Water-cooled heat sink and electronic device

Abstract

A water cooling heat dissipating device and an electronic device, the water cooling heat dissipating device is used to dissipate heat from a first heat source and a second heat source, the water cooling heat dissipating device comprises a first heat exchanger, a second heat exchanger, a radiator and a fluid driver. The first heat exchanger has a first inlet and a first outlet, and is used to be thermally coupled to the first heat source. The second heat exchanger has a second inlet and a second outlet, and is used to be thermally coupled to the second heat source. The radiator has a first radiator inlet, a second radiator inlet and a radiator outlet. The first radiator inlet and the second radiator inlet are both communicated with the radiator outlet. The first radiator inlet is connected to the first outlet. The second radiator inlet is connected to the second outlet. The fluid driver has a fluid inlet, a first fluid outlet and a second fluid outlet. The fluid inlet of the fluid driver is communicated with the radiator outlet of the radiator. The first fluid outlet and the second fluid outlet are respectively communicated with the first radiator inlet and the second radiator inlet.

Description

Technical Field

[0001] This invention relates to a heat dissipation device and an electronic device, particularly a water-cooled heat dissipation device and an electronic device. Background Technology

[0002] Generally, a computer mainly consists of a chassis, power supply, motherboard, central processing unit (CPU), graphics card, and expansion cards. The power supply and motherboard are housed inside the chassis, while the CPU, graphics card, and expansion cards are mounted on the motherboard. When the computer is running, the CPU performs data processing, and the graphics card performs image processing; both generate a significant amount of heat. Therefore, computer manufacturers typically install fans or liquid cooling systems to dissipate heat from the CPU and graphics card.

[0003] Taking a water-cooled radiator as an example, a water-cooled radiator generally includes a water block, a radiator, and a pump. The water block makes thermal contact with the central processing unit (CPU) or graphics card. The radiator is used for heat dissipation. The water block, radiator, and pump are connected to form a circulation channel. Coolant is stored in the circulation channel. The pump drives the coolant to flow through the water block and radiator, forming a cooling cycle. When the coolant circulates, it transfers the heat generated by the CPU or graphics card to the radiator, where it is dissipated.

[0004] However, if you want to cool both the CPU and the graphics card at the same time, you need to prepare two sets of water cooling radiators, which not only increases the cost but also makes the internal space of the computer more crowded. Summary of the Invention

[0005] This invention provides a water-cooling heat dissipation device and an electronic device, thereby reducing the space occupied by the water-cooling heat dissipation device inside the electronic device while simultaneously ensuring the heat dissipation performance of both the central processing unit and the graphics card. Furthermore, it also solves the problem of limited air cooling efficiency caused by overcrowding inside electronic devices.

[0006] An embodiment of the present invention discloses a water-cooled heat dissipation device for dissipating heat from a first heat source and a second heat source. The water-cooled heat dissipation device includes a first heat exchanger, a second heat exchanger, a radiator, and a fluid actuator. The first heat exchanger has a first inlet and a first outlet and is used for thermal coupling to the first heat source. The second heat exchanger has a second inlet and a second outlet and is used for thermal coupling to the second heat source. The radiator has a first heat dissipation inlet, a second heat dissipation inlet, and a heat dissipation outlet. Both the first and second heat dissipation inlets are connected to the heat dissipation outlet. The first heat dissipation inlet is connected to the first outlet. The second heat dissipation inlet is connected to the second outlet. The fluid actuator has a fluid inlet, a first fluid outlet, and a second fluid outlet. The fluid inlet of the fluid actuator is connected to the heat dissipation outlet of the radiator. The first and second fluid outlets are respectively connected to the first and second heat dissipation inlets.

[0007] In one embodiment of the present invention, the first heat exchanger and the second heat exchanger are water-cooled plates, and the radiator is a water-cooled radiator.

[0008] In one embodiment of the present invention, the radiator includes a first water inlet chamber, a second water inlet chamber, a water outlet chamber, a first heat dissipation channel structure, and a second heat dissipation channel structure. The first water inlet chamber is connected to a first heat dissipation inlet, the second water inlet chamber is connected to a second heat dissipation inlet, the water outlet chamber is connected to a heat dissipation outlet, the first heat dissipation channel structure is connected to the first water inlet chamber and the second water inlet chamber, and the second heat dissipation channel structure is connected to the second water inlet chamber and the water outlet chamber.

