Substrate supporting and fixing mechanism and thin film deposition equipment

Abstract

The present invention is a substrate supporting and fixing mechanism, which mainly includes a baffle, a cover ring and a carrier plate, wherein the baffle is used to carry the cover ring. The annular bottom of the baffle is connected to the side wall and the annular protrusion, and an opening is formed on the radial inner side of the annular protrusion. The carrier plate is used to carry a substrate, wherein the carrier plate is located below the cover ring and can enter the opening of the baffle. The cover ring includes a main body and a shielding part, wherein the main body is an annular body, and part of the main body covers the opening of the baffle. The shielding part is connected to the radial outer side of the main body and protrudes toward the annular bottom of the baffle, wherein the distance between the shielding part of the cover ring and the side wall of the baffle is between 3 and 10 mm, which can prevent process gas or target material atoms from being transmitted to the outside of the baffle through the gap between the cover ring and the baffle.

Description

Technical Field

[0001] The invention relates to a substrate carrying and fixing mechanism, which is used to fix the substrate on a carrying plate and can reduce the contamination of a cavity by process gas or target material atoms. Background Art

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD) and atomic layer deposition (ALD) are all commonly used thin film deposition equipment and are widely used in the manufacturing processes of integrated circuits, light emitting diodes and displays.

[0003] The deposition equipment mainly includes a chamber and a carrier plate, wherein the carrier plate is located in the chamber and is used to carry at least one substrate. Taking physical vapor deposition as an example, a target material needs to be set in the chamber, wherein the target material faces the substrate on the carrier plate. When performing physical vapor deposition, the substrate will be fixed on the carrier plate by a fixing device, and an inert gas and / or a reaction gas will be transported into the chamber, and a bias voltage will be applied to the target material and the carrier plate respectively, wherein the carrier plate will also heat the carried substrate. The inert gas in the chamber will form ionized inert gas due to the action of the high voltage electric field. The ionized inert gas will be attracted by the bias voltage on the target material and bombard the target material. The target atoms or molecules splashed from the target material will be attracted by the bias voltage on the carrier plate and deposited on the surface of the heated substrate to form a thin film on the surface of the substrate.

[0004] In addition, when performing a physical vapor deposition process, the carrier plate can be displaced relative to the target material, and the distance between the substrate carried by the carrier plate and the target material can be changed to adjust the parameters of the deposition process. Summary of the invention

[0005] As described in the prior art, conventional thin film deposition equipment can change the parameters of the deposition process by adjusting the distance between the carrier plate and the target material. However, the adjustable range of the distance between the carrier plate and the target material of conventional thin film deposition equipment is very small. When the carrier plate is displaced toward the target material, it may cause process gases and / or target atoms and / or target molecules to be transferred to the cavity and form a thin film deposition on the inner surface of the cavity, thereby causing contamination to the cavity. For this reason, the present invention proposes a novel substrate supporting and fixing mechanism and a thin film deposition device using the substrate supporting and fixing mechanism, which can increase the adjustable range of the distance between the carrier plate and the target material and reduce the process gases and / or target atoms and / or target molecules from entering the cavity.

[0006] One object of the present invention is to provide a substrate holding and fixing mechanism and a thin film deposition device, which mainly include a holding plate, a cover ring and a stopper, wherein the holding plate is used to hold at least one substrate. The stopper is used to hold the cover ring, and when the holding plate drives the held substrate to approach the cover ring, the cover ring will contact the substrate to fix the substrate on the holding plate, and a reaction space is formed between the stopper, the cover ring, the holding plate and / or the chamber.

[0007] The spacing between the side of the cover ring of the present invention and the baffle is less than 10 mm, so as to improve the shielding effect of the cover ring and the baffle on the cavity, and to prevent the reaction gas, target atoms and / or target molecules in the reaction space from contacting the cavity outside the cover ring and / or the baffle, so as to reduce the thin film deposition on the inner surface of the cavity.

