A deoxidation tool and deoxidation method for ceramic array package device pins

Abstract

The present invention proposes a deoxidation tool and a deoxidation method for the pins of a ceramic array package device, wherein the deoxidation tool comprises a limiting base, a first protective cover plate and a drainage cover plate; a card slot for limiting the ceramic array package device is provided on the limiting base; the first protective cover plate is located above the limiting base, and a first array of micropores is provided thereon to allow and cooperate with the pins of the ceramic array package device to pass through; the drainage cover plate is located above the first protective cover plate, and a processing groove corresponding to the first array of micropores is provided on the drainage cover plate, and the processing groove forms an abrasive flow inlet and outlet channel above the first protective cover plate. By designing the above-mentioned deoxidation tool to protect the non-oxidized area of ​​the ceramic array package device, and then using the abrasive flow to deoxidize the to-be-processed welding end of the pins of the ceramic array package device, the deoxidation treatment of the pins of the ceramic array package device can be achieved without causing any damage to the ceramic array package device, thereby improving the weldability of the packaged device.

Description

Technical Field

[0001] The invention relates to the technical field of ceramic array packaging devices, and in particular to a deoxidation tool and a deoxidation method for pins of ceramic array packaging devices. Background Art

[0002] As IC packaging technology develops towards high density, thinness, high performance and low cost, array packaging has become the mainstream technology in the current electronics industry. Ceramic Ball / Column Grid Array (CGA), as a high-density surface mount packaging, has been widely used in high-reliability products represented by aerospace in recent years due to its high interconnection density, excellent thermal and electrical properties.

[0003] Although ceramic array packaging devices have many application technology advantages, there are also some problems in actual engineering applications, such as the oxidation of solder balls / solder columns. Since the solder balls / solder columns of ceramic array packaging devices are made of lead-tin alloy, long-term storage is prone to pin oxidation, resulting in poor solderability of component pins and difficult to ensure welding reliability. In addition, the cycle from manufacturing to engineering application of devices is relatively long, which is also an important reason for the oxidation of device pins. Common deoxidation methods include: 1. Mechanical grinding method. Manual grinding or mechanical grinding is used to remove the surface oxidation of the device pins. This method requires extremely high worker skills. Improper operation affects the coplanarity of the pins and causes damage to the pins. 2. Replanting balls or columns, that is, removing the original solder balls / solder columns of the device, reprinting solder paste, and reflow soldering after planting solder balls / solder columns. This method is time-consuming and costly. 3. Acidic solvent removal, such as the reaction of activated flux with oxides to achieve the purpose of removing oxides. However, the activity of flux directly affects the effect of oxide removal. Summary of the invention

[0004] Based on the technical problems existing in the background technology, the present invention proposes a deoxidation tool and a deoxidation method for the pins of a ceramic array package device. A deoxidation tool is designed to protect the non-oxidized area of ​​the ceramic array package device, and then an abrasive flow is used to deoxidize the untreated welding ends of the pins of the ceramic array package device. The deoxidation treatment of the pins of the ceramic array package device can be achieved without causing any damage to the ceramic array package device, thereby improving the solderability of the packaged device.

[0005] The present invention provides a ceramic array package device pin deoxidation tool, comprising a limiting base, a first protective cover plate and a drainage cover plate;

[0006] A card slot for limiting the ceramic array packaging device is provided on the limiting base;

[0007] The first protective cover is located above the limiting base and is provided with a first array of micro holes that allow and cooperate with the ceramic array package device pins to pass through;

[0008] The drainage cover plate is located above the first protective cover plate, and a processing groove corresponding to the first array of micropores is opened on the drainage cover plate, and the processing groove forms an abrasive flow inlet and outlet channel above the first protective cover plate.

[0009] In the deoxidation tooling, the ceramic array packaged device is limited by a limiting base; the first protective cover plate is used to ensure that the pins of the ceramic array packaged device only leak out of the to-be-processed weld ends relative to the first protective cover plate, and other non-processing areas of the ceramic array packaged device are protected; the abrasive flow is accommodated by the drainage cover plate to enter the abrasive flow inlet and outlet channel, that is, to enter the area above the first protective cover plate, thereby achieving deoxidation of the to-be-processed weld ends of the pins of the ceramic array packaged device that leak out of the first protective cover plate.

