An array image detection device

Abstract

The present application provides an array-type image detection device, including two columns of imaging arrays arranged at intervals along a first direction, each column of the imaging array includes a plurality of imaging modules arranged at intervals along a second direction, each imaging module includes a magnifying lens and an imaging chip arranged in sequence along its optical axis; each imaging module magnifies the image to be detected located in its detection area and images it in its imaging area and is acquired by the imaging chip located in its imaging area; and except for the detection areas located at the head and tail sides of the second direction, each detection area has overlapping parts with other detection areas at both ends along the second direction. The array-type image detection device provided by the present application can effectively solve the problems of low resolution of existing contact image sensors, difficulty in detecting high-resolution images, and detection blind spots when performing magnified detection, and can obtain a clear magnified image of the image to be detected within the full-frame range.

Description

Technical Field

[0001] The present application belongs to the field of optical imaging technology, and specifically, relates to an array-type image detection device. Background Art

[0002] Image detection technology involves multiple technical fields such as optical imaging, photoelectric conversion, and signal processing. It can be widely used in industrial production and manufacturing processes to detect product quality by acquiring detailed features such as the structure and texture of the product surface and / or internal structure. Obviously, since the products to be inspected and the image features to be identified differ in size by multiple orders of magnitude, it is necessary to determine image detection solutions with different detection accuracy / resolution for different products to be inspected and detection scenarios. In particular, when it is necessary to detect micron-level image features, defects, and flaws on the surface of a product, it is even more necessary to design a special image detection solution.

[0003] In the manufacturing process of lithium batteries, the detection of micron-level burrs between the positive and negative electrodes and the diaphragm is a typical image detection scenario that requires obtaining micron-level features of the product. With the expansion of my country's new energy vehicle market, the demand for power lithium batteries is increasing significantly. At the same time, the rapid development of industries such as mobile phones, electric vehicles, power tools, and digital cameras has also led to a growing demand for lithium batteries. The rapid development of the lithium battery industry has become a new investment focus in the manufacturing field. However, at the same time, various news about lithium battery fires and explosions have been reported from time to time in the media, making consumers hesitant when choosing. Through research, it is found that the micron-level burrs between the positive and negative electrodes and the diaphragm of lithium batteries, which can only be seen clearly under a microscope, are one of the main culprits of lithium battery explosions and fires. Since it is difficult to avoid burrs in the above-mentioned parts whether it is hardware die cutting or laser cutting, the comprehensive and accurate detection of the above-mentioned micron-level burrs has become a key measure to ensure the safety of lithium battery products.

[0004] It is often difficult to achieve ideal results by using existing image detection methods to perform full-frame real-time high-resolution detection of the above-mentioned micron-level image features. For example, when using CCD or COMS cameras for image acquisition, due to the large size of the equipment and the long scanning distance, it is often not suitable for installation and operation in the actual production line environment; and when using conventional contact image sensors, due to their low imaging resolution, there is a problem that high-resolution image detection cannot be accurately achieved. Therefore, there is an urgent need for a device that can effectively amplify the image of the product to be inspected to achieve accurate acquisition of high-resolution image features using low-resolution chips, and can ensure close-range and full-frame image detection to meet the needs of synchronous and comprehensive detection during the production process. Summary of the invention

[0005] In order to solve the above problems existing in the prior art, the purpose of the present application is to provide an array image detection device that realizes high-resolution, close-range and full-format image detection using a low-resolution imaging chip.

[0006] The embodiments of the present application can be implemented through the following technical solutions:

[0007] An array-type image detection device comprises two columns of imaging arrays arranged at intervals along a first direction, wherein each column of the imaging array comprises a plurality of imaging modules arranged at intervals along a second direction, and each imaging module comprises a magnifying lens and an imaging chip arranged in sequence along its optical axis; each imaging module magnifies an image to be detected within its detection area and images it within its imaging area and the image is acquired by the imaging chip within its imaging area; and except for the detection areas located at the head and tail sides of the second direction, both ends of each detection area along the second direction have overlapping parts with other detection areas.

[0008] Furthermore, the magnifying lens is a meniscus lens, whose light incident surface is concave and the light emitting surface is convex; the radius of the light incident surface is less than or equal to 15 mm, the radius of the light emitting surface is less than or equal to 8 mm, and the distance between the intersection of the light incident surface, the light emitting surface and their optical axis is less than or equal to 3 mm.

[0009] Preferably, the magnifying lens is also cut with its optical axis as the axis center, and its projection on a plane perpendicular to the optical axis is a rectangle, the length of the rectangle ranges from 9 to 11 mm, and the width ranges from 2 to 6 mm.

[0010] Preferably, the distance from the detection area to the imaging area of ​​each imaging module is less than or equal to 90 mm and the image magnification is 1 to 6 times.

