A high speed connector pin alignment apparatus, method, terminal, and media

Abstract

The application relates to the field of PCB manufacturing, and particularly discloses a high-speed connector pin alignment device and method, a terminal and a medium, wherein at least one first auxiliary positioning hole is arranged on the high-speed connector, and a second auxiliary positioning hole matched with each first auxiliary positioning hole is arranged on a PCB; when the high-speed connector is placed on the PCB, the first auxiliary positioning hole is first aligned with the center of the corresponding second auxiliary positioning hole, and then the positioning column of the high-speed connector is inserted into the positioning hole on the PCB. The application sets auxiliary alignment points on the high-speed connector and the PCB, ensures the matching of the connector pin and the PCB pad, prevents the short circuit and misconnection between the pins and the pads, and improves the product quality.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB manufacturing, in particular to a high-speed connector pin alignment device, method, terminal and medium. BACKGROUND

[0002] With the rapid development of the Internet industry, in order to meet the high-speed transmission and analysis of data, the server as a data carrier is constantly innovating, and for the hardware main board of the server, in order to realize the high-speed interconnection of signals, the high-speed connector is an essential material in the production process of the board card, especially the integrated high-speed connector plays a more and more important role in the process of signal transmission. And miniaturization of high-speed connector has become a trend.

[0003] Because the high-speed connector pin is relatively dense and the gap is small, it poses a high challenge to the welding process of the board card production, and how to ensure the accurate alignment of the high-speed connector pin and the pad on the PCB after welding has always been an important factor affecting the failure of signal transmission function. The current design of high-speed connector is generally as follows Figure 1 As shown, it is usually fixed on the PCB by two positioning columns, and the pin of the high-speed connector will correspond to the pad designed on the PCB Figure 2 As shown) one by one, and welded. However, due to the very small spacing of the high-speed connector pin, the positioning column and the positioning hole cannot be accurately positioned, especially there is a cumulative tolerance in the positioning hole during the production of the PCB, so it will cause the high-speed connector pin to move left and right during welding, which is easy to cause the misalignment of the high-speed connector pin and the PCB pad, resulting in short circuit and misconnection during welding. SUMMARY

[0004] To solve the above problems, the present application provides a high-speed connector pin alignment device, method, terminal and medium, by setting auxiliary alignment points on the high-speed connector and the PCB, ensuring the matching of the connector pin and the PCB pad, preventing pad short circuit and misconnection between pins, and improving product quality.

[0005] In the first aspect, the technical scheme of the present application provides a high-speed connector pin alignment device, a positioning column is arranged on the high-speed connector, a positioning hole adapted to the positioning column is arranged on the PCB, at least one first auxiliary positioning hole is arranged on the high-speed connector, and a second auxiliary positioning hole adapted to each first auxiliary positioning hole is arranged on the PCB; when the high-speed connector is placed on the PCB, first, the high-speed connector is moved to align the centers of the first auxiliary positioning hole and the corresponding second auxiliary positioning hole, and then the positioning column of the high-speed connector is inserted into the positioning hole on the PCB.

[0006] Further, when there are multiple first auxiliary positioning holes, the centers of the first auxiliary positioning holes are not on a straight line.

[0007] Further, the first auxiliary positioning hole and the second auxiliary positioning hole are both circular.

[0008] Further, the diameter of the first auxiliary positioning hole is greater than the diameter of the second auxiliary positioning hole.

[0009] In a second aspect, the technical scheme of the present application provides a high-speed connector pin alignment method, wherein the high-speed connector is adsorbed by a suction nozzle, and the suction nozzle is driven by a suction nozzle driving mechanism. The method comprises the following steps:

[0010] S1, triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction, aligning the first auxiliary positioning hole on the high-speed connector with the corresponding second auxiliary positioning hole on the PCB board;

[0011] S2, triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the vertical direction, inserting the positioning column of the high-speed connector into the positioning hole on the PCB board.

[0012] Further, step S1 specifically comprises:

[0013] triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction by a predetermined position;

[0014] triggering the SMT camera to take a picture of the high-speed connector and the PCB board;

[0015] obtaining the picture, and analyzing the positions of the first auxiliary positioning hole and the second auxiliary positioning hole on the picture to obtain the distance to be moved by the suction nozzle;

[0016] triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction by the distance to be moved, aligning the first auxiliary positioning hole on the high-speed connector with the corresponding second auxiliary positioning hole on the PCB board.

