Heat dissipation control methods, devices, and computing equipment

Abstract

This application relates to a heat dissipation control method, apparatus, and computing device, specifically in the field of computer heat dissipation technology, and is applied to a computing device equipped with a heat dissipation device. The method includes: identifying an abnormal temperature measurement point from a plurality of temperature measurement points in the computing device; predicting the actual temperature value of the abnormal temperature measurement point based on a first preset correspondence, where the first preset correspondence is the correspondence between the temperature values ​​of the plurality of temperature measurement points; determining the target power of the heat dissipation device based on the actual temperature value; and controlling the heat dissipation device to adjust its power to the target power. The method provided in this application, when an abnormal temperature measurement point exists in the computing device, predicts the actual temperature value of the abnormal temperature measurement point through a first preset correspondence, and controls the heat dissipation device to adjust its power to the target power based on the actual temperature value. This can prevent the cooling strategy of the computing device from failing, thereby preventing damage to internal components.

Description

Technical Field

[0001] This application relates to the field of computer heat dissipation technology, and in particular to a heat dissipation control method, apparatus, and computing device. Background Technology

[0002] During operation, computing devices convert some electrical energy into heat. Therefore, heat dissipation devices are needed to meet the cooling requirements of computing devices.

[0003] Typically, the Baseboard Management Controller (BMC) in a computing device obtains the temperature value of the internal environment of the computing device through temperature sensors, and adjusts the power of the heat dissipation devices based on the obtained temperature value and heat dissipation adjustment strategy to prevent the devices in the computing device from being damaged due to excessive temperature.

[0004] Because computing devices are subject to some unstable factors during operation, such as temperature sensor malfunction, the device may become unable to obtain the internal temperature value of the server. In other words, the temperature value obtained from the temperature sensor stops updating, leading to abnormal temperature readings. Consequently, the device cannot adjust the power of its cooling system based on these abnormal temperature values, causing the cooling adjustment strategy to fail and ultimately damaging the internal components. Summary of the Invention

[0005] This application provides a heat dissipation control method, apparatus, and computing device to solve the technical problem that the heat dissipation adjustment strategy fails and causes device damage when the internal temperature value of the computing device is abnormal.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] Firstly, a heat dissipation control method is provided, applied to a computing device equipped with a heat dissipation device. The method includes: identifying abnormal temperature measurement points from multiple temperature measurement points in the computing device; predicting the actual temperature value of the abnormal temperature measurement point based on a first preset correspondence, where the first preset correspondence is the correspondence between the temperature values ​​of the multiple temperature measurement points; determining the target power of the heat dissipation device based on the actual temperature value; and controlling the heat dissipation device to adjust its power to the target power. The method provided in this application, when an abnormal temperature measurement point exists among the multiple temperature measurement points in the computing device, predicts the actual temperature value of the abnormal temperature measurement point through a first preset correspondence, and controls the heat dissipation device to adjust its power to the target power based on the actual temperature value. This can prevent the cooling strategy of the computing device from failing, thereby preventing damage to the internal components of the computing device.

[0008] In one possible implementation of the first aspect, before determining the abnormal temperature measurement point from multiple temperature measurement points in the computing device, the method further includes: generating a first preset correspondence relationship based on the temperature values ​​of multiple temperature measurement points when the heat dissipation device operates at different power levels. The method provided in this application, by pre-generating the first preset correspondence relationship, can accurately predict the actual temperature value of the abnormal temperature measurement point based on the temperatures of multiple temperature measurement points and the first preset correspondence relationship, thereby determining the target power of the heat dissipation device and completing the power adjustment of the heat dissipation device.

[0009] In one possible implementation of the first aspect, determining the target power of the heat dissipation device based on the actual temperature value includes: determining the target power of the heat dissipation device based on the actual temperature value, the temperature values ​​of multiple temperature measurement points excluding abnormal temperature measurement points, and a second preset correspondence relationship, whereby the second preset correspondence relationship is the correspondence between the temperature values ​​of multiple temperature measurement points and the power of the heat dissipation device. The method provided in this application determines the target power of the heat dissipation device through the second preset correspondence relationship, so that the heat dissipation device operates at the target power to meet the heat dissipation requirements of the computing device. On the one hand, this avoids energy waste caused by the heat dissipation device's power exceeding the cooling requirements of the computing device. On the other hand, it avoids the problem of the heat dissipation device operating at high power, generating noise, and affecting the user experience.

