Drying device for diode processing

Abstract

The application discloses a drying device for diode processing and relates to the technical field of drying devices.The drying device comprises a power box, a drying assembly for efficiently heating diodes is arranged on the power box, and a placing assembly for placing diodes and ensuring that the diodes are evenly heated is arranged in the drying assembly.The drying assembly can adjust the temperature in the drying box, balance the temperature of the drying box, avoid differences in detection values of the diodes on the placing assembly caused by temperature differences generated during drying, thereby causing the diodes to have large value deviations and being unable to be used, and the inside of the heat preservation box is provided with a partition block to enable the hot air in the inside to circulate and flow out, thereby gradually heating the diodes, preheating and drying the diodes without separate preheating operation, and avoiding changes in the texture of diode chips caused by large temperature differences during drying, thereby damaging the diode chips.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of drying devices, in particular to a drying device for diode processing. BACKGROUND

[0002] A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It has a unidirectional conduction property, that is, when a positive voltage is applied to the anode of the diode, the diode is turned on. When a reverse voltage is applied to the anode and the cathode, the diode is cut off. Therefore, the turn-on and turn-off of the diode are equivalent to the turn-on and turn-off of a switch.

[0003] The diode is one of the earliest semiconductor devices, and its application is very wide. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are connected reasonably to form circuits with different functions, which can realize functions such as AC rectification, modulation signal detection, amplitude limiting and clamping, and power voltage stabilization.

[0004] In the production process of diodes, multiple cleaning and drying are required. In the drying process of the existing drying device, the temperature of some positions in the drying device is lower than the average temperature or higher than the average temperature, so that the values of some dried diodes are relatively large or relatively small, resulting in unqualified products. Before drying, the chip in the diode needs to be preheated separately to prevent damage caused by large temperature difference during drying, so that the operation steps of the whole drying become cumbersome. Therefore, the application provides a drying device for diode processing to meet the needs. SUMMARY

[0005] The purpose of the present application is to provide a drying device for diode processing, which can effectively solve the problems in the background art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme: a drying device for diode processing, comprising a power box, a drying assembly for efficiently heating diodes is arranged on the power box, a placing assembly for placing diodes and ensuring uniform heating of the diodes is arranged inside the drying assembly, an air inlet assembly is arranged on one side of the drying assembly and penetrates the inside of the drying assembly and continuously injects air, and an exhaust assembly is arranged on one side of the drying assembly and exhausts waste gas and filters the waste gas.

[0007] The drying assembly comprises a drying box and a partition block arranged inside the drying box to control the direction of hot air, the outer surface of the drying box is sleeved with a heat preservation box fixedly connected with the power box, and the heat preservation box is provided with a heat preservation cover matched with the partition block to control the direction of hot air.

[0008] Preferably, the incubator top is provided with a dismounting groove, and a dismounting cover is arranged in the dismounting groove; the drying box is in the shape of 'U', and a partition is arranged in the 'U' cavity of the drying box; the partition is provided with two connecting plates, and a plurality of heating plates are arranged between the two connecting plates; a ventilation opening is formed in one side of the partition and communicates with the inside of the drying box, and the plurality of heating plates are inclined to the side of the ventilation opening; a blow opening is formed in one side of the partition, and a baffle is arranged on the inner wall of the blow opening.

[0009] The incubator is rotatably connected with the incubator cover through a hinge, the outer surface of the incubator cover is provided with clamping hooks on both sides, the two sides of the incubator are provided with locking frames matched with the clamping hooks, the outer surface of the incubator cover is provided with a pull rod in the middle, and the inner wall of the incubator cover is provided with a sealing frame matched with the drying box to increase the sealing effect.

[0010] Preferably, the air inlet assembly comprises an air inlet shell fixedly connected with the partition and communicating with the inside of the partition, a plurality of supporting rods are arranged on the outer surface of the air inlet shell, and the plurality of supporting rods are fixedly connected with the drying box, and a fan is arranged in the air inlet shell.

[0011] Preferably, the air outlet assembly comprises an air outlet pipe penetrating through the incubator and the drying box and fixedly connected with the drying box, and an exhaust gas filter pipe is arranged on one side of the air outlet pipe, and an air outlet pipe is connected to the outer surface of the exhaust gas filter pipe and has the same angle as the air inlet shell.