[0011] Furthermore, in the two columns of imaging arrays, each imaging module of one column of the imaging array has a first optical axis in the same direction, and each imaging module of the other column of the imaging array has a second optical axis in the same direction, and the first optical axis and the second optical axis are both perpendicular to the second direction.

[0012] Preferably, the angle formed by the first optical axis and the second optical axis is in the range of 8° to 12°, and the bisector of the angle extends along a third direction, and the third direction is perpendicular to the first direction and the second direction.

[0013] Preferably, the detection areas of the respective imaging modules are at the same height in the third direction.

[0014] Furthermore, each imaging module also includes an aperture stop located on its optical axis, and the aperture stop is located between the detection area and the magnifying lens of the imaging module.

[0015] Preferably, the distance from the aperture stop of each imaging module to the detection area is less than or equal to 25 mm.

[0016] Preferably, the imaging surface of each imaging chip is perpendicular to the optical axis of the imaging module in which it is located.

[0017] Preferably, the array image detection device further comprises a hollow outer frame for fixedly accommodating each imaging module.

[0018] Preferably, the array-type image detection device further comprises a light-proof baffle, wherein the baffle is located between the two columns of imaging arrays.

[0019] Preferably, the array-type image detection device further comprises a light source module for generating light directed toward the detection area.

[0020] Preferably, the array image detection device further includes:

[0021] A data conversion module is used to convert the analog signals acquired by each imaging chip into digital signals; and a data processing module is used to process the digital signals and generate a digitized amplified image of the image to be detected.

[0022] An array-type image detection device provided in an embodiment of the present application achieves miniaturization of the device while meeting the requirements of close-range magnified imaging through the magnifying lenses provided in each imaging module and the design of the structural parameters of the magnifying lenses, thereby solving the problem of excessive installation space for the device and realizing the need to use a low-resolution imaging chip to scan a high-resolution object surface at close range.

[0023] At the same time, two columns of imaging arrays are arranged in a staggered manner so that each detection area overlaps with each other along the scanning direction. In addition, the optical axes of the two columns of imaging arrays are preferably at a certain angle, which effectively solves the problem of blind spots in the detection of a single column of imaging arrays during magnification detection, and can ensure that the full-frame scanning information of the relevant image to be detected can be read within a certain error range. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the structure of a lithium battery membrane;

[0025] Figure 2 It is a schematic diagram of the layout of an existing array image detection device integrated in a production line environment;

[0026] Figure 3 is a side cross-sectional view of an array image detection device along a first direction according to an embodiment of the present application;

[0027] Figure 4is a side cross-sectional view of a row of imaging arrays of an array-type image detection device according to an embodiment of the present application along a second direction;

[0028] Figure 5a is a three-dimensional schematic diagram of a magnifying lens of an array-type image detection device according to an embodiment of the present application;

[0029] Figure 5b for Figure 5a a side cross-sectional view of the magnifying lens shown;

[0030] Figure 5c for Figure 5a A top view of the magnifying lens shown;

[0031] Figure 6 is a light path diagram of a magnifying lens of an array-type image detection device according to an embodiment of the present application;

[0032] Figure 7 is a top view of a plurality of first imaging regions and a second imaging region of an array-type image detection device according to an embodiment of the present application;

[0033] Figure 8 For Figure 7 A top view of the corresponding plurality of first detection areas and second detection areas;

[0034] Fig. 9 It is a side cross-sectional view along a first direction of an array image detection device according to another embodiment of the present application.

[0035] Numbers in the figure

[0036] 1: first imaging array, 10: first imaging module, 11: first magnifying lens, 11A, light incident surface, 11B, light exit surface, 12: first imaging chip, 121: first photoelectric conversion chip, 122: first chip substrate, 13: first aperture stop, 14: first optical axis, 15: first imaging area, 16: first detection area, 2: second imaging array, 20: second imaging module, 21: second magnifying lens, 22: second imaging chip, 221: second photoelectric conversion chip, 222: second chip substrate, 23: second aperture stop, 24: second optical axis, 25: second imaging area Domain, 26: second detection area, 31: outer frame, 32: second outer frame, 33: heat sink, 34: baffle, 4: light source module, 41: diffuser film, 42: light source substrate, 43: light source chip, 51: relay substrate, 52: data processing substrate, 600: socket, 601: socket, 602: data processing chip, 603: socket, 604: serial port circuit, 605: socket, 700: core material, 701: coating, 702: coating, 703: burr, 800: CIS sensor, 810: photoelectric conversion chip substrate, 811: photosensitive element, 900: object to be detected. DETAILED DESCRIPTION

[0037] Hereinafter, the present application will be further described based on preferred embodiments with reference to the accompanying drawings.

[0038] In addition, various components in the drawings are enlarged or reduced in size for ease of understanding, but this practice is not intended to limit the scope of protection of the present application.

[0039] Words importing the singular also include the plural and vice versa.