[0009] In one embodiment of the present invention, a centrifugal airflow generator is further included. The centrifugal airflow generator is disposed on the heat sink and located between the first heat dissipation channel structure and the second heat dissipation channel structure. The centrifugal airflow generator is used to generate a heat dissipation airflow that blows toward the first heat dissipation channel structure and the second heat dissipation channel structure.

[0010] Another embodiment of the present invention discloses an electronic device comprising a body and a water-cooling heat dissipation device. The body includes an assembly frame, a first electronic component, and a second electronic component. The first electronic component and the second electronic component are respectively disposed on opposite sides of the assembly frame. The water-cooling heat dissipation device includes a first heat exchanger, a second heat exchanger, a radiator, and a fluid actuator. The first heat exchanger has a first inlet and a first outlet, and is used for thermal coupling to the first electronic component. The second heat exchanger has a second inlet and a second outlet, and is used for thermal coupling to the second electronic component. The radiator has a first heat dissipation inlet, a second heat dissipation inlet, and a heat dissipation outlet. Both the first and second heat dissipation inlets are connected to the heat dissipation outlet. The first heat dissipation inlet is connected to the first outlet. The second heat dissipation inlet is connected to the second outlet. The fluid actuator has a fluid inlet, a first fluid outlet, and a second fluid outlet. The fluid inlet of the fluid actuator is connected to the heat dissipation outlet of the radiator. The first and second fluid outlets are respectively connected to the first and second heat dissipation inlets.

[0011] In one embodiment of the present invention, the assembly frame has a first surface and a second surface, the second surface facing away from the first surface, a first electronic component disposed on the first surface, and a second electronic component disposed on the second surface.

[0012] In one embodiment of the invention, the normal direction of the first surface of the assembly frame is perpendicular to the vertical line.

[0013] In one embodiment of the present invention, the first electronic component includes a first circuit board and a first heat source, the first heat source being disposed on the first circuit board; the second electronic component includes a second circuit board and a second heat source, the second heat source being disposed on the second circuit board; a first heat exchanger is thermally coupled to the first heat source; and a second heat exchanger is thermally coupled to the second heat source.

[0014] In one embodiment of the present invention, the first heat source is a central processing unit and the second heat source is an image processor.

[0015] In one embodiment of the present invention, the first heat exchanger and the second heat exchanger are water-cooled plates, and the radiator is a water-cooled radiator.

[0016] In one embodiment of the present invention, the radiator includes a first water inlet chamber, a second water inlet chamber, a water outlet chamber, a first heat dissipation channel structure, and a second heat dissipation channel structure. The first water inlet chamber is connected to a first heat dissipation inlet, the second water inlet chamber is connected to a second heat dissipation inlet, the water outlet chamber is connected to a heat dissipation outlet, the first heat dissipation channel structure is connected to the first water inlet chamber and the second water inlet chamber, and the second heat dissipation channel structure is connected to the second water inlet chamber and the water outlet chamber.

[0017] In one embodiment of the present invention, a centrifugal airflow generator is further included. The centrifugal airflow generator is disposed on the heat sink and located between the first heat dissipation channel structure and the second heat dissipation channel structure. The centrifugal airflow generator is used to generate a heat dissipation airflow that blows toward the first heat dissipation channel structure and the second heat dissipation channel structure.

[0018] According to the water-cooled heat dissipation device and electronic device of the above embodiments, since the first cooling cycle and the second cooling cycle share the same pump and heat sink, the number of required components can be reduced, and the overall size of the water-cooled heat dissipation device can be effectively reduced. In this way, the space occupied by the water-cooled heat dissipation device inside the electronic device can be reduced, thereby solving the problem of limited air cooling efficiency caused by overcrowding inside the electronic device.

[0019] Furthermore, the first circuit board and the second circuit board are respectively disposed on opposite sides of the assembly frame. In this way, the heat generated by the first electronic component and the heat generated by the second electronic component are isolated by the assembly frame to avoid mutual interference.

[0020] The above description of the invention and the following description of the embodiments are used to demonstrate and explain the principles of the invention, and to provide a further explanation of the claims of the invention. Attached Figure Description

[0021] Figure 1 This is a perspective view of the electronic device according to the first embodiment of the present invention;

[0022] Figure 2 for Figure 1 A schematic diagram of the decomposition process;

[0023] Figure 3 for Figure 1 A three-dimensional diagram from another perspective;

[0024] Figure 4 for Figure 2 A schematic diagram of the decomposition process;

[0025] Figure 5 for Figure 1 A cross-sectional view of the radiator.