[0008] In addition, the carrier plate can drive the carried substrate and cover ring to continue approaching the target material, so that the cover ring leaves the blocking member, thereby further shortening the distance between the substrate and the target material. Since the distance between the cover ring and the blocking member of the present invention is small, even if the cover ring leaves the blocking member, the cover ring and the blocking member can still provide a good shielding effect, thereby preventing the reaction gas, target material atoms and / or target material molecules in the reaction space from being transferred to the cavity outside the cover ring and / or the blocking member.

[0009] One object of the present invention is to provide a substrate supporting and fixing mechanism and a thin film deposition device, wherein the cover ring includes a first cover ring and a second cover ring, and the radius of the first cover ring is larger than that of the second cover ring, and is used to support the second cover ring. When the carrier plate contacts the cover ring, only the second cover ring will contact the substrate on the carrier plate, and the carrier plate is used to support the first cover ring. The design of the first cover ring and the second cover ring can reduce the pressure applied by the cover ring on the substrate, and reduce the probability of the substrate being crushed by the cover ring.

[0010] In order to achieve the above-mentioned purpose, the present invention proposes a substrate supporting and fixing mechanism, comprising: a stopper, comprising a side wall, an annular bottom and an annular protrusion, wherein the annular bottom connects the side wall and the annular protrusion and forms an opening on a radial inner side of the annular protrusion; a cover ring, which is placed on the stopper and comprises: a main body, which is an annular body, wherein a part of the main body is located at an extended position of the opening of the stopper; a shielding portion, which is connected to a radial outer side of the main body and comprises a first protrusion protruding toward the annular bottom of the stopper, or protruding toward a direction away from the annular bottom of the stopper, wherein the spacing between the shielding portion and the side wall of the stopper is between 3 and 10 mm; and a carrying plate, comprising a carrying surface for carrying a substrate, wherein the carrying plate is located below the cover ring, and when the carrying plate drives the substrate to move toward the cover ring, the main body of the cover ring will contact the substrate.

[0011] The present invention provides a thin film deposition device, comprising: a cavity, comprising an accommodating space; a substrate supporting and fixing mechanism, located in the accommodating space, comprising: a stopper, comprising a side wall, an annular bottom and an annular convex portion, wherein the side wall is connected to the cavity, and the annular bottom is connected to the side wall and the annular convex portion, and an opening is formed on a radial inner side of the annular convex portion; a cover ring, used to be placed on the stopper, and comprising: a main body, the main body is an annular body, wherein a part of the main body is located at an extended position of the opening of the stopper; a shielding portion, connected to a radial outer side of the main body, and comprising a first protrusion protruding toward the annular bottom of the stopper, wherein the spacing between the shielding portion and the side wall of the stopper is between 3 and 10 mm; and a carrying plate, comprising a carrying surface for carrying a substrate, wherein the carrying plate is located below the cover ring, and when the carrying plate drives the substrate to move toward the cover ring, the main body of the cover ring will contact the substrate.

[0012] In the substrate supporting and fixing mechanism and thin film deposition equipment, the shielding portion includes a second protruding portion protruding in a direction away from the annular bottom of the blocking member.

[0013] In the substrate supporting and fixing mechanism and thin film deposition equipment, the cover ring and the supporting plate are respectively provided with a corresponding alignment unit, and the cover ring and the supporting plate are aligned through the alignment unit.

[0014] The substrate supporting and fixing mechanism and thin film deposition equipment are described, wherein the cover ring includes a first cover ring and a second cover ring, the circumference of the first cover ring is larger than that of the second cover ring, and is used to support the second cover ring, when the supporting plate moves toward the cover ring, the supporting plate is used to support the first cover ring, and the second cover ring will contact the substrate, the first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and the second cover ring and the first cover ring are aligned through the alignment unit.

[0015] The substrate supporting and fixing mechanism and thin film deposition equipment include an annular component connected to a supporting plate, the annular component is located around the supporting surface of the supporting plate, wherein the annular component and the cover ring are respectively provided with a corresponding alignment unit, and the annular component and the cover ring are aligned through the alignment unit.

[0016] The thin film deposition equipment includes a target material arranged in a cavity and facing a carrier plate and a substrate. The carrier plate is located in an opening of a stopper and drives a cover ring to leave the stopper to shorten the distance between the substrate on the carrier plate and the target material.

