Method of processing and cutting device

Abstract

The present application provides a processing method and a cutting device, which can inhibit the reliability reduction and the connection failure of a chip. The processing method includes the following steps: a half-cutting step of cutting a first cutter into a packaging substrate, cutting the packaging substrate along a division predetermined line by the first cutter to form a first cutting groove, and forming a cutting residual portion below the first cutting groove; a full-cutting step of cutting the cutting residual portion along the first cutting groove by a second cutter thinner than the first cutter after the half-cutting step is implemented; and a front end shape confirmation step of confirming the shape of the front end of the first cutter. In the half-cutting step, the first cutter is cut into the packaging substrate at a cutting depth that makes the depth of the cutting residual portion a prescribed depth according to the shape of the front end of the first cutter confirmed by the front end shape confirmation step and the blade thickness of the second cutter.

Description

Technical Field

[0001] This invention relates to a processing method and a cutting device, which uses two cutting tools of different thicknesses to perform stepped cutting on a packaging substrate to form a chip (package) with stepped notches on the side. Background Technology

[0002] With the miniaturization of electronic devices in recent years, package sizes have also continued to shrink, resulting in smaller electrode areas on the package substrate. Therefore, in order to strengthen the bonding with the mounting substrate and improve the visibility of the bonding state, a package known as a wettable flank is widely used.

[0003] Wettable Flank packaging is formed by the following process: a cutting tool is used to partially cut the pre-defined dividing line of the packaging substrate so that the portion in the thickness direction of the electrode is exposed on the cut surface, then the electrode is electroplated, and then a full cut is performed using a cutting tool with a width narrower than the half-cut groove (see, for example, Patent Document 1).

[0004] Wettable Flank packaging improves solder wettability by creating notches on the electrode sides and performing electroplating. Furthermore, by forming stepped notches on the sides, solder is supplied to the notches during mounting, forming a raised area. This allows visualization of the solder bonding status from the top or sides, enabling visual inspection using a camera.

[0005] Patent Document 1: Japanese Patent Application Publication No. 2020-161615

[0006] On the other hand, the cutting tool wears down and forms an R-shape at its tip. Therefore, if the cutting depth is not changed when the cutting tool with an R-shape at its tip is cut in the half-cutting tool, the depth of the notch formed on the side of the chip (package) will change.

[0007] When the depth of the notch changes, during installation, the fillet weld exposed on the side of the package as a solder joint will not form a sufficient height from the mounting substrate, which may reduce the reliability of inspection or cause poor connection problems. Summary of the Invention

[0008] Therefore, the purpose of this invention is to provide a processing method and cutting device that can suppress the reduction of chip reliability and poor connection.

[0009] According to one aspect of the present invention, a processing method is provided in which, after a package substrate with multiple intersecting predetermined dividing lines is partially cut using a first tool, a full cut is performed using a second tool with a blade thickness thinner than the first tool, thereby forming a chip with stepped notches on its side surface. The processing method includes the following steps: a partial cutting step, in which the first tool cuts into the package substrate, and the first tool cuts along the predetermined dividing lines to form a first cutting groove, and a cutting residue is formed below the first cutting groove; a full cutting step, after the partial cutting step, in which the second tool, thinner than the first tool, cuts along the first cutting groove to remove the cutting residue; and a front-end shape confirmation step, in which the front-end shape of the first tool is confirmed, and in the partial cutting step, based on the front-end shape of the first tool confirmed by the front-end shape confirmation step and the blade thickness of the second tool, the first tool cuts into the package substrate to a depth that makes the depth of the notch a predetermined depth.

[0010] Preferably, in the front-end shape confirmation step, the first tool is used to form a cutting mark on the upper surface of the packaging substrate, and the front-end shape of the first tool is confirmed based on the cutting mark.

[0011] The preferred machining method also includes the following flattening step: the front end of the first tool is corrected and flattened at a specified time.

[0012] According to another aspect of the invention, a cutting apparatus is provided that, after partially cutting a package substrate with multiple intersecting predetermined dividing lines using a first tool, performs a full cut using a second tool with a blade thickness thinner than the first tool, thereby forming a chip with stepped notches on its sides. The cutting apparatus includes: a worktable for holding the package substrate; a first cutting unit having a first tool that cuts along the predetermined dividing lines to form a first cutting groove and forms a cutting residue below the first cutting groove; and a second cutting unit having... The system comprises: a second tool thinner than the first tool that cuts along the first cutting groove to remove the remaining cutting portion; an imaging unit that captures images of the cutting marks formed when the first tool cuts into the object being cut; and a control unit that controls each of the above-mentioned components, the control unit comprising: an estimation unit that estimates the tip shape of the first tool based on the image captured by the imaging unit; and a calculation unit that calculates the cutting depth of the first tool that makes the depth of the cut portion a predetermined depth based on the tip shape of the first tool estimated by the estimation unit and the cutting edge thickness of the second tool.

[0013] According to the present invention, the following effects are achieved: the chip's reliability is reduced and poor connection is prevented. Attached Figure Description

[0014] Figure 1 This is a perspective view showing an example of the structure of the cutting device according to the embodiment.

[0015] Figure 2 This is a top view of the packaging substrate that is being processed, as described in the processing method and cutting apparatus of the embodiment.

[0016] Figure 3 yes Figure 2 The side view of the packaging substrate shown.

[0017] Figure 4 yes Figure 2 The top view of the back side of the packaging substrate shown.

[0018] Figure 5 It is Figure 2 The diagram shows a three-dimensional view of the packaged chip obtained by dividing the packaged substrate.

[0019] Figure 6 It is shown Figure 1 Front view of the first cutting unit and the second cutting unit of the cutting device shown.

[0020] Figure 7 This is a flowchart illustrating the processing method of the embodiment.

[0021] Figure 8 It is shown schematically. Figure 7 A cross-sectional view of the half-cutting step of the processing method shown.

[0022] Figure 9 It is shown schematically. Figure 7 A cross-sectional view of all cutting steps in the processing method shown.

[0023] Figure 10 It is shown schematically. Figure 1 A cross-sectional view of the cutting device shown, showing the state of the first tool before wear.

[0024] Figure 11 It is shown schematically. Figure 10 The diagram shows a cross-sectional view of the first cutting tool in a worn state.

[0025] Figure 12 It is shown schematically. Figure 11 The cross-sectional view shown shows the state of further wear of the first tool.

[0026] Figure 13 It is shown schematically in partial cross-section. Figure 7 The side view of the state in which the cutting edge of the first tool cuts into the remaining area of ​​the outer periphery of the substrate of the packaging substrate during the front-end shape confirmation step of the processing method shown.

[0027] Figure 14 yes Figure 7 A top view of the remaining area on the outer periphery of the substrate of the packaging substrate with cutting marks formed in the front-end shape confirmation step of the processing method shown.

[0028] Figure 15 It is shown in Figure 7 The image shown is obtained by the imaging unit capturing images of the cutting marks during the front-end shape confirmation step of the processing method.

[0029] Figure 16 It is shown in Figure 7 In the front-end shape confirmation step of the processing method shown, Figure 15 The image shown is a diagram of the front end of the cutting edge of the first tool, generated by reducing the length of the image shown.

[0030] Figure 17 It is formed Figure 14 A cross-sectional view of the front end of the cutting edge of the first tool, showing the cutting marks.

[0031] Figure 18 Is with Figure 14 The longitudinal section view shown shows the cutting marks parallel to their length direction.

[0032] Figure 19 It is shown schematically in Figure 7 A cross-sectional view of the cutting depth, etc., calculated in the front-end shape confirmation step of the processing method shown.

[0033] Figure 20 This is a side view schematically showing, in a partial cross-section, the state in which the cutting edge of the first tool cuts into the remaining area of ​​the outer periphery of the substrate of the packaging substrate during the front-end shape confirmation step of the processing method in a modified embodiment.

