Wafer cleaning device

Abstract

The present invention proposes a wafer cleaning device, which relates to the field of semiconductor manufacturing technology, including a cabinet, wherein the cabinet is provided with a moving component for moving wafers out of or into a slot body to facilitate cleaning of the wafers, and the cabinet is provided with a conveying component for cooperating with the moving component to convey wafers from one slot body to another slot body to facilitate cleaning of the wafers. The wafer cleaning device facilitates moving wafers into the slot body for cleaning and removing wafers from the slot body after cleaning through the action of the moving component, facilitates moving wafers located in one slot body to another slot body through the action of the conveying component, and facilitates transferring wafers among multiple slot bodies through the cooperation of the moving component and the conveying component, thereby improving the wafer cleaning efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor manufacturing, and in particular to a wafer cleaning device. Background Art

[0002] In the manufacturing process of some integrated circuits, chemical mechanical polishing and etching are important process steps in the semiconductor manufacturing process. After the chemical mechanical polishing process or the etching process is completed, it is usually necessary to clean the polished and etched wafers to remove residues on the wafer surface.

[0003] When cleaning the wafer, the wafer needs to be placed in a tank with a specific solution for ultrasonic cleaning or acidic solution rinsing. After cleaning, the wafer needs to be taken out of the tank solution and moved to the next tank for further cleaning. During the cleaning process, the connected tanks are placed horizontally.

[0004] The original mechanism uses a claw clamp robot arm in conjunction with a cylinder or a screw to grab the wafer and move the wafer up and down in the tank body, and moves the wafer that has been removed from the tank body and cleaned from one tank to another, and then moves the wafer into the tank for cleaning.

[0005] However, the existing wafer handling method has problems such as unstable operation, only a single wafer can be cleaned at a time, wafer cleaning is time-consuming and inefficient. Summary of the invention

[0006] In order to overcome the shortcomings of the prior art, the present invention proposes a wafer cleaning device, comprising a cabinet and a trough assembly for cleaning wafers, the cabinet is provided with a moving assembly for moving wafers out of or into the trough to facilitate cleaning of the wafers, and the cabinet is provided with a transport assembly that cooperates with the moving assembly to transport wafers from one trough to another to facilitate cleaning of the wafers.

[0007] To achieve the above-mentioned purpose, the moving component facilitates the movement of the wafer into the tank body for cleaning, and facilitates the movement of the wafer out of the tank body after cleaning. The transporting component facilitates the movement of the wafer located in one tank body to another tank body. The cooperation of the moving component and the transporting component facilitates the transfer of wafers among multiple tank bodies, thereby improving the wafer cleaning efficiency.

[0008] Furthermore, the trough body assembly includes a cleaning trough for cleaning wafers, a first hot water washing trough and a second hot water washing trough, which are located in the cabinet and arranged in sequence from left to right. The cleaning trough, the first hot water washing trough and the second hot water washing trough are arranged in sequence along the moving direction of the wafer. The transport assembly includes a first grabbing assembly, a second grabbing assembly, a third grabbing assembly and a fourth grabbing assembly. The moving assembly includes a first lifting assembly, a second lifting assembly and a third lifting assembly.

[0009] Through the above technical scheme, a mixed liquid of H2SO4+H2O2 is provided in the cleaning tank, and the mixed liquid of H2SO4+H2O2 is heated to an extremely high temperature to meet the process requirements, so as to facilitate the cleaning of the wafer after grinding and etching. The chemical solution and pollutants on the surface of the wafer are washed away by the arrangement of the first hot water washing tank and the second hot water washing tank, and the use of hot water can reduce the possibility of local heat release of high concentration H2SO4 when encountering cold water and causing damage to the wafer. The first grabbing component is used for feeding and is located on the far left of the cabinet. The first lifting component is located next to the cleaning tank. The first grabbing component is used to facilitate the transport of the wafer to the first lifting component. The first lifting component is used to facilitate the movement of the wafer to the cleaning tank for cleaning. The second lifting component is used to facilitate the transport of the wafer to the first lifting component. The component is located next to the first hot water washing tank, the second grabbing component is located next to the second lifting component, the second grabbing component is used to move the wafers cleaned on the first lifting component to the second lifting component, and the second lifting component is used to move the wafers into the first hot water washing tank for cleaning, the third lifting component is located next to the second hot water washing tank, the third grabbing component is located next to the third lifting component, and the third lifting component is located on the rightmost side of the cabinet, the third grabbing component is used to transport the wafers on the second lifting component to the third lifting component, and the third lifting component is used to move the wafers into the second hot water washing tank for cleaning, and the fourth grabbing component is used to move the wafers cleaned on the third lifting component out of the cabinet to facilitate the unloading of the wafers.

[0010] Furthermore, the first grasping component includes a Y-platform, and ear-type supports are fixedly provided at the four end corners of the upper surface of the Y-platform, and every two adjacent ear-type supports are rotatably connected with a flip shaft through a support bearing, one end of the flip shaft extends out of one of the ear-type supports, and one end of the flip shaft extending out of the ear-type support is fixedly connected to a gripper connecting block, and a mechanical gripper for grasping the wafer is fixedly connected to the gripper connecting block, and two adjacent flip shafts are sleeved with connecting plates that serve to limit the flip shaft, and a flip component for driving the mechanical gripper to rotate to clamp the wafer is provided on the Y-platform.

[0011] Through the above technical scheme, a limiting groove adapted to the wafer is opened on the mechanical gripper, and the limiting groove facilitates the stable placement of multiple wafers on the mechanical gripper, and the spacing between several wafers is the same. The connecting plate plays a limiting role on the two flip axes and the gripper connecting block, so that the two gripper connecting blocks always maintain the same distance, and the distance will not increase or decrease under the action of external force to affect the gripping force of the mechanical gripper on the wafer. The two flip axes are driven to rotate towards each other through the action of the flip assembly, and the rotation of the two flip axes will drive the gripper connecting block fixedly connected to the flip axes to rotate, and the rotation of the gripper connecting block drives the rotation of the mechanical gripper fixedly connected to the gripper connecting block, and two adjacent mechanical grippers clamp the wafer to facilitate grabbing the wafer, and then facilitate moving and transporting the wafer.

[0012] Furthermore, the flip assembly includes a flip plate nested on the circumferential outer wall of the flip shaft, the flip plate is fixedly connected to the flip shaft, and a follower wheel is movably connected to the upper surface of the flip plate, and the two flip plates are fixedly connected by a pre-stressed spring, and the two pre-stressed springs are respectively located on both sides of the follower wheel, and a cam plate located between the pre-stressed spring and the Y platform is provided between two adjacent flip plates, and a slope surface is provided on the side of the cam plate close to the flip plate, and the outer surface of the follower wheel contacts the slope surface of the cam plate, and the diameter of the end of the cam plate close to the mechanical gripper is smaller than the diameter of the end of the cam plate away from the mechanical gripper, and a guide rod cylinder for pushing the cam plate to move is fixedly provided on the Y platform.

[0013] Through the above technical solution, the flip plate will fall around the flip axis due to gravity and the deviation of its own center of gravity, the pre-stressed spring will make the two flip blocks fixedly connected, and the flip block will not fall completely under the action of the pre-stressed spring, and the cam plate will be pushed to slide on the Y platform through the action of the guide rod cylinder, and the cam plate is slidably connected to the Y platform. When the cam plate moves toward the direction of the mechanical gripper, the cam plate will make the two follower wheels move away from each other, increasing the distance between the two follower wheels, the pre-stressed spring is stretched, and the flip plate flips outward, and the rotation of the flip plate will drive the flip axis fixedly connected to the flip plate to rotate, and the rotation of the flip axis drives the The connected gripper connecting block rotates, which in turn drives the mechanical gripper fixedly connected to the gripper connecting block to rotate. The two mechanical grippers tighten inward to facilitate clamping the wafer. The rotation angle of the mechanical gripper can be adjusted according to the size of the wafer, and then the preload force of the mechanical gripper can be adjusted. It is suitable for wafers of different sizes, improves the stability of grasping the wafer, and reduces the possibility of wafer damage. When the wafer needs to be released, the cam plate is driven by the guide rod cylinder to move away from the mechanical gripper. The movement of the mechanical gripper will cause the preload spring to rebound and the flip plate to rotate, thereby causing the flip axis to rotate inward, thereby driving the mechanical gripper to expand outward to facilitate the release of the wafer.