[0040] In the description of the embodiments of the present application, it should be noted that if the terms "upper", "lower", "inside", "outside", etc. indicate an orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the products of the embodiments of the present application are usually placed when in use, it is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, in the description of the present application, in order to distinguish different units, the words first, second, etc. are used in this specification, but these are not limited by the order of manufacture, nor can they be understood as indicating or implying relative importance, and their names may be different in the detailed description and claims of the present application.

[0041] The vocabulary in this specification is used to illustrate the embodiments of the present application, but is not intended to limit the present application. It should also be noted that, unless otherwise clearly specified and limited, the terms "disposed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, an indirect connection through an intermediate medium, or a connection between the two elements. For those skilled in the art, the specific meanings of the above terms in this application can be specifically understood.

[0042] In order to more clearly explain the technical solution of the present application, the technical difficulties faced in real-time detection of micron-level image features in the current production and manufacturing process are first described in detail.

[0043] Figure 1 A schematic diagram of a battery membrane structure of a lithium battery is shown, such as Figure 1 As shown, the battery membrane includes a core material 700 made of copper or aluminum and coatings 701 and 702 applied on both sides thereof. Generally, the thickness of the core material 700 and the coatings 701 and 702 is about tens of um. During the manufacturing and cutting process of the battery membrane, various burrs 703 often appear on the surface of the core material and the coating. These burrs 703 cause slight flaws on the surface of the battery membrane and greatly increase the probability of leakage, explosion and other dangers of the lithium battery. Therefore, in the production process of the battery membrane, it is an essential process to detect the burrs 703 thereon.

[0044] By using a microscope and other equipment to perform statistical analysis on the size of the burr 703, it can be determined that its size is generally around 20um, and burrs 703 may appear at various positions on the battery membrane. This determines the need to achieve real-time detection of micron-level image features within a range equivalent to the entire battery membrane format without affecting the normal operation of the production line.

[0045] An optional image detection solution is to use a linear scan camera (such as a CCD or COMS camera) to continuously scan and detect the product. However, although linear scan cameras can achieve high-resolution dynamic scanning, they are generally large in size and have a long scanning distance. They are often limited by the equipment space and cannot be installed. At the same time, a scanning distance that is too long will lead to a sharp increase in the cost of hardware equipment that meets the performance indicators required to detect the above-mentioned micron-level burrs.

[0046] Another option is to use CIS (Contact Image Sensor) or CIS array to perform close-range dynamic scanning of the battery membrane. CIS is a common sensor used for image acquisition / collection. It can convert the image's optical signal into an electrical signal through multiple photosensitive elements arranged in an array and the corresponding photoelectric conversion chip. Due to its small size and high integration, it is particularly suitable for collecting and acquiring product images in various production line environments.

[0047] Figure 2 The figure shows a layout of an image detection device integrated in a production line environment and an image detection scheme, such as Figure 2 As shown, the surface of the object to be detected 900 has a certain width along the Y direction (usually referred to as the scanning direction), and under normal operation of the production line, it moves continuously along the X direction (usually referred to as the scanning sub-direction). The image detection device includes a plurality of CIS sensors 800 spaced apart along the Y direction (usually the number of CIS sensors 800 needs to be determined according to the format of the object to be detected 900 to form coverage of the entire format), wherein each CIS sensor 800 includes a photoelectric conversion chip composed of an array of linearly spaced photosensitive elements 811, which is used to convert the light emitted from the surface of the object to be detected 900 into an analog signal (electrical signal). Obviously, the number of photosensitive elements 811 contained in a unit length is the resolution of the CIS sensor (in DPI). The above-mentioned photoelectric conversion chip is generally mounted on a photoelectric conversion chip substrate 810. In addition, the CIS sensor generally also includes an interface circuit for serially outputting the analog signal after photoelectric conversion.

[0048] After completing the above arrangement, different areas passing through the above image detection device can be continuously and fully scanned at certain time intervals during the continuous movement of the object 900 to be detected. Each scan can obtain a column of image signals after photoelectric conversion through each photosensitive element 811. Multiple columns of image signals obtained by multiple scans are spliced ​​to obtain a two-dimensional detection image of the object 900 to be detected.

[0049] The above image detection device can perform image detection on objects of conventional size to be detected, but it is difficult to directly apply it to the detection of micron-level burr images of battery membranes. The reason is that the imaging resolution of conventional contact image sensors is low. Taking a CIS sensor with a resolution of 1200DPI as an example, its pixel size is 25.4mm / 1200≈21um, that is, the minimum resolution of its imaging surface is 21um. Obviously, for burrs of about 20um, it is impossible to clearly image and identify them using the contact image sensor of the above specifications alone, and its structure needs to be improved to meet the requirements of high-resolution image recognition.

[0050] However, simply using a single magnifying lens cannot simultaneously meet the requirements of clear imaging covering the entire detection format and close-range contact detection. Therefore, it is necessary to combine the actual production line environment and the characteristics of the selected image sensor to reasonably design the optical path of the image magnification part and its coordination with the imaging part, so as to achieve close-range, full-format detection of micron-level image features.

