A workbench and a wafer thinning machine

Abstract

The present invention discloses a workbench and a wafer thinning machine, which include a pedestal, a fixing part arranged on the pedestal, and a waterproof component arranged on the pedestal. The waterproof component includes a waterproof cover covering the outer periphery of the pedestal, a shielding space formed inside the waterproof cover, a processing port formed on the upper end surface of the waterproof cover for the grinding part of the wafer thinning machine to freely enter and exit, an inlet formed on one side of the waterproof cover, and a closing component formed on the waterproof cover and capable of closing the inlet. Through the arrangement of the waterproof component, the fixing part and the grinding part are covered inside, and through the cooperation with the closing component, the wafer can be conveyed onto the fixing part inside the waterproof component, and when the wafer is thinned by the cooperation of the fixing part and the grinding part, the water and water mist ejected by the grinding component are blocked, preventing the water and water mist from splashing onto other devices and causing damage to other devices, ensuring the normal operation of the entire device, and improving the service life of the overall device.

Description

Technical Field

[0001] The invention relates to the field of wafer processing, and in particular to a workbench and a wafer thinning machine. Background Art

[0002] Wafer is a silicon chip used to make silicon semiconductor integrated circuits. Wafer is a cylindrical single crystal silicon, which is the carrier used to produce integrated circuits. During the processing of wafers, a wafer thinning machine is needed to grind and remove the excess base material on the back of the wafer to reduce the thickness of the wafer so that the wafer can be used to make more complex integrated circuits.

[0003] Some existing wafer thinning machines include a material taking mechanism for taking and placing wafers, a material receiving mechanism for supporting wafers, and a thinning mechanism for grinding wafers. The material taking mechanism moves the wafer to the material receiving mechanism, and the thinning mechanism performs grinding and thinning, thereby thinning the thickness of the wafer. However, when the thinning mechanism of the wafer thinning machine is grinding the wafer, the wafer and the grinding part of the thinning mechanism generate high temperature. In order to solve this problem, some wafer thinning machines cool down the wafer and the thinning mechanism by water cooling, that is, spraying water mist or cold water directly on the wafer and the grinding part of the thinning mechanism. The cold water is sprayed on the wafer and the grinding part during grinding, taking away most of the heat of the wafer and the grinding part, thereby playing a cooling role. However, since the grinding part usually grinds the wafer by high-speed rotation during operation, when cold water is sprayed on the grinding part, the high-speed rotating grinding part uses centrifugal action to spread the water sprayed on the grinding part, causing the cold water to form water mist and splash. The splashed water mist splashes on other parts and easily penetrates into the interior of other parts. Especially for non-waterproof parts, the infiltration of water can easily reduce the service life of the equipment, and may even cause circuit short circuits for some parts with circuits, bringing adverse effects on the safe use of the wafer thinning machine. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is to provide a workbench and a wafer thinning machine that can block the splashing of water mist during the thinning process.

[0005] To solve the above technical problems, a technical solution adopted by the present invention is: to provide a workbench and a wafer thinning machine. The workbench is arranged on the wafer thinning machine and is used to carry the wafer and prevent water mist from splashing during wafer processing. The workbench of the present invention includes a pedestal, a fixing part arranged on the pedestal for fixing the wafer, and a waterproof component arranged on the pedestal and used to cover the grinding part. The waterproof component prevents the grinding part of the wafer thinning machine from blocking the splashing water and water mist when processing the wafer, and avoids the adverse effects caused by these water mists splashing onto other devices; the waterproof component includes a waterproof cover covering the outer periphery of the pedestal, a shielding space formed inside the waterproof cover, a processing port formed on the upper end surface of the waterproof cover for the grinding part of the wafer thinning machine to penetrate into the shielding space, an inlet formed on one side of the waterproof cover, and a closing component formed on the waterproof cover and capable of closing the inlet. After the grinding part of the wafer thinning machine extends into the processing port, it can block the processing port. When the grinding part cooperates with the fixing part to grind the wafer, the waterproof component, the pedestal, and the closing component jointly enclose a shielding space that surrounds the grinding part to block the water mist when the grinding part operates. When the wafer thinning machine's material taking component approaches the closing component, the closing component opens the shielding space to enable the material taking component to move towards the grinding part until it exits the shielding space, and the closing component closes the shielding space to form an all-round shielding of the fixing part. No matter in which direction the splashing water mist sprays, the shielding space can block all the water mist, improving the waterproof performance.

[0006] An observation part for facilitating the observation of the internal situation of the shielding space is arranged on the waterproof cover, so as to be able to check the internal situation of the shielding space at any time in order to discover and maintain problems in a timely manner; the observation part includes an opening formed on the waterproof cover and communicating with the shielding space, a sealing plate arranged at the opening and hermetically connected to the opening, and an observation window formed on the sealing plate. When it is necessary to maintain the grinding part in the shielding space, it can be carried out by opening the opening, simplifying the maintenance work of the grinding part and the fixing part, and providing convenience for the maintenance and repair of the equipment.

[0007] One side of the sealing plate is pivotally connected to one side of the opening, and the other side of the sealing plate is locked to the opposite side of the opening through a detachable locking structure, so as to realize the opening and closing between the sealing plate and the opening.

[0008] The sealing plate includes two support plates, and the observation window is formed on each support plate. One side of one support plate is hinged to one side of the opening, and the other side is hinged to one side of the other support plate. The other side of the other support plate is locked to the opposite side of the opening through the locking structure; a sealing strip for preventing water mist from leaking is formed between the support plates to prevent water from running out through the gap between the two support plates, improving the waterproof effect; observation windows are arranged on both support plates to be able to clearly observe the situation inside the shielding space.

[0009] The locking structure includes a locking portion provided on the waterproof cover and a hook portion provided on one of the plates. The hook portion can rotate relative to the locking portion. The locking portion has a card slot for hooking and cooperating with the hook portion when the hook portion rotates to the locking portion to limit the plate to the opening, realizing detachable connection and enabling quick connection and unlocking.

[0010] The processing port is formed by enclosing an arc-shaped opening fixedly formed on the upper end surface of the waterproof cover and a plugging portion with a third arc-shaped notch that is aligned with the arc-shaped opening. The arc-shaped opening penetrates the upper end surface of the waterproof cover vertically upward to form a vertical through port. A horizontal through port that penetrates the side surface horizontally is formed on one side surface of the waterproof cover adjacent to the arc-shaped opening. The arc-shaped opening is communicated with the horizontal through port. Vertical mating walls are formed on the parts of the waterproof cover on both sides of the horizontal through port. After removing the plugging portion, the horizontal through port is communicated with the vertical through port to increase the activity space, facilitating the operator to maintain the structure in the shielding space through this place. A support platform extends outward from the lower end surface of the waterproof cover at the horizontal through port. Magnetic attraction portions that protrude upward and are magnetically attracted to the plugging portion are provided on both sides of the top surface of the support platform. After the plugging portion is installed at the horizontal through port, the cooperation between the plugging portion and the magnetic attraction portions improves the connection firmness between the plugging portion and the horizontal through port, and the plug-in cooperation method is simple and convenient to operate and can achieve quick connection. A fastener for locking the plugging portion is provided on the enclosure piece. The plugging portion is movably arranged at the horizontal through port to be able to open and close the horizontal through port. The lateral two side walls of the plugging portion abut against the mating walls, and the lower end surface of the plugging portion is supported on the support platform to improve the stability of the plugging portion. Two plug-in slots that are plug-in mated with the magnetic attraction portions are formed at the bottom of the plugging portion corresponding to the positions of the two magnetic attraction portions. A fastening hole that cooperates with the fastener is formed at the position corresponding to the fastener on the plugging portion. By rotating the fastener, the plugging portion is firmly fixed at the horizontal through port, improving the structural stability.

[0011] A first induction component for induction is provided on the waterproof cover after the sealing plate is opened or the plugging portion is removed. By opening the observation portion or removing the plugging portion, the grinding portion in the shielding space can be maintained. When the first induction component senses that the sealing plate is folded and the opening is opened or the plugging portion is removed, the cooperation between the fixing portion and the grinding portion stops. In this way, it can prevent the continuously operating grinding portion from causing harm to the operator and can automatically shut down the grinding portion, avoiding adverse effects caused by the operator forgetting to shut down the grinding portion and then opening the observation portion or the plugging portion.