[0010] Preferably, threaded holes for installing positioning bolts are provided at the bottom and / or sides of the slot on the limiting base.

[0011] Positioning bolts are installed through threaded holes, and the ceramic array package device is positioned using the positioning bolts.

[0012] Preferably, it also includes an adjustment gasket;

[0013] The regulating gasket is located between the limiting base and the first protective cover plate, and is provided with a middle opening for allowing the pins of the ceramic array packaging device to pass through.

[0014] The adjusting gasket is used to adjust the leakage height of the ceramic array package device pin relative to the adjusting gasket.

[0015] Preferably, the first protective cover is made of elastic material, and the diameter of the first array microholes is smaller than the diameter of the pins;

[0016] Preferably, the difference between the diameter of the first array microholes and the diameter of the pin is preferably a negative tolerance of the pin diameter.

[0017] The first protective cover is used to ensure that the ceramic array package device pins only expose the solder ends to be processed relative to the first protective cover.

[0018] When the first protective cover is made of elastic material and the diameter of the first array micro-holes is smaller than the diameter of the pins, the pins of the ceramic array package device can still pass through the first array micro-holes and form an interference fit with the first array micro-holes.

[0019] Preferably, it also includes a second protective cover;

[0020] The second protective cover is located between the first protective cover and the drainage cover, and is also provided with a second array of microholes that allow the pins of the ceramic array package device to pass through. The diameter of the second microhole array is larger than the diameter of the pin, and the abrasive flow inlet and outlet channel is located above the second protective cover;

[0021] Preferably, the difference between the diameter of the second array microholes and the diameter of the pin is a positive tolerance of the pin diameter.

[0022] The second protective cover can protect the elastic first protective cover to prevent the abrasive flow from damaging the first protective cover, and the diameter of the second microhole array is larger than the pin diameter to ensure that the unprocessed solder ends of the ceramic array package device pins relative to the first protective cover leak out on the second protective cover.

[0023] Preferably, the abrasive flow inlet and outlet channels on the drainage cover plate are single channels or multiple channels.

[0024] The drainage cover plate is used to accommodate the abrasive flow into the abrasive flow inlet and outlet channel, so as to deoxidize the unprocessed solder ends of the ceramic array package device pins that leak out relative to the first protective cover plate.

[0025] The present invention also provides a method for deoxidizing the pins of a ceramic array package device, comprising the following steps:

[0026] S1, placing the ceramic array package device on the above-mentioned deoxidation tooling, after the ceramic array package device is placed on the limiting base and positioned, its pins pass through the first protective cover plate and expose the solder ends to be processed relative to the first protective cover plate;

[0027] S2, passing the abrasive flow into the abrasive flow inlet and outlet channel on the drainage cover plate, and using the abrasive flow to deoxidize the weld end to be processed.

[0028] Preferably, the pins of the ceramic array package device are at least one of solder balls or solder columns, and the material of the pins is preferably at least one of 90Pb10Sn, 80Pb20Sn or 63Sn37Pb.

[0029] Preferably, the abrasive flow adopts a one-way circulation or a two-way circulation;

[0030] Preferably, the abrasive particle size of the abrasive flow is 0.5-100 μm, and the abrasive extrusion pressure is 0.1-10 MPa.

[0031] Preferably, after deoxidizing the solder end to be processed by using abrasive flow, the method further comprises: removing residual abrasive and excess materials by using an antistatic brush or non-woven fabric, and then cleaning the pin by using alcohol or isopropyl alcohol;

[0032] Preferably, the deoxidation process uses electrostatic protection.

[0033] Compared with the prior art, the present invention has the following beneficial effects:

[0034] (1) By designing the deoxidation tooling, the non-processing area (other areas except the solder end to be processed) of the ceramic array package device is protected. The entire deoxidation process is only for the solder end to be processed of the pin, and will not cause any force, heat and electrostatic damage to the ceramic array package device.

