Probe head and probe card

Abstract

The application discloses a probe head and a probe card. The probe head comprises a guide piece and a probe. The guide piece comprises a first guide sheet and a second guide sheet which are arranged in layers. A plurality of needle holes are formed in the guide piece and pass through the first guide sheet and the second guide sheet. A through groove is formed in a non-needle hole area of the first guide sheet, and the through groove is used for accommodating a component. The probe is inserted into the needle hole. The first guide sheet of the probe head of the application is provided with the through groove. After the probe head is installed on the probe card, the through groove of the first guide sheet is located in a component mounting area of a substrate. The through groove provides an accommodation space for the component, so that the component can be welded on the substrate close to the probe head. The component is just accommodated in the through groove, thereby reducing the distance between the component and a wafer or a chip connected to the probe of the probe head.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer testing, in particular to a probe head and a probe card. BACKGROUND

[0002] Wafer testing is an important link of wafer production, which plays a role in avoiding defective products from flowing into the next link. The probe card needs to be used in wafer testing, which generally includes a circuit board, a substrate and a probe head, and the probe head is connected with a wafer or a chip to be tested.

[0003] With the increase of integration, the power consumption of the chip is rising, and a large number of switching tubes generate certain power switching noise. It is a key point to provide a clean and stable power supply for the chip during wafer testing to ensure the stability of the test. Therefore, it is usually necessary to install a certain capacitor on the probe card to filter the power noise to ensure the stability of the power supply. The smaller the decoupling radius of the smaller capacitor is, so the smaller the capacitor needs to be as close to the wafer or chip as possible. However, the current probe head and probe card can only set the capacitor device on the circuit board, and the distance from the wafer or chip connected to the side of the probe head cannot be reduced, which reduces the efficiency of the capacitor.

[0004] On the other hand, for multi-path loopback testing, a switch chip is often needed to be connected for gating. The existing probe card structure can only place the capacitor and the switch chip on the circuit board. The signal path starts from the wafer position, passes through the probe head, the substrate to the circuit board, and then passes through the substrate, the probe head and returns to the wafer from the circuit board. The long path has more loss to the high-speed signal, and the discontinuity point is generated due to impedance through multiple components, which affects the test accuracy.

[0005] Therefore, a new probe head and probe card structure are needed to reduce the distance from the components on the probe card to the wafer or chip to be tested on the probe head. SUMMARY

[0006] The purpose of the embodiments of the present application is to provide a probe head and a probe card, so that the components can be directly arranged close to the probe head, and the distance from the components to the wafer or chip to be tested on the probe head is reduced.

[0007] To solve the above technical problems, in a first aspect, the embodiments of the present application provide a probe head, which comprises a guide piece and a probe; the guide piece comprises a first guide piece and a second guide piece arranged in layers, and a plurality of needle holes are formed in the first guide piece and the second guide piece; wherein a through slot is formed in the non-needle hole area of the first guide piece, and the through slot is used to accommodate components; the probe is inserted into the needle hole.

[0008] In a possible implementation, the through slot is arranged around the needle hole.

[0009] In a possible implementation, the plurality of needle holes are arranged in a rectangular array in the middle region of the guide member; and the plurality of through grooves are four in number and are located outside the four sides of the rectangular region. In a possible implementation, the probe head further comprises a fixing member; the guide member is formed with a mounting hole penetrating the first guide piece and the second guide piece; the fixing member is inserted into the mounting hole to lock the first guide piece and the second guide piece; and the fixing member is used to mount the guide member on a designated device.

[0010] In a possible implementation, the fixing member comprises a first fixing segment and a second fixing segment connected end to end; the first fixing segment is inserted into the mounting hole to lock the first guide piece and the second guide piece; and the second fixing segment protrudes from the side of the first guide piece away from the second guide piece, and is used to mount the guide member on a designated device.

[0011] In a possible implementation, the mounting hole is arranged around the through groove and the needle hole to improve the locking effect of the fixing member.

[0012] In a possible implementation, the guide member is a ceramic guide piece.