[0012] The closing assembly includes an inlet formed on the waterproof cover and communicating with the inner cavity of the waterproof cover, two moving parts connected to the waterproof cover and symmetrically arranged at the inlet for opening or closing the inlet, and a second sensing component arranged on the two moving parts for sensing whether the moving parts move in place. The opening and closing of the inlet are realized through the moving parts. While ensuring that the wafer picking component can transport the wafer into the shielding space, it can also block the inlet to prevent water mist from splashing out from the inlet during the operation of the grinding part; both of the two moving parts include a shielding plate for blocking the inlet and a telescopic member arranged on the waterproof cover and connected to the shielding plate. The two telescopic members can drive the two shielding plates to move towards or away from each other, so as to realize the automatic blocking and opening of the inlet without manual operation, realizing the automation of the equipment; when the two telescopic members drive the two shielding plates to move towards each other until they stop, the two shielding plates move to the first position, and when the two telescopic members drive the two shielding plates to move away from each other until they stop, the two shielding plates move to the second position; after the second sensing component senses that the two shielding plates move to the first position, it sends a signal for the inlet to close; after the second sensing component senses that the two shielding plates move to the second position, it sends a signal for the inlet to open, and the wafer picking component takes corresponding actions according to the signal sent by the second sensing component.

[0013] The present invention further includes a suction component communicating with the inside of the shielding space and sucking the water mist in the shielding space during the operation of the thinning component. After the water mist is generated, due to the light weight of the water mist, the suction component directly sucks the water mist and extracts it outside the shielding space, avoiding water accumulation in the shielding space due to the accumulation of a large amount of water mist, thereby avoiding the influence of water accumulation on the use of the grinding part and avoiding the erosion of the grinding part by water accumulation.

[0014] To solve the above technical problems, another technical solution adopted by the present invention is: to provide a wafer thinning machine including the workbench described in any one of the above.

[0015] The workbench and the wafer thinning machine of the present invention have at least the following beneficial effects: Through the setting of the waterproof component, the fixing part and the grinding part are covered inside, and through the cooperation with the closing component, the wafer can be transported to the fixing part inside the waterproof component, and when the fixing part and the grinding part cooperate to thin the wafer, the water and water mist sprayed by the grinding component are blocked, avoiding the water and water mist from splashing onto other devices and causing damage to other devices, ensuring the normal operation of the entire device, and improving the service life of the overall device. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings described herein are used to provide a further understanding of the present application and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation to the present application. In the drawings:

[0017] Figure 1Schematic structural diagram of the wafer thinning machine of the present invention after hiding the material box;

[0018] Figure 2 Schematic structural diagram of the wafer thinning machine of the present invention after hiding the waterproof cover.

[0019] Figure 3 Schematic structural diagram of the waterproof component and the closing component of the present invention;

[0020] Figure 4 Schematic structural diagram of the waterproof component and the closing component of the present invention from another angle;

[0021] Figure 5 Schematic structural diagram of the waterproof component and the closing component of the present invention after hiding the plugging shell;

[0022] The meanings of the reference numerals in the drawings are as follows:

[0023] Base - 1;

[0024] Material storage part - 2; Material box - 21; Chip sweeping part - 22;

[0025] Material taking component - 3; First support seat - 31; Supporting arm - 32; Notch - 321; First suction cup - 33; Second driving part - 34;

[0026] Material receiving component - 4; Material receiving seat - 41; Supporting platform - 42; Centering part - 43; Chute - 44; Through slot - 45;

[0027] Thinning component - 5; Base - 50; Waterproof component - 51; Waterproof cover - 511; Processing port - 512; First arc-shaped notch - 5121; Second arc-shaped notch - 5122; Third arc-shaped notch - 5123; Opening - 513; Sealing plate - 514; Support plate - 5141; Observation window - 515; Locking structure - 516; Plugging shell - 517; First inductor - 521; Second inductor - 522; Closing component - 53; Inlet - 531; Telescopic part - 532; Connecting bar - 533; Connecting block - 534; Shielding piece - 535; Third inductor - 536; Fourth inductor - 537; Suction component - 54; Main machine part - 55; Fixing part - 56; Wafer supporting table - 561; Second support seat - 551; Main shaft - 557; Grinding wheel - 552; Processing port - 512; Inlet - 531; Sixth driving part - 538; Seventh driving part - 553; Eighth driving part - 554; Oilstone - 555; Ninth driving part - 556; Support platform - 571; Enclosing piece - 572; Magnetic attraction part - 573; Fastener - 574; Limit notch - 575; Horizontal through port - 576;

[0028] Cleaning component - 6; Cleaning box - 61; Cleaning table - 62; Top cover - 63; Telescopic component - 64. Detailed Implementation Manner

[0029] The present invention will be further described below in conjunction with the accompanying drawings.

[0030] Please refer to Figure 1 and Figure 2 The wafer thinning machine of the present invention is used for conveying and grinding wafers. The wafer thinning machine includes a base 1, a material storage part 2, a material taking component 3, a material bearing component 4, a thinning component 5, and a cleaning component 6 arranged in sequence on the base 1. The thinning component 5 includes a workbench and a main machine part 55. The main machine part 55 has a grinding part for grinding and water-cooling the wafer. The material taking component 3 conveys the unground wafers at the material storage part 2 for storing wafers to the material bearing component 4, and then conveys the wafers on the material bearing component 4 to the workbench, and the grinding part and the workbench cooperate to grind and thin the wafers. After the wafer grinding work is completed, the material taking component 3 moves the ground wafers into the material box, and so on to complete the wafer thinning processing operation.

[0031] Referring to Figures 3 to 5 as shown, the workbench of the present invention includes a pedestal 50, a fixing part arranged on the pedestal 50, a waterproof component 51 arranged on the pedestal 50, a closing component 53 arranged on the waterproof component 51, and a suction component 54 arranged on the pedestal 50 and communicating with the inner cavity of the waterproof component 51. The fixing part is used to support the wafer and suck it to be fixed during wafer processing. The waterproof component 51 covers the fixing part to form an all-round shielding space. When the grinding part operates to grind the wafer, the grinding part also sprays water to cool the wafer at the same time. The splashing water and water mist during the cooling process are blocked by the waterproof component 51 to be isolated from other devices outside the waterproof component 51, and a shielding space is formed in the waterproof component 51 to surround the fixing part and the grinding part of the grinding part. The shielding space effectively prevents the water mist from splashing onto other devices and affecting the service life and safety of other devices. Compared with the existing thinning equipment without shielding, the overall safety and service life of the wafer thinning machine are improved; the closing component 53 is used to open the waterproof component 51 before the material taking component 3 enters and exits the inner cavity of the waterproof component 51. The closing component 53 is activated by sensing the approach of the material taking component 3 to ensure that the material taking component 3 can convey the wafer into the waterproof component 51, and when the material taking component 3 is not close to the waterproof component 51, it blocks the water mist together with the waterproof component 51 to ensure the waterproof effect of the waterproof component 51 and ensure the normal operation of the whole machine.

[0032] The pedestal 50 has a cuboid structure, and the top surface has a supporting surface and is flush with the top surface of the base 1. The material storage part 2, the material bearing component 4, the thinning component 5, and the cleaning component 6 are arranged at intervals in sequence and surround the material taking component 34. That is, the material storage part 2, the material bearing component 4, the thinning component 5, and the cleaning component 6 are arranged on the front side, right side, rear side, and left side of the material taking component 34 to surround the material taking component 34.

[0033] The waterproof component 51 is arranged on the top surface of the pedestal 50 and covers the outer periphery of the fixing part and the grinding part. The waterproof component 51 includes a waterproof cover 511 with a hollow interior, a shielding space formed within the waterproof cover 511, a processing opening 512 formed on the upper end surface of the waterproof cover 511 for the grinding part of the wafer thinning machine to penetrate into the shielding space, an inlet 531 formed on one side of the waterproof cover 511, a closing component 53 formed on the waterproof cover 511 and capable of closing the inlet 531, and a first sensing component arranged on the waterproof cover 511. The waterproof cover 511 is hermetically connected to the pedestal 50. After the grinding part penetrates into the inner cavity of the waterproof cover 511, it cooperates with the fixing part to grind the wafer. When the grinding part processes the wafer, the grinding part blocks the processing opening 512, and the fixing part is located within the shielding space. A blocking part and an observation part for facilitating the observation of the internal situation of the shielding space are arranged on the waterproof cover 511. The first sensing component is used to sense the positions of the observation part and the blocking part.

