Component assembly line, inspection device, and inspection method

Abstract

The component assembly line includes: a component assembly device for assembling components onto a substrate; and an inspection device for receiving the substrate from the component assembly device, inspecting the components assembled onto the substrate by the component assembly device, acquiring an image of the components assembled onto the substrate, measuring the position of the components on the substrate based on the acquired image, and determining whether the position measurement was performed correctly. Furthermore, for components determined to have undergone correct position measurement, first component identification information is generated; for components determined to have not undergone correct position measurement, second component identification information is generated.

Description

Technical Field

[0001] The present disclosure relates to a component assembly line including a component assembly device for assembling components on a substrate and an inspection device for inspecting the components mounted on the substrate, the inspection device constituting the component assembly line, and an inspection method using the inspection device. Background Art

[0002] In the past, a component assembly line is known, which includes: a component assembly device that picks up components by an assembly head and assembles them on a substrate; and an inspection device that receives the substrate removed from the component assembly device and inspects the components assembled on the substrate. In this component assembly line, the component assembly device measures the position of the component picked up by the assembly head, and assembles the component on the substrate based on the measured position of the component. In addition, the inspection device measures the position where the component is actually assembled as the assembly position based on an image (inspection image) obtained by photographing the component assembled on the substrate from above, and calculates the positional offset between the assembly position and the target assembly position on the substrate. Information related to the assembly position measured by the inspection device is fed back to the component assembly device, and is used to correct the motion parameters of the assembly head when the component assembly device assembles the component on the substrate (for example, refer to the following patent document 1).

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2019-134051 Summary of the invention

[0006] The component assembly line disclosed in the present invention comprises: a component assembly device for assembling components on a substrate; and an inspection device for receiving the substrate carried out from the component assembly device and inspecting each component assembled on the substrate by the component assembly device, wherein the inspection device comprises: an image acquisition unit for acquiring an image of each component assembled on the substrate; a measuring unit for measuring the position of each component in the substrate as the assembly position of the component based on the image of each component acquired by the image acquisition unit; a judgment unit for judging whether the measurement of the assembly position based on the measuring unit has been normally performed on each component; and a generation unit for generating information indicating whether the measurement of the assembly position has been normally performed by the measuring unit, i.e., component identification information, for each component judged by the judgment unit, wherein the generation unit generates first component identification information as the component identification information for a component judged by the judgment unit as having the measurement of the assembly position normally performed, and generates second component identification information as the component identification information for a component judged by the judgment unit as having the measurement of the assembly position not normally performed.

[0007] The inspection device disclosed in the present invention inspects each component mounted on a substrate, and the inspection device comprises: an image acquisition unit for acquiring images of each component mounted on the substrate; a measuring unit for measuring the position of each component in the substrate as the mounting position of the component based on the image of each component acquired by the image acquisition unit; a judgment unit for judging, with respect to each component, whether the measurement of the mounting position based on the measuring unit has been normally implemented for each component; and a generating unit for generating, with respect to each component judged by the judging unit, information indicating whether the measurement of the mounting position has been normally implemented by the measuring unit, i.e., component identification information, the generating unit generating first component identification information as the component identification information for a component judged by the judging unit as having the measurement of the mounting position normally implemented, and generating second component identification information as the component identification information for a component judged by the judging unit as having the measurement of the mounting position not being normally implemented.

[0008] The inspection method disclosed herein inspects each component assembled on a substrate, and the inspection method includes: a measuring step, measuring the position of each component assembled on the substrate in the substrate as the assembly position of the component; a judging step, judging whether the measurement of the assembly position has been normally implemented in the measuring step for each component; and a generating step, generating information indicating whether the measurement of the assembly position has been normally implemented in the measuring step, i.e., component identification information, for each component subjected to the judgment in the judging step, wherein the generating step generates first component identification information as the component identification information for a component judged in the judging step as having normally implemented the measurement of the assembly position, and generates second component identification information as the component identification information for a component judged in the judging step as having not normally implemented the measurement of the assembly position.

[0009] According to the present disclosure, it is possible to improve the reliability of correction of operation parameters in a component mounting device. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural diagram of a component assembly line in one embodiment of the present disclosure.

[0011] Figure 2 It is a perspective view of a component assembly device included in a component assembly line in one embodiment of the present disclosure.

[0012] Figure 3 This is a block diagram showing a control system of a component assembly line in one embodiment of the present disclosure.

[0013] Figure 4This is a perspective view of an inspection device included in a component assembly line according to one embodiment of the present disclosure.

[0014] Figure 5 This is a plan view of an example of a substrate inspected by an inspection device provided in a component assembly line according to an embodiment of the present disclosure.

[0015] Figure 6 This is a diagram showing an example of an image obtained by a single imaging operation of an inspection camera included in an inspection device of a component assembly line according to an embodiment of the present disclosure.

[0016] Figure 7 This is a diagram for explaining positional deviation of a component calculated by the inspection device of the component assembly line in one embodiment of the present disclosure.

[0017] Figure 8 This is a diagram for explaining a first method of determination by a determination unit of an inspection device of a component assembly line in one embodiment of the present disclosure.

[0018] Fig. 9A This is a diagram for explaining a first method of determination by a determination unit of an inspection device of a component assembly line in one embodiment of the present disclosure.

[0019] Fig. 9B This is a diagram for explaining a first method of determination by a determination unit of an inspection device of a component assembly line in one embodiment of the present disclosure.

[0020] Fig. 10A This is a diagram for explaining a second method of determination by the determination unit of the inspection device of the component assembly line in one embodiment of the present disclosure.

