Device winding insulation fault monitoring method and device, computer device and medium
By setting electroluminescent pads between transformer windings and monitoring changes in their luminescence brightness, the problem of low sensitivity in monitoring short-circuit faults between transformer winding turns and between transformer discs was solved, achieving accurate location and efficient fault diagnosis.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- XI AN JIAOTONG UNIV
- Filing Date
- 2022-09-20
- Publication Date
- 2026-06-02
AI Technical Summary
In existing technologies, the sensitivity of short-circuit fault monitoring between turns and between discs in transformer windings is low, making it difficult to accurately locate the fault location and potentially affecting equipment insulation.
By placing a pad between adjacent equipment windings, an electroluminescent material emits light under a high electric field. The change in the brightness of the pad is monitored, and the first and second brightness values are obtained, compared and corrected to determine the fault condition.
It improves the sensitivity of fault monitoring, enabling precise location of short-circuit faults in the equipment's pancake windings and reducing the impact on insulation.
Smart Images
Figure CN115656735B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of equipment winding fault detection technology, and in particular to a method, device, computer equipment, and medium for monitoring equipment winding insulation faults. Background Technology
[0002] Monitoring insulation faults in equipment windings enables timely troubleshooting, facilitating the safe and stable operation of the windings. For example, transformers are crucial power equipment in substations, and their safe and stable operation is essential for maintaining the normal operation of the substation. However, due to overload, insulation dampness, impurities, and other reasons, insulation failure may occur between turns and between wafers during transformer operation, leading to short circuits between the turns and wafers of the transformer windings.
[0003] Currently, electrical quantity monitoring and non-electrical quantity monitoring methods are used to monitor short-circuit faults between turns and between discs in equipment windings, but both methods suffer from low sensitivity. Summary of the Invention
[0004] Therefore, it is necessary to provide a method, device, computer equipment, and medium for monitoring equipment winding insulation faults that can improve the sensitivity of fault monitoring, in response to the above-mentioned technical problems.
[0005] Firstly, this application provides a fault monitoring method. The method includes:
[0006] The first luminous brightness of each pad disposed between adjacent device pan windings is obtained; the first luminous brightness is the luminous brightness of each pad in the normal operating state of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0007] After obtaining the first luminous brightness, the second luminous brightness of each pad is obtained;
[0008] Based on the first luminous brightness and the second luminous brightness of each pad, fault monitoring is performed on each of the device's disc windings to obtain fault monitoring results.
[0009] In one embodiment, fault monitoring of each device pancake winding is performed based on a first luminous intensity and a second luminous intensity of each pad, including:
[0010] Determine the first average value of the first luminous intensity and the second average value of the second luminous intensity for each pad;
[0011] The second luminous brightness of each pad is corrected based on the first average value and the second average value to obtain the third luminous brightness of each pad;
[0012] Based on the first and third luminous brightness of each pad, fault monitoring is performed on each device's disc winding to obtain fault monitoring results.
[0013] In one embodiment, the second luminance of each pad is corrected based on the first average value and the second average value to obtain the third luminance of each pad, including:
[0014] Determine a first difference between the first average value and the second average value;
[0015] Based on the second luminance of each pad and the first difference, the second luminance of each pad is corrected to obtain the third luminance of each pad.
[0016] In one embodiment, the second luminance of each pad is corrected based on the second luminance of each pad and the first difference to obtain a third luminance of each pad, including:
[0017] The summation result of the first difference and the second luminous brightness of each pad is determined, and the summation result corresponding to each pad is taken as the third luminous brightness of each pad.
[0018] In one embodiment, fault monitoring is performed on each device pancake winding based on a first luminous intensity and a third luminous intensity of each pad to obtain fault monitoring results, including:
[0019] Determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad;
[0020] Determine the ratio of the second difference corresponding to each pad to the corresponding first luminous brightness;
[0021] Based on this ratio and a preset threshold, fault monitoring is performed on each of the device's disc windings to obtain fault monitoring results.
[0022] In one embodiment, fault monitoring is performed on each of the device's pancake windings based on the ratio and a preset threshold to obtain fault monitoring results, including:
[0023] Determine the number of ratios that are greater than the preset threshold;
[0024] Based on the number of these ratios, fault monitoring is performed on each of the device's disc windings to obtain the fault monitoring results.
[0025] Secondly, this application also provides a fault monitoring device. The device includes:
[0026] The first acquisition module is used to acquire the first luminous brightness of each pad disposed between adjacent device pan windings; the first luminous brightness is the luminous brightness of each pad in the normal operating state of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0027] The second acquisition module is used to acquire the second luminous brightness of each pad after acquiring the first luminous brightness;
[0028] The monitoring module is used to perform fault monitoring on each device's disc winding based on the first luminous brightness and the second luminous brightness of each pad to obtain fault monitoring results.
