B are shown. When the movable heat sinks 112A and 112B are in a first position (e.g., the movable heat sinks 112A and 112B of the liquid cooling module 100A), the movable heat sinks 112A and 112B are located within the airflow path of the fan module 304. When the module 304 is in operation, a majority of the surface area of ​​the movable heat sinks 112A and 112B is exposed to the airflow from the fan module 304, which removes heat from the movable heat sinks 112A and 112B.

[0072] When the movable heat sinks 112A and 112B are in the second position (e.g., the movable heat sinks 112A and 112B of the liquid cooling module 100B), the movable heat sinks 112A and 112B extend above the airflow path of the fan module 304. If the fan module 304 is operated when the movable heat sinks 112A and 112B are in the second position, the surface area over which air from the fan module 304 flows over the movable heat sinks 112A and 112B is reduced, thereby reducing the efficiency of the fan module 304 in removing heat from the movable heat sinks 112A and 112B.

[0073] However, the removable heat sinks 112A and 112B cannot be permanently placed in the first position, or the memory modules in the memory slots 204A1-204D1 cannot be repaired or replaced without completely removing the liquid cooling modules 100A and 100B from the housing 302. By using a liquid cooling module with a removable heat sink, a desired amount of heat dissipation can be achieved while still allowing access to the memory slots 204A1-204D1.

[0074] Although Figure 2A 、 Figure 2B as well as Figure 3 A liquid cooling module is shown for preventing or allowing access to memory slots and memory modules within a server, but the liquid cooling modules described herein can be used in conjunction with any suitable electronic components within any suitable device. For example, the liquid cooling module can be used with computing devices that have other components located near heat-generating electronic components, such as add-on cards, fan modules, power supplies, etc.

[0075] Although the present invention has been illustrated and described with respect to one or more embodiments, equivalent changes and modifications will occur or become known to others skilled in the art upon reading and understanding this specification and the accompanying drawings. In addition, although a particular feature of the present invention may be disclosed with respect to only one of several embodiments, such feature may be combined with one or more other features of the other embodiments, as may be desired and advantageous for any given or particular application.

[0076] Although various embodiments of the present invention have been described above, it should be understood that they are presented by way of example only and not limitation. Various changes may be made to the disclosed embodiments according to the disclosure herein without departing from the spirit or scope of the present invention. Therefore, the breadth and scope of the present invention should not be limited by any of the above-described embodiments. On the contrary, the scope of the present invention should be defined in accordance with the appended claims and their equivalents.

[0077] In summary, while the present invention has been disclosed in conjunction with the above embodiments, they are not intended to limit the present invention. Persons skilled in the art will readily appreciate that various modifications and variations may be made without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A liquid cooling module for cooling electronic components, the liquid cooling module comprising: a fluid tank for containing cooling fluid; at least one movable radiator connected to the fluid tank, the at least one movable radiator being adapted to move between a first position relative to the fluid tank and a second position relative to the fluid tank; and One or more cooling tubes fluidly connecting the fluid tank and the at least one movable radiator to allow the cooling fluid to flow between the fluid tank and the at least one movable radiator, wherein, when the at least one movable radiator is in the first position relative to the fluid tank, the at least one movable radiator extends from the fluid tank along a first direction, and wherein, when the at least one movable radiator is in the second position relative to the fluid tank, the at least one movable radiator extends from the fluid tank along a second direction, the second direction being different from the first direction, In which, the at least one movable radiator includes a first movable radiator and a second movable radiator. When the first movable radiator and the second movable radiator are in the first position, the first movable radiator extends along the first direction and the second movable radiator extends along a third direction, which is parallel to and opposite to the first direction.

2. The liquid cooling module as claimed in claim 1, wherein the at least one movable heat sink is rotatably connected to the fluid box, so that the at least one movable heat sink is configured to rotate between the first position and the second position. 3 . The liquid cooling module as claimed in claim 2 , wherein the at least one movable heat sink is rotatably connected to the fluid box via a hinge.

4. The liquid cooling module according to claim 1, wherein: When the at least one movable heat sink is in the first position, at least one of the one or more cooling tubes extends a first distance between the at least one movable heat sink and the fluid tank, and When the at least one movable heat sink is in the second position, at least one of the one or more cooling tubes extends a second distance between the at least one movable heat sink and the fluid tank, the second distance being less than the first distance. The liquid cooling module as claimed in claim 1 , wherein the first direction and the second direction are perpendicular to each other.

6. The liquid cooling module according to claim 5, wherein: When the at least one movable radiator is in the first position, at least one of the one or more cooling tubes extends along the first direction between the at least one movable radiator and the fluid tank, and When the at least one movable heat sink is in the second position, at least one of the one or more cooling tubes extends between the at least one movable heat sink and the fluid tank along the first direction and the second direction.

7. The liquid cooling module as claimed in claim 1, wherein when the first movable radiator and the second movable radiator are in the second position, the first movable radiator and the second movable radiator extend in the second direction, and the second direction is perpendicular to the first direction and the third direction.

8. A computing device comprising: case; a heat-generating electronic component positioned within the housing; at least one additional electronic component positioned within the housing; as well as The liquid cooling module according to any one of claims 1 to 7, wherein the liquid cooling module is positioned in the housing and is used to cool the heat-generating electronic component.

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