Optical coupling system and method of manufacturing thereof

Abstract

The application relates to an optical coupling system and a preparation method thereof. The preparation method of the optical coupling system comprises the following steps: providing a substrate, mounting an optical chip on the substrate to form a first intermediate component 10; fixing an optical fiber in a fixing structure to form an optical fiber assembly; providing a connecting assembly, the connecting assembly comprising a chip-side connector and an optical fiber-side connector, the chip-side connector and the optical fiber-side connector being used for detachable connection; fixing one end of the optical fiber-side connector with the optical fiber assembly and connecting the other end of the optical fiber-side connector with the chip-side connector to form a second intermediate component 20; adjusting the position of the second intermediate component 20 relative to the first intermediate component 10; stopping the adjustment of the relative position when the optical chip and the optical fiber achieve optimal optical coupling, and fixing the chip-side connector on the substrate. The application can simultaneously realize fast and accurate optical coupling of the optical chip and the optical fiber.

Description

Technical Field

[0001] This application relates to the field of optoelectronic technology, and in particular to an optical coupling system and its fabrication method. Background Technology

[0002] With the booming development of the Internet of Things (IoT) and wireless communication technologies and applications, IP network data traffic continues to grow rapidly. Especially driven by applications such as cloud computing and big data, large-scale data center construction remains highly active. The data communication market is undergoing generational changes, and the optical communication market is experiencing rapid growth.

[0003] Meanwhile, with the rapid increase in power consumption, cost, and size of traditional discrete device packaging solutions, optoelectronics for communication is accelerating its development from discrete devices towards integration. Optoelectronic interconnect technology has always been one of the important development technologies in photonics integration. A key technology for optoelectronic interconnect is to solve the problem of efficient optical coupling between optical chips and optical fibers.

[0004] However, current optical chip and fiber optic coupling technologies struggle to achieve both rapid and precise coupling simultaneously. Summary of the Invention

[0005] Therefore, it is necessary to provide an optical coupling system and its fabrication method.

[0006] A method for fabricating an optical coupling system for coupling an optical chip to an optical fiber, comprising:

[0007] A substrate is provided, and an optical chip is mounted on the substrate to form a first intermediate component;

[0008] The optical fiber is fixed within a fixed structure to form an optical fiber assembly;

[0009] A connection component is provided, the connection component including a chip-side connector and an optical fiber-side connector, the chip-side connector and the optical fiber-side connector being used for detachable connection;

[0010] One end of the fiber optic connector is fixedly connected to the fiber optic assembly, and the other end is connected to the chip-side connector to form a second intermediate component.

[0011] Adjust the position of the second intermediate component relative to the first intermediate component;

[0012] When the optical chip and the optical fiber achieve optimal optical coupling, the adjustment of the relative position is stopped, and the chip-side connector is fixed to the substrate.

[0013] In one embodiment, after stopping the adjustment of the relative position when the optical chip and the optical fiber achieve optimal optical coupling and fixing the chip-side connector to the substrate, the method further includes:

[0014] Disconnect the chip-side connector from the fiber-optic side connector.

[0015] In one embodiment, providing a substrate and mounting an optical chip on the substrate to form a first intermediate component includes:

[0016] Provide substrate;

[0017] The optical chip is mounted on the substrate;

[0018] A first lens structure is mounted on the substrate, and the first lens structure is located on one side of the optical chip.

[0019] In one embodiment, mounting the first lens structure on the substrate includes:

[0020] Adjust the position of the first lens structure relative to the optical chip;

[0021] The first lens structure is mounted on the substrate.

[0022] In one embodiment, mounting the first lens structure onto the substrate includes:

[0023] The first lens structure is fixed to the substrate by laser welding or eutectic welding.

[0024] The step of stopping the adjustment of the relative position when the optical chip and the optical fiber achieve optimal optical coupling, and fixing the chip-side connector to the substrate, includes:

[0025] The chip-side connector is fixed to the substrate by laser welding or eutectic bonding.

