Optical device and method for manufacturing an optical device

Abstract

A light device (1) of one embodiment includes a light emitting element (9), a first lens (8) and a second lens (11) which are optically coupled to the light emitting element (9), a light member (6) which is provided between the light emitting element (9) and the second lens (11), is optically coupled to the light emitting element (9) and the second lens (11), and combines input light, and a housing (2) including a lower plate (2A) including a plurality of convex mounting surfaces (2c) on which the light emitting element (9), the first lens (8), the second lens (11), and the light member (6) are mounted, respectively, and a side wall (2B) to which a socket (4) is connected.

Description

Technical Field

[0001] This disclosure relates to an optical device and a method for manufacturing the optical device.

[0002] This application claims priority based on Japanese Application No. 2020-102422, filed on June 12, 2020, and invokes all the contents of the said Japanese application. Background Technology

[0003] Patent Document 1 describes a semiconductor light-emitting module. The semiconductor light-emitting module includes: a main part comprising a semiconductor light-emitting element; and a housing housing the main part of the semiconductor light-emitting module. The housing is a hermetically sealed enclosure, and the light element is mounted inside the enclosure.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent Application Publication No. 2005-033037 Summary of the Invention

[0007] An optical device comprises: an optical element; a lens optically coupled to the optical element; an optical component disposed between the optical element and the lens, optically coupled to both the optical element and the lens respectively, for combining or splitting input light; and a base having a lower plate and a sidewall, the lower plate having a plurality of convex mounting surfaces for mounting the optical element, the lens and the optical component respectively, and the sidewall for socket connection.

[0008] One method for manufacturing an optical device includes: an optical element; a lens optically coupled to the optical element; an optical component disposed between the optical element and the lens, optically coupled to both the optical element and the lens respectively, and performing multiplexing or splitting of input light; and a base having a lower plate and sidewalls, the lower plate having a plurality of convex mounting surfaces for mounting the optical element, the lens, and the optical component respectively, and the sidewalls for socket connections. In this manufacturing method, the mounting surfaces of the base corresponding to the mounting surfaces of the optical components have grooves on both sides in the longitudinal direction, the grooves having outer walls that follow the outline of the optical component. The manufacturing method includes: a step of mounting the optical component on the mounting surface using the outer walls as alignment marks; and a step of aligning the lens. Attached Figure Description

[0009] Figure 1 This is a perspective view of the optical device according to the embodiment.

[0010] Figure 2 From Figure 1 A 3D view of the optical device with its cover removed.

[0011] Figure 3 This is a diagram schematically showing the relationship between the base, optical elements, and optical path of the optical device in the comparative example.

[0012] Figure 4 It means Figure 1 A three-dimensional view of the lens, optical components, wiring substrate, and optical elements of an optical device.

[0013] Figure 5 It means Figure 1 A three-dimensional view of the base of the optical device.

[0014] Figure 6 It is a schematic representation Figure 1 A diagram showing the relationship between the base, optical elements, and optical path of an optical device.

[0015] Figure 7 It means Figure 5 A top view of the mounting surface and groove of the base.

[0016] Figure 8 It means Figure 1 A side sectional view of the base, lens, optical components, wiring substrate, and optical elements of the optical device.

[0017] Figure 9 It means Figure 8 A top view of the base, lens, optical components, wiring board, and optical elements.

[0018] Figure 10 This is a three-dimensional view of the base of the first modified example.

[0019] Figure 11 This is a three-dimensional view of the base of the second modified example.

[0020] Figure 12 This is a perspective view of a fixture that mounts a component onto a base.

[0021] Figure 13 It means to use Figure 12 A three-dimensional view of the state in which the components are fixed to the base by the clamps. Detailed Implementation

[0022] Furthermore, unlike the sealed housings mentioned above, optical devices sometimes use non-sealed (non-hermetic) housings to reduce costs. These optical devices include: an LD (Laser Diode); a bracket housing the LD; an FPC (Flexible Printed Circuit) with pads electrically connected to the LD; a monitoring PD (Photo Diode) to monitor light from the LD; and a base. The base houses the bracket, FPC, and monitoring PD.

[0023] The base is L-shaped, with sidewalls for socket assembly and a lower plate for mounting brackets, FPCs, and monitoring PDs. Sometimes, in addition to mounting monitoring PDs and other optical elements, lenses and other optical components are also mounted on the lower plate. The optical elements and components are fixed to the upper surface of the lower plate using resin adhesive. However, during bonding, the adhesive beneath the optical elements and components may sometimes bulge, potentially interfering with the optical path of the optical elements and components.