[0017] The beneficial effects of the present invention are: providing a substrate carrying and fixing mechanism for fixing the substrate on a carrying plate and reducing the contamination of the cavity by process gas or target material atoms. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a cross-sectional schematic diagram of an embodiment of a substrate supporting and fixing mechanism of the present invention.

[0019] Figure 2 It is a cross-sectional schematic diagram of an embodiment of the thin film deposition equipment of the present invention operating in the material loading and unloading state.

[0020] Figure 3 It is a cross-sectional schematic diagram of an embodiment of the thin film deposition apparatus of the present invention operating in a deposition state.

[0021] Figure 4 FIG. 4 is a cross-sectional schematic diagram of another embodiment of the thin film deposition apparatus of the present invention operating in a deposition state.

[0022] Figure 5 It is a cross-sectional schematic diagram of another embodiment of the substrate supporting and fixing mechanism of the present invention.

[0023] Figure 6 It is a cross-sectional schematic diagram of another embodiment of the substrate supporting and fixing mechanism of the present invention.

[0024] Figure 7 It is a cross-sectional schematic diagram of another embodiment of the substrate supporting and fixing mechanism of the present invention.

[0025] Explanation of the reference numerals: 10-substrate supporting and fixing mechanism; 100-thin film deposition equipment; 11-supporting plate; 111-supporting surface; 113-recess; 115-annular component; 12-substrate; 13-blocking member; 131-side wall; 132-opening; 133-annular bottom; 135-annular convex portion; 14-accommodating space; 141-reaction space; 15-cover ring; 151-main body; 153-shielding portion; 1531-first raised portion; 1533-second raised portion; 1535-raised portion; 155-protruding portion; 157-first cover ring; 159-second cover ring; 161-lifting unit; 163-supporting component; 17-cavity; 171: substrate inlet and outlet; 19-target material. DETAILED DESCRIPTION

[0026] See also Figure 1 and Figure 2 , respectively, are a cross-sectional schematic diagram of an embodiment of a substrate carrying and fixing mechanism of the present invention and a cross-sectional schematic diagram of an embodiment of a thin film deposition apparatus of the present invention operating in a material loading and unloading state. As shown in the figure, the substrate carrying and fixing mechanism 10 is used to carry and fix at least one substrate 12, and mainly includes at least one carrier plate 11, a stopper 13 and a cover ring 15, wherein the stopper 13 is used to carry the cover ring 15, and the carrier plate 11 is located below the cover ring 15 and / or the stopper 13.

[0027] The carrier plate 11 includes a carrier surface 111 for carrying the substrate 12. The top view of the cover ring 15 and / or the stopper 13 is approximately annular, wherein the stopper 13 includes a side wall 131, an annular bottom 133 and an annular protrusion 135, and the annular bottom 133 connects the side wall 131 and the annular protrusion 135.

[0028] The appearance of the side wall 131 of the blocking member 13 is approximately cylindrical, hollow columnar, hollow cylindrical or hollow truncated cone-shaped, wherein one end of the side wall 131 of the blocking member 13 can be connected to the cavity 17 , and the other end of the side wall 131 is connected to the annular bottom 133 .

[0029] The annular bottom 133 has an approximately circular appearance, wherein one end of the annular bottom 133 is connected to the side wall 131 of the stopper 13, for example, the radial outer side of the annular bottom 133 is connected to the bottom end of the side wall 131, wherein the angle between the side wall 131 and the annular bottom 133 is approximately 90 degrees.

[0030] The annular protrusion 135 has an appearance similar to a cylinder, a hollow column, a hollow cylindrical body or a hollow truncated cone, wherein one end of the annular protrusion 135 is connected to the radial inner side of the annular bottom 133, and an opening 132 is formed on a radial inner side of the annular protrusion 135. Specifically, the side wall 131 and the annular protrusion 135 are respectively connected to the radial outer side and the radial inner side of the annular bottom 133, and protrude or extend in the same direction, wherein the height of the side wall 131 is greater than that of the annular protrusion 135.