[0029] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the steps of any of the methods described in the first aspect above.
[0030] Fourthly, this application also provides a computer-readable storage medium. This computer-readable storage medium stores a computer program thereon, which, when executed by a processor, implements the steps of any of the methods described in the first aspect above.
[0031] Fifthly, this application also provides a computer program product. This computer program product includes a computer program that, when executed by a processor, implements the steps of any of the methods described in the first aspect above.
[0032] The aforementioned equipment winding insulation fault monitoring method, apparatus, computer equipment, and medium acquire the first luminance of each pad located between adjacent equipment windings under normal operating conditions, and then acquire the second luminance of each pad. Based on the first and second luminance of each pad, fault monitoring is performed on each equipment winding to obtain fault monitoring results. In other words, this application embodiment performs fault monitoring on each equipment winding based on the first and second luminance to obtain fault monitoring results, and then determines whether a short-circuit fault has occurred in each equipment winding based on the fault monitoring results. This allows for precise location of the equipment winding experiencing a short-circuit fault based on the changes in the first and second luminance of the pads located between the equipment windings experiencing a short-circuit fault, improving the sensitivity of fault monitoring. For example, based on the changes in the first and second luminance of pad number 2 located in the second and third transformer windings, it can be determined whether an inter-winding or inter-turn short-circuit fault has occurred in the second and third transformer windings. Attached Figure Description
[0033] Figure 1This is a schematic diagram of the structure of a transformer winding in the prior art;
[0034] Figure 2 A block diagram of a server provided in an embodiment of this application;
[0035] Figure 3 A schematic flowchart illustrating a method for monitoring equipment winding insulation faults, provided in an embodiment of this application;
[0036] Figure 4 A flowchart illustrating a method for obtaining equipment winding insulation fault monitoring results provided in an embodiment of this application;
[0037] Figure 5 A flowchart illustrating a method for obtaining a third luminous intensity provided in an embodiment of this application;
[0038] Figure 6 A flowchart illustrating another method for obtaining equipment winding insulation fault monitoring results provided in this application embodiment;
[0039] Figure 7 A flowchart illustrating another method for obtaining equipment winding insulation fault monitoring results provided in this application embodiment;
[0040] Figure 8 A schematic diagram showing the light emission brightness curves of each pad provided in the embodiments of this application;
[0041] Figure 9 A structural block diagram of a device for monitoring equipment winding insulation faults provided in this application embodiment;
[0042] Figure 10 This is an internal structural diagram of a computer device provided in an embodiment of this application. Detailed Implementation
[0043] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0044] Statistics show that transformer winding faults account for 70%-80% of all transformer faults, with inter-turn short-circuit faults accounting for 60%-70% of these faults. When inter-turn or inter-reel short-circuit faults occur, the transformer can still operate normally, and these faults are difficult to detect. If a transformer continues to operate for an extended period after a short-circuit fault, it may lead to more serious insulation failures, or even transformer combustion and explosion. Therefore, it is necessary to monitor inter-turn and inter-reel short-circuit faults in transformer windings to ensure timely transformer disconnection and fault diagnosis when a short-circuit fault occurs.
[0045] It should be noted that: The term "transformer winding inter-turn" refers to the relationship between one turn and another within a transformer winding. The term "transformer winding inter-turn" refers to the relationship between one transformer winding and another within a transformer winding. A transformer winding includes multiple transformer windings, for example, such as... Figure 1 As shown, Figure 1 This is a schematic diagram of the structure of a transformer winding in the prior art. From top to bottom, the transformer winding has a total of 11 transformer plate windings, namely the 1st transformer plate winding, the 2nd transformer plate winding, ... the 11th transformer plate winding.
[0046] Traditional methods for monitoring short-circuit faults between turns and between transformer windings are mainly divided into two categories: electrical quantity monitoring and non-electrical quantity monitoring. Electrical quantity monitoring includes, but is not limited to, the leakage inductance method, the leakage magnetic field method, and the voltage-current ratio method. These methods primarily monitor short-circuit faults between turns and between transformer windings by measuring electrical quantities such as voltage, current, and magnetic field during transformer operation. For example, when an inter-turn short-circuit fault occurs in a transformer winding, the leakage inductance of the transformer winding changes, the magnetic field around the transformer winding changes, and the voltage-current ratio of the transformer also changes. Therefore, by monitoring these electrical quantities such as leakage inductance, magnetic field, and voltage-current ratio, the inter-turn short-circuit fault in the transformer winding can be detected.