[0021] Figure 10B-1 This is a diagram for explaining a second method of determination by the determination unit of the inspection device of the component assembly line in one embodiment of the present disclosure.

[0022] Figure 10B-2 This is a diagram for explaining a second method of determination by the determination unit of the inspection device of the component assembly line in one embodiment of the present disclosure.

[0023] Figure 10C-1 This is a diagram for explaining a second method of determination by the determination unit of the inspection device of the component assembly line in one embodiment of the present disclosure.

[0024] Figure 10C-2 This is a diagram for explaining a second method of determination by the determination unit of the inspection device of the component assembly line in one embodiment of the present disclosure.

[0025] Fig.11AThis is a diagram showing components in an inspection image for explaining a third method of determination by a determination unit of an inspection device of a component assembly line according to an embodiment of the present disclosure.

[0026] Fig. 11B This is a diagram showing components in an inspection image when a component is mounted without being tilted, for explaining a third method of determination by a determination unit of an inspection device of a component assembly line in one embodiment of the present disclosure.

[0027] Fig. 11C This is a diagram showing a component corresponding to an inspection image for explaining a third method of determination by a determination unit of an inspection device for a component assembly line according to an embodiment of the present disclosure, as viewed from the side.

[0028] Fig.12 This is a flowchart showing the flow of inspection work performed by the inspection device of the component assembly line in one embodiment of the present disclosure.

[0029] Fig.13 This is a flowchart showing the flow of a correction process operation of an operation parameter executed by a component assembly device of a component assembly line in one embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] Before describing the embodiments of the present disclosure, the problems in the existing devices are briefly described. The information on the assembly position of the components obtained by the inspection device may contain information with low reliability. If the action parameters are corrected based on the information with low reliability, there is a concern that the assembly accuracy of the components may be reduced.

[0031] Therefore, an object of the present disclosure is to provide a component assembly line, an inspection device, and an inspection method that can improve reliability with respect to correction of operation parameters in a component assembly device.

[0032] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. Figure 1 A structural diagram showing a component assembly line 1 in one embodiment of the present disclosure. Figure 1 In the embodiment, the component assembly line 1 includes a component assembly device 11 , an inspection device 12 , and a management device 13 .

[0033] The component assembly device 11 receives the substrate KB from an upstream device (e.g., a solder printing device) and assembles the component BH on the substrate KB. The inspection device 12 is arranged on the downstream side of the component assembly device 11, receives the substrate KB removed from the component assembly device 11, and inspects the component BH assembled on the substrate KB. The management device 13 is connected to the component assembly device 11 and the inspection device 12 in a communicable state, and manages the component assembly device 11 and the inspection device 12.

[0034] Figure 2 FIG. 1 is a perspective view of a component assembly device 11 provided in the component assembly line 1. Figure 1 as well as Figure 2 In the figure, the component assembly device 11 includes: a substrate conveying path 21, a component supply unit 22, an assembly head 23, a head moving mechanism 24, a component camera 25, an assembly device input and output unit 26, and an assembly device control unit 27. The substrate conveying path 21 carries out the loading, positioning, and unloading of the substrate KB. The component supply unit 22 includes, for example, a belt feeder, and supplies the component BH to a specified position. The assembly head 23 includes a nozzle 23N extending downward. The assembly head 23 can raise and lower the nozzle 23N and rotate it around the vertical axis, and can adsorb the component BH supplied by the component supply unit 22 to the lower end of the nozzle 23N.

[0035] The head moving mechanism 24 includes an XY table mechanism including a fixed beam 24a and a movable beam 24b that is freely movable relative to the fixed beam 24a. The head moving mechanism 24 moves the assembly head 23 in a horizontal plane by combining an action of moving the movable beam 24b relative to the fixed beam 24a and an action of moving the assembly head 23 relative to the movable beam 24b. The assembly head 23 picks up the component BH supplied by the component supply unit 22 and assembles the picked-up component BH on the substrate KB by performing a movement action in a horizontal plane, a lifting and rotating action of the nozzle 23N, and an adsorption and release action of the component BH by the nozzle 23N.

[0036] exist Figure 1 as well as Figure 2 In the embodiment, the component camera 25 is disposed between the substrate conveying path 21 and the component supply unit 22 with the photographing field of view directed upward. When the assembly head 23, which adsorbs the component BH to the lower end of the nozzle 23N, moves upward, the component camera 25 photographs the component BH from below. The image of the component BH obtained by photographing the component camera 25 (pre-assembly image) is used for measuring the position of the component BH (pre-assembly position) and recognizing the component BH.

[0037] The assembly device input / output unit 26 includes, for example, a touch panel. The assembly device input / output unit 26 receives input operations by the operator and reports the operator the work to be performed, various information, and the like through a screen, sound, and the like.

[0038] Figure 3 is a block diagram showing the control system of the component assembly line 1. Figure 3As shown, the assembly device control unit 27 includes an assembly device storage unit 31, an assembly control unit 32, an assembly device communication unit 33, and a feedback control unit 34. The feedback control unit 34 includes an assembly position information acquisition unit 41, a component identification information acquisition unit 42, a confirmation unit 43, a correction unit 44, and an information statistics unit 45.

[0039] The assembly device storage unit 31 stores data (assembly data) and assembly programs required for assembling components BH on the substrate KB. The assembly data includes data such as the target position of the component BH to be assembled on the substrate KB, i.e., the target coordinates, the type of component BH to be assembled at the target coordinates, and the assembly direction. The assembly program is a control program that operates the various parts of the component assembly device 11 (component supply unit 22, assembly head 23, head moving mechanism 24, component camera 25, etc.) in order to assemble the component BH of a specified type at a specified position (target coordinates) in a specified assembly direction according to the assembly data.