[0034] Figure 21 This is a top view of the remaining area on the outer periphery of the base substrate of the packaging substrate with cutting marks formed in the front-end shape confirmation step of the processing method of a modified embodiment.

[0035] Label Explanation

[0036] 1: Cutting device; 10: Worktable; 20-1: First cutting unit; 20-2: Second cutting unit; 21-1: First cutting tool; 21-2: Second cutting tool; 25-2: Cutting edge thickness; 26, 26-1: Cutting depth; 30: Imaging unit; 100: Control unit; 101: Estimation unit; 102: Calculation unit; 200: Packaging substrate; 201: Packaging chip (chip); 203: Front side (upper surface); 205: Outer peripheral remaining area (cutting object); 206: Predetermined dividing line; 213: Side side; 214: Cut notch; 215: Depth; 216: First cutting groove; 217: Cutting residue; 219: Prescribed depth; 220, 220-1: Cutting mark; 1002: Half-cutting step; 1003: Full-cutting step; 1005: Front end shape confirmation step; 1007: Planarization step. Detailed Implementation

[0037] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The present invention is not limited to the contents described in the following embodiments. Furthermore, the constituent elements described below include contents that are readily conceived by those skilled in the art and substantially the same. Additionally, the structures described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications to the structure can be made without departing from the spirit of the present invention.

[0038] The processing method and cutting device 1 of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a perspective view showing an example of the structure of the cutting device according to the embodiment. Figure 2 This is a top view of the packaging substrate that is being processed by the processing method and cutting device of the embodiment. Figure 3 yes Figure 2 The side view of the packaging substrate shown. Figure 4 yes Figure 2 The top view of the back side of the packaging substrate shown. Figure 5 It is Figure 2 The diagram shows a three-dimensional view of the packaged chip obtained by dividing the packaged substrate. Figure 6 It is shown Figure 1 Front view of the first cutting unit and the second cutting unit of the cutting device shown.

[0039] Implementation methods Figure 1 The cutting device shown is for Figure 2 , Figure 3 and Figure 4 The substrate shown, namely the packaging substrate 200, is subjected to cutting processing to divide the packaging substrate 200 into... Figure 5 The processing apparatus that forms packaged chips 201 (equivalent to chips) as shown.

[0040] (Packaging substrate)

[0041] like Figure 2 As shown, the packaging substrate 200, the object to be processed by the cutting apparatus 1 in this embodiment, has a rectangular flat plate shape. The packaging substrate 200 has a rectangular flat plate-shaped base substrate 202, and a device region 204 and a peripheral remaining region 205 surrounding the device region 204 are provided on the front side 203 of the base substrate 202. Furthermore, the front side 203 of the base substrate 202 corresponds to the upper surface of the packaging substrate 200. The base substrate 202 is formed of a metal including copper (i.e., a copper alloy) or the like.

[0042] Device region 204 is provided with multiple intersecting predetermined dividing lines 206. One of the intersecting predetermined dividing lines 206 extends in a direction parallel to the length direction of the substrate 202, while the other extends in a direction perpendicular to the length direction of the substrate 202 and parallel to the width direction of the substrate 202. A device chip 208 is disposed within a region 207 defined by these intersecting predetermined dividing lines 206. The predetermined dividing lines 206 are configured to penetrate the substrate 202. Region 207 is formed by a portion of the substrate 202, on the back side 210 of the front side 203. Figure 4 A device chip 208 is provided on the side (as shown). Electrodes 209 for connecting the packaged chip 201 to the wiring substrate are provided on each predetermined dividing line 206.

[0043] Electrodes 209 are formed as a portion of the substrate 202. In this embodiment, they are respectively disposed at the center of the width direction of the predetermined dividing lines 206 and are formed in a straight line in a direction perpendicular to each predetermined dividing line 206. Electrodes 209 are connected via device chip 208 and metal wires (not shown).

[0044] In this embodiment, multiple device regions 204 are spaced apart along the length of the substrate 202 (three in this embodiment). The outer peripheral remaining region 205 is the region where no device chip 208 is disposed, formed by the substrate 202, surrounding the entire circumference of each device region 204, and connecting adjacent device regions 204 to each other.

[0045] In addition, such as Figure 3 and Figure 4As shown, the packaging substrate 200 has a sealing resin 211 that seals (encapsulates) the back side 210 of each device region 204. The sealing resin 211 is formed of thermoplastic resin and seals (encapsulates) the device chip 208 and metal wire disposed on the back side 210 of the region 207 of the substrate substrate 202, and fills within the predetermined dividing line 206. The sealing resin 211 seals (encapsulates) each device region 204 entirely on the back side 210 of the substrate substrate 202. On the front side 203 of the substrate substrate 202, the sealing resin 211 seals within the predetermined dividing line 206 with the region 207 where the device chip 208 is disposed and the electrode 209 exposed.

[0046] Regarding the packaging substrate 200, the center of each predetermined dividing line 206 in the width direction of each device region 204 is cut off, and the electrode 209 is divided into two parts. Figure 5 The various packaged chips 201 are shown. Thus, the packaged substrate 200, which is the object of processing by the processing method and cutting apparatus 1 in this embodiment, is a QFN substrate with metal electrodes 209 disposed on the predetermined dividing lines 206 cut by the cutting tool 21. Furthermore, in this embodiment, the packaged substrate 200 is a QFN (Quad Flat Non-leaded Package) substrate with electrodes 209 disposed on the predetermined dividing lines 206, but it is not limited to this and may also be a CSP (Chip Scale Packaging) substrate. In addition, in this embodiment, the packaged chips 201 divided from the packaged substrate 200 are small chips with each side length approximately 1mm × 1mm.

[0047] Additionally, in the implementation method, such as Figure 2 As shown, the packaging substrate 200 has alignment marks 212 at both ends of the pre-division lines 206 on the front side 203 of the base substrate 202, indicating the cutting position of the pre-division lines 206 during machining. In this embodiment, the alignment marks 212 are positioned side by side with the center of each pre-division line 206 in the width direction.

[0048] like Figure 5 As shown, the packaged chip 201 manufactured by dividing the packaged substrate 200 includes: a region 207 of the substrate 202; a device chip 208 disposed on the back side 210 of the region 207; an electrode 209; and a sealing resin 211. The sealing resin 211 seals the device chip 208 and the like while exposing the front side 203 of the region 207 and the electrode 209.

[0049] Furthermore, in this embodiment, the packaged chip 201 has stepped notches 214 formed on each side 213. The notches 214 have: a second side 213-1 on the front side 203, which is flat in a direction parallel to the side 213 and perpendicular to both the front side 203 and the back side 210; and a flat surface 213-2 connected to both the second side 213-1 and the side 213. The flat surface 213-2 is formed flatly along both the front side 203 and the back side 210. In the region where the electrode 209 is formed, the notches 214 are formed only on the electrode 209 and not on the sealing resin 211. The depth 215 of the notches 214 is less than the thickness of the electrode 209, and is set to a predetermined depth 219 set in advance during the design phase, etc.

[0050] Additionally, the packaged chip 201 has an electroplated layer (not shown) formed of metal on the front side of the electrode 209. This electroplated layer improves the wettability of the solder that holds the packaged chip 201 to the mounting substrate on the electrode 209. The packaged chip 201 is mounted on the mounting substrate by soldering the electrode 209 to a (not shown) metal portion of the mounting substrate.

[0051] (Cutting device)

[0052] The cutting device 1 in the embodiment is a processing device that holds the packaging substrate 200 on the worktable 10 and performs cutting processing along multiple predetermined dividing lines 206. In the embodiment, the cutting device 1 is a processing device (so-called jig cutter) that directly holds the packaging substrate 200 without the dicing tape attached on the worktable 10 and performs a so-called full cut on the packaging substrate 200 to divide it into packaged chips 201.

