Pickup device and mounting device

Abstract

The present application provides a kind of electronic components in non-contact mode pickup, and can be positioned pickup device and installation device. Embodiment is a kind of pickup device, with pickup cylinder clamp, direction change part, in pickup cylinder clamp, with porous member, the porous member has ventilation, the gas supplied to the inside is sprayed in the form of surface via the fine hole of the facing surface facing electronic components, suction hole and guide are provided in porous member, the suction hole has opening in facing surface, electronic components are sucked by negative pressure, the guide is configured in the form of along the outer edge of electronic components, the movement of electronic components held by facing surface is limited, direction change part has: rotation part, rotates pickup cylinder clamp in the form of facing surface from the supply position of electronic components is reversed;And angle change part, changes the angle of pickup cylinder clamp along the surface parallel to facing surface.

Description

TECHNICAL FIELD

[0001] The present application relates to a pickup device and mounting device. BACKGROUND

[0002] When electronic parts such as logic devices, memories, image sensors, and the like are mounted on a substrate as semiconductor elements, a wafer in which the semiconductor elements are formed is singulated by dicing. Then, the chips are individually picked up by a pickup device, transferred to a substrate, and mounted by a mounting device. As a mounting device used when mounting such semiconductor elements on a substrate, various devices have been proposed, and as one of them, a device including a transfer device of electronic parts such as chips, a supply device, and a substrate stage is known. Further, a pickup device, a mounting device, and a control device thereof are provided on the transfer device. The pickup device picks up electronic parts from the supply device and delivers the picked-up electronic parts to the mounting device.

[0003] As one surface of the chip, a surface in which a fine circuit is formed becomes a functional surface. When the chip is picked up from the wafer, if the picked-up member directly contacts the functional surface, there is a concern that the circuit or the like is damaged, and thus it is desirable to avoid contact.

[0004] Further, a connection terminal of the surface of the chip is also engaged with a connection terminal of the substrate. At this time, in order to ensure and improve the engagement of the connection terminals with each other, a surface treatment such as plasma treatment or surface activation treatment is sometimes performed on the surface of the chip. In order to maintain the surface state of the chip on which such treatment is performed, it is also desirable to avoid direct contact of the picked-up member with the surface of the chip.

[0005] In order to cope with the requirement that the member does not contact the surface of the chip, in the past, in a collet that picks up a chip, a surface that holds the chip is provided as a tapered surface, and the chip is suction-held from the center of the chip in a state in which not the surface of the chip but only the peripheral edge portion contacts the tapered surface of the collet (see Patent Document 1).

[0006] [Related Art Documents]

[0007] [Patent Documents]

[0008] [Patent Document 1] Japanese Patent Realization Publication No. 63-124746 SUMMARY

[0009] [Problems to be Solved by the Invention]

[0010] However, in the prior art as described above, only the peripheral portion of the chip is in contact with the collet, and suction is performed from the central portion of the chip. Therefore, the chip is easily strained, and there is a possibility that the chip will be damaged or broken. Further, the collet is in contact with the edge portion of the peripheral portion of the chip, and the chip being sucked is supported by the contact portion, and thus stress is concentrated on the peripheral portion, and there is a possibility that the chip will be damaged or broken. Furthermore, since the holding position of the chip is fixed in the state of being held by suction, in the case where the chip is shifted or tilted during the holding by suction, the shift or tilt cannot be corrected when the chip is transferred to the mounting device.

[0011] An embodiment of the present application is achieved to solve the problems as described above, and has an object to provide a pickup device and a mounting device which pick up an electronic component in a non-contact manner and position the electronic component.

[0012] [Technical means for solving the problems]

[0013] An embodiment of the present application is a pickup device which has a rectangular outer edge and picks up an electronic component, the pickup device including: a pickup collet which holds the electronic component by suction; and a direction changing portion which changes the orientation of the pickup collet, the pickup collet including a porous member which has air permeability, ejects gas supplied to the inside in a surface shape through a fine hole of a facing surface facing the electronic component, has a suction hole provided in the porous member, the suction hole having an opening in the facing surface, sucks the electronic component by negative pressure, and has a guide portion which is disposed so as to follow the outer edge of the electronic component, restricts movement of the electronic component held by the facing surface, the direction changing portion including a rotation portion which rotates the pickup collet so that the facing surface is reversed from a supply position of the electronic component, and an angle changing portion which changes the angle of the pickup collet along a surface parallel to the facing surface.

[0014] Further, a mounting device of an embodiment of the present application includes the pickup device, a bonding head which is disposed so as to be relatively movable with respect to the pickup collet, receives the electronic component from the pickup collet, and a mounting device which transfers and mounts the electronic component held by the bonding head to a substrate.

[0015] [Effects of the invention]

[0016] The pickup device and the mounting device according to the embodiment of the present application can pick up an electronic component in a non-contact manner and position the electronic component. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 is a front view of a transfer device and a mounting device of an embodiment.

[0018] Figure 2 is a plan view showing the transfer device and the mounting device of the embodiment.

[0019] Figure 3 (A) of FIG. 1 is a cross-sectional schematic view showing a principle of holding an electronic component by the pickup collet, Figure 3 (B) is a bottom surface side perspective view showing the base.

[0020] Figure 4 is a bottom surface side perspective view showing the pickup collet and the attachment / detachment section.

[0021] Figure 5 is a top surface side perspective view showing the pickup collet and the attachment / detachment section.

[0022] Figure 6 is a perspective view showing the direction changing section.

[0023] Figure 7 (A) to Figure 7 (E) of FIG. 1 are explanatory views showing a positioning action of the electronic component by changing the orientation of the pickup collet, the left side being a side view and the right side being a bottom view of the pickup collet.

[0024] Figure 8 (A) to Figure 8 (E) of FIG. 2 are explanatory views showing another form of a positioning action of the electronic component by changing the orientation of the pickup collet, the left side being a side view and the right side being a bottom view of the pickup collet.

[0025] Figure 9 is a block diagram showing a control device of the transfer device and the mounting device.

[0026] Figure 10 is a flowchart showing the sequence of the pickup action of the embodiment.

[0027] Figure 11 (A) to Figure 11 (D) of FIG. 3 are explanatory views showing the pickup action of the embodiment.

[0028] Figure 12 (A) to Figure 12 (F) of FIG. 4 are explanations of other examples of a positioning action of the electronic component by changing the orientation of the pickup collet, the left side being a side view and the right side being a bottom view of the pickup collet.

[0029] Figure 13 (A) and Figure 13 (B) of FIG. 5 are cross-sectional schematic views showing a modified example provided with a guide section having a spouting port.

[0030] Figure 14 (A) and Figure 14(A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection.

[0031] Figure 15 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection. Figure 15

[0032] Figure 16 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection.

[0033] Figure 17 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection.

[0034] Figure 18 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection.

[0035] Figure 19 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection. Figure 19

[0036] Figure 20 (A) and (B) of FIG. 1 are a bottom surface view and a sectional view, respectively, showing a principle of positioning of an electronic component by using gas ejection. Figure 20

[0037] [Explanation of Symbols]

[0038] 1: Transfer device

[0039] 2: Electronic component

[0040] 10: Supply device

[0041] 11: Sheet

[0042] 12: Supply stage

[0043] 13, 61: Stage moving mechanism

[0044] 20: Pickup device

[0045] 21: Pickup head

[0046] 22: Collet moving mechanism

[0047] 23: Direction changing portion

[0048] 24: Push pin

[0049] 30: Mounting device

[0050] 31: Bonding head

[0051] 31a: Nozzle​​​

[0052] 32: head moving mechanism

[0053] 50: control device

[0054] 51: supply device control section

[0055] 52: push pin control section

[0056] 53: pickup control section

[0057] 54: bonding head control section

[0058] 56: substrate stage control section

[0059] 57: storage section

[0060] 60: substrate stage

[0061] 100: mounting device

[0062] 200: pickup collet

[0063] 201: porous member

[0064] 201a: facing surface

[0065] 201b: back surface

[0066] 201c: suction hole

[0067] 201d: opening

[0068] 202: base

[0069] 202a: air supply hole

[0070] 202b: air exhaust hole

[0071] 202c: mounting hole

[0072] 203, 203K to 203N: guide portion

[0073] 203a: air passage portion

[0074] 203b: discharge port

[0075] 203c: guide porous member

[0076] 203d: suction port

[0077] 221, 321: sliding mechanism

[0078] 221a, 321a: support frame

[0079] 221b, 321b: rail

[0080] 221c, 321c: Slider

[0081] 222, 322: Lifting mechanism

[0082] 222a: Arm

[0083] 222b: Loading and unloading section

[0084] 222c: Selling

[0085] 231: Rotating part

[0086] 231a, 232a: Driver source

[0087] 232: Angle Change Section

[0088] 241: Support body

[0089] G: Gas

[0090] P1: Supply Location

[0091] P2: Handover Location

[0092] P3: Installation Location

[0093] RT: Rotational trajectory Detailed Implementation

[0094] Embodiments of the present invention will be described with reference to the accompanying drawings. Note that the drawings are schematic diagrams, and dimensions, proportions, etc., of each part include exaggerated portions for ease of understanding. Figure 1 and Figure 2 As shown, the pickup clip 200 of this embodiment is used in the transfer device 1 for electronic component 2. The transfer device 1 includes a pickup device 20, a mounting device 30, and a control device 50, and uses the pickup device 20 to transfer the electronic component 2 to the mounting device 30.

[0095] Electronic component 2 is, for example, a small, rectangular wafer. In this embodiment, electronic component 2 is a semiconductor chip that is sliced ​​into individual wafers. One side of the semiconductor chip has a functional surface that functions as a semiconductor element. Furthermore, the mounting apparatus 100 is an apparatus that mounts the electronic component 2 supplied from the supply apparatus 10 onto a substrate via the transfer apparatus 1. That is, in addition to the structure including the transfer apparatus 1, the mounting apparatus 100 also includes the supply apparatus 10 and a substrate stage 60 that supports the substrate.