[0026] [Symbol Explanation]

[0027] 1…electronic devices

[0028] 10…machine

[0029] 11…Assembly rack

[0030] 11A…First Surface

[0031] 11B…Second Surface

[0032] 12…First Electronic Component

[0033] 13…First Circuit Board

[0034] 14…First Heat Source

[0035] 16…Second Electronic Component

[0036] 17…Second Circuit Board

[0037] 18…Second heat source

[0038] 20… Water-cooled heat dissipation device

[0039] 100… First heat exchanger

[0040] 110…First Entrance

[0041] 120…First Exit

[0042] 200… Second heat exchanger

[0043] 210…Second Entrance

[0044] 220…Second Exit

[0045] 300… Radiator

[0046] 301…First heat dissipation inlet

[0047] 302…Second heat dissipation inlet

[0048] 303…heat dissipation outlet

[0049] 310…First water inlet chamber

[0050] 320…Second water inlet chamber

[0051] 330…Water outlet chamber

[0052] 340…First heat dissipation channel structure

[0053] 350…Second heat dissipation channel structure

[0054] 360… Centrifugal airflow generator

[0055] 400… fluid drive

[0056] 410…Fluid inlet

[0057] 420…First fluid outlet

[0058] 430…Second fluid outlet

[0059] a~e… directions Detailed Implementation

[0060] Please see Figures 1 to 5 . Figure 1 This is a perspective view of the electronic device 1 according to the first embodiment of the present invention. Figure 2 for Figure 1 A schematic diagram of its breakdown. Figure 3 for Figure 1 A three-dimensional diagram from another perspective. Figure 4 for Figure 2 A schematic diagram of its breakdown. Figure 5 for Figure 1 A cross-sectional view of the radiator 300.

[0061] The electronic device 1 in this embodiment is, for example, a computer host or server. The electronic device 1 includes a body 10 and a water-cooling device 20. The body 10 includes an assembly frame 11, a first electronic component 12, and a second electronic component 16. The first electronic component 12 and the second electronic component 16 are respectively disposed on opposite sides of the assembly frame 11. Specifically, the assembly frame 11 has a first surface 11A and a second surface 11B. The second surface 11B faces away from the first surface 11A. The normal direction of the first surface 11A of the assembly frame 11 is, for example, perpendicular to a vertical line. That is, the assembly frame 11 is, for example, vertically positioned. The first electronic component 12 includes a first circuit board 13 and a first heat source 14. The first heat source 14 is disposed on the first circuit board 13. The first circuit board 13 is disposed on the first surface 11A of the assembly frame 11. The second electronic component 16 includes a second circuit board 17 and a second heat source 18. The second heat source 18 is disposed on the second circuit board 17. The second circuit board 17 is disposed on the second surface 11B of the assembly frame 11. In other words, the first circuit board 13 and the second circuit board 17 are respectively disposed on opposite sides of the assembly frame 11. In this way, the heat generated by the first electronic component 12 and the heat generated by the second electronic component 16 are isolated by the assembly frame 11 to avoid mutual interference.

[0062] In addition, the body 10 may also include components such as a shell, power supply, and hard disk (not shown), but since these electronic components have not been modified in this embodiment, they are not described.

[0063] In this embodiment, the first electronic component 12 is, for example, a graphics card, namely, the first circuit board 13 is, for example, the circuit board of the graphics card, and the first heat source 14 is, for example, the image processor of the graphics card. The second electronic component 16 is, for example, a motherboard assembly, namely, the second circuit board 17 is, for example, the motherboard, and the second heat source 18 is, for example, the central processing unit.

[0064] In this embodiment, the assembly rack 11 is placed vertically, but this is not a limitation. In other embodiments, the assembly rack may also be placed horizontally.

[0065] The water-cooled heat dissipation device 20 in this embodiment is used to dissipate heat between the first heat source 14 and the second heat source 18. The water-cooled heat dissipation device 20 is, for example, a water-cooled radiator 300, which contains a coolant. The coolant is, for example, water or a refrigerant. The water-cooled heat dissipation device 20 includes a first heat exchanger 100, a second heat exchanger 200, a radiator 300, and a fluid actuator 400. The first heat exchanger 100 has a first inlet 110 and a first outlet 120, and is thermally coupled to the first heat source 14. The second heat exchanger 200 has a second inlet 210 and a second outlet 220, and is thermally coupled to the second heat source 18. Thermal coupling refers to direct thermal contact or heat transfer through another heat conductor. In this embodiment, the first heat exchanger 100 and the second heat exchanger 200 are, for example, water-cooled plates.