[0012] Preferably, the placing assembly comprises four sliding rails fixedly connected to the inner wall of the drying box, four sliding blocks are slidingly installed in the four sliding rails, four limit grooves are formed in the top of the four sliding rails, and a limiting block is arranged on one side of each of the four sliding blocks and matched with the limit groove, and a plurality of heat-conducting plates are fixedly connected to one side of each of every two sliding blocks and distributed at equal intervals, a plurality of heat-absorbing fins are sleeved on the outer surface of each of the plurality of heat-conducting plates and distributed at equal intervals, a plurality of storage plates are fixedly connected between the plurality of heat-conducting plates, and a storage disc is arranged on the upper part of each of the plurality of storage plates.

[0013] Preferably, the inner wall of the storage plate is fixedly connected with a wind guide plate, the cross section of the wind guide plate is in the shape of a semicircle, and the wind guide plate is in the shape of 'U'.

[0014] Preferably, the storage disc is in the shape of 'U', a clamping groove is formed in the top of the storage disc, the incubator cover is in the shape of a semicircular cavity, and the storage disc and the incubator cover are matched with each other.

[0015] In summary, the technical effects and advantages of the present application are as follows:

[0016] 1. The drying assembly is provided, when drying the diode, the fan runs to blow air into the partition block through the air inlet shell, because the air inlet and air outlet are arranged on the partition block, so the temperature in the drying box can be adjusted to balance the temperature of the drying box, avoid the temperature difference caused by drying to cause the detection value of the diode placed on the assembly to produce difference, thereby causing the diode user value amplitude is larger and cannot be used, and the internal heat preservation box is arranged in the partition block, which makes the internal hot air flow out in circulation, can make the diode gradually heat up, can preheat and dry the diode without separate preheating operation, and avoid the large temperature difference during drying to change the texture of diode chip and damage;

[0017] 2. The placing assembly provided in the application, the hot air first contacts the air deflector, the air deflector can absorb the heat energy in the hot air and transfer it to the storage plate, and then to the diodes in the storage disc through the storage plate, and the heat absorbing sheet and the heat conducting plate can also absorb the heat in the hot air and transfer it to the diodes, so that the diodes can be quickly dried, and the special shape of the air deflector can change the flow direction of the hot air, so that the hot air is in the shape of vortex to dry the diodes, thereby accelerating the drying speed of the diodes and increasing the drying effect of the drying device, and the U-shaped structure of the drying box can make the hot air flow quickly in the drying box, further improving the drying efficiency of the diodes. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0019] Figure 1 The first perspective view of the diode processing drying device is shown in the schematic view.

[0020] Figure 2 The second perspective view of the diode processing drying device is shown in the schematic view.

[0021] Figure 3 The third perspective view of the diode processing drying device is shown in the schematic view.

[0022] Figure 4 The fourth perspective view of the diode processing drying device is shown in the schematic view.

[0023] Figure 5 The sectional view of the drying assembly is shown in the schematic view.

[0024] Figure 6 Fig. 1 is a schematic diagram of the three-dimensional connection structure of the drying assembly;

[0025] Figure 7 Fig. 2 is a schematic diagram of the internal three-dimensional structure of the drying assembly;

[0026] Figure 8 Fig. 3 is a sectional view of the three-dimensional connection structure of the drying assembly, the exhaust assembly and the air inlet assembly;

[0027] Figure 9 Fig. 4 is a sectional view of the three-dimensional connection structure of the heat preservation box and the drying box;

[0028] Figure 10 Fig. 5 is a schematic diagram of the three-dimensional connection structure of the heating plate;

[0029] Figure 11 Fig. 6 is a sectional view of the three-dimensional connection structure of the air inlet assembly, the drying assembly and the exhaust assembly;

[0030] Figure 12 Fig. 7 is a schematic diagram of the three-dimensional connection structure of the air inlet assembly and the drying assembly;

[0031] Figure 13 Fig. 8 is a schematic diagram of the three-dimensional structure of the air inlet shell;

[0032] Figure 14 Fig. 9 is a schematic diagram of the three-dimensional structure of the placing assembly;

[0033] Figure 15 Fig. 10 is a schematic diagram of the three-dimensional structure of the storage disc;

[0034] Figure 16 Fig. 11 is a schematic diagram of the three-dimensional structure of the heat conducting plate and the storage plate;

[0035] Figure 17 Fig. 12 is a schematic diagram of the three-dimensional structure of the storage plate and the air guiding plate;

[0036] Figure 18 Fig. 13 is a schematic diagram of the three-dimensional structure of the air guiding plate.