[0010] In one possible implementation of the first aspect, before determining the target power of the heat dissipation device based on the actual temperature value, the method further includes: generating a second preset correspondence relationship based on the temperature values ​​of multiple temperature measuring points when the heat dissipation device operates at different power and the corresponding power of the heat dissipation device. The method provided in this application, by pre-generating the second preset correspondence relationship, can determine the target power of the heat dissipation device based on the actual temperature value of an abnormal temperature measuring point and the temperature values ​​of other temperature measuring points besides the abnormal temperature measuring point, so that the heat dissipation device operates at the target power. On the one hand, this meets the heat dissipation requirements of computing devices while avoiding energy waste due to excessive power of the heat dissipation device. On the other hand, it avoids the problem of noise generated by the heat dissipation device operating at high power, which affects the user experience.

[0011] In one possible implementation of the first aspect, the abnormal temperature measurement point is a temperature measurement point whose temperature value has not been updated within a preset time period. The method provided in this application identifies temperature measurement points whose temperature values ​​have not been updated within a preset time period as abnormal temperature measurement points, and then predicts the actual temperature value of the abnormal temperature measurement point through a first preset correspondence. Based on the actual temperature value, it controls the heat dissipation device to adjust its power to the target power, thereby preventing the heat dissipation strategy of the computing device from failing and thus preventing damage to the internal components of the computing device.

[0012] In one possible implementation of the first aspect, the computing device further includes multiple temperature sensors, each disposed at multiple temperature measurement points. These sensors detect the temperature values ​​at each measurement point and are connected to the BMC (Body Control Module). Identifying abnormal temperature measurement points among these points involves: repeatedly acquiring temperature values ​​from the multiple temperature measurement points using the multiple temperature sensors within a preset time period; and identifying the measurement point corresponding to the abnormal temperature value as an abnormal temperature measurement point if an abnormal temperature value exists among the multiple measurement points. The abnormal temperature value is a temperature value that has not been updated within the preset time period. In this way, the computing device can acquire temperature values ​​from multiple measurement points multiple times within the preset time period, analyze these values, identify temperature values ​​that have not been updated within the preset time period as abnormal temperature values, and quickly identify abnormal temperature measurement points from among the multiple measurement points. This allows for timely adjustment of the power of the heat dissipation devices, preventing heat dissipation strategy failure and potential damage to internal components of the computing device.

[0013] In one possible implementation of the first aspect, when an abnormal temperature value exists among multiple temperature measurement points, the temperature measurement point corresponding to the abnormal temperature value is identified as an abnormal temperature measurement point. This includes: adjusting the power of the heat dissipation device to a preset power when an abnormal temperature value exists among multiple temperature measurement points; obtaining the target temperature value of the temperature measurement point corresponding to the abnormal temperature value after power adjustment; and identifying the temperature measurement point corresponding to the abnormal temperature value as an abnormal temperature measurement point when the target temperature value is the same as the abnormal temperature value. The method provided in this application adjusts the power of the heat dissipation device to a preset power (e.g., the preset power is greater than the current power of the heat dissipation device), then obtains the temperature value corresponding to the abnormal temperature measurement point again. If the temperature value decreases, it indicates that the temperature value of the abnormal temperature measurement point is normal; if the temperature value does not change, it indicates that the temperature value of the abnormal temperature measurement point is abnormal. The method provided in this application further verifies the abnormal temperature measurement point by adjusting the power of the heat dissipation device to a preset power and then obtaining the temperature value of the abnormal temperature measurement point again. This avoids the situation where a temperature measurement point is considered an abnormal point by BMC due to its actual temperature remaining unchanged for a long period of time, thus improving the accuracy of abnormal temperature measurement point identification and enhancing the user experience.

[0014] In one possible implementation of the first aspect, the computing device further includes multiple temperature sensors, each disposed at multiple temperature measurement points, which are used to detect the temperature values ​​at those points. Determining abnormal temperature measurement points from among the multiple temperature measurement points in the computing device includes: acquiring status information of the multiple temperature sensors, including whether the status information is normal or abnormal; and identifying the temperature measurement point corresponding to a temperature sensor with an abnormal status as an abnormal temperature measurement point. The method provided in this application, by acquiring the status information of multiple temperature sensors in real time, quickly identifies the temperature measurement point corresponding to a temperature sensor as an abnormal temperature measurement point when a temperature sensor malfunctions. Then, through a first preset correspondence, it predicts the actual temperature value of the abnormal temperature measurement point and controls the heat dissipation device to adjust its power to the target power based on the actual temperature value. This avoids the failure of the computing device's heat dissipation strategy, thereby preventing damage to internal components of the computing device.