[0040] The assembly control unit 32 operates the substrate conveying path 21, the component supply unit 22, the assembly head 23, and the head moving mechanism 24 based on the assembly program. Thus, the substrate conveying path 21 carries in and positions the substrate KB, the component supply unit 22 supplies the component BH, and the head moving mechanism 24 and the assembly head 23 operate in conjunction and repeatedly perform the assembly cycle. Thus, the components BH are mounted on the substrate KB one by one.

[0041] In one assembly cycle, the assembly head 23 operates so as to sequentially perform the actions of picking up the component BH (picking action), identifying the component BH (identifying action), and assembling the component BH (assembling action). In the picking action, the assembly head 23 moves above the component supply unit 22 and causes the component BH supplied by the component supply unit 22 to be adsorbed to the nozzle 23N. In the identifying action, the assembly head 23 moves above the component camera 25, and the component camera 25 photographs the component BH adsorbed to the nozzle 23N from below. In the assembly action, the assembly head 23 moves above the substrate KB and causes the component BH photographed by the component camera 25 to be assembled at the target coordinates on the substrate KB.

[0042] During the recognition operation of the assembly head 23, the assembly control unit 32 causes the component camera 25 to photograph the component BH and obtain an image of the component BH (the image before assembly). The assembly control unit 32 measures the position of the component BH based on the obtained image before assembly. The position of the component BH is measured by obtaining the position of the center of the component BH by a prescribed method, and the obtained position of the center of the component BH is measured as the position of the component BH. The assembly control unit 32 moves the assembly head 23 so that the component BH is assembled so that the obtained center position of the component BH is consistent with the target coordinates prescribed as the assembly data.

[0043] The assembly device communication unit 33 is connected to a state where it can communicate with both the management device 13 and the inspection device 12. Therefore, the assembly device communication unit 33 can receive information detected by the inspection device 12 as feedback information via the management device 13, or directly receive information detected by the inspection device 12 as feedback information without passing through the management device 13.

[0044] The feedback control unit 34 performs feedback processing based on the feedback information received from the inspection device 12. The main content of the feedback processing is the correction of the action parameters of the assembly head 23 when the component assembly device 11 assembles the component BH on the substrate KB. Here, the so-called "action parameters" refer to the control data used to make the assembly head 23 move so that the component BH is assembled at the target coordinates on the substrate KB. The feedback control unit 34 will be described after the description of the inspection device 12.

[0045] Figure 4 1 is a perspective view of the inspection device 12. Figure 1 as well as Figure 4 In the embodiment, the inspection device 12 includes a substrate conveying unit 51, an inspection camera 52, a camera moving mechanism 53, an inspection device input / output unit 54, and an inspection device control unit 55. The substrate conveying unit 51 carries out the loading, positioning, and unloading of the substrate KB. The inspection camera 52 takes pictures in a state of being located above the substrate KB by directing the shooting field of view downward, thereby photographing the component BH assembled on the substrate KB by the component assembly device 11 from above. That is, in the present embodiment, the inspection camera 52 becomes an image acquisition unit that acquires the image (inspection image) of each component BH assembled on the substrate KB.

[0046] The image (inspection image) of the component BH obtained by photographing the inspection camera 52 is used to measure the position (assembly position) of the component BH in the substrate KB. The camera moving mechanism 53 includes an XY table mechanism including a fixed side beam 53a and a movable side beam 53b that is freely movable relative to the fixed side beam 53a, and moves the inspection camera 52 in the horizontal direction. The camera moving mechanism 53 moves the inspection camera 52 in the horizontal plane by combining the action of moving the movable side beam 53b relative to the fixed side beam 53a and the action of moving the inspection camera 52 relative to the movable side beam 53b.

[0047] The inspection device input / output unit 54 includes, for example, a touch panel. The inspection device input / output unit 54 receives input operations by the operator and notifies the operator of operations to be performed and various information through a screen, sound, or the like.

[0048] like Figure 3As shown, the inspection device control unit 55 includes an inspection device storage unit 61, an inspection image acquisition control unit 62, a measuring unit 63, a determination unit 64, a determination unit 65, a generation unit 66, and an inspection device communication unit 67. In addition to the assembly data stored in the assembly device storage unit 31, the inspection program is stored in the inspection device storage unit 61. The inspection program is a control program that causes each unit of the inspection device 12 (substrate conveying unit 51, inspection camera 52, camera moving mechanism 53, etc.) to operate in order to inspect whether each component BH assembled on the substrate KB by the component assembly device 11 is assembled at the target coordinate specified in the assembly data in a specified direction.

[0049] The inspection image acquisition control unit 62 acquires inspection images for each component BH by causing all inspection cameras 52 to capture multiple components BH mounted on the substrate KB. At this time, the inspection image acquisition control unit 62 moves the inspection camera 52 above the substrate KB positioned by the substrate conveyor 51 based on the inspection program stored in the inspection device storage unit 61, and causes the inspection camera 52 to repeatedly perform the capturing action. Depending on the configuration state of the components BH on the substrate KB, the inspection image acquired by the inspection camera 52 through one capturing action may contain one or more components BH.

[0050] Figure 5 1 is a plan view of an example of a substrate inspected by the inspection device 12 . Figure 5 An example of a substrate KB inspected by the inspection device 12 is shown. Figure 5 Each of the plurality of dashed-dotted line areas AR shown in FIG. 5 represents an area on the substrate KB obtained by one imaging of the inspection camera 52 . Figure 6 is a diagram showing an example of an image (inspection image GZ) obtained by a single shot of the inspection camera 52. Figure 6 In FIG. 1 , a plurality of parts BH are included in the inspection image GZ.