[0096] The supply device 10 is a device for supplying electronic component 2 to the pickup device 20. The supply device 10 moves the electronic component 2, which is to be picked up, to a supply position P1. The supply position P1 is the position where the pickup device 20 picks up the electronic component 2, which is to be picked up. The supply device 10 includes a supply platform 12 supporting a sheet 11 to which the electronic component 2 is attached, and a platform moving mechanism 13 for moving the supply platform 12. The platform moving mechanism 13 may, for example, be a linear guide that moves a slider on a track by a ball screw mechanism driven by a servo motor.

[0097] Here, the sheet 11 on which the electronic components 2 are attached is an adhesive wafer sheet attached to a wafer ring (not shown). The electronic components 2 are arranged in a matrix on the sheet 11. In this embodiment, the electronic components 2 are arranged with their functional surfaces facing upwards.

[0098] The supply stage 12 is a platform that horizontally supports the wafer ring to which the sheet 11 is attached. That is, the supply stage 12 supports the sheet 11 to which the electronic component 2 is attached via the wafer ring. The supply stage 12 is configured to be movable in the horizontal direction via the stage moving mechanism 13. The sheet 11 is horizontally supported together by the supply stage 12 and the stage moving mechanism 13, so the sheet 11 and the electronic component 2 mounted on the sheet 11 are also configured to be movable in the horizontal direction.

[0099] In addition, such as Figure 1 As shown, the direction in which the supply device 10 and the mounting device 30 are arranged in the horizontal direction is called the X-axis direction, and the direction orthogonal to the X-axis is called the Y-axis direction. Furthermore, the direction orthogonal to the plane of the sheet 11 is called the Z-axis direction or the up-down direction. The up direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is mounted, and the down direction is the direction bounded by the plane of the sheet 11 and on the side where the electronic component 2 is not mounted. The θz direction is the direction of rotation on a plane parallel to the XY plane, and the θx direction is the direction of rotation on a plane parallel to the ZY plane.

[0100] [Pickup device]

[0101] The pickup device 20 is a device that picks up electronic components 2 from the supply device 10 and transfers the picked-up electronic components 2 to the mounting device 30. The pickup device 20 includes a pickup collet 200, a collet moving mechanism 22, a direction changing part 23, and an upper pusher 24.

[0102] like Figures 3-5 As shown, the pickup clip 200 is a component that sucks up and holds the electronic component 2 and releases the electronic component 2 by releasing the suction and holding. The pickup clip 200 has a porous component 201, a base 202, and a guide portion 203.

[0103] The porous component 201 is a component that is breathable and supplies gas to its interior through fine pores in its facing surface 201a, which faces the electronic component 2 (the gas supplied to the electronic component 2 is illustrated in the following description using the symbol G). The porous component 201 of this embodiment is a cuboid plate shape, generally dense and substantially uniformly forming interconnected fine spaces. The porous component 201 is breathable due to this structure, but its conductivity is very low. Any face of the porous component 201 is called the facing surface 201a. If gas is supplied to the interior from the back surface 201b, which is opposite to the facing surface 201a, gas will be ejected from the dense and uniformly distributed fine pores of the facing surface 201a. This ejection is essentially a planar ejection that extends across the entire surface of the ejecting facing surface 201a. The ejection is extremely slow, almost like seepage, to the point where one can barely feel the airflow near a finger. In addition, the pores on surfaces other than the facing surface 201a and the back surface 201b can also be blocked.

[0104] The porous component 201 is a continuous structure, as described above, in which fine pores of internal microspace are interconnected and gas can pass through the pores. Sintered metal, ceramic, resin, etc., can be used as such a porous component 201. From the viewpoint that it is difficult for internal particles to separate and flow out, sintered metal is preferred.

[0105] Furthermore, such as Figure 3 and Figure 4 As shown, a suction hole 201c is provided in the porous component 201. The suction hole 201c is a through hole with an opening 201d on the facing surface 201a, through which the electronic component 2 is suctioned by negative pressure. In this embodiment, the suction hole 201c extends linearly from the center of the back surface 201b to the center of the facing surface 201a.

[0106] The base 202 is a component that covers the surface of the porous member 201 other than the facing surface 201a. In this embodiment, the base 202 is a cuboid-shaped box with an opening at the bottom. The shape of the base 202 forms the rectangular outer edge of the pickup clip 200. The porous member 201 is inserted into the base 202 through the opening of the base 202 with its bottom surface facing the facing surface 201a, and is assembled and fixed inside the base 202.

[0107] like Figure 3 and Figure 5As shown, an air supply hole 202a, an exhaust hole 202b, and a mounting hole 202c are provided on the top surface of the base 202. The air supply hole 202a is a through hole for supplying air to the porous component 201. The air supply hole 202a is formed near the outer edge of the base 202 due to the piping connected to it. The exhaust hole 202b is a through hole for generating negative pressure in the opening 201d via the suction hole 201c. The exhaust hole 202b extends downwards, forming in a manner consistent with the suction hole 201c of the porous component 201. A space for gas retention is formed between the inner surface of the base 202 surrounding the exhaust hole 202b and the porous component 201. Additionally, the exhaust hole 202b can also penetrate the suction hole 201c to reach the opposing surface 201a. In this case, the suction hole 201c and opening 201d of the porous member 201 are provided in close contact with the outer side of the vent hole 202b reaching the opposing surface 201a of the porous member 201. The mounting hole 202c is a pair of recessed holes used to prevent displacement when connected to the collet moving mechanism 22.

[0108] The gas supply port 202a is connected to a gas supply circuit via a pipe (not shown). The supply circuit includes a gas supply source, a pump, valves, etc. Here, the gas supplied to the porous component 201 via the gas supply port 202a is an inert gas. The exhaust port 202b is connected to a negative pressure generating circuit including a vacuum pump, valves, etc. via a pipe (not shown).

[0109] The guide portion 203 is a component disposed along the outer edge of the electronic component 2 and restricting the movement of the electronic component 2 held by the opposing surface 201a. "Along the outer edge of the electronic component 2" simply means disposed in the direction along the outer edge; the guide portion 203 does not necessarily need to be in contact with the electronic component 2. In this embodiment, the guide portion 203 is disposed along the four sides of the side of the rectangular base 202. For example... Figure 3 , Figure 4 and Figure 5 As shown, the guide section 203 consists of a plurality of plate-like bodies arranged along the four sides of the base 202, that is, the four sides of the rectangular facing surface 201a. In this embodiment, one guide section 203 is provided on each side of the facing surface 201a, but it is not limited to this.

[0110] Each guide portion 203 has a protruding portion that protrudes more than the facing surface 201a. The distance by which the guide portion 203 protrudes from the facing surface 201a (the amount of protrusion) only needs to be at least the extent from the facing surface 201a to the electronic component 2 held across the gas layer. However, in the case where the protruding portion of the guide portion 203 protrudes beyond the electronic component 2 held across the gas layer by the facing surface 201a, when picking up from the wafer, it is necessary to take into account avoiding contact with the electronic components 2 around the picked-up electronic component 2. Therefore, the distance by which the protruding portion of the guide portion 203 protrudes from the facing surface 201a is preferably set to within the side surface of the electronic component 2 held across the gas layer by the facing surface 201a. However, as described below, by controlling the push pin 24 at the time of picking up, it is possible to cope with various amounts of protrusion while avoiding contact with the electronic components 2 around.

[0111] In addition, in the following description, one of the orthogonal guide portions 203 is denoted as 203K, 203L, and the other orthogonal guide portion 203 is denoted as 203M, 203N, and the guide portions 203 are described without distinguishing between these. The so-called orthogonality here includes the case where two guide portions 203 of adjacent sides are in contact or continuous to form a right angle, and also includes the case where there are a plurality of guide portions 203 on one side and the straight lines (planes) along which these guide portions 203 are separated are orthogonal (see Figure 19 ).

[0112] The collet moving mechanism 22 is a mechanism that moves the pick-up head 21 on which the pick-up collet 200 is mounted back and forth between the supply position PI and the handover position P2, and raises and lowers the pick-up head 21 at the supply position PI and the handover position P2. In addition, the handover position P2 is a position at which the pick-up device 20 hands over the electronic component 2 picked up at the supply position PI to the bonding head 31 described later that functions as a receiving portion. The supply position PI and the handover position P2 refer mainly to positions in the XY direction, and do not necessarily refer to positions in the Z-axis direction.

[0113] Furthermore, even in the case of referring to positions (heights) in the Z-axis direction, the heights have a prescribed width. The prescribed width includes the thickness of the electronic component 2, the distance by which the electronic component 2 is pushed up, the distance at which the electronic component 2 can be adsorbed, and the like. In particular, in the case of referring to positions (heights) in the Z-axis direction, in the supply position PI, the height at the approach position is set to HI, and the height at the peeling position is set to H2 (see Figure 11 ).

[0114] The collet moving mechanism 22 has an arm 222a on which the pickup head 21 is mounted, and moves the pickup collet 200 mounted on the pickup head 21 by moving the arm 222a. A mounting / demounting portion 222b is provided at the front end of the pickup head 21. The mounting / demounting portion 222b includes a magnet inside, and holds the base 202 of the pickup collet 200 by suction using the suction force of the magnet. As shown in Figure 4 and Figure 5 A pair of pins 222c is provided at the contact surface of the mounting / demounting portion 222b with the base 202. By fitting the pins 222c into the mounting holes 202c provided in the base 202, the pickup collet 200 is prevented from deviating with respect to the mounting / demounting portion 222b. In addition, although not shown, a pipe connected to the exhaust hole 202b is supported by the mounting / demounting portion 222b, and a pipe connected to the supply hole 202a is supported by the mounting / demounting portion 222b.

[0115] The collet moving mechanism 22 includes a sliding mechanism 221 and a lifting mechanism 222. The sliding mechanism 221 moves the pickup collet 200 back and forth between the supply position PI and the handover position P2 by moving the arm 222a on which the pickup head 21 is mounted. Here, the sliding mechanism 221 has a rail 221b extending in parallel with the X-axis direction and fixed to a support frame 221a, and a slider 221c that travels on the rail 221b.

