Image sensor package and camera device including the same

Abstract

A camera device according to an embodiment of the present invention includes a printed circuit board, a heat dissipation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat dissipation layer, wherein the printed circuit board has a plurality of through holes passing through the printed circuit board from the first surface of the printed circuit board to a second surface of the printed circuit board opposite the first surface, and the plurality of through holes are in contact with the heat dissipation layer.

Description

Technical Field

[0001] The present invention relates to a camera device, and more particularly, to an image sensor package and a camera device including the image sensor package. Background Technology

[0002] A camera is a device that captures images or moving images of an object and is mounted in portable devices, drones, vehicles, and other similar devices. The trend towards full-screen displays and narrow bezels, ultra-high resolution, multiple cameras, zoom capabilities, and 5G modules in portable devices further necessitates miniaturization and high performance of camera devices.

[0003] Typically, in a camera device installed in a portable device or similar device, an image sensor can be mounted on a printed circuit board, and the image sensor and the printed circuit board can be wire-connected. An infrared (IR) filter can be mounted above the image sensor and spaced at a predetermined distance from the image sensor, and a lens assembly can be positioned at a predetermined distance from the IR filter.

[0004] Therefore, the total thickness from the printed circuit board to the IR filter is 1000 μm or more, which may severely limit the miniaturization of the camera device.

[0005] Meanwhile, given the trend towards higher resolution and higher speed in video frames, image sensors consume more power and generate more heat compared to traditional image sensors. Therefore, a technology is needed to effectively dissipate the heat generated by image sensors to the outside. Summary of the Invention

[0006] Technical issues

[0007] The present invention aims to provide an image sensor package for a camera device that can be implemented in a small size and has excellent thermal radiation performance.

[0008] Technical solution

[0009] One aspect of the present invention provides a camera device including an image sensor package and a lens assembly disposed on the image sensor package, wherein the image sensor package includes a printed circuit board, a heat dissipation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat dissipation layer, wherein a plurality of through holes are formed in the printed circuit board from the first surface through the printed circuit board to a second surface which is a surface opposite to the first surface, and the plurality of through holes are in contact with the heat dissipation layer.

[0010] Multiple through holes can be filled with metal.

[0011] Multiple through holes can be formed to extend into the heat dissipation layer.

[0012] The heat dissipation layer may include an insulating substrate containing metal oxides.

[0013] The metal oxide can be contained in the insulating substrate in an amount of 90 wt% or more, based on the total weight.

[0014] The metal oxide can be an oxide of at least one of Al and Mg.

[0015] The heat dissipation layer can further include a thermal interface material disposed between the insulating substrate and the image sensor.

[0016] The heat dissipation layer can include a first metal layer disposed on the printed circuit board, a thermal interface material disposed on the first metal layer, and a second metal layer disposed on the thermal interface material, wherein the first metal layer can be in contact with the printed circuit board, the second metal layer can be in contact with the image sensor, and a thickness of the first metal layer can be greater than a thickness of the second metal layer.

[0017] The thermal interface material can be disposed on an upper surface of the first metal layer, a side surface of the first metal layer, and an upper surface of the printed circuit board.

[0018] The thermal interface material can be further disposed on a lower surface of the second metal layer and a side surface of the second metal layer.

[0019] The thermal interface material can be further disposed on a side surface of the image sensor.

[0020] A wire of the image sensor can be connected to a circuit pattern disposed on the heat dissipation layer.

[0021] An area of the heat dissipation layer can be greater than an area of the image sensor and less than an area of the printed circuit board.

[0022] The printed circuit board can include a rigid-flex (RF) printed circuit board including a rigid area and a flexible area, and the image sensor is disposed in the rigid area of the printed circuit board.

[0023] Another aspect of the present application provides an image sensor package including an insulating substrate including a metal oxide and an image sensor disposed on a first surface of the insulating substrate, wherein the insulating substrate includes a plurality of vias passing through the insulating substrate from the first surface to a second surface which is a surface opposite to the first surface, and at least some of the plurality of vias are electrical connection paths of the image sensor.

[0024] The image sensor package can include a plurality of first metal pads disposed on the first surface of the insulating substrate and a plurality of second metal pads disposed on the second surface of the insulating substrate, wherein the plurality of first metal pads and the plurality of second metal pads can be disposed to surround the plurality of vias of the insulating substrate.

[0025] The conductive wire connected to the image sensor can be connected to a portion of the plurality of first metal pads, and at least a portion of the plurality of through-holes can be filled with a conductive material.

[0026] The image sensor package can further include a solder resist layer disposed between the insulating substrate and the image sensor, wherein the solder resist layer can be disposed to cover a portion of the plurality of first metal pads.

[0027] Yet another aspect of the present disclosure provides an image sensor package including a printed circuit board, an insulating substrate disposed on the printed circuit board and including a metal oxide, and an image sensor disposed on a first surface of the insulating substrate, wherein the insulating substrate includes a plurality of through-holes passing through the insulating substrate from the first surface to a second surface as a surface opposite to the first surface, and at least a portion of the plurality of through-holes are electrical connection paths of the image sensor.