[0024] The purpose of this disclosure is to provide an optical device that can suppress the interference of adhesives on the optical path, and a method for manufacturing the optical device.

[0025] According to this disclosure, it is possible to suppress the interference of adhesives on the optical path.

[0026] The following description outlines embodiments of this disclosure. One embodiment of the optical device includes: an optical element; a lens optically coupled to the optical element; an optical component disposed between the optical element and the lens, optically coupled to both the optical element and the lens, and performing multiplexing or demultiplexing of input light; and a base having a lower plate and a sidewall, the lower plate having a plurality of convex mounting surfaces for mounting the optical element, the lens, and the optical component respectively, and the sidewall for socket connection.

[0027] In this optical device, the base has a lower plate and sidewalls, and the lower plate has multiple mounting surfaces. Optical elements, lenses, and optical components are mounted on each of these mounting surfaces. Each of the mounting surfaces in the lower plate of the base is convex. Therefore, when adhesive is applied under each of the optical elements, lenses, and optical components for mounting on the convex mounting surfaces, even if the adhesive overflows from the convex mounting surfaces, the overflowed adhesive will flow downwards. Thus, it is possible to suppress the adhesive from bulging under the optical elements, lenses, and optical components during bonding, thereby suppressing interference of the adhesive with the optical path of the optical elements, lenses, and optical components.

[0028] Alternatively, the heights of the multiple mounting surfaces can be the same. In this case, when forming multiple convex mounting surfaces by grinding, the fact that the heights of the multiple mounting surfaces are the same improves the grindability. That is, mounting surfaces with the same height can be easily formed by grinding, and the dimensional accuracy of the mounting surfaces can be improved.

[0029] Alternatively, the light component may have two surfaces extending parallel to each other, and the mounting surface of the light component may have two edges extending parallel to the two surfaces of the light component. Alternatively, the distance between the two edges of the mounting surface of the light component may be shorter than the distance between the two surfaces of the light component. In this case, the two surfaces of the light component and the two edges of the mounting surface are arranged parallel to each other, thus eliminating the difference in tilt angle generated by the light component.

[0030] Alternatively, the mounting surface of the base corresponding to the mounting surface of the optical component may have grooves on both sides in the longitudinal direction. In this case, even with a large amount of adhesive, the adhesive can be released into the grooves, thus more reliably suppressing the interference of the adhesive on the optical path.

[0031] Alternatively, the groove may have an outer wall that follows the shape of the optical component. In this case, the outer wall of the groove can be used for passive alignment of the optical component.

[0032] One embodiment of the manufacturing method for an optical device includes: an optical element; a lens optically coupled to the optical element; an optical component disposed between the optical element and the lens, optically coupled to both the optical element and the lens respectively, and performing multiplexing or splitting of input light; and a base having a lower plate and sidewalls, the lower plate having a plurality of convex mounting surfaces for mounting the optical element, the lens, and the optical component respectively, and the sidewalls for socket connection. In this manufacturing method, the mounting surfaces of the base corresponding to the mounting surfaces of the optical component have grooves on both sides in the longitudinal direction, the grooves having outer walls that follow the outline of the optical component. The manufacturing method includes: a step of mounting the optical component on the mounting surface using the outer walls as alignment marks; and a step of aligning the lens.

[0033] In this method of manufacturing an optical device, optical elements, lenses, and optical components are each mounted on a plurality of mounting surfaces. In the lower plate of the base, each of the mounting surfaces is convex. Therefore, when adhesive is applied under each of the optical elements, lenses, and optical components for mounting on the convex mounting surfaces, even if the adhesive overflows from the convex mounting surfaces, the overflowed adhesive will flow downwards. Thus, it is possible to suppress the adhesion of the adhesive under the optical elements, lenses, and optical components during bonding, thereby suppressing interference of the adhesive on the optical path of the optical elements, lenses, and optical components. In this manufacturing method, the lens can be aligned while the optical component is mounted on the mounting surface using the outer wall of the groove as an alignment mark. Therefore, the optical components and lenses can be positioned on each mounting surface with high precision.