[0035] (2) The abrasive flow process is used to deoxidize the oxidized pins of ceramic array packaged devices. The processing uniformity is good, the coplanarity of the device pins is not affected, the solderability of the device pins is improved, and the welding yield of ceramic array packaged devices is increased to more than 99.8%.

[0036] (3) Compared with the traditional mechanical grinding method, not only the end face of the leaked pin (solder ball / solder column) can be deoxidized, but also the annular surface or curved surface of the leaked pin (solder ball / solder column) can be deoxidized, the processing uniformity and repeatability are good, and the efficiency is improved by more than 50%; compared with the methods such as re-balling / re-pillaring, the processing uniformity and repeatability are good, and the device will not be caused multiple thermal damages, and the efficiency is improved by more than 2 times; in short, compared with the traditional mechanical method or the methods such as re-balling / re-pillaring, the present invention will not cause multiple thermal damages to the device, and the processing uniformity and repeatability are good; one or more devices can be processed at one time, the processing time is short, and the efficiency is high.

[0037] (4) In addition to being used for pin deoxidation, the present invention is also suitable for leveling the pins (solder balls / solder columns) of ceramic array packaging devices to improve coplanarity; compared with the coplanarity of ≤150μm achieved by traditional mechanical grinding, the coplanarity achieved by this method is ≤50μm, or even lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 This is a schematic diagram of the structure of the deoxidation tooling for the ceramic array packaging device according to Example 1 of the present invention;

[0039] Figure 2 It is a schematic diagram of the structure of the CCGA device described in Example 1 of the present invention. DETAILED DESCRIPTION

[0040] The technical solutions of the present invention are described in detail below through specific embodiments. However, it should be clearly stated that these embodiments are for illustration only and are not to be construed as limiting the scope of the present invention. Example 1

[0041] Reference Figure 1 As shown, this embodiment proposes a deoxidation tool for the pins of a ceramic array package device, including a limiting base 1, an adjusting gasket 2, a first protective cover plate 3, a second protective cover plate 4, a drainage cover plate 5, a positioning bolt 6 and a fastening screw 7;

[0042] A slot 11 is provided on the limiting base 1 for limiting the ceramic array package device 8. The limiting base 1 is also provided with arc grooves 12 at both ends of the slot 11 to facilitate the removal of the ceramic array package device 8. The bottom and both sides of the slot 11 are evenly designed with threaded holes 13 for installing positioning bolts 6. The positioning bolts 6 position the ceramic array package device 8 in the X, Y, and Z directions.

[0043] The adjusting gasket 2 is located above the limiting base 1. The adjusting gasket 2 is provided with a middle opening for allowing the pins of the ceramic array package device 8 to pass through. The thickness of the adjusting gasket is designed according to the pin lengths of the different ceramic array package devices 8, so as to adjust the leakage height of the pin array of the ceramic array package device 8 relative to the adjusting gasket 2.

[0044] The first protective cover plate 3 is made of elastic material and is located above the adjusting gasket 2. The first protective cover plate 3 is provided with first array microholes 31 that allow and cooperate with the pins of the ceramic array package device 8 to pass through. The diameter of the first array microholes 31 is smaller than the diameter of the pin, and the difference between the two diameters is the negative tolerance of the pin diameter. The first protective cover plate 3 can ensure that the pins of the ceramic array package device only leak out the welding ends to be processed relative to the first protective cover plate 3, and prevent the abrasive flow from flowing into the non-processing area of ​​the ceramic array package device 8;

[0045] The second protective cover plate 4 is located above the first protective cover plate 3. The second protective cover plate 4 is also provided with second array microholes 41 for allowing the pin array of the ceramic array package device 8 to pass through. The diameter of the second array microholes 41 is larger than the pin diameter, and the difference between the two diameters is the positive tolerance of the pin diameter. The second protective cover plate 4 can protect the first protective cover plate 3 and ensure that the unprocessed welding end of the ceramic array package device 8 that leaks out relative to the first protective cover plate 3 leaks out.