[0116] The lifting mechanism 222 moves the pickup collet 200 in the vertical direction by moving the arm 222a on which the pickup head 21 is mounted. Specifically, the lifting mechanism 222 can use a linear guide that moves a slider on a rail by a ball screw mechanism driven by a servo motor. That is, by driving the servo motor, the pickup collet 200 is lifted and lowered in the Z-axis direction. In addition, the pickup collet 200 is elastically supported by the pickup head 21 via the mounting / demounting portion 222b, and is disposed so as to be able to slide vertically in the Z-axis direction with respect to the pickup head 21. Furthermore, the pickup head 21 has a sensor that detects the sliding movement.

[0117] The direction changing portion 23 changes the orientation of the pickup collet 200. The orientation of the pickup collet 200 includes the direction from the base 202 toward the facing surface 201a, and the angle along the surface parallel to the facing surface 201a. As shown in Figure 6 The direction changing portion 23 has a rotating portion 231 and an angle changing portion 232. The rotating portion 231 rotates the pickup collet 200 so that the facing surface 201a is reversed from the position at which the electronic component 2 is picked up from the sheet 11.

[0118] The rotating part 231 has a drive source 231a. The drive source 231a is, for example, a motor provided in the lifting mechanism 222, which rotates the pickup head 21 in the θx direction by rotating the arm 222a connected to its rotation axis about the X-axis. As a result, the rotating part 231 can reverse the pickup collet 200 supported by the pickup head 21.

[0119] The angle changing unit 232 changes the angle of the pickup collet 200 along a plane parallel to the opposing surface 201a. As described below, the angle change formed by the angle changing unit 232 is the angle by which the electronic component 2 moves toward the corner of the opposing surface 201a by reversing the direction. Moreover, the angle changing unit 232 changes the angle at any time after picking up the electronic component 2, but after stopping at the position where the opposing surface 201a is reversed, it returns to the original angle (the angle at the time of pickup). The angle changing unit 232 has a drive source 232a and a transmission part (not shown). The drive source 232a is, for example, a motor provided on the pickup head 21, having a rotation axis in the Z-axis direction. The transmission part rotates the pickup head 21 about the Z-axis by transmitting the power of the drive source 232a to the loading / unloading part 222b. The transmission part is, for example, a belt drive mechanism built into the pickup head 21. Thus, the angle changing unit 232 can rotate the pickup collet 200 supported by the pickup head 21 along the θz direction.

[0120] For example, such as Figure 7 As shown in (A), the pickup clip 200, with its opposing surface 201a facing the supply stage 12, adsorbs and holds the electronic component 2 at the supply position P1. Figure 7 (C) Figure 7 As shown in (D), the rotating part 231 of the direction changing unit 23 changes the orientation of the pickup clip 200 from the supply position P1 with the opposing surface 201a facing upward. That is, the electronic component 2 held by the pickup clip 200 is reversed from a direction facing downward with the opposing surface 201a to a direction facing upward. At this time, the angle of rotation around the X-axis from the supply position P1 is 180°.

[0121] Moreover, for example, such as Figure 7 As shown in (B), the angle changing unit 232 rotates the pickup clip 200 at the supply position P1 by 45° around the Z-axis (as shown in α in the figure). This rotation can be performed immediately after picking up the electronic component 2, or it can be performed during rotation using the rotating unit 231. However, it is preferable to change the angle using the angle changing unit 232 before the rotation angle formed by the rotating unit 231 reaches 180°. Then, as... Figure 7 As shown in (E), after the electronic component 2 is reversed by rotating 180°, the angle changing unit 232 causes the pickup clip 200 to rotate 45° to return to the original angle.

[0122] like Figure 1As shown, the upper push pin 24 is disposed below the sheet 11 of the supply device 10. The upper push pin 24 is a needle-like member with a sharp front end. The upper push pin 24 is disposed inside the support body 241 in a manner that the longitudinal direction thereof is parallel to the Z-axis direction.

[0123] The support body 241 has a drive mechanism that causes the upper push pin 24 to advance from or retreat into the inside thereof. The advancement or retreat is performed in the up-down direction. The drive mechanism includes, for example, a slider that moves guided by a track in the up-down direction, and a cylinder or a cam mechanism that drives the slider.

[0124] [Mounting device]

[0125] The mounting device 30 is a device that transports the electronic component 2 received from the pickup device 20 to a mounting position P3 and mounts the electronic component 2 on a substrate. The mounting position P3 is a position at which the electronic component 2 is mounted on the substrate. The mounting device 30 has a bonding head 31 and a head moving mechanism 32.

[0126] The bonding head 31 is a device that has a function as a receiving portion that receives the electronic component 2 from the pickup tube 200 at the handover position P2 and mounts the electronic component 2 on the substrate at the mounting position P3. The bonding head 31 holds the electronic component 2 and releases the electronic component 2 from the holding state after the mounting.

[0127] Specifically, the bonding head 31 includes a nozzle 31a. The nozzle 31a holds the electronic component 2 and releases the electronic component 2 from the holding state. The nozzle 31a includes a nozzle hole. The nozzle hole is opened at a suction surface of the front end of the nozzle 31a. The nozzle hole communicates with a negative pressure generating circuit (not shown) such as a vacuum pump, and a negative pressure is generated by the circuit to hold the electronic component 2 by suction at the suction surface of the nozzle 31a. Also, the electronic component 2 is released from the holding state at the suction surface by releasing the negative pressure.

[0128] The head moving mechanism 32 is a mechanism that moves the bonding head 31 to and fro between the handover position P2 and the mounting position P3 and elevates and lowers the bonding head 31 at the handover position P2 and the mounting position P3. Specifically, the head moving mechanism 32 includes a sliding mechanism 321 and an elevating mechanism 322.

[0129] The sliding mechanism 321 moves the bonding head 31 to and fro between the handover position P2 and the mounting position P3. Here, the sliding mechanism 321 has two tracks 321b that extend in parallel with the X-axis direction and are fixed to a support frame 321a, and a slider 321c that travels on the tracks 321b.

[0130] In addition, although not shown, the sliding mechanism 321 has a sliding mechanism that slides the joint head 31 in the Y-axis direction. The sliding mechanism can also include a rail in the Y-axis direction and a slider that travels on the rail. The slider is driven by a ball screw driven by a rotary motor, a linear motor, or the like. The lifting mechanism 322 moves the joint head 31 in the up-down direction. Specifically, the lifting mechanism 322 can use a linear guide that moves a slider on a rail by a ball screw mechanism driven by a servo motor. That is, by driving of the servo motor, the joint head 31 is lifted in the Z-axis direction.

[0131] The substrate stage 60 is a stage that supports a substrate on which the electronic component 2 is mounted. The substrate stage 60 is provided to the stage moving mechanism 61. The stage moving mechanism 61 is a moving mechanism that slides the substrate stage 60 on the XY plane and positions the mounting position P3 of the electronic component 2 on the substrate. The stage moving mechanism 61 can use, for example, a linear guide that moves a slider on a rail by a ball screw mechanism driven by a servo motor.

[0132] In addition, the mounting device 30 has a not-shown imaging device, an image processing device, and a position recognition device. By the imaging device, the electronic component 2 held by the joint head 31 and the substrate supported by the substrate stage 60 are imaged, and based on an image processed by the image processing device, the position recognition device recognizes the positional relationship of the both. Based on the positional relationship, the mounting device 30 mounts the electronic component 2 on the substrate. As the imaging device, it can be a double field-of-view camera that can simultaneously image the both by being inserted between the electronic component 2 and the substrate, or it can be a camera that separately images the both.

[0133] [Control device]

[0134] The control device 50 controls the start, stop, speed, timing of action, and the like of the supply device 10, the pickup device 20, the mounting device 30, and the substrate stage 60. That is, the control device 50 is a control device of the transfer device 1 and the mounting device 100. The control device 50 can be realized by, for example, a dedicated electronic circuit or a computer that operates in a prescribed program. To the control device 50, an input device that inputs an instruction or information necessary for control by an operator, and an output device that confirms the state of the device are connected. The input device can use a switch, a touch panel, a keyboard, a mouse, or the like. The output device can use a display portion of liquid crystal, organic electroluminescence (EL), or the like.

[0135] Figure 9 is a functional block diagram of the control device 50. As shown in Figure 9 the control device 50 has a supply device control section 51, a push pin control section 52, a pickup control section 53, a joint head control section 54, a substrate stage control section 56, and a storage section 57.

[0136] The supply device control section 51 controls the movement of the supply stage 12. That is, the movement of the electronic component 2 placed on the sheet 11 that becomes a pickup object is controlled. The push pin control section 52 controls the movement of the push pin 24, that is, the operation of the support body 241.

[0137] The pickup control section 53 controls the movement of the pickup tube chuck 200. That is, the pickup control section 53 controls the operation of the tube chuck movement mechanism 22 and the direction changing section 23. For example, the pickup control section 53 controls a gas supply circuit that communicates with the gas supply hole 202a, a negative pressure generation circuit that communicates with the gas exhaust hole 202b, a drive source 231a of the rotation section 231, and a drive source 232a of the angle changing section 232. Thereby, as described below, the pickup control section 53 controls the holding, inversion, positioning, and release of the electronic component 2.

[0138] The head control section 54 controls the movement of the head 31, that is, the operation of the head movement mechanism 32. Also, the head control section 54 controls a negative pressure generation circuit that communicates with the nozzle hole of the head 31, thereby controlling the holding and release of the electronic component 2. The substrate stage control section 56 controls the movement of the substrate stage 60, that is, the operation of the stage movement mechanism 61.

[0139] The storage section 57 is a storage device that includes various memories (a Hard Disk Drive (HDD) or a Solid State Drive (SSD), etc.) as a recording medium, and an interface of the recording medium with the outside. The storage section 57 stores data and programs required for the operation of the transfer device 1 in advance, and stores data required for the operation of the transfer device 1. The required data is, for example, the supply amount of gas, the exhaust pressure, the position coordinates of the supply position P1, the handover position P2, and the mounting position P3, and the position coordinates of each movement mechanism. Each movement mechanism performs movement control of each structure based on these coordinates.