[0026] In one embodiment, the step of fixing one end of the fiber optic connector to the optical component and detachably connecting the other end to the fiber optic connector to form a second intermediate component includes:

[0027] A second lens structure is installed at one end of the optical fiber connector;

[0028] Connect the end of the optical fiber connector with the second lens structure installed to the optical fiber assembly;

[0029] Connect the other end of the fiber optic connector to the chip-side connector.

[0030] In one embodiment, connecting the end of the fiber optic connector with the second lens structure mounted thereon to the fiber optic assembly includes:

[0031] Adjust the position of the fiber optic assembly relative to the second lens structure;

[0032] The end of the fiber optic connector with the second lens structure is fixed to the fiber optic assembly.

[0033] In one embodiment,

[0034] The chip-side connector includes a first guide pin and a first guide hole;

[0035] The fiber optic connector includes a second guide pin and a second guide hole;

[0036] The first guide pin is provided corresponding to the second guide hole, and the second guide pin is provided corresponding to the first guide hole.

[0037] An optical coupling system, manufactured according to any one of the above methods, comprising:

[0038] substrate;

[0039] An optical chip is mounted on the substrate;

[0040] An optical fiber assembly includes an optical fiber and a fixing structure, wherein the optical fiber is fixed to the fixing structure;

[0041] The connection assembly includes a chip-side connector and an optical fiber-side connector, wherein one end of the optical fiber-side connector is connected to the connection end face of the optical fiber assembly, and the other end is detachably connected to the chip-side connector. The chip-side connector is fixed to the substrate, and the fixed position of the chip-side connector on the substrate is determined based on the optical fiber-side connector connected to the optical fiber assembly.

[0042] In one embodiment, the optical coupling system further includes a first lens structure located on the substrate and on one side of the optical chip.

[0043] In one embodiment, the optical coupling system further includes a second lens structure located at one end of the optical fiber connector, and the end of the optical fiber connector with the second lens structure mounted thereon is connected to the optical fiber assembly.

[0044] The aforementioned optical coupling system and its fabrication method first involve placing an optical chip on a substrate to form a first intermediate component. Then, an optical fiber is fixed to a fixed structure and connected to an optical fiber-side connector in a connecting assembly. Simultaneously, the other end of the optical fiber-side connector is also connected to a chip-side connector, forming a second intermediate component. Next, by adjusting the position of the second intermediate component relative to the first intermediate component, and achieving optimal optical coupling between the optical chip and the optical fiber, the chip-side connector is fixed to the substrate.

[0045] Therefore, in the application of optical coupling systems, the chip-side connector and the fiber-optic connector can be quickly assembled and disassembled as needed. Meanwhile, the fiber-optic connector is fixed to the substrate under conditions that achieve optimal optical coupling between the optical chip and the fiber optic assembly. Therefore, when the chip-side connector and the fiber-optic connector are reconnected during application, sufficiently high optical coupling efficiency can still be guaranteed, and its repeatability is high. Attached Figure Description

[0046] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a flowchart of a method for fabricating an optical coupling system provided in one embodiment;

[0048] Figures 2 to 9 This is a cross-sectional structural schematic diagram of the fabrication process of the optical coupling system provided in one embodiment;

[0049] Figure 10 This is a three-dimensional structural diagram of an optical coupling system provided in one embodiment. Detailed Implementation

[0050] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0052] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, parts, regions, layers, doping types, and / or portions, these elements, parts, regions, layers, doping types, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, part, region, layer, doping type, or portion from another element, part, region, layer, doping type, or portion. Therefore, without departing from the teachings of this application, the first element, part, region, layer, doping type, or portion discussed below may be referred to as a second element, part, region, layer, or portion.

[0053] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0054] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0055] In one embodiment, see Figure 1 This invention provides a method for fabricating an optical coupling system for coupling optical chips and optical fibers.

[0056] As an example, the optical chip can be a laser, a PLC, silicon photonics, or other optical chips. Specifically, the optical chip can be an active optical device emitted from the edge of a laser, or a passive optical device such as an optical waveguide with edge-coupled reception.