[0066] like Figure 5 As shown, the radiator 300 in this embodiment is, for example, a water-cooled radiator, and includes a first heat dissipation inlet 301, a second heat dissipation inlet 302, a heat dissipation outlet 303, a first water inlet chamber 310, a second water inlet chamber 320, a water outlet chamber 330, a first heat dissipation channel structure 340, and a second heat dissipation channel structure 350. The first heat dissipation inlet 301 and the second heat dissipation inlet 302 are both connected to the heat dissipation outlet 303. The first heat dissipation inlet 301 is connected to the first outlet 120. The second heat dissipation inlet 302 is connected to the second outlet 220. The first water inlet chamber 310 is connected to the first heat dissipation inlet 301. The second water inlet chamber 320 is connected to the second heat dissipation inlet 302. The water outlet chamber 330 is connected to the heat dissipation outlet 303. The first heat dissipation channel structure 340 connects the first water inlet chamber 310 and the second water inlet chamber 320. The second heat dissipation channel structure 350 connects the second water inlet chamber 320 and the water outlet chamber 330.

[0067] Cooling fluid can flow in from either the first heat dissipation inlet 301 or the second heat dissipation inlet 302. Taking the first heat dissipation inlet 301 as an example, the cooling fluid enters the first water inlet chamber 310 from the first heat dissipation inlet 301 and diffuses along direction a. Then, it flows along direction b through the first heat dissipation channel structure 340 to the second water inlet chamber 320. Next, it flows along direction c from the second water inlet chamber 320 near the first heat dissipation channel structure 340 to near the second heat dissipation channel structure 350. Then, it flows along direction d through the second heat dissipation channel structure 350 to the water outlet chamber 330. Finally, it gathers along direction e to the heat dissipation outlet 303 and flows out from the heat dissipation outlet 303.

[0068] Taking the flow from the second heat dissipation inlet 302 as an example, the cooling fluid enters the second water inlet chamber 320 from the second heat dissipation inlet 302. Then, it flows along direction c from the second water inlet chamber 320 near the first heat dissipation channel structure 340 to near the second heat dissipation channel structure 350. Next, it flows along direction d through the second heat dissipation channel structure 350 to the water outlet chamber 330. Then, it gathers along direction e to the heat dissipation outlet 303 and flows out from the heat dissipation outlet 303.

[0069] In this embodiment, the first heat dissipation channel structure 340 and the second heat dissipation channel structure 350 are not provided with heat dissipation fins, but this is not a limitation. In other embodiments, the first heat dissipation channel structure and the second heat dissipation channel structure may also be provided with heat dissipation fins to improve the heat exchange efficiency between the heat sink and the external environment.

[0070] The fluid actuator 400 has a fluid inlet 410, a first fluid outlet 420, and a second fluid outlet 430. The fluid inlet 410 of the fluid actuator 400 is connected to the heat dissipation outlet 303 of the radiator 300. The first fluid outlet 420 and the second fluid outlet 430 are respectively connected to the first heat dissipation inlet 301 and the second heat dissipation inlet 302. In this way, the first heat exchanger 100, the second heat exchanger 200, the radiator 300, and the fluid actuator 400 together form a two-circulation flow channel. The circulation channel is used to store cooling fluids such as water or refrigerant (not shown), and the cooling fluid is used to circulate under the drive of the fluid actuator 400. The first cooling cycle is that the cooling fluid flows along... Figure 1 The cooling fluid flows sequentially through the first heat exchanger 100, the radiator 300, and the fluid actuator 400, as indicated by the arrows. When the cooling fluid flows through the first heat exchanger 100, it absorbs the heat generated by the first heat source 14. Next, the cooling fluid flows to the radiator 300, where it dissipates the heat generated by the first heat source 14 to the outside. Then, it returns to the fluid actuator 400 and is re-injected into the first heat exchanger 100 to exchange heat with the first heat source 14.

[0071] The second cooling cycle is that the cooling fluid flows along... Figure 3 The cooling fluid flows sequentially through the second heat exchanger 200, radiator 300, and fluid actuator 400, as indicated by the arrows. When the cooling fluid flows through the second heat exchanger 200, it absorbs the heat generated by the second heat source 18. Next, the cooling fluid flows to the radiator 300, where it dissipates the heat generated by the second heat source 18 to the outside. Then, it returns to the fluid actuator 400 and is re-injected into the second heat exchanger 200 to exchange heat with the second heat source 18.