[0014] Furthermore, a top plate is provided below the Y platform, and a Y-axis driving assembly is provided on the top plate for driving the Y platform to move on the Y axis so that the mechanical gripper can grab wafers at different positions on the Y axis, and the Y-axis driving assembly includes two fixed seats located on the upper surface of the Y axis, a Y-axis screw rod is rotatably connected between the two fixed seats, one end of the Y-axis screw rod extends out of one of the fixed seats, a Y-axis motor is fixedly provided on the upper surface of the top plate and is located beside the Y-axis screw rod, and the output shaft end of the Y-axis motor and the part of the Y-axis screw rod extending out of one of the fixed seats are both embedded with a Y A Y-axis pulley, two Y-axis pulleys are provided with Y-axis synchronous belts adapted thereto, a Y-axis sliding block is provided on the outer side of the Y-axis lead screw through a threaded sleeve, the Y-axis sliding block is fixedly connected to the Y-platform on the side away from the top plate, a Y-axis guide assembly is provided on the top plate for guiding the movement of the Y-platform, the guide assembly comprises two Y-axis line rails respectively arranged on both sides of the upper surface of the top plate, the Y-axis line rail is fixedly connected to the top plate, a Y-axis slider is provided on the Y-axis line rail for sliding connection with the Y-axis line rail, and the Y-axis slider is fixedly connected to the Y-platform on the side away from the Y-axis line rail.

[0015] Through the above technical scheme, the Y-axis motor will drive the Y-axis pulley fixedly connected to the Y-axis motor to rotate, the two Y-axis pulleys and the Y-axis synchronous belt are adapted to each other, the rotation of the Y-axis pulley will drive the rotation of the Y-axis synchronous belt, the rotation of the Y-axis synchronous belt will drive the Y-axis pulley fixedly connected to the Y-axis lead screw to rotate, the rotation of the Y-axis pulley will drive the Y-axis lead screw to rotate, through the action of the thread, the rotation of the Y-axis lead screw will drive the movement of the Y-axis sliding block, the Y-axis sliding block is slidingly connected to the top plate, the movement of the Y-axis sliding block will drive the movement of the Y-platform fixedly connected to the Y-axis sliding block, through the cooperation of the Y-axis axis rail and the Y-axis slider, the sliding of the Y-platform is guided, the possibility of the Y-platform escaping from the top plate is reduced, and the sliding stability of the Y-platform is improved.

[0016] Furthermore, an axial vertical plate is provided below the top plate, a horizontal plate A is fixedly provided on the upper end surface of the vertical plate, a horizontal plate B is fixedly provided on the lower end surface of the vertical plate, a circular groove is provided on the horizontal plate A, an axial column is passed through the circular groove, the top end of the column is fixedly connected to the lower end surface of the top plate, a Z-axis sliding block is fixedly provided on the end of the column away from the top plate, a Z-axis driving assembly for driving the column to slide in the Z-axis direction is provided on the vertical plate, the Z-axis driving assembly includes a Z-axis screw rod located between the A horizontal plate and the B horizontal plate, the Z-axis screw rod is rotatably connected to the A horizontal plate and the B horizontal plate, the Z-axis sliding block is mounted on the Z-axis screw rod through a threaded sleeve, the bottom end of the Z-axis screw rod is passed through the B horizontal plate, A Z-axis motor located beside the Z-axis screw rod is fixedly provided on the vertical plate, and the output end of the Z-axis motor passes through the B cross plate and is rotatably connected to the B cross plate, one end of the Z-axis motor output end passing through the B cross plate and one end of the Z-axis screw rod passing through the B cross plate are both embedded with Z-axis pulleys, and the outer sides of the two Z-axis pulleys are sleeved with Z-axis synchronous belts adapted to the Z-axis pulleys, and a Z-axis guide assembly for guiding the Z-axis sliding block is provided on the vertical plate, and the Z-axis guide assembly includes two Z-axis line rails respectively located on both sides of the Z-axis sliding block, the Z-axis line rails are fixedly connected to the vertical plate, and a Z-axis slider slidingly connected to the Z-axis line rail is sleeved on the Z-axis line rail, and the Z-axis slider is fixedly connected to the Z-axis sliding block.

[0017] Through the above technical scheme, the Z-axis motor drives the Z-axis pulley fixedly connected to the output shaft of the Z-axis motor to rotate, and the rotation of the Z-axis pulley drives the Z-axis synchronous belt matched with it to rotate, and the rotation of the Z-axis synchronous belt drives another Z-axis pulley to rotate, and the other Z-axis pulley drives the Z-axis lead screw fixedly connected to it to rotate. Through the action of the thread, the rotation of the Z-axis lead screw drives the Z-axis sliding block threadedly connected to the Z-axis lead screw to slide in the vertical direction, and while the Z-axis sliding block moves in the vertical direction, it drives the Z-axis slider fixedly connected to the Z-axis sliding block to move on the Z-axis line rail, and the movement of the Z-axis slider is guided by the action of the Z-axis line rail, and the movement of the Z-axis sliding block is guided by the cooperation of the Z-axis line rail and the Z-axis slider.

[0018] Furthermore, a horizontal rack is fixedly provided on one side of the cabinet body near the cleaning tank, the first hot water washing tank and the second hot water washing tank, and an X-axis driving assembly is provided on the vertical plate to cooperate with the rack to drive the vertical plate to move in the X-axis direction, and the X-axis driving assembly includes a square slot opened on the vertical plate, an X-axis motor is fixedly provided on the vertical plate and is located next to the column, an A gear is fixedly provided on the output shaft end of the X-axis motor, a B gear meshing with the A gear is provided on the side of the A gear close to the vertical plate, the B gear is rotatably connected to the vertical plate, the B gear passes through the vertical plate through the square slot, and the B gear is provided on the vertical plate. The part of the gear passing through the vertical plate is meshed with the rack. The cabinet is provided with an X-axis guide assembly that guides the movement of the vertical plate on the X-axis. The X-axis guide assembly includes two X-axis line rails located on the cabinet, and the X-axis line rails are fixedly connected to the cabinet. The two X-axis line rails are respectively located on the upper and lower sides of the rack. Four X-axis sliders are fixedly provided on the side of the vertical plate away from the column. The X-axis sliders are sleeved on adjacent X-axis line rails and slidably connected to the X-axis line rails. The first grabbing assembly, the second grabbing assembly, the third grabbing assembly and the fourth grabbing assembly have the same structure.

[0019] Through the above technical solution, the sliding of the vertical plate on the X-axis will drive the X-axis slider to slide on the X-axis line rail. The X-axis line rail guides the movement of the X-axis slider. The X-axis line rail and the X-axis slider guide the sliding of the vertical plate in the X-axis direction, thereby improving the stability of the vertical plate in the X-axis direction and reducing the possibility of the vertical plate detaching from the cabinet.

[0020] Furthermore, the first lifting assembly includes a cross bar, a connecting rod is fixedly provided at one end of the cross bar away from the cabinet, a weight-reducing groove is provided on the connecting rod, two return plates for placing wafers are fixedly provided at one end of the connecting rod away from the cross bar, two support rods for supporting the wafers are fixedly provided in the return plates, the cross-sections of the return plates and the support rods are both arc-shaped, and a plurality of serrated grooves are provided on the upper surfaces of the return plates and the support rods, and the spacing between the plurality of serrated grooves is the same.

[0021] Through the above technical solution, the weight of the connecting rod is reduced through the effect of the weight-reducing groove, and the burden of the connecting rod is lightened. The cross-sections of the return plate and the support rod are both arc-shaped, so as to fit the disc shape of the wafer. Through the effect of the serrated groove, each wafer can be placed independently and several wafers can be kept at the same distance.

[0022] Furthermore, a square plate A is fixedly provided at one end of the cross bar away from the connecting rod, and a square plate B located on one side of the cross bar is fixedly provided on the square plate A, the long side direction of the square plate A is perpendicular to the long side direction of the square plate B, the long side direction of the square plate B is parallel to the long side direction of the cross bar, the bottom end of the square plate B is flush with the cross bar, an adjustment platform is provided below the square plate B and the cross bar, and an adjustment component is provided on the adjustment platform for adjusting the movement of the cross bar in the Y-axis direction, and the adjustment component includes a positioning block located in the middle position of the upper surface of the adjustment platform, two guide columns are passed through the positioning block, and the two ends of the guide columns passing through the positioning block are fixedly connected to the cross bar and the square plate B respectively, and two fixing plates are fixedly provided on the upper surface of the adjustment platform, and the two fixing plates are respectively located on the side of the cross bar and the square plate B away from the positioning block, a threaded groove is provided on the fixing plate, and a bolt is threadedly connected in the threaded groove, the bolt passes through the fixing plate, and the ends of the two bolts respectively contact the cross bar and the square plate B.

[0023] Through the above technical solution, the cross bar and the B square plate are fixedly connected by the action of the guide column, and at the same time, they guide the movement of the cross bar and the B square plate in the Y-axis direction. When the position of the cross bar on the Y-axis needs to be adjusted, the staff manually pushes the cross bar to move the cross bar to a suitable position in the Y-axis direction. Then the staff grabs the bolt and manually turns the bolt. Through the action of the thread, the bolt moves during the rotation process, and the ends of the two bolts respectively contact the side of the cross bar and the B square plate away from the positioning block to facilitate the positioning of the cross bar. The bolts are specifically M8 bolts.