[0034] The interior of the waterproof cover 511 is hollow and the bottom surface is open to communicate with the inner cavity of the waterproof cover 511. The observation part is arranged on the top side of the waterproof cover 511. The closing component 53 and the blocking part are respectively arranged on two side walls of the waterproof cover 511, and a horizontal opening 576 communicating with the inner cavity and the shielding space of the waterproof cover 511 is formed on the waterproof cover 511. The blocking part is arranged at the horizontal opening 576 for blocking the horizontal opening 576. The bottom edge part of the waterproof cover 511 extends horizontally outward (i.e., in all directions away from the waterproof cover 511 in the horizontal projection plane relative to the waterproof cover 511) to form a connecting piece. Bolt holes are arranged in a matching and completely overlapping manner on the connecting piece and the top surface of the pedestal 50. The waterproof cover 511 and the pedestal 50 are connected by bolts. Preferably, a sealing gasket is pasted between each connecting piece and the top surface of the pedestal 50. After the waterproof cover 511 and the pedestal 50 are bolted together through the connecting piece, the sealing gasket seals between the bottom surface of the waterproof cover 511 and the pedestal 50, and water cannot pass between the connecting piece and the pedestal 50, preventing the condensed water flow from the bottom of the waterproof cover 511 from flowing outside the waterproof cover 511 after the grinding part operates. If the water flow is allowed to flow outside the waterproof cover 511, it will flow to other devices, and most other devices have charged structures. If the charged structures are soaked in water for a long time, they are easily eroded by water and are likely to be damaged. Therefore, the sealing treatment between the bottom of the waterproof cover 511 and the pedestal 50 can protect the structures outside the waterproof cover 511 and ensure the normal use and operation of the equipment.

[0035] The observation part includes an opening 513 formed on the waterproof cover 511 and communicating with the shielding space, a sealing plate 514 disposed at the opening 513 and hermetically connected to the opening 513, and an observation window 515 formed on the sealing plate 514. The sealing plate 514 has the same shape as the opening 513, and the sealing plate 514 blocks the opening 513 to block the shielding space. The observation window 515 is made of a transparent material to facilitate observing the internal situation of the shielding space through the observation window 515, so that the situation of the grinding part can be checked in time through the observation window 515. If a failure occurs in the grinding part, it can also be discovered in time through the observation window 515, and the operation of the grinding part can be shut down in time, and the equipment can be repaired and maintained in time to minimize losses in time. The sealing plate 514 is disposed at the opening 513 in a manner that can be opened and closed, and the sealing plate 514 can be flipped relative to the opening 513 to open and close the opening 513. Specifically, one side of the sealing plate 514 is pivotally connected to one side of the opening 513, and the other side of the sealing plate 514 is locked to the opposite side of the opening 513 through a detachable locking structure 516 so that the sealing plate 514 can be flipped. The side of the sealing plate 514 detachably connected to the waterproof cover 511 is the free side. Through the locking structure 516, the free side of the sealing plate 514 can be flipped relative to the opening 513, or the free side of the sealing plate 514 can be limited at the opening 513 to prevent the opening 513 from being bounced outside the opening 513 due to other factors. The locking structure 516 can be set as a buckle so that the free side of the sealing plate 514 is connected to the waterproof cover 511 through the buckle. The buckling method can achieve rapid connection and convenient operation method, and common locks on the market can also be used for connection. In this embodiment, the locking structure 516 includes a locking portion provided on the waterproof cover 511 and a hook portion provided on one of the support plates. The hook portion can rotate relative to the locking portion. The locking portion has a card slot for hooking and cooperating with the hook portion when the hook portion rotates to the locking portion to locate the support plate at the opening, so that connection and disconnection can be quickly performed, and the operation is simple and convenient.

[0036] The closing plates 514 are provided in several numbers. Each closing plate 514 is sequentially unfolded along the length direction of the opening 513 to block the opening 513. The same side of each corresponding closing plate 514 is hinged to the waterproof cover 511. The side of each closing plate 514 hinged to the opposite side of one side of the waterproof cover 511 is the free side, and the free side is detachably connected to the waterproof cover 511. In this way, the closing plate 514 where the fixing part to be maintained is located can be opened as needed, without opening all the closing plates 514 over a large range. Preferably, each closing plate 514 is formed by splicing two plates 5141. The two plates 5141 of each closing plate 514 are sequentially connected along the hinged side of the closing plate 514 towards the free side. And the two plates 5141 of each closing plate 514 are hinged to each other and can be folded. One side of the two plates 5141 of each closing plate 514, which are opposite to each other, is hinged to the waterproof cover 511, and the other side is detachably connected to the waterproof cover 511 through a connecting structure. Observation windows 515 are provided on each of the two plates 5141. In this way, the situation inside the shielding space can be observed in sections. When the closing plate 514 at the corresponding position is flipped, the plate 5141 can fold the whole closing plate 514. For the closing plate 514 that cannot be folded, after flipping, due to the certain length of the closing plate 514, the flipped closing plate 514 may move towards the closing assembly 53, and the closing assembly 53 may be misjudged and opened due to the approach of the closing plate 514, thus causing unnecessary trouble. Therefore, the foldable closing plate 514 can be folded after flipping without approaching the closing assembly 53, ensuring the normal use of the closing assembly 53. After each closing plate 514 covers the opening 513, it jointly encloses a fully shielded space with the waterproof cover 511, the closing assembly 53, the plugging part and the top surface of the pedestal 50. While the closing plate 514 blocks the inner cavity of the waterproof cover 511, it is also convenient to check the situation inside the shielded space. In this embodiment, the opposite sides of the two plates 5141 are connected by a hinge. Preferably, a sealing strip is provided on one of the two plates 5141 to block the gap at the hinged side between the two plates 5141 when the two plates 5141 block the opening, so as to prevent water from running out of the gap between the two plates 5141. Since the two plates 5141 are connected by a hinge, there is a large gap between the opposite sides of the two plates 5141, and the sealing strip just blocks at the gap after the plate 5141 blocks the opening, avoiding water from running out of the gap.The sealing strip is located on the opposite sides of the corresponding two support plates 5141 and is connected to and parallel to any one of the two support plates 5141. The sealing strip is located on the side of the corresponding two support plates 5141 away from the fixing part. When the two support plates 5141 block the opening 513, the two support plates 5141 are laid flat at the opening 513, and the sealing strip is parallel to the two support plates 5141. When the two support plates 5141 are flipped, the sealing strip restricts the rotation angle of the support plate 5141 not connected to the sealing strip, so that the rotation angle relative to the support plate 5141 connected to the sealing strip is less than 180 degrees.

[0037] Preferably, the sealing plates 514 are provided in two pieces. The two sealing plates 514 are sequentially arranged along the length direction of the opening 513 at the opening 513 to block the opening 513. The sides of the two sealing plates 514 detachably connected to the waterproof cover 511 intersect with the processing opening 512. The processing opening 512 is formed by enclosing an arc-shaped opening fixedly formed on the upper end surface of the waterproof cover 511 and a plugging part having a third arc-shaped notch 5123 that is aligned with the arc-shaped opening. The arc-shaped opening includes two first arc-shaped notches 5121 respectively formed on the free sides of the two sealing plates 514 and two second arc-shaped notches 5122 on the waterproof cover 511 between the sealing plates 514 and the plugging part. The two second arc-shaped notches 5122 are arranged opposite to each other. The two first arc-shaped notches 5121 are sequentially arranged, and the opposite ends of the two first arc-shaped notches 5121 are sequentially connected to one end of the two second arc-shaped notches 5122. Thus, when the free side of the sealing plate 514 is flipped, a notch appears in the first arc-shaped notch 5121 of the processing opening 512. At this time, the processing opening 512 is connected to the opening 513, which increases the operating space of the operator when performing any operation through the opening 513. When the operator maintains and repairs the structures in the shielding space through the opening 513, the operation can be performed more conveniently.