[0017] Further, analyzing the positions of the first auxiliary positioning hole and the second auxiliary positioning hole on the picture to obtain the distance to be moved by the suction nozzle specifically comprises:

[0018] obtaining the center position of the first auxiliary positioning hole and the center position of the second auxiliary positioning hole;

[0019] calculating the distance between the two center positions, including the distance in the x-axis direction and the distance in the y-axis direction;

[0020] the obtained distance in the x-axis direction and the distance in the y-axis direction are the distance to be moved by the suction nozzle.

[0021] Further, when there are multiple first auxiliary positioning holes and corresponding second auxiliary positioning holes, the distance to be moved of each suction nozzle is calculated, and the final distance to be moved of the suction nozzle is obtained by taking the arithmetic mean of the distances to be moved of the suction nozzles.

[0022] In a third aspect, the technical solution of the present application provides a terminal, comprising:

[0023] a memory for storing a high-speed connector pin alignment program;

[0024] a processor for implementing the steps of the high-speed connector pin alignment method as described in any of the above aspects when executing the high-speed connector pin alignment program.

[0025] In a fourth aspect, the technical solution of the present application provides a computer readable storage medium, wherein the readable storage medium stores a high-speed connector pin alignment program, and the high-speed connector pin alignment program implements the steps of the high-speed connector pin alignment method as described in any of the above aspects when executed by a processor.

[0026] The high-speed connector pin alignment device, method, terminal and medium provided by the present application have the following beneficial effects compared with the prior art: auxiliary alignment points are arranged on the high-speed connector, and auxiliary alignment points are also added on the PCB. In actual production, positioning is not performed based on the positioning column alone, but the auxiliary positioning points on the high-speed connector and the PCB are matched, the influence of accumulated tolerances on the alignment of the pin and the PCB pad is reduced, accurate positioning is performed first in actual production, then welding is performed, the matching of the connector pin and the PCB pad is ensured, pin-to-pad short circuit and misconnection are prevented, and product quality is improved. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0028] Figure 1 is a schematic diagram of the current high-speed connector structure.

[0029] Figure 2 is a schematic diagram of the current PCB structure.

[0030] Figure 3 is a schematic diagram of the current high-speed connector inserted into the PCB structure.

[0031] Figure 4is a high-speed connector structure schematic diagram of a high-speed connector pin alignment device provided by the embodiment of the present application.

[0032] Figure 5 is a PCB structure schematic diagram of a high-speed connector pin alignment device provided by the embodiment of the present application.

[0033] Figure 6 is an assembly structure top view schematic diagram of a high-speed connector pin alignment device provided by the embodiment of the present application.

[0034] Figure 7 is an assembly structure side cut surface schematic diagram of a high-speed connector pin alignment device provided by the embodiment of the present application.

[0035] Figure 8 is a high-speed connector pin alignment method flow chart schematic diagram provided by the embodiment of the present application.

[0036] Figure 9 is a terminal structure schematic diagram provided by the embodiment of the present application.

[0037] In the figure, 1-high-speed connector, 2-high-speed connector pin, 3-positioning column, 4-PCB board, 5-positioning hole, 6-PCB pad, 7-first auxiliary positioning hole, 8-second auxiliary positioning hole. DETAILED DESCRIPTION

[0038] The following explains some terms related to the present application.

[0039] PCB: Printed Circuit Board, printed circuit board.

[0040] PIP: Pin-in-Paste, pin-in-paste reflow soldering.

