An optical transmitter sub-module for fiber optic communication transmission equipment
By designing heat dissipation and protection mechanisms in the optical emission sub-module, the problem of heat accumulation during laser operation was solved, achieving efficient heat dissipation and pin protection for the module, thus improving the overall working effect and efficiency.
Patent Information
- Application Number
- CN202111087095.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2021-09-16
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2041-09-16
AI Technical Summary
The existing optical emission sub-modules lack independent and effective heat dissipation mechanisms, which leads to heat accumulation during laser operation, affecting the module's performance and efficiency.
A heat dissipation mechanism is designed, comprising a main heat sink, a secondary heat sink, a cooling fan, a main heat sink, a secondary heat sink, a positioning block, a limiting slide bar, a compression spring, a slider, a positioning lock bar, a tension spring, and an air duct, as well as a protection mechanism. The heat dissipation mechanism enables rapid heat dissipation of the module body, and the protection mechanism protects the pins.
It effectively dissipates heat from the module body during operation, prevents heat buildup, improves working efficiency, and provides protection for the pins through a protective mechanism.
Smart Images

Figure CN115826151B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of optical module manufacturing technology, and in particular to an optical transmitting sub-module for optical fiber communication transmission equipment. Background Technology
[0002] Optical transmission modules are divided into single-mode optical transmission modules and multi-mode optical transmission modules. In terms of overall product architecture, they include two main parts: optical sub-modules and electronic sub-modules. The optical sub-modules can be further divided into optical transmitting sub-modules and optical receiving sub-modules. The optical transmitting sub-modules are mainly used to convert electrical signals into optical signals, i.e., E / O conversion. Performance indicators include optical power, threshold, etc.
[0003] The core component of the optical emission submodule is the laser. The light emitted by the laser is collimated and focused by an optical lens before being sent into the optical fiber. For the laser, the most important parameter is the PI curve, where P represents temperature and I represents the threshold current. Light emission only occurs when the driving current exceeds the threshold current. The threshold current I exhibits a strong temperature dependence, increasing with rising temperature P. Since the laser generates heat during emission, if the accumulated heat during continuous operation cannot be dissipated promptly, it will inevitably affect the working effect and efficiency of the optical emission submodule. Therefore, to address this issue, we propose an optical emission submodule for fiber optic communication transmission equipment. Summary of the Invention
[0004] The present invention proposes an optical transmission submodule for optical fiber communication transmission equipment, which solves the problem that existing optical transmission submodules do not have an independent and effective heat dissipation mechanism, thus they cannot quickly handle the heat generated by the laser during operation, and the heat accumulation may affect the overall working effect and efficiency of the module.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A light transmitting sub-module for optical fiber communication transmission equipment includes a module body, a heat dissipation mechanism, and a protection mechanism. The module body is characterized in that a heat dissipation mechanism is provided on the side wall of the module body, and a protection mechanism is provided at the pin end of the module body.
[0007] The heat dissipation mechanism includes a main heat dissipation cover, a secondary heat dissipation cover, a cooling fan, a main heat sink, a secondary heat sink, a positioning block, a limiting slide rod, a compression spring, a slider, a positioning lock rod, a tension spring, and an air duct. The module body is provided with two main heat dissipation covers and two secondary heat dissipation covers with the same structure. A cooling fan is fixedly installed on the outer wall of the main heat dissipation cover, and a main heat sink is fixedly connected inside the main heat dissipation cover. A secondary heat sink is slidably arranged inside the secondary heat dissipation cover, and two symmetrically distributed positioning blocks are fixedly connected to the side of the secondary heat sink near the outside of the secondary heat dissipation cover. A limiting slide rod is fixedly connected to both ends of the positioning block. A compression spring is sleeved on the body of the limiting slide rod, and a slider is slidably sleeved at the end of the limiting slide rod. A positioning lock rod is fixedly connected to the end of the slider away from the positioning block. A tension spring is fixedly connected to the side of the positioning block near the outside of the secondary heat dissipation cover. Air ducts are fixedly connected to the opposite side walls of the secondary heat dissipation cover.
[0008] The protective mechanism includes a main protective cover, a secondary protective cover, a first tensioning band, and a second tensioning band. The main protective cover and the secondary protective cover are provided on the pins of the module body. The main protective cover and the secondary protective cover are correspondingly arranged and matched. The first tensioning band and the second tensioning band are fixedly connected to both ends of the main protective cover, and the first and second tensioning bands are pin-connected to each other.
