A chip failure location device and method

Abstract

The application provides a chip failure positioning device and method, the chip failure positioning device comprises a substrate, a first micro-light microscope detector and a second micro-light microscope detector, the first micro-light microscope detector and the second micro-light microscope detector are respectively arranged on two adjacent sides of the substrate, in the positioning process, the first micro-light microscope detector and the second micro-light microscope detector respectively acquire the coordinates of the failure position in the first direction and the second direction from the side of the chip, the second direction is perpendicular to the first direction, so that the failure position is obtained. By positioning the failure position from the side of the chip, the application can avoid damaging the chip and improve the success rate; in the positioning process, the low-power lens and the high-power lens are used to position the failure position in turn, which can effectively improve the accuracy of the measurement result; in addition, the chip failure positioning device of the application has a simple structure, and the chip failure positioning method is simple to operate, which is beneficial to reduce the operation cost and improve the production efficiency.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip failure location technology, specifically to a chip failure location device and method. Background Technology

[0002] Emission microscopy (EMMI) is a crucial defect localization technique in chip failure analysis. For power chips, the back side has a heavily doped layer, which blocks signals generated by defect excitation. Therefore, EMMI cannot locate hotspots from the back side of the power chip; localization must be done from the front. However, the front side of the power chip is largely covered by an aluminum layer, which cannot penetrate the infrared light generated by defects. Therefore, before performing EMMI on power chips, it is usually necessary to remove the passivation layer and polyimide film on the aluminum layer using ion beam etching, followed by etching away the metallic aluminum with hydrochloric acid. However, this method can sometimes damage the chip structure. Furthermore, for high-voltage power chips, after removing the aluminum layer, the chip may burn out at the tip of the tungsten needle during high-voltage testing due to the excessive current density, causing secondary damage. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the present invention provides a chip failure location device and method. The chip failure location device includes a substrate, a first low-light microscope detector, and a second low-light microscope detector, which are respectively disposed on adjacent sides of the substrate. During chip failure location, the chip is placed on the surface of the substrate, and the first low-light microscope detector is moved along a first direction to obtain the coordinates of the failure location in the first direction; the second low-light microscope detector is moved along a second direction to obtain the coordinates of the failure location in the second direction, where the second direction is perpendicular to the first direction, thus locating the failure location. The chip failure location device and method provided by the present invention locate the failure location from the side of the chip, enabling chip location without destructive processing, greatly improving the success rate of chip failure location. During the location process, a low-magnification lens is first used to obtain the approximate location of the failure location, and then a high-magnification lens is used to accurately locate the failure location, effectively improving the accuracy of the measurement results. Furthermore, the chip failure location device of the present invention has a simple structure, and the chip failure location method is easy to operate, which helps to reduce operating costs and improve production efficiency.

[0004] To achieve the above and other related objectives, the present invention provides a chip failure location device, comprising:

[0005] A substrate for placing a chip and applying voltage to the chip;

[0006] The low-light microscope detector includes a first low-light microscope detector and a second low-light microscope detector. The first low-light microscope detector is disposed on a first side of the substrate and is used to locate the coordinates of the failure location of the chip in a first direction. The second low-light microscope detector is disposed on a second side of the substrate and is used to locate the coordinates of the failure location of the chip in a second direction, wherein the second direction is perpendicular to the first direction.

[0007] Optionally, the low-light microscope detector includes a first lens and a second lens, wherein the magnification of the second lens is greater than that of the first lens.

[0008] Optionally, the magnification of the first lens is between 1x and 10x.

[0009] Optionally, the magnification of the second lens is between 20x and 100x.

[0010] Optionally, the substrate is a PCB board.

[0011] The present invention also provides a chip failure location method, using the chip failure location device described in any one of the above-mentioned methods, the method comprising the following steps:

[0012] S1: A chip is provided, the chip is fixed on the substrate, and a voltage is applied to the chip to generate a hot spot signal at the failure location;

[0013] S2: Move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the first time.

[0014] S3: Move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, it marks the coordinates of the failure location in the second direction for the first time.

[0015] Optionally, in steps S2 and S3, both the first and second low-light microscope detectors use the first lens.