[0072] Since the first and second cooling cycles share the pump and radiator 300, the number of required components can be reduced, and the overall size of the water-cooled heat dissipation device 20 can be effectively reduced. In this way, the space occupied by the water-cooled heat dissipation device 20 inside the electronic device 1 can be reduced, solving the problem of limited air cooling efficiency caused by overcrowding inside the electronic device 1.

[0073] In this embodiment, the heat sink 300 may further include a centrifugal airflow generator 360. The centrifugal airflow generator 360 is, for example, a fan, and is located between the first heat dissipation channel structure 340 and the second heat dissipation channel structure 350. The cooling airflow F generated by the centrifugal airflow generator 360 is used to blow towards the first heat dissipation channel structure 340 and the second heat dissipation channel structure 350 to improve the heat exchange efficiency between the heat sink 300 and the outside environment.

[0074] According to the water-cooled heat dissipation device and electronic device of the above embodiments, since the first cooling cycle and the second cooling cycle share the same pump and heat sink, the number of required components can be reduced, and the overall size of the water-cooled heat dissipation device can be effectively reduced. In this way, the space occupied by the water-cooled heat dissipation device inside the electronic device can be reduced, thereby solving the problem of limited air cooling efficiency caused by overcrowding inside the electronic device.

[0075] Furthermore, the first circuit board and the second circuit board are respectively disposed on opposite sides of the assembly frame. In this way, the heat generated by the first electronic component and the heat generated by the second electronic component are isolated by the assembly frame to avoid mutual interference.

[0076] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope defined in the appended claims.

Claims

1. A water-cooled heat dissipation device, characterized in that, The water-cooled heat dissipation device, used for dissipating heat from a first heat source and a second heat source, comprises: A first heat exchanger has a first inlet and a first outlet, and is used for thermal coupling to the first heat source. The first heat exchanger is a water-cooled plate. A second heat exchanger having a second inlet and a second outlet, and used for thermal coupling to the second heat source, wherein the second heat exchanger is a water-cooled plate; A radiator, which is a water-cooled radiator, has a first heat dissipation inlet, a second heat dissipation inlet, and a heat dissipation outlet. Both the first and second heat dissipation inlets are connected to the heat dissipation outlet. The first heat dissipation inlet is connected to the first outlet, and the second heat dissipation inlet is connected to the second outlet. The radiator includes a first water inlet chamber, a second water inlet chamber, a water outlet chamber, a first heat dissipation channel structure, and a second heat dissipation channel structure. The first water inlet chamber is connected to the first heat dissipation inlet, the second water inlet chamber is connected to the second heat dissipation inlet, and the water outlet chamber is connected to... The heat dissipation outlet and the first heat dissipation channel structure connect the first water inlet chamber and the second water inlet chamber. The second heat dissipation channel structure connects the second water inlet chamber and the water outlet chamber, so that the cooling fluid enters the first water inlet chamber from the first heat dissipation inlet and flows through the first heat dissipation channel structure to the second water inlet chamber. The cooling fluid enters the second water inlet from the second heat dissipation inlet and merges with the cooling fluid entering from the first heat dissipation inlet, and then flows together through the second heat dissipation channel structure to the water outlet chamber and flows out from the heat dissipation outlet. as well as A fluid actuator has a fluid inlet, a first fluid outlet, and a second fluid outlet. The fluid inlet of the fluid actuator is connected to the heat dissipation outlet of a radiator. The first fluid outlet and the second fluid outlet are respectively connected to the first heat dissipation inlet and the second heat dissipation inlet. Cooling fluid is driven by the fluid actuator to form a dual cooling cycle and shares the radiator and the fluid actuator. The dual cooling cycle is as follows: When the cooling fluid flows through the first heat exchanger, it absorbs the heat energy generated by the first heat source. Then, the cooling fluid flows to the radiator and discharges the heat energy generated by the first heat source to the outside through the radiator. It then returns to the fluid drive and is re-injected into the first heat exchanger through the fluid drive to exchange heat with the first heat source. When the cooling fluid flows through the second heat exchanger, it absorbs the heat energy generated by the second heat source. Then, the cooling fluid flows to the radiator and discharges the heat energy generated by the second heat source to the outside through the radiator. It then returns to the fluid drive and is re-injected into the second heat exchanger through the fluid drive to exchange heat with the second heat source.