[0053] like Figure 1 As shown, the cutting device 1 includes: a worktable 10 that holds the packaged substrate 200 by means of a holding surface 11; a sub-chuck worktable 15; a cutting unit 20 that performs cutting processing on the packaged substrate 200 held by the worktable 10; an imaging unit 30 that captures images of the packaged substrate 200 held by the worktable 10; and a control unit 100. Figure 1 and Figure 6 As shown, the cutting device 1 is a cutting device with two cutting units 20, that is, a dual-spindle cutting machine, a so-called dual-axis type cutting device.

[0054] In addition, such as Figure 1 As shown, the cutting device 1 has a moving unit 40 that moves the worktable 10 and the cutting unit 20 relative to each other. The moving unit 40 has an X-axis moving unit 41, a Y-axis moving unit 42, a Z-axis moving unit 43, and a rotary moving unit 44.

[0055] The X-axis moving unit 41 moves the worktable 10 and the rotary moving unit 44 in the X-axis direction, which is parallel to the horizontal direction and serves as the machining feed direction. This causes the cutting unit 20 and the worktable 10 to move relative to each other along the X-axis direction. The Y-axis moving unit 42 moves the cutting unit 20 in the Y-axis direction, which is parallel to the horizontal direction and perpendicular to the X-axis direction and serves as the indexing feed direction. This causes the cutting unit 20 and the worktable 10 to move relative to each other along the Y-axis direction.

[0056] The Z-axis traverse unit 43 moves the cutting unit 20 in the Z-axis direction, which is perpendicular to both the X-axis and Y-axis directions and serves as the feed direction. This causes the cutting unit 20 and the worktable 10 to move relative to each other along the Z-axis. The rotary traverse unit 44, supported by the X-axis traverse unit 41, supports the worktable 10 and is configured to move freely together with the worktable 10 in the X-axis direction. The rotary traverse unit 44 rotates the worktable 10 about an axis parallel to the Z-axis direction.

[0057] The X-axis moving unit 41, Y-axis moving unit 42, and Z-axis moving unit 43 each include: a known ball screw configured to rotate freely about an axis; a known electric motor that rotates the ball screw about an axis; and a known guide rail that supports the worktable 10 or cutting unit 20 for free movement in the X-axis, Y-axis, or Z-axis directions. Additionally, the rotary moving unit 44 includes an electric motor that rotates the worktable 10 about an axis.

[0058] The worktable 10 uses the holding surface 11, which serves as the upper surface, to attract and hold the packaging substrate 200. The worktable 10 rotates about an axis parallel to the Z-axis direction via the rotary moving unit 44. The worktable 10 and the rotary moving unit 44 move together in the X-axis direction via the X-axis moving unit 41.

[0059] Regarding the worktable 10, the holding surface 11 is divided into multiple regions by a relief groove 12 into which the cutting tool 21 enters during machining. Within each region divided by the relief groove 12 of the holding surface 11, there are suction holes 13 for attracting the packaging substrate 200 and the packaging chip 201. The relief groove 12 is located at a position corresponding to the predetermined dividing line 206 (the position overlapping with the predetermined dividing line 206 of the packaging substrate 200 held by the holding surface 11) and is formed by recessing from the holding surface 11.

[0060] The suction hole 13 is disposed at a position corresponding to the packaged chip 201 (i.e., the position where it overlaps with the packaged chip 201 of the packaged substrate 200 held by the holding surface 11) and is open in each region of the holding surface 11. In the embodiment, the suction hole 13 corresponds to the packaged chip 201 in a one-to-one manner. The suction hole 13 is connected to the suction source via a suction path (not shown).

[0061] The worktable 10 holds the sealing resin 211 side of the encapsulation substrate 200 on the holding surface 11. The worktable 10 attracts the suction hole 13 through the suction source, thereby attracting and holding the encapsulation substrate 200 and the encapsulation chip 201 on the holding surface 11. In an embodiment, the worktable 10 is a so-called jig worktable that directly attracts and holds the encapsulation substrate 200 without the scribe strip attached to the holding surface 11, but it is not limited to a jig worktable in this invention.

[0062] The sub-chuck worktable 15 is positioned adjacent to the worktable 10, and the dressing plate 250 is held in place by the holding surface 16. The dressing plate 250 is used in the following straightening process: the cutting edge of the cutting tool 21 is worn by cutting the dressing plate 250, so that the cutting edge is flattened along the axial direction of the cutting unit 20.

[0063] The sub-chuck table 15 moves along the X-axis direction together with the table 10 and the rotary moving unit 44 via the X-axis moving unit 41. The sub-chuck table 15 rotates around the axis together with the table 10 via the rotary moving unit 44.

[0064] The cutting unit 20 is a machining unit that mounts a cutting tool 21 on the spindle 23 and cuts the packaging substrate 200 held by the worktable 10. The cutting unit 20 is configured to be freely movable in the Y-axis direction via the Y-axis moving unit 42 and in the Z-axis direction via the Z-axis moving unit 43 relative to the packaging substrate 200 held by the worktable 10. Figure 1 As shown, the cutting unit 20 is mounted on the support frame 3, which is erected from the main body 2, by means of the Y-axis moving unit 42 and the Z-axis moving unit 43. The cutting unit 20 can position the cutting tool 21 at any position on the holding surface 11 of the worktable 10 by means of the Y-axis moving unit 42 and the Z-axis moving unit 43.

[0065] The cutting unit 20 includes: a cutting tool 21; a spindle housing 22, which is configured to move freely in the Y-axis direction and the Z-axis direction via a Y-axis moving unit 42 and a Z-axis moving unit 43; a spindle 23, which is rotatable about an axis and has the cutting tool 21 mounted at its front end; a spindle motor (not shown) that rotates the spindle 23 about an axis; and a cutting water nozzle 24 that supplies cutting water to the cutting tool 21.

[0066] The cutting tool 21 is an extremely thin cutting abrasive with a generally annular shape. The cutting tool 21 is fixed to the front end of the spindle 23. In one embodiment, the cutting tool 21 is a so-called hub tool, which has: an annular circular base; and an annular cutting edge disposed on the outer periphery of the circular base to cut the package substrate 200. The cutting edge is formed from abrasive grains such as SiC, alumina, diamond, or CBN (Cubic Boron Nitride) and a bonding material for fixing the abrasive grains such as metal or resin, and is formed to a predetermined thickness. Alternatively, in this invention, the cutting tool 21 may also be a so-called washer tool consisting only of the cutting edge.

[0067] Furthermore, in the following text, one of the two cutting units 20 will be referred to as the first cutting unit 20 (shown as 20-1), and the other as the second cutting unit 20 (shown as 20-2). Additionally, in the following text... Figure 6 As shown, the cutting tool 21 of the first cutting unit 20-1 is designated as the first tool 21 (shown as 21-1), and the cutting tool 21 of the second cutting unit 20-2 is designated as the second tool 21 (shown as 21-2). Furthermore, compared to the cutting edge thickness 25-1 of the first tool 21-1 of the first cutting unit 20-1, the cutting edge thickness 25-2 of the second tool 21-2 of the second cutting unit 20-2 is thinner. Additionally, in this embodiment, when tools 21-1 and 21-2 repeatedly cut the packaging substrate 200, the cutting edges gradually wear down from the front end side, and the corners are removed to form a curved surface (R-shape).