[0034] Hereinafter, specific examples of the optical device of this disclosure will be described with reference to the accompanying drawings. It should be noted that the present invention is not limited to the examples described below, but is shown in the claims and is intended to include all modifications within the scope equivalent to the claims. In the description of the drawings, the same or equivalent elements are labeled with the same reference numerals, and repeated descriptions are omitted where appropriate. For ease of understanding, parts of the drawings may sometimes be simplified or exaggerated, and the scale ratios are not limited to those shown in the drawings.

[0035] Figure 1 This is a perspective view showing the optical device 1 of this embodiment. In this embodiment, the optical device 1, which is a light transmitter, is shown as an example. Figure 1 As shown, the optical device 1 includes: a base 2; a cover 3 covering the base 2; a receptacle 4 having a cylindrical sleeve; and a wiring substrate 5. The optical device 1 extends along the longitudinal direction D1, and the receptacle 4, the cover 3 (base 2), and the wiring substrate 5 are arranged in this order.

[0036] Figure 2 This is a perspective view of the light device 1 with the cover 3 removed. (See image below.) Figure 1 and Figure 2 As shown, the base 2 includes: a lower plate 2A extending along the longitudinal direction D1; and a side wall 2B extending from one end of the lower plate 2A in the longitudinal direction D1 along the height direction D2. The base 2 is, for example, made of metal. As an example, the material of the base 2 is Kovar (an alloy in which nickel and cobalt are combined with iron) or SUS (Steel Use Stainless). The base 2 may also be made of iron, chromium, an alloy of iron and chromium, an alloy of iron and nickel, or plastic.

[0037] The base 2, viewed from the width direction D3 of the optical device 1, is L-shaped. The base 2 is also referred to as the L-shaped base. A socket 4 is formed on the side wall 2B for connection and serves as the output light L (see reference). Figure 3 The outlet end of the socket 4 has a hole that penetrates the sidewall 2B in the longitudinal direction D1. The socket 4 is formed in a cylindrical shape. The socket 4 has a plurality of flanges 4c, one of which functions as a guide 4b that determines the position of the socket 4. In the socket 4, when fixed to the base 2, for example, the guide 4b contacts the outer surface 2f of the sidewall 2B.

[0038] Viewed from the height direction D2, for example, the base 2 is rectangular. The base 2 is a component that houses the parts housed inside the optical device 1, and each part of the optical device 1 is mounted on the lower plate 2A. The lower plate 2A is a long strip protruding from the side wall 2B along the longitudinal direction D1, and each part of the optical device 1 is mounted on this long strip. The parts of the optical device 1 are bonded together by an adhesive resin R (see reference). Figure 3 It is fixed to the lower plate 2A. The lower plate 2A has: a main surface 2b, which faces the internal components of the optical device 1; a guide pin 2d, which determines the position of the cover 3 and the wiring substrate 5 relative to the base 2; and an outer surface 2f, which is exposed to the outside of the optical device 1. The main surface 2b is set as a rectangle extending in the longitudinal direction D1 and the width direction D3.

[0039] Guide pin 2d protrudes along the height direction D2 on the main surface 2b. Guide pin 2d is, for example, cylindrical. Guide pin 2d is, for example, located on one side in the width direction D3 (offset from the center of the base 2 in the width direction D3). Cover 3 is a component that covers the base 2 from the height direction D2. The components of the optical device 1 are housed inside the base 2 and cover 3.

[0040] The optical device 1 includes a wiring substrate 5, an optical component 6, a light-receiving element 7 (optical element), a first lens 8 (lens), a light-emitting element 9 (optical element), a spacer 10, and a thermistor 14 inside the base 2 and the cover 3. A portion of the wiring substrate 5 extends from the base 2 and the cover 3 to the opposite side of the socket 4. The portion of the wiring substrate 5 extending to the opposite side of the socket 4 protrudes to the outside of the optical device 1. The optical device 1 also includes a second lens 11 sandwiched between the socket 4 and the optical component 6. For example, the optical device 1 includes four light-emitting elements 9, four first lenses 8, four light-receiving elements 7, an optical component 6, and a second lens 11 (lens).