[0009] Preferably, the two limiting slide rods located on the same positioning block are coaxially arranged.
[0010] Preferably, the two ends of the compression spring are fixedly connected to the positioning block and the slider respectively and are in a compressed state, and the end of the tension spring is fixedly connected to the inner wall of the secondary heat dissipation cover and is in a stretched state.
[0011] Preferably, the positioning locking rod is L-shaped, with the long section of the positioning locking rod vertically penetrating and extending to the outside of the outer wall of the secondary heat dissipation cover. The inner side wall of the secondary heat dissipation cover has a groove that matches the hook end of the positioning locking rod, and the outer wall of the secondary heat dissipation cover has a sliding groove that matches the movement rail of the positioning locking rod.
[0012] Preferably, the air duct is L-shaped and connects to the secondary heat dissipation cover. The air duct is located on the side wall of the secondary heat dissipation cover parallel to the main heat dissipation cover, and the end of the air duct away from the secondary heat dissipation cover passes through the side wall of the main heat dissipation cover.
[0013] Preferably, the inner walls of the first and second tensioning bands are provided with evenly distributed locking teeth, and the two ends of the main protective cover and the secondary protective cover are respectively provided with annular locking grooves that match the first and second tensioning bands.
[0014] The beneficial effects of this invention are as follows:
[0015] 1. By setting up a heat dissipation mechanism, the entire heat dissipation mechanism is fitted onto the circumferential side wall of the module body. The end of the positioning locking rod pushes the auxiliary heat sink to press against the circumferential side wall of the module body to form a fixed position and prevent it from falling off. The positioning locking rod can be moved to release the lock, which is convenient for disassembly and maintenance. When in operation, the cooling fan is turned on and blows air directly onto the main heat sink. The air also flows into the auxiliary heat sink covers on both sides through the air duct. The heat is carried away by the main heat sink and the auxiliary heat sink in contact with the circumferential side wall of the module body, so as to achieve overall heat dissipation.
[0016] 2. With the protection mechanism, when the module body is not in use, align the main protective cover and the secondary protective cover with the pins of the module body and engage them. Then, use the first and second tensioning straps to tighten them along the annular grooves at both ends to protect the pins.
[0017] In summary, this invention effectively dissipates heat from the module body during operation by setting up a heat dissipation mechanism, and provides a certain degree of protection for the module's pins by setting up a protection mechanism. This solves the problem that existing optical emission sub-modules, due to the lack of an independent and effective heat dissipation mechanism, cannot quickly handle the heat emitted by the laser during operation, and the heat accumulation may affect the overall working effect and efficiency of the module. Therefore, this invention is suitable for widespread application. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the structure of the present invention;
[0019] Figure 2 This is a structural diagram of the heat dissipation mechanism and the module body of the present invention.
[0020] Figure 3 This is an exploded view of the present invention;
[0021] Figure 4 This is a structural diagram of the mounting block and auxiliary heat sink of the present invention;
[0022] Figure 5 This is an exploded view of the protective mechanism of the present invention.
[0023] The following are the labels in the diagram: 1. Module body; 2. Main heat sink cover; 3. Secondary heat sink cover; 4. Cooling fan; 5. Main heat sink; 6. Secondary heat sink; 7. Positioning block; 8. Limiting slide bar; 9. Compression spring; 10. Slider; 11. Positioning lock rod; 12. Tension spring; 13. Air duct; 14. Main protective cover; 15. Secondary protective cover; 16. First tension band; 17. Second tension band. Detailed Implementation
[0024] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0025] Reference Figure 1-4 A light transmitting sub-module for optical fiber communication transmission equipment includes a module body 1, a heat dissipation mechanism, and a protection mechanism. The heat dissipation mechanism is provided on the side wall of the module body 1. The heat dissipation mechanism includes a main heat dissipation cover 2, a secondary heat dissipation cover 3, a cooling fan 4, a main heat sink 5, a secondary heat sink 6, a positioning block 7, a limiting slide bar 8, a compression spring 9, a slider 10, a positioning locking rod 11, a tension spring 12, and an air duct 13. The module body 1 is provided with two main heat dissipation covers 2 and two secondary heat dissipation covers 3 with the same structure. The cooling fan 4 is fixedly installed on the outer side wall of the main heat dissipation cover 2, and the main heat sink 5 is fixedly connected inside the main heat dissipation cover 2. The secondary heat sink 6 is slidably arranged inside the secondary heat dissipation cover 3.