[0051] To achieve the above-mentioned purpose, the present application provides an array-type image detection device through an embodiment, comprising two columns of imaging arrays arranged at intervals along a first direction, each column of the imaging array comprising a plurality of imaging modules arranged at intervals along a second direction, each imaging module comprising a magnifying lens and an imaging chip arranged in sequence along its optical axis; each imaging module magnifies the image to be detected within its detection area and images it within its imaging area and the image is acquired by the imaging chip within its imaging area; and except for the detection areas located at the head and tail sides of the second direction, each detection area has overlapping parts with other detection areas at both ends along the second direction.

[0052] The array-type image detection device provided by the embodiment of the present application is provided with two columns of imaging arrays arranged at predetermined intervals in the first direction, wherein each column of the imaging array includes a plurality of modules for magnified imaging arranged at intervals along the second direction, and each detection area of ​​the above two columns of the imaging array is arranged to overlap each other along the second direction. The arrangement of the above two columns of imaging arrays arranged at intervals and staggered can enable the multiple detection areas to form a full-width coverage of the second direction, thereby ensuring that the images within the coverage range of the above multiple detection areas can be clearly magnified without omission.

[0053] The array image detection device provided by the present application is described in detail below through specific embodiments.

[0054] [Example 1]

[0055] Figure 3 FIG. 4 shows a side cross-sectional view of an array image detection device along the X-axis direction according to a preferred embodiment 1 of the present application, as shown in FIG. Figure 3 As shown, the array image detection device includes a first direction (in Figure 3 The first imaging array 1 and the second imaging array 2 are arranged at a predetermined interval (represented by the X-axis).

[0056] Figure 4 It further shows that the first imaging array 1 is along the second direction ( Figure 4 The Y axis is represented by the Y axis, the Y axis is in a different direction from the X axis, and preferably, the Y axis is perpendicular to the X axis). Figure 3 , 4As shown, the first imaging array 1 includes a plurality of first imaging modules 10 arranged at intervals of length H along the Y-axis direction. The Y-axis direction is generally referred to as the scanning direction. Obviously, the number of first imaging modules 10 can be determined based on the length that each imaging module 10 can effectively detect along the scanning direction and the length that needs to be detected in the scanning direction, so as to ensure coverage of the overall detection format. It should be noted that the interval H between the first imaging modules 10 in the figure is only a schematic preferred arrangement, but does not constitute a limitation to the present application.

[0057] Furthermore, the array image detection device also includes a hollow outer frame 31 for fixedly accommodating the above-mentioned imaging modules. The outer frame 31 can be made of metal aluminum material to further increase the stability of the structure. The above-mentioned imaging modules are fixed inside the outer frame 31 according to their respective optical path parameters by bonding, plugging, etc., and the inner wall of the outer frame 31 is coated with a black oxide coating, which can effectively eliminate the influence of stray light on image detection.

[0058] In this embodiment, preferably, Figure 3 As shown, the array image detection device also includes a light source module 4, the light emitted by which is directed to the area to be detected, so as to increase the light emitted by the surface of the object in the area to be detected, thereby facilitating subsequent image detection. The light source module 4 is a linear light source, and its effective light emitting area extends along the Y-axis direction and covers the entire format to be detected. Among them, the light source substrate 42 is equipped with a light source chip 43.

[0059] Preferably, if Figure 3 As shown, the light source substrate 42 is made of aluminum to increase the heat dissipation effect, and a diffuser film 41 is also provided to achieve the effect of uniform light. In order to further increase the lighting effect, the number of light source modules 4 can also be two or more, and the two-side light source lighting method is adopted.

[0060] In this embodiment, preferably, the array image detection device further includes a data conversion module to convert the analog signal acquired by the imaging chip in each imaging module into a digital signal. Figure 3 As shown, the data conversion module includes a relay substrate 51 and a circuit for data transmission and conversion mounted thereon (not shown in the figure). The data transmission between the relay substrate 51 and each imaging chip is realized through a corresponding signal interface, that is, the pads of the relay substrate 51 and the back pads of the imaging chip are welded together through pin insertion or reflow soldering, thereby realizing data transmission.

[0061] In this embodiment, preferably, the array image detection device further includes a data processing module, specifically, as follows: Figure 3As shown, the data processing module includes a data processing substrate 52, on which a data processing chip 602 and a serial port circuit 604 are mounted. The data processing chip 602 has an image preprocessing function, processes the digital signal received from the data conversion module to synthesize a detection image, and sends it to the external display module PC terminal through the serial port circuit 604 to complete the display of the entire image. Those skilled in the art can select a suitable data chip and serial port circuit substrate according to specific needs, such as selecting an FPGA chip and a CAMRALINK serial port circuit substrate, or other optional data chips and serial port circuits.