[0013] To solve the above technical problems, in a second aspect, an embodiment of the present application provides a probe card, which comprises a probe head as described in the above embodiments, and further comprises: a circuit board; a plurality of structural members fixed to one side of the circuit board; a substrate, a first surface of the substrate being welded to the circuit board, wherein the structural members are arranged around the substrate; the probe head is mounted on the side of the structural members and the substrate away from the circuit board; the second guide piece is away from the circuit board relative to the first guide piece; one end of the probe is connected to a second surface of the substrate; and a component is welded to the second surface of the substrate and accommodated in the through groove of the first guide piece.

[0014] In a possible implementation, the distance between the second surface of the substrate and the second guide piece facing the one side of the substrate ranges from 2 mm to 4 mm.

[0015] In a possible implementation, the component is a capacitor and a switch chip.

[0016] The present application has the following beneficial effects: Different from the prior art, the present application provides a probe head and a probe card. The probe head comprises a guide member and a probe, the guide member comprises a first guide piece and a second guide piece arranged in layers, and the guide member is formed with a plurality of needle holes penetrating the first guide piece and the second guide piece; wherein the non-needle hole region of the first guide piece is formed with a through groove for accommodating a component; and the probe is inserted into the needle hole. The probe head of the present application is formed with a through groove, which can accommodate the component, so that the component does not need to be arranged on the circuit board of the probe card, but can be arranged close to the probe head, thereby reducing the distance between the component and the wafer or chip to be tested on the probe head. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced. Obviously, the drawings in the following description only constitute some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative effort based on these drawings. Among them:

[0018] Figure 1 is a structural schematic diagram of a probe head in an embodiment of the present application;

[0019] Figure 2 is a structural schematic diagram of a probe card in an embodiment of the present application. Figure 1 is a planar cross-sectional structural schematic diagram of the probe head;

[0020] Figure 3 is a structural schematic diagram of a probe card in an embodiment of the present application.

[0021] The drawings show that: 100 / 240, probe head; 110, guide piece; 111, first guide piece; 112, second guide piece; 120, probe; 130, through slot; 140, fixing piece; 150, needle hole; 160, mounting hole; 200, probe card; 210, circuit board; 220, structural piece; 230, base plate; 250, component. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.

[0023] The terms used in the embodiments of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The singular forms "a", "an" and "the" used in the embodiments of the present application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise. "Multiple" generally includes at least two, but does not exclude the case of including at least one.

[0024] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0025] It should be understood that the terms "comprises", "comprising", or other any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0026] The existing probe head does not reserve space for setting components, and the components can only be set on the circuit board of the probe card, and the distance from the components to the wafer or chip to be tested on the probe head cannot be reduced.

[0027] To solve the above problems, the application provides a probe head and a probe card. By forming a through slot for accommodating component setting on the first guide piece of the probe head, the above problems are effectively solved. A probe head and a probe card provided by the application are described in detail below in combination with the drawings and embodiments.

[0028] Please refer to Figure 1 With Figure 2 , Figure 1 is a structural schematic diagram of an embodiment of the probe head of the application. Figure 2 For Figure 1 a planar cross-sectional structural schematic diagram of the probe head. The first aspect of the application provides a probe head. In a specific embodiment, the probe head 100 of the application comprises a guide piece 110 and a probe 120.

[0029] The guide member 110 includes a first guide piece 111 and a second guide piece 112 stacked together. A plurality of pinholes 150 are formed on the guide member 110, penetrating the first guide piece 111 and the second guide piece 112. A through groove 130 is formed in the non-pinhole 150 area of ​​the first guide piece 111, used to accommodate components. A probe 120 is inserted into the pinhole 150. Specifically, the first guide piece 111 and the second guide piece 112 serve to fix the probe 120. The probe 120 is fixed within the through holes of the first guide piece 111 and the second guide piece 112. During wafer testing, one side of the first guide piece 111 of the probe head 100 is fixed to the probe card. After the probe 120 is inserted into the pinhole 150, it protrudes from both sides of the guide member 110. The end protruding from the first guide piece 111 connects to the substrate on the probe card, and the end protruding from the second guide piece 112 connects to the test point on the wafer under test. The first guide piece 111 of the guide member 110 of this application has a through groove 130. After the probe head 100 is installed on the probe card, the through groove 130 is located exactly in the value needle area of ​​the substrate. The through groove 130 makes it unnecessary to fix the components on the circuit board, but can be soldered on the substrate so that the components are just accommodated in the groove of the first guide piece 111.