[0068] The imaging unit 30 is fixed to the first cutting unit 20-1 in a manner that allows it to move integrally with the first cutting unit 20-1. The imaging unit 30 has an imaging element that captures images of the area to be divided on the packaging substrate 200 held by the worktable 10 before cutting. The imaging element is, for example, a CCD (Charge-Coupled Device) imaging element or a CMOS (Complementary Metal-Oxide-Semiconductor) imaging element. The imaging unit 30 captures images of the packaging substrate 200 held by the worktable 10 to obtain images for alignment, i.e., alignment of the packaging substrate 200 with the cutting tool 21, and outputs the obtained images to the control unit 100.

[0069] Additionally, the cutting device 1 includes: an X-axis position detection unit (not shown) for detecting the X-axis position of the worktable 10; a Y-axis position detection unit (not shown) for detecting the Y-axis position of the cutting units 20-1 and 20-2; and a Z-axis position detection unit for detecting the Z-axis position of the cutting units 20-1 and 20-2. The X-axis and Y-axis position detection units can be composed of a linear scale parallel to the X-axis or Y-axis direction and a reading head. The Z-axis position detection unit uses pulses from a motor to detect the Z-axis position of the cutting units 20-1 and 20-2. The X-axis, Y-axis, and Z-axis position detection units output the X-axis position of the worktable 10 and the Y-axis or Z-axis position of the lower end of the cutting edge of the cutting units 20-1 and 20-2 to the control unit 100.

[0070] Furthermore, in the embodiment, the positions of the worktable 10 of the cutting device 1 and the cutting units 20-1 and 20-2 in the X-axis direction, Y-axis direction, and Z-axis direction are determined according to a pre-set reference position (not shown).

[0071] The control unit 100 controls each component of the cutting device 1, including the first cutting unit 20-1, the second cutting unit 20-2, and the imaging unit 30, to enable the cutting device 1 to perform processing operations on the packaging substrate 200. Furthermore, the control unit 100 is a computer, comprising: an arithmetic processing unit having a microprocessor such as a CPU (central processing unit); a storage device having a memory such as ROM (read-only memory) or RAM (random access memory); and an input / output interface device. The arithmetic processing unit of the control unit 100 performs arithmetic processing according to a computer program stored in the storage device, and outputs control signals for controlling the cutting device 1 to each component of the cutting device 1 via the input / output interface device.

[0072] The control unit 100 is connected to a display unit, such as a liquid crystal display device that displays the status or image of the processing operation, and an input unit used by the operator to register processing information. The input unit consists of a touch panel provided on the display unit.

[0073] In addition, such as Figure 1As shown, the control unit 100 includes an estimation unit 101, a calculation unit 102, and a machining control unit 103 that controls the machining operations of each component of the cutting device 1. The functions of the estimation unit 101, the calculation unit 102, and the machining control unit 103 are realized by an arithmetic processing device performing arithmetic processing according to a computer program stored in a storage device.

[0074] The processing method of this embodiment is as follows: After the packaging substrate 200 is partially cut by the first tool 21-1, the cutting device 1 performs a full cut by the second tool 21-2, which has a blade thickness 25-2 thinner than the first tool 21-1, thereby forming a packaging chip 201 with a stepped notch 214 formed on the side 213. That is, the processing method of this embodiment is also the processing operation of the cutting device 1. Figure 7 This is a flowchart illustrating the processing method of the embodiment. For example... Figure 7 As shown, the processing method of the embodiment includes a half-cutting step 1002, a full-cutting step 1003, a front-end shape confirmation step 1005, and a flattening step 1007.

[0075] The cutting device 1 places the sealing resin 211 of the encapsulation substrate 200 on the holding surface 11 of the worktable 10, and places the dressing plate 250 on the holding surface 11 of the sub-chuck worktable 15. The cutting device 1 performs the machining operation, i.e., the machining method, when the control unit 100 receives machining conditions input from the input unit, etc., and the control unit 100 receives a machining start instruction from the operator, etc. Furthermore, the machining conditions include the cutting edge thicknesses 25-1 and 25-2 of each tool 21-1 and 21-2, and the cutting depth 26 of the first tool 21-1. Figure 8 (As shown), the depth 215 of the notch 214 is the predetermined depth 219 set in the design stage, the thickness of the electrode 209, the type of the first cutting tool 21-1, the type of the packaging substrate 200, etc. In addition, the cutting depth 26 in the processing conditions is less than the thickness of the electrode 209, and is the same as the depth 215 of the notch 214, which is the predetermined depth 219 set in the design stage.

[0076] When the machining operation begins, the cutting device 1 rotates the spindles 23 of the cutting units 20-1 and 20-2, i.e., the cutting tools 21-1 and 21-1, around their axes. The cutting device attracts and holds the encapsulation substrate 200 on the holding surface 11 of the worktable 10, and attracts and holds the trimming plate 250 on the holding surface 11 of the sub-chuck worktable 15. Furthermore, when the machining operation begins, the cutting device 1 determines, via the machining control unit 103 of the control unit 100, whether it is time to confirm the shape of the tip of the cutting edge of the first tool 21-1 (step 1001). The timing for confirming the shape of the tip of the cutting edge of the first tool 21-1 is determined based on the type of encapsulation substrate 200 and the first tool 21-1. When the cutting device 1 determines, via the machining control unit 103 of the control unit 100, that it is not time to confirm the shape of the tip of the cutting edge of the first tool 21-1 (step 1001: No), it proceeds to the half-cutting step 1002.

[0077] (Semi-cutting step)

[0078] Figure 8 It is shown schematically. Figure 7 The diagram shows a cross-sectional view of the half-cutting step of the processing method. Half-cutting step 1002 involves the following steps: a first tool 21-1 cuts into the packaging substrate 200, and the first tool 21-1 cuts the packaging substrate 200 along the predetermined dividing line 206 to form a first cutting groove 216, and a cutting residue 217 is formed below the first cutting groove 216. In other words, in half-cutting step 1002, the first tool 21-1 cuts the packaging substrate 200 along the predetermined dividing line 206 to form the first cutting groove 216, and a cutting residue 217 is formed below the first cutting groove 216.

[0079] In the semi-cutting step 1002, the cutting device 1 controls the moving unit 40 via the processing control unit 103 of the control unit 100 to move the worktable 10 below the imaging unit 30. The imaging unit 30 then captures the mark 212 on the packaging substrate 200 and performs alignment, i.e., aligning the cutting tools 21-1 and 21-2 with the predetermined dividing line 206. In the semi-cutting step 1002, the cutting device 1 controls each component via the processing control unit 103 of the control unit 100, moving the worktable 10 and the first cutting tool 21-1 of the cutting unit 20-1 relative to each other along the X-axis and Y-axis directions, while simultaneously causing the cutting edge of the first cutting tool 21-1 to cut into the center of a predetermined dividing line 206 at a depth 26 set in the processing conditions. In the semi-cutting step 1002, as... Figure 8 As shown, the cutting device 1 uses the first cutting tool 21-1 to cut the predetermined dividing line 206 of the package substrate 200, forming a first cutting groove 216 on the predetermined dividing line 206, and forming a cutting residue 217 below the first cutting groove 216.

[0080] In this embodiment, during the half-cutting step 1002, the cutting device 1 causes the tip of the cutting edge of the first tool 21-1 to cut to a depth 26 up to the center of each electrode 209 in the thickness direction, and a first cutting groove 216 is also formed on the electrode 209 of the predetermined dividing line 206. Furthermore, since the first cutting groove 216 is formed by the tip of the cutting edge of the first tool 21-1 cutting to the center of the electrode 209 in the thickness direction, it is a groove that does not separate the electrode 209 and the packaging substrate 200, i.e., a half-cutting groove.