[0026] Two symmetrically distributed positioning blocks 7 are fixedly connected to the side of the secondary heat sink 6 near the outside of the secondary heat sink cover 3. Limiting slide rods 8 are fixedly connected to both ends of each positioning block 7. The two limiting slide rods 8 on the same positioning block 7 are coaxially arranged. A compression spring 9 is sleeved on the rod of the limiting slide rod 8. The two ends of the compression spring 9 are fixedly connected to the positioning block 7 and the slider 10 respectively and are in a compressed state. A slider 10 is slidably sleeved at the end of the limiting slide rod 8. A positioning locking rod 11 is fixedly connected to the end of the slider 10 away from the positioning block 7. The positioning locking rod 11 is L-shaped, with its long section vertically penetrating and extending to the outside of the outer wall of the secondary heat sink cover 3. A groove matching the hook end of the positioning locking rod 11 is provided on the inner side wall of the secondary heat sink cover 3, and a sliding groove matching the movement rail of the positioning locking rod 11 is provided on the outer wall of the secondary heat sink cover 3. A tension spring 12 is fixedly connected to the side of the positioning block 7 near the outside of the secondary heat sink cover 3. The end of the tension spring 12 is connected to the secondary heat sink... The inner wall of the cover 3 is fixedly connected and in a stretched state. Air ducts 13 are fixedly connected to the opposite side walls of the secondary heat dissipation cover 3. The air ducts 13 are L-shaped and connect to the secondary heat dissipation cover 3. The air ducts 13 are located on the side walls of the secondary heat dissipation cover 3 parallel to the main heat dissipation cover 2, with one end of the air duct away from the secondary heat dissipation cover 3 penetrating the side wall of the main heat dissipation cover 2. The entire heat dissipation mechanism is fitted onto the circumferential side wall of the module body 1. Pressing the positioning locking rod 11 makes it engage with the secondary heat dissipation cover 2. The slots on the inner wall of the heat cover 3 engage, and the end of the positioning locking rod 11 pushes the secondary heat sink 6 to press against the circumferential side wall of the module body 1, forming a fixed position to prevent it from falling off. The positioning locking rod 11 can be moved to release the lock, making it easy to disassemble and maintain. When in operation, the cooling fan 4 is turned on, and the cooling fan 4 blows air onto the main heat sink 5 and through the air duct 13 to the secondary heat sink covers 3 on both sides. The heat is carried away by the main heat sink 5 and the secondary heat sink 6 adhering to the circumferential side wall of the module body 1.
[0027] Reference Figure 1-2 and Figure 5 The pins of module body 1 are provided with a protective mechanism, which includes a main protective cover 14, a secondary protective cover 15, a first tensioning band 16, and a second tensioning band 17. The main protective cover 14 and the secondary protective cover 15 are provided on the pins of module body 1. The main protective cover 14 and the secondary protective cover 15 are correspondingly and matched. The two ends of the main protective cover 14 are respectively fixedly connected to the first tensioning band 16 and the second tensioning band 17. The first and second ends of the first tensioning band 16 and the second tensioning band 17 are respectively pin-connected. The inner walls of the first tensioning band 16 and the second tensioning band 17 are provided with evenly distributed clips. The main protective cover 14 and the secondary protective cover 15 have annular grooves on their two ends of the circumferential sidewalls that match the first tension band 16 and the second tension band 17, respectively. The main protective cover 14, the secondary protective cover 15, the first tension band 16 and the second tension band 17 are all made of rubber. When the module body 1 is not in use, the main protective cover 14 and the secondary protective cover 15 are aligned with the pins of the module body 1 and engaged. The first tension band 16 and the second tension band 17 are then tightened along the annular grooves at both ends to protect the pins. When the module body 1 is in use, the protective mechanism can be removed by reversing the operation.
[0028] Example: When using this invention, the protective mechanism set on the pin of the module body 1 needs to be removed first, that is, the first and the last ends of the first tension band 16 and the second tension band 17 are released from the pins, and then unfolded along the annular groove, so that the main protective cover 14 and the secondary protective cover 15 are exposed.