[0038] The two first arc-shaped notches 5121 are aligned with the processing opening 512. The processing opening 512 is formed by the enclosure of the two first arc-shaped notches 5121, the second arc-shaped notch 5122 fixedly formed on the upper end surface of the waterproof cover 511, and the arc-shaped plugging portion aligned with the second arc-shaped notch 5122. The second arc-shaped notch 5122 penetrates the upper end surface of the waterproof cover 511 vertically upward to form a vertical through opening, and the second arc-shaped notch 5122 also penetrates one side surface of the waterproof cover 511 horizontally to form a horizontal through opening 576. The portions of the waterproof cover 511 on both sides of the horizontal through opening 576 form vertical mating walls. The plugging portion is movably arranged at the horizontal through opening 576 to block the horizontal through opening 576, and the plugging portion can open or close the horizontal through opening 576. After the plugging portion closes the horizontal through opening 576, it prevents water from splashing out through the horizontal through opening 576. After the plugging portion opens the horizontal through opening 576, it is convenient to repair the equipment in the shielding space through the horizontal through opening 576. The plugging portion can be detachably arranged at the horizontal through opening 576 so as to be detachable and installable relative to the horizontal through opening 576; the plugging portion can be hingedly arranged at the horizontal through opening 576 to be flipped relative to the horizontal through opening 576 to open or block the horizontal through opening 576, such as hinge connection, etc.; the plugging portion can also be arranged in a push-pull manner at the horizontal through opening 576 to open and close the horizontal through opening 576 by pushing and pulling the plugging portion in the same way. In this embodiment, the plugging portion is detachably arranged at the horizontal through opening 576 so as to be installable and detachable relative to the horizontal through opening 576. When the plugging portion is removed, through the horizontal through opening 576, the operator's hand can enter the shielding space inside the inner cavity of the waterproof cover 511, thus facilitating the operation of the grinding portion. The plugging portion and the closing assembly 53 are separately arranged on two non-adjacent sides of the waterproof cover 511. In this way, the setting of the plugging portion will not affect the operation of the closing assembly 53. Preferably, sealing strips are arranged along the corresponding inner edges on the inner sides of the first arc-shaped notch 5121, the second arc-shaped notch 5122, and the third arc-shaped notch 5123. When both the plugging portion and the sealing plate 514 are closed, each sealing strip is circular and abuts against the outer wall of the grinding portion when the grinding portion penetrates into the processing opening 512 to form a sealed environment, avoiding water from seeping out between the outer wall of the grinding portion and the processing opening 512 and improving the waterproof effect.The sealing part is made of metal material; the bottom surface of the horizontal opening 576 has a supporting platform 571 protruding toward the side away from the horizontal opening 576, and an upwardly open enclosure piece 572 is arranged along its edge on the side of the supporting platform 571 away from the horizontal opening 576 to form a slot for plugging and cooperating with the horizontal opening 576 for plugging and cooperating with the sealing part, and upwardly protruding magnetic suction parts 537 are arranged on both sides of the top surface of the supporting platform 571. The magnetic suction parts 537 are magnetically matched with the sealing part, and two insertion grooves for plugging and cooperating with the magnetic suction parts 537 are formed at the bottom of the sealing part at positions corresponding to the two magnetic suction parts 537; a fastener 574 extending toward the side of the horizontal opening 576 for pressing the sealing part against the horizontal opening 576 is screwed on the side of the enclosure piece 572 facing away from the horizontal opening 576, and a fastening hole matching with the fastener 574 is formed on the sealing part at a position corresponding to the fastener 574. It should be understood that the detachable setting of the blocking portion is not limited to the present embodiment, and it can also be screwed at the horizontal opening 576, or connected by a snap connection.

[0039] The top surface of the support platform 571 has a horizontal plane. The support platform 571 protrudes toward the side facing away from the horizontal through-port 576 to form a notch with the horizontal through-port 576. The enclosing sheet 572 is arranged around the edge of the support platform 571 and extends upward. A slot for inserting the plugging part is formed among the enclosing sheet 572, the support platform 571, and the horizontal through-port 576. The magnetic attracting part 537 includes a magnet. A limiting notch 575 and a screw hole are formed on the enclosing sheet 572. The fastener 574 is screwed at the screw hole. The fastener 574 includes a bolt. During use, the plugging part is inserted into the slot from top to bottom, that is, the plugging part is inserted into the notch formed between the horizontal through-port 576 and the support plane. The plugging part blocks the horizontal through-port 576. The magnetic attracting part 537 attracts the plugging part to prevent the plugging part from loosening and detaching from the horizontal through-port 576. After the plugging part is inserted into the slot, the fastener 574 is rotated so that the fastener 574 moves toward the plugging part until the fastener 574 presses the plugging part against the horizontal through-port 576, making the horizontal through-port 576 and the plugging part fit tightly to block the splashing water mist, improving the firmness and structural stability of the plugging part. The plugging part includes a plugging shell 517 with an arc-shaped cross-section. The horizontal through-port 576 on the waterproof cover 511 communicates with the horizontal through-port 576 upward. Correspondingly, the plugging shell 517 is detachably arranged at the horizontal through-port 576 to block the horizontal through-port 576. And a third arc-shaped notch 5123 is formed on the top surface of the plugging shell 517 facing the processing port 512. The third arc-shaped notch 5123 and the two first arc-shaped notches 5121 are respectively arranged at both ends of the second arc-shaped notch. The two ends of the third arc-shaped notch 5123 are respectively connected to the ends of the two second arc-shaped notches 5122 far from the first arc-shaped notch 5121. The two first arc-shaped notches 5121, the two second arc-shaped notches 5122, and the third arc-shaped notch 5123 jointly enclose a circular processing port 512. When the plugging shell 517 is removed, a notch appears on the side of the processing port 512 corresponding to the plugging shell 517. At this time, the horizontal through-port 576 communicates with the processing port 512, increasing the operable space. If an operator needs to operate the structure in the shielding space through the horizontal through-port 576, it can be carried out more conveniently. Insertion slots are formed on the bottom surface of the plugging shell 517 and symmetrically arranged on both sides of the bottom surface of the plugging shell 517. Correspondingly, the two magnetic attracting parts 537 are symmetrically arranged on the support platform 571 at the positions corresponding to the two insertion slots to form a relatively stable structure horizontal through-port 576 horizontal through-port 576. During use, the magnetic attracting part 537 is aligned with the insertion slot until the magnetic attracting part 537 is inserted into the insertion slot, and when the plugging shell 517 is inserted into the slot, the detachable connection between the plugging shell 517 and the waterproof cover 511 is completed so that the plugging shell 517 can block the horizontal through-port 576. A handle is arranged on the side of the plugging shell 517 facing away from the horizontal through-port 576 to facilitate extracting the plugging shell 517 horizontal through-port 576.

[0040] The first sensing component is arranged on the waterproof cover 511 for sensing after the sealing plate 514 is opened or the blocking part is removed. When the first sensing component senses that the observation part is opened or the blocking shell 517 is separated from the horizontal through port 576, the grinding part stops operating. In this way, when the operator maintains and repairs the structure in the shielding space through the opening 513 or the horizontal through port 576, it can prevent the operator from being injured due to the operation of the grinding part, improving the safety of the workbench.

[0041] The first sensing component includes a first sensor 521 and a second sensor 522. The first sensor 521 corresponds to the sealing plate 514 one by one and is arranged on the waterproof cover 511 corresponding to the free side of the sealing plate 514. The first sensor 521, the second sensor 522, the closing component 53, and the grinding part are all electrically connected to a controller. The second sensor 522 is arranged on the waterproof cover 511 and is close to the horizontal through port 576. When the free side of the sealing plate 514 is flipped, after the first sensor 521 senses that any sealing plate 514 is flipped, the first sensor 521 sends a signal to the controller, and the controller controls the wafer thinning machine to stop running. When the second sensor 522 senses that the plugging shell 517 is separated from the horizontal through port 576, the second sensor 522 sends a signal to the controller, and the controller controls the grinding part to stop running. Specifically, the first sensor 521 includes a first trigger module arranged on the free side of the sealing plate 514 and a first sensing module arranged on the waterproof cover 511 near the opening 513. When the sealing plate 514 is closed at the opening 513, the first trigger module abuts against the first sensing module. When the sealing plate 514 is flipped, the first trigger module moves away from the first sensing module. After the first sensing block detects that the first trigger module has moved away, it will send a signal to the controller, and the controller will then control the wafer thinning machine to stop running. The second sensor 522 includes a second trigger module arranged on the plugging shell 517 and a second sensing module arranged on the waterproof cover 511 and close to the horizontal through port 576. The second trigger module corresponds to the limiting notch 575. When the plugging shell 517 is installed at the horizontal through port 576, the second trigger module is clamped in the limiting notch 575 to limit the horizontal movement of the plugging shell 517 on the horizontal plane perpendicular to the limiting notch 575, further improving the stability of the plugging shell 517. At the same time, the second trigger module abuts against the second sensing module. When the plugging shell 517 is removed, the second trigger module moves away from the second sensing module. After the second sensing block detects that the second trigger module has moved away, it will send a signal to the controller, and the controller will then control the grinding part to stop running. Both the first sensing module and the second sensing module can be set as photosensitive sensors. When the sealing plate 514 is closed at the opening 513, the first trigger module blocks the photosensitive part of the first sensing module. When the sealing plate 514 is flipped, the photosensitive part is exposed to sunlight, and the voltage of the first sensing module changes. When the controller receives the signal, it controls the wafer thinning machine to stop running. When the operator forgets to manually turn off the grinding part, there is no need to worry that the grinding part will harm the operator, ensuring the safety of the operator and improving the safety performance of the entire thinning equipment. The structural principle of the second trigger module and the second sensing module is the same as that of the first sensor 521, and will not be elaborated here. The first sensing module and the second sensing module can also be proximity switches. When the corresponding first trigger module or second trigger module moves away from the first sensing module or the second sensing module, after detecting that the corresponding first trigger module or second trigger module has left the established position, it will send a signal to the controller.