[0031] The cover ring 15 includes a main body 151 and a shielding portion 153, wherein the main body 151 is an annular body, and the shielding portion 153 has an appearance similar to a cylinder, a hollow column, a hollow cylindrical body or a hollow truncated cone. Specifically, the shielding portion 153 is connected to the radial outer side of the main body 151, wherein the angle between the shielding portion 153 and the main body 151 is approximately 90 degrees.

[0032] The cover ring 15 can be placed on the stopper 13, for example, the annular protrusion 135 of the stopper 13 is used to support the lower surface of the main body 151 of the cover ring 15. When the cover ring 15 is placed on the annular protrusion 135 of the stopper 13, part of the main body 151 will extend toward the radial inner side of the annular bottom 133 and / or the annular protrusion 135 of the stopper 13, and be located at the extended position of the opening 132 of the stopper 13, so as to shield or cover part of the opening 132. In addition, part of the main body 151 will extend toward the radial outer side of the annular bottom 133 and / or the annular protrusion 135 of the stopper 13, and shield or cover most of the annular bottom 133.

[0033] Specifically, the cover ring 15 of the present invention extends toward the side wall 131 of the baffle 13 and reduces the distance between the shielding portion 153 of the cover ring 15 and the side wall 131, wherein the distance is between 3 and 10 millimeters (mm). Through the special design of the cover ring 15 of the present invention, the shielding effect of the cover ring 15 and the baffle 13 can be improved to reduce the reaction gas and / or the target atoms and / or target molecules generated during the deposition process from contacting the cavity 17 outside the baffle 13.

[0034] like Figure 2 The thin film deposition apparatus 100 shown mainly includes a chamber 17 and a substrate holding and fixing mechanism 10, wherein the substrate holding and fixing mechanism 10 is located in a receiving space 14 of the chamber 17. One end of the stopper 13 can be connected to the chamber 17, and the other end is used to carry the cover ring 15. The carrier plate 11 is located below the cover ring 15 and / or the stopper 13, and can be displaced relative to the cover ring 15 and / or the stopper 13.

[0035] A substrate inlet and outlet 171 may be provided on the cavity 17, wherein the carrier plate 11 may be displaced in a direction away from the cover ring 15 and / or the stopper 13, so that the height of the carrier surface 111 of the carrier plate 11 is close to the substrate inlet and outlet 171. Then, a robot arm may be used to place the substrate 12 outside the cavity 17 on the carrier surface 111 of the carrier plate 11 through the substrate inlet and outlet 171. In addition, the robot arm may also transport the substrate 12 on the carrier surface 111 of the carrier plate 11 to the outside of the cavity 17 through the substrate inlet and outlet 171.

[0036] In one embodiment of the present invention, the thin film deposition apparatus 100 may be a physical vapor deposition device, and a target 19 is disposed in the chamber 17, wherein the target 19 faces the carrier plate 11 and / or the substrate 12. At least one gas inlet may be disposed on the chamber 17, wherein the gas inlet fluid is connected to the accommodating space 14 of the chamber 17, and is used to transport a process gas into the accommodating space 14 for performing a deposition process, for example, the process gas may be an inert gas or a reactive gas. In addition, a gas extraction port may be disposed on the chamber 17, and the gas in the chamber 17 may be extracted through the gas extraction port by a pump, so that the accommodating space 14 is at low pressure or vacuum.

[0037] like Figure 3 As shown, the carrier plate 11 can drive the substrate 12 carried by it to move toward the cover ring 15, the stopper 13 and / or the target material 19, so that the carrier plate 11 is located in the opening 132 of the stopper 13, wherein the main body 151 of the cover ring 15 contacts the substrate 12 on the carrier plate 11, so as to fix the substrate 12 on the carrier plate 11. At this time, the carrier plate 11, the cover ring 15, the stopper 13 and the cavity 17 define a reaction space 141 in the accommodating space 14, and perform thin film deposition on the surface of the substrate 12 in the reaction space 141. The reaction space 141 is basically an isolated space in the accommodating space 14, wherein the reaction gas, target material atoms and / or target material molecules in the reaction space 141 will not contact the cavity 17 outside the stopper 13, so as to avoid deposition of thin films on the surface of the cavity 17, thereby causing contamination of the cavity 17.