[0047] However, both the leakage inductance method and the voltage-current ratio method rely on measuring the leakage inductance, total current, and total voltage presented by the transformer to infer whether there is an inter-turn short circuit fault inside the transformer windings. Therefore, for smaller inter-turn short circuit faults, it is difficult to determine whether an inter-turn short circuit has occurred based on these electrical quantities, resulting in low sensitivity and an inability to accurately locate the fault. The leakage magnetic field method requires the installation of multiple magnetic field sensors inside the transformer. While it can locate the short circuit fault using these sensors, it cannot pinpoint the specific winding from a multi-turn transformer winding, resulting in low sensitivity. Furthermore, the involvement of magnetic field sensors can threaten the transformer's insulation.
[0048] Non-electrical quantity monitoring includes, but is not limited to, methods such as temperature measurement and detection of dissolved gases in oil. However, when an inter-turn short-circuit fault occurs in a transformer winding, localized overheating or electric arcing in the oil can occur, leading to increased transformer temperature and dissolved gas content in the oil. Therefore, the sensitivity of short-circuit fault monitoring is low. Furthermore, there are many reasons for increased transformer temperature and dissolved gas content in the oil, making it difficult to determine whether an inter-turn short-circuit fault in the transformer winding is the cause.
[0049] To address the aforementioned technical problems, this application provides a fault monitoring method. This fault monitoring method can be applied to servers, where the server can be a single server or a server cluster composed of multiple servers. This application does not specifically limit the specific server configuration.
[0050] Please refer to Figure 2 It shows a block diagram of a server provided in an embodiment of this application, such as Figure 2 As shown, the server may include a processor and memory connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. When the computer program is executed by the processor, it implements a business quantification method.
[0051] Those skilled in the art will understand that Figure 2 The structure shown is merely a block diagram of a portion of the structure related to the solution of this application and does not constitute a limitation on the server to which the solution of this application is applied. A specific server may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.
[0052] It should be noted that the equipment winding insulation fault monitoring method provided in this application is not only applicable to fault monitoring of transformer windings, but also applicable to fault monitoring of equipment composed of windings such as reactors and generators. By setting pads between adjacent windings of the equipment or between slots of adjacent windings, the equipment is monitored for faults based on the brightness of the pads to obtain fault monitoring results.
[0053] Reference Figure 3 , Figure 3 This application provides a flowchart illustrating a method for monitoring equipment winding insulation faults, which includes the following steps:
[0054] S301, obtain the first luminous brightness of each pad disposed between adjacent device pan windings; the first luminous brightness is the luminous brightness of each pad in the normal operating state of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material.
[0055] In this embodiment, the initial luminous intensity of each pad can be obtained by taking a picture of the luminous emission of each pad with a camera, calculating the grayscale value of the luminous emission image of each pad, and determining the luminous intensity of each pad based on the grayscale value; alternatively, the luminous emission of each pad can be extracted using an optical fiber, and the luminous intensity of each pad can be measured using a photoelectric detector. When obtaining the luminous intensity of each pad by taking a picture with a camera, the camera's aperture, exposure, and exposure time should be kept constant to allow for comparison of the luminous intensity of each pad.
[0056] For example, combining Figure 1 To illustrate, 16 spacers are evenly distributed circumferentially between every two transformer windings. Therefore, there are 16 columns of spacers vertically. One column of spacers (numbered 1-10 from top to bottom) is selected as the research object. Electroluminescent material is sprayed onto the radial outer surface of each spacer. A camera is mounted on the transformer tank wall, facing the spacers. Since only a small amount of electroluminescent material is sprayed onto the spacers, the impact on the transformer insulation is minimal. Optionally, the coating can be applied only to a localized area of the spacers' outer surface, or a small amount of electroluminescent powder can be incorporated into the spacers. This embodiment does not limit the method of spraying the luminescent material onto the spacers, as long as it enables the spacers to emit light. Optionally, insulating components such as support bars or insulating paper tubes can be placed between the windings.
[0057] It should be noted that the pad can emit light because when the equipment is running, the pad will bear the potential difference between the two device windings, forming a high electric field, and the electroluminescent material will emit light under the high electric field.
[0058] S302, after obtaining the first luminous brightness, obtain the second luminous brightness of each pad.
[0059] To illustrate with the examples above, if the transformer winding is a continuous winding, the brightness of each pad is basically the same because the potential difference borne by each pad is basically the same. If the transformer winding is a twisted winding, the potential difference borne by each pad is slightly different. Although the brightness of each pad is slightly different, the brightness of each pad is basically close.