[0051] The measuring unit 63 measures the position (the mounting position) of each of the one or more components BH included in each inspection image GZ on the substrate KB based on the plurality of images (inspection images GZ) obtained by the inspection camera 52. In measuring the mounting position of the component BH, the measuring unit 63 measures the center ZP (refer to the center ZP of the component BH) based on the inspection image GZ obtained by the inspection image acquisition control unit 62. Figure 6 ) position for measurement.

[0052] The assembly position of the component BH is calculated based on the position of the center ZP of the component BH in the inspection image GZ (the position based on the origin OR of the inspection image GZ) and the position of the substrate KB relative to the origin OR of the inspection image GZ. The position of the origin OR of the inspection image GZ can be obtained based on the position of the inspection camera 52 when the inspection image GZ is acquired.

[0053] Furthermore, the measuring unit 63 compares the position of the center ZP of each component BH whose mounting position is measured with the target coordinates of the component BH stored in the inspection device storage unit 61 , thereby obtaining a positional deviation of the component BH from the target coordinates. Figure 7 This is a diagram for explaining the positional deviation of a component calculated by the inspection device 12 . Figure 7 This indicates a state where the position of the center ZP of the target component BH deviates from the target coordinates MZ. Figure 7 In the figure, if the target coordinates on the substrate KB are represented by the coordinates of the X-axis and the Y-axis which are orthogonal within the plane of the substrate KB, the difference in the X-axis direction (DX) and the difference in the Y-axis direction (DY) between the position of the center ZP of the component BH and the position of the target coordinates MZ are obtained as the position offset (DX, DY) of the component BH.

[0054] The determination unit 64 determines whether the assembly state of each component BH whose assembly position is obtained by the measuring unit 63 is good or not. Specifically, the positional deviation of the component BH obtained by the measuring unit 63 is compared with the allowable value determined corresponding to the component BH to determine whether the positional deviation is below the allowable value. And, if the positional deviation of the component BH is below the allowable value, it is determined that the assembly state of the component BH is good, and if the positional deviation of the component BH exceeds the allowable value, it is determined that the assembly state of the component BH is unqualified. In addition, the data of the allowable value for each component BH is stored in the inspection device storage unit 61.

[0055] exist Figure 7 In the example of , if the allowable value of the positional deviation is RX with respect to the X-axis direction and RY with respect to the Y-axis direction, then when DX≤RX and DY≤RY, it is determined that the assembly state of the component BH is good, and when DX>RX or DY>RY, it is determined that the assembly state of the component BH is unqualified. Figure 6 As shown, when the inspection image GZ includes a plurality of components BH, the quality determination is performed on each of the plurality of components BH included in the inspection image GZ.

[0056] The determination unit 65 determines whether the measurement of the mounting position by the measuring unit 63 is normally performed for each component BH whose mounting position is measured by the measuring unit 63. In the present embodiment, this determination is performed by any of the first, second, and third methods described below.

[0057] Figures 8 to 9B 1 is a diagram for explaining a first method of determination by the determination unit 65 of the inspection device 12. In the first method, Figure 8 As shown, the determination unit 65 determines whether the entire component BH in the inspection image GZ is located within the measurement area KA set for the component BH. The measurement area KA has a shape and size corresponding to the component BH and is set as the target coordinates MZ of the component BH.

[0058] In the first method, the determination unit 65 compares the component BH with the measurement area KA. Fig. 9A As shown in FIG. 1 , when the entire component BH is located within the measurement area KA, it is determined that the measurement of the mounting position of the component BH is performed normally. Fig. 9B As shown in FIG. 1 , when at least a portion of the component BH is located outside the measurement area KA, it is determined that the measurement of the mounting position of the component BH is not normally performed.

[0059] Figure 10A to Figure 10C-2 1 is a diagram for explaining the second method of determination by the determination unit 65 of the inspection device 12. In the second method, the determination unit 65 performs pattern matching processing between the inspection image GZ and the reference pattern of the component BH, and calculates the matching rate between the area occupied by the component BH in the inspection image GZ and the reference pattern. In addition, the pattern matching processing is performed by a well-known method. For example, in the case of Fig. 10A The reference pattern KP shown in FIG. 1 is the area BR occupied by the component BH in the inspection image GZ. Figure 10B-1 , Figure 10B-2 In the case of the area shown in FIG. 1 , the reference pattern KP and the center ZP of the area BR are aligned with each other. Figure 10C-1 , Figure 10C-2 The matching rate is calculated for the reference pattern KP shown above.

[0060] In the second method, if the determination unit 65 calculates the matching rate, it compares the calculated matching rate with a predetermined reference matching rate. And, if the matching rate is equal to or higher than the reference matching rate, it is determined that the measurement of the assembly position of the component BH is normally performed. On the other hand, if the calculated matching rate is lower than the reference matching rate, it is determined that the measurement of the assembly position of the component is not normally performed. The reference matching rate is, for example, 80%.

[0061] Figures 11A to 11C1 is a diagram for explaining the third method of determination by the determination unit 65 of the inspection device 12. In the third method, the determination unit 65 compares the size (measured size) obtained by measuring the size of the component BH in the inspection image GZ with the reference size, and obtains the difference between the measured size and the reference size as the size difference. Fig.11A For example, the measured dimension of the component BH in the X-axis direction is X1, and the measured dimension in the Y-axis direction is Y1.