[0042] The closing component 53 includes an inlet 531 formed on the waterproof cover 511, two moving parts connected to the waterproof cover 511 and symmetrically arranged at the inlet 531, and a second sensing component arranged on the two moving parts. Both the moving parts and the second sensing component are electrically connected to the controller. The inlet 531 communicates with the inner cavity of the waterproof cover 511, and the two moving parts can block the inlet 531, so as to prevent water mist from splashing out from the inlet 531. The second sensing component can sense whether the sensing moving part moves in place, that is, whether the moving part runs to completely close or completely open the inlet 531. The controller controls the two moving parts to run until the inlet 531 is blocked. At this time, the shielding space is jointly enclosed by the moving parts, the waterproof cover 511, the pedestal 50, each sealing plate 514 and the plugging shell 517 to shield the fixed part.

[0043] The inlet 531 is opened on one side wall of the waterproof cover 511 and is oppositely opened on both sides of the waterproof cover 511 relative to the horizontal through port 576. The inlet 531 can allow the material taking component 3 to enter the shielding space and move to the position where the wafer is placed on the polishing part. Both moving parts include a telescopic member 532 arranged on the waterproof cover 511 and a shielding plate connected to the telescopic member 532. The shielding plate is arranged on the part of the telescopic member 532 that can move. The moving parts of the two telescopic members 532 move towards or away from each other, so as to drive the two shielding plates to move towards or away from each other, thereby realizing the opening and closing of the inlet 531.

[0044] The telescopic member 532 can be a device such as a cylinder, an electric push rod, a linear module, etc. that can drive the shielding plate to move. In this embodiment, the telescopic member 532 includes a rodless cylinder. Both rodless cylinders are fixedly arranged on the waterproof cover 511 and are symmetrically arranged on the left and right sides of the inlet 531. It should be noted that the two rodless cylinders can also be arranged on the upper and lower sides of the inlet 531, not limited to this embodiment. The sliders of the two rodless cylinders are respectively connected to the two shielding plates. When the material taking component 3 approaches the inlet 531, the sliders of the two rodless cylinders move away from each other to drive the two shielding plates to move away from each other to open the inlet 531. After the material taking component 3 enters and exits the shielding space, the sliders of the two rodless cylinders extend towards each other to drive the two multifunctional shielding plates to move towards each other until the two shielding plates abut against each other to completely block the inlet 531. When the two telescopic members 532 drive the two shielding plates to move towards each other until they stop, the two shielding plates move to the first position. When the two telescopic members 532 drive the two shielding plates to move away from each other until they stop, the two shielding plates move to the second position. After the second sensing component senses that the two shielding plates move to the first position, it sends out a signal of inlet closing. After the second sensing component senses that the two shielding plates move to the second position, it sends out a signal of inlet opening. After receiving the signal, the controller can issue the next instruction.

[0045] The baffle includes a connecting bar 533 connected to the slider of the rodless cylinder, a connecting block 534 connected to the connecting bar 533, and a shielding piece 535 connected to the connecting block 534. One end of the connecting bar 533 is fixedly arranged on the slider of the rodless cylinder, and the other end of the connecting bar 533 extends towards the inlet 531 to the position of the inlet 531. The connecting block 534 is connected to one end of the connecting bar 533 located at the inlet 531, and the connecting block 534 is located on the side of the connecting bar 533 facing the inlet 531 and passes through the inlet 531. The shielding piece 535 is connected to the side of the connecting block 534 facing the inlet 531, and the shielding piece 535 is located in the shielding space and can move freely relative to the inlet 531. The shielding piece 535 is slidably connected to the waterproof cover 511 along the extending direction of the rodless cylinder; the shielding piece 535 can also be independent of the waterproof cover 511 without connection, and only realizes the movement cooperation with the inlet 531 through the connecting block 534 and the connecting bar 533 to shield and open the inlet 531. In either case, the shielding piece 535 is movably attached to the inner wall of the waterproof cover 511 to ensure that the shielding piece 535 can better shield the inlet 531, reduce the gap between the shielding piece 535 and the waterproof cover 511, and can better avoid the problem that the inlet 531 cannot be blocked due to too large a gap between the shielding piece 535 and the waterproof cover 511.

[0046] The inlet 531 is in a "T" shape, facilitating the passing of the material taking assembly 3. A limiting block is provided on the waterproof cover 511 between the two telescopic members 532 to space the two telescopic members apart and prevent the two telescopic members 532 from affecting each other. The rodless cylinders are respectively arranged on the left and right sides of the inlet 531, and the two rodless cylinders are spaced apart. The connecting bar 533 is in an "L" shape. One end of each of the two connecting bars 533 is connected to one of the two sliders. The other ends of the two connecting bars 533 extend upward to the wide end of the inlet 531 and then continue to extend towards each other and are perpendicular. The connecting block 534 is located at the end of the connecting bar 533 away from the slider. The opposite side surfaces of the two connecting blocks 534 are flush with the opposite side surfaces of the two connecting bars 533 to which they are connected. The opposite side surfaces of the two shielding sheets 535 are flush with the opposite side surfaces of the two connecting blocks 534 to which they are connected. When the two shielding sheets 535 block the inlet 531, the two shielding sheets 535 are in contact with each other, the two connecting blocks 534 are in contact with each other, and the opposite ends of the two connecting bars 533 are in contact with each other. When the sliders of the rodless cylinders move to drive the two connecting bars 533 to move away from each other to open the inlet 531, the connecting block 534 can limit the moving position of the slider. When the two connecting blocks 534 move away from the connecting bars 533 until they abut against the two side edges of the inlet 531, the connecting block 534 can limit the continuous operation of the sliders of the rodless cylinders. The rodless cylinders and the connecting bars 533 are both arranged on the outer wall of the waterproof cover. The cooperative setting of the connecting block 534, the connecting bar 533, and the shielding sheet 535 can block the inlet 531 from the inside of the inlet and can drive the shielding sheet 535 to move from the outside of the waterproof cover 511. While ensuring that the water mist does not wet the telescopic member 532, it can also block or open the inlet, with a clever and practical design.

[0047] The second sensing component includes a third sensor 536 and a fourth sensor 537 respectively arranged on the two rodless cylinders. Both the third sensor 536 and the fourth sensor 537 are electrically connected to the controller. The third sensor 536 and the fourth sensor 537 are both set to be two and are respectively arranged at both ends where the two telescopic members 532 can move. The positions of the third sensor 536 and the fourth sensor 537 on each telescopic member 532 are respectively the first point and the second point. The two points facing each other on the telescopic member 532 are the first point, and the two points facing away from each other on the telescopic member 532 are the second point. When the telescopic member 532 drives the baffle to move to the corresponding point, the third sensor 536 and the fourth sensor 537 at the corresponding point sense the approach of the baffle and send out corresponding signals. The controller receives the signals to judge the opening and closing state of the inlet, so as to make the next instruction, so as to judge whether to proceed to the next step according to the opening and closing state of the inlet 531 before the material taking component 3 enters or exits the inlet 531. Both the third sensor 536 and the fourth sensor 537 can use sensors such as proximity switches to judge whether the inlet 531 needs to be opened or closed according to the change of the established movement track of the material taking component 3. The third sensor 536 and the fourth sensor 537 send signals to the controller after the material taking component 3 moves to the set position for corresponding operations.

[0048] The suction component 54 is arranged on the pedestal 50. One end of the suction component 54 is connected to the waterproof cover 511 and communicates with the shielding space. The suction component 54 includes an air extraction pump arranged on the pedestal 50 and an air extraction pipe connected to the suction port of the air extraction pump. The air extraction pump is electrically connected to the controller. An interface communicating with the shielding space is opened on the waterproof cover 511. One end of the air extraction pipe is connected to the suction port, and the other end of the air extraction pipe is connected to the interface. It operates while the wafer thinning machine is running to suck the splashed water mist through the air extraction pipe, so as to reduce the accumulation of water mist in the waterproof cover 511 and avoid excessive water accumulation in the shielding space, which affects the operation of the grinding part. Since there are gaps when the sealing plate 514 closes with the opening 513, when the plugging shell 517 is inserted and matched with the horizontal through port 576, and when the shielding piece 535 blocks the inlet 531, the suction component 54 will not be in a sealed state when extracting the air in the shielding space. The suction component 54 can operate normally. And because the suction component extracts the air in the shielding space, a negative pressure is formed in the shielding space, which makes the sealing plate 514 suck air into the shielding space from the gap due to the negative pressure state of the shielding space when it closes with the opening 513, when the plugging shell 517 is inserted and matched with the horizontal through port 576, and when the shielding piece 535 blocks the inlet 531. In this way, it can effectively prevent water from running out of the gap. In this way, when spraying water mist on the wafer, the water mist will not run out of the gap at all, greatly enhancing the waterproof effect of the shielding space.