[0016] Optional, also includes:

[0017] S4: Using the first mark in step S2 as a reference, move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the second time.

[0018] S5: Using the first mark in step S3 as a reference, move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, mark the coordinates of the failure position in the second direction for the second time.

[0019] Optionally, in steps S4 and S5, both the first and second low-light microscope detectors employ the second lens.

[0020] The chip failure location device and method provided by the present invention have at least the following technical effects:

[0021] The chip failure location device and method provided by this invention locate the failure position from the side of the chip, which can locate the chip without destructive processing, greatly improving the success rate of chip failure location. In the location process, a low-magnification lens is first used to obtain the approximate location of the failure position, and then a high-magnification lens is used to accurately locate the failure position, effectively improving the accuracy of the measurement results. In addition, the chip failure location device of this invention has a simple structure and the chip failure location method is easy to operate, which helps to reduce operating costs and improve production efficiency. Attached Figure Description

[0022] Figure 1 The image shown is a top view of the chip failure location device provided in Embodiment 1.

[0023] Figure 2 The flowchart shown is a chip failure location method provided in Example 2.

[0024] Component designation explanation

[0025] 10 substrate

[0026] 11 Metal Electrode

[0027] 21 First low-light microscope detector

[0028] 22 Second low-light microscope detector

[0029] 30 chips

[0030] 300 Failure Location

[0031] 101 First side of substrate

[0032] 102 The second side of the substrate

[0033] a. Coordinates of the failure location in the first direction

[0034] b. Coordinates of the failure location in the second direction Detailed Implementation

[0035] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0036] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of the present invention. Although the illustrations only show components related to the present invention and are not drawn according to the actual number, shape and size of the components, the shape, quantity, positional relationship and proportion of each component can be arbitrarily changed under the premise of realizing the technical solution of this invention, and the layout of the components may also be more complex.

[0037] Example 1

[0038] This embodiment provides a chip failure location device, such as... Figure 1 As shown, it includes a substrate 10 and a micro-microscope detector, which includes a first micro-microscope detector 21 and a second micro-microscope detector 22.

[0039] As an example, substrate 10 is selected as a printed circuit board (PCB). The PCB serves as the carrier for the electrical connection of electronic components, possessing excellent reliability and testability. For example... Figure 1 As shown, a carrier area (not shown in the figure) for placing the chip 30 is provided on the substrate 10; metal electrodes 11 are provided around the carrier area. In this embodiment, the metal electrodes 11 can be copper electrodes, and the number of metal electrodes 11 can be designed according to the test requirements; bonding lines (not shown in the figure) are also provided on the substrate 10 for electrically connecting the chip 30 to the metal electrodes 11 to apply voltage to the chip 30.

[0040] like Figure 1 As shown, the first micro-microscope detector 21 is disposed on the first side 101 of the substrate 10, and is used to locate the failure location of the chip 30 in the first direction ( Figure 1 The coordinate 'a' in the X-axis direction (as shown). Specifically, the first micro-microscope detector 21 can move along the first direction (…). Figure 1 Moving along the X-axis (as shown), during the process of locating the failure location 300 of chip 30, a voltage is first applied to chip 30 to generate a hot spot signal at the failure location 300, moving along the first direction (…). Figure 1 The first low-light microscope detector 21 is moved along the X-axis direction (as shown). When the first low-light microscope detector 21 detects a hot spot signal, it moves the hot spot signal along the first direction (as shown). Figure 1The coordinate 'a' in the X-axis direction (as shown) is marked to obtain the failure location 300 in the first direction ( Figure 1 The coordinate a in the X-axis direction shown.

[0041] like Figure 1 As shown, the second micro-microscope detector 22 is disposed on the second side 102 of the substrate 10, and is used to locate the failure location of the chip 30 in the second direction. Figure 1 The coordinate b of the second micro-microscope detector 22 (in the Y-axis direction shown) is specifically the coordinate b along the second direction (as shown). Figure 1 When the chip 30 moves along the Y-axis (as shown), and a voltage is applied to the chip 30, a hot spot signal is generated at the failure location 300, moving along the second direction ( Figure 1 The second low-light microscope detector 22 is moved along the Y-axis direction (as shown). When the second low-light microscope detector 22 detects a hot spot signal, it moves the hot spot signal along the second direction (as shown). Figure 1 The coordinate b in the Y-axis direction (as shown) is marked to obtain the failure location 300 in the second direction ( Figure 1 The coordinate b in the Y-axis direction (as shown).