[0028] The image sensor package can include a plurality of first metal pads disposed on the first surface of the insulating substrate and a plurality of second metal pads disposed on the second surface of the insulating substrate, wherein the plurality of first metal pads and the plurality of second metal pads can be disposed to surround the plurality of through-holes of the insulating substrate.

[0029] A plurality of third metal pads can be disposed on the printed circuit board, and at least a portion of the plurality of second metal pads can be connected to at least a portion of the plurality of third metal pads.

[0030] A solder layer can be disposed between at least a portion of the plurality of second metal pads and at least a portion of the plurality of third metal pads.

[0031] A plurality of through-holes can be formed in the printed circuit board passing through the printed circuit board from a first surface on which the plurality of third metal pads are formed to a second surface as a surface opposite to the first surface of the printed circuit board, and at least a portion of the plurality of through-holes can be connected to at least a portion of the plurality of third metal pads.

[0032] A cavity can be formed in the printed circuit board, and the insulating substrate and the image sensor can be accommodated in the cavity.

[0033] The image sensor package can further include a molding layer fixing the printed circuit board, the insulating substrate, and the image sensor in the cavity.

[0034] The image sensor package can further include a light filtering layer disposed on the molding layer.

[0035] The printed circuit board can be a rigid-flexible (RF) printed circuit board including a rigid area and a flexible area, and the image sensor can be disposed in the rigid area of the printed circuit board.

[0036] Still another aspect of the present application provides a camera device including an image sensor package and a lens assembly disposed on the image sensor package, wherein the image sensor package includes a printed circuit board, an insulating substrate disposed on the printed circuit board and containing a metal oxide, and an image sensor disposed on a first surface of the insulating substrate, the insulating substrate including a plurality of vias passing through the insulating substrate from the first surface to a second surface which is a surface opposite to the first surface, and at least some of the plurality of vias being an electrical connection path of the image sensor.

[0037] Advantageous Effects

[0038] According to embodiments of the present application, a camera device having a simple structure, a simple manufacturing process, and a small size can be obtained. In addition, according to embodiments of the present application, an image sensor package supporting not only high performance but also excellent heat radiation performance and a camera device including the same can be obtained. BRIEF DESCRIPTION OF DRAWINGS

[0039] Figure 1 is a cross-sectional view illustrating an example of a camera device.

[0040] Figure 2 and Figure 3 is a cross-sectional view illustrating an image sensor package according to an embodiment of the present application.

[0041] Figure 4a and Figure 4b is a cross-sectional view illustrating a portion of an image sensor package according to an embodiment of the present application.

[0042] Figure 5 is a cross-sectional view illustrating a portion of an image sensor package according to another embodiment of the present application.

[0043] Figure 6 is an enlarged view illustrating a portion of Figure 5 .

[0044] Figure 7 is a cross-sectional view illustrating an image sensor package according to another embodiment of the present application.

[0045] Figure 8 is a perspective view illustrating an image sensor included in the image sensor package of Figure 7 .

[0046] Figure 9 is a perspective view illustrating an image sensor included in the image sensor package of Figure 7a top view of a heat dissipation layer included in an image sensor package.

[0047] Figure 10 is a sectional view showing an image sensor package according to another embodiment of the present application.

[0048] Figure 11a 、 Figure 11b 、 Figure 11c and Figure 11d are sectional views showing a part of an image sensor package according to other embodiments of the present application. DETAILED DESCRIPTION

[0049] Hereinafter, specific embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0050] However, the technical spirit of the present application is not limited to some embodiments to be described and can be implemented in various different forms, and at least one or more components of the embodiments can be selectively combined, replaced, and used within the scope of the technical spirit.

[0051] Further, unless explicitly and specifically defined otherwise in the context, all terms used herein, including technical terms and scientific terms, can be interpreted according to the meaning commonly understood by one of ordinary skill in the art and the meaning of terms commonly used in the art will be interpreted in the context of the relevant technology.

[0052] Further, the terms used in the embodiments of the present application are considered only in the sense of illustration, not limitation of the present application.

[0053] In the present specification, the singular form includes the plural form, and in the case of describing "at least one of A, B, and C (or one or more of A, B, and C)," it can include at least one of all possible combinations of A, B, and C.

[0054] Further, in the description of components of the present application, terms such as "first," "second," "A," "B," "(a)," and "(b)" can be used.

[0055] The terms are used only to distinguish one element from another element, and the nature, order, etc. of the elements are not limited by the terms.

[0056] Further, it should be understood that when an element is referred to as being "connected" or "coupled" to another element, such a description can include the case where the element is directly connected or coupled to another element, and the case where the element is connected or coupled to another element with yet another element interposed therebetween.

[0057] Also, when any one element is described as being formed or disposed "on" or "under" another element, such description includes a case where the two elements are formed or disposed in direct contact with each other as well as a case where one or more other elements are interposed therebetween. Also, when one element is described as being formed "on or under" another element, such description can include a case where the one element is formed on the upper side or the lower side with respect to the other element.