2. The water-cooled heat dissipation device as described in claim 1, characterized in that, It also includes a centrifugal airflow generator disposed on the radiator and located between the first heat dissipation channel structure and the second heat dissipation channel structure. The centrifugal airflow generator is used to generate a heat dissipation airflow that blows toward the first heat dissipation channel structure and the second heat dissipation channel structure.

3. An electronic device, characterized in that, Include: A body, comprising an assembly frame, a first electronic component, and a second electronic component, wherein the first electronic component and the second electronic component are respectively disposed on opposite sides of the assembly frame; and A water-cooled heat dissipation device, comprising: A first heat exchanger having a first inlet and a first outlet, and used for thermal coupling to the first electronic component, wherein the first heat exchanger is a water-cooled plate; A second heat exchanger having a second inlet and a second outlet, and used for thermal coupling to the second electronic component, wherein the second heat exchanger is a water-cooled plate; A radiator, which is a water-cooled radiator, has a first heat dissipation inlet, a second heat dissipation inlet, and a heat dissipation outlet. Both the first and second heat dissipation inlets are connected to the heat dissipation outlet. The first heat dissipation inlet is connected to the first outlet, and the second heat dissipation inlet is connected to the second outlet. The radiator includes a first water inlet chamber, a second water inlet chamber, a water outlet chamber, a first heat dissipation channel structure, and a second heat dissipation channel structure. The first water inlet chamber is connected to the first heat dissipation inlet, the second water inlet chamber is connected to the second heat dissipation inlet, and the water outlet chamber is connected to... The heat dissipation outlet and the first heat dissipation channel structure connect the first water inlet chamber and the second water inlet chamber. The second heat dissipation channel structure connects the second water inlet chamber and the water outlet chamber, so that the cooling fluid enters the first water inlet chamber from the first heat dissipation inlet and flows through the first heat dissipation channel structure to the second water inlet chamber. The cooling fluid enters the second water inlet from the second heat dissipation inlet and merges with the cooling fluid entering from the first heat dissipation inlet, and then flows together through the second heat dissipation channel structure to the water outlet chamber and flows out from the heat dissipation outlet. as well as A fluid actuator has a fluid inlet, a first fluid outlet, and a second fluid outlet. The fluid inlet of the fluid actuator is connected to the heat dissipation outlet of a radiator. The first fluid outlet and the second fluid outlet are respectively connected to the first heat dissipation inlet and the second heat dissipation inlet. Cooling fluid is driven by the fluid actuator to form a dual cooling cycle and shares the radiator and the fluid actuator. The dual cooling cycle is as follows: When the cooling fluid flows through the first heat exchanger, it absorbs the heat energy generated by the first heat source. Then, the cooling fluid flows to the radiator and discharges the heat energy generated by the first heat source to the outside through the radiator. It then returns to the fluid drive and is re-injected into the first heat exchanger through the fluid drive to exchange heat with the first heat source. When the cooling fluid flows through the second heat exchanger, it absorbs the heat energy generated by the second heat source. Then, the cooling fluid flows to the radiator and discharges the heat energy generated by the second heat source to the outside through the radiator. It then returns to the fluid drive and is re-injected into the second heat exchanger through the fluid drive to exchange heat with the second heat source.

4. The electronic device as claimed in claim 3, characterized in that, The assembly frame has a first surface and a second surface, the second surface facing away from the first surface, the first electronic component being disposed on the first surface, and the second electronic component being disposed on the second surface.

5. The electronic device as claimed in claim 4, characterized in that, The normal direction of the first surface of the assembly frame is perpendicular to the vertical line.

6. The electronic device as claimed in claim 3, characterized in that, The first electronic component includes a first circuit board and a first heat source, the first heat source being disposed on the first circuit board; the second electronic component includes a second circuit board and a second heat source, the second heat source being disposed on the second circuit board; the first heat exchanger is thermally coupled to the first heat source; and the second heat exchanger is thermally coupled to the second heat source.

7. The electronic device as claimed in claim 6, characterized in that, The first heat source is the central processing unit, and the second heat source is the image processor.

8. The electronic device as claimed in claim 3, characterized in that, It also includes a centrifugal airflow generator disposed on the radiator and located between the first heat dissipation channel structure and the second heat dissipation channel structure. The centrifugal airflow generator is used to generate a heat dissipation airflow that blows toward the first heat dissipation channel structure and the second heat dissipation channel structure.

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