[0049] The working mode of one embodiment of the workbench of the present invention is as follows:

[0050] After the wafer pickup component 34 picks up the wafer, it moves towards the inlet 41 and stops after approaching the inlet 41. The controller controls the telescopic member 42 to operate so that the two shielding sheets 45 move away from each other until they reach the second position. Then, the third sensor 46 and the fourth sensor 47 at the second position send signals to the controller. The controller controls the wafer pickup component 34 to move the wafer onto the fixing part and then return along the original path. When the wafer pickup component 34 exits the inlet 41, the controller controls the telescopic member 42 to operate to drive the two shielding sheets 45 to move towards each other until they reach the first position to block the inlet. The third sensor 46 and the fourth sensor 47 at the first position send signals to the controller. Subsequently, the controller controls the grinding part to operate to grind the wafer. At the same time, the suction component 5 operates to suck the water mist in the shielding space. After the grinding is completed, the grinding part stops operating, and the suction component 5 stops operating. The wafer pickup component 34 moves towards the inlet 41 again. The inlet 41 is opened under the cooperation of the third sensor 46 and the rodless cylinder. After the wafer pickup component 34 takes out the wafer and exits the shielding space, the inlet 41 is closed under the cooperation of the fourth sensor 47 and the rodless cylinder. This process is repeated to complete the grinding and thinning of the wafer, realizing fully automated mechanized operation and reducing labor costs. When the grinding part grinds the wafer, it blocks the splashing water mist to prevent the water mist from spreading and affecting the use of other parts, improving the overall safety and the service life of the equipment.

[0051] Refer to Figures 1 to 2 As shown, the storage part 2 includes a cassette 21 detachably arranged on the base 1 for storing wafers and a wafer sweeping member 22 for detecting the placement of the wafers to be processed in the cassette 21. The cassette 21 and the wafer sweeping member 22 are both prior arts and will not be elaborated here.

[0052] The wafer picking component 3 includes a first support base 31 disposed on the base 1, a supporting arm 32 disposed on the first support base 31, and a first suction cup 33 disposed on the first support base 31. The first support base 31 can drive the supporting arm 32 and the first suction cup 33 to rotate towards the cassette 21, the wafer receiving component 4, the thinning component 5, and the cleaning component 6 respectively. The supporting arm 32 and the first suction cup 33 are both horizontal and arranged in parallel. The supporting arm 32 and the first suction cup 33 can be telescoped along the length direction of the supporting arm 32 through a driving structure so as to move to the position where the wafer needs to be picked or the position where the wafer needs to be placed by extending when the wafer needs to be placed or picked. The supporting arm 32 is used to move the wafers in the storage part 2 to the wafer receiving component 4. One end of the supporting arm 32 for supporting the wafers has a notch 321 that opens away from the supporting arm 32 along the length direction of the supporting arm 32. The first suction cup 33 is used to suck the wafers on the wafer receiving component 4 to the thinning component 5, and the first suction cup 33 continues to suck the wafers after the thinning component 5 finishes processing the wafers and moves them to the cleaning component 6. Finally, the supporting arm 32 moves the cleaned wafers into the cassette 21. In this way, only one supporting arm 32 and the first suction cup 33 can be used to realize the movement of the wafers during the processes of wafer picking, centering, grinding, and cleaning, saving the equipment cost.

[0053] The first support base 31 includes a third driving member disposed on the base 1 and a first driving member connected to the third driving member. The third driving member can drive the first driving member to move up and down. The supporting arm 32 and the first suction cup 33 are sequentially connected to the first driving member from bottom to top, and both the supporting arm 32 and the first suction cup 33 are horizontally and parallelly arranged. The first driving member can drive the supporting arm 32 and the first suction cup 33 to rotate coaxially and horizontally by 360 degrees around the first driving member. The third driving member can drive the first driving member to move up and down, so as to adjust the height position of the supporting arm 32 and the first suction cup 33, and adjust to a suitable height according to different components. The third driving member can be a cylinder, an electric telescopic rod, a linear module or other devices that can drive the first driving member to move up and down. The third driving member is vertically arranged to drive the multifunctional first driving member to move up and down in the vertical direction. The first driving member includes a servo motor or a rotary cylinder that can rotate 360 degrees, etc., which has a rotatable output shaft. The supporting arm 32 and the first suction cup 33 are arranged on the output shaft of the first driving member to drive the supporting arm 32 and the first suction cup 33 to rotate synchronously through the operation of the first driving member. The driving mechanism includes two groups of second driving members 34. The two second driving members 34 are parallel to the supporting arm 32 and are respectively connected to the output shaft of the first driving member corresponding to the positions of the supporting arm 32 and the first suction cup 33, that is, the two second driving members 34 are arranged at intervals, one above the other. The supporting arm 32 is connected to the second driving member 34 located below, and the first suction cup 33 is connected to the second driving member 34 located above. The second driving member 34 located below can drive the supporting arm 32 to move along the length direction so that the supporting arm 32 extends or contracts relative to the first driving member. The second driving member 34 located above can drive the first suction cup 33 to move along the length direction of the supporting arm 32 so that the first suction cup 33 extends or contracts relative to the first driving member. During use, when the first driving member drives the supporting arm 32 and the first suction cup 33 to rotate until facing one of the cassette 21, the material receiving component 4, the grinding component or the cleaning component 6, the second driving member 34 can drive the corresponding supporting arm 32 and the first suction cup 33 to extend towards the corresponding component to obtain or place the wafer, and retract after obtaining or placing the wafer. The second driving member 34 can be a cylinder, an electric push rod, a linear module and other devices that can drive the supporting arm 32 or the first suction cup 33 to move linearly. Any structure can realize the telescoping of the supporting arm 32 and the first suction cup 33. The bottom surface of the first suction cup 33 has suction holes capable of sucking the wafer, and a channel communicating with the suction holes is provided inside the first suction cup 33. The function of sucking the wafer by the suction holes is realized by pumping air.

[0054] The wafer supporting component 4 includes a wafer supporting base 41 disposed on the base 1, a supporting platform 42 disposed on the wafer supporting base 41 and capable of lifting, and a centering part 43 disposed on the wafer supporting base 41 and capable of closing or opening towards the supporting platform 42. The supporting platform 42 is used to support the wafer, and the supporting platform 42 can be lifted. The centering part 43 can center the wafer placed on the supporting platform 42 so that the wafer is coaxially aligned with the supporting platform 42. The wafer supporting base 41, the supporting platform 42, and the centering part 43 are all coaxially arranged. When the supporting arm 32 moves the wafer towards the supporting platform 42, the supporting platform 42 rises until the supporting arm 32 moves the wafer directly above the supporting platform 42, and after the supporting arm 32 places the wafer on the supporting platform 42, the supporting platform 42 descends. After the supporting platform 42 supports the wafer and descends, the centering part 43 closes to push the wafer to the center of the supporting platform 42 until the wafer is aligned with the center of the supporting platform 42. After centering is completed, the centering part 43 opens to release the wafer.

[0055] In this embodiment, the wafer supporting base 41 includes a supporting housing disposed on the top surface of the base 1. There is an installation space inside the supporting housing. The supporting platform 42 and the centering part 43 are both disposed in the installation space and coaxially arranged. A through hole is formed on the top surface of the supporting housing for the supporting platform 42 to penetrate upward through the top surface of the wafer supporting base 41. The supporting platform 42 includes a lifting platform capable of lifting and a second suction cup disposed on the top surface of the supporting platform 42. The lifting platform can pass through the notch 321 of the supporting arm 32 in the vertical direction. The top surface of the lifting platform is a supporting plane for supporting the wafer. A chute 44 is provided on the lifting platform for the centering part 43 to close or open and align with the center of the supporting platform 42. Through grooves 45 corresponding to the chute 44 one by one and overlapping in the vertical direction are formed on the top surface of the supporting housing. Both the through grooves 45 and the chute 44 are provided in several numbers and correspond to the centering part 43 one by one so that the centering part 43 extends upward. The several through grooves 45 and the chute 44 are arranged in a circular array with the supporting platform 42 as the center, and both the through grooves 45 and the chute 44 are arranged along the radial direction of the supporting platform 42. For the detailed structure of the centering part 43, reference can be made to the structure of the centering component in the Chinese invention patent application "CN115338717A", which will not be elaborated here. During use, after the supporting arm 32 drags out the wafer in the cassette 21 and drives the wafer towards the supporting platform 42 until the supporting arm 32 drives the wafer directly above the supporting platform 42. At the same time, the supporting platform 42 rises until it touches the wafer and then stops rising. At the same time, the second suction cup sucks the wafer. After the supporting platform 42 stops rising, the supporting arm 32 contracts to move away from the supporting platform 42. Subsequently, the supporting platform 42 descends until the top surface of the supporting platform 42 and the top surface of the housing are on the same horizontal plane. The second suction cup releases the wafer, and the centering part 43 operates to close towards the supporting platform 42. In this way, even if the midpoint of the wafer is not aligned with the midpoint of the supporting platform 42, the centering part 43 that closes at a constant speed drags the misaligned wafer during the closing process until the wafer is coaxially aligned with the supporting platform 42, and then the centering part 43 opens until it returns to the initial position.