[0058] Figure 1 is a cross-sectional view showing an example of a camera device.

[0059] Referring to Figure 1 The camera device 10 can include a printed circuit board 12, an image sensor 14 disposed on the printed circuit board 12, a filter layer 16 disposed above the image sensor 14, and a lens assembly 18 disposed above the filter layer 16. The printed circuit board 12, the image sensor 14, the filter layer 16, and the lens assembly 18 can be accommodated in a housing 20.

[0060] The printed circuit board 12 can include a flexible printed circuit board (FPCB), a rigid flexible printed circuit (RFPCB), or a ceramic printed circuit board.

[0061] The image sensor 14 can be disposed on the printed circuit board 12 and joined with the printed circuit board 12 using a wire 22. The image sensor 14 is a sensor that collects incident light to generate an image signal, and a semiconductor element used in the image sensor 14 can be formed as a charge-coupled device (CCD) sensor or a complementary metal-oxide semiconductor (CMOS) sensor, and can be a semiconductor element that captures an image of a person or an object and outputs an electrical signal.

[0062] The image sensor 14 can include a plurality of pixels arranged in a matrix form. Each pixel can include a photoelectric conversion element and at least one transistor for sequentially outputting a voltage level of the photoelectric conversion element. An area in which the plurality of pixels are disposed can be an active area of the image sensor 14. The active area of the image sensor 14 can be used interchangeably with a light-receiving portion.

[0063] The filter layer 16 can be formed of a glass substrate, and the glass substrate can be a transparent or translucent substrate formed of a glass material. The filter layer 16 can block or transmit light having a predetermined wavelength. As an example, the filter layer 16 can be an IR blocking layer that blocks infrared light.

[0064] In general, the filter layer 16 can be disposed to be spaced apart from the image sensor 14. As shown, the filter layer 16 can be joined to the housing 20.

[0065] Alternatively, although not shown in the drawings, the image sensor 14 and the filter layer 16 can be joined by an adhesive member.

[0066] The lens assembly 18 can include at least one lens having a predetermined field of view and focal length, refract incident light, and transmit the refracted light to the image sensor 14. The lens assembly 18 can be moved by an actuator (not shown). When the lens assembly 18 includes a plurality of lenses, an optical system can be formed by arranging the lenses based on a central axis. In this case, the central axis can be the same as an optical axis of the optical system. The lens assembly 18 can be a lens having a fixed focal length or a variable lens whose focal point is adjustable.

[0067] The housing 20 can be disposed at an upper edge of the printed circuit board 12. The housing 20 can include a first housing 20a and a second housing 20b. The first housing 20a can accommodate an image sensor package including the image sensor 14 and the filter layer 16, and the second housing 20b can include the lens assembly 18. A lower end of the first housing 20a can be joined and bonded to the printed circuit board 12 by an adhesive member. In this case, although not shown in the housing 20, a lens holder supporting the lens can be integrally formed with the housing 20.

[0068] In order to describe a general example of the structure and operating principle of the camera device according to an embodiment of the present application, the description of Figure 1 and the description with reference to Figure 1 have been described. Figure 1 and the description with reference to Figure 1 may be applied to the camera device according to an embodiment of the present application, but this embodiment of the present application is not limited to the detailed structure shown in Figure 1

[0069] According to one embodiment of the present application, a heat dissipation layer is disposed between the printed circuit board and the image sensor, and heat generated by the image sensor is radiated through the heat dissipation layer and the printed circuit board.

[0070] Figure 2 and Figure 3 are sectional views showing an image sensor package according to one embodiment of the present application.

[0071] Referring to Figure 2 and Figure 3 , the image sensor package 100 according to one embodiment of the present application includes a printed circuit board 110, an image sensor 120 disposed above the printed circuit board 120, and a heat dissipation layer 130 disposed between the printed circuit board 110 and the image sensor 120.

[0072] In this case, the image sensor 120 can be disposed above the printed circuit board 110 and joined with the printed circuit board 110 using a wire 160. The same description as the image sensor 14 of Figure 1 may be applied to the image sensor 120.​

[0073] Although not shown in the figure, the image sensor package 100 may also include a filter layer disposed above the image sensor 120. For example... Figure 1 As shown, the filter layer can be configured to be spaced apart from the image sensor 120 by a support member (e.g., a housing) supporting the filter layer, configured to be in direct contact with the image sensor 120, or configured to be in contact with the image sensor 110 through a bonding layer.

[0074] The image sensor package 100 according to an embodiment of the present invention may further include a molding layer 150, which molds the image sensor 120 and the conductive wires bonded to the image sensor 120. In this case, the molding layer 150 may be configured to extend from the non-active region of the image sensor 120 to the printed circuit board 110 through the heat dissipation layer 130. Therefore, compared with the chip-on-board (COB) structure, the thickness of the image sensor package 100 can be reduced, the conductive wires 160 bonded to the image sensor 120 can be stably fixed, and the assembly process and structure of the image sensor package 100 can be simplified. Furthermore, since the molding layer 150 molds the conductive wires 160 bonded to the image sensor 120, conductive wire bonding failures can be minimized, and the heat generated by the image sensor 120 can also be radiated to the outside through the molding layer 150.