[0046] The drainage cover plate 5 is located above the second protective cover plate 4. A processing groove corresponding to the second array micropores 41 is opened on the drainage cover plate 5. An abrasive flow inlet and outlet channel is formed between the processing groove and the second protective cover plate 4. An opening connecting the abrasive flow inlet and outlet channel is provided on the side of the drainage cover plate 5. The abrasive flow inlet and outlet channel is a single channel.

[0047] In the deoxidation tooling described in this embodiment, corresponding threaded openings are provided on the limit base 1, the adjusting gasket 2, the first protective cover plate 3, the second protective cover plate 4 and the drainage cover plate 5 to facilitate the installation of the fastening screws 7, thereby fixing the limit base 1, the adjusting gasket 2, the first protective cover plate 3, the second protective cover plate 4 and the drainage cover plate 5.

[0048] This embodiment also provides a method for deoxidizing the pins of a ceramic array package device, comprising:

[0049] (1) Reference Figure 2As shown, the ceramic array package device 8 is specifically a ceramic column grid array package device CCGA1152, which has a solder column (i.e., pin) 81 array 34×34, the solder column size is 0.51mm×2.21mm, and the material is 80Pb20Sn;

[0050] (2) Install the CCGA1152 device 8 on the above-mentioned deoxidation tooling. After the CCGA1152 device 8 is placed on the limiting base 1 and positioned, its welding column 81 array passes through the adjusting gasket 2, the first protective cover plate 3 and the second protective cover plate 4, and the welding end to be processed of the welding column 81 array is exposed relative to the second protective cover plate 4;

[0051] (3) passing the abrasive flow from the opening on the drainage cover plate 5 into the abrasive flow inlet and outlet channel, and using the abrasive flow to deoxidize the weld end to be processed of the CCGA1152 device 8, the abrasive particle size is 5-10 μm, the abrasive extrusion pressure is 6-7 MPa, and the abrasive flows in a single cycle;

[0052] (4) Use an antistatic brush to remove residual abrasive and excess materials, and then use isopropyl alcohol to clean the solder column 81 array of the CCGA1152 device 8, thereby completing the deoxidation of the pins of the ceramic array package device. Example 2

[0053] This embodiment proposes a deoxidation tooling for the pins of a ceramic array packaging device. In addition to opening 34 processing grooves corresponding to each row of micropores in the second array micropores 41 on the drainage cover plate 5 of the deoxidation tooling, and forming 34 abrasive flow inlet and outlet channels between the drainage cover plate 5 and the second protective cover plate 4, each abrasive flow inlet and outlet channel corresponds to a row of pins, the other structural settings are the same as the deoxidation tooling described in Example 1.

[0054] This embodiment also proposes a method for deoxidizing the pins of a ceramic array package device. Except for passing the abrasive flow into the above-mentioned 34 abrasive flow inlet and outlet channels, and the abrasive extrusion pressure is 5-6MPa, other operations are the same as those in Example 1. Example 3

[0055] This embodiment proposes a deoxidation tool for the pins of a ceramic array package device, and its structural design is completely the same as that of the first embodiment.

[0056] This embodiment also provides a method for deoxidizing the pins of a ceramic array package device, comprising:

[0057] (1) The ceramic array package device 8 is specifically a ceramic ball grid array package device CBGA400, which has a solder ball (i.e., pin) array of 20×20, a solder ball size of 0.76 mm, and a material of 90Pb10Sn;

[0058] (2) The CBGA400 device is mounted on the above-mentioned deoxidation tooling. After the CBGA400 device is positioned on the limiting base 1, its solder ball array passes through the adjusting gasket 2, the first protective cover plate 3 and the second protective cover plate 4, and only the solder end to be processed of the solder ball array (about half of the solder ball) is exposed relative to the second protective cover plate 4;

[0059] (3) passing the abrasive flow from the opening on the drainage cover plate 5 into the abrasive flow inlet and outlet channel, and using the abrasive flow to deoxidize the weld end to be processed of the CBGA400 device. The particle size of the abrasive is 5-8 μm, the extrusion pressure of the abrasive is 4-5 MPa, and the abrasive is circulated in a single cycle;

[0060] (4) Use an anti-static brush to remove residual abrasive and excess materials, and then use isopropyl alcohol to clean the solder ball array of the CBGA400 device to complete the deoxidation of the pins of the ceramic array package device.