[0037] In the figure: 1, power box; 2, drying assembly; 20, partition block; 21, heat preservation box; 22, drying box; 23, disassembly cover; 24, heat preservation cover; 25, clamping hook; 26, sealing frame; 27, ventilation opening; 28, connecting plate; 29, locking frame; 211, air baffle; 212, heating plate; 213, air outlet; 3, placing assembly; 30, heat conducting plate; 31, sliding rail; 32, sliding block; 33, limiting groove; 34, limiting block; 35, storage disc; 36, heat absorbing sheet; 37, storage plate; 38, air guiding plate; 4, air inlet assembly; 41, air inlet shell; 42, supporting rod; 43, fan; 5, exhaust assembly; 51, exhaust pipe; 52, tail gas filter pipe; 53, air outlet pipe. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of the present application.

[0039] Embodiment one

[0040] Reference Figures 1-18 The diode drying device shown in the figure comprises a power box 1, the power box 1 is provided with a drying assembly 2 for efficiently heating diodes, the inside of the drying assembly 2 is provided with a placing assembly 3 for placing diodes and ensuring that the diodes are evenly heated, one side of the drying assembly 2 is provided with an air inlet assembly 4 which is in communication with the inside of the drying assembly 2 and continuously injects air, and one side of the drying assembly 2 is provided with an air outlet assembly 5 which discharges waste gas and filters the waste gas;

[0041] It is worth noting that, in use, the diodes to be dried are placed on the fixed support, and then the diodes placed in a row are placed into the placing assembly 3, and after all the diodes are placed, they are pushed into the drying assembly 2, then the air inlet assembly 4 blows the filtered pure air into the drying assembly 2, the drying assembly 2 heats the air into dry hot air, because of the special setting of the drying assembly 2, the heated air will form a circulating flow state in the drying assembly 2, and the hot air blown into the drying assembly 2 cooperates with the placing assembly 3 to quickly heat the diodes, and the circulating hot air can quickly remove the moisture in the diode chip, the double-layer heating of the drying assembly 2 and the placing assembly 3 can quickly evaporate the moisture in the diode welding chip, and the way of heating air to dry the diode can quickly remove the moisture on the surface of the diode chip, and the placing assembly 3 completely discharges the moisture in the diode chip, the cooperation of the physical heat transfer heating and drying of the placing assembly 3 and the drying assembly 2 not only can improve the heating effect, but also can avoid the moisture in the diode chip after drying.

[0042] Further, in order to improve the drying efficiency of the diode, the air inlet assembly 4 as shown in Figures 11-13 The air inlet assembly 4 comprises an air inlet shell 41 fixedly connected with the partition block 20 and in communication with the inside thereof, the outer surface of the air inlet shell 41 is provided with a plurality of support rods 42, and the plurality of support rods 42 are fixedly connected with the drying box 22, and the inside of the air inlet shell 41 is provided with a fan 43.

[0043] Wherein, when in use, the power box 1 drives the fan 43 to rotate, and the fan 43 delivers the pure air into the air inlet shell 41. Since the outlet of the air inlet of the air inlet shell 41 is larger, and the outlet of the air outlet is smaller, the air is accelerated when entering the partition block 20, so that the air can quickly pass through the partition block 20.