[0140] [Principle of suction holding by pickup tube chuck]

[0141] Next, the principle of suction holding of the electronic component 2 by the pickup tube chuck 200 as described above will be described. As described above, the pickup tube chuck 200 is provided with the gas supply hole 202a and the gas exhaust hole 202b. The gas supply hole 202a is connected to the gas supply circuit, and the gas exhaust hole 202b is connected to the negative pressure generation circuit. The gas supply circuit is connected to the gas supply source 201, and the negative pressure generation circuit is connected to the vacuum pump 203. Figure 3As shown in (A), gas supplied from the gas supply port 202a is ejected in a planar manner through the fine holes of the opposing surface 201a, forming a gas layer between the gas supply port 202a and the electronic component 2. This gas layer is, for example, 2 μm to 10 μm thick. Then, with a negative pressure applied to the suction port 201c via the negative pressure generation circuit, the opposing surface 201a is brought close to the electronic component 2, thereby suction and holding the electronic component 2. At this time, because a gas layer is formed between the opposing surface 201a and the electronic component 2, the opposing surface 201a and the electronic component 2 remain in a non-contact state. Furthermore, by releasing the negative pressure generated by the negative pressure generation circuit, the negative pressure no longer applies to the suction port 201c, thus releasing the electronic component 2 from the pick-up collet 200.

[0142] [The principle of using a pickup collet to position electronic components]

[0143] Furthermore, referring to Figure 7 The principle of the positionable electronic component 2 in the pickup clip 200 described above will be explained. Furthermore, Figure 7 (A) Figure 7 In the diagram on the left of (E), the central dashed line represents the rotating arm 222a (illustrated with dashed lines), and the outer dashed circle and the dashed line in the diagram on the right represent a portion of the rotation trajectory RT of the pickup collet 200. (See diagram for example.) Figure 7 As shown in (A), when the electronic component 2 is held in place by the pick-up collet 200, a pair of opposing guide parts 203K and guide parts 203M are parallel to the rotation trajectory RT. Figure 7 As shown in (B), after picking up the electronic component 2, the angle of the pickup collet 200 is changed by 45° by the angle changing unit 232. At this point, a pair of opposing guide parts 203K and guide parts 203M are tilted by 45° relative to the rotation trajectory RT.

[0144] Then, as Figure 7 As shown in (C), after the pickup chuck 200 is rotated by the rotating part 231, the electronic component 2, held by the opposing surface 201a, moves towards the corner of the opposing surface 201a along which one of the orthogonal guide parts 203K and 203L is located due to inertia and gravity. As described above, the electronic component 2 is held by the pickup chuck 200 in a state where it is not in contact with the opposing surface 201a due to a gas layer, and it is easy to move in a direction parallel to the opposing surface 201a. Thus, it is positioned such that two of the orthogonal sides of the electronic component 2 are in contact with the guide parts 203K and 203L. That is, the electronic component 2 is positioned near a corner of the pickup chuck 200.

[0145] Furthermore, such as Figure 7(D) shown in FIG. 10, the rotation section 231 decelerates and reaches the reversal position, and then stops. At this time, the inertia of the electronic component 2 continues to move, but as described below, the electronic component 2 is prevented from moving away from the guide sections 203K and 203L.

[0146] First, since the pickup chuck 200 rotates around the horizontal X axis, the centrifugal force, the gravitational force, and the inertial force act on the electronic component 2 during rotation. Therefore, at the time of rotation stop, the centrifugal force and the inertial force act on the electronic component 2 to move away from one of the orthogonal guide sections 203K and 203L. Moreover, the inertial force acts in such a manner that, in the reversed state, the inertial force and the gravitational force press the electronic component 2 against the pickup chuck 200 in the vertical direction (refer to (D) of FIG. 10). Figure 7 The electronic component 2 is held with respect to the pickup chuck 200 via the gas layer, but if the force acts in such a vertical direction, it becomes difficult to move in the horizontal direction. That is, the force to move away from one of the orthogonal guide sections 203K and 203L does not act on the electronic component 2.

[0147] Here, the rotation of the pickup chuck 200 in the reversal is not suddenly stopped, but gradually decelerates and stops as described above. Therefore, the centrifugal force gradually decreases toward the stop, and does not act at the time point of the stop of the pickup chuck 200. At the time of the stop of the pickup chuck 200, the inertia due to the deceleration acts. Therefore, the deceleration is set to a degree at which the electronic component 2 does not move away from the guide sections 203K and 203L. In this way, the electronic component 2 is prevented from moving away from the guide sections 203K and 203L. The electronic component 2 is positioned at an appropriate position of the corner of the facing surface 201a along which the guide sections 203K and 203L at the reversed position.

[0148] At the end of the reversal, since the electronic component 2 is positioned at one of the corners of the facing surface 201a, the positional displacement of the electronic component 2 due to the pickup and the reversal operation can be corrected. Even if the electronic component 2 moves on the facing surface 201a, as described above, the facing surface 201a and the electronic component 2 maintain a state in which they do not contact, and thus there is no case in which the surface of the facing surface 201a side of the electronic component 2 is damaged. Moreover, at the initial stage of the reversal operation, since the speed of the acceleration is slow, the impact at the time of approaching the guide sections 203K and 203L is small. Therefore, there is almost no danger of damage or breakage. There is also no danger of collision with the facing guide sections 203M and 203N.

[0149] Moreover, in the mode, the deceleration at the time of the reversal stop is set to a degree that the electronic component 2 does not move away from the guide portions 203K, 203L, but can be set to a degree that the electronic component 2 moves away from the guide portions 203K, 203L. That is, as shown in (D) of FIG. 10, it can be set to a deceleration at which the electronic component 2 held by the facing surface 201a moves to a corner of the facing surface 201a along which the other orthogonal guide portions 203M, 203N due to the inertial force and the gravitational force when stopped at the reversal position. Figure 8 (C) of FIG. 10, it can be set to a deceleration at which the electronic component 2 held by the facing surface 201a moves to a corner of the facing surface 201a along which the other orthogonal guide portions 203M, 203N due to the inertial force and the gravitational force when stopped at the reversal position. Figure 8 (A) to (C) of FIG. 10 are the same as the above Figure 8 (A) to (C) of FIG. 10 are the same as the above Figure 7 (A) to (C) of FIG. 10 are the same as the above Figure 7 (A) to (C) of FIG. 10 are the same as the above Figure 8 (E) of FIG. 10, after reversing the electronic component 2 by 180° of rotation, the angle changing portion 232 rotates the pickup tube holder 200 by 45° to restore the original angle.

[0150] In the case where the electronic component 2 is positioned at the guide portions 203M, 203N, the deceleration of the rotation of the rotation portion 231 is increased at the time of stopping the rotation of the reversal. If stopped at the reversal position in the above manner, the inertia allows the electronic component 2 to move to a corner of the facing surface 201a along which the guide portions 203M, 203N. Since the time taken for the deceleration is shortened, the time taken for the reversal is shortened, and the productivity can be improved by suppressing the influence of changing the angle of the pickup tube holder 200 on the tact time. However, there is a possibility that the electronic component 2 is affected by the contact with the guide portions 203M, 203N. Therefore, the deceleration of the rotation portion 231 is set to a degree that allows the movement of the electronic component 2 and the influence of the contact on the electronic component 2.

[0151] In addition, the electronic component 2 does not necessarily need to be positioned in contact with the guide portions 203. It is sufficient to enter the recognition range of the electronic component 2 in a state close to the guide portions 203, and it is not necessary to be positioned at a fixed position as long as it is in the recognition range.

[0152] [Operation]

[0153] As for the operation of picking up the electronic component 2 from the supply device 10 by the pickup device 20 and delivering the electronic component 2 to the mounting device 30 in the transfer device 1 as above, in addition to referring to the flowchart of FIG. 11, Figures 1-8 , the explanatory diagram of FIG. 12, Figure 10 , the explanatory diagram of FIG. 13 are described below. Figure 11

[0154] ​First, the pickup cylinder chuck 200 is moved to the feeding position Pl where the push pin 24 is located by the pickup device 20 and the feeding device 10, and the facing surface 201a of the pickup cylinder chuck 200 is brought into facing relation with the push pin 24 (step S01). At this time, the pressurized gas is supplied to the porous member 201 via the gas supply hole 202a, and the gas is blown out from the facing surface 201a. Also, at this time, the gas is not discharged from the gas discharge hole 202b, and the suction is not performed from the opening 201d.

[0155] On the other hand, the feeding device 10 moves the feeding stage 12, and as shown in (A) of FIG. 6, the electronic component 2 as the pickup target is positioned at the feeding position Pl (step S02). Then, the pickup cylinder chuck 200 whose facing surface 201a is supplied with the gas is lowered together with the pickup head 21, and approaches the electronic component 2. At this time, as shown in (B) of FIG. 6, in order to avoid the collision of the guide portion 203 with the surrounding electronic components 2, the push pin 24 is raised to push up the electronic component 2 as the pickup target, according to the amount of protrusion of the guide portion 203 from the facing surface 201a, at the same time as the pickup cylinder chuck 200 starts to be lowered, whereby the electronic component 2 as the pickup target is raised to a height at which the guide portion 203 does not collide with the surrounding electronic components 2. Figure 11 Figure 11

[0156] When the pickup cylinder chuck 200 which is being lowered approaches the electronic component 2, the gas supplied to the surface of the facing surface 201a is sandwiched by the facing surface 201a and the electronic component 2, and a gas layer is formed. It is considered that the gas layer which is sandwiched at this time becomes a viscous flow layer. Therefore, the flowability of the gas G of the gas layer itself is very poor, and the suction caused by the discharge from the gas discharge hole 202b described later, and the outflow from the outer edge portion of the gas layer hardly occur. Then, the pickup cylinder chuck 200 stops the lowering with respect to the electronic component 2 by the gas layer which is not further compressed (step S03). At this time, as described above, the electronic component 2 as the pickup target is raised with respect to the surrounding electronic components 2, and therefore the guide portion 203 does not come into contact with the electronic components 2 surrounding the pickup target on the sheet 11.

[0157] Even if the lowering of the pickup cylinder chuck 200 with respect to the electronic component 2 is stopped, since the pickup cylinder chuck 200 is elastically supported by the pickup head 21, the pickup head 21 continues to be lowered, and the pickup head 21 is moved in sliding relation with respect to the pickup cylinder chuck 200. If the sliding is detected by the sensor, the pickup control section 53 recognizes that the pickup cylinder chuck 200 has reached the electronic component 2, and stops the lowering of the pickup head 21.