[0061] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A deoxidation tool for the pins of a ceramic array packaging device, characterized in that: It comprises a limiting base (1), a first protective cover plate (3) and a drainage cover plate (5); The limiting base (1) is provided with a slot for limiting the ceramic array package device; The first protective cover plate (3) is located above the limiting base (1), and is provided with a first array of micro-holes that allow and cooperate with the ceramic array packaging device pins to pass through; The drainage cover plate (5) is located above the first protective cover plate (3), and a processing groove corresponding to the first array of micropores is opened on the drainage cover plate (5), and the processing groove forms an abrasive flow inlet and outlet channel above the first protective cover plate (3); The first protective cover plate (3) is made of elastic material, and the diameter of the first array microholes is smaller than the diameter of the pins; The difference between the diameter of the first array microholes and the diameter of the pin is the negative tolerance of the pin diameter.

2. The deoxidation tool for the pins of the ceramic array package device according to claim 1, characterized in that: The bottom and / or side of the slot on the limiting base (1) are provided with threaded holes for installing positioning bolts.

3. The deoxidation tool for the pins of the ceramic array package device according to claim 1 or 2, characterized in that: Also includes an adjustment gasket (2); The adjusting gasket (2) is located between the limiting base (1) and the first protective cover plate (3), and is provided with a middle opening for allowing the pins of the ceramic array package device to pass through.

4. The deoxidation tool for the pins of the ceramic array package device according to claim 1, characterized in that: Also includes a second protective cover plate (4); The second protective cover plate (4) is located between the first protective cover plate (3) and the drainage cover plate (5), and is provided with a second array of microholes for allowing the pins of the ceramic array packaging device to pass through, the diameter of the second microhole array being larger than the diameter of the pins, and the abrasive flow inlet and outlet channel being located above the second protective cover plate; The difference between the diameter of the second array microholes and the diameter of the pin is the positive tolerance of the pin diameter.

5. The deoxidation tool for the pins of the ceramic array package device according to claim 1 or 2, characterized in that: The abrasive flow inlet and outlet channels are single channels or multiple channels.

6. A method for deoxidizing the pins of a ceramic array packaging device, characterized in that: The steps include: S1. Place the ceramic array package device on the deoxidation tooling according to any one of claims 1 to 5. After the ceramic array package device is placed on the limiting base (1) and positioned, its pins pass through the first protective cover plate (3) and expose the solder ends to be processed relative to the first protective cover plate (3); S2, passing the abrasive flow into the abrasive flow inlet and outlet channel on the drainage cover plate (5), and using the abrasive flow to deoxidize the weld end to be processed.

7. The method for deoxidizing the pins of a ceramic array package device according to claim 6, characterized in that: The pins of the ceramic array package device are at least one of solder balls or solder columns, and the material of the pins is at least one of 90Pb10Sn, 80Pb20Sn or 63Sn37Pb.

8. The method for deoxidizing the pins of a ceramic array package device according to claim 6 or 7, characterized in that: The abrasive flow adopts one-way circulation or two-way circulation.

9. The method for deoxidizing the pins of a ceramic array package device according to claim 6 or 7, characterized in that: The abrasive particle size of the abrasive flow is 0.5-100 μm, and the abrasive extrusion pressure is 0.1-10 MPa.

10. The method for deoxidizing the pins of a ceramic array package device according to claim 6 or 7, characterized in that: After the abrasive flow is used to deoxidize the solder end to be processed, the method further includes: using an antistatic brush or non-woven fabric to remove residual abrasive and excess materials, and then using alcohol or isopropyl alcohol to clean the pin.

11. The method for deoxidizing the pins of a ceramic array package device according to claim 6 or 7, characterized in that: The deoxidation process uses electrostatic protection.

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