[0060] Optionally, since the potential difference of the pad changes immediately when a short circuit fault occurs in the device's pan winding, the brightness of the pad will change accordingly, resulting in a fast response and high sensitivity.
[0061] S303, based on the first and second luminous brightness of each pad, perform fault monitoring on the pancake winding of each device to obtain the fault monitoring results.
[0062] In this embodiment, whether a short circuit fault has occurred in each device's pie winding is determined by judging whether the first luminous brightness and the second luminous brightness are the same. If the first luminous brightness and the second luminous brightness are the same, then no short circuit fault has occurred in each device's pie winding; if the first luminous brightness and the second luminous brightness are different, then a short circuit fault has occurred in each device's pie winding. The difference between the first luminous brightness and the second luminous brightness can be that the first luminous brightness is greater than the second luminous brightness (i.e., the luminous brightness of each pad is dimmed); or it can be that the first luminous brightness is less than the second luminous brightness (i.e., the luminous brightness of each pad is brightened).
[0063] The equipment winding insulation fault monitoring method provided in this embodiment acquires the first luminance of each pad located between adjacent equipment windings under normal operating conditions, and then acquires the second luminance of each pad. Based on the first and second luminance of each pad, fault monitoring is performed on each equipment winding to obtain fault monitoring results. In other words, this embodiment monitors each equipment winding based on the first and second luminance to obtain fault monitoring results, and then determines whether a short-circuit fault has occurred in each equipment winding based on the fault monitoring results. This allows for precise location of the equipment winding experiencing a short-circuit fault based on the changes in the first and second luminance of the pads located between the equipment windings experiencing a short-circuit fault, improving the sensitivity of fault monitoring. For example, based on the changes in the first and second luminance of pad number 2 located between the second and third transformer windings, it can be determined whether an inter-winding or inter-turn short-circuit fault has occurred in the second and third transformer windings.
[0064] Reference Figure 4 , Figure 4 This is a flowchart illustrating a method for obtaining equipment winding insulation fault monitoring results according to an embodiment of this application. This embodiment relates to an optional implementation method for fault monitoring of each equipment pan winding based on the first and second luminous intensity of each pad. Based on the above embodiment, S302 specifically includes the following steps:
[0065] S401, determine the first average value of the first luminous intensity and the second average value of the second luminous intensity of each pad.
[0066] In this embodiment, the first luminous intensity of each pad is a[i], and the second luminous intensity of each pad is b[i], where i = 1 to n. For example, if there are 5 pads, the first luminous intensity of the 5 pads are a[1], a[2]...a[5], and the first average value A = a[1] + a[2] + ... + a[5] / 5. The second luminous intensity of the 5 pads are b[1], b[2]...b[5], and the second average value B = b[1] + b[2] + ... + b[5] / 5.
[0067] S402, the second luminous brightness of each pad is corrected according to the first average value and the second average value to obtain the third luminous brightness of each pad.
[0068] In this process, the second luminance of each pad is corrected using a function calculation formula based on the first and second average values to obtain the third luminance b'[i] of each pad, where i = 1 to n. The function calculation formula can be a linear function or a quadratic function; this embodiment does not limit the function calculation formula, as long as it makes the first and second average values close to each other.
[0069] S403, based on the first and third luminous brightness of each pad, perform fault monitoring on the pancake winding of each device to obtain the fault monitoring results.
[0070] In this embodiment, the presence or absence of a short circuit in each device's piezoelectric winding is determined by judging whether the first and third luminous brightness are consistent. If the first and third luminous brightness are consistent, then no short circuit has occurred in any device's piezoelectric winding; if the first and third luminous brightness are inconsistent, then a short circuit has occurred in any device's piezoelectric winding.
[0071] The method provided in this embodiment determines a first average value of the first luminous intensity and a second average value of the second luminous intensity of each pad, and corrects the second luminous intensity of each pad based on the first and second average values to obtain a third luminous intensity of each pad. Then, based on the first and third luminous intensities of each pad, fault monitoring is performed on each equipment winding to obtain fault monitoring results. In other words, this embodiment corrects the second luminous intensity using the first and second average values to obtain the third luminous intensity, thereby enabling fault monitoring of each equipment winding based on the first and third luminous intensities to obtain fault monitoring results.
[0072] Reference Figure 5 , Figure 5This is a flowchart illustrating a method for obtaining a third luminance level according to an embodiment of this application. This example relates to an optional implementation of how to correct the second luminance level of each pad based on a first average value and a second average value to obtain the third luminance level of each pad. Based on the above embodiment, S402 specifically includes the following steps:
[0073] S501, determine the first difference between the first average value and the second average value.
[0074] Using the examples above as an illustration, the first difference is equal to the first average value A minus the second average value B.