[0030] Unlike existing technologies, this application proposes a probe head 100, on which a through groove 130 is formed on the first guide plate 111. After the probe head 100 is mounted on a probe card, the through groove 130 of the first guide plate 111 is located in the pin-planting area of ​​the substrate. The through groove 130 provides space for accommodating components, so that components can be soldered onto the substrate close to the probe head 100. The components are precisely accommodated in the through groove 130, thereby reducing the distance between the components and the wafer or chip to be tested connected to the probe 120 on the probe head 100.

[0031] like Figure 1 As shown, in order to enhance the fixing reliability of probe 120, in some other embodiments, the edges of the first guide plate 111 and the second guide plate 112 extend perpendicularly to the plane. This structural design allows the first guide plate 111 and the second guide plate 112 to be stacked, with a hollow space between them, effectively increasing the thickness of the guide member 110. After the probe 120 is inserted into the pinhole 150, it is fixed more securely.

[0032] In this embodiment, a through groove 130 is formed in the non-pinhole 150 area of ​​the first guide plate 111, while no through groove 130 is provided in the area of ​​the second guide plate 112 corresponding to the through groove 130. This structural design allows the probe head 100 to be mounted on the probe card, and when the component is housed in the through groove 130, it prevents contaminants or solder dross on the component from falling onto the wafer or chip under test on the side of the second guide plate 112 below.

[0033] In some embodiments, the pin holes 150 are arranged in a rectangular array in the middle region of the guide 110, and the through grooves 130 are four in number and are located outside the four sides of the rectangular region. Specifically, the through grooves 130 are used to provide accommodation spaces for components, which can be capacitive components or switch chips, etc. The number of the through grooves 130 is determined according to the number of components to be arranged, and in the present embodiment, the number of the through grooves 130 is set to be four, but in other embodiments, the number of the through grooves 130 can also be three, five, six, etc. without specific limitation. In the present embodiment, the through grooves 130 are arranged around the pin holes 150, and this structure design makes the components distributed on the substrate of the probe card to be dispersed, which is convenient for heat dissipation of the components, and the components arranged on the substrate are balanced in stress. In other embodiments, the through grooves 130 can also be arranged on the same side of the pin holes 150, etc. without specific limitation on the arrangement. Further, in the present embodiment, the opening of the through groove 130 is square, but in other embodiments, the opening of the through groove 130 can also be circular, elliptical, square, parallelogram or irregular shape, etc. without specific limitation. The shape of the through groove 130 is determined according to the shape of the component to be accommodated. Moreover, each through groove 130 can accommodate one component or multiple components, and when accommodating multiple components, the shape of the through groove 130 needs to be determined according to the overall shape of the multiple components, which can be irregular.

[0034] Further, after the through grooves 130 are formed on the first guide piece 111 of the probe head 100, the components to be arranged on the circuit board of the probe card can be welded and arranged on the substrate, the components are accommodated in the through grooves 130, and the distance from the components to the wafer or chip to be tested on the one side of the probe head 100 is reduced. After the components are transferred and welded on the substrate, the components are surrounded by the substrate and the probe head 100, and in order to improve the heat dissipation capacity of the components, the size of the through groove 130 is designed to be larger than the size of the component, which effectively prolongs the service life of the probe head 100.