[0029] When the module body 1 is in working condition, the cooling fan 4 is activated. The cooling fan 4 blows air directly onto the main heat sink 5 and through the air duct 13 into the secondary heat sink covers 3 on both sides. The air blows onto the secondary heat sink 6. The heat is carried away by the main heat sink 5 and the secondary heat sink 6 in contact with the circumferential side wall of the module body 1, thereby achieving heat dissipation of the module body 1.
[0030] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. An optical transmitting submodule for an optical fiber communication transmission device, comprising a module body (1), a heat dissipation mechanism, and a protection mechanism, characterized in that, A heat dissipation mechanism is provided on the side wall of the module body (1), and a protection mechanism is provided on the pin end of the module body (1). The heat dissipation mechanism includes a main heat dissipation cover (2), a secondary heat dissipation cover (3), a cooling fan (4), a main heat sink (5), a secondary heat sink (6), a positioning block (7), a limiting slide bar (8), a compression spring (9), a slider (10), a positioning locking rod (11), a tension spring (12), and an air duct (13). The module body (1) is provided with two main heat dissipation covers (2) and two secondary heat dissipation covers (3) with the same structure. A cooling fan (4) is fixedly installed on the outer wall of the main heat dissipation cover (2), and a main heat sink (5) is fixedly connected inside the main heat dissipation cover (2). A secondary heat sink is slidably arranged inside the secondary heat dissipation cover (3). (6), and two symmetrically distributed positioning blocks (7) are fixedly connected to the side of the secondary heat sink (6) near the outside of the secondary heat sink cover (3). Both ends of the positioning blocks (7) are fixedly connected to limit slide rods (8). A compression spring (9) is sleeved on the rod body of the limit slide rod (8), and a slider (10) is slidably sleeved on the end of the limit slide rod (8). A positioning lock rod (11) is fixedly connected to the end of the slider (10) away from the positioning block (7). A tension spring (12) is fixedly connected to the side of the positioning block (7) near the outside of the secondary heat sink cover (3). Air ducts (13) are fixedly connected to the opposite side walls of the secondary heat sink cover (3). The positioning locking rod (11) is L-shaped. The long section of the positioning locking rod (11) extends vertically through and to the outside of the outer wall of the secondary heat dissipation cover (3). The inner side wall of the secondary heat dissipation cover (3) is provided with a groove that matches the hook end of the positioning locking rod (11), and the outer wall of the secondary heat dissipation cover (3) is provided with a sliding groove that matches the movement rail of the positioning locking rod (11). The protective mechanism includes a main protective cover (14), a secondary protective cover (15), a first tension band (16), and a second tension band (17). The main protective cover (14) and the secondary protective cover (15) are provided on the pins of the module body (1). The main protective cover (14) and the secondary protective cover (15) are correspondingly arranged and matched. The first tension band (16) and the second tension band (17) are fixedly connected to both ends of the main protective cover (14). The first tension band (16) and the second tension band (17) are pin-connected to each other.
2. The optical transmitting sub-module for optical fiber communication transmission equipment according to claim 1, characterized in that, The two limiting slide rods (8) located on the same positioning block (7) are coaxially arranged.
3. The optical transmitting sub-module for optical fiber communication transmission equipment according to claim 1, characterized in that, The two ends of the compression spring (9) are fixedly connected to the positioning block (7) and the slider (10) respectively and are in a compressed state, and the end of the tension spring (12) is fixedly connected to the inner wall of the auxiliary heat dissipation cover (3) and is in a stretched state.
4. The optical transmitting sub-module for optical fiber communication transmission equipment according to claim 1, characterized in that, The air duct (13) is L-shaped and is connected to the secondary heat dissipation cover (3). The air duct (13) is located on the side wall of the secondary heat dissipation cover (3) parallel to the main heat dissipation cover (2), and the end of the air duct (13) away from the secondary heat dissipation cover (3) passes through the side wall of the main heat dissipation cover (2).
5. The optical transmitting sub-module for optical fiber communication transmission equipment according to claim 1, characterized in that, The inner walls of the first tension band (16) and the second tension band (17) are provided with evenly distributed locking teeth, and the two ends of the main protective cover (14) and the secondary protective cover (15) are respectively provided with annular locking grooves that match the first tension band (16) and the second tension band (17).
Citation Information
Patent Citations
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