[0075] S502, based on the second luminous brightness and the first difference of each pad, the second luminous brightness of each pad is corrected to obtain the third luminous brightness of each pad.
[0076] The second luminous brightness can be corrected by summing the second luminous brightness and the first difference, or by summing the second luminous brightness, the first difference, and the weighting coefficient corresponding to the first difference.
[0077] The method provided in this example determines a first difference between a first average value and a second average value, and then corrects the second luminous brightness of each pad based on the second luminous brightness of each pad and the first difference to obtain a third luminous brightness of each pad. This method is simple, easy to implement, and highly efficient.
[0078] Based on the above embodiment, in step S502, the second luminous brightness of each pad is corrected according to the second luminous brightness and the first difference to obtain the third luminous brightness of each pad. This can be achieved in the following way:
[0079] Determine the sum of the first difference and the second luminous intensity of each pad, and use the sum of the values corresponding to each pad as the third luminous intensity of each pad.
[0080] In this example, the third luminous intensity b'[i] is specifically calculated using the following formula (1):
[0081]
[0082] Where i = 1 to n, and b[i] is the second luminous intensity. This is the first difference.
[0083] The method provided in this embodiment determines the sum of the first difference and the second luminous brightness of each pad, and uses the sum of the sums of the first difference and the second luminous brightness of each pad as the third luminous brightness of each pad. This method is simple, easy to implement, and highly operable.
[0084] Based on the above embodiments, referring to Figure 6 , Figure 6 This is a flowchart illustrating another method for obtaining equipment winding insulation fault monitoring results provided in this application embodiment. This example relates to an optional implementation of how to perform fault monitoring on each equipment pan winding based on the first and third luminous intensity of each pad to obtain fault monitoring results. Based on the above embodiment, S403 specifically includes the following steps:
[0085] S601, determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad.
[0086] S602, determine the ratio of the second difference corresponding to each pad to the corresponding first luminous brightness.
[0087] S603 performs fault monitoring on the pancake windings of each device based on the ratio and preset threshold to obtain fault monitoring results.
[0088] In this embodiment, a short-circuit fault is determined for each device's pie winding by comparing the ratio with a preset threshold. If the ratio corresponding to each pad is greater than the preset threshold, a short-circuit fault occurs in the device's pie winding around that pad; if the ratio corresponding to each pad is less than or equal to the preset threshold, no short-circuit fault occurs in the device's pie winding around that pad. The ratio S of each pad is specifically calculated using the following formula (2):
[0089] S=|a[i]-b'[i]| / a[i] (2)
[0090] The method provided in this embodiment determines a second difference between the first luminous brightness and the corresponding third luminous brightness of each pad, and determines the ratio of the second difference to the corresponding first luminous brightness of each pad. Then, based on the ratio and a preset threshold, fault monitoring is performed on each equipment winding to obtain the fault monitoring result. That is, the smaller the preset threshold value in this embodiment, the higher the sensitivity. Since a smaller preset threshold value indicates a smaller second difference between the first and third luminous brightness, the change in brightness of the pad corresponding to a short-circuit fault in the equipment winding is very small compared to the change in brightness when no short-circuit fault occurs. This means that even a small change in the luminous brightness of each pad can determine whether a short-circuit fault has occurred in each equipment winding.
[0091] Based on the above embodiments, referring to Figure 7 , Figure 7This is a flowchart illustrating another method for obtaining equipment winding insulation fault monitoring results provided in this application embodiment. This example relates to an optional implementation of how to perform fault monitoring on each equipment pancake winding based on a ratio and a preset threshold to obtain fault monitoring results. Based on the above embodiment, S603 specifically includes the following steps:
[0092] S701, determine the number of ratios that are greater than a preset threshold.
[0093] S702, based on the number of ratios, performs fault monitoring on the pancake windings of each device to obtain fault monitoring results.
[0094] In this embodiment, if the ratio is 1, a short circuit fault has occurred between the two adjacent wafer windings of the equipment where the pad is located. When a short circuit fault occurs between the two adjacent wafer windings, the potential difference between the two ends of the pad located between the two adjacent wafer windings is close to zero, and the brightness of the pad is significantly reduced.
[0095] If the number of ratios is greater than or equal to 3, then a short circuit fault has occurred between the windings of the multi-layer equipment. Since the overall voltage of the transformer remains basically unchanged after it is connected to the power grid, and the potential difference between the two ends of the pads between the windings of the equipment with the short circuit fault is close to zero, the potential difference between the two ends of the pads between the windings of the equipment without the short circuit fault increases. As a result, the brightness of the pads between the windings of the equipment without the short circuit fault increases, but the brightness of the pads between the windings of the equipment without the short circuit fault decreases or remains unchanged.