[0158] ​​As described above, at the time of stop of the pickup head 21, the pickup cylinder 200 forms a gas layer between the facing surface 201a and the electronic component 2 as described above, and the facing surface 201a stops via the gas layer, and no longer further approaches the electronic component 2. Therefore, the pickup cylinder 200 is not in direct contact with the electronic component 2. The height position of the pickup cylinder 200 at this time becomes the approach position Hl (refer to Figure 9 ).

[0159] Thus, the pickup cylinder 200 stops via the gas layer, and further, in the state where the pickup head 21 is stopped, the suction by the suction hole 201c is started by exhausting from the exhaust hole 202b (step S04). That is, as shown in (C) of FIG. 6, in the state where the pickup cylinder 200 presses the electronic component 2 against the sheet 11 supported by the support body 241 via the gas layer, that is, in the state where the sheet 11 and the electronic component 2 are sandwiched between the pickup cylinder 200 and the support body 241, the suction is started. Figure 11

[0160] In the state, the pickup cylinder 200 is raised, and in synchronization therewith, the ejector pin 24 is further raised, and after rising by a predetermined prescribed amount, is stopped (step S05). Then, as shown in (D) of FIG. 6, the electronic component 2 sucked to the pickup cylinder 200 by the negative pressure in the state where the gap formed by the gas layer is maintained is peeled from the sheet 11 by the pickup cylinder 200 further raised, and thereby is picked up (step S06). The height position at which the electronic component 2 is thus completely peeled is the peeling position H2. Figure 11 As shown in (B) of FIG. 6, the angle changing portion 232 of the direction changing portion 23 changes the angle of the pickup cylinder 200 (step S07). Then, the rotation portion 231 of the direction changing portion 23 reverses the pickup cylinder 200 (step S08). That is, the orientation of the pickup cylinder 200 is rotated 180° in the up-down direction, and the facing surface 201a of the pickup cylinder 200 is oriented upward. Also, here, the reversing action of step S07 is performed immediately after the electronic component 2 is picked up, but can be performed at an arbitrary point between the supply position Pl and the handover position P2.

[0161] Figure 7 Also, after the reversal, in the case of moving to the handover position P2, the force accompanying the reversal or the horizontal movement applied to the electronic component 2 is dispersed, and therefore the risk of falling from the pickup cylinder 200 can be reduced. In the case of moving while reversing, the reversal and the horizontal movement cooperate in the force, and therefore the possibility of falling is increased, but the tact time can be shortened, and the productivity is improved. The possibility of falling varies depending on the size (size, thickness, etc.) of the electronic component 2, and therefore it is preferable to appropriately select the action depending on the electronic component 2.

[0162] In the reversing process, as shown in (A) of FIG. 7, the pickup cylinder 200 is reversed, and the facing surface 201a of the pickup cylinder 200 is oriented upward. Also, the ejector pin 24 is further raised, and the electronic component 2 is held by the pickup cylinder 200 and the ejector pin 24.

[0163] In the reversing process, as shown in (A) of FIG. 7, the pickup cylinder 200 is reversed, and the facing surface 201a of the pickup cylinder 200 is oriented upward. Also, the ejector pin 24 is further raised, and the electronic component 2 is held by the pickup cylinder 200 and the ejector pin 24.​​Figure 7 As shown in (C) of FIG. 9, the electronic component 2 moves to a corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Then, the pickup collet 200 is decelerated in the vicinity of the reversal position and stopped at the reversal position. As shown in (D) of FIG. 9, the electronic component 2 is maintained in a state of being positioned at the corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Further, as shown in (E) of FIG. 9, the direction changing portion 23 restores the pickup collet 200 to the original angle (refer to (A) of FIG. 9) (step S09). Figure 7 As shown in (C) of FIG. 9, the electronic component 2 moves to a corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Then, the pickup collet 200 is decelerated in the vicinity of the reversal position and stopped at the reversal position. As shown in (D) of FIG. 9, the electronic component 2 is maintained in a state of being positioned at the corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Further, as shown in (E) of FIG. 9, the direction changing portion 23 restores the pickup collet 200 to the original angle (refer to (A) of FIG. 9) (step S09). Figure 7 As shown in (C) of FIG. 9, the electronic component 2 moves to a corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Then, the pickup collet 200 is decelerated in the vicinity of the reversal position and stopped at the reversal position. As shown in (D) of FIG. 9, the electronic component 2 is maintained in a state of being positioned at the corner of the facing surface 201a along which the guide portions 203K, 203L are extended. Further, as shown in (E) of FIG. 9, the direction changing portion 23 restores the pickup collet 200 to the original angle (refer to (A) of FIG. 9) (step S09). Figure 7

[0164] Next, the pickup device 20 moves the picked-up electronic component 2 to the handover position P2 by the collet moving mechanism 22 (step S10). At the handover position P2, the engagement head 31 of the mounting device 30 is waiting, facing the facing surface 201a of the pickup collet 200 across the electronic component 2.

[0165] The engagement head 31 is lowered toward the pickup collet 200 at the handover position P2, and after the electronic component 2 is held by the engagement head 31, the pickup collet 200 is released from the negative pressure, thereby handing over the electronic component 2 from the pickup collet 200 to the engagement head 31 (step S11). Then, the engagement head 31 is raised away from the pickup collet 200 and moved to the mounting position P3, and the electronic component 2 is mounted to the substrate.

[0166] [Effects]

[0167] (1) The present embodiment is a pickup device 20 having a rectangular outer periphery, and sucking and holding and picking up an electronic component 2, the pickup device 20 having a pickup collet 200 that sucks and holds the electronic component 2, and a direction changing portion 23 that changes the orientation of the pickup collet 200.

[0168] In the pickup collet 200, there is a porous member 201 having air permeability, which sprays gas supplied to the inside in a surface shape through fine pores of a facing surface 201a facing the electronic component 2, a suction hole 201c is provided in the porous member 201, the suction hole 201c has an opening 201d at the facing surface 201a, the electronic component 2 is sucked by negative pressure, a guide portion 203 is provided, the guide portion 203 is arranged in a manner of extending along the outer periphery of the electronic component 2, and movement of the electronic component 2 held by the facing surface 201a is restricted.

[0169] The direction changing portion 23 has a rotation portion 231 that rotates the pickup collet 200 in a manner of reversing the facing surface 201a from the supply position Pl of the electronic component 2, and an angle changing portion 232 that changes the angle of the pickup collet 200 along a surface parallel to the facing surface 201a.​

[0170] Further, the pickup tube chuck 200 of the present embodiment hands over the electronic component 2 picked up and reversed to the mounting device 30 mounted to the substrate.

[0171] Further, the mounting device 100 of the present embodiment has: the pickup device 20; the bonding head 31 provided so as to be relatively movable with respect to the pickup tube chuck 200, receiving the electronic component 2 from the front end of the pickup tube chuck 200; and the mounting device 30, which transports and mounts the electronic component 2 held by the bonding head 31 to the substrate.

[0172] Therefore, when the electronic component 2 is picked up by suction from the suction holes 201c, the electronic component 2 can be prevented from coming into contact with the facing surface 201a by the layer of gas discharged from the fine holes of the porous member 201, and damage to the electronic component 2 can be suppressed. Further, when the electronic component 2 is transported, the possibility of damage to the electronic component 2 by contact with the facing surface 201a can be reduced, and the electronic component 2 can be held to prevent dropping and the like.

[0173] Further, even if the electronic component 2 moves horizontally on the facing surface 201a held in a non-contact manner by the layer of gas, accompanied by inertial force during movement of the electronic component 2 at the time of reversal and the like, the electronic component 2 can be prevented from escaping from the pickup tube chuck 200 by the guide portion 203.

[0174] Further, at the time of reversal, by changing the angle of the pickup tube chuck 200 using the angle changing portion 232, the electronic component 2 can be positioned at a corner formed by the planes along which the orthogonal guide portions 203K, 203L, or the orthogonal guide portions 203M, 203N. That is, the position in the XY plane can be determined by two orthogonal edges. Therefore, when the electronic component 2 is picked up, even if the position, angle, and the like of the electronic component 2 held by the facing surface 201a are uneven, at an appropriate position (including the allowable range described below), the electronic component 2 can be handed over to the bonding head 31, and deviation and the like at the time of mounting can be reduced. Further, at the time of positioning, the electronic component 2 moves in a direction parallel to the facing surface 201a, but as described above, since the electronic component 2 does not come into contact with the facing surface 201a, damage to the electronic component 2 by friction can be prevented. In addition, within the region surrounded by the guide portions 203, even if the position of the electronic component 2 deviates, as long as the suction of the opening 201d is within the projection plane of the electronic component 2, the electronic component 2 can be suction-held regardless of the position of the opening 201d. It is assumed that there is a case in which the reversal is such that the electronic component 2 approaches one edge of the pickup tube chuck 200 without changing the angle of the pickup tube chuck 200. However, since the possibility of determining the position in only one direction in the XY plane is high, there is a possibility that time is taken, or the amount of correction is large and the error increases, in the position recognition of the handed-over electronic component 2.

[0175] In addition, in the case where the electronic component 2 is positioned at the guide portion 203M and the guide portion 203N after being temporarily brought close to the corner of the facing surface 201a along which the guide portions 203K and 203L, the positioning is performed in two stages from the state where the posture of the electronic component 2 is determined once, and thus the positioning of the electronic component 2 can be performed more surely. In particular, the electronic component 2 can be moved on the diagonal line at the time of stop, and thus the accuracy of the positioning is improved.

[0176] Here, the reason why the guide portions 203 and the positioning are effective in the case where the pickup tube holder 200 holds the electronic component 2 in a non-contact manner as in the present embodiment will be described in further detail. That is, since the electronic component 2 is held by the pickup tube holder 200 in a non-contact manner with the gas layer interposed therebetween, it can be easily moved in the horizontal direction. Thus, there is a case where the electronic component 2 is moved on the facing surface 201a of the pickup tube holder 200 due to the inertial force acting on the electronic component 2 resulting from the movement or reverse operation of the pickup tube holder 200 to the handover position P2. Even if such movement occurs, the movement of the electronic component 2 can be restricted to a prescribed region by the guide portions 203, and thus the electronic component 2 can be prevented from falling off from the pickup tube holder 200.