[0035] In the embodiment, the probe head 100 further comprises a fixing member 140, the guide member 110 is provided with a mounting hole 160 penetrating the first guide piece 111 and the second guide piece 112, and the fixing member 140 is inserted into the mounting hole 160 to lock the first guide piece 111 and the second guide piece 112. The fixing member 140 is used to mount the guide member 110 on a designated device. The fixing member 140 comprises a first fixing section and a second fixing section connected in sequence. The first fixing section is inserted into the mounting hole 160 to lock the first guide piece 111 and the second guide piece 112. The second fixing section protrudes from the side of the first guide piece 111 away from the second guide piece 112, and is used to mount the guide member 110 on the designated device. Specifically, in the embodiment, the fixing member 140 is a bolt, and the mounting hole 160 is a screw hole. The bolt is screwed into the screw hole to lock and fix the first guide piece 111 and the second guide piece 112. The length of the shank of the bolt is greater than the thickness of the guide member 110. When the bolt locks the guide member 110, the nut of the bolt is located on the side of the second guide piece 112 away from the first guide piece 111, and the other end of the bolt protrudes from the side of the first guide piece 111. The part of the bolt located in the mounting hole 160 is the first fixing section, which is used to lock the first guide piece 111 and the second guide piece 112. The other end of the bolt is the second fixing section of the fixing member 140, which is used to mount the probe head 100 on the probe card.

[0036] Further, in the embodiment, the mounting hole 160 is arranged around the through slot 130 and the needle hole 150 to improve the locking effect of the fixing member 140. Specifically, in the embodiment, the number of the mounting hole 160 is four. In other embodiments, the number of the mounting hole 160 can also be 3, 5, 6, or other numbers, which are not limited specifically. The mounting hole 160 is arranged around the through slot 130 and the needle hole 150, and the locking is more secure after the fixing member 140 is locked. In some preferred embodiments, the mounting holes 160 are not arranged on the same straight line, and preferably, at least four mounting holes 160 are arranged at the four corner regions of the guide member 110.

[0037] Further, the guide member 110 is made of insulating material. In the embodiment, the guide member 110 is preferably a ceramic guide piece. The ceramic guide piece has high hardness and is insulating, which can fix the probe 120 well. In addition, the ceramic has excellent thermal conductivity, and the use of the ceramic guide piece can quickly dissipate the heat generated by the components in the through slot 130.

[0038] Different from the prior art, the application provides a probe head 100, a through groove 130 is formed on a first guide piece 111 of the probe head 100, and the through groove 130 of the first guide piece 111 is located at a ball mounting area of a substrate after the probe head 100 is mounted on a probe card. The through groove 130 provides a mounting space for a component, so that the component can be welded on the substrate close to the probe head 100, and the component is just mounted in the through groove 130, thereby reducing the distance between the component and a wafer or a chip to be tested connected by a probe 120 of the probe head 100.

[0039] Correspondingly, in a second aspect, the application also provides a probe card. Please refer to Figure 3 , Figure 3 is a structural schematic diagram of an embodiment of the probe card of the application. In a specific embodiment, the probe card 200 of the application comprises a probe head 240, a circuit board 210, a structural member 220, a substrate 230 and a component 250.

[0040] The probe head 240 is the probe head described in the above embodiment.

[0041] The structural member 220 is fixed on one side of the circuit board 210; the first surface of the substrate 230 is welded on the circuit board 210, wherein the structural member 220 is arranged around the substrate 230; the probe head 240 is mounted on the side of the structural member 220 and the substrate 230 away from the circuit board 210; the second guide piece is away from the circuit board 210 relative to the first guide piece; one end of the probe is connected to the second surface of the substrate 230; the component 250 is welded on the second surface of the substrate 230, and the component 250 is accommodated in the through groove of the first guide piece. Specifically, the first surface of the substrate 230 is a ball mounting surface and is welded on the circuit board 210 through a tin ball; the second surface of the substrate 230 is a needle mounting surface, and the probes exposed on one side of the first guide piece of the probe head 240 are connected to the needle mounting surface of the substrate 230 after the probe head 240 is mounted on the probe card 200. After the probe head 240 is mounted on the probe card 200, the through groove on the first guide piece of the probe head 240 is located at the second surface area of the substrate 230, so that the component 250 can be welded on the second surface of the substrate 230. After the probe head 240 is mounted, the component 250 is just located in the through groove, avoiding that the component 250 can only be arranged on the circuit board 210, and reducing the distance between the component 250 and a wafer or a chip to be tested on the probe head 240.