[0038] like Figure 4 and Figure 5As shown, the carrier plate 11 in the opening 132 of the stopper 13 can continue to drive the substrate 12 to move toward the target 19 to shorten the distance between the target 19 and the substrate 12 carried by the carrier plate 11. At this time, the carrier plate 11 also carries the cover ring 15 and drives the cover ring 15 to leave the stopper 13.

[0039] Since the gap between the shielding portion 153 of the cover ring 15 of the present invention and the side wall 131 of the baffle 13 is less than 10 mm, even if the carrier plate 11 drives the cover ring 15 to leave the baffle 13, the reaction gas, target atoms and / or target molecules in the reaction space 141 can still be prevented from entering the accommodating space 14 outside the baffle 13.

[0040] Specifically, the thin film deposition apparatus 100 of the present invention can avoid the formation of a deposited thin film on the inner surface of the chamber 17, and increase the adjustable range of the distance between the substrate 12 carried by the carrier plate 11 and the target 19. In this way, the distance between the substrate 12 and the target 19 can be adjusted according to the requirements of the deposition process to improve the uniformity of the thin film deposited on the surface of the substrate 12.

[0041] In comparison, the adjustable range of the distance between the substrate 12 carried by the carrier plate 11 of a general deposition chamber and the target material 19 is smaller. If one wishes to reduce the distance between the carrier plate 11 and the target material 19, this will often result in an excessively large gap between the cover ring 15 and the baffle 13, causing the reaction gas, target material atoms and / or target material molecules in the reaction space 141 to enter the accommodating space 14 outside the baffle 13, thereby forming a thin film deposition on the inner surface of the cavity 17.

[0042] In addition, the gap between the shielding portion 153 of the cover ring 15 of the present invention and the side wall 131 of the blocking member 13 is greater than 3 mm to avoid electrical conduction between the cover ring 15 and the blocking member 13 and to prevent the shielding portion 153 of the cover ring 15 from contacting or rubbing against the side wall 131 of the blocking member 13 to generate particle contamination.

[0043] In one embodiment of the present invention, Figure 1 As shown, a corresponding alignment unit can be respectively provided between the cover ring 15 and the carrier plate 11, for example, a protrusion 155 is provided on the lower surface of the cover ring 15, and a recess 113 is provided on the carrier plate 11, wherein a corresponding inclined surface is provided between the protrusion 155 and the recess 113. When the carrier plate 11 approaches the cover ring 15, the protrusion 155 of the cover ring 15 will contact the recess 113 of the carrier plate 11, and the cover ring 15 and the carrier plate 11 are aligned.

[0044] In another embodiment of the present invention, the carrier plate 11 may include an annular component 115 , wherein the annular component 115 is located around the carrier surface 111 of the carrier plate 11 , and corresponding alignment units are disposed between the cover ring 15 and the annular component 115 to align the cover ring 15 and the annular component 115 .

[0045] In one embodiment of the present invention, the substrate supporting and fixing mechanism 10 may include at least one lifting unit 161 and a supporting component 163, wherein the supporting component 163 is arranged on the supporting plate 11 and is located below the substrate 12 supported by the supporting plate 11. For example, the supporting component 163 may have an annular appearance and be located on the inner side of the annular component 115.

[0046] The lifting unit 161 connects the supporting component 163 and the supporting plate 11, and is used to drive the supporting component 163 to move relative to the supporting plate 11. For example, the lifting unit 161 can be extended relative to the supporting surface 111 of the supporting plate 11, and drive the supporting component 163 to leave the supporting plate 11, so as to drive the substrate 12 to leave the supporting surface 111 of the supporting plate 11 through the supporting component 163, which is conducive to taking the substrate 12 by the robot arm.

[0047] In another embodiment of the present invention, the lifting unit 161 is connected to the carrier plate 11 and is located below the substrate 12 carried by the carrier plate 11. The lifting unit 161 can be extended relative to the carrying surface 111 of the carrier plate 11 and drive the substrate 12 to leave the carrying surface 111 of the carrier plate 11, so that the supporting member 163 is not required.