[0057] Methods for fabricating optical coupling systems include:

[0058] Step S100: A substrate 100 is provided, and an optical chip 200 is mounted on the substrate 100 to form a first intermediate component 10. Please refer to [link to relevant documentation]. Figure 3 ;

[0059] Step S200: Fix the optical fiber 310 inside the fixed structure 320 to form the optical fiber assembly 300;

[0060] Step S300: A connection assembly 400 is provided, comprising a chip-side connector 410 and an optical fiber-side connector 420. The chip-side connector 410 and the optical fiber-side connector 420 are used for detachable connection. (See also...) Figure 4 ;

[0061] In step S400, one end of the fiber optic connector 420 is connected to the fiber optic assembly 300, and the other end is connected to the chip-side connector 410 to form the second intermediate component 20. (See also...) Figure 6 ;

[0062] Step S500: Adjust the position of the second intermediate member 20 relative to the first intermediate member 10. Please refer to [link / reference]. Figure 7 ;

[0063] In step S600, when optimal optical coupling is achieved between the optical chip 200 and the fiber optic assembly 300, the adjustment of their relative positions is stopped, and the chip-side connector 410 is fixed to the substrate 100. (See also...) Figure 8 .

[0064] In step S100, the substrate 100 is the carrier substrate of the optical chip 200, which can be a heat sink or other substrate material.

[0065] Specifically, the optical chip 200 can be mounted on the substrate 100. In addition to the optical chip, other chips and / or other circuit structures can also be provided on the substrate 100.

[0066] In step S200, the optical fiber 310 can be fixed in a fixing structure 320 with a V-groove, thereby being limited and fixed by the V-groove.

[0067] Meanwhile, after the optical fiber 310 is fixed to the fixed structure 320 to form the optical fiber assembly 300, the end face of the optical fiber assembly 300 can be ground and polished to form a connection end face for easy connection, and then connected to one end of the optical fiber side connector 420 through the connection end face.

[0068] In step S300, the chip-side connector 410 and the fiber-optic connector 420 of the connection assembly 400 may be provided with mutually cooperating positioning structures, so that the two can be detachably connected.

[0069] As an example, the chip-side connector 410 and the fiber optic connector 420 may be provided with mutually cooperating guide pins and guide holes, so as to achieve detachable connection through the cooperation of the guide pins and guide holes.

[0070] In step S400, the chip-side connector 410 and the fiber optic assembly 300 are located on opposite sides of the fiber optic connector 420. Specifically, the chip-side connector 410 and the fiber optic assembly 300 can be located on opposite sides of the fiber optic connector 420.

[0071] At this time, the second intermediate component 20 includes the chip-side connector 410 and the fiber-optic connector 420, which are in a connected state, as well as the fiber-optic assembly 300.

[0072] In step S500, the direction from the optical chip toward the optical fiber can be set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, with the y-axis direction perpendicular to the upper surface of the substrate.

[0073] At this time, the first intermediate component 10 can be fixed in place, while the position of the second intermediate component 20 can be adjusted in the x, y, and z directions by a high-precision mounting device, thereby adjusting the distance and spatial angle between the second intermediate component 20 and the first intermediate component 10.

[0074] Of course, in some embodiments, the second intermediate component 20 can be fixed in place, while the position of the first intermediate component 10 can be adjusted in the x, y, and z directions using a high-precision mounting device, thereby adjusting the distance and spatial angle between the second intermediate component 20 and the first intermediate component 10. This application does not limit this.

[0075] In step S500, during the adjustment of the position of the second intermediate component 20 relative to the first intermediate component 10, the optical power emitted by the optical chip 200 to the optical fiber 310 can also be monitored simultaneously.

[0076] At this point, in step S600, when the optical chip and optical fiber achieve optimal optical coupling, i.e., when the optical power emitted from the optical chip 200 to the optical fiber is at its maximum, the chip-side connector 410 can be fixed to the substrate 410 by means of adhesive bonding, laser welding, eutectic bonding, etc., thereby fixing the chip-side connector 410 to the optical fiber assembly 300 to form an optical coupling system. Therefore, in the fabrication process of the optical coupling system, the optical fiber-side connector 420 connected to the optical fiber assembly 300 functions as both a connector and a coupling alignment tool.