[0056] The thinning component 5 includes a workbench and a main body part 55. The workbench includes a pedestal 50, a fixing part arranged on the pedestal 50, a waterproof component 51 arranged on the pedestal 50, a closing component 53 arranged on the waterproof component 51, and a suction component 54 arranged on the pedestal 50 and communicating with the inner cavity of the waterproof component 51. The waterproof component 51, the closing component, and the suction component 54 are the same as the foregoing content and will not be elaborated here. The main body part includes a grinding part arranged on the pedestal 50, an oilstone part arranged on the pedestal 50 and located within the waterproof cover 511, and a detection part arranged on the pedestal 50 and located within the waterproof cover 511. The fixing part is used to support and fix the wafer to be ground. The grinding part and the first support base 31 are respectively arranged on two opposite sides of the waterproof cover 511 so that there is no interference between the grinding part and the first support base 31. The grinding part is used to grind the wafer on the fixing part for thinning. The oilstone part is used to clean the fixing part. After the grinding of the wafer is completed by the cooperation of the fixing part and the grinding part and the wafer is sucked away by the first suction cup 33 and moved to the cleaning component 6, the oilstone part rotates to directly above the fixing part and grinds the fixing part, cleaning the dust remaining on the fixing part due to wafer grinding, avoiding the dust remaining on the fixing part and increasing the height of the top surface of the fixing part, which affects the thickness of the wafer after grinding. After the oilstone part finishes cleaning the fixing part, the detection part detects the height of the fixing part.

[0057] The fixing part includes a work platform arranged on the pedestal 50 and a wafer carrier 561 arranged on the work platform. The wafer carrier 561 is used to support the wafer and suck the wafer to fix it. The top surface of the work platform has a flat surface. The wafer carrier 561 is located on the top surface of the work platform. The top surface of the wafer carrier 561 has a support plane for supporting the wafer. The wafer carrier 561 includes a third suction cup for sucking the wafer to fix the wafer on the wafer carrier 561. The wafer carrier 561 and the processing port 512 are coaxially arranged in the vertical direction so that the grinding part can cooperate with the wafer carrier 561 after passing through the processing port 512.

[0058] The grinding part includes a second support base 551 arranged on the pedestal 50, a main shaft 557 arranged on the second support base 551 and coaxially arranged with the wafer carrier 561, and a grinding wheel 552 arranged on the main shaft 557 and located at the bottom of the main shaft 557. The grinding wheel 552 is the grinding part of the main body part 55. The grinding wheel 552 is coaxially arranged with the main shaft 557. The processing port 512 is opened directly below the main shaft 557. The main shaft 557 can drive the grinding wheel 552 to move in the vertical direction relative to the workbench so that the grinding wheel 552 can move towards or away from the wafer carrier 561.

[0059] The second support base 551 and the first support base 31 are respectively arranged on two opposite sides of the waterproof cover 511. The main shaft 557 is arranged on the second support base 551 and is located on the side of the second support base 551 facing the waterproof cover 511. The main shaft 557 includes a housing connected to the second support base 551, a fourth driving member arranged inside the housing, and a fifth driving member connected to the fourth driving member. The bottom of the housing extends to the processing opening 512. The grinding wheel 552 is located in the shielding space. The fifth driving member is drivingly connected to the grinding wheel 552, and the fourth driving member drives the fifth driving member to move up and down in the vertical direction. In this embodiment, the fourth driving member is a servo motor, and the fifth driving member can be a device capable of telescoping or moving, such as a cylinder or an electric telescopic rod. During use, the main shaft 557 drives the grinding wheel 552 to move downward until it contacts the wafer on the wafer holding stage 561 and then stops moving. At this time, the bottom of the main shaft 557 presses against the processing opening 512 to form a complete shielding together with the waterproof cover 511 after the closing part is closed, so as to prevent dust from escaping from the processing opening 512. The main shaft 557 drives the grinding wheel 552 to rotate to polish the top surface of the wafer. After the wafer polishing is completed, the main shaft 557 drives the grinding wheel 552 to move upward to return to its original position and wait for the next processing.

[0060] The oil stone part includes a seventh driving member 553 arranged on the pedestal 50, an eighth driving member 554 arranged on the seventh driving member 553, and an oil stone 555 arranged on the eighth driving member 554. In this embodiment, the seventh driving member 553 includes a rotary cylinder, the output shaft of the rotary cylinder is arranged upward, the eighth driving member 554 is arranged on the output shaft of the seventh driving member 553, and the seventh driving member 553 can drive the eighth driving member 554 to rotate relative to directly above the wafer holding stage 561. When the wafer holding stage 561 does not need to be cleaned, the seventh driving member 553 drives the eighth driving member 554 to rotate to the side of the wafer holding stage 561. After the wafer is polished and driven by the first suction cup 33, the seventh driving member 553 drives the eighth driving member 554 to rotate to directly above the wafer holding stage 561. The eighth driving member 554 includes a servo motor, the output shaft of the eighth driving member 554 is arranged vertically downward, and the oil stone 555 is arranged on the output shaft of the eighth driving member 554. The eighth driving member 554 drives the oil stone 555 to rotate around the output shaft of the eighth driving member 554.

[0061] The detection part includes a ninth driving member 556 arranged on the pedestal 50, a sensor arranged on the ninth driving member 556, and a spraying part arranged on the ninth driving member 556. The ninth driving member 556 is used to drive the sensor and the spraying part to rotate relative to the wafer holding stage 561. The sensor is used to detect the height of the wafer holding stage 561, and the spraying part is used to spray water mist on the wafer when the grinding wheel 552 polishes the wafer on the wafer holding stage 561 to cool it down.

[0062] In this embodiment, the seventh driving member 553 and the ninth driving member 556 are respectively arranged on both sides of the second support base 551. The ninth driving member 556 includes a rotary cylinder and the output shaft is located above the cylinder body. The operation of the ninth driving member 556 can horizontally rotate relative to the position directly above the wafer stage 561 and the side of the wafer stage 561. Both the sensor and the spraying part are arranged on the output shaft of the ninth driving member 556. The spraying part includes a spray head arranged on the output shaft of the ninth driving member 556, a pipeline connected to the spray head and supplying water to the spray head, and a water pump arranged on the pedestal 50 and connected to the pipeline. The water pump is connected to an external water source and supplies water to the pipeline after operation, and water is ejected from the spray head to form water mist. During use, when the grinding wheel 552 cooperates with the wafer stage 561 to grind the wafer, the ninth driving member 556 drives the spraying part to rotate until it faces the wafer stage 561 and then stops rotating. The spraying part sprays water mist on the wafer to cool the wafer and can also play a role in dust reduction, improving the dust prevention effect to a certain extent; after the oilstone 555 cleans the wafer stage 561, the ninth driving member 556 operates to drive the sensor to rotate until the sensor rotates to the position directly above the wafer stage 561. At this time, the bottom end of the sensor detects the height of the top surface of the wafer stage 561. When the height of the wafer stage 561 is not at the set height, the operator can adjust it in time to ensure the quality of the wafer after processing. It should be understood that the ninth driving member 556 is not limited to the rotary cylinder in this embodiment, and can also be replaced by a device such as a servo motor that can drive the sensor and the spraying part to rotate.