[0048] Figure 1 The shielding portion 153 includes a first protrusion 1531 and a second protrusion 1533, wherein the first protrusion 1531 protrudes toward the annular bottom 133 of the blocking member 13, and the second protrusion 1533 protrudes away from the annular bottom 133 of the blocking member 13.

[0049] like Figure 5 As shown, the cover ring 15 may include a first cover ring 157 and a second cover ring 159. The top view of the first cover ring 157 and the second cover ring 159 is annular, wherein the maximum circumference and / or maximum radius of the first cover ring 157 is greater than the maximum circumference and / or maximum radius of the second cover ring 159. The second cover ring 159 is located above the first cover ring 157, and the first cover ring 157 supports the second cover ring 159. When the carrier 11 moves toward the first cover ring 157 and / or the second cover ring 159, the second cover ring 159 contacts the edge of the substrate 12 supported by the carrier 11, and fixes the substrate 12 on the supporting surface 111 of the carrier 11.

[0050] In actual application, the second cover ring 159 can be placed on the first cover ring 157, and the smaller substrate 12 can be fixed on the carrier plate 11 through the second cover ring 159. In addition, the second cover ring 159 can be removed from the first cover ring 157, and the larger substrate 12 can be fixed on the carrier plate 11 through the first cover ring 157. When the larger substrate 12 is fixed on the carrier plate 11 by the first cover ring 157, it may be necessary to replace the carrier plate 11 or configure additional components on the carrier plate 11. A corresponding alignment unit can be respectively set between the first cover ring 157 and the second cover ring 159, and the first cover ring 157 and the second cover ring 159 can be aligned through the alignment unit.

[0051] Compared with the prior art, the length, area and weight of the cover ring 15 of the present invention may be larger, and the pressure applied by the cover ring 15 to the substrate 12 may be increased, thereby increasing the probability of breaking the substrate 12. When the cover ring 15 includes a first cover ring 157 and a second cover ring 159, the weight of the first cover ring 157 can be supported by the carrier plate 11, and the second cover ring 159 can contact and fix the substrate 12 on the carrier plate 11, thereby reducing the pressure applied by the cover ring 15 to the substrate 12 and reducing the probability of breaking the substrate 12.

[0052] like Figure 6 As shown, the shielding portion 153 of the cover ring 15 includes a first protrusion 1531, wherein the first protrusion 1531 protrudes toward the annular bottom 133 of the stopper 13. Figure 7 As shown, the shielding portion 153 of the cover ring includes a protrusion 1535 , wherein the protrusion 1535 protrudes in a direction away from the annular bottom 133 of the stopper 13 .

[0053] Since the cover ring 15 described in the present invention can provide a good shielding effect, the height of the annular protrusion 135 of the baffle 13 and the first protrusion 1531 of the shielding portion 153 can be further shortened. In this way, the adjustable distance between the substrate 12 carried by the carrier plate 11 and the target material 19 can be increased without affecting the shielding effect of the cover ring 15 and the baffle 13 on the cavity 17. For example, the distance between the substrate 12 and the target material 19 can be increased while the main body 151 of the cover ring 15 is still in contact with the substrate 12.

[0054] Advantages of the present invention:

[0055] A substrate carrying and fixing mechanism is provided to fix the substrate on a carrying plate and reduce the contamination of the cavity by process gas or target material atoms.

[0056] The above is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. That is, all equivalent changes and modifications to the shape, structure, characteristics and spirit described in the patent application scope of the present invention should be included in the patent application scope of the present invention.

Claims

1. A substrate supporting and fixing mechanism, characterized in that: include: A stopper, comprising a side wall, an annular bottom and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion and forms an opening on a radial inner side of the annular convex portion; A cover ring, for placement on the stopper, comprising: A main body, the main body is an annular body, wherein a portion of the main body is located at an extended position of the opening of the stopper; a shielding portion connected to a radially outer side of the main body, the shielding portion being adjacent to one side of the side wall of the stopper and away from the annular protrusion of the stopper, and comprising a first protrusion protruding toward the annular bottom of the stopper, wherein the spacing between the shielding portion and the side wall of the stopper is between 3 and 10 mm, wherein the shielding portion comprises a second protrusion protruding toward the direction away from the annular bottom of the stopper; and A carrier plate, comprising a carrier surface for carrying a substrate, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the substrate to move toward the cover ring, the main body of the cover ring contacts the substrate; The cover ring includes a first cover ring and a second cover ring. The circumference of the first cover ring is larger than that of the second cover ring and is used to support the second cover ring. When the supporting plate moves toward the cover ring, the supporting plate is used to support the first cover ring, and the second cover ring will contact the substrate. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and the second cover ring and the first cover ring are aligned through the alignment unit.