[0062] In addition, the data processing chip 602 also controls the timing cycle by setting the internal register to realize the control of the light source module 4, so as to achieve the purpose of synchronizing the light emission frequency of the light source module 4 and the scanning frame rate of each imaging module within the scanning cycle.

[0063] Preferably, if Figure 3 As shown, the array image detection device further includes a second outer frame 32, the data conversion module is fixedly accommodated inside the outer frame 31, the data processing module is fixedly accommodated inside the second outer frame 32, and the second outer frame 32 is fixedly connected to the outer frame 31 by plugging, bonding, integral molding or any other suitable method. The digital signal output by the data conversion module is connected through the socket 601 and the socket 603 of the data processing module to realize signal conversion and transmission.

[0064] Preferably, a heat sink 33 is further provided on the side of the second outer frame 32 facing away from the outer frame 31 . The heat sink 33 is preferably made of metal or other materials with excellent heat dissipation performance to dissipate heat generated by the data processing chip 602 during operation.

[0065] The overall structure of the array-type image detection device of this embodiment is introduced above. Next, the working principle of the array-type image detection device is described in detail.

[0066] Still taking the first imaging array 1 as an example, Figure 3 , Figure 4 As shown, each first imaging module 10 in the first imaging array 1 includes a first magnifying lens 11 and a first imaging chip 12 which are sequentially arranged along its optical axis (represented by the first optical axis 14 ).

[0067] Furthermore, due to the magnifying effect of the first magnifying lens 11, each first imaging module 10 has a first detection area 16 and a first imaging area 15 on both sides of the first magnifying lens 11, wherein the image to be detected located in the first detection area 16 can be magnified and imaged in the first imaging area 15 and acquired by the first imaging chip 12 located in the first imaging area 15.

[0068] Figure 5a to Figure 5c 1 and 2 respectively show a perspective view, a side cross-sectional view and a top view of the first magnifying lens 11 included in the first imaging module 10 in some preferred embodiments. Figure 5a As shown, preferably, the first magnifying lens 11 is made of a meniscus lens, wherein the light incident surface 11A facing the object side is a concave surface, which has a certain convergence effect on the light, and the light exiting surface 11B facing the image side is a convex surface, which has a certain divergence effect on the light.

[0069] Those skilled in the art already know that the object distance, image distance and magnification of the lens can be determined by designing the radius of the light incident surface, the light exit surface and the distance between the light incident surface and the light exit surface. Figure 5b As shown, the radius R11A of the light incident surface 11A is ≤15mm, the radius R11B of the light emitting surface 11B is ≤8mm, and the distance H11 between the intersection of the light incident surface 11A, the light emitting surface 11B and the first optical axis 14 is ≤3mm. By setting the above preferred structural parameters, the image to be detected can be magnified by 1 to 6 times under the condition that the distance between the first detection area 16 and the first imaging area 15 is less than or equal to 90mm, thereby achieving magnified detection of the image to be detected on the basis of miniaturization of the equipment.

[0070] In this embodiment, preferably, the first magnifying lens 11 is made of glass or other materials with good optical properties and high processing performance. Furthermore, the lens adopts coating and other processes to reduce the reflected light on the lens surface and increase the light transmittance. In addition, in order to facilitate the installation of the lens and realize the miniaturization of the device, Figure 5a and Figure 5c As shown, the lens can be cut into long strips with its optical axis as the center. Preferably, the length of the first magnifying lens 11 after cutting along the Y-axis direction is 9-11 mm, and the width along the X-axis direction is 2-6 mm.

[0071] In this embodiment, optionally, the first imaging chip 12 included in the first imaging module 10 is the linear CIS sensor described above, specifically, including a first chip substrate 122, on which a first photoelectric conversion chip 121 is mounted, and corresponding connecting wires and interface circuits (not shown in the figure). In addition, in some other embodiments, other sensors with image scanning functions can also be selected according to actual image detection needs.

[0072] In this embodiment, if Figure 3As shown, the first imaging module 10 preferably also includes a first aperture stop 13 arranged along the first optical axis 14, and the first magnifying lens 11 is located between the first aperture stop 13 and the first imaging chip 12. The first aperture stop 13 can be used to block the light rays that are relatively deviated from the first optical axis 14 in the light beam, which has a direct impact on the clarity, correctness, brightness and depth of field of the imaging. The first aperture stop 13 is a circular hole structure with an aperture of 1.4 mm to 1.6 mm, and can be made by digging a hole in the middle of the light-shielding paper, or can be directly processed by digging a hole at the intersection of the outer frame 31 and the first optical axis 14.

[0073] Preferably, the working distance from the first aperture diaphragm 13 to the first detection area 15 is ≤25 mm, which can achieve a close-range scanning imaging effect, is conducive to the miniaturization of the equipment, and solves the problem of equipment installation space.