[0075] According to an embodiment of the present invention, the first surface 132 of the heat dissipation layer 130 contacts the first surface 112 of the printed circuit board 110, and the second surface 134 of the image sensor 120 is configured to contact the heat dissipation layer 130. In this case, the thermal conductivity of the heat dissipation layer 130 can be higher than that of the printed circuit board 110.

[0076] Furthermore, according to embodiments of the present invention, a plurality of through-holes 116 can be formed in the printed circuit board 110, extending from the first surface 112 through the printed circuit board 110 to a second surface 114, which is the surface opposite to the first surface 112, and the plurality of through-holes 116 can contact the heat dissipation layer 130. Therefore, the heat generated by the image sensor 120 can be transferred to the heat dissipation layer 130, and the heat transferred to the heat dissipation layer 130 can be radiated to the outside through the plurality of through-holes 116 formed in the printed circuit board 110.

[0077] In this configuration, the vias 116 can be filled with a thermally conductive material. As an example, the thermally conductive material can be a thermally conductive metal including at least one of gold (Au), silver (Ag), copper (Cu), and aluminum (Al). Since the thermal conductivity of the vias 116 formed in the printed circuit board 110 is higher than that of the printed circuit board 110, the heat generated by the image sensor 120 and transferred to the heat dissipation layer 130 can be effectively radiated to the outside through the vias 116 formed in the printed circuit board 110.

[0078] According to an embodiment of the present invention, the plurality of vias 116 may also be formed to extend into the heat dissipation layer 130. That is, a plurality of vias 136 may also be formed in the heat dissipation layer 130, and the plurality of vias 136 may be filled with a thermally conductive material having a thermal conductivity higher than that of the heat dissipation layer 130. Therefore, the heat generated by the image sensor 120 can be more effectively radiated to the outside through the plurality of vias 136 formed in the heat dissipation layer 130 and the plurality of vias 116 formed in the printed circuit board 110.

[0079] According to an embodiment of the present invention, the area of ​​the heat dissipation layer 130 can be larger than the area of ​​the image sensor 120. Therefore, the heat generated by the image sensor 120 can be effectively radiated through the heat dissipation layer 130, and the image sensor 120 can be easily mounted on the heat dissipation layer 130.

[0080] At the same time, such as Figure 2 As shown, the wires 160 connected to the image sensor 120 can be directly connected to the printed circuit board 110. For this purpose, the area of ​​the heat dissipation layer 130 can be smaller than the area of ​​the printed circuit board 110, and the wires 160 connected to the image sensor 120 can be connected to the circuit pattern 118 formed in the area of ​​the first surface 112 of the printed circuit board 120 where the heat dissipation layer 130 is not disposed.

[0081] Or, such as Figure 3 As shown, the wires 160 connected to the image sensor 120 can also be connected to the printed circuit board 110 through the heat dissipation layer 130. For this purpose, the wires 160 connected to the image sensor 120 can be connected to a circuit pattern 138 formed in a region of the second surface 134 of the heat dissipation layer 130 where the image sensor 120 is not disposed, and the circuit pattern 138 can be electrically connected to the printed circuit board 110 through through-holes (not shown) formed in the heat dissipation layer 130.

[0082] The heat dissipation layer included in the image sensor package according to embodiments of the present invention will be described in more detail below.

[0083] Figure 4a and Figure 4b This is a cross-sectional view showing a portion of an image sensor package according to an embodiment of the present invention.

[0084] Reference Figure 4a and Figure 4b A heat dissipation layer 130 is disposed on a printed circuit board 110, and an image sensor 120 is disposed on the heat dissipation layer 130. For example... Figure 2 and Figure 3 As shown, a plurality of vias 116 can be formed in the printed circuit board 110, and the plurality of vias 116 can be formed to extend into the heat dissipation layer 130. That is, a plurality of vias 136 connected to the plurality of vias 116 can be formed in the heat dissipation layer 130, and the plurality of vias 116 and 136 can be filled with a thermally conductive material.

[0085] In addition, such as Figure 4a As shown, the wire 160 connected to the image sensor 120 can be directly connected to the circuit pattern 118 of the printed circuit board 110, or as... Figure 4b As shown, the wire 160 connected to the image sensor 120 can be connected to the printed circuit board 110 through the circuit pattern 138 of the heat dissipation layer 130.