[0081] In one embodiment, during the half-cutting step 1002, the cutting device 1 forms a first cutting groove 216 on one of the predetermined dividing lines 206 of the packaging substrate 200 held by the worktable 10. However, in this invention, the first cutting groove 216 can be formed sequentially on a number of predetermined dividing lines 206 set by processing conditions, etc. In another embodiment, during the half-cutting step 1002, when the cutting device 1 forms the first cutting groove 216 on one of the predetermined dividing lines 206 of the packaging substrate 200 held by the worktable 10, the process proceeds to the full-cutting step 1003.

[0082] (Full cutting steps)

[0083] Figure 9 It is shown schematically. Figure 7 The diagram shows a cross-sectional view of the full cutting step of the machining method. Full cutting step 1003 is a step performed after half-cutting step 1002, where a second tool 21-2 with a cutting edge thickness 25-2 thinner than the first tool 21-1 cuts along the first cutting groove 216 to cut the remaining cutting portion 217. That is, in full cutting step 1003, the second tool 21-2 is a cutting tool that cuts along the first cutting groove 216 to cut the remaining cutting portion 217, and it is a cutting tool with a cutting edge thickness 25-2 thinner than the first tool 21-1.

[0084] In the full cutting step 1003, the cutting device 1 controls each component through the machining control unit 103 of the control unit 100. While moving the worktable 10 and the second tool 21-2 of the cutting unit 20-2 relative to each other along the X-axis and Y-axis directions, the cutting edge of the second tool 21-2 cuts into the cutting residue 217 below the first cutting groove 216 formed at the center of the width direction of a predetermined dividing line 206 until it reaches the retraction groove 12. In the full cutting step 1003, as... Figure 9As shown, the cutting device 1 uses the second cutting tool 21-2 to cut the center of the cutting residue 217 below the first cutting groove 216 formed on the dividing predetermined line 206 of the packaging substrate 200 in the width direction, forming a second cutting groove 218 that cuts off the cutting residue 217. In the full cutting step 1003, the cutting device 1 forms the second cutting groove 218 that cuts off the cutting residue 217, dividing the packaging substrate 200 into packaging chips 201.

[0085] At this time, the packaging substrate 200, i.e., the packaged chip 201, forms a notched portion 214 through the first cutting groove 216 and a side surface 213 through the second cutting groove 218. The inner surface of the first cutting groove 216 becomes the second side surface 213-1, the bottom surface of the first cutting groove 216 becomes the flat surface 213-2, the inner surface of the second cutting groove 218 becomes the side surface 213, and the depth 215 of the notched portion 214 is set by the cutting depth 26 of the first tool 21-1.

[0086] In this embodiment, during the full cutting step 1003, the cutting device 1 cuts the cutting residue 217 below the first cutting groove 216 of one of the predetermined dividing lines 206 formed on the packaging substrate 200 held and attracted by the worktable 10. However, in this invention, the first cutting groove 216 may be formed sequentially on a number of predetermined dividing lines 206 set by processing conditions, etc. In this case, during the full cutting step 1003, it is preferable to cut the cutting residue 217 below the first cutting groove 216 just formed in the previous half cutting step 1002. In this embodiment, during the full cutting step 1003, when the cutting device 1 cuts the cutting residue 217 below the first cutting groove 216 of one of the predetermined dividing lines 206 formed on the packaging substrate 200 held and attracted by the worktable 10, the process proceeds to step 1004.

[0087] The cutting device 1 determines, via the processing control unit 103 of the control unit 100, whether the first cutting groove 216 is formed on all the predetermined dividing lines 206 of the packaging substrate 200 through the half-cutting step 1002 and the cutting residue 217 below the first cutting groove 216 is cut through the full-cutting step 1003 to divide the packaging substrate 200 into individual packaging chips 201 (step 1004). In the cutting device 1, if the processing control unit 103 of the control unit 100 determines that the first cutting groove 216 is not formed on all the predetermined dividing lines 206 of the packaging substrate 200 through the half-cutting step 1002 and the cutting residue 217 below the first cutting groove 216 is not cut through the full-cutting step 1003 to divide the packaging substrate 200 into individual packaging chips 201 (step 1004: No), it returns to step 1001.

[0088] In the cutting device 1, when the machining control unit 103 of the control unit 100 determines that it is time to confirm the shape of the tip of the cutting edge of the first tool 21-1 (step 1001: Yes), it proceeds to the tip shape confirmation step 1005. Here, the first tool 21-1 of the cutting unit 20-1 of the cutting device 1, before wear, for example... Figure 8 and Figure 10 As shown, the cutting edge is formed flat along the axis of the main shaft 23, and the curved surface 28 (also called the R-shape) of the angle at the cutting edge is small. Additionally, Figure 10 It is shown schematically. Figure 1 A cross-sectional view of the cutting device shown, showing the state of the first tool before wear. Figure 11 It is shown schematically. Figure 10 The diagram shows a cross-sectional view of the first cutting tool in a worn state. Figure 12 It is shown schematically. Figure 11 The cross-sectional view shown depicts the further wear of the first cutting tool.

[0089] The first tool 21-1 wears out during repeated cutting of the predetermined dividing line 206, for example... Figure 11 As shown, the curved surface 28 of the tip of the cutting edge gradually increases, and the boundary 27 of the curved surface 28 and the flat surface along the axis of the main shaft 23 gradually moves towards the center of the cutting edge in the thickness direction. When the boundary 27 of the first tool 21-1 is located outside the second cutting groove 218 formed by the second tool 21-2, the cutting depth 26 is equal to the depth 215 of the notch 214, and a notch 214 with a predetermined depth 219 can be formed. Conversely, when the boundary 27 of the first tool 21-1 is located inside the second cutting groove 218 formed by the second tool 21-2, the depth 215 of the notch 214 becomes smaller than the cutting depth 26, resulting in a notch 214 with a depth 215 smaller than the predetermined depth 219.

[0090] Additionally, when the first tool 21-1 wears further, for example as... Figure 12 As shown, sometimes the cutting edge disappears along the flat surface of the axis at its tip, and the tip is formed into a curved surface that curves outward in the circumferential direction. As a result, the depth 215 of the notch 214 becomes smaller than the cutting depth 26, and a notch 214 with a depth 215 less than the predetermined depth 219 is formed.

[0091] In this implementation, the timing for confirming the shape of the tip of the cutting edge of the first tool 21-1 in step 1001 is, for example, when the first tool 21-1... Figure 12The timing before wear occurs and the depth 215 of the notch 214 becomes smaller than the cutting depth 26, as shown, is, for example, the timing just before the boundary 27 enters the inner side of the second cutting groove 218 (just before it enters). In the embodiment, the timing of confirming the shape of the tip of the cutting edge of the first tool 21-1 in step 1001 is determined according to each type of package substrate 200 and the first tool 21-1, such as after the start of the processing operation or after the previous tip shape confirmation step 1005 has been performed and a predetermined number of dividing lines 206 have been cut, etc.

[0092] (Front-end shape confirmation steps)

[0093] Figure 13 It is shown schematically in partial cross-section. Figure 7 The side view of the state in which the cutting edge of the first tool cuts into the remaining area of ​​the outer periphery of the substrate of the packaging substrate during the front-end shape confirmation step of the processing method shown. Figure 14 yes Figure 7 A top view of the remaining area on the outer periphery of the substrate of the packaging substrate with cutting marks formed in the front-end shape confirmation step of the processing method shown. Figure 15 It is shown in Figure 7 The image shown is obtained by the imaging unit capturing images of the cutting marks during the front-end shape confirmation step of the processing method. Figure 16 It is shown in Figure 7 In the front-end shape confirmation step of the processing method shown, Figure 15 The image shown is a diagram of the front end of the cutting edge of the first tool, generated by reducing the length of the image shown. Figure 17 It is formed Figure 14 A cross-sectional view of the front end of the cutting edge of the first tool, showing the cutting marks. Figure 18 Is with Figure 14 The longitudinal section view shown shows the cutting marks parallel to their length direction. Figure 19 It is shown schematically in Figure 7 A cross-sectional view of the cutting depth, etc., calculated in the front-end shape confirmation step of the processing method shown.