[0062] On the other hand, the reference dimension is the dimension obtained based on the design value of the component BH, such as Fig. 11B In this way, the size of the component (denoted by "BHa" in the figure) in the inspection image GZ is consistent with that in the case where the component is mounted without tilting relative to the substrate KB. Figure 1 In the example of 1B, the reference dimension in the X-axis direction is X0, and the reference dimension in the Y-axis direction is Y0. For the same component BH, the difference between the measured dimension and the reference dimension is Figure 1 As shown in FIG. 1C , a part of the component BH is mounted on the substrate KB in a state of floating from the surface of the substrate KB.

[0063] In the third method, the determination unit 65 obtains the measured dimension based on the component BH in the inspection image GZ, compares it with the reference dimension to calculate the dimension difference, and compares the calculated dimension difference with the reference dimension difference determined corresponding to the component BH. And, when the calculated dimension difference is less than the reference dimension difference, it is determined that the measurement of the assembly position of the component BH is normally performed. On the other hand, when the calculated dimension difference is greater than the reference dimension difference, it is determined that the measurement of the assembly position of the component BH is not normally performed.

[0064] exist Fig.11A as well as Figure 1 In the example of 1B, the dimension difference is the dimension difference ΔX in the X-axis direction, which is ΔX=X0-X1, and the dimension difference ΔY in the Y-axis direction, which is ΔY=Y0-Y1. The judgment unit 65 compares these dimension differences (ΔX, ΔY) with the reference dimension difference (DX, DY), and when (ΔX, ΔY) are both below the reference dimension difference (ΔX≤DX and ΔY≤DY), it is judged that the measurement of the assembly position of the component BH is normally performed. On the other hand, when at least one of (ΔX, ΔY) exceeds the reference dimension difference (DX, DY) (ΔX>DX or ΔY>DY), it is judged that the measurement of the assembly position of the component BH is not normally performed.

[0065] The generating unit 66 generates information (component identification information) indicating whether the measurement of the assembly position has been normally performed by the measuring unit 63, for each component BH determined by the determining unit 65. Specifically, the generating unit 66 generates the first component identification information as the component identification information for the component BH determined by the determining unit 65 to have been measured at the assembly position normally, and generates the second component identification information as the component identification information for the component determined by the determining unit 65 to have not been measured at the assembly position normally.

[0066] The inspection device communication unit 67 is connected to both the management device 13 and the component assembly device 11 in a communicable state. The inspection device communication unit 67 sends information related to the assembly position (assembly position information) of each component BH measured by the measuring unit 63 and component identification information (first component identification information or second component identification information) of each component BH on the substrate KB generated by the generating unit 66 to the component assembly device 11 via the management device 13 or directly without going through the management device 13.

[0067] Next, the feedback control unit 34 included in the assembly device control unit 27 will be described. As described above, the feedback control unit 34 includes the assembly position information acquisition unit 41, the component identification information acquisition unit 42, the confirmation unit 43, the correction unit 44, and the information statistics unit 45.

[0068] The assembly position information acquisition unit 41 acquires the assembly position information for each component BH on the substrate KB from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly from the inspection device 12 without passing through the management device 13. The component identification information acquisition unit 42 acquires the component identification information for each component BH on the substrate KB from the inspection device communication unit 67 of the inspection device 12 via the management device 13 or directly from the inspection device 12 without passing through the management device 13.

[0069] The confirmation unit 43 confirms whether the measurement of the assembly position of each component BH is normally performed based on the component identification information for each component BH acquired by the component identification information acquisition unit 42. Thus, each component acquired by the component identification information acquisition unit 42 is sorted into components associated with the first component identification information as component identification information and components associated with the second component identification information as component identification information.

[0070] The correction unit 44 uses the information related to the assembly position (assembly position information) acquired by the assembly position information acquisition unit 41 to correct the action parameters when the component assembly device 11 assembles each component BH on the substrate KB. In detail, the correction unit 44 corrects the action parameters using the assembly position information acquired by the assembly position information acquisition unit 41 for the component BH for which the confirmation unit 43 confirms that the measurement of the assembly position is normally performed. On the other hand, the correction unit 44 does not correct the action parameters using the assembly position information acquired by the assembly position information acquisition unit 41 for the component BH for which the confirmation unit 43 confirms that the measurement of the assembly position is not normally performed.

[0071] The information statistics unit 45 uses the assembly position information obtained by the assembly position information acquisition unit 41 to count the information related to the assembly accuracy of the component BH. Specifically, the information statistics unit 45 uses the assembly position information obtained by the assembly position information acquisition unit 41 to count the information related to the assembly accuracy of the component BH for which the confirmation unit 43 confirms that the measurement of the assembly position is normally implemented. On the other hand, the information statistics unit 45 does not use the assembly position information obtained by the assembly position information acquisition unit 41 to count the information related to the assembly accuracy of BH for which the confirmation unit 43 confirms that the measurement of the assembly position is not normally implemented. Thereby, it is possible to prevent the judgment of the assembly accuracy of the component BH from being reduced (the assembly accuracy is evaluated low) due to accidental assembly failures such as simple picking errors of the component BH by the assembly head 23.

[0072] In the component assembly line 1 of such a structure, when the component assembly operation of assembling the component BH on the substrate KB is performed, the component assembly device 11 first receives the substrate KB from the device (e.g., solder printing device) on the upstream side through the substrate conveying path 21 and positions it at a predetermined component assembly operation position. Then, the assembly cycle of picking up the component BH supplied by the component supply unit 22 and assembling it on the substrate KB is repeatedly performed through the assembly head 23. Thus, when all the components BH to be assembled on the substrate KB are assembled, the component assembly device 11 carries out the substrate KB to the inspection device 12 on the downstream side.

