A lidar sensor packaging structure and a packaging method

Abstract

The application discloses a kind of laser radar sensor packaging structure and packaging method, the packaging structure includes substrate, ASIC chip and MEMS chip are arranged on substrate, ASIC chip and MEMS chip are connected with substrate respectively, the upper surface of MEMS chip is provided with optical filter, substrate, ASIC chip, MEMS chip and optical filter are integrally plastic encapsulation, the upper surface of optical filter is not completely plastic encapsulation.In the application, laser radar sensor can be used as a single transmitter or receiver, it is more flexible and convenient to use;Using optical filter+Open molding packaging form, it can form the product that packaging size meets customer's requirements, and the packaging size is smaller, the integration is higher, the manufacturing process is simple, reasonable, the production efficiency is higher, it is more suitable for industrialization and popularization and use.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and specifically relates to a lidar sensor packaging structure and packaging method. Background Technology

[0002] LiDAR typically consists of a light source transmitter, a receiver, and a signal processing unit. Currently, a significant amount of research and development focuses on lidar transmitters, such as VCSEL packaging. The circuit structure includes a laser emitting chip and a driver chip, greatly advancing the research progress of Time-of-Flight (ToF) radar and enabling high-tech applications like autonomous driving to become mainstream in the future. However, the high integration of VCSELs leads to complex manufacturing processes, which is detrimental to production. Summary of the Invention

[0003] To address the technical problems existing in the prior art, the present invention aims to provide a lidar sensor packaging structure and packaging method.

[0004] To achieve the above objectives and technical effects, the technical solution adopted by this invention is as follows:

[0005] A lidar sensor packaging structure includes a substrate, on which an ASIC chip and a MEMS chip are disposed. The ASIC chip and the MEMS chip are respectively connected to the substrate. A filter is disposed on the upper surface of the MEMS chip. The substrate, the ASIC chip, the MEMS chip and the filter are integrally encapsulated, except that the upper surface of the filter is not completely encapsulated.

[0006] Furthermore, the ASIC chip and MEMS chip are spaced apart, and the ASIC chip and MEMS chip are respectively connected to the substrate via bonding wires.

[0007] Furthermore, an ASIC chip is attached to the substrate using adhesive I.

[0008] Furthermore, a MEMS chip is attached to the substrate using adhesive II.

[0009] Furthermore, the upper and lower surfaces of the filter are respectively provided with filter coating b and filter coating a, and the filter coating b is not completely encapsulated.

[0010] Furthermore, the upper surface of the filter coating layer b is screen-printed to form a filter screen print.

[0011] Furthermore, the bottom of the substrate 1 has several pins pre-installed.

[0012] This invention discloses a lidar sensor packaging method, comprising the following steps:

[0013] Step 1: Use die bonding adhesive I to attach the ASIC chip to the substrate using a die bonding device;

[0014] Step 2: Use adhesive II to attach the MEMS chip to the substrate using a chip mounting device;

[0015] Step 3: Connect the ASIC chip, MEMS chip and substrate by gold wire bonding;

[0016] Step 5: Use adhesive tape III to attach the filter to the MEMS chip;

[0017] Step 6: The substrate, adhesive I, ASIC chip, adhesive II, MEMS chip, adhesive III, filter, and filter coating a are encapsulated using open molding, exposing the filter coating b. The upper surface of the filter coating b is then screen-printed to form the filter screen print.

[0018] Step 7: Apply the seal mark;

[0019] Step 8: Cut into individual finished products.

[0020] Furthermore, the upper and lower surfaces of the filter are respectively provided with filter coating b and filter coating a, and the filter coating b is not completely encapsulated.

[0021] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0022] This invention discloses a lidar sensor packaging structure and method. The packaging structure includes a substrate, on which an ASIC chip and a MEMS chip are disposed. The ASIC chip and MEMS chip are respectively connected to the substrate. A filter is disposed on the upper surface of the MEMS chip. The substrate, ASIC chip, MEMS chip, and filter are integrally encapsulated, except that the upper surface of the filter is not completely encapsulated. In this invention, the lidar sensor can be used as a standalone transmitter or receiver, making it more flexible and convenient to use. Using a filter + open molding packaging method, products with package sizes that meet customer requirements can be formed, with smaller package sizes, higher integration, simpler and more reasonable manufacturing processes, higher production efficiency, and greater suitability for industrial-scale promotion and use. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the structure of the present invention. Detailed Implementation

[0024] The present invention will now be described in detail so that its advantages and features can be more easily understood by those skilled in the art, thereby providing a clearer and more explicit definition of the scope of protection of the present invention.