[0094] The front-end shape confirmation step 1005 is a step of confirming the shape of the front end of the cutting edge of the first tool 21-1. In the embodiment, in the front-end shape confirmation step 1005, the cutting device 1 controls the moving unit 40, etc., through the estimation unit 101 of the control unit 100. Figure 13 As shown, the first cutting tool 21-1 is positioned above the base substrate 202 of the outer peripheral remaining area 205 of the packaging substrate 200, which is the object to be cut. The rotating first cutting tool 21-1 is lowered along the Z-axis direction, and after the front end of the cutting edge of the first cutting tool 21-1 cuts in, the first cutting tool 21-1 is raised along the Z-axis direction.

[0095] Therefore, a package substrate 202 is formed on the front side 203 of the substrate 202 in the remaining area 205 of the outer periphery of the package substrate 200. Figure 14 The cutting mark 220 is shown. Thus, in this embodiment, during the front-end shape confirmation step 1005, the cutting device 1 causes the first tool 21-1 to cut into the front surface 203 of the base substrate 202 of the outer peripheral remaining area 205 of the packaging substrate 200, which is the object of cutting, and forms a cutting mark 220 on the front surface 203 using the first tool 21-1. Alternatively, in this embodiment, during the front-end shape confirmation step 1005, the cutting mark 220 is formed by a so-called cleaving cut, in which the first tool 21-1 is raised and lowered relative to the front surface 203 of the base substrate 202 of the outer peripheral remaining area 205 of the packaging substrate 200. The cutting mark 220 is a groove recessed from the front surface 203 extending along the X-axis direction, and the shapes of its two ends 221 are curved according to the shape of the front end of the cutting edge of the first tool 21-1.

[0096] Furthermore, a cutting mark 220 is formed by the first tool 21-1 moving up and down along the Z-axis, so that the two ends 221 of the cutting mark 220 are formed as terminals that gradually approach the front face 203 as they approach the two ends 221. The two ends 221 of the cutting mark 220 are identical in shape to the front end of the cutting edge of the first tool 21-1.

[0097] In the front-end shape confirmation step 1005, the cutting device 1, through the estimation unit 101 of the control unit 100, controls the moving unit 40, etc., to position the cutting mark 220 below the imaging unit 30. In the front-end shape confirmation step 1005, the cutting device 1, through the estimation unit 101 of the control unit 100, causes the imaging unit 30 to capture the cutting mark 220, thereby obtaining the shape below the front-end. Figure 15 Image 300 shows an example. In this way, the imaging unit 30 captures the cutting mark 220 formed when the first tool 21-1 cuts into the outer peripheral remaining area 205 of the packaging substrate 200 on the base substrate 202.

[0098] In the front-end shape confirmation step 1005, the cutting device 1, through the estimation unit 101 of the control unit 100, determines the length of the image 300 containing at least a portion of one end 221 of the cutting mark 220 as the tangential direction 29 from the front end of the cutting edge of the tool 21-1. Figure 18 The image (as shown) is observed in a way that reduces the length of at least a portion of the image to form an image 400 that approximates the tip of the cutting edge of the first tool 21-1. Specifically, the estimation unit 101 of the control unit 100, as shown... Figure 15 As shown, image 300 is divided along the length of cutting mark 220.

[0099] In this embodiment, the estimation unit 101 of the control unit 100 divides the image 300 into multiple segmented images 301, 302, 303, and 304 from one end 221 of the cutting mark 220 according to each length L that can be calculated using the following formula 1. The control unit 100 pre-stores the following Equation 1. The control unit 100 calculates the length L1 (L in Equation 1) of the segmented image 302 containing one end 221 of the cutting mark 220, which corresponds to the value α1 (α is shown in Equation 1) and can be calculated using Equation 1. Here, the value α1 is set to, for example, 1 μm, R is set to the radius of the first tool 21-1, and d is set to the cutting depth of the cutting mark 220. In addition, the segmented image 302 is an image of a portion of the cutting mark 220 containing one end 221 of the cutting mark 220.

[0100] Formula 1

[0101]

[0102] The estimation unit 101 of the control unit 100 removes a portion of the pixels constituting the segmented image 302 in such a way that the length L (L1) of the segmented image 302 becomes the value α1. At this time, the control unit 100 removes pixels at equal intervals according to each interval corresponding to the length difference between the length L (L1) and the value α1.

[0103] Next, the control unit 100 sets the value α2 to, for example, 1 μm, sets d to the cutting depth of the cutting mark 220, and sets R to R-α1, and uses Equation 1 to calculate the length L (L2) of the segmented image 303 adjacent to the segmented image 302 corresponding to the value α2 (α in Equation 1). The estimation unit 101 of the control unit 100 removes a portion of the pixels constituting the segmented image 303 in such a way that the length L (L2) of the segmented image 303 becomes the value α2. Additionally, the control unit 100 sets the value α3 to, for example, 1 μm, sets d to the cutting depth of the cutting mark 220, and sets R to R-(α1+α2), and uses Equation 1 to calculate the length L (L3) of the segmented image 304 adjacent to the segmented image 303 corresponding to the value α3 (α in Equation 1). The control unit 100 removes a portion of the pixels constituting the segmented image 303 in such a way that the length L (L3) of the segmented image 304 becomes the value α3.

[0104] In this way, the estimation unit 101 of the control unit 100 divides the image 300 into segmented images 301, 302, and 303. Given 300N, find the values ​​of α1, α2, α3, and α4. The segmented images corresponding to αN are 302, 303, and 304. The lengths L1, L2, and L3 are 30N. LN. The estimation unit 101 of the control unit 100 will consider all segmented images 302, 303, 304, A portion of the 30N pixels is removed, and the length is reduced to values ​​α1, α2, α3. αN. Furthermore, the estimation unit 101 of the control unit 100 will reduce the segmented images 301, 302, 303, 304, 30N combined, such as Figure 16 As shown, the length of image 300 is reduced to generate image 400, which approximates the shape of the tip of the cutting edge of the first tool 21-1. Additionally, Figure 16 The shape of the cutting mark 220 in the image 400 shown is similar to Figure 17 The front section shape of the cutting edge of the first tool 21-1 that forms the cutting mark 220 is approximately the same.

[0105] Thus, in the embodiment, in the front-end shape confirmation step 1005, the estimation unit 101 of the control unit 100 confirms the shape of the front end of the cutting edge of the first tool 21-1 based on the image 300 of the cutting mark 220 obtained by the imaging unit 30.

[0106] Next, Equation 1 above will be explained. For example... Figure 10 As shown, the imaging unit 30 images one end 221 of the cutting mark 220 from above, perpendicularly to the front surface 203 of the base substrate 202, which is in the remaining peripheral region 205 of the packaging substrate 200. Figure 18 In the above, when the center of the first tool 21-1 that forms the cutting mark 220 is set as A, the point that extends from the center A along the Z-axis and intersects with the front surface 203 of the packaging substrate 200 is set as B, and the end of the cutting mark 220 is set as C0, the length of the side BC0 of triangle ABC0 can be shown using the following formula 2.

[0107] Formula 2

[0108]

[0109] exist Figure 18 In the process, when the end of the segmented image 302 that leaves the cutting mark 220 at one end 221 is set as C1, and the depth of the radial cutting mark 220 of the first tool 21-1 at the end C1 of the segmented image 302 that leaves the cutting mark 220 at one end 221 is set as α1 (α is shown in Equation 3), the length of the side BC1 of triangle ABC1 can be shown using the following Equation 3.