[0044] Further, in order to make the dried diode heated uniformly, the drying assembly 2 as shown in the figure is arranged, and the drying assembly 2 comprises a drying box 22 and a partition block 20 arranged inside the drying box 22 to control the direction of hot air. The outer surface of the drying box 22 is sleeved with a heat preservation box 21 fixedly connected with the power box 1, and one side of the heat preservation box 21 is provided with a heat preservation cover 24 cooperating with the partition block 20 to control the direction of hot air. Figures 5-12

[0045] A dismounting groove is formed on the top of the heat preservation box 21, and a dismounting cover 23 is arranged in the dismounting groove. The drying box 22 is in the shape of "U", and the partition block 20 is arranged in the "U" shaped cavity of the drying box 22. Two connecting plates 28 are arranged in the partition block 20, and a plurality of heating plates 212 are arranged between the two connecting plates 28. An air vent 27 is formed on one side of the partition block 20 and communicates with the inside of the drying box 22. An air outlet 213 is formed on one side of the partition block 20, and a baffle 211 is arranged on the inner wall of the air outlet 213.

[0046] Further, when the air enters the partition block 20 through the air inlet shell 41, the heating plates 212 can heat the air entering the partition block 20. The plurality of heating plates 212 are inclined to one side of the air vent 27, so that the heated air quickly enters the inside of the drying box 22 through the air vent 27. The added air contacts the placing assembly 3, so as to take away the moisture in the diode chip. The hot air contacting the placing assembly 3 can also heat the placing assembly 3 to evaporate the moisture in the diode.

[0047] Wherein, the heat preservation box 21 is rotatably connected with the heat preservation cover 24 through a hinge. The outer surface of the heat preservation cover 24 is provided with a clamping hook 25 on both sides. The two sides of the heat preservation box 21 are provided with a locking frame 29 matched with the clamping hook 25. The outer surface of the heat preservation cover 24 is provided with a pull rod in the middle. The inner wall of the heat preservation cover 24 is provided with a sealing frame 26 matched with the drying box 22 to increase the sealing effect.

[0048] ​Further, in the above-mentioned heated air into the drying box 22 inside, in order to make the diode uniform heating, hot air will be diverted through the heat cover 24, so that hot air can quickly through the "U" type drying box 22 inner cavity, so that the hot air can make the diode heating, in the process of heating block 20 in the hot air part through the vent 27 another part will be through the air outlet 213, through the air outlet 213 of the hot air will be blocked by the baffle 211, then into the drying box 22 on the diode heating placed on the assembly 3;

[0049] Because in the process of heating diode hot air with time and distance of the progressive temperature will also be reduced, so that the following diode heating uneven, and open the air outlet 213 and cooperate with the baffle 211 can realize the overall temperature balance in the drying box 22, ensure that the diode in the drying box 22 heating uniform drying thoroughly.

[0050] Further, in order to make the drying gas to reach the qualified emission level set as Figures 5-9 The exhaust assembly 5 shown, and the exhaust assembly 5 includes through the heat preservation box 21 and drying box 22 and with the drying box 22 fixed connection of the exhaust pipe 53, one side of the exhaust pipe 53 is provided with tail gas filter pipe 52, tail gas filter pipe 52 belongs to the existing technology hereinafter will not be described.

[0051] It is worth noting that, when the above-mentioned drying box 22 in the hot air take away the moisture in the diode need to be discharged, the hot air will be through the exhaust pipe 53 and then into the tail gas filter pipe 52 in the filter moisture and harmful gas, and the filtered gas will be discharged from the exhaust pipe 51, the exhaust pipe 51 of the same angle as the air inlet shell 41, so that the exhaust gas through the exhaust pipe 51 also part of the fan 43 again to the air inlet shell 41.

[0052] Further use method of the embodiment

[0053] In use, the diode is placed on the assembly 3, and then the heat cover 24 is rotated and attached to the heat preservation box 21. Because the sealing frame 26 provided on the heat cover 24 is attached to the drying box 22, the overall sealing effect of the drying box 22 is better. The lock frame 29 and the hook 25 are combined together to firmly attach the heat cover 24 to the heat preservation box 21.

[0054] When the diodes are dried, the fan 43 operates to blow air into the partition block 20 through the air inlet shell 41. Since the air inlet 27 and the air outlet 213 are formed on the partition block 20, the temperature in the drying box 22 can be adjusted to balance the temperature of the drying box 22, so as to avoid the temperature difference caused by drying to cause the detection value of the diodes placed on the assembly 3 to be different, thereby causing the diode user value to have a large amplitude and be unable to be used. The internal part of the heat preservation box 21 is matched with the partition block 20, so that the internal hot air flows out in a circulating manner, so that the diodes can be gradually heated, the diodes can be preheated and dried, and the diodes are prevented from being damaged due to the change in the texture of the diode chip caused by the large temperature difference during drying.