[0074] Figure 6 The half-field optical path diagram of the first imaging module 10 is further shown. Figure 6 As shown, based on the specific requirements of close-range magnified imaging, by designing the size parameters of the first magnifying lens 11, including the radius of the light entrance surface and the light exit surface and the distance between the light entrance surface / light exit surface and the intersection of the first optical axis, the magnification of the first magnifying lens 11 and the object distance and image distance of clear imaging can be determined, and at the same time, the first aperture diaphragm 13 and the outer frame are used to limit the light deviating from the first optical axis 14, so that a first detection area 16 and a first imaging area 15 capable of magnifying and imaging the image to be detected located in the first detection area 16 are formed on both sides of the first optical axis 14, wherein the lengths of the first imaging area 15 and the first detection area 16 along the Y-axis direction are L' and L respectively, and L' / L is the magnification of the first magnifying lens 11.

[0075] It should be noted that if Figure 6 As shown, the amplified image to be detected is an inverted real image, and in the subsequent image processing process, a signal inversion operation and the like are required.

[0076] In the actual image detection process, the object to be detected 900 (such as the battery membrane described above) is placed in the first detection area 16, and the first imaging chip 12 is placed in the first imaging area 15. Generally, since the first imaging module 10 realizes image acquisition through the first imaging chip 12, the effective scanning length of the first imaging chip 12 can be considered to be equal to L'. At this time, the image of the surface of the object to be detected (the image to be detected) can be magnified and clearly imaged in the first imaging area 15 and acquired by the first imaging chip 12.

[0077] Table 1 below schematically shows a set of preferred design parameters of the first imaging module 10. Obviously, those skilled in the art can also determine corresponding design parameters according to actual image detection indicators.

[0078] Table 1 Preferred design parameters of the first imaging module

[0079]

[0080]

[0081] The structure of the first imaging module 10 and the principle of magnified imaging are described in detail above. Furthermore, a plurality of first imaging modules 10 are arranged at intervals along the Y-axis direction at a spacing H, so as to form a first imaging array 1.

[0082] The first imaging array 1 uses a plurality of magnifying lenses arranged at intervals and imaging chips corresponding to the magnifying lenses. Under the premise of ensuring a specific magnification factor and scanning a wide format, the distance between the object and the image can be effectively shortened to achieve close-range scanning and miniaturization of the device, thereby effectively solving the problem that when using a single magnifying lens, in order to meet the coverage of a larger image detection area and avoid imaging distortion, the distance between the object and the image must be increased, which greatly increases the size of the device. However, when using a single imaging array, there is still the problem of missing detection of a specific area in the entire detection format. The reason can be explained by Figure 4 Provide explanation.

[0083] like Figure 4 As shown, in the multiple first imaging modules 10 of the first imaging array 1, since each first imaging area 15 magnifies the first detection area 16 along the Y direction, even if the first imaging chips 12 are connected to each other as closely as possible so that the first imaging areas 15 are connected end to end, there are still multiple detection blind areas in the corresponding first detection areas 16 along the Y direction, wherein the length of each detection blind area is HL. The existence of the above-mentioned detection blind areas is determined by the characteristics of the multiple amplifying optical path structures arranged at intervals, and leads to the phenomenon of missed detection of the surface of the object to be detected. Therefore, it is necessary to further improve the single-column amplified imaging method.

[0084] For this reason, Figure 3As shown, in this embodiment, in addition to the first imaging array 1, a second imaging array 2 is also provided which is spaced apart from the first imaging array 1 along the X-axis direction. Specifically, the second imaging array 2 includes a plurality of second imaging modules 20 spaced apart along the Y-axis direction, wherein each second imaging module 20 includes a second magnifying lens 21 and a second imaging chip 22 sequentially arranged along its optical axis (represented by the second optical axis 24). Accordingly, a second detection area 26 and a second imaging area 25 for magnified imaging are formed on both sides of the second optical axis 24, respectively, and the second imaging chip 22 is placed in the second imaging area 25.

[0085] Similar to the first imaging module 10 , the second imaging module 20 may also include a second aperture stop 23 , and the second imaging chip 22 includes a second chip substrate 222 and a second photoelectric conversion chip 221 mounted thereon.

[0086] In some preferred embodiments, the structural parameters of each first imaging module 10 included in the first imaging array 1 and each second imaging module 20 included in the second imaging array 2 are the same, that is, the same imaging modules can be used, and the spacing of each second imaging module 20 along the Y-axis direction is the same as the spacing of each first imaging module 10 along the Y-axis direction (both are represented by H). Therefore, Figure 4 It can also be used to explain the structure of the second imaging array 2, which will not be described here for the sake of brevity.

[0087] In this embodiment, preferably, Figure 3 As shown, each of the first detection areas 16 and the second detection areas 26 is at the same height in the Z-axis direction, wherein the Z-axis is perpendicular to the X-axis and the Y-axis.