[0110] 【Formula 3】

[0111]

[0112] Furthermore, in Figure 18 In this process, when the estimation unit 101 of the control unit 100 sets the length of the cutting mark 220 in the longitudinal direction of the segmented image 302 to L1 (as shown by L in Equation 1), Equation 1 can be obtained from Equations 2 and 3. The estimation unit 101 of the control unit 100 sets the value α1, which is the depth of the cutting mark 220, to 1 μm. Since the radius R of the first tool 21-1 and the cutting depth d of the cutting mark 220 are predetermined, the length L1 of the cutting mark 220 in the longitudinal direction of the segmented image 302 can be calculated.

[0113] Furthermore, by setting α2 to 1 μm and R to R-α1 in Equation 1, the estimation unit 101 of the control unit 100 can calculate the length L2 of the cutting mark 220 in the longitudinal direction of the segmented image 303, and by setting α3 to 1 μm and R to R-(α1+α2), the length L3 of the cutting mark 220 in the longitudinal direction of the segmented image 304 can be calculated. Similarly, the estimation unit 101 of the control unit 100 can calculate the length L3 of all segmented images 302, 303, and 304. The lengths L1, L2, and L3 are 30N. LN. Divide image 300 into images 302, 303, 304, ... The lengths L1, L2, and L3 are 30N. LN is reduced to the values ​​α1, α2, α3. αN, and thus according to each segmented image 302, 303, 304, The length of the 30N cutting mark 220 is defined as the length observed from the tangential direction 29 at the tip of the cutting edge of the first tool 21-1 in the segmented images 302, 303, and 304. The length of 30N is reduced.

[0114] The estimation unit 101 of the control unit 100 will reduce the segmented images 302, 303, 304, Combining 30N, the length of image 300 is reduced so that the length of the cutting mark 220 in image 300 is the length viewed from the tangential direction 29 of the cutting edge of the cutting tool 21 at one end 221 of the cutting mark 220. Therefore, the image 400, which approximates the outer peripheral shape of the cutting tool 21, and the imaging unit 30 (which is located at one end 221 of the cutting mark 220) are similar in length. Figure 18 The image obtained by photographing one end 221 of the cutting mark 220 (shown by the dashed line) is approximate.

[0115] In the front-end shape confirmation step 1005, the calculation unit 102 of the control unit 100 calculates the depth 215 of the notch 214 as the cutting depth 26-1 of the notch 214, based on the front-end shape of the cutting edge of the first tool 21-1 estimated by the estimation unit 101 and the cutting thickness 25-2 of the second tool 21-2. Specifically, the shape of the inner surface of the first cutting groove 216 is the same as the shape of the front end of the cutting edge of the first tool 21-1, and the shape of the inner surface of the second cutting groove 218 is the same as the shape of the front end of the cutting edge of the second tool 21-2. Therefore, for example, the calculation unit 102 of the control unit 100 calculates the intersection point 222 of the first cutting groove 216 and the second cutting groove 218 based on the shape of the front end of the cutting edge of the first tool 21-1 and the cutting edge thickness 25-2 of the second tool 21-2 estimated by the estimation unit 101, and calculates the cutting depth 26-1 of the first tool 21-1 when the intersection point 222 is located at a predetermined depth 219.

[0116] In the front-end shape confirmation step 1005, the calculation unit 102 of the control unit 100 stores the calculated cutting depth 26-1 as a new processing condition in the storage device. In the front-end shape confirmation step 1005, the cutting depth 26-1 calculated by the calculation unit 102 of the control unit 100 is greater than the depth 215 of the notch 214, i.e., the predetermined depth 219. In the front-end shape confirmation step 1005, when the calculation unit 102 of the control unit 100 stores the calculated cutting depth 26-1 as a new processing condition in the storage device, the process proceeds to step 1006.

[0117] The machining control unit 103 of the control unit 100 determines whether it is the prescribed time to perform straightening trimming on the tip of the cutting edge of the first tool 21-1 (step 1006). The machining control unit 103 of the control unit 100 determines whether the cutting depth 26-1 calculated by the calculation unit 102 in the tip shape confirmation step 1005 is greater than or equal to the thickness of the electrode 209. The value corresponding to the thickness of the electrode 209 refers to the value at which the metal forming the electrode 209 remains in the cutting residue portion 217 below the first cutting groove 216 formed by cutting the electrode 209. For example, it can be the thickness of the electrode 209, or it can be a value slightly smaller than the thickness of the electrode 209.

[0118] When the machining control unit 103 of the control unit 100 determines that the cutting depth 26-1 calculated by the calculation unit 102 in the front-end shape confirmation step 1005 is less than the value corresponding to the thickness of the electrode 209, it determines that it is not the prescribed time to perform straightening trimming on the front end of the cutting edge of the first tool 21-1 (step 1006: No), and returns to the half-cutting step 1002. When the machining control unit 103 of the control unit 100 determines that the cutting depth 26-1 calculated by the calculation unit 102 in the front-end shape confirmation step 1005 is greater than or equal to the value corresponding to the thickness of the electrode 209, it determines that it is the prescribed time to perform straightening trimming on the front end of the cutting edge of the first tool 21-1 (step 1006: Yes), and proceeds to the flattening step 1007.

[0119] (Planarization step)

[0120] The planarization step 1007 is a step of planarizing the shape of the tip of the cutting edge of the first tool 21-1 by correcting it at a predetermined time. In the embodiment, in the planarization step 1007, the cutting device 1 controls the moving unit 40, etc., through the machining control unit 103 of the control unit 100 to position the tip of the cutting edge of the rotating first tool 21-1 at a position parallel to the dressing plate 250 held by the sub-chuck worktable 15 in the Y-axis direction and at a position lower than the upper surface of the dressing plate 250.

[0121] In the embodiment, during the planarization step 1007, the cutting device 1 controls the moving unit 40, etc., via the machining control unit 103 of the control unit 100, causing the first cutting unit 20-1 to move along the Y-axis towards the dressing plate 250, so that the tip of the cutting edge of the rotating first tool 21-1 cuts into the upper surface of the dressing plate 250. In the embodiment, during the planarization step 1007, the cutting device 1 controls the moving unit 40, etc., via the machining control unit 103 of the control unit 100, and while causing the tip of the cutting edge of the rotating first tool 21-1 to cut into the upper surface of the dressing plate 250, moves the first cutting unit 20-1 along the Y-axis to perform a flattening dressing that flattens the tip of the cutting edge of the first tool 21-1 along the axial direction. In the implementation, in the flattening step 1007, the cutting device 1 controls the moving unit 40, etc., through the machining control unit 103 of the control unit 100, so that the first cutting unit 20-1 moves along the Y-axis direction a predetermined number of times to perform flattening on the first tool 21-1.

[0122] In one embodiment, during the planarization step 1007, when the cutting device 1 performs straightening on the first tool 21-1, it returns to the front-end shape confirmation step 1005. Alternatively, in one embodiment, the cutting device 1 returns to the front-end shape confirmation step 1005 after the planarization step 1007; however, in this invention, it may also return to the half-cutting step 1002 after the planarization step 1007.

[0123] In the semi-cutting step 1002, which returns from step 1004 or step 1006, the cutting device 1 controls each component through the processing control unit 103 of the control unit 100. While moving the worktable 10 and the first cutting tool 21-1 of the cutting unit 20-1 relative to each other along the X-axis and Y-axis directions, the cutting edge of the first cutting tool 21-1 cuts into the center of the width direction of a predetermined dividing line 206 at a cutting depth 26-1 calculated by the calculation unit 102 in the front end shape confirmation step 1005. In the semi-cutting step 1002, the cutting device 1 uses the first cutting tool 21-1 to cut the predetermined dividing line 206 of the packaging substrate 200, forming a first cutting groove 216 on the predetermined dividing line 206, and forming a cutting residue 217 below the first cutting groove 216. Thus, in the half-cutting step 1002, which returns from step 1004 or step 1006, the cutting device 1 uses the shape of the front end of the cutting edge of the first tool 21-1 confirmed in step 1005 based on the shape of the front end shape and the cutting thickness 25-2 of the second tool 21-2 to calculate the depth 215 of the notch 214 to a predetermined depth 219 and a cutting depth 26-1 to make the first tool 21-1 cut into the encapsulation substrate 200.