[0086] Meanwhile, according to an embodiment of the present invention, the heat dissipation layer 130 may include an insulating substrate 400 comprising a metal oxide. Since the thermal conductivity of the insulating substrate 400 comprising a metal oxide is higher than that of the printed circuit board 110, the heat generated by the image sensor 120 can be effectively transferred to the printed circuit board 110 through the heat dissipation layer 130. In this case, the insulating substrate 400 comprising a metal oxide can be formed on the printed circuit board 110 using a high-temperature co-fired ceramic (HTCC) process or a low-temperature co-fired ceramic (LTCC) process. The HTCC process is a sintering process at a temperature of 1300°C or higher, while the LTCC process is a sintering process at a temperature of 800°C to 1000°C. Therefore, the printed circuit board 110 and the insulating substrate 400 comprising a metal oxide can be bonded with high bonding strength, and the heat transfer efficiency at the interface between the insulating substrate 400 and the printed circuit board 110 can be very high.

[0087] In this configuration, the metal oxide can be included in the insulating substrate in an amount of 90 wt% or more based on the total weight, and the metal oxide can be an oxide of at least one of Al and Mg. As an example, the metal oxide may include at least one of Al₂O₃ and MgO. Therefore, due to the high thermal conductivity of the insulating substrate 400, the heat generated by the image sensor 120 can be effectively radiated to the outside through the insulating substrate 400.

[0088] In this case, according to an embodiment of the present application, the heat dissipation layer 130 can further include a thermal interface material 410 disposed between the insulating substrate 400 containing the metal oxide and the image sensor 120. Two surfaces of the thermal interface material 410 can be in direct contact with the insulating substrate 400 and the image sensor 120 and transfer heat generated by the image sensor 120 to the insulating substrate 400. In this case, the thermal interface material 410 can be a resin composite material having heat transfer and bonding properties, and include a silicon-based resin or an epoxy-based resin and an inorganic filler. As described above, when the thermal interface material 410 is further disposed between the insulating substrate 400 and the image sensor 120, the insulating substrate 400 and the image sensor 120 can be bonded with high bonding strength, and heat generated by the image sensor 120 can be effectively transferred to the insulating substrate 400.

[0089] Figure 5 is a cross-sectional view illustrating a portion of an image sensor package according to another embodiment of the present application, Figure 6 is an enlarged view illustrating a portion of Figure 5 will be omitted. Figure 1 to the contents described with reference to FIG. 4.

[0090] Referring to Figure 5 and Figure 6 , the heat dissipation layer 130 can include a first metal layer 500 disposed on the printed circuit board 110.

[0091] In this case, the first metal layer 500 can be printed with the circuit pattern 118 of the printed circuit board 110, and can be a dummy metal pattern not connected to the circuit pattern 118. As described above, a plurality of vias 116 filled with a thermally conductive material can be formed in the printed circuit board 110, and the plurality of vias 116 can be in contact with the first metal layer 500. Accordingly, heat of the first metal layer 500 can be radiated to the outside through the plurality of vias 116, and the first metal layer 500 can also be referred to as a heat radiation pad or a heat radiation pattern.

[0092] In this case, the material and thickness of the first metal layer 500 can be the same as those of the circuit pattern 118 on the printed circuit board 110. Accordingly, since the first metal layer 500 can be printed with the circuit pattern 118 when the circuit pattern 118 is printed on the printed circuit board 110, an additional process for forming a heat dissipation pad can not be required.

[0093] Meanwhile, the heat dissipation layer 130 may also include a thermal interface material 510 disposed on the first metal layer 500. In this case, the thermal interface material 510 may be a resin composite material with heat transfer and bonding properties, and includes a silicone-based resin or an epoxy-based resin and inorganic fillers. As described above, when the thermal interface material 510 is further disposed between the first metal layer 500 and the image sensor 120, the first metal layer 500 and the image sensor 100 can be bonded with high bonding strength, and the heat generated by the image sensor 120 can be effectively transferred to the first metal layer 500.

[0094] Furthermore, the heat dissipation layer 130 may also include a second metal layer 520 disposed on the thermal interface material 510. In this case, both surfaces of the thermal interface material 510 can be in direct contact with the first metal layer 500 and the second metal layer 520, and both surfaces of the second metal layer 520 can be in direct contact with the thermal interface material 510 and the image sensor 120. For this purpose, one surface of the image sensor 120 may be coated with the second metal layer 520, and the thickness of the first metal layer 500 may be greater than the thickness of the second metal layer 520. As an example, the thickness of the first metal layer 500 may be in the range of 10 μm to 20 μm, and the thickness of the second metal layer 520 may be in the range of 0.1 μm to 2 μm, preferably in the range of 0.1 μm to 0.5 μm. As described above, when the heat dissipation layer 130 further includes a second metal layer 520 coated on the image sensor 120, the heat from the image sensor 120 can be transferred more effectively to the thermal interface material 510 and the first metal layer 500.

[0095] In this configuration, the thermal interface material 510 can be configured to cover both the upper and side surfaces of the first metal layer 500. Therefore, the thermal interface material 510 can also be disposed on the upper surface of the printed circuit board 110. Consequently, since heat is transferred to the printed circuit board 110 not only through the first metal layer 500 but also through the thermal interface material 510, the thermal radiation performance of the image sensor package 100 can be improved. Furthermore, the interface between the first metal layer 500 and the printed circuit board 110 can be bonded through the thermal interface material 510, further enhancing the bonding strength between the first metal layer 500 and the printed circuit board 110.