[0088] Figure 7 FIG. 1 shows a top view of a plurality of first imaging regions 15 and a second imaging region 25 in the preferred embodiment. (The figure schematically shows three first imaging regions 15 and three second imaging regions 25, wherein each first imaging chip 12 and each second imaging chip 22 are located in each of the above imaging regions.) Figure 8 Shown with Figure 7 The top view of the corresponding first detection area 16 and the second detection area 26. Figure 3 , Figure 4 as well as Figure 7 , Figure 8As shown, in a preferred embodiment of the present application, each first imaging module 10 and the second imaging module 20 are arranged in a staggered manner along the Y-axis direction, and the arrangement is designed to meet the following requirements: except for the first detection area 16 and / or the second detection area 26 located at the head and tail sides of the Y-axis direction, both ends of each first detection area 16 have overlapping parts with the second detection area 26 along the Y-axis direction, and both ends of each second detection area 26 have overlapping parts with the first detection area 16 along the Y-axis direction. Through the above settings, the first imaging array 1 and the second imaging array 2 achieve blind-zone coverage of the entire area to be detected, thereby achieving full-scale magnified detection of micron-level image features.

[0089] In this embodiment, preferably, Figure 7 As shown, the center of each first imaging region 15 is exactly aligned with the midpoint of the line connecting the centers of two adjacent second imaging regions 25. Accordingly, as shown in FIG. Figure 8 As shown, the center of each first detection area 16 is exactly aligned with the midpoint of the line connecting the centers of the two adjacent second detection areas 26, and the two ends of each first detection area 16 have an overlapping part of ΔZ with the two adjacent second detection areas 26, and the same is true for the second imaging area 25 and the second detection area 26, which will not be repeated here.

[0090] Specifically, taking the parameters listed in Table 1 as an example, for the design parameters of the first imaging module 10 and the second imaging module 20, H is preferably designed to be 21 mm, so that ΔZ=0.5 mm.

[0091] It should be noted that those skilled in the art can flexibly adjust the spacing, staggered arrangement, size of overlapping parts, etc. of each imaging module in the first imaging array 1 and the second imaging array 2 to meet the needs of actual image detection, and the above adjustments do not deviate from the technical ideas of the present application.

[0092] like Figure 3 As shown, preferably, the first optical axes 14 of each first imaging module 10 are in the same direction, the second optical axes 24 of each second imaging module 20 are in the same direction, the first optical axis 14 and the second optical axis 24 are both perpendicular to the Y-axis direction, and the bisector of the angle θ formed by the first optical axis 14 and the second optical axis 24 points to the Z-axis direction.

[0093] In this embodiment, the preferred value range of θ is between 8° and 12°. Figure 3 and Figure 8As shown, when the depth of field of each magnifying lens is Δl, according to the sine theorem, the effective width of each detection area in the scanning sub-direction, i.e., the X direction, is: ΔD=4Δl*Sin(θ / 2). This effective width represents the allowable tolerance range ΔD of the detection area in the X direction, that is, a clear image can be scanned within this depth of field tolerance range. The detected object within the above ΔD range moves continuously along the X direction and is scanned continuously. The light signal on its surface is acquired and converted into an electrical signal by the first imaging array 1 and the second imaging array 2, and then is converted into an analog-to-digital signal by the data conversion module, and finally synthesized into a surface image by the data processing module. Specifically, the processing process of the data processing module includes signal inversion, position calibration, removal of overlap, image stitching, correction synthesis, etc. The above operations are already known to those skilled in the art.

[0094] When the first imaging array 1 and the second imaging array 2 are close in the X direction, the optical paths of their imaging modules may affect each other. This is because when the light enters the magnifying lens on one side, although the light will normally irradiate the respective imaging chips, the light will be emitted at a certain angle because the light emitting surface of the magnifying lens is a convex structure. At the same time, the distance between the imaging chips on both sides is small, so the light on one side will enter the imaging chip on the other side, causing interference.

[0095] For this purpose, preferably, Figure 3 As shown, the array-type image detection device further includes a baffle 34. In this embodiment, the baffle 34 is located between the first imaging array 1 and the second imaging array 2, parallel to the Z axis and extending along the Y axis, and is fixedly connected to the outer frame 31 by plugging, bonding, etc., so as to play the role of separating the magnifying lens and the imaging chip on both sides. The baffle 34 is preferably made of black PC material or other materials that are easier to absorb light, so as to absorb stray light caused by wall reflection, further increase the effective light signal, and present a clearer image.

[0096] [Example 2]

[0097] Fig. 9 A side sectional view along the X-axis direction of an array image detection device according to a preferred embodiment 2 of the present application is shown. The difference between this embodiment and embodiment 1 is that the first imaging chip 12 and the second imaging chip 22 are also rotated accordingly relative to the first optical axis 14 and the second optical axis 24, respectively, so that the imaging surface of each imaging chip is set to be perpendicular to the optical axis of the imaging module in which it is located.