[0177] Further, in order to avoid contact with the electronic component 2 at the time of pickup from the sheet 11, the facing interval of the guide portions 203 needs to be set to be larger than the size of the electronic component 2. Thus, a gap is provided between the electronic component 2 held by suction by the pickup tube holder 200 and the guide portions 203. Thus, in the case where the movement of the electronic component 2 as described above occurs, there is a case where the holding posture of the position or angle of the electronic component 2 is moved within the range of the amount of the gap. Such a variation in the state of the holding posture is large. If there is such a variation in the holding posture, the holding posture of the electronic component 2 handed over to the bonding head 31 also varies with respect to the reference position (proper position) serving as the positioning reference, and in the case where the holding position of the electronic component 2 is photographed by a photographing device or the like and the position is recognized, the time taken or the amount of correction of the position is large, and thus the movement error at the time of correction becomes large. In the present embodiment, as described above, the proper position is always positioned with respect to the facing surface 201a, and thus the variation in the holding posture can be suppressed, and the amount of correction of the position or the movement error at the time of correction can be reduced.

[0178] In addition, the so-called proper position is a holding posture in which the electronic component 2 held by the pickup tube holder 200 is substantially directly handed over to the bonding head 31, and also corresponds to a reference position for mounting the electronic component 2 to a substrate. The proper position includes the variation in the holding posture with respect to the reference position within the range allowed in the case where the position is recognized by photographing with a camera, as long as the variation is within the range allowed in the time taken for recognition or the movement error in the correction of the movement.

[0179] Moreover, in consideration of a case where gas discharged from the space flows between the electronic component 2 and the surface facing the electronic component 2, thereby holding the electronic component 2 by a Bernoulli chuck using suction force generated by negative pressure generated by the flow of a large amount of gas. In this case, the suction force is very weak, and even if the electronic component 2 can be held in a state where the electronic component 2 is at a certain distance from the collet, the suction force cannot be obtained to peel the electronic component 2 adhering to the sheet 11. Moreover, in order to obtain the Bernoulli effect, it is necessary to make the flow rate of gas per unit time very large, and thus adjustment of the suction force for holding while maintaining non-contact is very difficult. Furthermore, there is a concern that a large amount of gas is blown to the periphery of the pickup site, resulting in generation of particles.

[0180] Moreover, instead of a fine hole like the porous member 201, a gas ejection hole of a size equal to the suction hole is provided on the surface of the collet facing the electronic component 2, and gas is ejected toward the electronic component 2 to suspend the electronic component 2, and in a case where the electronic component 2 is sucked through the suction hole in opposition to the suspension force of the electronic component 2 generated by the ejection, adjustment of the suction force for holding while generally maintaining non-contact (suspension) is also very difficult as described above, and there is a concern that a large amount of gas is blown to the periphery of the pickup site, resulting in generation of particles.

[0181] In contrast, in the present embodiment, the flow rate of gas blown from the entire surface of the facing surface 201a through the fine holes of the facing surface 201a is extremely small. Therefore, there is no concern of generation of particles. Gas blown from the facing surface 201a does not actively suspend the electronic component 2, but forms a layer of gas that forms a viscous flow when the facing surface 201a approaches the electronic component 2. Therefore, the stronger the suction force, the easier it is to hold the facing surface 201a and the electronic component 2 in a non-contact state, and even if the suction force generated by negative pressure from the suction hole 201c is set to a force sufficient to peel the electronic component 2 from the sheet 11, contact can be prevented by the layer of gas between the facing surface 201a and the electronic component 2, and thus it becomes easy to obtain a strong suction force and adjustment of the suction force.

[0182] For example, if the following conditions are met, the result that the non-contact with the electronic component 2 and the suction holding by the pickup cylinder 200 can be maintained. As the porous member 201, a member having a gas permeation rate of, for example, 0.7 L / min or so of the flow rate of the gas flowing out from the porous member 201 at a supply pressure of 0.3 MPa is used. The pressure of the gas (nitrogen) supplied to the porous member 201 can be in the range of 0.1 MPa to 0.7 MPa or so, and at this time, the flow rate of the gas flowing through the porous member 201 is in the range of 0.3 L / min to 1.5 L / min or so, and the non-contact of the pickup cylinder 200 with the electronic component 2 can be surely maintained. Also, as the suction pressure, the range of -10 kPa to -90 kPa, and the electronic component 2 can be surely picked up from the sheet 11. At this time, the pressure in the gas layer between the electronic component 2 and the facing surface 201a is 0.1 MPa to 0.5 MPa.

[0183] (2) The angle change by the angle change section 232 is to reverse the angle at which the electronic component 2 moves toward the corner of the facing surface 201a. Thus, if reversed after the pickup, the electronic component 2 is positioned at the corner of the facing surface 201a.

[0184] (3) The rotation section 231 starts to rotate from the position where the electronic component 2 is picked up, and stops at the position where the facing surface 201a is reversed. Thus, if the angle is changed by the angle change section 232, the electronic component 2 can be positioned at the corner of the facing surface 201a along which the orthogonal guide section 203K, the guide section 203L, or the corner of the facing surface 201a along which the orthogonal guide section 203M, the guide section 203N, by the inertia of the electronic component 2 to continue to move. Thus, without additionally preparing a mechanism to move the electronic component 2, a device that is less likely to have an abnormality and is low in cost can be configured by a simple structure.

[0185] [Modified Example]

[0186] The present application is not limited to the above-described embodiment. The basic structure is the same as that of the above-described embodiment, and the following modified example can also be applied.

[0187] (1) As described above, the angle of change of the pickup chuck 200 formed by the angle changing section 232 is an angle by which the electronic component 2 is moved toward the corner of the facing surface 201a by reversing. In this way, if the guide sections 203 are inclined with respect to the rotation locus RT, the positioning described above can be achieved. Therefore, for example, the angle of change can be set within a range of 10° to 80°. The angle at which movement is easy varies depending on the size of the electronic component 2, the ratio of the length to the width, and the like, and thus is preferably appropriately selected according to the electronic component 2. It can also be found by experiment or the like, as necessary. However, if the angle of change of one of the pair of orthogonal guide sections 203 is too large, movement along the guide section 203 is not easy. Therefore, both are set to approximately 45°, so that with respect to the rotation locus RT, the angles of the pair of orthogonal guide sections 203 are equal and there is no bias, and the action of bringing the electronic component 2 close to the corner can be smoothly performed.

[0188] (2) When the pickup chuck 200 is reversed by the rotation section 231, it is not necessary to necessarily stop at the time when the rotation angle becomes 180° from the start of rotation. For example, it can be such that the rotation section 231 starts rotation from the position at which the electronic component 2 is picked up, and returns to the position at which reversal is performed after the facing surface 201a exceeds the reversed position (rotation angle 180°) and stops. That is, as shown in (A) to (C) of FIG. 10, the rotation section 231 starts the reverse action as in (A) to (C) of FIG. 9, and as shown in (D) of FIG. 10, stops rotation at a position exceeding 180°. In this way, in addition to the inertial force, the gravitational force brings the electronic component 2 close to the corner of the facing surface 201a along which the guide section 203M and the guide section 203N are guided. As shown in (E) of FIG. 10, the rotation section 231 stops the pickup chuck 200 from the state at a lower speed than that at the time of the reverse action and returns to the reversed position. Then, as shown in (F) of FIG. 10, the angle changing section 232 rotates the pickup chuck 200 so as to return to the original angle. Figure 12 Figure 12 Figure 7 Figure 7 Figure 12 Figure 12 Figure 12

[0189] ​​​​​​​Here, in the case where the pickup collet 200 is stopped at the rotation angle of 180° from the start of rotation, the state of positioning of the electronic component 2 is also considered to collapse from the dislodging movement from the guide portions 203K, 203L. Also, in the case where the electronic component 2 is moved in a manner to be actively positioned by the guide portions 203M, 203N, the possibility that the electronic component 2 rebounds when the side surface of the electronic component 2 comes into contact with the guide portions 203M, 203N, or the possibility that the electronic component 2 does not reach the guide portions 203M, 203N because the movement amount of the electronic component 2 is small, is also worried about. However, in the described mode, by making it rotate and pass the position of reversal, the electronic component 2 is brought close to the corner of the facing surface 201a by the gravitational force in addition to the inertial force, and thus the possibility of being able to be positioned can be improved. In Figure 12 In the described mode, the electronic component 2 is positioned by the guide portions 203M, 203N. Also, as described above, when the pickup collet 200 is returned from the position of passing the position of reversal, by lowering the acceleration or deceleration of the return movement, with respect to the pickup collet 200 which is stopped by returning to the position of reversal, the electronic component 2 can be prevented from dislodging from the corner by the inertia.

[0190] In addition, in the described case, the overhanging time of temporarily passing the position of reversal, the time of returning to the position of reversal, and if the return is slow by lowering the acceleration or deceleration, the tact time becomes long. Therefore, by making the angle change while returning from the overhanging position and recovering the change angle, the tact time can be inhibited from becoming long. In the described case, if the recovery of the angle change is slow, the occurrence of the displacement of the electronic component 2 due to the recovery of the change angle can also be inhibited.

[0191] Also, in the case where the rotation angle is 180°, that is, when the pickup collet 200 is stopped at the position of reversal, the electronic component 2 becomes in a horizontal state, and thus the inertial force acting on the electronic component 2 is divided into the force in the horizontal direction and the force in the vertical direction. Therefore, the horizontal force toward the guide portions 203M, 203N is weakened. Also, the inertial force acting in the vertical direction becomes a resistance to movement in the horizontal direction. Therefore, the inertial force acting in the horizontal direction is further weakened. Thus, compared to the possibility that the electronic component 2 rebounds from colliding with the guide portions 203M, 203N, the possibility that the electronic component 2 does not reach the guide portions 203M, 203N should be considered more.