[0096] Furthermore, the thermal interface material 510 can be configured to cover the lower surface of the second metal layer 520 and the side surface of the second metal layer 520, and further disposed on the side surface of the image sensor 120. Therefore, since the heat of the image sensor 120 can be directly transferred not only to the second metal layer 520, but also directly to the thermal interface material 510, the thermal radiation performance of the image sensor package 100 can be further improved.

[0097] Meanwhile, according to another embodiment of the present application, a plurality of through-holes can be formed in a heat dissipation layer on which an image sensor is disposed, and a portion of the plurality of through-holes can be an electrical connection path of the image sensor.

[0098] Figure 7 is a cross-sectional view illustrating an image sensor package according to another embodiment of the present application, Figure 8 is a perspective view illustrating an image sensor included in the image sensor package of Figure 7 , Figure 9 is a top view illustrating a heat dissipation layer included in the image sensor package of Figure 7 , Figure 10 is a cross-sectional view illustrating an image sensor package according to another embodiment of the present application.

[0099] Referring to Figures 7 to 10 , an image sensor package 100 according to another embodiment of the present application includes a printed circuit board 110, an image sensor 120 disposed above the printed circuit board 120, a heat dissipation layer 130 disposed between the printed circuit board 110 and the image sensor 120, and a filter layer 140 disposed above the image sensor 120. The heat dissipation layer 130 is an insulating substrate including a metal oxide. Thus, the heat dissipation layer 130 can be referred to as an insulating substrate. As for the heat dissipation layer 130, the contents described with reference to Figures 2 to 6 may be applied to the heat dissipation layer 130. Thus, as for the heat dissipation layer 130, repetitive description of the same contents as those described with reference to Figures 2 to 6 will be omitted.

[0100] In this case, the description of the image sensor 14 and the filter layer 16 of Figure 1 may be applied to the image sensor 120 and the filter layer 140.

[0101] As shown in Figure 8 , the image sensor 120 includes an active area 122 and a non-active area 124 surrounding the active area 122. As described above, the active area 122 of the image sensor 122 can be a light-receiving portion on which a plurality of pixels are disposed, and a pad 126 for bonding can be formed in the non-active area 122.

[0102] The image sensor package 100 according to an embodiment of the present application can further include a printed circuit board 110, an image sensor 120, wires connected to the image sensor 120, and a molding layer 150 fixing a filter layer 140. Accordingly, compared to a chip on board (COB) structure, the thickness of the image sensor package 100 can be reduced, the wires bonded to the image sensor 120 can be stably fixed, and the assembly process and structure of the image sensor package 100 can be simplified. In addition, since the molding layer 150 molds the wires bonded to the image sensor 120, wire bonding failure can be minimized, and heat generated by the image sensor 120 can also be radiated to the outside through the molding layer 150.

[0103] According to an embodiment of the present application, the heat dissipation layer 130 includes a plurality of through-holes 136 passing through the heat dissipation layer 130 from the first surface 132 to the second surface 134 which is the surface opposite to the first surface 132. In addition, at least some of the plurality of through-holes 136 can be an electrical connection path of the image sensor 120. Accordingly, even when the wires 160 connected to the image sensor 120 are not directly connected to the printed circuit board 110, the wires 160 can be connected to the printed circuit board 110 through the heat dissipation layer 130. In particular, when the plurality of through-holes 136 which are the electrical connection paths between the image sensor 120 and the printed circuit board 110 are formed in the direction in which the plurality of through-holes 136 pass through both surfaces 132 and 134 of the heat dissipation layer 130, the heat dissipation layer 130 and the image sensor 120 are manufactured as a module, and the module is easily bonded to the printed circuit board 110.

[0104] More specifically, referring to Figures 7 to 9In this case, the plurality of first metal pads 200 and the plurality of second metal pads 210 can be disposed to surround the plurality of through holes 136. That is, a pair of the first metal pad 200 and the second metal pad 210 can be disposed to correspond to one through hole 136. Hereinafter, one through hole 136 and a pair of the first metal pad 200 and the second metal pad 210 are referred to as one through hole group. According to an embodiment of the present application, a plurality of through hole groups can be formed in the heat dissipation layer 130. As described above, at least a part of the plurality of through hole groups 136a and 200a can be an electrical connection path between the image sensor 120 and the printed circuit board 110. At least a part of the plurality of through hole groups 136a and 200a, which are the electrical connection path between the image sensor 120 and the printed circuit board 110, can be disposed to correspond to the pads 126 to be wire-bonded with the image sensor 120. That is, at least a part of the plurality of through hole groups 136a and 200a, which are the electrical connection path between the image sensor 120 and the printed circuit board 110, can be disposed along the edge of the heat dissipation layer 130 to correspond to the number and interval of the pads 126 of the image sensor 120. Alternatively, at least a part of the plurality of through hole groups, which are the electrical connection path between the image sensor 120 and the printed circuit board 110, can be connected to the wire 160 connected with the image sensor 120 through a conductive path. In this case, the connection through the conductive path can include both a direct connection to the wire 160 connected with the image sensor 120 and an indirect connection through a metal pattern formed on the second surface 134 of the heat dissipation layer 130. As an example, as shown in FIG. 17, a metal pad 139 to be connected to the wire 160 can be disposed on the second surface 134 of the heat dissipation layer 130, and the metal pad 139 can be connected to the through hole group along the circuit pattern. In this case, at least a part of the plurality of through holes 136 can be filled with a conductive material. As an example, the conductive material can be at least one of Au, Ag, Cu, an alloy thereof, and a conductive resin including the same. Figure 9

