Foldable vapor chamber and electronic device

Abstract

The application provides a foldable vapor chamber and an electronic device, relates to the technical field of electronic device heat dissipation, and aims to solve the technical problem of insufficient foldable reliability of the vapor chamber. The foldable vapor chamber comprises a first plate body and a second plate body which are arranged in layers, a sealed cavity is formed between the first plate body and the second plate body, the length direction of the first plate body is a first direction, and the thickness direction of the first plate body is a second direction; the first plate body and the second plate body both comprise a flexible section and a heat transfer section connected to the two ends of the flexible section along the first direction, and the sealed cavity penetrates through the flexible section and the heat transfer section; a capillary structure is arranged at the interface between the first plate body and the second plate body in the sealed cavity, and the capillary structure contains a cooling medium; the cooling medium is used for absorbing heat transferred from the first plate body or the second plate body, evaporating to form steam, flowing in the sealed cavity, and being reabsorbed by the capillary structure after condensation.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and more particularly to a foldable heat spreader and an electronic device. Background Technology

[0002] As consumer electronics products such as mobile phones and tablets become increasingly thinner and lighter, and in order to continuously improve the user's visual experience, foldable screen products have received more and more attention. They can not only meet people's demand for thinner and lighter electronic products, but also have the advantages of large-size screen display and easy portability.

[0003] Driven by the research and development and production of electronic products focused on higher performance and better display effects, the energy consumption and heat generation of these products are also continuously increasing. Meanwhile, the chips in foldable screen electronic devices are typically concentrated on one side of the device. Therefore, to improve the utilization rate of the heat dissipation area on the foldable screen of electronic devices, it is necessary to improve the efficiency of heat transfer from one side of the device to the entire foldable screen, thereby comprehensively enhancing the overall heat dissipation efficiency.

[0004] Currently, heat pipes or vapor chambers are commonly used to dissipate heat from electronic devices. Both achieve heat dissipation through contact heat conduction. Compared to the one-dimensional linear heat conduction of heat pipes, vapor chambers can achieve heat conduction on a two-dimensional surface, resulting in higher heat transfer efficiency. However, existing vapor chambers cannot simultaneously meet the requirements of folding reliability and high thermal conductivity, and have insufficient bending performance, which limits the application and development of vapor chambers in electronic folding screens. Summary of the Invention

[0005] In view of the above-mentioned problem of insufficient reliability of the folding of the heat exchange plate, the present invention provides a foldable heat exchange plate to improve the bending performance of the heat exchange plate and ensure its heat transfer capacity.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] A first aspect of the present invention provides a foldable heat spreader, comprising a first plate and a second plate stacked together, wherein a sealed cavity is formed between the first plate and the second plate; both the first plate and the second plate include a flexible segment and a heat transfer segment connected to both ends of the flexible segment along a first direction, the sealed cavity penetrating the flexible segment and the heat transfer segment; a capillary structure is disposed within the sealed cavity at the interface between the first plate and the second plate, and the capillary structure contains a cooling medium;

[0008] The cooling medium absorbs heat transferred from the first plate or the second plate, evaporates to form steam, and flows within the sealed cavity. The steam is then condensed upon cooling and reabsorbed by the capillary structure.

[0009] The technical solution provided by this invention has at least the following beneficial effects:

[0010] By placing the capillary structure at the interface between the first and second plates, i.e., on the neutral surface of the heat exchanger, when the heat exchanger is folded (i.e., when the first and second plates are bent via flexible sections), the capillary structure located on the neutral surface of the heat exchanger can reduce the stress it experiences within the sealed cavity, thereby significantly reducing deformation. This increases the number of times the capillary structure can be folded, improves the bending performance of the heat exchanger, and extends the service life of the capillary structure material. Furthermore, when the heat source comes into contact with the surface of the first or second plate, the side where the contact surface is located is the evaporation side. Heat is conducted to the cooling medium within the capillary structure through the evaporation side. At this time, the air pressure inside the sealed cavity is negative compared to the outside. After absorbing the heat transferred from the evaporation side, the cooling medium evaporates to form steam, which flows within the sealed cavity. The steam condenses upon encountering cold air. If the steam flows to the side wall of the plate or the inner wall of the opposite side, it condenses to form condensate. The condensate is reabsorbed by the capillary structure, thus continuing to dissipate heat from the heat source. Through this process, continuous heat exchange with the heat source achieves a good temperature uniformity effect.