[0042] In the embodiment, the distance between the second surface of the substrate 230 and the second guide piece facing the substrate 230 is 2-4 mm. Specifically, the distance between the second surface of the substrate 230 and the second guide piece facing the substrate 230 is the height of the component 250 that can be accommodated in the through slot. In the embodiment, the distance between the second surface of the substrate 230 and the second guide piece facing the substrate 230 is controlled to be 2-4 mm, so that the height of the solderable component 250 is at least 2 mm. By adjusting the thickness of the first guide piece and the second guide piece, the distance can be adjusted to 4 mm, so that the component 250 with a height of 4 mm can be accommodated. The specific distance value is adjusted adaptively according to the height of the component 250, and is not specifically limited.

[0043] In the embodiment, the component 250 is a capacitor and a switch chip. Specifically, the capacitor is transferred from the position of the circuit board 210 to the pin planting surface of the substrate 230, so that the capacitor is located in the through slot, the distance between the capacitor and the wafer or chip to be tested on the probe head 240 is reduced, so that the decoupling radius of the small capacitor can be met, and the efficiency of the capacitor is improved. The switch chip is transferred from the position of the circuit board 210 to the pin planting surface of the substrate 230, so that the switch chip is located in the through slot. The signal path is from the wafer position, through the probe head 240 to the switch chip on the substrate 230, and is transmitted back to the wafer on the probe head 240 by the substrate 230, without passing through the circuit board 210. The signal transmission path is reduced, and the test accuracy is higher.

[0044] Different from the prior art, the application provides a probe card 200. The first guide piece of the probe head 240 of the probe card 200 is provided with a through slot. After the probe head 240 is installed on the probe card 200, the through slot of the first guide piece is located in the pin planting area of the substrate 230. The through slot provides a space for accommodating the component 250, so that the component 250 can be soldered on the substrate 230 close to the probe head 240. The component 250 is just accommodated in the through slot, so that the distance between the component 250 and the wafer or chip to be tested connected by the probe head 240 is reduced.

[0045] The above description is only an embodiment of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent principle transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.

Claims

1. A probe head, characterized by, The probe head comprises: a guide piece, which comprises a first guide sheet and a second guide sheet arranged in layers, and a plurality of needle holes formed in the first guide sheet and the second guide sheet; a probe, which is inserted into the needle holes.

2. The probe head according to claim 1, wherein the through grooves are arranged around the needle holes.

3. The probe head according to claim 2, wherein the plurality of needle holes are arranged in a rectangular array in a middle region of the guide piece; and the number of the through grooves is four, which are respectively located outside the four sides of the rectangular region.

4. The probe head of claim 1, wherein The probe head further comprises: a fixing piece; the guide piece is provided with a mounting hole penetrating through the first guide sheet and the second guide sheet, and the fixing piece is inserted into the mounting hole to lock the first guide sheet and the second guide sheet, and the fixing piece is also used to mount the guide piece on a designated device.

5. The probe head according to claim 4, wherein the fixing piece comprises a first fixing segment and a second fixing segment connected in head-to-tail manner, the first fixing segment is inserted into the mounting hole to lock the first guide sheet and the second guide sheet, and the second fixing segment is exposed from one side of the first guide sheet away from the second guide sheet, and the guide piece is mounted on the designated device through the second fixing segment.

6. The probe head according to claim 4, wherein the mounting hole is arranged around the through grooves and the needle holes.

7. The probe head according to claim 1, wherein the guide piece is a ceramic guide sheet.

8. A probe card characterized by The probe card comprises a probe head, which is the probe head according to any one of claims 1-7, and further comprises: a circuit board; a plurality of structural pieces fixed to one side of the circuit board; a substrate, a first surface of which is welded to the circuit board, wherein the structural pieces are arranged around the substrate; the probe head is mounted on the side of the structural pieces and the substrate away from the circuit board; the second guide sheet is away from the circuit board relative to the first guide sheet; and one end of the probe is connected to a second surface of the substrate; a component, which is welded to the second surface of the substrate and accommodated in the through groove of the first guide sheet.

9. The probe card according to claim 8, wherein the distance between the second surface of the substrate and the second guide sheet facing the side of the substrate ranges from 2 mm to 4 mm.

10. The probe card according to claim 8, wherein the component is a capacitor and a switch chip.

Images