[0105] ​According to an embodiment of the present application, the remaining via groups 136b and 200b among the plurality of via groups can also be heat radiation paths. The remaining via groups among the plurality of via groups that are heat radiation paths can not be electrically connected, and the vias 136 can be filled with a thermally conductive material. As an example, the thermally conductive material can be a thermally conductive material including at least one of Au, Ag, Cu, and Al. Accordingly, heat generated by the image sensor 120 can be transferred to the printed circuit board 110 through a portion of the plurality of vias 136 of the heat dissipation layer 130, and the heat transferred to the printed circuit board 110 can be radiated to the outside of the image sensor package 100.

[0106] Meanwhile, according to an embodiment of the present application, a solder resist layer 170 can be further disposed between the heat dissipation layer 130 and the image sensor 120. In this case, the solder resist layer 170 can be disposed to cover a portion of the plurality of first metal pads 200. Accordingly, the solder resist layer 170 can insulate the plurality of first metal pads 200 of the heat dissipation layer 130 from the image sensor 120. However, the first metal pads 200 directly connected to the wires of the image sensor 120 can not be covered by the solder resist layer 170. To this end, the area of the solder resist layer 170 can be smaller than the area of the heat dissipation layer 130.

[0107] According to an embodiment of the present application, the heat dissipation layer 130 on which the image sensor 120 is mounted can be manufactured as a module, and the module including the image sensor 120 and the heat dissipation layer 130 can be bonded to the printed circuit board 110.

[0108] Referring to Figure 10 The plurality of second metal pads 210 disposed on the first surface 132 of the heat dissipation layer 130 can be disposed on the printed circuit board 110. In this case, the plurality of second metal pads 300 can be disposed on the printed circuit board 110, and at least a portion of the plurality of second metal pads 210 can be electrically connected to at least a portion of the plurality of third metal pads 300. Accordingly, the wires connected to the image sensor 120 can be connected to the printed circuit board 110 through the heat dissipation layer 130.

[0109] In this case, a solder layer 310 can be disposed between at least a portion of the plurality of second metal pads 210 and at least a portion of the plurality of third metal pads 300.

[0110] Accordingly, the heat dissipation layer 130 and the printed circuit board 110 can be bonded with high strength, and the wires connected to the image sensor 120 can be electrically connected to the printed circuit board 110 through the heat dissipation layer 130.

[0111] In this case, a cavity can be formed in the printed circuit board 110, and the heat dissipation layer 130 and the image sensor 120, which are provided as modules, can be accommodated in the cavity. Accordingly, a separate structure for supporting side surfaces of the modularized heat dissipation layer 130 and the image sensor 120 is not required, and the overall size of the image sensor package 100 can be reduced.

[0112] According to an embodiment of the present application, the molding layer 150 fixes the printed circuit board 110, the heat dissipation layer 130, and the image sensor 120 in the cavity, and the optical filter layer 140 can be provided on the molding layer 150. Accordingly, a separate structure for supporting the optical filter layer 140 is not required, and the overall size of the image sensor package 100 can be reduced.

[0113] Meanwhile, according to an embodiment of the present application, one or more through holes 116 passing through the printed circuit board 110 from the first surface 112 to the second surface 114, which is a surface opposite to the first surface 112, can be formed in the printed circuit board 110, and at least some of the plurality of through holes 116 can be connected to at least some of the plurality of third metal pads 300. Accordingly, heat generated by the image sensor 120 can be transferred to the heat dissipation layer 130, and the heat transferred to the heat dissipation layer 130 can be radiated to the outside through the plurality of through holes 116 formed in the printed circuit board 110.

[0114] Meanwhile, in the above-described embodiment, an example of the printed circuit board 110 as a single-layer rigid substrate has been described, but the present application is not limited thereto, and the printed circuit board 110 of the image sensor package 100 according to an embodiment of the present application can also be an RF PCB.

[0115] Figure 11a 、 Figure 11b 、 Figure 11c and Figure 11d are cross-sectional views showing a part of an image sensor package according to other embodiments of the present application. Repetitive description of the same content as described with reference to Figures 1 to 10 will be omitted.

[0116] Referring to Figures 11a to 11d , the printed circuit board 110 can be an RF PCB including rigid regions 110a and 110b and a flexible region 110c. In this case, the image sensor 120, the heat dissipation layer 130, the optical filter layer (not shown), and the lens assembly (not shown) can be provided in the rigid region 110a, other components (e.g., terminals) can be provided in the rigid region 110b, and the flexible region 110c can be provided between one rigid region 110c and the other rigid region 110b.