[0041] The optical device 1 is a four-lane multi-channel light-emitting module comprising four light-emitting elements 9, four first lenses 8, and four light-receiving elements 7. In the optical device 1 with four output light paths L, the optical path length of each output light L is different. The socket 4 is, for example, positioned offset from the center of the base 2 in the width direction D3. The end located on the opposite side of the socket 4 in the width direction D3 (in...) Figure 2 The light path of the output light L from the light-emitting element 9 (located at the upper end) is the longest. The light from the end of the socket 4 located on the width direction D3 (in...) Figure 2 The light path of the output light L of the light-emitting element 9 (located at the lower end) is the shortest.

[0042] A plurality of light-emitting elements 9 and a plurality of light-receiving elements 7 are mounted on a base 2. The plurality of light-emitting elements 9 are arranged along the width direction D3, and the plurality of light-receiving elements 7 are arranged along the width direction D3. For example, each of the four light-emitting elements 9 is mounted on the main surface 2b of the base 2 via a bracket 12. Each light-emitting element 9 is correspondingly arranged with each of the four first lenses 8 and each of the four light-receiving elements 7. Each light-emitting element 9 is, for example, a semiconductor laser diode (LD). The output light L, which is divergent light, emitted from the light-emitting element 9 is converted into collimated light by each of the first lenses 8. In this way, the first lenses 8 are optically coupled to the light-emitting elements 9.

[0043] The wiring substrate 5 is, for example, an FPC (Flexible Printed Circuit) mounted on the base 2. The wiring substrate 5 includes: a first region 5A extending outward from the light device 1; a second region 5B having pads 5b; and a connection region 5C connecting the first region 5A and the second region 5B to each other. When viewed from the height direction D2, the first region 5A, the second region 5B, and the connection region 5C are arranged in a C-shape.

[0044] The first region 5A has a pad 5d that is electrically connected to the light-emitting element 9. For example, each of the plurality of light-emitting elements 9 is connected to the pad 5d via a wire. The first region 5A is located at a higher position than the second region 5B (a position further away from the main surface 2b of the base 2 than the second region 5B). For example, the height of the first region 5A is the same as the height of the bracket 12 that mounts the light-emitting elements 9. As a result, the length of the wires extending from each light-emitting element 9 to the pad 5d can be shortened.

[0045] For example, a wiring substrate 5 has a first region 5A as the upper layer and a second region 5B as the lower layer, which are fixed to the base 2 by adhesive bonding. The second region 5B is located at a lower position than the first region 5A, for example, in contact with the main surface 2b of the base 2. Because the second region 5B is located at a lower position, the wires extending from the wiring substrate 5 or the light-receiving element 7 do not interfere with the output light L passing through the light-emitting element 9 and the first lens 8.

[0046] The width (length in the width direction D3) of the connection region 5C of the wiring substrate 5 is narrower than the width of the first region 5A and the width of the second region 5B. The connection region 5C is located, for example, at the end of the socket 4 side in the width direction D3. The connection region 5C extends from the end of the first region 5A in the width direction D3 to the end of the second region 5B in the width direction D3. The thickness of the wiring substrate 5 in the first region 5A and the thickness of the wiring substrate 5 in the second region 5B are, for example, the same. The connection region 5C extends in the longitudinal direction D1 between the first region 5A and the second region 5B, for example, located at the end of the base 2 in the width direction D3. The connection region 5C has a height difference or an inclined portion located between the first region 5A and the second region 5B. In this embodiment, an example is shown where the connection region 5C has an inclined portion 5f.

[0047] A spacer 10 is disposed between the first region 5A and the base 2, for example, ensuring the height of the first region 5A. It should be noted that a reinforcing plate made of insulating material can also be provided in the first region 5A of the wiring substrate 5 instead of the spacer 10. In this case, a wiring pattern can also be formed on the lower surface of the first region 5A.

[0048] The output light L emitted from the light-emitting element 9 via the first lens 8 is input to the optical component 6 via the light-receiving element 7. The optical component 6 is disposed between the light-emitting element 9 and the second lens 11, optically coupling the light-emitting element 9 and the second lens 11. The optical component 6 performs a multiplexing of the input light (output light L) input to the optical component 6. For example, the optical component 6 is an optical multiplexer that performs multiplexing of four output light L. The four output light L are combined into one output light L inside the optical component 6 and output from the optical component 6 to the second lens 11. The second lens 11 converges the output light L from the optical component 6 to an optical fiber held in the socket 4, and the output light L is output to the outside of the optical device 1 via the optical fiber held in the socket 4. The second lens 11 is optically coupled to the light-emitting element 9 via the optical component 6.