[0024] Furthermore, the cabinet is provided with a control component that drives the adjustment platform to move in a vertical direction, and the control component includes a bracket fixedly connected to the cabinet, the bracket is rotatably connected to a control screw, the bracket is fixedly provided with a control motor located beside the control screw, the output shaft end of the control motor and one end of the control screw are both embedded with control pulleys, and the two control pulleys are both sleeved with control synchronous belts that match the control pulleys, the outer side of the control screw is sleeved with a control sliding block through a threaded sleeve, a movable plate is fixedly provided on the control sliding block, the top of the movable plate is fixedly connected to the adjustment platform, and control sliders are fixedly provided at the four end corners of the outer periphery of the control sliding block, and a control linear rail located beside the control screw is fixedly provided on the bracket, the control slider is sleeved on the control linear rail and is slidably connected to the control linear rail, and the first lifting assembly, the second lifting assembly and the third lifting assembly have the same structure.

[0025] Through the above technical scheme, the control motor will drive the control pulley fixedly connected to the output shaft end of the control motor to rotate, and the rotation of the control pulley will drive the control synchronous belt sleeved on the outside of the control pulley to rotate, and the rotation of the control synchronous belt will drive another control pulley to rotate, and the rotation of the other control pulley will drive the control screw fixedly connected to it to rotate, and the rotation of the control screw will drive the control sliding block threadedly connected to the control screw to move in the vertical direction, and the movement of the control sliding block will drive the movement of the control sliding block fixedly connected to the control sliding block, and the cooperation of the control sliding block and the control linear rail will guide the movement of the control sliding block, and the movement of the control sliding block will drive the movement of the moving plate fixedly connected to the control sliding block, and the movement of the moving plate in the vertical direction will drive the movement of the adjustment platform fixedly connected to the moving plate, thereby driving the movement of the wafer in the vertical direction.

[0026] In summary, the present invention has the following technical effects:

[0027] (1) The wafer cleaning device facilitates moving wafers into a tank for cleaning and removing wafers from the tank after cleaning through the action of a moving component. The wafers located in one tank can be moved to another tank through the action of a transporting component. The cooperation of the moving component and the transporting component facilitates the transfer of wafers among multiple tanks, thereby improving the wafer cleaning efficiency.

[0028] (2) The wafer cleaning device has a mixed liquid of H2SO4+H2O2 in the cleaning tank, and the mixed liquid of H2SO4+H2O2 is heated to an extremely high temperature to meet the process requirements, so as to facilitate the cleaning of the wafer after grinding and etching. The first hot water cleaning tank and the second hot water cleaning tank are provided to wash away the liquid and pollutants on the surface of the wafer, and the use of hot water can reduce the possibility of local heat release caused by high concentration of H2SO4 encountering cold water and causing damage to the wafer. The first grabbing component is used for feeding and is located on the leftmost side of the cabinet. The first lifting component is located next to the cleaning tank. The first grabbing component is used to facilitate the transfer of the wafer to the first lifting component. The first lifting component is used to facilitate the movement of the wafer to the cleaning tank for cleaning. The second lifting component is used to facilitate the transfer of the wafer to the first lifting component. The lifting assembly is located beside the first hot water washing tank, and the second grabbing assembly is located beside the second supporting assembly. The second grabbing assembly is used to move the wafers cleaned on the first supporting assembly to the second supporting assembly, and the second lifting assembly is used to move the wafers into the first hot water washing tank for cleaning. The third lifting assembly is located beside the second hot water washing tank, and the third grabbing assembly is located beside the third supporting assembly. The third supporting assembly is located at the rightmost side of the cabinet. The third grabbing assembly is used to transport the wafers on the second supporting assembly to the third lifting assembly, and the third lifting assembly is used to move the wafers into the second hot water washing tank for cleaning. The fourth grabbing assembly is used to move the cleaned wafers on the third lifting assembly out of the cabinet to facilitate the unloading of the wafers.

[0029] (3) The wafer cleaning device has the same structure as the first gripping component, the second gripping component, the third gripping component and the fourth gripping component, and the two flipping shafts are driven to rotate toward each other through the action of the flipping component. The rotation of the two flipping shafts will drive the gripper connecting block fixedly connected to the flipping shaft to rotate. The rotation of the gripper connecting block drives the rotation of the mechanical gripper fixedly connected to the gripper connecting block. Two adjacent mechanical grippers clamp the wafer to facilitate the movement and transportation of the wafer. The pre-tightening force of the mechanical gripper can be adjusted through the action of the flipping component. It is suitable for transporting wafers of different sizes, improves the stability of grasping the wafer, and reduces the possibility of wafer breakage.

[0030] (4) In the wafer cleaning device, the first grasping assembly, the second grasping assembly, the third grasping assembly and the fourth grasping assembly can all move on the X-axis, the Y-axis and the Z-axis, so as to facilitate the wafer handling and improve the cleaning efficiency.

[0031] (5) In the wafer cleaning device, multiple wafers can be stably placed by supporting the sawtooth grooves and the return plate. The sawtooth grooves increase the friction between the return plate and the wafers, thereby improving the safety of the wafers. Through the action of the sawtooth grooves, each wafer can be placed independently and maintain the same distance, thereby reducing the possibility of scratching the wafer surface due to contact between the wafer and the connecting rod or friction between multiple wafers, and also reducing the possibility of the wafer falling off the return plate during movement. At the same time, the number of wafers cleaned is increased, and the cleaning efficiency is improved. The setting of the return plate does not affect the cleaning of the wafer, thereby reducing cleaning dead angles.

[0032] (6) The wafer cleaning device adjusts the positions of the crossbar, the connecting rod and the return plate on the Y-axis through the action of the adjusting component, thereby adjusting the position of the wafer on the return plate on the Y-axis. The control component controls the adjustment platform to move in the vertical direction, thereby driving the crossbar on the adjustment platform to move in the vertical direction, thereby driving the wafer on the crossbar to move in the vertical direction, so as to control the wafer to move up and down in the tank. When the wafer moves down, it is convenient to move the wafer into the cleaning tank for cleaning. When the wafer moves up, the wafer that has been cleaned is separated from the cleaning tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present invention will be further described and explained below in conjunction with the accompanying drawings.

[0034] Figure 1 It is a schematic diagram of the overall structure of the preferred embodiment of the present invention;

[0035] Figure 2 It is a schematic diagram of the overall top view structure of the present invention;

[0036] Figure 3 It is a schematic diagram of the structure of the column used in the present invention;

[0037] Figure 4 It is a schematic diagram of the structure of the Z-axis synchronous belt used in the present invention;

[0038] Figure 5 It is a schematic diagram of the structure of the X-axis slider of the present invention;

[0039] Figure 6 It is a schematic diagram of the structure of the flip plate of the present invention;

[0040] Figure 7 The present invention Figure 1 The enlarged structural diagram at A in the middle;

[0041] Figure 8 It is a schematic diagram of the structure of the Y-axis sliding block of the present invention;

[0042] Fig. 9 It is a schematic diagram of the structure of the hollow groove of the present invention;

[0043] Fig.10 It is a schematic diagram of the structure of the present invention for embodying the sawtooth groove;

[0044] Fig.11 It is a schematic diagram of the structure of the positioning block of the present invention;

[0045] Fig.12 It is a schematic diagram of the structure of the return plate used in the present invention.

[0046] Reference numerals: 1, cabinet; 101, cleaning tank; 102, first hot water washing tank; 103, second hot water washing tank; 2, handling assembly; 201, first grabbing assembly; 202, second grabbing assembly; 203, third grabbing assembly; 204, fourth grabbing assembly; 205, Y platform; 206, ear support; 207, flip shaft; 208, gripper connecting block; 209, mechanical gripper; 210, connecting plate; 211, flip assembly; 21101, flip plate; 21102, follower wheel; 21103, pre- Compression spring; 21104, cam plate; 21105, ramp surface; 21106, guide rod cylinder; 212, top plate; 213, Y-axis drive assembly; 21301, fixed seat; 21302, Y-axis screw rod; 21303, Y-axis motor; 21304, Y-axis pulley; 21305, Y-axis synchronous belt; 21306, Y-axis sliding block; 214, Y-axis guide assembly; 21401, Y-axis axis rail; 21402, Y-axis slider; 3, moving assembly; 301, first lifting assembly; 302, second lifting Component; 303, third lifting component; 4, vertical plate; 401, A horizontal plate; 402, B horizontal plate; 403, circular groove; 404, column; 405, Z-axis drive component; 40501, Z-axis sliding block; 40502, Z-axis screw rod; 40503, Z-axis motor; 40504, Z-axis pulley; 40506, Z-axis synchronous belt; 406, Z-axis guide component; 40601, Z-axis axis rail; 40602, Z-axis slider; 5, rack; 501, X-axis drive component; 50101, square groove; 50 102, X-axis motor; 50103, A gear; 50104, B gear; 502, X-axis guide assembly; 50201, X-axis axis rail; 50202, X-axis slider; 6, crossbar; 601, connecting rod; 602, hollow groove; 603, return plate; 604, support rod; 605, serrated groove; 606, A square plate; 607, B square plate; 608, adjustment platform; 7, adjustment assembly; 701, positioning block; 702, guide column; 703, fixing plate; 704, bolt; 8, control assembly. DETAILED DESCRIPTION

[0047] The technical solution of the present invention will be more clearly and completely explained below through description of preferred embodiments of the present invention in combination with the accompanying drawings.