[0192] On the other hand, in the case where the overhanging is performed and temporarily stopped, the force of the electronic component 2 to move is compensated for because the centrifugal force or the component of the gravitational force is also applied. Also, the angle at which the resultant force of the inertial force and the gravitational force acts as a component of the force with respect to the collet surface is also small, and thus the resistance component is also weakened. Therefore, the possibility of being able to be positioned can be improved.

[0193] (3) The timing at which the angle of the pickup chuck 200 is changed and the reverse rotation is started is not limited to the above-described mode. For example, in the mode shown in FIG. 10, the rotation for the reverse is started after the angle is changed, but the angle can be changed after the rotation for the reverse is started. By doing so, the time for the angle change and the time for the reverse rotation can overlap, and thus the increase in the tact time can be suppressed. Figure 7 、 Figure 12

[0194] In the angle change of the pickup chuck 200, a force that rotates the electronic component 2 in the direction parallel to the facing surface 201a is generated. That is, at the time of the pickup, the electronic component 2 is positioned at substantially the center between the guide portions 203. However, due to the angle change of the pickup chuck 200, the electronic component 2 tries to maintain the posture, but the guide portions 203 rotate. Thus, there is a possibility that the electronic component 2 collides with the guide portions 203.

[0195] Moreover, if the rotation for the reverse is started, similarly, the electronic component 2 collides with the guide portions 203. In addition, in the process, the electronic component 2 approaches the guide portion 203K and the guide portion 203L.

[0196] However, if the rotation for the reverse is performed while the angle is changed, the resultant force of the movements of both results in the collision of the guide portions 203K and 203L with the electronic component 2, and thus there is a possibility that the impact at the time of the collision increases. Thus, the risk of the defect or the breakage, the drop also increases. However, such a risk is determined by the size and the weight of the electronic component 2, and thus it is sufficient to appropriately determine whether to overlap the angle change and the reverse depending on the electronic component 2. In addition, as described below, if the collision is avoided by ejecting gas or the like from the guide portions 203, the tact time can be shortened when the operations are overlapped.

[0197] (4) The angle change portion 232 can change the angle of the picked-up electronic component 2, and restore the changed angle in the state in which the rotation for the reverse is performed on the facing surface 201a. That is, the angle can be restored in the middle of the reverse rotation operation regardless of whether the overhang is performed. By doing so, the angle of the pickup chuck 200 can be changed by overlapping the restoration time and the rotation operation, and thus the tact time can be suppressed from being prolonged.

[0198] In the case where the overhang is performed, if the angle is restored during the rotation to return to the reverse position, the force acting on the electronic component 2 decreases, and the electronic component 2 can be suppressed from being deviated from the corner or the vicinity thereof.

[0199] ​In the case of stopping without overhang and in a state of approaching the corner close to the acceleration at the time of reversal, the angle is recovered directly in the deceleration. In the case of stopping without overhang and approaching the opposite corner from the corner close to the acceleration at the time of reversal by the inertial force generated by the deceleration at the time of stopping, the angle is recovered after approaching the opposite corner.

[0200] (5) The operation of recovering after overhanging the pickup chuck 200 can be repeated multiple times. That is, the rotation section 231 of the direction changing section 23 can be driven in such a manner that the pickup chuck 200 approaches and retreats from the reversal position, which is the center, between a position beyond the reversal position and a position on the proximal side of the reversal position. By swinging the pickup chuck 200 in such a manner that the pickup chuck 200 approaches and retreats, the pickup chuck 200 is inclined in the up-and-down direction, the inertial force and the gravitational force act on the electronic component 2, and the electronic component 2 can be caused to approach the corner of the pickup chuck 200. In this case, the electronic component 2 can be caused to approach the corner by gradually slowing the speed of the swing. Also, the swing amplitude can be gradually reduced. Even if the electronic component 2 does not completely approach the corner of the pickup chuck 200, that is, does not come into contact with the orthogonal guide section 203, by the reversal operation or the overhang operation, the electronic component 2 can be positioned more surely by the operation of further approaching.

[0201] (6) The angle changing section 232 can be provided in such a manner that the angle can be changed in the up-and-down direction, the pickup chuck 200 is inclined in the up-and-down direction, and the electronic component 2 is caused to approach the corner of the facing surface 201a. For example, the electronic component 2 can be positioned by being inclined in the up-and-down direction at the reversal position instead of being overhung. Even if the electronic component 2 does not completely approach the corner of the pickup chuck 200 by the reversal operation, the electronic component 2 can be positioned more surely by the operation of further approaching. Of course, the inclination in the up-and-down direction can be performed together with the overhang. Also, the inclination in the up-and-down direction can be repeated multiple times.

[0202] (7) In the described mode, the electronic component 2 is picked up by the angle changing section 232 changing the angle of the pickup chuck 200 after the electronic component 2 is picked up, and the electronic component 2 can be picked up in a state in which the angle of the electronic component 2 in the horizontal direction is inclined, and the angle changing section 232 recovers the angle before being handed over to the bonding head 31.

[0203] (8) As shown in Figure 13 and Figure 14 , the air passage section 203a can be provided in one of the two facing guide sections 203 among the four guide sections 203. The guide section 203 in which the air passage section 203a is provided is provided on both of the adjacent sides of the facing surface 201a. As described below, gas can be ejected from the air passage section 203a to the facing guide section 203. That is, as shown in (A) of Figure 13 , (B) of Figure 14(A) and (B) of FIG. 1, the vent 203a is provided so that one of the four corners in which one of the orthogonal guide portions 203K, 203L (the side hidden in the inner side in (B) of FIG. 1) is orthogonal to the other of the orthogonal guide portions 203M, 203N (the side opposite to the diagonal corner) is made to be the relative positive pressure. By making one of the orthogonal guide portions 203K, 203L side to be the relative positive pressure compared to the other of the orthogonal guide portions 203M, 203N side, the electronic component 2 near the guide portions 203K, 203L side is left in the guide portions 203K, 203L side, and the inertial force at the time of rotation stop is prevented from moving it to the guide portions 203M, 203N side. Thus, the deceleration at the time of stopping rotation can be increased, and the time reduction and the prevention of the rebound due to the collision of the electronic component 2 are achieved. Figure 13 Figure 13 (A) and (B) of FIG. 1, the vent 203a is provided so that one of the four corners in which one of the orthogonal guide portions 203K, 203L (the side hidden in the inner side in (B) of FIG. 1) is orthogonal to the other of the orthogonal guide portions 203M, 203N (the side opposite to the diagonal corner) is made to be the relative positive pressure. By making one of the orthogonal guide portions 203K, 203L side to be the relative positive pressure compared to the other of the orthogonal guide portions 203M, 203N side, the electronic component 2 near the guide portions 203K, 203L side is left in the guide portions 203K, 203L side, and the inertial force at the time of rotation stop is prevented from moving it to the guide portions 203M, 203N side. Thus, the deceleration at the time of stopping rotation can be increased, and the time reduction and the prevention of the rebound due to the collision of the electronic component 2 are achieved.

[0204] (A) and (B) of FIG. 1, the vent 203a is provided so that one of the four corners in which one of the orthogonal guide portions 203K, 203L (the side hidden in the inner side in (B) of FIG. 1) is orthogonal to the other of the orthogonal guide portions 203M, 203N (the side opposite to the diagonal corner) is made to be the relative positive pressure. By making one of the orthogonal guide portions 203K, 203L side to be the relative positive pressure compared to the other of the orthogonal guide portions 203M, 203N side, the electronic component 2 near the guide portions 203K, 203L side is left in the guide portions 203K, 203L side, and the inertial force at the time of rotation stop is prevented from moving it to the guide portions 203M, 203N side. Thus, the deceleration at the time of stopping rotation can be increased, and the time reduction and the prevention of the rebound due to the collision of the electronic component 2 are achieved. Figure 13 Figure 14 (A) and (B) of FIG. 1, the vent 203a is provided so that one of the four corners in which one of the orthogonal guide portions 203K, 203L (the side hidden in the inner side in (B) of FIG. 1) is orthogonal to the other of the orthogonal guide portions 203M, 203N (the side opposite to the diagonal corner) is made to be the relative positive pressure. By making one of the orthogonal guide portions 203K, 203L side to be the relative positive pressure compared to the other of the orthogonal guide portions 203M, 203N side, the electronic component 2 near the guide portions 203K, 203L side is left in the guide portions 203K, 203L side, and the inertial force at the time of rotation stop is prevented from moving it to the guide portions 203M, 203N side. Thus, the deceleration at the time of stopping rotation can be increased, and the time reduction and the prevention of the rebound due to the collision of the electronic component 2 are achieved. Figure 13

[0205]

[0206] (A) and (B) of FIG. 1, the vent 203a is provided so that one of the four corners in which one of the orthogonal guide portions 203K, 203L (the side hidden in the inner side in (B) of FIG. 1) is orthogonal to the other of the orthogonal guide portions 203M, 203N (the side opposite to the diagonal corner) is made to be the relative positive pressure. By making one of the orthogonal guide portions 203K, 203L side to be the relative positive pressure compared to the other of the orthogonal guide portions 203M, 203N side, the electronic component 2 near the guide portions 203K, 203L side is left in the guide portions 203K, 203L side, and the inertial force at the time of rotation stop is prevented from moving it to the guide portions 203M, 203N side. Thus, the deceleration at the time of stopping rotation can be increased, and the time reduction and the prevention of the rebound due to the collision of the electronic component 2 are achieved. Figure 14 Figure 14 ​​​​​As shown in (B), when the pickup collet 200 is reversed, gas is ejected from the vent 203a of one of the orthogonal guide portions 203 via the ejector 203b, relative to one of the two orthogonal sides of the electronic component 2 held by the opposing surface 201a as described above. This presses the other two orthogonal sides of the electronic component 2 against the inner wall of the other orthogonal guide portion 203. This prevents movement of the temporarily positioned electronic component 2, or insufficient movement or rebound of the electronic component 2 during reversal, and allows it to be positioned at a corner of the opposing surface 201a.