[0077] In the application of the optical coupling system, the chip-side connector 410 and the fiber-optic connector 420 can be quickly assembled and disassembled as needed. Meanwhile, the fiber-optic connector 420 is fixed to the substrate 100 under conditions where optimal optical coupling is achieved between the optical chip 200 and the fiber optic assembly 300. Therefore, when the chip-side connector 410 and the fiber-optic connector 420 are reconnected during application, sufficiently high optical coupling efficiency can still be guaranteed, and its repeatability is high.

[0078] Furthermore, the same first intermediate component 10 can be adapted to multiple second intermediate components 20 manufactured using the same process. Simultaneously, the same second intermediate component 20 can also be adapted to multiple first intermediate components 1020 manufactured using the same process. Therefore, this embodiment can effectively improve the yield rate.

[0079] It is understood that the fabrication method of the optical coupling system in this embodiment can be used for coupling connection between optical chips and optical fibers in a single optical path, and can also support coupling connection between optical chips and optical fibers in a multi-optical path array structure.

[0080] In one embodiment, step S200 includes:

[0081] Step S210: Provide a substrate;

[0082] Step S220: Mount the optical chip 200 onto the substrate 100. Please refer to [link / reference]. Figure 2 ;

[0083] Step S230: A first lens structure 500 is mounted on the substrate 100. The first lens structure 500 is located on one side of the optical chip 200. (See also...) Figure 3 .

[0084] In step S220, the optical chip 200 can be mounted on the substrate 100 first.

[0085] In step S230, the first lens structure 500 can be fixed to the substrate 100 by means of adhesive bonding or laser welding. The first lens structure 500 can specifically be a micro-optical lens.

[0086] The first lens structure 500 is located on one side of the optical chip 200, thereby enabling collimation and beam expansion of the small-mode field beam emitted by the optical chip 200.

[0087] For example, please refer to Figure 3 The substrate 100 may include a first mounting portion 110 and a second mounting portion 120 that are connected to each other. The thickness of the first mounting portion 110 may be greater than the thickness of the second mounting portion 120, thereby creating a step between them.

[0088] The thinner optical chip 200 can be mounted on the thicker first mounting portion 110, and its light emission direction can be controlled along the direction from the first mounting portion 110 to the second mounting portion 120. The thicker first lens structure 500 can be mounted on the thinner second mounting portion 120. In this case, since the thickness of the first mounting portion 110 is greater than that of the second mounting portion 120, it is advantageous for the optical chip 200 on the first mounting portion 110 to emit light towards the central portion of the first lens structure 500, thereby facilitating effective collimation and beam expansion of the small-mode-field beam emitted by the first lens structure 500.

[0089] Of course, the shape of the substrate 100 is not limited to this and can be set according to the actual situation.

[0090] In this embodiment, the small-mode field beam emitted by the optical chip 200 can be collimated and expanded by the first lens structure 500, so that the small-mode field is converted into a large-mode field, thereby effectively reducing the accuracy of the alignment and coupling between the optical chip 200 and the fiber optic assembly 300.

[0091] Of course, in other embodiments, the small-mode beam emitted by the optical chip 200 can also be collimated and expanded in other ways, and this application does not limit this.

[0092] In one embodiment, step S230 includes:

[0093] Step S231: Adjust the distance between the first lens structure 500 and the optical chip 200;

[0094] Step S232: Mount the first lens structure 500 onto the substrate 100.

[0095] In step S231, specifically, as an example, when the direction from the optical chip toward the optical fiber is set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, and the y-axis direction is perpendicular to the upper surface of the substrate, the position of the first lens structure 500 in the z-axis and x-axis directions can be adjusted by relevant instruments and equipment, so that the light beam emitted by the optical chip 200 can form a light beam with high collimation after passing through the first lens structure 500, thereby facilitating effective optical coupling with the optical fiber.

[0096] It is understandable that the position of the first lens structure 500 in the y-axis direction can be reasonably controlled through manufacturing processes.