[0048] like Figure 1-12 As shown, a wafer cleaning device in a preferred embodiment of the present invention includes a cabinet 1 and a tank assembly for cleaning wafers, the tank assembly includes a cleaning tank 101 for cleaning wafers, a first hot water washing tank 102 and a second hot water washing tank 103, which are located in the cabinet 1 and arranged from left to right, and the cleaning tank 101, the first hot water washing tank 102 and the second hot water washing tank 103 are arranged in sequence along the moving direction of the wafer.

[0049] like Figure 1 and Figure 2 A mixed liquid of H2SO4+H2O2 is provided in the cleaning tank 101, and the mixed liquid of H2SO4+H2O2 is heated to an extremely high temperature to meet the process requirements, so as to facilitate the cleaning of the wafer after grinding and etching. The chemical solution and pollutants on the surface of the wafer are washed away by the setting of the first hot water washing tank 102 and the second hot water washing tank 103, and the use of hot water can reduce the possibility of local heat release of high concentration H2SO4 when encountering cold water and causing damage to the wafer.

[0050] like Figure 1 and Figure 2 A transport component 2 for transporting wafers is provided on the cabinet 1, and the transport component 2 includes a first grabbing component 201, a second grabbing component 202, a third grabbing component 203 and a fourth grabbing component 204. A moving component 3 for cooperating with the transport component 2 to move wafers is provided on the cabinet 1, and the moving component 3 includes a first lifting component 301, a second lifting component 302 and a third lifting component 303.

[0051] like Figure 1 and Figure 2 The first grabbing assembly 201 is used for feeding and is located on the leftmost side of the cabinet 1. The first lifting assembly 301 is located next to the cleaning tank 101. The first grabbing assembly 201 facilitates the transport of the wafer to the first lifting assembly 301, and the first lifting assembly 301 facilitates the movement of the wafer into the cleaning tank 101 for cleaning.

[0052] like Figure 1 and Figure 2 The second lifting component 302 is located next to the first hot water washing tank 102, and the second grabbing component 202 is located next to the second lifting component 302. The second grabbing component 202 is used to transfer the wafer on the first lifting component 301 to the second lifting component 302, and the second lifting component 302 is used to move the wafer into the first hot water washing tank 102 for cleaning.

[0053] like Figure 1 and Figure 2The third lifting component 303 is located next to the second hot water washing tank 103, the third grabbing component 203 is located next to the third lifting component 303, and the third lifting component 303 is located at the rightmost side of the cabinet 1. The third grabbing component 203 is used to transport the wafer on the second lifting component 302 to the third lifting component 303, and the third lifting component 303 is used to move the wafer into the second hot water washing tank 103 for cleaning. The fourth grabbing component 204 is used to move the cleaned wafer on the third lifting component 303 out of the cabinet 1 to facilitate the unloading of the wafer.

[0054] like Figure 5 and Figure 6 The first grabbing component 201 includes a Y platform 205, and ear-type supports 206 are fixedly provided at the four end corners of the upper surface of the Y platform 205. Every two adjacent ear-type supports 206 are rotatably connected with a flip shaft 207 through a support bearing, and one end of the flip shaft 207 extends out of one of the ear-type supports 206, and one end of the flip shaft 207 extending out of the ear-type support 206 is fixedly connected to a gripper connecting block 208, and a mechanical gripper 209 for grabbing wafers is fixedly connected to the gripper connecting block 208, and a limiting groove adapted to the wafer is provided on the mechanical gripper 209, and the limiting groove facilitates the stable placement of multiple wafers on the mechanical gripper 209, and the spacing between several wafers is the same, and a connecting plate 210 that limits the flip shaft 207 is sleeved on the two flip shafts 207. The connecting plate 210 is rotatably connected, and the connecting plate 210 plays a limiting role on the two flip shafts 207 and the gripper connecting block 208, so that the two gripper connecting blocks 208 always maintain the same distance, and the distance will not increase or decrease under the action of external force to affect the gripping effect of the mechanical gripper 209 on the wafer. A flip component 211 is provided on the Y platform 205 to drive the mechanical gripper 209 to rotate to clamp the wafer. The two flip shafts 207 are driven to rotate towards each other through the action of the flip component 211. The rotation of the two flip shafts 207 will drive the gripper connecting block 208 fixedly connected to the flip shaft 207 to rotate. The rotation of the gripper connecting block 208 drives the mechanical gripper 209 fixedly connected to the gripper connecting block 208 to rotate. Two adjacent mechanical grippers 209 clamp the wafer to facilitate the movement and transportation of the wafer.

[0055] like Figure 3 , Figure 4 , Figure 5 and Figure 6The flip assembly 211 includes a flip plate 21101 nested on the outer wall of the circumference of the flip shaft 207, the flip plate 21101 is fixedly connected to the flip shaft 207, and a follower wheel 21102 is movably connected to the upper surface of the flip plate 21101. The two flip plates 21101 are fixedly connected by a pre-compression spring 21103, and the two pre-compression springs 21103 are respectively located on both sides of the follower wheel 21102. A cam plate 21104 located between the pre-compression spring 21103 and the Y platform 205 is provided between two adjacent flip plates 21101, and a slope surface 21105 is provided on the side of the cam plate 21104 close to the flip plate 21101. The outer surface of the follower wheel 21102 The surface of the cam plate 21104 contacts with the slope surface 21105 of the cam plate 21104. The diameter of the end of the cam plate 21104 close to the mechanical gripper 209 is smaller than the diameter of the end of the cam plate 21104 away from the mechanical gripper 209. A guide rod cylinder 21106 is fixed on the Y platform 205 to push the cam plate 21104 to move. The flip plate 21101 will fall around the flip axis 207 due to gravity and the deviation of its own center of gravity. The preload spring 21103 will fix the two flip plates 21101 in connection, and the flip plate 21101 will not fall completely under the action of the preload spring 21103. The cam plate 21104 is pushed on the Y platform 205 by the action of the guide rod cylinder 21106. The platform 205 slides, and the cam plate 21104 is slidably connected with the Y platform 205. When the cam plate 21104 moves toward the direction of the mechanical gripper 209, the cam plate 21104 will make the two follower wheels 21102 move away from each other, increasing the distance between the two follower wheels 21102. The preload spring 21103 is stretched, and the flip plate 21101 flips outward. The rotation of the flip plate 21101 will drive the flip shaft 207 fixedly connected to the flip plate 21101 to rotate, and the rotation of the flip shaft 207 will drive the gripper connecting block 208 fixedly connected to the flip shaft 207 to rotate, and then drive the mechanical gripper 21102 fixedly connected to the gripper connecting block 208 09 rotates, and the two mechanical grippers 209 are tightened inward to facilitate clamping the wafer. The rotation angle of the mechanical gripper 209 can be adjusted according to the size of the wafer, and then the preload force of the mechanical gripper 209 can be adjusted. It is suitable for wafers of different sizes, improves the stability of grasping the wafer, and reduces the possibility of wafer damage. When the wafer needs to be released, the cam plate 21104 is driven by the guide rod cylinder 21106 to move away from the mechanical gripper 209. The movement of the mechanical gripper 209 will cause the preload spring 21103 to rebound and the flip plate 21101 to rotate, thereby causing the flip shaft 207 to rotate inward, thereby driving the mechanical gripper 209 to expand outward to facilitate the release of the wafer.

[0056] like Figure 6 and Figure 8A top plate 212 is provided below the Y platform 205, and a Y-axis driving component 213 is provided on the top plate 212 for driving the Y platform 205 to move on the Y axis so that the mechanical gripper 209 can grab wafers at different positions on the Y axis. The Y-axis driving component 213 can drive the Y platform 205 to slide on the Y axis, and the movement of the Y platform 205 will drive the mechanical gripper 209 on the Y platform 205 to slide on the Y axis, so that the mechanical gripper 209 can grab wafers at different positions.