[0055] Embodiment two

[0056] Based on the assembly 3 and the drying assembly 2 proposed in embodiment one, the present embodiment proposes a further technical solution of the assembly 3 and the heat preservation cover 24.

[0057] It is worth noting that in order to improve the drying efficiency of the drying device on the diodes, the assembly 3 as shown in Figures 14-18 is arranged, and the assembly 3 comprises four sliding rails 31 fixedly connected to the inner wall of the drying box 22. The four sliding rails 31 are slidably installed with sliding blocks 32 inside. The top of the four sliding rails 31 is provided with limiting grooves 33, and the side of the four sliding blocks 32 is provided with limiting blocks 34 matched with the limiting grooves 33. Every two sliding blocks 32 are fixedly connected with a plurality of heat-conducting plates 30 distributed at equal intervals on one side. The outer surfaces of the plurality of heat-conducting plates 30 are sleeved with a plurality of heat-absorbing fins 36 distributed at equal intervals. A plurality of storage plates 37 are fixedly connected between the plurality of heat-conducting plates 30. The upper part of the plurality of storage plates 37 is provided with a storage disc 35.

[0058] In use, the heat preservation cover 24 is opened, then the storage disc 35 is pulled out from the storage plate 37, and then the diodes to be dried are arranged in the storage disc 35. The top of the storage disc 35 is provided with a clamping groove, so that the arranged diodes can be prevented from falling off;

[0059] Then the storage disc 35 with the diodes arranged therein is pushed into the storage plate 37. When all the storage discs 35 are stacked on the storage plate 37, the user rotates the heat preservation cover 24 to be sealed with the drying box 22. The heat preservation cover 24 is in the shape of a semicircular cavity, so that the storage disc 35 and the heat preservation cover 24 are matched with each other. Therefore, when the hot air is blown into the drying box 22, the heat preservation cover 24 in the shape of a semicircular cavity can guide the hot air and quickly dry the diodes on the storage disc 35;

[0060] When the heat is dried, the hot air blown from the vent 27 first contacts the air deflector 38, the cross section of the air deflector 38 is semicircular, and the air deflector 38 is in the shape of a "U", so the hot air contacting the air deflector 38 flows to the upward two sides of the storage plate 37, and the plurality of storage plates 37 are stacked, so that the stacked air deflectors 38 make the hot air blown between the two air deflectors 38 flow in a spiral rotation direction to accelerate through the U-shaped cavity provided in the drying box 22, and the spiral flow direction of the air can quickly dry the diodes, and when the hot air in the ring flow contacts the inner wall of the drying box 22, it will quickly enter the exhaust assembly 5 by fitting the U-shaped cavity of the drying box 22.

[0061] When the hot air contacts the inner wall of the drying box 22, the heat absorbing sheet 36 can quickly absorb a large amount of heat energy in the hot air and transfer it to the heat conducting plate 30, and then to the storage plate 37 through the heat conducting plate 30, and the storage plate 37 transfers the heat to the storage disc 35, so that the diodes can be quickly tempered to the same temperature as the temperature in the drying box 22, and the diodes can be preheated when drying, which can protect the diode chips and improve the drying efficiency.

[0062] Further use method of the embodiment

[0063] In use, the hot air first contacts the air deflector 38, which can absorb the heat energy in the hot air and transfer it to the storage plate 37, and then to the diodes in the storage disc 35 through the storage plate 37, and the heat absorbing sheet 36 and the heat conducting plate 30 can both absorb the heat in the hot air and transfer it to the diodes, which can quickly dry the diodes, and the special shape of the air deflector 38 can change the flow direction of the hot air, making the hot air in the shape of a vortex to dry the diodes, thereby accelerating the drying speed of the diodes and increasing the drying effect of the drying device. Furthermore, the U-shaped structure of the drying box 22 can make the hot air flow quickly inside the drying box 22, further improving the drying efficiency of the diodes.