[0041] As Figures 1-3As shown, the current high-speed connector 1 is usually fixed on the PCB board 4 by two positioning columns 3, the high-speed connector pin 2 will correspond to the pad 6 designed on the PCB board 4 one by one and be welded. The common practice in the current industry for the high-speed connector 1 is to use normal SMT welding, and the welding of the positioning column 3 is also completed by PIP through-hole reflow technology. The high-speed connector 1 is placed on the surface of the PCB board 4, the pin 2 thereof corresponds to the pad 6 on the PCB board 4 one by one, and the positioning column 3 is inserted into the positioning hole 5 of the PCB board 4. However, in actual welding, because the positioning column 3 of the high-speed connector 1 is smaller than the positioning hole 5 on the PCB board 4 to be inserted for welding of the positioning column 3, the positioning column 3 has a movable space, and because the positioning hole 5 also has a tolerance during production of the PCB board 4, the high-speed connector 1 will be misaligned due to the existence of the cumulative tolerance during welding. Because the pin 2 of the high-speed connector 1 is too close, the most serious case is that the connector pin 2 will short-circuit with the adjacent pad 6, causing functional failure.

[0042] To solve the above problems, the present application provides a high-speed connector pin 2 alignment scheme, optimizes material design, sets auxiliary alignment points on the high-speed connector 1, and at the same time increases alignment points on the PCB board 4. In actual production, positioning is no longer based on the positioning column 3 alone, but is matched through the auxiliary positioning points on the high-speed connector 1 and the PCB board 4, reducing the influence of cumulative tolerance on the alignment of the pin 2 and the PCB pad 6. In actual production, precise positioning is performed first, and then welding is performed, to ensure the matching of the high-speed connector pin 2 and the PCB pad 6.

[0043] In order for those skilled in the art to better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

[0044] As shown in the drawings, Figures 4-7 The embodiment of the present application provides a high-speed connector pin alignment device, the high-speed connector 1 is provided with a positioning column 3, and the PCB board 4 is provided with a positioning hole 5 matched with the positioning column 3, for example, a positioning column 3 is arranged at each end of the high-speed connector 1.

[0045] The high-speed connector 1 and the PCB 4 are optimized, at least one first auxiliary positioning hole 7 is arranged on the high-speed connector 1, and a second auxiliary positioning hole 8 matched with each first auxiliary positioning hole 7 is arranged on the PCB 4. When the high-speed connector 1 is placed on the PCB 4, the high-speed connector 1 is first positioned and aligned through the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8, and then the high-speed connector 1 is inserted and mounted on the PCB 4. Specifically, the high-speed connector 1 is first moved to align the centers of the first auxiliary positioning hole 7 and the corresponding second auxiliary positioning hole 8, and then the positioning column 3 of the high-speed connector 1 is inserted and mounted into the positioning hole 5 on the PCB 4, and then welding can be performed. Since the auxiliary positioning points on the high-speed connector 1 and the PCB 4 are matched first, the influence of the cumulative tolerance on the alignment of the pin 2 and the PCB pad 6 is reduced, and the matching of the high-speed connector pin 2 and the PCB pad 6 is ensured.

[0046] It can be understood that the second auxiliary positioning hole 8 on the PCB 4 can be configured in the design file of the PCB 4. When the PCB 4 is manufactured, the second auxiliary positioning hole 8 is directly manufactured on the PCB 4 according to the design file.

[0047] In actual production, in order to improve the alignment accuracy, a plurality of first auxiliary positioning holes 7 are generally arranged, and correspondingly a plurality of second auxiliary positioning holes 8 are arranged. When there are a plurality of first auxiliary positioning holes 7, the centers of the first auxiliary positioning holes 7 are not on a straight line, and correspondingly the centers of the second auxiliary positioning holes 8 are not on a straight line, further improving the alignment accuracy. For example, two first auxiliary positioning holes 7 and two second auxiliary positioning holes 8 are arranged, and the two first auxiliary positioning holes 7 and the two second auxiliary positioning holes 8 are not on a horizontal line.

[0048] As a preferred embodiment, the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 adopt the same shape, for example, in some specific embodiments, the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 are both circular, facilitating positioning.

[0049] Currently, the production of the PCB 4 generally adopts SMT placement, which has an SMT camera. In actual production, the high-speed connector 1 and the PCB 4 can be photographed through the SMT camera, and the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 can be analyzed by analyzing the picture. In order to facilitate picture analysis, it is preferred that the diameter of the first auxiliary positioning hole 7 is greater than the diameter of the second auxiliary positioning hole 8.