[0011] In the aforementioned foldable heat spreader, the capillary structure may optionally be at least one of woven copper mesh, foamed metal, porous fiber, and filament bundle.

[0012] Optionally, in the above-mentioned foldable heat spreader, a sealing layer is provided on both sides of the capillary structure along the second direction within the flexible section, wherein the second direction is perpendicular to the first direction.

[0013] Optionally, in the above-mentioned foldable heat spreader, the sealing layer is provided with a corrugated structural component, which includes a U-shaped corrugated pipe or a V-shaped corrugated pipe.

[0014] In the aforementioned foldable heat spreader, optionally, the U-shaped corrugated pipe comprises a plurality of U-shaped segments connected sequentially along the first direction; or,

[0015] The V-shaped bellows includes a plurality of V-shaped segments connected sequentially along the first direction.

[0016] Optionally, in the aforementioned foldable heat spreader, a polymer layer is also provided outside the sealing layer.

[0017] In the above-mentioned foldable heat spreader, optionally, the polymer layer completely covers the heat transfer section along the first direction, or the polymer layer partially covers the heat transfer section along the first direction.

[0018] Optionally, in the aforementioned foldable heat spreader, a support mechanism is provided between the surface of the first plate and the surface of the second plate.

[0019] Optionally, in the above-mentioned foldable heat spreader, the support mechanism includes a first support column and a second support column. The first support column is spaced apart within the flexible section and located between the capillary structure and the first sealing layer. The second support column is located within the heat transfer section and is spaced apart on both sides of the capillary structure.

[0020] A second aspect of the present invention provides an electronic device comprising the foldable heat spreader provided in any of the above-described technical solutions.

[0021] The beneficial effects provided by the second aspect of the present invention include those provided by the first aspect of the present invention, which will not be repeated here. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 An exploded view of the foldable heat spreader provided in an embodiment of the present invention;

[0024] Figure 2 A side view showing the foldable heat spreader polymer layer completely covering the heat transfer section, as provided in an embodiment of the present invention.

[0025] Figure 3 This is a cross-sectional view along the AA direction of the foldable heat exchange plate provided in an embodiment of the present invention;

[0026] Figure 4 A cross-sectional view along the BB direction when the polymer layer of the foldable heat spreader provided in an embodiment of the present invention completely covers the heat transfer section;

[0027] Figure 5 This is a side view of the structure of the foldable heat spreader polymer layer partially covering the heat transfer section according to an embodiment of the present invention;

[0028] Figure 6 A cross-sectional view along the BB direction of the foldable heat spreader polymer layer partially covering the heat transfer section according to an embodiment of the present invention.

[0029] Figure 7 This is a side view of the folded state of the foldable heat spreader provided in an embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the U-shaped and V-shaped corrugated structure inside the sealing layer of the foldable heat spreader provided in an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1-First plate; 2-Second plate; 3-Capillary suction core; 4-Flexible section; 5-Heat transfer section; 6-First support column; 7-Second support column; 8-Sealing layer; 9-Polymer layer; 10-U-shaped corrugated pipe; 11-V-shaped corrugated pipe. Detailed Implementation

[0033] As described in the background section, vapor chambers have been widely used in heat dissipation technology for electronic devices. However, with the rise of foldable electronic devices, the bending performance of vapor chambers cannot adequately meet the application requirements of foldable screens, resulting in insufficient folding reliability. The inventors have discovered that this problem is mainly due to the fact that the heat transfer performance of the vapor chamber is limited by the heat transfer capacity of its outer shell material. The outer shell material of the vapor chamber is generally metal. While metal materials possess good thermal conductivity and temperature uniformity, stress concentration easily occurs within the material, especially in the bending area, after repeated bending, leading to structural instability. Therefore, a vapor chamber structure design that balances folding reliability and high thermal conductivity is urgently needed.