[0063] The cleaning assembly 6 includes a cleaning box 61 arranged on the base 1, a cleaning table 62 arranged in the cleaning box 61, a top cover 63 arranged directly above the cleaning box 61, a water spraying part for spraying water on the wafer arranged in the cleaning box 61, a drying part arranged in the cleaning box 61, a baffle movably arranged on the cleaning box 61, and a telescopic member 64 arranged on the cleaning box 61 and connected to the baffle. The cleaning table 62 is used to support and suck the wafer. The water spraying part is used to spray water on the wafer on the cleaning table 62. The drying part is used to blow air on the cleaning table 62 to dry the wafer. There is a gap between the top cover 63 and the cleaning box 61 for the first suction cup 33 and the supporting arm 32 to pass through. The supporting arm 32 and the first suction cup 33 can extend into the area above the cleaning table 62 through the gap. The baffle can block the gap to prevent water from splashing out from the gap. The telescopic member 64 is used to drive the baffle to move to open the gap when the supporting arm 32 or the first suction cup 33 needs to extend into or out of the cleaning box 61, and drive the multi-functional baffle to move to block the gap when the wafer needs to be cleaned.

[0064] In this embodiment, the cleaning box 61 includes a box body that is arranged to pass through from top to bottom, and the cleaning table 62 includes a placement table arranged on the base 1 and located inside the cleaning box 61 and a fourth suction cup located on the top surface of the placement table. A tenth driving member is arranged on the base 1, and the tenth driving member is located below the placement table. The output shaft of the tenth driving member passes through the top surface of the base 1 upward, and the placement table is transmission-connected to the output shaft of the tenth driving member. The tenth driving member can drive the placement table to rotate with its output shaft as the axis. The water spraying part includes a bracket arranged on the base 1, a nozzle arranged on the bracket and facing the placement table, a pipe connected to the nozzle and supplying water to the spray head, and a water pump arranged on the base 1 and connected to the pipe. The water pump is connected to an external water source to output water to the spray head through the pipe to rinse the wafer. The tenth driving member includes a servo motor, and can also be replaced by other devices that can drive the cleaning table 62 to rotate.

[0065] The drying section includes a fan arranged on the base 1 and an air outlet connected to the fan and extending into the cleaning box 61, and the air outlet is arranged toward the placement table. The baffle is distributed in a ring around the inner wall of the cleaning box 61, and the baffle is movably arranged relative to the cleaning box 61 and the top cover 63. A slide rail can be arranged on the inner wall of the cleaning box 61 in a vertical direction to make the baffle slidably connected to the cleaning box 61, or the baffle and the cleaning box 61 can be disconnected and only the movable cooperation between the baffle and the cleaning box 61 can be achieved through the telescopic component 64. The telescopic component 64 is arranged on the outer wall of the cleaning box 61 and arranged vertically. The telescopic component 64 is fixedly connected to the baffle through a connecting block, and the telescopic component 64 operates to drive the baffle to move up and down. When not in use, the baffle does not block the gap. The baffle is located inside the cleaning box 61 and below the gap. When the first suction cup 33 sucks the polished wafer on the wafer stage 561 and moves it to the placement table through the gap and exits the gap, the telescopic component 64 operates to drive the baffle to move upward until the baffle blocks the gap. At this time, the fourth suction cup on the placement table sucks the wafer to fix the wafer; the water spraying part flushes water to the wafer on the placement table to wash away the dust on the wafer. The baffle prevents water from flying out of the gap during the flushing process of the water spraying part to avoid water consumption on other parts; after the flushing is completed, the tenth driving member drives the placement table to rotate at a high speed to dry the moisture on the wafer, and then the drying part runs to blow air toward the wafer to accelerate the evaporation rate of the moisture on the wafer surface. In this embodiment, the telescopic component 64 includes a cylinder.

[0066] In the present invention, the first driving member, the second driving member 34, the third driving member, the fourth driving member, the fifth driving member, the sixth driving member 538, the seventh driving member 553, the eighth driving member 554, the ninth driving member 556, the tenth driving member, the telescopic member 64, the spraying portion, the water spraying portion, the drying portion, the wiper 22, the support table 42, the centering portion 43, and the first suction cup 33. The second suction cup, the third suction cup, and the fourth suction cup are all connected to a controller. The controller is connected to a computer program and programmed, and the controller controls and operates the components of each part.

Claims

1. A workbench is provided on a wafer thinning machine for carrying a wafer and preventing water mist from splashing during wafer processing. It is characterized in that: It includes a pedestal, a fixing part arranged on the pedestal for fixing a wafer, and a waterproof component arranged on the pedestal for covering a grinding part. The waterproof component includes a waterproof cover covering the outer periphery of the pedestal, a shielding space formed inside the waterproof cover, a processing opening formed on the upper end face of the waterproof cover for the grinding part of the wafer thinning machine to penetrate into the shielding space, an inlet formed on one side of the waterproof cover, and a closing component formed on the waterproof cover and capable of closing the inlet. After the grinding part of the wafer thinning machine extends into the processing opening, it can block the processing opening; The processing opening is formed by enclosing an arc-shaped opening fixedly formed on the upper end face of the waterproof cover and a plugging part with a third arc-shaped notch opposite to the arc-shaped opening. The arc-shaped opening penetrates the upper end face of the waterproof cover vertically upward to form a vertical through opening. A horizontal through opening penetrating the side face horizontally is formed on one side face of the waterproof cover adjacent to the arc-shaped opening. The arc-shaped opening is communicated with the horizontal through opening. The parts of the waterproof cover on both sides of the horizontal through opening form vertical mating walls. A supporting platform extends outward from the lower end face of the waterproof cover at the horizontal through opening. Magnet attracting parts protruding upward and magnetically attracting and cooperating with the plugging part are arranged on both sides of the top surface of the supporting platform. A surrounding piece with an upward opening is arranged along the edge on the side of the supporting platform away from the horizontal through opening. A fastener for locking the plugging part is arranged on the surrounding piece.

2. The workbench according to claim 1, characterized in that: An observation part for facilitating observing the internal situation of the shielding space is arranged on the waterproof cover. The observation part includes an opening formed on the waterproof cover and communicating with the shielding space, a sealing plate arranged at the opening and hermetically connected to the opening, and an observation window formed on the sealing plate.

3. The workbench according to claim 2, characterized in that: One side of the sealing plate is pivotally connected to one side of the opening, and the other side of the sealing plate is locked to the opposite side of the opening through a detachable locking structure.

4. The workbench according to claim 3, characterized in that: The sealing plate includes two support plates, and the observation window is formed on each support plate. One side of one support plate is hinged to one side of the opening, and the other side is hinged to one side of the other support plate. The other side of the other support plate is locked to the opposite side of the opening through the locking structure; A sealing strip for preventing water mist from leaking out is formed between the support plates.

5. The workbench according to claim 4, characterized in that: The locking structure includes a locking part arranged on the waterproof cover and a hook part arranged on one of the support plates. The hook part can rotate relative to the locking part. The locking part has a clamping groove for hooking and cooperating with the hook part when the hook part rotates to the locking part to limit the support plate at the opening.

6. The workbench according to claim 1, characterized in that: The plugging part is movably arranged at the horizontal through opening to be able to open and close the horizontal through opening. The transverse two side walls of the plugging part abut against the mating walls, and the lower end face of the plugging part is supported on the supporting platform; Two plugging grooves inserted and cooperating with the magnet attracting parts are formed at the positions corresponding to the two magnet attracting parts at the bottom of the plugging part, and a fastening hole cooperating with the fastener is formed at the position corresponding to the fastener on the plugging part.

7. The workbench according to claim 6, characterized in that: A first induction component for induction after the sealing plate is opened or the plugging part is removed is arranged on the waterproof cover. After the first induction component senses that the opening is opened due to the folding of the sealing plate or the horizontal through port is opened due to the removal of the plugging part, the cooperation between the fixing part and the grinding part stops.

8. The workbench according to claim 1, characterized in that: The closing component includes two moving parts that are connected to the waterproof cover and symmetrically arranged at the inlet and can open or close the inlet, and a second induction component arranged on the two moving parts to sense whether the moving parts move in place. Both of the two moving parts include a shielding plate for blocking the inlet and a telescopic member arranged on the waterproof cover and connected to the shielding plate. The two telescopic members can drive the two shielding plates to move towards or away from each other. When the two telescopic members drive the two shielding plates to move towards each other until they stop, the two shielding plates move to the first position. When the two telescopic members drive the two shielding plates to move away from each other until they stop, the two shielding plates move to the second position. After the second induction component senses that the two shielding plates move to the first position, it sends a signal for closing the inlet. After the second induction component senses that the two shielding plates move to the second position, it sends a signal for opening the inlet, and the material taking mechanism takes corresponding actions according to the signal sent by the second induction component.

9. The workbench according to claim 1, characterized in that: It further includes a suction component that communicates with the shielding space and sucks the water mist in the shielding space when the thinning mechanism is operating.

10. A wafer thinning machine is characterized in that, It includes the workbench according to any one of claims 1 to 9.

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