[0073] The inspection device 12 receives and carries in the substrate KB carried out from the component mounting device 11 through the substrate conveying unit 51, and positions the substrate KB at a predetermined inspection position, and then performs an inspection operation on each component BH mounted on the substrate KB.

[0074] Fig.12 The flowchart shown in FIG. 1 shows the execution steps of the inspection operation (the inspection method based on the inspection device 12). When the inspection operation is performed, the inspection device 12 first loads and positions the substrate KB unloaded from the component mounting device 11 ( Fig.12Step ST1 shown in the figure). After positioning the substrate KB, the inspection camera 52 is moved by the camera moving mechanism 53 to obtain images (inspection images GZ) for each component BH on the substrate KB (step ST2. Image acquisition process). After obtaining the inspection images GZ for each component BH on the substrate KB, the inspection device 12 measures the assembly position for each component BH based on these inspection images GZ (measurement process of step ST3), thereby obtaining assembly position information for each component BH (step ST4).

[0075] After obtaining the assembly position information for each component BH, the inspection device 12 performs a quality judgment on the assembly state of each component BH based on the assembly position information for each component BH (step ST5). The component BH judged as unqualified in the assembly state for the substrate KB by the quality judgment is reported to the operator through the inspection device input and output unit 54. Therefore, the operator can extract the substrate KB having the component BH whose assembly state is judged to be unqualified from the position where the substrate KB is unloaded from the inspection device 12, and correct the assembly state of the component BH as needed.

[0076] After the inspection device 12 has made a quality judgment on each component BH assembled on the substrate KB, it specifies one of the multiple components BH whose assembly position information was obtained in step ST4 (step ST6). Then, for the specified component BH, it is judged whether the measurement of the assembly position was normally implemented in the measurement process of step ST3 (step ST7. Judgment process). For each component BH that has made the above judgment in the judgment process, the inspection device 12 generates information indicating whether the measurement of the assembly position in the measurement process of step ST3 was normally implemented, that is, component identification information (generation process). In detail, for the component BH that is judged to have been measured normally (yes (Y) in step ST7), the first component identification information is generated (step ST8), and for the component BH that is judged to have been measured normally (no (N) in step ST7), the second component identification information is generated (step ST9).

[0077] After the inspection device 12 generates the component identification information (first component information or second component information) in the generation process (step ST8 or step ST9), it determines whether there is a component BH that has not been specified (step ST10). Then, if there is a component BH that has not been specified, it returns to step ST6 (Y in step ST10), and performs the processing of steps ST7 to ST9 on the basis of newly specifying the component BH that has not been specified. On the other hand, in step ST10, if there is no component BH that has not been specified (N in step ST10), the assembly position information and component identification information for each component BH obtained so far are sent directly to the component assembly device 11 via the management device 13 or without passing through the management device 13 (step ST11). Then, after sending the assembly position information and component identification information for all components BH to the component assembly device 11, the inspection device 12 moves the substrate KB to the device on the downstream side (for example, the reflow device) (step ST12), and ends the inspection operation for the substrate KB.

[0078] As described, the component assembly device 11 assembles the component BH on the substrate KB moved in from the upstream side and moves it out to the inspection device 12. However, before assembling the component BH on the substrate KB, the component assembly device 11 receives information (assembly position information and component identification information) on the results of the inspection operation on the substrate KB on which the component BH has been assembled and moved out of the inspection device 12, and performs a correction processing operation on the action parameters based on this information.

[0079] Fig.13 The flowchart shown in FIG. 1 shows the execution steps of the action parameter correction processing operation. When the component assembly device 11 performs the action parameter correction processing operation, first, for the substrate KB that has received the inspection result from the inspection device 12, one of the multiple components BH to be assembled on the substrate KB is specified ( Fig.13 Then, based on the component identification information acquired for the designated component BH, it is confirmed whether the measurement of the mounting position of the component BH is normally performed (step ST22).

[0080] In step ST22, the component assembly device 11 corrects the action parameters using the assembly position information (step ST23) for the component BH for which the measurement of the assembly position is confirmed to be normally performed (Y in step ST22), and uses the assembly position information to collect statistics on the information related to the assembly accuracy (step ST24). On the other hand, in step ST22, for the component BH for which the measurement of the assembly position is confirmed to be not normally performed (N in step ST22), the action parameters are not corrected (step ST25), and the information related to the assembly accuracy using the assembly position information is not collected (step ST26).

[0081] If step ST24 or step ST26 is completed, the component assembly device 11 determines whether there is a component BH that has not been specified (step ST27). Then, if there is a component BH that has not been specified (Y in step ST27), it returns to step ST21, and performs the processing of steps ST22 to step S26 on the basis of newly specifying the component BH that has not been specified. On the other hand, in step ST27, if there is no component BH that has not been specified (N in step ST27), the correction processing operation for the action parameters of the substrate KB is completed. When the component assembly device 11 obtains new action parameters by performing the correction processing operation of the action parameters, it updates the values ​​of the action parameters so far, uses the updated action parameters to operate the assembly head 23, and assembles the component BH to the substrate KB.

[0082] Thus, in the component assembly line 1 of the present embodiment, the inspection device 12 acquires the inspection image GZ of each component BH assembled on the substrate KB, and based on the acquired inspection image GZ of each component BH, measures the position of each component BH in the substrate KB as the assembly position of the component BH (the measurement process of step ST3), and determines whether the measurement of the assembly position is normally implemented (the determination process of step ST7). Then, for the component BH determined as the measurement of the assembly position being normally implemented, the first component identification information is generated as the component identification information, and for the component BH determined as the measurement of the assembly position not being normally implemented, the second component identification information is generated as the component identification information (the generation process of step ST8 or step ST9).