[0049] The light-receiving element 7 is a monitoring PD (PhotoDiode) that monitors the output light L from each of the plurality of light-emitting elements 9. The light-receiving element 7 monitors the intensity of the output light L by receiving a portion of the output light L from the light-emitting elements 9. For example, each of the four light-receiving elements 7 is mounted on the main surface 2b of the base 2 via a bracket formed of a dielectric material. The light-receiving element 7 converts a portion of the output light L from the light-emitting elements 9 into an electrical signal and outputs the converted electrical signal via a wire (not shown) to a pad 5b on the wiring board 5. The light-receiving element 7 and the wire extending from the light-receiving element 7 to the pad 5b are located closer to the light output side (socket 4 side) than the light-emitting elements 9. By outputting an electrical signal from the light-receiving element 7, APC (Auto Power Control) can be performed on the output light L from the light-emitting elements 9.

[0050] The second region 5B is a PD wiring FPC with pads 5b for wiring to the light-receiving element 7, located on the light output side (socket 4 side) of the light-receiving element 7. The light-receiving element 7 is a surface-incident type light-receiving element. The light-receiving element 7 is configured, for example, to have its light-receiving surface tilted relative to the optical axis of the output light L. By configuring the light-receiving element 7 with its light-receiving surface tilted relative to the optical axis of the output light L, the light-receiving element 7 receives a portion of the output light L.

[0051] Therefore, by arranging the light-receiving element 7 on the light output side of the light-emitting element 9, the output light L can be monitored with a simple configuration on the light output side. The wiring, such as wires, used for monitoring the PD, of the light-receiving element 7 is located closer to the light output side than the light-receiving element 7. Therefore, electrical connection to the light-receiving element 7 can be made without reducing its light-receiving sensitivity. The light-receiving element 7 is, for example, directly wired to the pad 5b on the wiring board 5, thus eliminating the need for a separate bracket or the like. This contributes to cost reduction.

[0052] Furthermore, such as Figure 3As shown, assuming that the mounting surface of the base 2 on which the internal component X (e.g., the aforementioned optical component 6, first lens 8, or second lens 11) of the light supply device 1 is mounted is a flat surface, the adhesive resin R may overflow into the optical path of the output light L. Thus, the resin R used to bond the component X may interfere with the optical path of the output light L.

[0053] Figure 4 This is a three-dimensional diagram showing the structure of the base 2, which can suppress the interference of resin R on the output light L. Figure 5 It means Figure 4 A three-dimensional view of base 2. (See figure) Figure 4 and Figure 5 As shown, the base 2 has a pair of upwardly projecting protrusions 2k at its end opposite the sidewall 2B in the longitudinal direction D1. The pair of protrusions 2k are arranged in the width direction D3. The first region 5A has a pair of recesses 5c arranged in the width direction D3. The wiring board 5 is fixed to the base 2 by the protrusions 2k engaging with the recesses 5c.

[0054] The base 2 has a convex mounting surface 2c for mounting components. The mounting surface 2c is the adhesive base for the components. The mounting surface 2c is the surface on which multiple optical components of the light supply device 1 are respectively mounted. For example, the base 2 has multiple mounting surfaces 2c on the main surface 2b. Each of the multiple mounting surfaces 2c respectively mounts the light component 6, the first lens 8, the second lens 11, and the bracket 12. The mounting surface 2c is a portion that protrudes along the height direction D2 on the main surface 2b. Each mounting surface 2c is located at a position higher than the main surface 2b. For example, the multiple mounting surfaces 2c are set to the same height as each other. In this case, when the multiple mounting surfaces 2c are formed by grinding, the grindability and dimensional accuracy can be improved.

[0055] Figure 6 This is a schematic side view showing component X, mounting surface 2c, and resin R of the optical device 1. Figure 6 As shown, when component X is mounted on mounting surface 2c via resin R, even if resin R overflows from component X, the overflowed resin R will flow below mounting surface 2c. This prevents resin R from interfering with the output light L. For example, when component X is viewed from the height direction D2, mounting surface 2c falls into component X. Mounting surface 2c falls into the surface X1 (e.g., the lower surface) of component X opposite to base 2. Therefore, resin R can more reliably flow from surface X1 of component X mounted on mounting surface 2c to the lower surface, thereby reducing the possibility of resin R interfering with the output light L.