[0064] Finally, it should be noted that the above description is only a preferred embodiment of the present application and is not intended to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A drying device for diode processing, comprising a power supply box (1), characterized in that: The power box (1) is provided with a drying assembly (2) for efficiently heating diodes, the inside of the drying assembly (2) is provided with a placing assembly (3) for placing diodes and ensuring uniform heating of the diodes, one side of the drying assembly (2) is provided with an air inlet assembly (4) which is through the inside of the drying assembly (2) and continuously injects air, one side of the drying assembly (2) is provided with an exhaust assembly (5) which exhausts waste gas and filters the waste gas; The drying assembly (2) comprises a drying box (22) and a partition block (20) arranged inside the drying box (22) to control the direction of hot air, the outer surface of the drying box (22) is sleeved with a heat preservation box (21) fixedly connected with the power box (1), one side of the heat preservation box (21) is provided with a heat preservation cover (24) cooperating with the partition block (20) to control the direction of hot air. The heat preservation box (21) is provided with a dismounting groove on the top, and the inside of the dismounting groove is provided with a dismounting cover (23), the drying box (22) is in the shape of "U", and the partition block (20) is arranged in the "U" type cavity of the drying box (22), the inside of the partition block (20) is provided with two connecting plates (28), a plurality of heating plates (212) are arranged between the two connecting plates (28), one side of the partition block (20) is provided with a ventilation opening (27) communicating with the inside of the drying box (22), and the plurality of heating plates (212) are all inclined to one side of the ventilation opening (27), one side of the partition block (20) is provided with an air outlet (213), and the inner wall of the air outlet (213) is provided with a baffle (211). The heat preservation box (21) is rotatably connected with the heat preservation cover (24) through a hinge, the outer surface of the heat preservation cover (24) is provided with a clamping hook (25) on both sides, the two sides of the heat preservation box (21) are provided with a locking frame (29) matched with the clamping hook (25), the outer surface of the heat preservation cover (24) is provided with a pull rod in the middle, and the inner wall of the heat preservation cover (24) is provided with a sealing frame (26) matched with the drying box (22) to increase the sealing effect.

2. The drying apparatus for diode processing according to claim 1, characterized by: The air inlet assembly (4) comprises an air inlet shell (41) fixedly connected with the partition block (20) and communicating with the inside thereof, the outer surface of the air inlet shell (41) is provided with a plurality of supporting rods (42), and the plurality of supporting rods (42) are all fixedly connected with the drying box (22), and the inside of the air inlet shell (41) is provided with a fan (43).

3. The drying apparatus for diode processing according to claim 1, characterized by: The exhaust assembly (5) comprises an exhaust pipe (53) penetrating through the heat preservation box (21) and the drying box (22) and fixedly connected with the drying box (22), one side of the exhaust pipe (53) is provided with a tail gas filter pipe (52), and the outer surface of the tail gas filter pipe (52) is connected with an exhaust pipe (51) having the same angle as the air inlet shell (41).

4. The drying apparatus for diode processing according to claim 1, characterized by: The placing assembly (3) comprises four slide rails (31) fixedly connected to the inner wall of the drying box (22), four slide blocks (32) slidably installed in the four slide rails (31), a limiting groove (33) formed in the top of each of the four slide rails (31), and a limiting block (34) arranged on one side of each of the four slide blocks (32) and matched with the limiting groove (33), a plurality of heat-conducting plates (30) equally spaced are fixedly connected to one side of each of the two slide blocks (32), a plurality of heat-absorbing fins (36) are sleeved on the outer surfaces of the plurality of heat-conducting plates (30) and are equally spaced, a plurality of storage plates (37) are fixedly connected between the plurality of heat-conducting plates (30), and a storage disc (35) is placed on the upper portion of each of the plurality of storage plates (37).

5. The drying apparatus for diode processing according to claim 4, characterized by: The inner wall of the storage plate (37) is fixedly connected with a wind guide plate (38), the cross section of the wind guide plate (38) is semicircular, and the wind guide plate (38) is in the shape of "U".

6. The drying apparatus for diode processing according to claim 4, characterized by: The storage disc (35) is in the shape of "U", a clamping groove is formed in the top of the storage disc (35), the heat preservation cover (24) is in the shape of a semicircular cavity, and the storage disc (35) and the heat preservation cover (24) are matched with each other.

Images