[0124] In the cutting device 1, when the processing control unit 103 of the control unit 100 determines that the packaging substrate 200 is divided into individual packaging chips 201 by forming the first cutting groove 216 on all the predetermined dividing lines 206 of the packaging substrate 200 using the half-cutting step 1002 and cutting the cutting residue 217 below the first cutting groove 216 using the full-cutting step 1003 (step 1004: yes), the processing operation ends, i.e., the processing method.

[0125] As described above, regarding the processing method and cutting apparatus 1 of the embodiment, in the front-end shape confirmation step 1005, the shape of the front end of the cutting edge of the first tool 21-1 is confirmed, and the cutting depth 26-1 of the first tool 21-1 is set such that the depth 215 of the notch 214 formed based on the shape of the front end of the cutting edge of the first tool 21-1 and the cutting thickness 25-2 of the second tool 21-2 is a predetermined depth 219. Therefore, the processing method and cutting apparatus 1 of the embodiment can suppress the error of the depth 215 of the notch 214 of the packaged chip 201 relative to the predetermined depth 219. As a result, the processing method and cutting apparatus 1 of the embodiment have the effect of suppressing the decrease in the reliability of the inspection of the packaged chip 201 and the poor connection.

[0126] Furthermore, the processing method and cutting apparatus 1 of the embodiment result in the first tool 21-1 being straightened during the flattening step 1007 at a predetermined time, thereby correcting the shape of the tip of the cutting edge of the first tool 21-1 to be flat, thus enabling the stable formation of a cut portion 214 with a predetermined depth 219. Normally, straightening the cutting edge of a cutting tool takes time (the reason for making the side of the cut portion perpendicular is not significant), reducing productivity. However, the processing method and cutting apparatus 1 of the embodiment change the cutting depth 26-1 according to the shape of the tip of the cutting edge of the first tool 21-1 to form a cut portion 214 with a predetermined depth 219, thus suppressing the implementation of straightening and preventing a decrease in productivity.

[0127] [Variation Example]

[0128] The processing method and cutting device 1 of a modified embodiment of the present invention will be described with reference to the accompanying drawings. Figure 20 This is a side view schematically showing, in a partial cross-section, the state in which the cutting edge of the first tool cuts into the remaining area of ​​the outer periphery of the substrate of the packaging substrate during the front-end shape confirmation step of the processing method in a modified embodiment. Figure 21 This is a top view of the remaining outer periphery of the base substrate of the packaging substrate with cutting marks formed during the front-end shape confirmation step of the processing method of a modified embodiment. Additionally, Figure 20 and Figure 21 In this document, parts that are the same as those in the implementation method are marked with the same reference numerals, and the description is omitted.

[0129] The processing method and the method by which the cutting device 1 forms the cutting mark 220-1 in the front-end shape confirmation step 1005 of the modified embodiment differ from those of the original embodiment, except that they are the same. In the front-end confirmation step of the modified processing method, as... Figure 20 As shown, the cutting device 1 is formed by so-called cleaving and transverse cutting in the following manner. Figure 21The cutting mark 220-1 shown: Similar to the half-cutting step 1002, the first tool 21-1 cuts into the predetermined dividing line 206 of the packaging substrate 200, and the first tool 21-1 rises within the remaining peripheral region 205. In the modified example, the cutting mark 220-1 formed extends along the X-axis direction from the outer edge of the base substrate 202 in the remaining peripheral region 205 of the packaging substrate 200, and the front end 221 is formed with the same shape as in the embodiment. In the front end confirmation step of the processing method in the modified example, the cutting device 1 uses the imaging unit 30 to photograph the area containing the front end 221 of the cutting mark 220-1, confirms the shape in the same way as in the embodiment, and calculates the cutting depth 26-1.

[0130] In the modified processing method and cutting device 1, the shape of the front end of the cutting edge of the first tool 21-1 is confirmed, and the cutting depth 26-1 of the first tool 21-1 is set in such a way that the depth 215 of the notch 214 becomes a predetermined depth 219. Therefore, similar to the embodiment, the following effect is achieved: the decrease in reliability of the inspection of the packaged chip 201 and the poor connection can be suppressed.

[0131] Furthermore, the present invention is not limited to the embodiments described above. That is, various modifications and implementations can be made without departing from the spirit of the present invention. In the present invention, the processing method and cutting device 1 can hold the silicon wafer or trimming plate 250, which is the object to be cut, on the sub-chuck worktable 15 in advance, and in the front end shape confirmation step 1005, the first tool 21-1 cuts into the silicon wafer or trimming plate 250 to form cutting marks 220, 220-1. In addition, in the present invention, the cutting depth 26-1 can be corrected not only during continuous processing, but also after trimming by changing the first tool 21-1 and before performing the half-cutting step 1002. In this case, the cutting depth 26-1 of the half-cutting step 1002 can be adjusted according to the shape of the front end of the cutting edge of the confirmed first tool 21-1.

Claims

1. A processing method comprising, after partially cutting a packaging substrate with multiple intersecting predetermined dividing lines using a first tool, fully cutting it using a second tool with a thinner blade than the first tool, thereby forming a chip with stepped notches on its side surface, wherein, The processing method has the following steps: In the half-cutting step, the first tool cuts into the packaging substrate, and the first tool cuts along the predetermined dividing line to form a first cutting groove, and a cutting residue is formed below the first cutting groove. In the full cutting step, after the half cutting step is performed, the remaining cutting portion is cut along the first cutting groove using the second tool, which is thinner than the first tool. as well as The front-end shape confirmation step involves confirming the front-end shape of the first tool. In this half-cutting step, based on the front-end shape of the first tool and the cutting thickness of the second tool as confirmed by the front-end shape confirmation step, the first tool cuts into the packaging substrate at a cutting depth that makes the depth of the cut portion a predetermined depth.

2. The processing method according to claim 1, wherein, In the front-end shape confirmation step, the first tool is used to form a cutting mark on the upper surface of the packaging substrate, and the front-end shape of the first tool is confirmed based on the cutting mark.

3. The processing method according to claim 1 or 2, wherein, The machining method also includes the following flattening step: the front end of the first tool is corrected and flattened at a specified time.

4. A cutting apparatus that, after partially cutting a packaging substrate with multiple intersecting predetermined dividing lines using a first tool, performs a full cut using a second tool with a blade thickness thinner than the first tool, thereby forming a chip with stepped notches on its side surface, wherein... The cutting device has the following features: A worktable that holds the packaged substrate; The first cutting unit has a first cutting tool that cuts the packaging substrate along the predetermined dividing line to form a first cutting groove and forms a cutting residue below the first cutting groove. The second cutting unit has a second tool that is thinner than the first tool and cuts the cutting residue along the first cutting groove; The imaging unit captures images of the cutting marks formed when the first tool cuts into the object being cut. as well as The control unit controls the worktable, the first cutting unit, the second cutting unit, and the imaging unit. The control unit includes: The estimation unit estimates the shape of the tip of the first tool based on the image captured by the imaging unit; and The calculation unit calculates the cutting depth of the first tool to make the depth of the notch a predetermined depth based on the tip shape of the first tool and the cutting thickness of the second tool as estimated by the estimation unit.

Images