[0025] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form to prepare for the more detailed descriptions that follow.

[0026] like Figure 1 As shown, a lidar sensor packaging structure includes a substrate 1. An ASIC chip 3 is attached to the substrate 1 using adhesive I2, and a MEMS chip 5 is attached to the substrate 1 using adhesive II4. The ASIC chip 3 and the MEMS chip 5 are connected to the substrate 1 via bonding wires 6. A filter coating a9 is attached to the upper surface of the MEMS chip 5 using adhesive III7. A filter 8 is disposed on the upper surface of the filter coating a9, and a filter coating b10 is disposed on the upper surface of the filter 8. The substrate 1, adhesive I2, ASIC chip 3, adhesive II4, MEMS chip 5, bonding wires 6, adhesive III7, filter 8, and filter coating a9 are integrally encapsulated in plastic, with the filter coating b10 exposed. A screen printing 11 is formed on the upper surface of the filter coating b10 to prevent plastic encapsulation overflow. Pins 12 are reserved at the bottom of the substrate 1.

[0027] A method for packaging a lidar sensor includes the following steps:

[0028] Step 1: Use adhesive I2 to attach the ASIC chip 3 to the substrate 1 using a chip mounting device.

[0029] Step 2: Use adhesive II 4 to attach the MEMS chip 5 to the substrate 1 using a chip mounting device.

[0030] Step 3: Connect the ASIC chip 3 and MEMS chip 5 to the substrate 1 using gold wire bonding.

[0031] Step 5: Use adhesive Ⅲ7 to attach the filter 8 to the MEMS chip 5 using the bonding equipment. Adhesive Ⅲ7 can wrap the bonding wires. Filter coating a9 and filter coating b10 are respectively set on the two opposite sides of the filter 8.

[0032] Step 6: Use open molding to seal the filter, exposing the filter coating b10. Silk screen printing is applied to the upper surface of the filter coating b10 to prevent overflow during sealing.

[0033] Step 7: Stamp the mark.

[0034] Step 8: Cut into individual finished products.

[0035] Any parts or structures not specifically described in this invention can be made using existing technologies or products, and will not be elaborated upon here.

[0036] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A lidar sensor packaging structure, characterized in that, The device includes a substrate on which an ASIC chip and a MEMS chip are disposed. The ASIC chip and the MEMS chip are spaced apart and connected to the substrate by bonding wires. A filter is disposed on the upper surface of the MEMS chip. The substrate, the ASIC chip, the MEMS chip and the filter are integrally encapsulated, but the upper surface of the filter is not completely encapsulated. The filter is attached to the MEMS chip using adhesive III; the upper and lower surfaces of the filter are respectively provided with filter coating b and filter coating a, and the filter coating b is not completely encapsulated. The upper surface of the filter coating layer b is screen-printed to form a filter screen print.

2. The lidar sensor packaging structure according to claim 1, characterized in that, An ASIC chip is attached to the substrate using adhesive I.

3. The lidar sensor packaging structure according to claim 1, characterized in that, The MEMS chip is attached to the substrate using adhesive II.

4. The lidar sensor packaging structure according to claim 1, characterized in that, The bottom of the substrate has several pins pre-installed.

5. A method for packaging a lidar sensor, characterized in that, Includes the following steps: Step 1: Use die bonding adhesive I to attach the ASIC chip to the substrate using a die bonding device; Step 2: Use adhesive II to attach the MEMS chip to the substrate using a chip mounting device; Step 3: Connect the ASIC chip and MEMS chip to the substrate by gold wire bonding, with the ASIC chip and MEMS chip spaced apart; Step 5: Use adhesive tape III to attach the filter to the MEMS chip; Step 6: The substrate, adhesive I, ASIC chip, adhesive II, MEMS chip, adhesive III, filter, and filter coating a are encapsulated using open molding, exposing the filter coating b. The upper surface of the filter coating b is then screen-printed to form the filter screen print. Step 7: Apply the seal mark; Step 8: Cut into individual finished products; The filter has a filter coating b and a on its upper and lower surfaces, respectively, and the filter coating b is not completely encapsulated.

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