[0083] In addition, in the component assembly line 1 of the present embodiment, the component assembly device 11 obtains the component identification information (first component identification information or second component identification information) generated for each component BH, and based on the obtained component identification information for each component BH, confirms whether the measurement of the assembly position of each component BH is normally implemented. Then, for the component BH for which the measurement of the assembly position is confirmed to be normally implemented, the action parameters are corrected based on the assembly position information obtained by the inspection device 12 and the assembly position information is statistically analyzed, and for the component BH for which the measurement of the assembly position is confirmed to be not normally implemented, the action parameters are not corrected and the assembly position information is not statistically analyzed.

[0084] That is, in the component assembly line 1 of the present embodiment, the data of the inspection result of the component BH with low reliability is not used as feedback information, and only the data of the inspection result with high reliability is used as feedback information to correct the action parameters and to collect statistics of the assembly position information. Therefore, through the component assembly line 1 of the present embodiment, the reliability of the correction of the action parameters in the component assembly device 11 and the statistical results of the assembly position information (information related to the assembly accuracy of the component BH) can be improved.

[0085] As described above, in the component assembly line 1 in the present embodiment, when the inspection device 12 measures the assembly position of each component BH assembled on the substrate KB, it is determined whether the measurement is normally performed for each component BH, and only for the component BH determined to have been measured normally, the action parameters in the component assembly device 11 for the component are corrected (for the component BH determined to have been measured abnormally, the action parameters are not corrected). Therefore, in the component assembly device 11, the action parameters can be corrected only based on the data with higher reliability among the inspection results in the inspection device 12. Therefore, through the component assembly line 1 in the present embodiment (or the inspection device 12, the inspection method based on the inspection device 12), the reliability of the correction of the action parameters in the component assembly device 11 can be improved, and high-quality substrate production with higher assembly accuracy of the component BH can be performed.

[0086] The above is a description of the embodiments of the present disclosure, but the present disclosure is not limited to the above and can be variously modified. For example, in the above embodiment, the first, second and third methods are shown as methods for the determination unit 65 of the inspection device 12 to determine whether the measurement of the assembly position by the measuring unit 63 is normally performed, but the determination unit 65 can also use other methods to determine whether the measurement of the assembly position is normally performed.

[0087] Furthermore, in the above-mentioned embodiment, the inspection device 12 is Fig.12 In step ST11 shown, the assembly position information and component identification information for each component BH are sent to the component assembly device 11, but the component BH for which the second component identification information is generated is not used as feedback information in the component assembly device 11. Therefore, the inspection device 12 may not send the assembly position information to the component assembly device 11 in step ST11 for the component BH for which the second component identification information is generated in step ST9.

[0088] In addition, in the above-mentioned embodiments, each structural element is composed of dedicated hardware, or can also be implemented by executing a software program suitable for each structural element. Each structural element can also be implemented by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded in a recording medium such as a hard disk or a semiconductor memory.

[0089] Industrial Applicability

[0090] Provided are a component assembly line, an inspection device, and an inspection method capable of improving reliability with respect to correction of operation parameters in a component assembly device.

[0091] -Explanation of symbols-

[0092] 1 Component assembly line

[0093] 11 Component assembly device

[0094] 12 Inspection device

[0095] 13 Management Device

[0096] 41 Assembly position information acquisition unit

[0097] 42 Component identification information acquisition unit

[0098] 43 Confirmation Department

[0099] 44 Correction Department

[0100] 45 Information Statistics Department

[0101] 52 Inspection camera (image acquisition unit)

[0102] 63 Measurement Department

[0103] 65 Judgment Department

[0104] 66 Generation Department

[0105] GZ Check Image(Image)

[0106] KA measurement area

[0107] KP Reference Pattern

[0108] BH Parts

[0109] KB substrate.

Claims

1. A component assembly line, comprising: a component assembly device that assembles components on a substrate; and an inspection device that receives the substrate removed from the component assembly device and inspects each component assembled on the substrate by the component assembly device. The inspection device comprises: An image acquisition unit, which acquires images of the components mounted on the substrate; a measuring unit that measures the position of each component in the substrate as an assembly position of the component based on the image of each component acquired by the image acquisition unit; a determination unit that determines, for each of the components, whether the measurement of the assembly position by the measurement unit has been normally performed on each of the components; and a generating unit that generates, for each of the components determined by the determining unit, component identification information, the component identification information being information indicating whether the measurement of the assembly position has been performed normally by the measuring unit, The generating unit generates first component identification information as the component identification information for a component determined by the determining unit as having been measured at the assembly position normally, and generates second component identification information as the component identification information for a component determined by the determining unit as having not been measured at the assembly position normally. The component assembly device comprises: an assembly position information acquisition unit that acquires assembly position information, wherein the assembly position information is information related to the assembly position of each component measured by the measuring unit; a component identification information acquisition unit, which acquires the component identification information for each component generated by the generation unit; and The confirmation unit confirms whether the mounting position has been measured normally for each component based on the component identification information for each component acquired by the component identification information acquisition unit.

2. The component assembly line according to claim 1, wherein: The component mounting device comprises: a correction unit that uses the mounting position information acquired by the mounting position information acquisition unit to correct the action parameters for each component when the component mounting device mounts each component on a substrate. The correction unit uses the assembly position information obtained by the assembly position information acquisition unit to correct the action parameters for the component for which the confirmation unit has confirmed that the measurement of the assembly position has been normally implemented, and does not use the assembly position information obtained by the assembly position information acquisition unit to correct the action parameters for the component for which the confirmation unit has confirmed that the measurement of the assembly position has not been normally implemented.