[0096] If the number of ratios equals 2, it is necessary to further determine whether the short circuit fault is between the three-panel windings around the two pads or between the turns of the windings in contact with both pads. Specifically, if the second difference between the first luminous intensity and the corresponding third luminous intensity of the two pads is greater than the first preset difference, then it is determined that the short circuit fault is between the three-panel windings around the two pads.
[0097] If the second difference between the first luminous brightness and the corresponding third luminous brightness of the two pads is greater than a second preset difference, it is determined that an inter-turn short circuit fault has occurred in the device winding that is in contact with both pads. When an inter-turn short circuit fault occurs in the device winding, the luminous brightness of both pads located above and below the device winding will change.
[0098] It should be noted that the first preset difference is greater than the second preset difference.
[0099] The method provided in this embodiment determines the number of ratios greater than a preset threshold; and performs fault monitoring on the pancake windings of each device based on the number of ratios to obtain fault monitoring results. This method is simple, easy to implement, and highly efficient.
[0100] For example, using the equipment winding insulation fault monitoring method provided in this application, for Figure 1 Fault monitoring is performed on the transformer windings, and the luminous intensity of 10 pads located between the 11 transformer windings is obtained, such as... Figure 8 As shown, Figure 8 This is a schematic diagram showing the light emission brightness curves of each pad provided in the embodiments of this application.
[0101] In curve 1, the initial luminance of each pad is roughly the same. In curve 2, the second luminance of pad 2 decreases sharply, while the second luminance of the other pads increases slightly, indicating an inter-panel short circuit fault between the second and third transformer pan windings above and below pad 2. In curve 3, the second luminance of pads 4-6 decreases significantly, while the second luminance of the other pads increases significantly, indicating an inter-panel short circuit fault in the fourth-seventh transformer pan winding. In curve 4, the second luminance of pads 8-9 decreases slightly, while the second luminance of the other pads increases slightly, indicating an inter-turn short circuit fault in the seventh transformer pan winding.
[0102] It should be noted that if an inter-turn short circuit fault occurs in the winding of the equipment, the brightness of the upper and lower pads of the winding will change. Similarly, if an inter-turn short circuit fault occurs in the winding of the equipment, the brightness of the pads placed on the winding will change.
[0103] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.
[0104] Based on the same inventive concept, this application also provides a device for monitoring equipment winding insulation faults to implement the aforementioned method. The solution provided by this device is similar to the solution described in the above method. Therefore, the specific limitations of one or more embodiments of the device for monitoring equipment winding insulation faults provided below can be found in the limitations of the fault monitoring method described above, and will not be repeated here.
[0105] In one embodiment, such as Figure 9 As shown, a device for monitoring winding insulation faults is provided. The device 900 includes: a first acquisition module 901, a second acquisition module 902, and a monitoring module 903, wherein:
[0106] The first acquisition module 901 is used to acquire the first luminous brightness of each pad disposed between adjacent device pan windings; the first luminous brightness is the luminous brightness of each pad in the normal operating state of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0107] The second acquisition module 902 is used to acquire the second luminous brightness of each pad after acquiring the first luminous brightness;
[0108] The monitoring module 903 is used to perform fault monitoring on the pancake winding of each device based on the first luminous brightness and the second luminous brightness of each pad to obtain the fault monitoring results.
[0109] The fault monitoring device provided in this embodiment acquires the first luminous intensity of each pad located between adjacent equipment windings during normal operation of the equipment windings, and then acquires the second luminous intensity of each pad. Based on the first and second luminous intensities of each pad, fault monitoring is performed on each equipment winding to obtain fault monitoring results. In other words, this embodiment performs fault monitoring on each equipment winding based on the first and second luminous intensities to obtain fault monitoring results, and then determines whether a short-circuit fault has occurred in each equipment winding based on the fault monitoring results. This allows for precise location of the equipment winding experiencing a short-circuit fault based on the changes in the first and second luminous intensities of the pads located between the equipment windings experiencing a short-circuit fault, thus improving the sensitivity of fault monitoring. For example, based on the changes in the first and second luminous intensities of pad number 2 located between the second and third transformer windings, it can be determined whether an inter-wound or inter-turn short-circuit fault has occurred in the second and third transformer windings.
[0110] In some embodiments, the monitoring module 903 includes:
[0111] The first determining unit is used to determine the first average value of the first luminous brightness and the second average value of the second luminous brightness of each pad;
[0112] The obtaining unit is used to correct the second luminous brightness of each pad according to the first average value and the second average value to obtain the third luminous brightness of each pad;
[0113] The first monitoring unit is used to perform fault monitoring on the pancake windings of each device based on the first and third luminous brightness of each pad to obtain fault monitoring results.