[0042] As an example, both the first low-light microscope detector 21 and the second low-light microscope detector 22 include a first lens and a second lens, and the magnification of the second lens is greater than that of the first lens. During the process of locating the failure location 300 of the chip 30, the first lens can be used for rough positioning first. Since the magnification of the first lens is relatively small, the entire chip 30 can be observed, and the approximate location of the failure location 300 within the chip 30 can be obtained. Then, the second lens is used, based on the rough positioning obtained by the first lens, to obtain the accurate location of the failure location 300 within the chip 30. In this embodiment, the magnification of the first lens is between 1x and 10x, and the magnification of the second lens is between 20x and 100x.

[0043] The chip failure location device provided in this embodiment includes a substrate, a first low-light microscope detector, and a second low-light microscope detector. The first low-light microscope detector is disposed on a first side of the substrate and is used to locate the coordinates of the failure location in a first direction. The second low-light microscope detector is disposed on a second side of the substrate and is used to locate the coordinates of the failure location in a second direction, which is perpendicular to the first direction. The chip failure location device provided in this embodiment can locate the failure location from the side of the chip, avoiding damage to the chip, greatly improving the success rate of chip failure location, and effectively improving the accuracy of measurement results. Furthermore, the chip failure location device of this invention has a simple structure, which helps to reduce operating costs and improve production efficiency.

[0044] Example 2

[0045] This embodiment provides a chip failure location method, which is implemented using the chip failure location device provided in Embodiment 1, such as... Figure 2 As shown, it includes the following steps:

[0046] S1: A chip is provided, the chip is fixed on the substrate, and a voltage is applied to the chip to generate a hot spot signal at the failure location;

[0047] Reference Figure 1 As shown, a chip 30 is provided, which has a failure location 300. The chip 30 is fixed in the carrier area (not shown in the figure) of the substrate 10. A voltage is applied to the chip 30 through the metal electrode 11 on the substrate 10 to generate a hot spot signal at the failure location 300.

[0048] S2: Move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the first time.

[0049] like Figure 1 As shown, along the first direction ( Figure 1 The first low-light microscope detector 21 is moved along the X-axis direction (as shown). After detecting the hot spot signal, the first low-light microscope detector 21 moves the failure position 300 in the first direction (as shown). Figure 1 The coordinate 'a' in the X-axis direction (as shown) is marked for the first time. As an example, the first low-light microscope detector 21 uses a first lens with a relatively low magnification. Because the magnification of the first lens is low, the entire chip 30 can be observed, and the approximate location of the failure location 300 within the chip 30 can be obtained. In this embodiment, the magnification of the first lens is between 1x and 10x.

[0050] S3: Move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, it marks the coordinates of the failure location in the second direction for the first time.

[0051] like Figure 1 As shown, along the second direction ( Figure 1 The second low-light microscope detector 22 is moved along the Y-axis direction (as shown). After the second low-light microscope detector 22 detects the hot spot signal, it moves the failure position 300 along the second direction (as shown). Figure 1 The coordinate b (in the Y-axis direction shown) is marked for the first time. As an example, the second low-light microscope detector 22 uses a first lens with a small magnification. Because the magnification of the first lens is small, the entire chip 30 can be observed, and the approximate location of the failure location 300 in the chip 30 can be obtained. In this embodiment, the magnification of the first lens is between 1x and 10x.

[0052] S4: Using the first mark in step S2 as a reference, move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the second time.

[0053] Reference Figure 1 As shown, taking the first mark in step S2 as a reference, along the first direction ( Figure 1 The first low-light microscope detector 21 is moved along the X-axis direction (as shown). After the first low-light microscope detector 21 detects the hot spot signal, it moves the failure position 300 along the first direction (as shown). Figure 1 The coordinate 'a' in the X-axis direction (as shown) is marked a second time. As an example, the first low-light microscope detector 21 uses a second lens with a higher magnification. Because the second lens has a higher magnification, the accurate location of the failure position 300 within the chip 30 can be obtained. In this embodiment, the magnification of the second lens is between 20x and 100x.