[0057] like Figure 6 and Figure 8 The Y-axis driving assembly 213 includes two fixed seats 21301 located on the upper surface of the Y-axis, a Y-axis screw rod 21302 is rotatably connected between the two fixed seats 21301, one end of the Y-axis screw rod 21302 extends out of one of the fixed seats 21301, and a Y-axis motor 21303 located beside the Y-axis screw rod 21302 is fixed on the upper surface of the top plate 212, and the output shaft end of the Y-axis motor 21303 and the Y-axis screw rod 21302 extend out of one of the fixed seats 21301. The fixed seat 21301 is embedded with Y-axis pulleys 21304, and the two Y-axis pulleys 21304 are sleeved with Y-axis synchronous belts 21305 adapted thereto. The outer side of the Y-axis lead screw 21302 is sleeved with a Y-axis sliding block 21306 through a threaded sleeve, and the side of the Y-axis sliding block 21306 facing away from the top plate 212 is fixedly connected to the Y platform 205. The top plate 212 is provided with a Y-axis guide component 214 that guides the movement of the Y platform 205. The Y-axis motor 21303 drives the Y-axis pulley 21304 fixedly connected to the Y-axis motor 21303 to rotate. The two Y-axis pulleys 21304 and the Y-axis synchronous belt 21305 are adapted to each other. The rotation of the Y-axis pulley 21304 drives the rotation of the Y-axis synchronous belt 21305. The rotation of the Y-axis synchronous belt 21305 drives the Y-axis pulley 21304 fixedly connected to the Y-axis screw rod 21302 to rotate. The rotation of the Y-axis screw rod 21302 will drive the rotation of the Y-axis screw rod 21302. Through the action of the thread, the rotation of the Y-axis screw rod 21302 will drive the movement of the Y-axis sliding block 21306. The Y-axis sliding block 21306 is slidingly connected to the top plate 212. The movement of the Y-axis sliding block 21306 will drive the Y platform 205 fixedly connected to the Y-axis sliding block 21306 to move. The Y-axis guide assembly 214 plays a guiding and supporting role in the movement of the Y-axis sliding block 21306.

[0058] like Figure 8The Y-axis guide assembly 214 includes two Y-axis rails 21401 respectively arranged on both sides of the upper surface of the top plate 212, the Y-axis rails 21401 are fixedly connected to the top plate 212, and a Y-axis slider 21402 is sleeved on the Y-axis rail 21401 and is slidably connected to the Y-axis rail 21401. The side of the Y-axis slider 21402 away from the Y-axis rail 21401 is fixedly connected to the Y platform 205. Through the cooperation of the Y-axis rail 21401 and the Y-axis slider 21402, a guiding effect is played on the sliding of the Y platform 205, the possibility of the Y platform 205 escaping from the top plate 212 is reduced, and the sliding stability of the Y platform 205 is improved. A first protection box body that protects the Y platform 205 is fixedly provided on the top plate 212, and two flip shafts 207 pass through the first protection box body and are slidably connected to the first protection box body.

[0059] like Figure 3 and Figure 4 An axial vertical plate 4 is provided below the top plate 212, an A horizontal plate 401 is fixedly provided on the upper end surface of the vertical plate 4, a B horizontal plate 402 is fixedly provided on the lower end surface of the vertical plate 4, a circular groove 403 is provided on the A horizontal plate 401, an axial column 404 is passed through the circular groove 403 on the A horizontal plate 401, the top end of the column 404 is fixedly connected to the lower end surface of the top plate 212, a Z-axis sliding block 40501 is fixedly provided on the end of the column 404 away from the top plate 212, and a driving column 404 is provided on the vertical plate 4 to move in the Z-axis The Z-axis driving component 405 that slides in the direction drives the Z-axis sliding block 40501 to slide on the Z-axis through the action of the Z-axis driving component 405. The movement of the Z-axis sliding block 40501 will drive the column 404 fixedly connected to the Z-axis sliding block 40501 to slide on the Z-axis. The sliding of the column 404 will drive the top plate 212 fixedly connected to the top of the column 404 to slide on the Z-axis, which will further drive the mechanical gripper 209 to slide on the Z-axis, so as to facilitate the grasping of wafers at different heights on the Z-axis.

[0060] like Figure 3 and Figure 4The Z-axis driving assembly 405 includes a Z-axis screw rod 40502 located between the A horizontal plate 401 and the B horizontal plate 402, the Z-axis screw rod 40502 is rotatably connected to the A horizontal plate 401 and the B horizontal plate 402, the Z-axis sliding block 40501 is set on the Z-axis screw rod 40502 through a threaded sleeve, the bottom end of the Z-axis screw rod 40502 passes through the B horizontal plate 402, and a Z-axis motor 40503 located next to the Z-axis screw rod 40502 is fixed on the vertical plate 4, and the Z-axis motor 40503 is fixed on the vertical plate 4. The output end of 3 passes through the B horizontal plate 402 and is rotatably connected to the B horizontal plate 402. One end of the output end of the Z-axis motor 40503 passes through the B horizontal plate 402 and one end of the Z-axis screw rod 40502 passes through the B horizontal plate 402 are both embedded with Z-axis pulleys 40504. The outer sides of the two Z-axis pulleys 40504 are sleeved with Z-axis synchronous belts 40506 adapted to the Z-axis pulleys 40504. The vertical plate 4 is provided with a Z-axis guide assembly 40506 that guides the Z-axis sliding block 40501. 6. The Z-axis motor 40503 drives the Z-axis pulley 40504 fixedly connected to the output shaft of the Z-axis motor 40503 to rotate. The rotation of the Z-axis pulley 40504 drives the Z-axis synchronous belt 40506 adapted thereto to rotate. The rotation of the Z-axis synchronous belt 40506 drives another Z-axis pulley 40504 to rotate. The other Z-axis pulley 40504 drives the Z-axis screw rod 40502 fixedly connected thereto to rotate. Through the action of the thread, the Z-axis The rotation of the screw rod 40502 will drive the Z-axis sliding block 40501 threadedly connected to the Z-axis screw rod 40502 to slide in the vertical direction. The movement of the Z-axis sliding block 40501 will be guided by the Z-axis guide assembly 406, thereby improving the stability of the Z-axis sliding block 40501 in the vertical direction. A second protective box body is fixed on the lower end surface of the B cross plate 402 to protect the Z-axis synchronous belt 40506 and the two Z-axis pulleys 40504.

[0061] like Figure 3 and Figure 4 The Z-axis guide assembly 406 includes two Z-axis line rails 40601 respectively located on both sides of the Z-axis sliding block 40501, the Z-axis line rails 40601 are fixedly connected to the vertical plate 4, and a Z-axis slider 40602 slidingly connected to the Z-axis line rails 40601 is sleeved on the Z-axis line rails 40601, and the Z-axis slider 40602 is fixedly connected to the Z-axis sliding block 40501. When the Z-axis sliding block 40501 moves in the vertical direction, it will drive the Z-axis slider 40602 fixedly connected to the Z-axis sliding block 40501 to move on the Z-axis line rails 40601, and the movement of the Z-axis slider 40602 is guided by the action of the Z-axis line rails 40601, and the movement of the Z-axis slider 40602 is guided by the cooperation of the Z-axis line rails 40601 and the Z-axis slider 40602.

[0062] like Figure 1 and Figure 7 A horizontal rack 5 is fixedly provided on one side of the cabinet 1 close to the cleaning tank 101, the first hot water washing tank 102 and the second hot water washing tank 103. An X-axis driving component 501 is provided on the vertical plate 4 to cooperate with the rack 5 to drive the vertical plate 4 to move in the X-axis direction. The vertical plate 4 is driven to move in the X-axis direction through the action of the X-axis driving component 501. The movement of the vertical plate 4 in the X-axis direction can drive the mechanical gripper 209 to move on the X-axis, and then can drive the wafer to move on the X-axis.

[0063] like Figure 3 and Figure 4 The X-axis driving assembly 501 includes a square groove 50101 formed on the vertical plate 4, an X-axis motor 50102 located beside the column 404 is fixedly provided on the vertical plate 4, an A gear 50103 is fixedly provided on the output shaft end of the X-axis motor 50102, a B gear 50104 meshing with the A gear 50103 is provided on the side of the A gear 50103 close to the vertical plate 4, the B gear 50104 is rotatably connected to the vertical plate 4, the B gear 50104 passes through the vertical plate 4 through the square groove 50101, and the part of the B gear 50104 passing through the vertical plate 4 is meshed with the rack 5, and an X-axis guiding assembly 502 for guiding the movement of the vertical plate 4 on the X-axis is provided on the cabinet 1, and the movement of the vertical plate 4 on the X-axis is guided by the action of the X-axis guiding assembly 502, thereby improving the stability of the vertical plate 4 moving in the X-axis direction and reducing the possibility of the vertical plate 4 falling off on the cabinet 1.

[0064] like Figure 1 and Figure 5 The X-axis guide assembly 502 includes two X-axis rails 50201 located on the cabinet 1, the X-axis rails 50201 are fixedly connected to the cabinet 1, the long sides of the two X-axis rails 50201 are parallel, the two X-axis rails 50201 are respectively located on the upper and lower sides of the rack 5, and four X-axis sliders 50202 are fixed on the side of the vertical plate 4 away from the column 404. The X-axis sliders 50202 are sleeved on the adjacent X-axis rails 50201 and are connected to the X-axis rails 50201. Sliding connection, the sliding of the vertical plate 4 on the X-axis will drive the X-axis slider 50202 to slide on the X-axis line rail 50201, and the movement of the X-axis slider 50202 is guided by the action of the X-axis line rail 50201. The sliding of the vertical plate 4 in the X-axis direction is guided by the action of the X-axis line rail 50201 and the X-axis slider 50202, thereby improving the stability of the vertical plate 4 in the X-axis direction and reducing the possibility of the vertical plate 4 escaping from the cabinet 1.