[0114] In some embodiments, the obtaining unit includes:
[0115] A sub-unit is defined to determine the first difference between the first average value and the second average value;
[0116] The correction subunit is used to correct the second luminous brightness of each pad according to the second luminous brightness and the first difference, so as to obtain the third luminous brightness of each pad.
[0117] In some embodiments, the correction subunit is specifically used to determine the summation result of the first difference and the second luminous brightness of each pad, and to use the summation result corresponding to each pad as the third luminous brightness of each pad.
[0118] In some embodiments, the monitoring module 903 includes:
[0119] The second determining unit is used to determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad;
[0120] The third determining unit is used to determine the ratio of the second difference corresponding to each pad to the corresponding first luminous brightness;
[0121] The second monitoring unit is used to perform fault monitoring on the pancake windings of each device according to the ratio and preset threshold to obtain fault monitoring results.
[0122] In some embodiments, the second monitoring unit is specifically used to determine the number of ratios greater than a preset threshold; and to perform fault monitoring on the pancake winding of each device based on the number of ratios to obtain fault monitoring results.
[0123] Each module in the aforementioned fault monitoring device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in the processor of a computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the corresponding operations of each module.
[0124] In one embodiment, a computer device is provided, which may be a terminal, and its internal structure diagram may be as follows:Figure 10 As shown, the computer device includes a processor, memory, communication interface, display screen, and input devices connected via a system bus. The processor provides computing and control capabilities. The memory includes non-volatile storage media and internal memory. The non-volatile storage media stores the operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage media. The communication interface is used for wired or wireless communication with external terminals; wireless communication can be achieved through Wi-Fi, mobile cellular networks, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it implements a fault monitoring method. The display screen can be an LCD screen or an e-ink screen. The input devices can be a touch layer covering the display screen, buttons, a trackball, or a touchpad mounted on the computer device casing, or an external keyboard, touchpad, or mouse.
[0125] Those skilled in the art will understand that Figure 10 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.
[0126] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:
[0127] Obtain the first luminous brightness of each pad located between adjacent equipment pan windings; the first luminous brightness is the luminous brightness of each pad under normal operating conditions of each equipment pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0128] After obtaining the first luminous intensity, the second luminous intensity of each pad is obtained;
[0129] Based on the first and second luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0130] In one embodiment, the processor, when executing a computer program, also performs the following steps:
[0131] Determine the first average value of the first luminous intensity and the second average value of the second luminous intensity of each pad;
[0132] The second luminous brightness of each pad is corrected based on the first average value and the second average value to obtain the third luminous brightness of each pad;
[0133] Based on the first and third luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0134] In one embodiment, the processor, when executing a computer program, also performs the following steps:
[0135] Determine the first difference between the first average and the second average;
[0136] Based on the second luminous intensity and the first difference of each pad, the second luminous intensity of each pad is corrected to obtain the third luminous intensity of each pad.
[0137] In one embodiment, the processor, when executing a computer program, also performs the following steps:
[0138] Determine the sum of the first difference and the second luminous intensity of each pad, and use the sum of the values corresponding to each pad as the third luminous intensity of each pad.
[0139] In one embodiment, the processor, when executing a computer program, also performs the following steps:
[0140] Determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad;
[0141] Determine the ratio of the second difference to the corresponding first luminous brightness for each pad;
[0142] Based on the ratio and preset threshold, fault monitoring is performed on the pancake windings of each device to obtain fault monitoring results.
[0143] In one embodiment, the processor, when executing a computer program, also performs the following steps:
[0144] Determine the number of ratios that are greater than a preset threshold;
[0145] Fault monitoring results are obtained by analyzing the number of ratios for each device's disc winding.
[0146] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:
[0147] Obtain the first luminous brightness of each pad located between adjacent equipment pan windings; the first luminous brightness is the luminous brightness of each pad under normal operating conditions of each equipment pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0148] After obtaining the first luminous intensity, the second luminous intensity of each pad is obtained;
[0149] Based on the first and second luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0150] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0151] Determine the first average value of the first luminous intensity and the second average value of the second luminous intensity of each pad;
[0152] The second luminous brightness of each pad is corrected based on the first average value and the second average value to obtain the third luminous brightness of each pad;
[0153] Based on the first and third luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0154] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0155] Determine the first difference between the first average and the second average;
[0156] Based on the second luminous intensity and the first difference of each pad, the second luminous intensity of each pad is corrected to obtain the third luminous intensity of each pad.