[0034] To address the aforementioned technical problems, this invention provides a foldable heat exchanger. By placing a capillary structure at the interface between the first and second plates, i.e., on the neutral surface of the heat exchanger, when the heat exchanger is folded (i.e., when the first and second plates bend through the flexible section), the capillary structure located on the neutral surface of the heat exchanger can reduce the stress it experiences within the sealed cavity, thereby significantly reducing deformation. This increases the number of times the capillary structure can be folded, improves the bending performance of the heat exchanger, and extends the service life of the capillary structure material. Furthermore, when the heat source comes into contact with the surface of the first or second plate, the side where the contact surface is located is the evaporation side. Heat is conducted to the cooling medium in the capillary structure through the evaporation side. At this time, the air pressure inside the sealed cavity is negative compared to the outside. After absorbing the heat transferred from the evaporation side, the cooling medium evaporates to form steam and flows in the sealed cavity. The steam condenses when it encounters cold. If the steam flows to the side wall of the plate or the inner wall of the opposite side, it condenses to form condensate. The condensate is reabsorbed by the capillary structure, so that it can continue to be used to dissipate heat and cool the heat source. In this way, through the above process, heat is continuously exchanged with the heat source to achieve a good temperature uniformity effect.

[0035] To make the above-mentioned objectives, features, and advantages of the embodiments of the present invention more apparent and understandable, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] The foldable heat spreader provided in this embodiment of the invention, in order to Figure 1 As shown in the example, it includes a first plate 1 and a second plate 2 stacked together, with a sealed cavity formed between the first plate 1 and the second plate 2. The length direction and thickness direction of the first plate 1 are the first direction and the second direction, respectively. Along the first direction, both the first plate 1 and the second plate 2 include a flexible segment 4 and a heat transfer segment 5 connected to both ends of the flexible segment 4. That is to say, the capillary liquid absorption core 3 penetrates the sealed cavity inside the foldable heat equalization plate along the first direction.

[0037] A sealed cavity extends through the flexible section 4 and the heat transfer section 5; a capillary structure is provided within the sealed cavity at the interface between the first plate 1 and the second plate 2, and the capillary structure contains a cooling medium, such as... Figure 1 and Figure 2 As shown, the capillary structure is a flexible capillary wick 3. Along the first direction, the capillary wick 3 extends from the heat transfer section 5 located at one end of the flexible section 4 to the heat transfer section 5 located at the other end of the flexible section 4. The capillary wick 3 is tough and bendable, and has fatigue resistance that allows it to be bent multiple times without being damaged.

[0038] It should be noted that the interface between the first plate 1 and the second plate 2 is the neutral plane of the foldable heat exchanger provided in the embodiment of the present invention, which is the neutral mechanical symmetry plane inside the heat exchanger that is not subject to either compressive or tensile stress (internal stress balance) along the second direction.

[0039] With the above design of this embodiment, when the heat source comes into contact with the surface of the first plate 1 or the second plate 2, the side where the contact surface is located is the evaporation side. The heat is conducted to the cooling medium in the capillary wick 3 through the evaporation side. At this time, the air pressure inside the sealed cavity is negative pressure compared with the outside. After the cooling medium absorbs the heat transferred from the evaporation side, it evaporates to form steam and flows in the sealed cavity. The steam condenses when it encounters cold. If the steam flows to the side wall of the plate or the inner wall of the opposite side, it condenses to form condensate. The condensate is reabsorbed by the capillary wick 3, so that it can continue to be used for heat dissipation and cooling of the heat source. In this way, through the above process, heat is continuously exchanged with the heat source to achieve a good temperature uniformity effect.