[0097] In step S232, the first lens structure 500, after being positioned, is mounted on the substrate 100.

[0098] In one embodiment, step S400 includes:

[0099] Step S410: Install the second lens structure 600 at one end of the fiber optic connector 420. (See [link to relevant documentation]). Figure 5 ;

[0100] Step S420: Connect the end of the fiber optic connector 420 with the second lens structure 600 to the fiber optic assembly 300. (See also...) Figure 5 ;

[0101] Step S430: Connect the other end of the fiber optic connector 420 to the chip-side connector 410. Please refer to [link to relevant documentation]. Figure 6 .

[0102] In step S410, the second lens structure 600 can be integrated and mounted on the fiber optic connector 420 via a precision patch. The second lens structure 600 can be a micro-optical lens.

[0103] Specifically, the second lens structure 600 can be mounted on the outer surface of the fiber optic connector 420 (see [link]). Figure 10 At this time, in step S420, the end of the fiber optic connector 420 on which the second lens structure 600 is mounted can be connected to the connection end face of the fiber optic assembly 300 through the second lens structure 600.

[0104] Of course, the second lens structure 600 can also be mounted inside the fiber optic connector 420 (see [link]). Figure 5 At this point, in step S420, the second lens structure 600 can also be connected to the connection end face of the fiber optic assembly 300. Alternatively, the outer end surface of the end of the fiber optic connector 420 where the second lens structure 600 is mounted can be connected to the fiber optic assembly 300 (not shown). There are no restrictions on this.

[0105] In step S430, the fiber optic connector 420 and the chip connector 410 can be connected by a positioning structure that allows them to cooperate with each other.

[0106] In this embodiment, the small-mode beam emitted by the fiber optic assembly 300 can be collimated and expanded by the second lens structure 600, thereby enabling the conversion between small-mode and large-mode fields, which can effectively reduce the alignment and coupling accuracy between the optical chip 200 and the fiber optic assembly 300.

[0107] Specifically, in some embodiments, during the fabrication of the optical coupling system, a light beam can be emitted through the optical chip 200, and then the light beam emitted by the optical chip 200 can be collimated and expanded through the first lens structure 500 to realize the conversion of a small mode field to a large mode field. Then, the large mode field beam can be converted into a small mode field beam through the second lens structure 600 and emitted into the optical fiber, thereby monitoring the optical power of the optical fiber.

[0108] In one embodiment, step S420 includes:

[0109] Step S421: Adjust the position of the fiber optic assembly relative to the second lens structure;

[0110] Step S422: Fix the end of the fiber optic connector with the second lens structure to the fiber optic assembly.

[0111] In step S421, specifically, as an example, when the direction from the optical chip toward the optical fiber is set as the z-axis direction, and the two directions perpendicular to the z-axis are the x-axis direction and the y-axis direction, and the y-axis direction is perpendicular to the upper surface of the substrate, the position of the optical fiber assembly 300 in the x-axis and y-axis directions can be adjusted by relevant instruments and equipment, so that the beam emitted by the optical fiber can form a beam with high collimation after passing through the second lens structure, thereby facilitating effective optical coupling with the optical chip.

[0112] It is understandable that the position of the fiber optic assembly in the z-axis direction can be reasonably controlled through manufacturing processes. For example, a spacer of appropriate thickness can be added between the fiber optic assembly and the second lens structure.

[0113] In step S422, specifically, the end of the fiber optic connector with the second lens structure can be fixed to the connection end face of the fiber optic assembly by means of adhesive bonding or laser welding.

[0114] In one embodiment, see Figure 4 The chip-side connector 410 includes a first guide pin 411 and a first guide hole 412. The fiber optic-side connector 420 includes a second guide pin 421 and a second guide hole 422.

[0115] The first guide pin 411 is correspondingly provided with the second guide hole 422, so that they can cooperate with each other to connect the chip-side connector 410 and the fiber optic connector 420. At the same time, the second guide pin 421 is correspondingly provided with the first guide hole 412, so that they can cooperate with each other to connect the chip-side connector 410 and the fiber optic connector 420.