[0056] Figure 7 This is a top view showing the mounting surface 2c of the exemplary light component 6. (See attached image.) Figure 4 and Figure 7As shown, the light component 6 has two surfaces 6b extending parallel to each other, and the mounting surface 2c on which the light component 6 is mounted has two edges 2g extending parallel to the two surfaces 6b. For example, a groove 2h lower than the main surface 2b is formed around the mounting surface 2c. The groove 2h is provided, for example, on one side and the other side of the mounting surface 2c in the longitudinal direction D1.

[0057] The groove 2h has an outer wall 2j that runs along the shape of the light component 6. The outer wall 2j is the wall that forms the shape of the mounting surface 2c and the groove 2h when viewed from the height direction D2. For example, the distance from the mounting surface 2c to the end side of the outer wall 2j in the longitudinal direction D1 is constant and is independent of its position in the width direction D3. That is, the aforementioned distance can be kept constant by the mounting surface 2c having an edge 2g parallel to the surface 6b of the light component 6. The mounting surface 2c and the outer wall 2j (light component 6) are designed to be point-symmetric with respect to the center O when viewed from the height direction D2. As an example, the mounting surface 2c, the groove 2h, and the outer wall 2j are designed as parallelograms. By making the mounting surface 2c a parallelogram, the offset of the position (height from the main surface 2b of the base 2) of each incident surface of the surface 6b caused by the tilt angle of the surface 6b of the light component 6 can be kept constant.

[0058] The manufacturing method of the optical device according to this embodiment will be described. Hereinafter, the manufacturing method of the exemplary optical device 1 will be described. First, a base 2 is prepared. Then, as... Figure 8 and Figure 9 As shown, the socket 4 and base 2 are positioned. It should be noted that the socket 4, whose position relative to the base 2 has been adjusted, is fixed to the base 2 by YAG (Yttrium Aluminum Garnet) soldering. The wiring board 5, the bracket 12 housing the light-emitting element 9, the light-receiving element 7, the thermistor 14, and the light component 6 are then mounted. At this time, the light component 6 is mounted on the mounting surface 2c using the outer wall 2j as an alignment mark (the process of mounting the light component). Thus, passive alignment can be achieved by using the outer wall 2j of the groove 2h, which is shaped like the light component 6.

[0059] Next, the first lens 8 and the second lens 11 are mounted on the mounting surfaces 2c of the base 2. Then, output light L is emitted from the installed light-emitting element 9, and the first lens 8 and the second lens 11 are aligned (lens alignment process). After aligning the first lens 8 and the second lens 11 to the position where the intensity of the output light L is greatest, the first lens 8 and the second lens 11 are fixed (active alignment).

[0060] The effects obtained by the optical device 1 and the manufacturing method of the optical device according to this embodiment will be explained. In the optical device 1 and the manufacturing method of the optical device according to this embodiment, the base 2 has a lower plate 2A and a side wall 2B, and the lower plate 2A has a plurality of mounting surfaces 2c. The light-emitting element 9 (bracket 12), the first lens 8, the second lens 11, and the light component 6 are respectively mounted on each of the plurality of mounting surfaces 2c.

[0061] In the lower plate 2A of the base 2, multiple mounting surfaces 2c are each designed to be convex. Therefore, when resin R is applied under each of the light-emitting element 9, the first lens 8, the second lens 11, and the light component 6 for mounting onto the convex mounting surfaces 2c, even if resin R overflows, the overflowed resin R will flow out from the mounting surface 2c downwards. Thus, it is possible to suppress the resin R from bulging under the light-emitting element 9, the first lens 8, the second lens 11, and the light component 6 during bonding. This suppresses interference of the resin R with the optical path of the light-emitting element 9, the first lens 8, the second lens 11, and the light component 6. Furthermore, since the bonding area formed by the resin R is convex, the bonding area formed by the resin R can be controlled. For example, it is possible to suppress deformation of the light component 6 caused by differences in the coefficients of linear expansion when the external temperature changes.

[0062] Alternatively, the heights of the multiple mounting surfaces 2c can be the same. In this case, when forming the convex mounting surfaces 2c by grinding, the fact that the heights of the multiple mounting surfaces 2c are the same improves the grindability. That is, mounting surfaces 2c with the same height can be easily formed by grinding, and the dimensional accuracy of the mounting surfaces 2c can be improved. Moreover, the dimensional tolerances can be made smaller, thus suppressing unevenness in optical coupling efficiency.