[0040] Furthermore, by placing the capillary wick 3 at the interface between the first plate 1 and the second plate 2, i.e. the neutral surface of the temperature equalization plate, when the temperature equalization plate is folded, i.e. when the first plate 1 and the second plate 2 achieve the bending function through the flexible segment 4, the capillary wick 3 located on the neutral surface of the temperature equalization plate can reduce the stress it experiences in the sealed cavity, thereby significantly reducing the amount of deformation, thus increasing the number of times the capillary wick 3 can be folded and extending the service life of the capillary structure material.

[0041] It should be noted that the cooling medium is at least one of water, methanol, ethanol, acetone and liquid ammonia.

[0042] Furthermore, the flexible segment 4 is located in the middle of the first plate 1 and the second plate 2, and the two heat transfer segments 5 are symmetrically distributed at both ends of the flexible segment 4 in the first direction. In this way, the heat is distributed more evenly inside the first plate 1 and the second plate 2, including in the sealed cavity, and after conduction on the plate surface.

[0043] The flexible segment 4 is used to support the bending of the first plate 1 and the second plate 2. The flexible segment 4 is made of a flexible material, such as a flexible composite material made of one or more of flexible graphite, flexible rubber and flexible resin.

[0044] Furthermore, the capillary absorbent core 3 is at least one of woven copper mesh, foam metal, porous fiber and filament bundle, preferably foam metal. For example, the foam metal can be foam copper, foam aluminum, foam nickel or foam titanium.

[0045] Compared with single metal materials or porous materials, this design can simultaneously enhance the thermal conductivity and ductility of the capillary core 3. It can also play a role in shock absorption and energy absorption when the capillary core 3 and the heat spreader fold together. From the perspective of structural materials, it can further reduce the probability of stress concentration of the capillary core 3 and improve the structural stability and reliability.

[0046] It should be noted that foamed metal is a type of metallic material containing a foam-like porous structure.

[0047] The heat transfer section 5 is used for the transfer and diffusion of heat from the surface of the first plate 1 and / or the second plate 2. The first plate 1 and the second plate 2 are provided with a support mechanism in the sealed cavity inside the heat transfer section 5. The support mechanism is made of a thermally conductive material, which can be metal or thermally conductive polymer material.

[0048] In this way, the support mechanism can play a structural support role when the air pressure inside the sealed cavity is lower than the external air pressure, and it is also conducive to the heat conduction to the capillary liquid core 3, thereby improving the temperature uniformity of the plate.

[0049] As one possible embodiment, the support mechanism includes a first support column 6 and a second support column 7, such as... Figure 1 , Figure 3 , Figure 4 and Figure 5 As shown, multiple first support columns 6 are spaced apart within the flexible section 4 and located between the capillary structure and the first sealing layer 8; multiple second support columns 7 are located within the heat transfer section 5 and are spaced apart on both sides of the capillary structure, and the first support columns 6 and the second support columns 7 are arranged in a parallel array within the sealed cavity.

[0050] This structural design further strengthens the structural support of the support mechanism for the inner surface of the temperature equalization plate, and reduces the structural load on the plate caused by the pressure difference between the inside and outside of the sealed cavity.

[0051] Furthermore, when the flexible section 4 bends, the first support column 6 plays a supporting and limiting role for the capillary wick 3. On the one hand, it ensures that the capillary wick 3 is always located on the deformation neutral surface of the flexible plate. On the other hand, it maintains a clearance space with the capillary wick 3. The clearance space is also a cavity. This cavity can provide sufficient conduction space for the heat transfer vapor that is heated and evaporated in the capillary wick 3, thus ensuring the heat transfer efficiency inside the heat spreader.

[0052] Preferably, the sidewall connecting the flexible segment 4 and the heat transfer segment 5, as well as the first support column 6, are made of non-metallic materials with a deformation rate of less than or equal to 20%, such as polymer films, preferably polyurethane films or polyimide films (PI films). In this way, the deformable support column not only provides structural support for the flexible segment 4 and its sidewall connected to the heat transfer segment 5, but also coordinates with the deformation of the flexible segment 4 in a bent state. For example, in a bent state... Figure 7 As shown, the deformation capability of the flexible section 4 and its sidewall connected to the heat transfer section 5 is comprehensively guaranteed from both static and dynamic dimensions.