[0050] The above describes an embodiment of a high-speed connector pin alignment device in detail, and based on the high-speed connector pin alignment device described in the above embodiment, the embodiment of the present application further provides a high-speed connector pin alignment method corresponding to the device.

[0051] In the placing stage of the PCB 4 production process, the high-speed connector 1 is sucked by a suction nozzle, and the suction nozzle is driven by a suction nozzle driving mechanism. The suction nozzle driving mechanism is started, and the suction nozzle drives the high-speed connector 1 to move.

[0052] Figure 8 is a high-speed connector pin alignment method flowchart provided by an embodiment of the application, as shown in the figure, the method comprises the following steps. Figure 8

[0053] S1, trigger the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction, align the first auxiliary positioning hole 7 on the high-speed connector 1 with the corresponding second auxiliary positioning hole 8 on the PCB 4.

[0054] S2, trigger the suction nozzle driving mechanism to drive the suction nozzle to move in the vertical direction, and insert the positioning column 3 of the high-speed connector 1 into the positioning hole 5 on the PCB 4.

[0055] The method first aligns the positions through the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8, and then inserts the positioning column 3 of the high-speed connector 1 into the positioning hole 5 on the PCB 4, reduces the cumulative tolerance of the positioning column 3 and the positioning hole 5, accurately positions the high-speed connector pin 2 and the PCB pad 6, prevents the pad 6 from being short-circuited and misconnected between pins, and improves product quality.

[0056] In some specific embodiments, in the normal production process, the SMT camera of the machine is used to match the auxiliary positioning point of the high-speed connector 1 with the designed positioning point on the PCB 4 during SMT placing, so that the centers are consistent and become concentric circles, and the accurate positioning of the high-speed connector pin 2 and the PCB pad 6 is ensured.

[0057] Correspondingly, step S1 specifically comprises the following process.

[0058] S101, trigger the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction by a predetermined position;

[0059] S102, trigger the SMT camera to take a picture of the high-speed connector 1 and the PCB 4;

[0060] S103, acquire the photographed picture, analyze the positions of the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 on the photographed picture, and acquire the distance to be moved by the suction nozzle;

[0061] S104, trigger the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction by the distance to be moved according to the distance to be moved by the suction nozzle, align the first auxiliary positioning hole 7 on the high-speed connector 1 with the corresponding second auxiliary positioning hole 8 on the PCB 4. ​

[0062] Firstly, the suction nozzle drives the high-speed connector 1 to reach an initial position, at which the SMT camera takes a picture, and the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 can be seen from the picture, and then the positions of the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 are analyzed, the suction nozzle to-be-moved distance is calculated based on the principle that the center of the first auxiliary positioning hole 7 should be aligned with the center of the second auxiliary positioning hole 8, and then the suction nozzle driving mechanism is triggered to start, so that the suction nozzle moves the to-be-moved distance, and the first auxiliary positioning hole 7 on the high-speed connector 1 is aligned with the corresponding second auxiliary positioning hole 8 on the PCB 4. On this basis, the suction nozzle is moved downward again, so that the positioning column 3 of the high-speed connector 1 is inserted into the positioning hole 5 on the PCB 4. Then, welding is performed.

[0063] In the position analysis of the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8 on the picture, the suction nozzle to-be-moved distance is obtained, which specifically includes: obtaining the center positions of the first auxiliary positioning hole 7 and the second auxiliary positioning hole 8, and calculating the distance between the two center positions, including the x-axis direction distance and the y-axis direction distance. The obtained x-axis direction distance and y-axis direction distance are the suction nozzle to-be-moved distance, that is, the suction nozzle driving mechanism drives the suction nozzle to move in the x-axis and y-axis directions.

[0064] When there are multiple first auxiliary positioning holes 7 and corresponding second auxiliary positioning holes 8, a suction nozzle to-be-moved distance is calculated for each first auxiliary positioning hole 7, and the final suction nozzle to-be-moved distance is obtained by taking the arithmetic mean of the suction nozzle to-be-moved distances. For example, when there are two first auxiliary positioning holes 7, two suction nozzle to-be-moved distances will be obtained, including two x-axis direction distances and two y-axis direction distances. The final suction nozzle x-axis direction to-be-moved distance is obtained by taking the arithmetic mean of the two x-axis direction distances, and the final suction nozzle y-axis direction to-be-moved distance is obtained by taking the arithmetic mean of the two y-axis direction distances.