2. The substrate supporting and fixing mechanism according to claim 1, characterized in that: The cover ring and the carrier plate are respectively provided with a corresponding alignment unit, and the cover ring and the carrier plate are aligned through the alignment unit.

3. The substrate supporting and fixing mechanism according to claim 1, characterized in that: It comprises an annular component connected to the carrier plate, the annular component is located around the carrier surface of the carrier plate, wherein the annular component and the cover ring are respectively provided with a corresponding alignment unit, and the annular component and the cover ring are aligned through the alignment unit.

4. A substrate supporting and fixing mechanism, characterized in that: include: A stopper, comprising a side wall, an annular bottom and an annular convex portion, wherein the annular bottom connects the side wall and the annular convex portion and forms an opening on a radial inner side of the annular convex portion; A cover ring, for placement on the stopper, comprising: A main body, the main body is an annular body, wherein a portion of the main body is located at an extended position of the opening of the stopper; a shielding portion connected to a radially outer side of the main body, the shielding portion being adjacent to one side of the side wall of the stopper and away from the annular protrusion of the stopper, and comprising a protrusion protruding in a direction away from the annular bottom of the stopper, wherein the spacing between the shielding portion and the side wall of the stopper is between 3 and 10 mm, wherein the shielding portion comprises a second protrusion protruding in a direction away from the annular bottom of the stopper; and A carrier plate, comprising a carrier surface for carrying a substrate, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the substrate to move toward the cover ring, the main body of the cover ring contacts the substrate; The cover ring includes a first cover ring and a second cover ring. The circumference of the first cover ring is larger than that of the second cover ring and is used to support the second cover ring. When the supporting plate moves toward the second cover ring, the second cover ring will contact the substrate. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and the second cover ring and the first cover ring are aligned through the alignment unit.

5. A thin film deposition device, characterized in that: include: A cavity including a containing space; A substrate carrying fixing mechanism is located in the accommodating space and includes: A stopper, comprising a side wall, an annular bottom and an annular convex portion, wherein the side wall is connected to the cavity, and the annular bottom is connected to the side wall and the annular convex portion, and an opening is formed on a radial inner side of the annular convex portion; A cover ring, for placement on the stopper, comprising: A main body, the main body is an annular body, wherein a portion of the main body is located at an extended position of the opening of the stopper; a shielding portion connected to a radially outer side of the main body, the shielding portion being adjacent to one side of the side wall of the stopper and away from the annular protrusion of the stopper, and comprising a first protrusion protruding toward the annular bottom of the stopper, wherein the spacing between the shielding portion and the side wall of the stopper is between 3 and 10 mm, wherein the shielding portion comprises a second protrusion protruding toward the direction away from the annular bottom of the stopper; and A carrier plate, comprising a carrier surface for carrying a substrate, wherein the carrier plate is located below the cover ring, and when the carrier plate drives the substrate to move toward the cover ring, the main body of the cover ring contacts the substrate; The cover ring includes a first cover ring and a second cover ring. The circumference of the first cover ring is larger than that of the second cover ring and is used to support the second cover ring. When the supporting plate moves toward the second cover ring, the second cover ring will contact the substrate. The first cover ring and the second cover ring are respectively provided with a corresponding alignment unit, and the second cover ring and the first cover ring are aligned through the alignment unit.

6. The thin film deposition device according to claim 5, characterized in that: A target is arranged in the cavity and faces the carrier plate and the substrate. The carrier plate is located in the opening of the blocking member and drives the cover ring to leave the blocking member to shorten the distance between the substrate on the carrier plate and the target.

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