[0116] In this embodiment, both the chip-side connector 410 and the fiber optic connector 420 have guide pins and guide holes, which makes the connection between the two more stable.

[0117] Specifically, the chip-side connector 410 may also include a first light-transmitting portion 413. The first light-transmitting portion 413 is located in the center of the fiber optic connector 420, so that when the chip-side connector 410 is fixed to the substrate 100, the light from the optical chip 200 can pass through the first light-transmitting portion 413.

[0118] Similarly, the fiber optic connector 420 may also include a second light-transmitting portion 423. The second light-transmitting portion 423 is located in the center of the fiber optic connector 420, so that when the fiber optic connector 420 is connected to the fiber optic assembly 300, the second light-transmitting portion 423 is opposite to the fiber optic assembly 300, allowing light to pass through.

[0119] It is understood that the specific form of the chip-side connector 410 is not limited to this. For example, the chip-side connector 410 may only have guide pins, while the fiber optic connector 420 may only have guide holes that mate with it.

[0120] In one embodiment, after step S600, the method further includes:

[0121] Step S700: Disconnect the chip-side connector 410 from the fiber optic-side connector 420. Please refer to [link / reference]. Figure 9 .

[0122] At this time, the fiber optic connector 420 and the fiber optic assembly 300 connected thereto can also be used to fix another chip-side connector on other substrates with optical chips.

[0123] Meanwhile, after disassembling the chip-side connector 410 and the fiber-optic connector 420, the optical chip 200 can still be processed to achieve optoelectronic co-packaging. Optoelectronic co-packaging often requires a reflow soldering process. By disassembling the chip-side connector 410 and the fiber-optic connector 420, the fiber optic 310 can be protected from the effects of the high-temperature reflow soldering process, thus maintaining its good performance.

[0124] In some embodiments, to better reduce the impact of the high-temperature reflow soldering process, when the first lens structure 500 is mounted on the substrate 100 in step S231, the first lens structure 500 can be fixed to the substrate 100 by non-adhesive methods such as laser welding or eutectic bonding. Simultaneously, in step S600, the chip-side connector 410 can be fixed to the substrate 100 by laser welding, eutectic bonding, or other methods.

[0125] It should be understood that, although Figure 1 The steps in the flowchart are shown sequentially as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order in which these steps are executed, and they can be performed in other orders. Figure 1 At least some of the steps in the process may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but may be executed at different times. The execution order of these steps or stages is not necessarily sequential, but may be executed in turn or alternately with other steps or at least some of the steps or stages in other steps.

[0126] In one embodiment, an optical coupling system is also provided, manufactured according to any one of the methods described above. See also... Figure 9 or Figure 10 The optical coupling system includes a substrate 100, an optical chip 200, an optical fiber assembly 300, and a connecting assembly 400. The optical chip 200 is mounted on the substrate 100. The optical fiber assembly 300 includes an optical fiber 310 and a fixing structure 320, with the optical fiber 310 fixed to the fixing structure 320.

[0127] The connection assembly 400 includes a chip-side connector 410 and an optical fiber-side connector 420. One end of the optical fiber-side connector 420 is connected to the optical fiber assembly 300, and the other end is detachably connected to the chip-side connector 410. The chip-side connector 410 is fixed to the substrate 100, and the fixed position of the chip-side connector 410 on the substrate is determined based on the optical fiber-side connector 420 connected to the optical fiber assembly 300.

[0128] In one embodiment, the optical coupling system further includes a first lens structure 500, which is located on the substrate 100 and on one side of the optical chip 200.

[0129] In one embodiment, the optical coupling system further includes a second lens structure 600, which is located at one end of the optical fiber connector 420, and the end of the optical fiber connector 420 on which the second lens structure 600 is mounted is connected to the optical fiber assembly 300.

[0130] For specific limitations regarding the optical coupling system, please refer to the limitations on the fabrication method of the optical coupling system mentioned above, which will not be repeated here.