[0065] Figure 9 A structure schematic diagram of a terminal device 900 provided for an embodiment of the present application, which includes a processor 910, a memory 920, and a communication unit 930. The processor 910 is used to realize the following steps when the high-speed connector pin alignment program saved in the memory 920 is realized:

[0066] S1, the suction nozzle driving mechanism is triggered to drive the suction nozzle to move in the horizontal direction, so that the first auxiliary positioning hole 7 on the high-speed connector 1 is aligned with the corresponding second auxiliary positioning hole 8 on the PCB 4.

[0067] S2, the suction nozzle driving mechanism is triggered again to drive the suction nozzle to move in the vertical direction, so that the positioning column 3 of the high-speed connector 1 is inserted into the positioning hole 5 on the PCB 4.

[0068] The present application sets auxiliary alignment points on the high-speed connector 1, and also increases auxiliary alignment points on the PCB. In actual production, the positioning is not only based on the positioning column 3, but also based on the auxiliary positioning points on the high-speed connector 1 and the PCB. The cumulative tolerance has little effect on the alignment of the pin 2 and the PCB pad 6. In actual production, the positioning is first accurately positioned, and then welded, so as to ensure the matching of the connector pin 2 and the PCB pad 6, prevent the short circuit and misconnection of the pin and pad 6, and improve the product quality.

[0069] The terminal device 900 includes a processor 910, a memory 920, and a communication unit 930. These components communicate through one or more buses. Those skilled in the art can understand that the structure of the server shown in the figure does not constitute a limitation on the present application. It can be a bus structure or a star structure. It can also include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0070] The memory 920 can be used to store the execution instructions of the processor 910. The memory 920 can be implemented by any type of volatile or non-volatile storage terminal or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk or optical disk. When the execution instructions in the memory 920 are executed by the processor 910, the terminal 900 can execute some or all of the steps in the following method embodiments.

[0071] The processor 910 is the control center of the storage terminal. It connects all parts of the electronic terminal through various interfaces and lines, executes or runs the software programs and / or modules stored in the memory 920, and calls the data stored in the memory, to perform various functions of the electronic terminal and / or process data. The processor can be composed of integrated circuits (ICs), such as a single packaged IC or a combination of multiple packaged ICs with the same or different functions. For example, the processor 910 can only include a central processing unit (CPU). In the present application, the CPU can be a single operation core or can include multiple operation cores.

[0072] The communication unit 930 is used to establish a communication channel, so that the storage terminal can communicate with other terminals. It receives user data sent by other terminals or sends user data to other terminals.

[0073] The application also provides a computer storage medium, wherein the storage medium can be a magnetic disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM) and the like.

[0074] The computer storage medium stores a high-speed connector pin alignment program, and the high-speed connector pin alignment program, when executed by a processor, implements the following steps:

[0075] S1, triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction, aligning the first auxiliary positioning hole 7 on the high-speed connector 1 with the corresponding second auxiliary positioning hole 8 on the PCB 4;

[0076] S2, triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the vertical direction, inserting the positioning column 3 of the high-speed connector 1 into the positioning hole 5 on the PCB 4.

[0077] The application sets auxiliary positioning points on the high-speed connector 1, and also increases auxiliary positioning points on the PCB, so that in actual production, the positioning is not based on the positioning column 3 alone, but is matched through the auxiliary positioning points on the high-speed connector 1 and the PCB, the influence of the accumulated tolerance on the positioning of the pin 2 and the PCB pad 6 is reduced, the positioning is accurately performed in actual production, then welding is performed, the matching of the connector pin 2 and the PCB pad 6 is ensured, the short circuit and the misconnection between the pins and the pads 6 are prevented, and the product quality is improved.

[0078] Those skilled in the art can clearly understand that the technology in the embodiments of the application can be realized by means of software and necessary general hardware platforms. Based on such understanding, the technical solutions in the embodiments of the application can be embodied in the form of a software product, and the computer software product is stored in a storage medium, such as a U disk, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk and various storage media that can store program codes, and includes a plurality of instructions for causing a computer terminal (which can be a personal computer, a server or a second terminal, a network terminal and the like) to execute all or part of the steps of the method described in the embodiments of the application.