[0063] Alternatively, the light component 6 may have two surfaces 6b extending parallel to each other, and the mounting surface 2c of the light component 6 may have two edges 2g extending parallel to the two surfaces 6b of the light component 6. Alternatively, the distance between the two edges 2g of the mounting surface 2c of the light component 6 may be shorter than the distance between the two surfaces 6b of the light component 6. In this case, the two surfaces 6b of the light component 6 and the two edges 2g of the mounting surface 2c are arranged parallel to each other, thus eliminating the difference in tilt angle generated by the light component 6.

[0064] Alternatively, grooves 2h can be provided on both sides of the mounting surface 2c of the base 2, which corresponds to the mounting surface 2c of the optical component 6, in the longitudinal direction D1. In this case, even if the amount of resin R is large, the resin R can be released into the grooves 2h, thus more reliably suppressing the interference of resin R on the optical path.

[0065] Alternatively, the groove 2h may have an outer wall 2j that follows the outline of the optical component 6. In this case, the outer wall 2j of the groove 2h can be used for passive alignment of the optical component 6.

[0066] In the manufacturing method of the optical device of this embodiment, the light-emitting element 9, the first lens 8, the second lens 11, and the optical component 6 are respectively mounted on each of the plurality of mounting surfaces 2c. The first lens 8 and the second lens 11 can be aligned by using the outer wall 2j of the groove portion 2h of the base 2 as an alignment mark on the mounting surface 2c. Therefore, the optical component 6, the first lens 8, and the second lens 11 can be positioned on the mounting surface 2c with high precision.

[0067] The base 2 can be manufactured using MIM (Metal Powder Injection Molding). In this case, the manufacturing cost of the base 2 can be reduced. In the base 2, the side wall 2B for assembling the socket 4 and the lower plate 2A for mounting the component are integrated, thus forming a base 2 that is less prone to component tolerances and has high rigidity. The base 2 has a pair of upwardly projecting protrusions 2k at the end opposite the side wall 2B in the longitudinal direction D1. Therefore, even if the component is mistakenly... Figure 4 The base 2 with the mounted components shown is arranged upside down. Since the side wall 2B and the protrusion 2k will touch the base plate, interference between the mounted components and the base plate can be avoided.

[0068] Reference Figure 10 The modified base 22 will be described below. In addition to a convex mounting surface 2c for mounting components, the base 22 also has a protrusion 22c for fixing a component mounting clamp. The protrusion 22c and the mounting surface 2c are, for example, arranged along the width direction D3. In this case, the position of the protrusion 22c in the length direction D1 is the same as the position of the mounting surface 2c in the length direction D1. For example, the height of the protrusion 22c is the same as the height of the mounting surface 2c.

[0069] Reference Figure 11 The base 32 of another variation will now be described. The base 32 has a protrusion 32c instead of the aforementioned mounting surface 2c. This protrusion 32c has a planar shape that is longer in the width direction D3 than the planar shape (the shape viewed from the height direction D2) of the component (e.g., the second lens 11). The protrusion 32c has an abutment portion for the component mounting clamp to abut against during component mounting.

[0070] Figure 12 and Figure 13This is a perspective view showing an exemplary component mounting fixture 40. The component mounting fixture 40 is a fixture for positioning the sleeve 4A of the socket 4 and the base 2. The component mounting fixture 40 includes a base holding portion 41 for holding the base 2 and a sleeve holding portion 42 for holding the sleeve 4A. The base holding portion 41 has an opposing portion 41b facing the main surface 2b side of the lower plate 2A of the base 2 and a holding portion 41c for holding the base 2 when the lower plate 2A is facing the opposing portion 41b.

[0071] In the aforementioned base 22 with protrusion 22c and base 32 with protrusion 32c, the sleeve 4A can be positioned relative to the base 22 or base 32 while the protrusion 22c or protrusion 32c abuts against the contact surface 41d of the opposing portion 41b. Therefore, the sleeve 4A can be positioned while the base 22 or base 32 is stable, thus improving the positional accuracy of the sleeve 4A relative to the component mounted on the base 22 or base 32. As a result, the alignment tolerance of the optical component can be increased, and manufacturability can be improved. It should be noted that the sleeve 4A, after being positioned relative to the base 22 or base 32, is fixed to the base 22 or base 32 by YAG welding.