[0131] In the description of this specification, references to terms such as "one embodiment," "other embodiments," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0132] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0133] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for fabricating an optical coupling system for coupling an optical chip to an optical fiber, characterized in that, include: A substrate is provided, and an optical chip is mounted on the substrate to form a first intermediate component; The optical fiber is fixed within a fixed structure to form an optical fiber assembly; A connection component is provided, the connection component including a chip-side connector and an optical fiber-side connector, the chip-side connector and the optical fiber-side connector being used for detachable connection; One end of the fiber optic connector is fixedly connected to the fiber optic assembly, and the other end is connected to the chip-side connector to form a second intermediate component. Adjust the position of the second intermediate component relative to the first intermediate component. The second intermediate component includes a chip-side connector and an optical fiber-side connector in a connected state, as well as an optical fiber assembly. When the optical chip and the optical fiber achieve optimal optical coupling, the adjustment of the relative position is stopped, and the chip-side connector is fixed to the substrate; The step of fixing one end of the fiber optic connector to the fiber optic assembly and connecting the other end to the chip-side connector to form a second intermediate component includes: A second lens structure is installed at one end of the fiber optic connector; Connect the end of the fiber optic connector with the second lens structure to the fiber optic assembly. Connect the other end of the fiber optic connector to the chip-side connector.

2. The method for fabricating the optical coupling system according to claim 1, characterized in that, After achieving optimal optical coupling between the optical chip and the optical fiber, stopping the adjustment of the relative position, and fixing the chip-side connector to the substrate, the method further includes: Disconnect the chip-side connector from the fiber-optic side connector.

3. The method for fabricating an optical coupling system according to claim 1, characterized in that, The provision of a substrate, and the mounting of an optical chip on the substrate to form a first intermediate component, includes: Provide substrate; The optical chip is mounted on the substrate; A first lens structure is mounted on the substrate, and the first lens structure is located on one side of the optical chip.

4. The method for fabricating the optical coupling system according to claim 3, characterized in that, The first lens structure mounted on the substrate includes: Adjust the position of the first lens structure relative to the optical chip; The first lens structure is mounted on the substrate.

5. The method for fabricating an optical coupling system according to claim 4, characterized in that, The step of mounting the first lens structure onto the substrate includes: The first lens structure is fixed to the substrate by laser welding or eutectic welding. The step of stopping the adjustment of the relative position when the optical chip and the optical fiber achieve optimal optical coupling, and fixing the chip-side connector to the substrate, includes: The chip-side connector is fixed to the substrate by laser welding or eutectic bonding.

6. The method for fabricating an optical coupling system according to claim 1, characterized in that, The second lens structure is a micro-optical lens.

7. The method for fabricating an optical coupling system according to claim 1, characterized in that, Connecting the end of the fiber optic connector with the second lens structure to the fiber optic assembly includes: Adjust the position of the fiber optic assembly relative to the second lens structure; The end of the fiber optic connector with the second lens structure is fixed to the fiber optic assembly.

8. The method for fabricating an optical coupling system according to claim 1, characterized in that, The chip-side connector includes a first guide pin and a first guide hole; The fiber optic connector includes a second guide pin and a second guide hole; The first guide pin is provided corresponding to the second guide hole, and the second guide pin is provided corresponding to the first guide hole.

9. An optical coupling system, characterized in that, Made according to any one of claims 1-8, comprising: substrate; An optical chip is mounted on the substrate; An optical fiber assembly includes an optical fiber and a fixing structure, wherein the optical fiber is fixed to the fixing structure; A connection component includes a chip-side connector and an optical fiber-side connector, wherein one end of the optical fiber-side connector is connected to the connection end face of the optical fiber assembly, and the other end is detachably connected to the chip-side connector. The chip-side connector is fixed to the substrate, and the fixed position of the chip-side connector on the substrate is determined based on the optical fiber-side connector connected to the optical fiber assembly. A second lens structure is located at one end of the optical fiber connector, and the end of the optical fiber connector with the second lens structure is connected to the optical fiber assembly.

10. The optical coupling system according to claim 9, characterized in that, The optical coupling system further includes a first lens structure located on the substrate and on one side of the optical chip.

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