[0207] Moreover, such as Figure 15 As shown in (A), gas is ejected not only from one of the orthogonal guide sections 203K and 203L, but also from the nozzle 203b of the other orthogonal guide sections 203M and 203N, which communicates with the vent 203a, to the other two orthogonal sides of the electronic component 2. This suppresses the offset or deviation of the electronic component 2 during movement or reversal, and prevents contact with the electronic component 2. The vent 203a is also connected to the gas supply circuit via a pipe (not shown) and is controlled by the control device 50. In this case, during positioning, as... Figure 15 As shown in (B), gas is stopped from being ejected from the other orthogonal guide sections 203M and 203L, and gas is ejected only from one of the orthogonal guide sections 203K and 203L. This creates a positive pressure on the side of one of the orthogonal guide sections 203K and 203L, enabling positioning. Furthermore, in this case, positioning can be selected on either side by setting the positive pressure on the guide section 203K and 203L side or on the guide section 203M and 203N side.

[0208] (9) such as Figure 16As shown, the vent 203a can also be configured to draw gas from the other two orthogonal sides of the guide section 203. For example, the vent 203a can be provided inside the other orthogonal guide sections 203M and 203N in a manner that connects the outside to the surrounding area of ​​the electronic component 2 held by the opposing surface 201a. The vent 203a is connected to the gas exhaust circuit (negative pressure generating circuit) via a pipe not shown, and the exhaust circuit is controlled by the control device 50. The end of the vent 203a becomes a suction port 203d facing the other two sides of the electronic component 2. Therefore, the sides of the electronic component 2 can be drawn from the suction port 203d. As a result, since one of the orthogonal guide sections 203K and 203L sides has a relative positive pressure compared to the other orthogonal guide sections 203M and 203N sides, the electronic component 2 is positioned at an appropriate corner in the same manner. Furthermore, in the aforementioned case, a venting section 203a may or may not be provided in one of the orthogonal guide sections 203K or 203L. Moreover, a venting section 203a for suction may be provided in one of the orthogonal guide sections 203K or 203L, or it may be configured to be positioned in the opposite direction.

[0209] (10) As described above, if electronic component 2 comes into contact with one of the orthogonal guide portions 203K, guide portion 203L, and the other orthogonal guide portions 203M, guide portion 203N, electronic component 2 may be affected. Therefore, by emitting gas from guide portions 203K, guide portions 203L, guide portions 203M, and guide portions 203N, contact with electronic component 2 can be avoided, thereby preventing electronic component 2 from detaching from the pickup collet 200 and positioning it, preventing damage to electronic component 2 caused by contact with guide portions 203K, guide portions 203L, guide portions 203M, and guide portions 203N. In this case, it is also possible to position it close to either side by setting positive pressure on the guide portion 203K and guide portion 203L side or on the guide portion 203M and guide portion 203N side.

[0210] (11) Moreover, for example, such as Figure 17 As shown, the vent 203a can be configured to eject gas from another orthogonal guide section 203M or guide section 203N via a porous member 203c. Specifically, the porous member 203c is positioned at a location where the protruding portion of the other orthogonal guide section 203M or guide section 203N faces the side of the electronic component 2. The vent 203a, which communicates with the porous member 203c, is provided inside the guide section 203M or guide section 203N. The vent 203a is connected to the gas supply circuit via a pipe (not shown) and is controlled by the control device 50.

[0211] The guide portions 203M, 203N eject gas via the porous member 203c serving as a guide. Thereby, a layer of gas is formed along the side surfaces of the guide portions 203M, 203N, and thus, in the case where the electronic component 2 moves to the side of the other orthogonal guide portion 203M, 203N for positioning, non-contact of the electronic component 2 with respect to the guide portions 203M, 203N can be maintained. Thus, the electronic component 2 is positioned via the layer of gas, and defects or cracks of the electronic component 2 are reduced, and generation of particles due to contact can also be suppressed. The amount of gas ejected is also small, and thus generation of particles due to gas flow can also be suppressed. Furthermore, displacement or falling of the electronic component 2 during transfer can also be reduced. In addition, as shown in Figure 18 (A), the guide portions 203M, 203N can also be provided in a manner capable of ejecting gas via the porous member 203c serving as a guide. Thereby, in the middle of rotation for reversal, in the case where the electronic component 2 moves to the side of the guide portions 203M, 203N due to gravity, non-contact of the side surface of the electronic component 2 with the guide portions 203M, 203N can be maintained, and the influence on the electronic component 2 can be reduced.

[0212] (12) The guide portions 203 described above can be provided along the outer edge of the facing surface 201a in a manner capable of restricting movement of the electronic component 2. Thus, the guide portions 203 can be provided around the entire circumference of the facing surface 201a, or can be provided in part. For example, as in (A) of Figure 19 , the guide portions 203 can be arranged in a manner such that one of the orthogonal guide portions 203 is continuous along the corner portion, or as in (B) of Figure 19 , the guide portions 203 can be arranged in a manner such that one of the orthogonal guide portions 203 is continuous along the corner portion, or as in (B) of Figure 19 , the guide portions 203 can be arranged in a manner such that one of the orthogonal guide portions 203 is continuous along the corner portion, or as in (B) of

[0213] (13) The number or size of the suction holes 201c, the openings 201d, the ejection ports 203b, and the suction ports 203d are not limited to the described modes. The maintenance of the suction holding state and the non-contact state can be achieved by the balance between the area of the facing surface 201a of the porous member 201 on which the electronic component 2 is supported by the layer of gas and the total area of the openings 201d. Furthermore, the number or size of the ejection ports 203b or the suction ports 203d can be determined in a manner capable of positioning the electronic component 2 in the other orthogonal guide portion 203.

[0214] (14) The positions or shapes of the suction holes 201c, the openings 201d, the ejection ports 203b, and the suction ports 203d are not limited to the described modes. For example, the shape of the openings 201d can be circular, rectangular, or other elliptical, polygonal, rounded polygonal, star-shaped, or the like as described above.

[0215] (15) By making the pickup jig 200 replaceable, it is possible to replace it according to the shape and size of the electronic component 2. As the replaceable structure, a structure that is held by suction by a magnet is simple, and the replacement work becomes easy. However, as long as it is a structure in which the pickup jig 200 is replaceable, it is acceptable. For example, it can be a structure in which the holding is performed by suction using negative pressure, or a structure in which the holding is performed mechanically.

[0216] (16) The outer edge of the pickup jig 200 is not limited to a rectangular shape. Also, the arrangement of the guide portion 203 is acceptable as long as it is arranged in a manner that follows the outer edge of the electronic component 2, and it is not necessary to arrange it on the outer edge of the pickup jig 200 as described above. For example, as shown in FIG. 18, it can be a pickup jig 200 in which the base 202 has a curved outer edge such as a cylindrical shape, and in which the guide portion 203 is arranged on the bottom surface. Also, the facing surface 201a is not limited to a rectangular shape. Figure 20

[0217] [Other Embodiments]

[0218] The present application is not limited to the embodiments described above, and in the implementation stage, the structural elements can be deformed and embodied within a range that does not depart from the gist thereof. Also, various applications can be formed by appropriately combining the plurality of structural elements disclosed in the embodiments. For example, several structural elements can be deleted from all of the structural elements shown in the embodiments. Furthermore, the structural elements in different embodiments can be appropriately combined.​

Claims

1. A pickup device having a rectangular outer edge and picking up an electronic component, the pickup device characterized by having: a pickup collet that suction-holds the electronic component; and a direction changing section that changes the orientation of the pickup collet, in the pickup collet, a porous member having air permeability that ejects gas supplied to the inside in a surface shape through a fine hole of a facing surface facing the electronic component, a suction hole is provided in the porous member, the suction hole having an opening in the facing surface, the electronic component being suction-held by negative pressure, a guide section is provided, the guide section being arranged in a manner following the outer edge of the electronic component, the movement of the electronic component held by the facing surface being restricted, the direction changing section has: a rotation section that rotates the pickup collet in a manner in which the facing surface is reversed from the supply position of the electronic component; and an angle changing section that changes the angle of the pickup collet along a surface parallel to the facing surface, the angle changed by the angle changing section is an angle that moves the electronic component toward a corner of the facing surface by reversal.

2. The pickup device according to claim 1, characterized in that: the rotation section starts rotating from a position at which the electronic component is picked up, and stops at a position at which the facing surface is reversed.

3. The pickup device of claim 1, wherein: the rotation section returns to the reversed position after passing the position at which the facing surface is reversed before stopping at the position at which the facing surface is reversed.

4. The pickup device of claim 1, wherein: the angle changing section changes the angle after picking up the electronic component, and restores the angle after stopping at the position at which the facing surface is reversed.

5. The pickup device of claim 1, wherein: the angle changing section changes the angle of the picked-up electronic component, and restores the changed angle in a state in which the facing surface is rotated for reversal.

6. The pickup device of claim 1, wherein: a vent section is provided in the guide section, the vent section making one orthogonal guide section side relatively positive pressure compared to the other orthogonal guide section side.

7. The pickup device according to claim 6, characterized in that: the vent section is provided in a manner in which gas can be ejected from one of the orthogonal guide sections.

8. The pickup device of claim 6, wherein: the vent section is provided in a manner in which gas can be suctioned from the other of the orthogonal guide sections.

9. The pickup device of claim 1, wherein: the pickup collet is provided in a manner in which gas can be ejected from at least one of the orthogonal guide sections via the guide-referred porous member.

10. The pickup device of claim 1, wherein: a collet moving mechanism is provided, the collet moving mechanism bringing the pickup collet to a position at which the electronic component can be suction-held in a sheet to which the electronic component is attached, and peeling and transferring the suction-held electronic component from the sheet.

11. The pickup device according to claim 1, characterized by: a control device is provided, the control device causes the pickup collet to suction-hold the electronic component, causes the angle changing section to change the angle of the pickup collet suction-holding the electronic component, causes the rotation section to reverse the pickup collet suction-holding the electronic component by rotation.

12. An installation apparatus for mounting an electronic component on a substrate, characterized by a pickup device according to any one of claims 1 to 11 is provided; a joint head is provided in a manner in which it can relatively move with respect to the pickup collet, and receives the electronic component from the pickup collet; and a mounting device that transfers and mounts the electronic component held by the joint head to the substrate. ​

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