[0065] like Figure 1 and Figure 2 The first grabbing assembly 201, the second grabbing assembly 202, the third grabbing assembly 203 and the fourth grabbing assembly 204 have the same structure.

[0066] like Fig. 9 and Fig.10 and Fig.12 The first lifting component 301 includes a cross bar 6. A connecting rod 601 is fixedly arranged at one end of the cross bar 6 away from the cabinet 1. A hollow groove 602 is provided on the connecting rod 601. The hollow groove 602 reduces the weight of the connecting rod 601 and reduces the burden on the connecting rod 601. A return plate 603 for placing wafers is fixedly arranged at one end of the connecting rod 601 away from the cross bar 6. Two support rods 604 for supporting the wafers are fixedly arranged in the return plate 603. The return plate 603 and the support rods 604 can stably place the wafers and reduce the possibility of the wafers falling off. It does not affect the cleaning of the wafer, reduces cleaning dead corners, and reduces the weight of the device. The cross-sections of the return plate 603 and the support rod 604 are arc-shaped, so as to fit the disc shape of the wafer. The upper surfaces of the return plate 603 and the support rod 604 are provided with a plurality of serrated grooves 605, and the spacing between the plurality of serrated grooves 605 is the same. Through the action of the serrated grooves, the friction between the return plate 603 and the support rod 604 and the wafer is increased, so that each wafer can be placed independently and several wafers can maintain the same distance.

[0067] like Fig. 9 and Fig.10 and Fig.11 A square plate A 606 is fixedly arranged at one end of the cross bar 6 away from the connecting rod 601, and a square plate B 607 located on one side of the cross bar 6 is fixedly arranged on the square plate A 606, the long side direction of the square plate A 606 is perpendicular to the long side direction of the square plate B 607, the long side direction of the square plate B 607 is parallel to the long side direction of the cross bar 6, the bottom ends of the square plate B 607 and the cross bar 6 are flush, an adjustment platform 608 is arranged below the square plate B 607 and the cross bar 6, the cross bar 6 is slidably connected to the adjustment platform 608, and an adjustment component 7 for adjusting the movement of the cross bar 6 in the Y-axis direction is arranged on the adjustment platform 608, and the positions of the cross bar 6, the connecting rod 601 and the return plate 603 on the Y-axis are adjusted by the action of the adjustment component 7.

[0068] like Fig.10 and Fig.11The adjustment component 7 includes a positioning block 701 located in the middle position of the upper surface of the adjustment platform 608, the positioning block 701 is fixedly connected to the adjustment platform 608, and two guide columns 702 are penetrated on the positioning block 701, and the guide columns 702 are slidably connected to the positioning block 701. The two ends of the guide columns 702 penetrate the positioning block 701 and are respectively fixedly connected to the cross plate and the B square plate 607. The cross bar 6 and the B square plate 607 are fixedly connected through the action of the guide columns 702, and at the same time, the movement of the cross bar 6 and the B square plate 607 in the Y-axis direction is guided. Two fixed plates 703 are fixedly arranged on the upper surface of the adjustment platform 608. The two fixed plates 703 are respectively located on the side of the cross bar 6 and the B square plate 607 away from the positioning block 701. The fixing plates 703 are arranged relatively to each other, and a threaded groove is opened on the fixing plate 703, and a bolt 704 is connected in the threaded groove through a thread. The bolt 704 passes through the fixing plate 703, and the ends of the two bolts 704 respectively conflict with the cross bar 6 and the B square plate 607. When the position of the cross bar 6 on the Y-axis needs to be adjusted, the staff manually pushes the cross bar 6 so that the cross bar 6 moves to a suitable position in the Y-axis direction. Then the staff grabs the bolt 704 and manually tightens the bolt 704. Through the action of the thread, the bolt 704 moves during the rotation, and the ends of the two bolts 704 respectively conflict with the side of the cross bar 6 and the B square plate 607 away from the positioning block 701, so as to facilitate the positioning of the cross bar 6. The bolt 704 is specifically an M8 bolt.

[0069] like Fig. 9 A control component 8 for driving the adjustment platform 608 to move in the vertical direction is provided on the cabinet 1. The adjustment platform 608 is controlled to move in the vertical direction through the action of the control component 8, thereby driving the cross bar 6 on the adjustment platform 608 to move in the vertical direction, thereby driving the wafer on the cross bar 6 to move in the vertical direction, so as to control the wafer to move up and down in the tank. When the wafer moves down, it is convenient to move the wafer to the cleaning tank 101 for cleaning. When the wafer moves up, the cleaned wafer is separated from the cleaning tank 101.

[0070] like Fig. 9The control component 8 includes a bracket fixedly connected to the cabinet 1, and a control screw is rotatably connected to the bracket. A control motor is fixedly arranged on the bracket and is located next to the control screw. The output shaft end of the control motor and one end of the control screw are both embedded with control pulleys. Control synchronous belts matching the control pulleys are sleeved on the two control pulleys. A control sliding block is sleeved on the outer side of the control screw through a threaded sleeve. A moving plate is fixedly arranged on the control sliding block. The top of the moving plate is fixedly connected to the adjustment platform 608. Control sliders are fixedly arranged at the four end corners of the outer periphery of the control sliding block. A control linear rail is fixedly arranged on the bracket and is sleeved on the control linear rail and is slidably connected to the control linear rail. The control pulley fixedly connected to the output shaft end of the control motor is driven to rotate by the action of the control motor. The rotation of the control pulley will drive the rotation of the control synchronous belt mounted on the outside of the control pulley, and the rotation of the control synchronous belt will drive the rotation of another control pulley. The rotation of the other control pulley will drive the rotation of the control screw fixedly connected thereto. The rotation of the control screw will drive the control sliding block threadedly connected to the control screw to move in the vertical direction. The movement of the control sliding block will drive the movement of the control sliding block fixedly connected to the control sliding block. The cooperation of the control sliding block and the control linear rail will guide the movement of the control sliding block. The movement of the control sliding block will drive the movement of the moving plate fixedly connected to the control sliding block. The movement of the moving plate in the vertical direction will drive the movement of the adjustment platform 608 fixedly connected to the moving plate, thereby driving the movement of the wafer in the vertical direction.

[0071] like Figure 1 The first lifting assembly 301, the second lifting assembly 302 and the third lifting assembly 303 have the same structure.

[0072] When in use, the power supply is turned on and the switch is turned on. After the wafer is cleaned in the second hot water washing tank 103, when the third grabbing assembly 203 is needed to move the wafer on the second lifting assembly 302 to the third lifting assembly 303, the control motor is turned on. The control motor drives the control pulley fixedly connected to the output shaft end of the control motor to rotate. The rotation of the control pulley drives the control synchronous belt sleeved on the outer side of the control pulley to rotate. The rotation of the control synchronous belt drives another control pulley to rotate. The rotation of the other control pulley drives the control screw fixedly connected to it to rotate. The rotation of the control screw drives the control sliding block to move in the vertical direction. The movement of the control sliding block drives the movement of the control sliding block. The movement of the control sliding block drives the movement of the moving plate. The movement of the moving plate in the vertical direction drives the movement of the adjustment platform 608 fixedly connected to the moving plate, and then drives the wafer to move upward in the vertical direction until the wafer moves out of the second hot water washing tank 103.

[0073] Then turn on the X-axis motor 50102, and the A gear 50103 fixedly connected to the output shaft of the X-axis motor 50102 is driven to rotate by the action of the X-axis motor 50102. The rotation of the A gear 50103 will drive the B gear 50104 meshing with the A gear 50103 to rotate. The A gear 50103 and the B gear 50104 are of the same height. The B gear 50104 extends out of the vertical plate 4 through the square groove 50101. The portion of the B gear 50104 extending out of the vertical plate 4 conflicts with the rack 5, and the B gear 50104 and the rack 5 are meshed with each other. Through the cooperation of the B gear 50104 and the rack 5, the rotation of the B gear 50104 will drive the vertical plate 4 to move in the X-axis direction until it moves to the second lifting assembly 302. Then turn off the X-axis motor 50102, and the sliding of the vertical plate 4 in the X-axis direction is guided by the action of the X-axis line rail 50201 and the X-axis slider 50202.

[0074] Then turn on the Y-axis motor 21303, and the Y-axis pulley 21304 fixedly connected to the output shaft end of the Y-axis motor 21303 will be driven to rotate through the action of the Y-axis motor 21303, and the rotation of the Y-axis pulley 21304 will drive the rotation of the Y-axis synchronous belt 21305, and the rotation of the Y-axis synchronous belt 21305 will drive another Y-axis pulley 21304 to rotate, and the rotation of the other Y-axis pulley 21304 will drive the Y-axis screw 21302 to rotate. Through the action of the thread, the Y-axis screw 21302 The rotation of 1302 will drive the movement of the Y-axis sliding block 21306, and the Y-axis sliding block 21306 is slidingly connected to the top plate 212. The movement of the Y-axis sliding block 21306 will drive the Y platform 205 fixedly connected to the Y-axis sliding block 21306 to move until the mechanical gripper 209 moves to the top of the wafer on the second lifting assembly, and the Y-axis motor 21303 is turned off. Through the cooperation of the Y-axis line rail 21401 and the Y-axis slider 21402, the sliding of the Y platform 205 is guided.