[0157] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0158] Determine the sum of the first difference and the second luminous intensity of each pad, and use the sum of the values corresponding to each pad as the third luminous intensity of each pad.
[0159] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0160] Determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad;
[0161] Determine the ratio of the second difference to the corresponding first luminous brightness for each pad;
[0162] Based on the ratio and preset threshold, fault monitoring is performed on the pancake windings of each device to obtain fault monitoring results.
[0163] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0164] Determine the number of ratios that are greater than a preset threshold;
[0165] Fault monitoring results are obtained by analyzing the number of ratios for each device's disc winding.
[0166] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:
[0167] Obtain the first luminous brightness of each pad located between adjacent equipment pan windings; the first luminous brightness is the luminous brightness of each pad under normal operating conditions of each equipment pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material;
[0168] After obtaining the first luminous intensity, the second luminous intensity of each pad is obtained;
[0169] Based on the first and second luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0170] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0171] Determine the first average value of the first luminous intensity and the second average value of the second luminous intensity of each pad;
[0172] The second luminous brightness of each pad is corrected based on the first average value and the second average value to obtain the third luminous brightness of each pad;
[0173] Based on the first and third luminous brightness of each pad, fault monitoring is performed on the pancake winding of each device to obtain the fault monitoring results.
[0174] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0175] Determine the first difference between the first average and the second average;
[0176] Based on the second luminous intensity and the first difference of each pad, the second luminous intensity of each pad is corrected to obtain the third luminous intensity of each pad.
[0177] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0178] Determine the sum of the first difference and the second luminous intensity of each pad, and use the sum of the values corresponding to each pad as the third luminous intensity of each pad.
[0179] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0180] Determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each pad;
[0181] Determine the ratio of the second difference to the corresponding first luminous brightness for each pad;
[0182] Based on the ratio and preset threshold, fault monitoring is performed on the pancake windings of each device to obtain fault monitoring results.
[0183] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:
[0184] Determine the number of ratios that are greater than a preset threshold;
[0185] Fault monitoring results are obtained by analyzing the number of ratios for each device's disc winding.
[0186] It should be noted that the user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, data stored, data displayed, etc.) involved in this application are all information and data authorized by the user or fully authorized by all parties.
[0187] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.
[0188] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0189] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.
Claims
1. A method for monitoring insulation faults in equipment windings, characterized in that, The method includes: The first luminous brightness of each pad disposed between adjacent device pan windings is obtained; the first luminous brightness is the luminous brightness of each pad under normal operating conditions of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material; After obtaining the first luminous intensity, the second luminous intensity of each of the pads is obtained; Determine the first average value of the first luminous intensity and the second average value of the second luminous intensity of each of the aforementioned pads; Determine a first difference between the first average value and the second average value; Determine the summation result of the first difference and the second luminous brightness of each of the pads, and take the summation result corresponding to each of the pads as the third luminous brightness of each of the pads; Determine the second difference between the first luminous brightness and the corresponding third luminous brightness of each of the pads; Determine the ratio of the second difference corresponding to each of the pads to the corresponding first luminous brightness; Based on the ratio and the preset threshold, fault monitoring is performed on each of the device's disc windings to obtain fault monitoring results.
2. The method according to claim 1, characterized in that, The step of performing fault monitoring on each of the device's disc windings based on the ratio and a preset threshold to obtain fault monitoring results includes: Determine the number of ratios that are greater than the preset threshold; Fault monitoring is performed on each of the device's disc windings based on the number of ratios to obtain fault monitoring results.
3. A device for monitoring insulation faults in equipment windings, characterized in that, The device includes: The first acquisition module is used to acquire the first luminous brightness of each pad disposed between adjacent device pan windings; the first luminous brightness is the luminous brightness of each pad in the normal operating state of each device pan winding; the surface of each pad is sprayed with electroluminescent material and / or each pad is doped with electroluminescent material; The second acquisition module is used to acquire the second luminous brightness of each of the pads after acquiring the first luminous brightness; The monitoring module is used to determine a first average value of the first luminous intensity and a second average value of the second luminous intensity of each of the pads; determine a first difference between the first average value and the second average value; determine the summation result of the first difference and the second luminous intensity of each of the pads, and take the summation result corresponding to each of the pads as the third luminous intensity of each of the pads; determine a second difference between the first luminous intensity of each of the pads and the corresponding third luminous intensity; determine the ratio of the second difference corresponding to each of the pads to the corresponding first luminous intensity; and perform fault monitoring on each of the device pancake windings according to the ratio and a preset threshold to obtain fault monitoring results.
4. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 2.
5. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 2.
6. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 2.