[0054] S5: Using the first mark in step S3 as a reference, move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, mark the coordinates of the failure position in the second direction for the second time.

[0055] Reference Figure 1 As shown, taking the first mark in step S3 as a reference, along the second direction ( Figure 1 The second low-light microscope detector 22 is moved along the Y-axis direction (as shown). After the second low-light microscope detector 22 detects the hot spot signal, it moves the failure position 300 along the second direction (as shown). Figure 1 The coordinate b (in the Y-axis direction shown) is marked a second time. As an example, the second low-light microscope detector 22 uses a second lens with a large magnification. Because the second lens has a large magnification, the accurate location of the failure position 300 in the chip 30 can be obtained. In this embodiment, the magnification of the second lens is between 20x and 100x.

[0056] This embodiment provides a chip failure location method. The chip is placed on the surface of a substrate, and a first low-light microscope detector is moved along a first direction to obtain the coordinates of the failure location in the first direction. A second low-light microscope detector is moved along a second direction to obtain the coordinates of the failure location in the second direction. The second direction is perpendicular to the first direction, thus locating the failure location. By locating the failure location from the side of the chip, damage to the chip can be avoided, greatly improving the success rate of chip failure location. During the location process, a low-magnification lens is first used to obtain the approximate location of the failure location, and then a high-magnification lens is used to accurately locate the failure location, effectively improving the accuracy of the measurement results. Furthermore, the chip failure location method provided in this embodiment is simple to operate, which helps reduce operating costs and improve production efficiency.

[0057] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A chip failure location device, wherein the chip is a power chip, the front side of the chip is covered by an aluminum layer and the back side has a heavily doped layer, characterized in that, include: A substrate for placing a chip and applying voltage to the chip; The low-light microscope detector includes a first low-light microscope detector and a second low-light microscope detector. The first low-light microscope detector is disposed on a first side of the substrate and is used to locate the coordinates of the failure location of the chip in a first direction. The second low-light microscope detector is disposed on a second side of the substrate and is used to locate the coordinates of the failure location of the chip in a second direction. Both the first direction and the second direction are located on the side of the chip, and the second direction is perpendicular to the first direction. The failure location is located from the side of the chip to avoid damage to the chip.

2. The chip failure location device according to claim 1, characterized in that, The low-light microscope detector includes a first lens and a second lens, wherein the magnification of the second lens is greater than that of the first lens.

3. The chip failure location device according to claim 2, characterized in that, The magnification of the first lens is between 1x and 10x.

4. The chip failure location device according to claim 2, characterized in that, The magnification of the second lens is between 20x and 100x.

5. The chip failure location device according to claim 2, characterized in that, The substrate is a PCB board.

6. A method for locating chip failures, wherein the chip is a power chip, the front side of the chip is covered by an aluminum layer, and the back side has a heavily doped layer, characterized in that... The chip failure location device according to any one of claims 2 to 5, the method includes the following steps: S1: A chip is provided, the chip is fixed on the substrate, and a voltage is applied to the chip to generate a hot spot signal at the failure location; S2: Move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the first time. S3: Move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, it marks the coordinates of the failure location in the second direction for the first time, and locates the failure location from the side of the chip to avoid damage to the chip.

7. The chip failure location method according to claim 6, characterized in that, In steps S2 and S3, both the first and second low-light microscope detectors use the first lens.

8. The chip failure location method according to claim 7, characterized in that, Also includes: S4: Using the first mark in step S2 as a reference, move the first low-light microscope detector along the first direction. After the first low-light microscope detector detects the hot spot signal, mark the coordinates of the failure location in the first direction for the second time. S5: Using the first mark in step S3 as a reference, move the second low-light microscope detector along the second direction. After the second low-light microscope detector detects the hot spot signal, mark the coordinates of the failure position in the second direction for the second time.

9. The chip failure location method according to claim 8, characterized in that, In steps S4 and S5, both the first and second low-light microscope detectors employ the second lens.

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