[0053] Optionally, the second support column 7 is a metal support column, such as a copper column, a tin column, or a copper-tin alloy column, preferably a copper-tin alloy column. In this way, it has both the strength and toughness of the material and meets the thermal conductivity requirements of the interior of the heat exchange plate, especially the heat transfer section 5 and its connection with the flexible section 4.

[0054] In some possible implementations, within the flexible segment 4, a sealing layer 8 is provided on both sides of the capillary structure along the second direction. This layer is made of a material with good plasticity and toughness, which not only enhances the sealing ability of the sealed cavity within the flexible segment 4 of the heat exchange plate, but also further improves the deformation ability of the heat exchange plate when folded by absorbing the tensile or compressive deformation energy generated during the bending process of the flexible segment 4. At the same time, it can reduce the leakage of cooling medium inside the cavity, further ensuring the temperature stability of the heat exchange plate.

[0055] In some embodiments, the sealing layer 8 includes a corrugated structural member, for example, the corrugated structural member can be a bellows, and the corrugated shape of the bellows is at least one of U-shape, Ω-shape, S-shape and V-shape. In this way, while ensuring the sealing performance of the flexible section 4, there are multiple contact parts and multiple non-contact parts between the bellows and the first support column 6.

[0056] Multiple contact parts provide support and reinforcement for the first support column 6, while multiple non-contact parts form multiple spaced cavities between the bellows and the first support column 6, which can also serve as heat transfer spaces to facilitate the temperature uniformity of the plate.

[0057] Preferably, combined with Figure 8The corrugated structural component is a U-shaped corrugated pipe 10 or a V-shaped corrugated pipe 11. The U-shaped corrugated pipe 10 includes a plurality of U-shaped segments connected in sequence along the first direction; the V-shaped corrugated pipe 11 includes a plurality of V-shaped segments connected in sequence along the first direction.

[0058] The corrugated structural component is further preferably a U-shaped corrugated pipe 10, which is easy to form during the preparation process and further simplifies the preparation process of the sealing layer 8.

[0059] Optionally, the sealing layer 8 can be composed of metal or metal oxide or a combination of both. For example, the sealing layer 8 material includes one or more of aluminum oxide, copper and aluminum. The thickness of the sealing layer 8 can be between tens of nanometers and hundreds of micrometers, preferably 10nm-100μm, and more preferably 50nm-20μm. For example, the thickness of the sealing layer 8 is 10nm or 50nm or 100nm or 20μm or 50μm or 100μm.

[0060] Alternatively, the sealing layer 8 can be formed by atomic layer deposition or magnetron sputtering. With this design, the material type, thickness parameters and preparation method of the sealing layer 8 can be designed to make the heat spreader adaptable to heat sources of different sizes and heat conduction requirements, thus expanding its application range.

[0061] As one possible implementation, a polymer layer 9 is also provided outside the sealing layer 8, which not only serves as a secondary seal but also enhances the connection stability between the flexible section 4 and the heat transfer section 5.

[0062] Furthermore, the polymer layer 9 completely covers the heat transfer section 5 along the first direction, or the polymer layer 9 partially covers the heat transfer section 5 along the first direction. In this way, in actual engineering, the connection form between the polymer layer 9 and the heat transfer section 5 can be designed according to the heat transfer parameters of different heat sources on the heat spreader, the connection strength between the flexible section 4 and the heat transfer section 5, and the production cost requirements.

[0063] In some embodiments, when the sealing layer 8 in the flexible segment 4 is connected to the heat transfer segment 5 and extends a distance from one end of the heat transfer segment 5 to the other end, for example, both ends of the sealing layer 8 form an overlap with the end of the heat transfer segment 5 with a certain width, which can work together with the polymer layer 9 to enhance the connection stability between the flexible segment 4 and the heat transfer segment 5.