[0072] The embodiments of the optical device disclosed herein have been described above. However, the present invention is not limited to the embodiments described above. That is, those skilled in the art will readily recognize that various modifications and alterations can be made to the present invention without changing the spirit of the claims. For example, the shape, size, quantity, material, and configuration of the components of the optical device are not limited to the above descriptions and can be appropriately modified.

[0073] For example, in the above embodiment, optical device 1, which is an optical transmitter, was exemplified. However, the optical device of this disclosure may also be an optical device other than an optical transmitter, such as an optical receiver. Furthermore, in the above embodiment, optical component 6, which is an optical multiplexer, was exemplified. However, the optical component may also be an optical component other than an optical multiplexer, such as an optical demultiplexer that divides the input light. Thus, the types of optical devices and components mounted on the optical device can be appropriately changed.

[0074] Explanation of reference numerals in the attached figures

[0075] 1...optical device;

[0076] 2, 22, 32... base;

[0077] 2A... lower board;

[0078] 2B...side wall;

[0079] 2b...Main face;

[0080] 2c……Equipped with surface;

[0081] 2d……Guide pin;

[0082] 2f……outer surface;

[0083] 2g...side;

[0084] 2h……groove section;

[0085] 2j……Outer wall;

[0086] 2k...protrusion;

[0087] 3...cover;

[0088] 4...sockets;

[0089] 4A...sleeve;

[0090] 4b...guide component;

[0091] 4c……Flange;

[0092] 5... Wiring substrate;

[0093] 5A...First Zone;

[0094] 5b, 5d... pads;

[0095] 5B...Second Zone;

[0096] 5C...connection area;

[0097] 5c...concave;

[0098] 5f……sloping part;

[0099] 6...optical components;

[0100] 6b...face;

[0101] 7...light receiving element (optical element);

[0102] 8……First lens (lens);

[0103] 9...light-emitting elements (optical elements);

[0104] 10...spacers;

[0105] 11……Second lens (lens);

[0106] 12... bracket;

[0107] 14...Thermistor;

[0108] 22c, 32c...convex part;

[0109] 40…… Fixtures for component installation;

[0110] 41...base retaining part;

[0111] 41b……Opposite part;

[0112] 41c……Retention section;

[0113] 41d……Abutment surface;

[0114] 42……Sleeve retaining part;

[0115] D1……long dimension direction;

[0116] D2...height direction;

[0117] D3……width direction;

[0118] L...outputs light;

[0119] O……center;

[0120] R... resin (adhesive);

[0121] X... component;

[0122] X1……face.

Claims

1. An optical device comprising: an optical element; a lens optically coupled to the optical element; an optical component disposed between the optical element and the lens, performing optical coupling between the optical element and the lens, and performing multiplexing or demultiplexing of input light, the optical component having an optical input surface and an optical output surface, the optical input surface and the optical output surface having surfaces inclined with respect to an optical axis of the input light, the optical input surface being parallel to the optical output surface; and a base having a lower plate and a side wall, the lower plate having a convex mounting surface on a surface thereof for mounting the optical component, the side wall being for connection of a socket, the mounting surface of the lower plate of the base having two parallel sides, the distance between the two parallel sides being smaller than the distance between the optical input surface and the optical output surface of the optical component, the optical input surface and the optical output surface of the optical component being in parallel with the two parallel sides of the mounting surface, the optical component being disposed on the mounting surface with the two parallel sides of the mounting surface located inward of the optical input surface and the optical output surface of the optical component, the lower plate having a convex other mounting surface for mounting the optical element, the mounting surface and the other mounting surface being the same height as each other, the mounting surface and the other mounting surface being parallel to the surface of the lower plate.

2. The optical device according to claim 1, wherein the optical component is a multiplexer that multiplexes a plurality of the input light.

3. The optical device according to claim 1, wherein the optical component is a demultiplexer that demultiplexes the input light into a plurality of output light.

4. The optical device according to claim 2, wherein the lower plate further has a convex light-receiving element mounting surface for mounting a light-receiving element that receives the input light, the light-receiving element mounting surface being non-parallel to the surface of the lower plate and facing an opposite side of the side wall.

5. A method of manufacturing an optical device, the method of manufacturing an optical device according to claim 1, comprising: a process of mounting the optical component on the mounting surface using the two parallel sides of the mounting surface as alignment marks; and a process of adjusting the center of the lens. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

Images