[0117] In this case, each of the rigid areas 110a and 110b can include a rigid layer 1 RL1, a flexible layer FL disposed on the rigid layer 1 RL1, and a rigid layer 2 RL2 disposed on the flexible layer FL, and the flexible area 110c can be connected to the flexible layer FL of each of the rigid areas 110a and 110b.

[0118] In this case, the plurality of through holes 116 formed in the printed circuit board 110 can be formed to pass through the rigid layer 1 RL1, the flexible layer FL, and the rigid layer 2 RL2.

[0119] Accordingly, the printed circuit board 110 can be folded due to the flexible area 110c between the rigid areas 110a and 110b, and the camera device 10 can be accommodated in a small area in a folded state.

[0120] While the present application has been described above with reference to exemplary embodiments, it is to be understood that various modifications and changes can be made to the present application without departing from the spirit and scope thereof, which are defined by the appended claims.

Claims

1. A camera device comprising: an image sensor package; and a lens assembly disposed on the image sensor package, wherein the image sensor package comprises a printed circuit board, a heat dissipation layer disposed on a first surface of the printed circuit board, and an image sensor disposed on the heat dissipation layer, a plurality of through-holes are formed in the printed circuit board from the first surface through the printed circuit board to a second surface as a surface opposite to the first surface, at least a portion of the plurality of through-holes pass through the heat dissipation layer, wherein the heat dissipation layer comprises a first metal layer disposed on the printed circuit board, a thermal interface material disposed on the first metal layer, and a second metal layer disposed on the thermal interface material, wherein the thermal interface material is disposed on an upper surface of the first metal layer, a side surface of the first metal layer, a portion of an upper surface of the printed circuit board, a lower surface of the second metal layer, a side surface of the second metal layer, and a portion of a side surface of the image sensor, and wherein an upper surface of the thermal interface material comprises a concave shape.

2. The camera device of claim 1, wherein, the plurality of through-holes are metal filled.

3. The camera device of claim 2, wherein, the at least a portion of the plurality of through-holes are electrically connected to the image sensor.

4. The camera device of claim 1, wherein, the heat dissipation layer comprises an insulating substrate comprising a metal oxide.

5. The camera device of claim 4, wherein, the metal oxide is contained in the insulating substrate in an amount of 90 wt% or more, based on the total weight.

6. The camera device of claim 4, wherein, the metal oxide is an oxide of at least one of Al and Mg.

7. The camera device of claim 4, wherein, the heat dissipation layer further comprises a thermal interface material disposed between the insulating substrate and the image sensor.

8. The camera device of claim 4, wherein, the first metal layer is in contact with the printed circuit board, the second metal layer is in contact with the image sensor, and a thickness of the first metal layer is greater than a thickness of the second metal layer.

9. The camera device of claim 1, wherein, a wire of the image sensor is connected to a circuit pattern disposed on the heat dissipation layer.

10. The camera device of claim 1, wherein, an area of the heat dissipation layer is greater than an area of the image sensor and less than an area of the printed circuit board. 11.The camera device according to claim 1, wherein: the printed circuit board comprises a rigid-flexible printed circuit board, i.e., an RF printed circuit board, comprising a rigid region and a flexible region; and the image sensor is disposed in the rigid region of the printed circuit board. 12.The camera device according to claim 1, wherein: the heat dissipation layer is an insulating substrate comprising a metal oxide; a plurality of through-holes are formed in the insulating substrate; at least a portion of the plurality of through-holes of the insulating substrate are electrical connection paths of the image sensor. 13.The camera device according to claim 12, comprising: a plurality of first metal pads disposed on a first surface of the insulating substrate; and a plurality of second metal pads disposed on a second surface of the insulating substrate, wherein the plurality of first metal pads are disposed on an upper portion of the plurality of through-holes of the insulating substrate, and the plurality of second metal pads are disposed on a lower portion of the plurality of through-holes of the insulating substrate. 14.The camera device according to claim 13, wherein: ​ Wires connected to the image sensor are connected to a portion of the first metal pads; and The at least a portion of the vias of the insulating substrate are filled with a conductive material.

15. The camera device of claim 13, further comprising a solder resist layer disposed between the insulating substrate and the image sensor. wherein, The solder resist layer is disposed to cover a portion of the first metal pads.

16. The camera device of claim 13, wherein: a plurality of third metal pads are disposed on the printed circuit board; and at least a portion of the second metal pads are connected to at least a portion of the third metal pads.

17. The camera device of claim 16, wherein, A solder layer is disposed between at least a portion of the second metal pads and at least a portion of the third metal pads.

18. The camera device of claim 12, wherein: a cavity is formed in the printed circuit board; and the insulating substrate and the image sensor are housed in the cavity.

19. The camera device of claim 18, further comprising a molding layer that secures the printed circuit board, the insulating substrate, and the image sensor in the cavity.

Images