[0075] Then turn on the Z-axis motor 40503, and the Z-axis pulley 40504 fixedly connected to the output shaft of the Z-axis motor 40503 is driven to rotate through the action of the Z-axis motor 40503. The rotation of the Z-axis pulley 40504 will drive the Z-axis synchronous belt 40506 adapted thereto to rotate. The rotation of the Z-axis synchronous belt 40506 will drive another Z-axis pulley 40504 to rotate. The other Z-axis pulley 40504 will drive the Z-axis screw rod 40502 fixedly connected thereto to rotate. Through the action of the thread, the Z-axis The rotation of the lead screw 40502 will drive the Z-axis sliding block 40501 threadedly connected to the Z-axis lead screw 40502 to slide in the vertical direction. The movement of the Z-axis sliding block 40501 will drive the top plate 212 fixedly connected to the Z-axis sliding block 40501 to move in the vertical direction. The movement of the top plate 212 will drive the mechanical gripper 209 on the top plate 212 to move in the vertical direction. The mechanical gripper 209 moves to the outer side of the wafer on the return plate 603 and the support rod 604, and the Z-axis motor 40503 is turned off.

[0076] Open the guide rod cylinder 21106, and the cam plate 21104 is pushed to move on the Y platform 205 toward the mechanical gripper 209 through the action of the guide rod cylinder 21106. The cam plate 21104 will make the two follower wheels 21102 move away from each other, increasing the distance between the two follower wheels 21102. The preload spring 21103 is stretched, and the flip plate 21101 flips outward. The rotation of the flip plate 21101 will drive the flip shaft 207 fixedly connected to the flip plate 21101 to rotate, and the rotation of the flip shaft 207 It will drive the gripper connection block 208 fixedly connected to the flip shaft 207 to rotate, and then drive the mechanical gripper 209 fixedly connected to the gripper connection block 208 to rotate, and the two mechanical grippers 209 are tightened inward to clamp the wafers placed on the return plate 603 and the support rod 604, and close the guide rod cylinder 21106. The rotation angle of the mechanical gripper 209 can be adjusted according to the size of the wafer, and then the pre-tightening force of the mechanical gripper 209 can be adjusted, which is suitable for wafers of different sizes, improves the stability of grabbing the wafer, and reduces the possibility of wafer damage;

[0077] After the wafer is clamped, the Z-axis motor 40503 is turned on again, and the reverse button on the Z-axis motor 40503 is pressed. The Z-axis motor 40503 is a prior art, so it will not be described in detail here. The reverse rotation of the Z-axis motor 40503 will drive the Z-axis screw rod 40502 to reverse, thereby causing the Z-axis sliding block 40501 to move upward in the vertical direction. The upward movement of the Z-axis sliding block 40501 will drive the wafer to move upward on the Z axis. When the wafer moves to the top of the first hot water washing tank 102, the Z-axis motor 405 is turned off. 03. Turn on the X-axis motor 50102 and press the reverse button on the X-axis motor 50102. The X-axis motor 50102 is a prior art, so it will not be described in detail here. The X-axis motor 50102 drives the A gear 50103 to rotate, and the rotation of the A gear 50103 drives the B gear 50104 to rotate. The rotation of the B gear 50104 drives the vertical plate 4 to move in the X-axis direction until it moves to the third lifting assembly 303, and then turns off the X-axis motor 50102.

[0078] Turn on the Z-axis motor 40503, and drive the Z-axis screw 40502 to rotate through the action of the Z-axis motor 40503. The rotation of the Z-axis screw 40502 will drive the Z-axis sliding block 40501 to slide in the vertical direction. The movement of the Z-axis sliding block 40501 will drive the top plate 212 to move in the vertical direction. The movement of the top plate 212 will drive the mechanical gripper 209 on the top plate 212 and the wafer in the mechanical gripper 209 to move downward. The mechanical gripper 209 moves to the third lifting assembly, and the Z-axis motor 40503 is turned off;

[0079] Open the guide rod cylinder 21106, and drive the cam plate 21104 to move away from the mechanical gripper 209 through the guide rod cylinder 21106. The movement of the mechanical gripper 209 will cause the pre-compression spring 21103 to rebound, and the flip plate 21101 to rotate, thereby causing the flip shaft 207 to rotate inward, thereby driving the mechanical gripper 209 to expand outward, so as to release the wafer, so that the wafer is located on the return plate 603 and the support rod 604 of the third lifting assembly 303, and each wafer can be placed independently through the effect of the sawtooth groove, and several wafers are kept at the same distance;

[0080] Turn on the control motor and press the reverse button of the control motor. The control motor is a prior art, so it will not be described in detail here. The control motor will drive the control pulley fixedly connected to the output shaft end of the control motor to rotate through the action of the control motor. The rotation of the control pulley will drive the control synchronous belt sleeved on the outside of the control pulley to rotate. The rotation of the control synchronous belt will drive the rotation of another control pulley. The rotation of the other control pulley will drive the rotation of the control screw fixedly connected to it. The rotation of the control screw will drive the control sliding block threadedly connected to the control screw to move in the vertical direction. The movement of the control sliding block will drive the movement of the control sliding block fixedly connected to the control sliding block. The movement of the control sliding block will drive the movement of the moving plate fixedly connected to the control sliding block. The movement of the moving plate in the vertical direction will drive the movement of the adjustment platform 608 fixedly connected to the moving plate, which will drive the movement of the wafer in the vertical direction until the wafer is moved into the second hot water washing tank 103. The control motor is turned off to clean the wafer in the second hot water washing tank 103.

[0081] The first grabbing assembly 201, the second grabbing assembly 202 and the fourth grabbing assembly 204 move in the same manner as the third grabbing assembly 203, and the first lifting assembly 301, the second lifting assembly 302 and the third lifting assembly 303 move in the same manner.

[0082] The above specific implementations are only descriptions of the preferred implementations of the present invention, and do not limit the protection scope of the present invention. Without departing from the design concept and spirit of the present invention, various modifications, substitutions and improvements made by ordinary technicians in this field to the technical solution of the present invention based on the text description and drawings provided by the present invention should all fall within the protection scope of the present invention. The protection scope of the present invention is determined by the claims.