[0079] In several embodiments provided by the present application, it should be understood that the disclosed system, device and method can be implemented in other manners. For example, the embodiments of the device described above are merely schematic, and the division of the units is merely a logical function division. For example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed mutual couplings or direct couplings or communication connections can be indirect couplings or communication connections through some interfaces, devices or units, and can be in electrical, mechanical or other forms.

[0080] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units, i.e., can be located in one place, or can be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purposes of the embodiments.

[0081] In addition, each functional unit in each embodiment of the present application can be integrated into a processing unit, or each unit can be a physically independent unit, or two or more units can be integrated into one unit.

[0082] The above disclosure is merely the preferred embodiments of the present application, but the present application is not limited thereto. Any non-creative changes and several improvements and refinements made by any person skilled in the art without departing from the principles of the present application shall fall within the protection scope of the present application.

Claims

1. A high speed connector pin alignment method, the high speed connector is sucked by a suction nozzle, the suction nozzle is driven by a suction nozzle driving mechanism, a positioning column is arranged on the high speed connector, and a positioning hole matched with the positioning column is arranged on a PCB, characterized in that, The high-speed connector is further provided with at least one first auxiliary positioning hole, and the PCB is provided with a second auxiliary positioning hole matched with each first auxiliary positioning hole; the method comprises the following steps: S1, triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction, aligning the first auxiliary positioning hole on the high-speed connector with the corresponding second auxiliary positioning hole on the PCB, comprising: triggering the suction nozzle driving mechanism to drive the suction nozzle to move in the horizontal direction to a predetermined position; triggering the SMT camera to take a picture of the high-speed connector and the PCB; obtaining the picture, analyzing the positions of the first auxiliary positioning hole and the second auxiliary positioning hole on the picture, and obtaining the distance to be moved by the suction nozzle; triggering the suction nozzle driving mechanism to drive the suction nozzle according to the distance to be moved by the suction nozzle, so that the suction nozzle moves in the horizontal direction by the distance to be moved, aligning the first auxiliary positioning hole on the high-speed connector with the corresponding second auxiliary positioning hole on the PCB; S2, triggering the suction nozzle driving mechanism to drive the suction nozzle again to move in the vertical direction, and inserting the positioning column of the high-speed connector into the positioning hole on the PCB.

2. The high speed connector pin alignment method of claim 1, wherein, The position analysis of the first auxiliary positioning hole and the second auxiliary positioning hole on the picture comprises: obtaining the center positions of the first auxiliary positioning hole and the second auxiliary positioning hole; calculating the distance between the two center positions, including the distance in the x-axis direction and the distance in the y-axis direction; the obtained distance in the x-axis direction and the distance in the y-axis direction are the distance to be moved by the suction nozzle.

3. The high speed connector pin alignment method of claim 2, wherein, When there are multiple first auxiliary positioning holes and corresponding second auxiliary positioning holes, a distance to be moved by the suction nozzle is calculated for each first auxiliary positioning hole, and the final distance to be moved by the suction nozzle is obtained by taking the arithmetic mean of the distances to be moved by the suction nozzle.

4. The high speed connector pin alignment method of claim 1, wherein, When there are multiple first auxiliary positioning holes, the centers of the first auxiliary positioning holes are not on a straight line.

5. The high speed connector pin alignment method of claim 4, wherein, The first auxiliary positioning hole and the second auxiliary positioning hole are both circular.

6. The high speed connector pin alignment method of any of claims 1-5, wherein, The diameter of the first auxiliary positioning hole is larger than the diameter of the second auxiliary positioning hole.

7. A terminal, characterized by comprising: comprise: a memory for storing a high-speed connector pin alignment program; a processor for executing the high-speed connector pin alignment program to realize the steps of the high-speed connector pin alignment method according to any one of claims 1-6.

8. A computer-readable storage medium, characterized in that, The readable storage medium stores a high-speed connector pin alignment program, and the high-speed connector pin alignment program is executed by the processor to realize the steps of the high-speed connector pin alignment method according to any one of claims 1-6.

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