[0064] For example, such as Figure 5 and Figure 6 As shown, by partially covering the heat transfer section 5 along the first direction with the polymer layer 9, a stable connection of the three-section structure, including two heat transfer sections 5 and a flexible section 4, can be achieved; Figure 2 For example, when there is no connection between the sealing layer 8 in the flexible segment 4 and the heat transfer segment 5, the connection strength between the flexible segment 4 and the heat transfer segment 5 can be improved by completely covering the heat transfer segment 5 along the first direction by the polymer layer 9.

[0065] Those skilled in the art will understand that the support mechanism, including the first support column 6 and the second support column 7, can be formed on a substrate by etching or electroplating techniques. Furthermore, the substrate for forming the first support column 6 can be at least one of the sealing layer 8, the polymer layer 9, and the capillary structure surface, and the substrate for forming the second support column 7 can be the polymer layer 9 and / or the capillary structure surface.

[0066] Secondly, embodiments of the present invention provide an electronic device, which is a foldable electronic device, comprising the foldable heat spreader provided in the first aspect. The foldable electronic device can be any device with communication and / or storage functions, such as a mobile phone, tablet computer, watch, e-reader, laptop computer, in-vehicle equipment, smart TV, wearable device, and other smart devices.

[0067] Since the electronic device provided in the embodiments of the present invention adopts all the technical solutions provided in the above-described foldable heat spreader embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be repeated here.

[0068] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0071] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0072] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0073] It should be noted that the embodiments referred to in the specification, such as "one embodiment," "embodiment," "exemplary embodiment," and "some embodiments," may include specific features, structures, or characteristics, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A foldable heat spreader, characterized in that, The device includes a first plate and a second plate stacked together, with a sealed cavity formed between the first plate and the second plate. Both the first plate and the second plate include a flexible segment and a heat transfer segment connected to both ends of the flexible segment along a first direction. The sealed cavity penetrates the flexible segment and the heat transfer segment. A capillary structure is disposed within the sealed cavity at the interface between the first plate and the second plate. The interface is a neutral mechanically symmetrical plane inside the heat exchange plate that is not subjected to compressive or tensile stress along a second direction. The capillary structure contains a cooling medium. Within the flexible segment, sealing layers are provided on both sides of the capillary structure along a second direction, the second direction being perpendicular to the first direction; The cooling medium absorbs heat transferred from the first plate or the second plate, evaporates to form steam, and flows within the sealed cavity. The steam is then condensed upon cooling and reabsorbed by the capillary structure. The sealing layer is provided with a corrugated structural component, which includes a U-shaped corrugated pipe or a V-shaped corrugated pipe. A support mechanism is provided between the surface of the first plate and the surface of the second plate; The support mechanism includes a first support column and a second support column. The first support column is spaced apart within the flexible section and located between the capillary structure and the sealing layer. The second support column is located within the heat transfer section and is spaced apart on both sides of the capillary structure. The sidewall connecting the flexible section and the heat transfer section, as well as the first support column, are made of non-metallic materials with a deformation rate of less than or equal to 20 percent, while the second support column is a metal support column.

2. The foldable heat spreader according to claim 1, characterized in that, The capillary structure is at least one of woven copper mesh, foamed metal, porous fiber, and filament bundle.

3. The foldable heat spreader according to claim 1, characterized in that, The U-shaped corrugated pipe comprises a plurality of U-shaped segments connected sequentially along the first direction; or, The V-shaped bellows includes a plurality of V-shaped segments connected sequentially along the first direction.

4. The foldable heat spreader according to claim 1 or 3, characterized in that, A polymer layer is also provided outside the sealing layer.

5. The foldable heat spreader according to claim 4, characterized in that, The polymer layer completely covers the heat transfer section along the first direction, or the polymer layer partially covers the heat transfer section along the first direction.

6. An electronic device, characterized in that, Includes the foldable heat spreader as described in any one of claims 1-5.

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