Claims

1. A wafer cleaning device, comprising a cabinet (1) and a tank assembly for cleaning wafers, characterized in that: The cabinet (1) is provided with a moving assembly (3) for moving wafers out of the tank or into the tank assembly to facilitate cleaning of the wafers, and the cabinet (1) is provided with a transport assembly (2) for cooperating with the moving assembly (3) to transport the wafers; The tank assembly comprises a cleaning tank (101) for cleaning wafers, a first hot water washing tank (102) and a second hot water washing tank (103) which are located in the cabinet (1) and are arranged in sequence from left to right. The cleaning tank (101), the first hot water washing tank (102) and the second hot water washing tank (103) are arranged in sequence along the moving direction of the wafers. The transport assembly (2) comprises a first grabbing assembly (201), a second grabbing assembly (202), a third grabbing assembly (203) and a fourth grabbing assembly (204); the moving assembly (3) comprises a first lifting assembly (301), a second lifting assembly (302) and a third lifting assembly (303); The first gripping component (201) comprises a Y platform (205), ear-type supports (206) are fixedly provided at the four end corners of the upper surface of the Y platform (205), and a flip shaft (207) is rotatably connected to each of two adjacent ear-type supports (206) via a support bearing, one end of the flip shaft (207) extends out of one of the ear-type supports (206), and one end of the flip shaft (207) extending out of the ear-type support (206) is fixedly connected to a gripper connection block (208), and a mechanical gripper (209) for gripping a wafer is fixedly connected to the gripper connection block (208), and a connecting plate (210) for limiting the flip shaft (207) is sleeved on two adjacent flip shafts (207), and a flip component (211) for driving the mechanical gripper (209) to rotate to clamp the wafer is provided on the Y platform (205); The flip assembly (211) comprises a flip plate (21101) nested on the outer circumferential wall of the flip shaft (207), the flip plate (21101) is fixedly connected to the flip shaft (207), the upper surface of the flip plate (21101) is movably connected with a follower wheel (21102), the two flip plates (21101) are fixedly connected via a pre-compression spring (21103), the two pre-compression springs (21103) are respectively located on both sides of the follower wheel (21102), and a spring (21103) and a Y spring (21103) are provided between two adjacent flip plates (21101). A cam plate (21104) is provided between the platforms (205), the side of the cam plate (21104) close to the flip plate (21101) is provided with a slope surface (21105), the outer surface of the follower wheel (21102) contacts the slope surface (21105) of the cam plate (21104), the diameter of the end of the cam plate (21104) close to the mechanical gripper (209) is smaller than the diameter of the end of the cam plate (21104) away from the mechanical gripper (209), and a guide rod cylinder (21106) is fixedly provided on the Y platform (205) for pushing the cam plate (21104) to move; A top plate (212) is provided below the Y platform (205), and a Y-axis driving component (213) is provided on the top plate (212) for driving the Y platform (205) to move on the Y axis so that the mechanical gripper (209) can grasp wafers at different positions on the Y axis; The Y-axis driving assembly (213) comprises two fixed seats (21301) located on the upper surface of the Y-axis, a Y-axis screw rod (21302) is rotatably connected between the two fixed seats (21301), one end of the Y-axis screw rod (21302) extends out of one of the fixed seats (21301), a Y-axis motor (21303) located beside the Y-axis screw rod (21302) is fixedly arranged on the upper surface of the top plate (212), an output shaft end of the Y-axis motor (21303) and a Y-axis screw rod (21302) extending out of one of the fixed seats (21301) are connected to the top plate (212), and a Y-axis motor (21303) is fixedly arranged on the upper surface of the top plate (212), and an output shaft end of the Y-axis motor (21303) and a Y-axis screw rod (21302) extend out of one of the fixed seats (21301) The fixed seat (21301) is partially embedded with a Y-axis pulley (21304), and the two Y-axis pulleys (21304) are sleeved with a Y-axis synchronous belt (21305) adapted thereto, and the outer side of the Y-axis screw rod (21302) is sleeved with a Y-axis sliding block (21306) through a threaded sleeve, and the side of the Y-axis sliding block (21306) facing away from the top plate (212) is fixedly connected to the Y platform (205), and the top plate (212) is provided with a Y-axis guide component (214) that guides the movement of the Y platform (205); The guide assembly comprises two Y-axis rails (21401) respectively arranged on both sides of the upper surface of the top plate (212), the Y-axis rails (21401) are fixedly connected to the top plate (212), a Y-axis slider (21402) is sleeved on the Y-axis rails (21401) and is slidably connected to the Y-axis rails (21401), and the side of the Y-axis slider (21402 facing away from the Y-axis rails (21401) is fixedly connected to the Y platform (205); An axial vertical plate (4) is provided below the top plate (212), an A horizontal plate (401) is fixedly provided on the upper end surface of the vertical plate (4), a B horizontal plate (402) is fixedly provided on the lower end surface of the vertical plate (4), a circular groove (403) is provided on the A horizontal plate (401), an axial vertical column (404) is passed through the circular groove (403) on the A horizontal plate (401), the top end of the vertical column (404) is fixedly connected to the lower end surface of the top plate (212), a Z-axis sliding block (40501) is fixedly provided at one end of the vertical column (404) away from the top plate (212), and a Z-axis driving component (405) for driving the vertical column (404) to slide in the Z-axis direction is provided on the vertical plate (4); The Z-axis driving assembly (405) comprises a Z-axis screw rod (40502) located between the A horizontal plate (401) and the B horizontal plate (402), the Z-axis screw rod (40502) being rotatably connected to the A horizontal plate (401) and the B horizontal plate (402), the Z-axis sliding block (40501) being sleeved on the Z-axis screw rod (40502) by a thread, the bottom end of the Z-axis screw rod (40502) being penetrated by the B horizontal plate (402), the vertical plate (4) being fixedly provided with a Z-axis motor (40503) located beside the Z-axis screw rod (40502), the Z-axis motor (40503) being 3) is penetrated by the B horizontal plate (402) and is rotatably connected to the B horizontal plate (402), one end of the output end of the Z-axis motor (40503) is penetrated by the B horizontal plate (402) and one end of the Z-axis screw rod (40502) is penetrated by the B horizontal plate (402), both of which are embedded with Z-axis pulleys (40504), and the outer sides of the two Z-axis pulleys (40504) are sleeved with Z-axis synchronous belts (40506) adapted to the Z-axis pulleys (40504), and the vertical plate (4) is provided with a Z-axis guide component (406) that guides the Z-axis sliding block (40501); The Z-axis guide assembly (406) comprises two Z-axis axis rails (40601) respectively located on both sides of the Z-axis sliding block (40501), the Z-axis axis rails (40601) are fixedly connected to the vertical plate (4), the Z-axis axis rails (40601) are sleeved with a Z-axis slider (40602) which is slidably connected to the Z-axis axis rails (40601), and the Z-axis slider (40602) is fixedly connected to the Z-axis sliding block (40501); An X-axis driving assembly (501) for driving the vertical plate (4) to move in the X-axis direction is disposed on the vertical plate (4); a transverse rack (5) cooperating with the X-axis driving assembly (501) is fixedly disposed on one side of the cabinet (1) close to the cleaning tank (101), the first hot water washing tank (102) and the second hot water washing tank (103); The X-axis driving assembly (501) comprises a square slot (50101) formed on the vertical plate (4); an X-axis motor (50102) located beside the column (404) is fixedly provided on the vertical plate (4); an A gear (50103) is fixedly provided on the output shaft end of the X-axis motor (50102); a B gear (50104) meshing with the A gear (50103) is provided on the side of the A gear (50103) close to the vertical plate (4); the B gear (50104) is rotatably connected to the vertical plate (4); the B gear (50104) passes through the vertical plate (4) through the square slot (50101); the portion of the B gear (50104) passing through the vertical plate (4) meshes with the rack (5); and an X-axis guiding assembly (502) is provided on the cabinet (1) for guiding the movement of the vertical plate (4) on the X-axis; The X-axis guide assembly (502) comprises two X-axis line rails (50201) located on the cabinet (1), the X-axis line rails (50201) are fixedly connected to the cabinet (1), the two X-axis line rails (50201) are respectively located on the upper and lower sides of the rack (5), and four X-axis sliders (50202) are fixedly provided on the side of the vertical plate (4) away from the column (404), and the X-axis sliders (50202) are sleeved on adjacent X-axis line rails (50201) and are slidably connected to the X-axis line rails (50201); The first grabbing assembly (201), the second grabbing assembly (202), the third grabbing assembly (203) and the fourth grabbing assembly (204) have the same structure.

2. A wafer cleaning device according to claim 1, characterized in that: The first lifting component (301) includes a cross bar (6), a connecting rod (601) is fixedly provided at one end of the cross bar (6) away from the cabinet (1), a weight-reducing groove (602) is provided on the connecting rod (601), two return plates (603) for placing wafers are fixedly provided at one end of the connecting rod (601) away from the cross bar (6), two support rods (604) for supporting wafers are fixedly provided in the return plates (603), the cross-sections of the return plates (603) and the support rods (604) are both arc-shaped, and the upper surfaces of the return plates (603) and the support rods (604) are both provided with a plurality of serrated grooves (605), and the spacing between the plurality of serrated grooves (605) is the same.

3. A wafer cleaning device according to claim 2, characterized in that: A square plate A (606) is fixedly provided at one end of the cross bar (6) away from the connecting rod (601), and a square plate B (607) located on one side of the cross bar (6) is fixedly provided on the square plate A (606), the long side direction of the square plate A (606) is perpendicular to the long side direction of the square plate B (607), the long side direction of the square plate B (607) is parallel to the long side direction of the cross bar (6), the bottom ends of the square plate B (607) and the cross bar (6) are flush, an adjustment platform (608) is provided below the square plate B (607) and the cross bar (6), and an adjustment component (7) for adjusting the movement of the cross bar (6) in the Y-axis direction is provided on the adjustment platform (608); The adjustment assembly (7) comprises a positioning block (701) located in the middle of the upper surface of the adjustment platform (608); two guide columns (702) are passed through the positioning block (701); the two ends of the guide columns (702) passing through the positioning block (701) are respectively fixedly connected to the cross bar (6) and the B square plate (607); two fixing plates (703) are fixedly provided on the upper surface of the adjustment platform (608); the two fixing plates (703) are respectively located on the side of the cross bar (6) and the B square plate (607) away from the positioning block (701); a thread groove is formed on the fixing plate (703), and a bolt (704) is threadedly connected in the thread groove; the bolt (704) passes through the fixing plate (703), and the ends of the two bolts (704) are respectively in contact with the cross bar (6) and the B square plate (607).

4. A wafer cleaning device according to claim 3, characterized in that: The cabinet (1) is provided with a control component (8) for driving the adjustment platform (608) to move in the vertical direction, the control component (8) comprising a bracket fixedly connected to the cabinet (1), the bracket being rotatably connected to a control screw, the bracket being fixedly provided with a control motor located beside the control screw, the output shaft end of the control motor and one end of the control screw being embedded with control pulleys, the two control pulleys being sleeved with control synchronous belts adapted to the control pulleys, the outer side of the control screw being sleeved with a control sliding block through a threaded sleeve, the control sliding block being fixedly provided with a moving plate, the top end of the moving plate being fixedly connected to the adjustment platform (608), the four end corners of the outer periphery of the control sliding block being fixedly provided with control sliders, the bracket being fixedly provided with a control linear rail located beside the control screw, the control slider being sleeved on the control linear rail and being slidably connected to the control linear rail; The first lifting assembly (301), the second lifting assembly (302) and the third lifting assembly (303) have the same structure.

Images