[0098] Specifically, Fig. 9As shown, the first chip substrate 122 is rotated so that its surface is perpendicular to the first optical axis 14, and the first optical axis 14 is aligned with the center of the first photoelectric conversion chip 121. In this way, the imaging surface of the first imaging chip 12 can be perpendicular to the first optical axis 14. At the same time, the main light can also pass through the center of the first magnifying lens 11 and illuminate the center of the first photoelectric conversion chip 121, which is more conducive to achieving light symmetry and can allow a wider range of scanning deviations.

[0099] The same operation can be performed on the second imaging chip 22 , which will not be described in detail here.

[0100] In this embodiment, if Fig. 9 As shown, after the first photoelectric conversion chip 121 and the second photoelectric conversion chip 221 convert the optical signal of the image to be detected into an analog signal, they are connected to the corresponding sockets 605 provided on the relay substrate 51 through the sockets 600 provided on the first chip substrate 122 and the second chip substrate 222, respectively, and the connection method can be an FFC cable, etc., so as to realize the transmission of data between the imaging chip and the data conversion module.

[0101] The above is a detailed introduction to the specific implementation methods of the present application. For those skilled in the art, several improvements and modifications may be made to the present application without departing from the principles of the present application. These improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. An array image detection device, comprising two imaging arrays arranged at intervals along a first direction, characterized in that: Each column of the imaging array includes a plurality of imaging modules arranged at intervals along the second direction, and each imaging module includes a magnifying lens and an imaging chip arranged in sequence along its optical axis; Each imaging module magnifies the image to be detected in its detection area and images it in its imaging area, and the image is acquired by the imaging chip in its imaging area; and The imaging modules in the two imaging arrays are arranged staggered with each other along the second direction, and except for the detection areas at the head and tail sides of the second direction, both ends of each detection area along the second direction have overlapping parts with other detection areas; In the two columns of imaging arrays, each imaging module of one column of the imaging array has a first optical axis in the same direction, and each imaging module of the other column of the imaging array has a second optical axis in the same direction, the first optical axis and the second optical axis are both perpendicular to the second direction, the first optical axis and the second optical axis are both straight lines, and the first optical axis and the second optical axis are not perpendicular to the plane where the image to be detected is located; The angle between the first optical axis and the second optical axis is in the range of 8° to 12°, and the detection areas of the imaging modules in different imaging arrays have a tolerance of no more than 4Δl*Sin(θ / 2) in the first direction, where θ is the angle between the first optical axis and the second optical axis, and Δl is the depth of field of the magnifying lens; A bisector of an angle formed by the first optical axis and the second optical axis extends along a third direction, and the third direction is perpendicular to the first direction and the second direction; The detection areas of the respective imaging modules are at the same height in the third direction; The magnifying lens is also cut with its optical axis as the axis center, and its projection on a plane perpendicular to the optical axis is a rectangle.

2. An array type image detection device according to claim 1, characterized in that: The magnifying lens is a meniscus lens, the light incident surface of which is a concave surface and the light emitting surface of which is a convex surface; The radius of the light incident surface is less than or equal to 15 mm, the radius of the light emitting surface is less than or equal to 8 mm, and The distance between the intersection of the light incident surface, the light emitting surface and the optical axis is less than or equal to 3 mm.

3. The array image detection device according to claim 1, characterized in that: The length of the rectangle is in the range of 9 to 11 mm, and the width is in the range of 2 to 6 mm.

4. The array image detection device according to claim 1, characterized in that: The distance from the detection area to the imaging area of ​​each imaging module is less than or equal to 90 mm and the image magnification is 1 to 6 times.

5. The array image detection device according to claim 1, characterized in that: Each imaging module further comprises an aperture stop located on its optical axis, wherein the aperture stop is located between the detection area and the magnifying lens of the imaging module.

6. The array image detection device according to claim 5, characterized in that: The distance from the aperture stop of each imaging module to the detection area is less than or equal to 25 mm.

7. The array image detection device according to claim 1, characterized in that: The imaging surface of each imaging chip is perpendicular to the optical axis of the imaging module in which it is located.

8. The array image detection device according to claim 1, characterized in that: The array image detection device also includes a hollow outer frame for fixedly accommodating each imaging module.

9. The array image detection device according to claim 1, characterized in that: The array-type image detection device further comprises a light-proof baffle, and the baffle is located between the two columns of imaging arrays.

10. The array image detection device according to claim 1, characterized in that: The array image detection device also includes a light source module, which is used to generate light directed to the detection area.

11. The array image detection device according to claim 1, characterized in that: The array image detection device also includes: A data conversion module, used to convert the analog signals acquired by each imaging chip into digital signals; and The data processing module is used to process the digital signal and generate a digitized magnified image of the image to be detected.

Images