3. The component assembly line according to claim 1, wherein: The component assembly device comprises: an information statistics unit for collecting statistics on the assembly position information acquired by the assembly position information acquisition unit; The information statistics unit uses the assembly position information acquired by the assembly position information acquisition unit to count the assembly position information for the components for which the confirmation unit has confirmed that the measurement of the assembly position has been normally implemented, and does not use the assembly position information acquired by the assembly position information acquisition unit to count the assembly position information for the components for which the confirmation unit has confirmed that the measurement of the assembly position has not been normally implemented.

4. The component assembly line according to any one of claims 1 to 3, wherein: The judgment unit judges whether the entire component in the image acquired by the image acquisition unit is located within a measurement area set for the component, and when at least a portion of the component is located outside the measurement area, it is judged that the measurement of the assembly position of the component is not normally performed.

5. The component assembly line according to any one of claims 1 to 3, wherein: The judgment unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of a component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and when the calculated matching rate is lower than a reference matching rate, judges that measurement of the assembly position of the component has not been normally implemented.

6. The component assembly line according to any one of claims 1 to 3, wherein: The determination unit determines that the measurement of the mounting position of the component is not normally performed when a difference between a dimension of the component in the image acquired by the image acquisition unit and a reference dimension, that is, a dimension difference exceeds a reference dimension difference.

7. The component assembly line according to any one of claims 1 to 3, wherein: The inspection device sends the assembly position information and the component identification information for each component to the component assembly device via a management device that manages the component assembly device and the inspection device, or directly sends the assembly position information and the component identification information for each component to the component assembly device without going through the management device.

8. The component assembly line according to any one of claims 1 to 3, wherein: The inspection device does not transmit the mounting position information and the component identification information to the component mounting device with respect to the component for which the second component identification information is generated by the generating unit.

9. The component assembly line according to claim 8, wherein: The inspection device sends the assembly position information and the component identification information for each component to the component assembly device via a management device that manages the component assembly device and the inspection device, or directly sends the assembly position information and the component identification information for each component to the component assembly device without going through the management device.

10. An inspection device for inspecting components mounted on a substrate. The inspection device comprises: An image acquisition unit, which acquires images of components mounted on the substrate; a measuring unit that measures the position of each component in the substrate as an assembly position of the component based on the image of each component acquired by the image acquisition unit; a determination unit that determines, for each of the components, whether the measurement of the assembly position by the measurement unit has been normally performed on each of the components; and a generating unit that generates, for each of the components determined by the determining unit, component identification information, the component identification information being information indicating whether the measurement of the assembly position has been performed normally by the measuring unit, The generating unit generates first component identification information as the component identification information for a component determined by the determining unit to have been measured at the assembly position normally, and generates second component identification information as the component identification information for a component determined by the determining unit to have been measured at the assembly position unnormally. The judgment unit performs pattern matching processing between the image acquired by the image acquisition unit and a reference pattern of a component, calculates a matching rate between an area occupied by the component in the image and the reference pattern, and when the calculated matching rate is lower than a reference matching rate, judges that measurement of the assembly position of the component has not been performed normally.

11. The inspection device according to claim 10, wherein: The judgment unit judges whether the entire component in the image acquired by the image acquisition unit is located within a measurement area set for the component, and when at least a portion of the component is located outside the measurement area, it is judged that the measurement of the assembly position of the component is not normally performed.

12. The inspection device according to claim 10, wherein: The determination unit determines that the measurement of the mounting position of the component is not normally performed when a difference between a dimension of the component in the image acquired by the image acquisition unit and a reference dimension, that is, a dimension difference exceeds a reference dimension difference.

13. The inspection device according to any one of claims 10 to 12, wherein: The inspection device sends the assembly position information and the component identification information for each component to the component assembly device via a management device that manages the component assembly device and the inspection device, or directly sends the assembly position information and the component identification information for each component to the component assembly device without going through the management device.

14. The inspection device according to any one of claims 10 to 12, wherein: Regarding the component for which the second component identification information is generated by the generating unit, the mounting position information and the component identification information are not transmitted to the component mounting device.

15. The inspection device according to claim 14, wherein: For the parts for which the first part identification information is generated by the generating unit, the assembly position information and the part identification information for each part are sent to the part assembly device via a management device that manages the part assembly device and the inspection device, or the assembly position information and the part identification information for each part are directly sent to the part assembly device without going through the management device.

16. An inspection method for inspecting components mounted on a substrate, the inspection method comprising: an image acquisition step of acquiring images of the components mounted on the substrate, a measuring step of measuring, based on the images of the components acquired in the image acquisition step, the positions of the components mounted on the substrate as the mounting positions of the components; a judging step of judging, for each of the components, whether the measurement of the assembly position has been normally performed in the measuring step; and a generating step of generating component identification information for each of the components judged in the judging step, wherein the component identification information is information indicating whether the measurement of the assembly position has been normally performed in the measuring step, In the generating step, first component identification information is generated as the component identification information for the component determined in the judging step to have been measured at the assembly position normally, and second component identification information is generated as the component identification information for the component determined in the judging step to have been measured at the assembly position not normally. In the judgment process, pattern matching processing is performed between the image acquired by the image acquisition process and the reference pattern of the component, and the matching rate between the area occupied by the component in the image and the reference pattern is calculated. When the calculated matching rate is lower than the reference matching rate, it is judged that the measurement of the assembly position of the component has not been normally implemented.

Images