[0015] Secondly, a heat dissipation control device is provided, comprising: functional units for executing any of the methods provided in the first aspect, wherein the actions performed by each functional unit are implemented by hardware or by hardware executing corresponding software. For example, the heat dissipation control device may include a first determining unit, a temperature predicting unit, a second determining unit, and a power adjusting unit. The first determining unit is used to determine an abnormal temperature measuring point from multiple temperature measuring points in a computing device, wherein the temperature value of the abnormal temperature measuring point has not been updated within a preset time period. The temperature predicting unit is used to predict the actual temperature value of the abnormal temperature measuring point according to a first preset correspondence, wherein the first preset correspondence is a correspondence between the temperature values ​​of multiple temperature measuring points. The second determining unit is used to determine the target power of the heat dissipation device based on the actual temperature value. The power adjusting unit is used to control the heat dissipation device to adjust its power to the target power.

[0016] Thirdly, a computing device is provided, comprising: a baseboard management controller (BMC) and a memory, wherein the baseboard management controller (BMC) is connected to the memory. The memory is used to store computer-executable instructions, and the baseboard management controller (BMC) executes the computer-executable instructions stored in the memory, thereby implementing any of the methods provided in the first aspect.

[0017] Fourthly, a chip is provided, comprising: a processor and an interface circuit; the interface circuit for receiving code instructions and transmitting them to the processor; and the processor for executing the code instructions to perform any of the methods provided in the first aspect above.

[0018] Fifthly, a computer-readable storage medium is provided, storing computer-executable instructions that, when executed on a computer, cause the computer to perform any of the methods provided in the first aspect above.

[0019] In a sixth aspect, a computer program product is provided, including computer execution instructions that, when executed on a computer, cause the computer to perform any of the methods provided in the first aspect above.

[0020] The technical effects of any of the design methods in aspects two through six can be found in the technical effects of different implementation methods in aspect one, and will not be repeated here. Attached Figure Description

[0021] Figure 1 This paper shows a structural block diagram of a computing device according to an embodiment of the present application;

[0022] Figure 2 This invention illustrates a structural block diagram of another computing device provided in an embodiment of this application;

[0023] Figure 3 A schematic flowchart of a heat dissipation control method provided in an embodiment of this application is shown;

[0024] Figure 4 A flowchart illustrating another heat dissipation control method provided in an embodiment of this application is shown;

[0025] Figure 5 This illustration shows a schematic diagram of a BMC acquiring temperature values ​​from multiple temperature measurement points, provided in an embodiment of this application.

[0026] Figure 6a A flowchart illustrating another heat dissipation control method provided in an embodiment of this application is shown;

[0027] Figure 6b A flowchart illustrating another heat dissipation control method provided in an embodiment of this application is shown;

[0028] Figure 7 A structural block diagram of a heat dissipation control device provided in an embodiment of this application is shown. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. In the description of this application, unless otherwise stated, "multiple" refers to two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0030] Furthermore, to facilitate a clear description of the technical solutions in the embodiments of this application, the terms "first" and "second" are used in the embodiments of this application to distinguish identical or similar items with substantially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that "first" and "second" are not necessarily different. Meanwhile, in the embodiments of this application, the words "exemplary" or "for example" are used to indicate that something is being used as an example, illustration, or description. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the terms "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner for ease of understanding.

[0031] During operation, computing devices convert some electrical energy into heat. Therefore, heat dissipation devices are needed to meet the cooling requirements of computing devices.

[0032] Typically, the Baseboard Management Controller (BMC) in a computing device obtains the temperature value of the internal environment of the computing device through temperature sensors. Based on the obtained temperature value and heat dissipation adjustment strategy, it adjusts the power of the heat dissipation devices, thereby enabling timely adjustment of the internal temperature of the server to prevent the devices in the server from being damaged due to excessive temperature.

[0033] Because computing devices are subject to some unstable factors during operation, such as temperature sensor malfunction, the device may become unable to obtain the internal temperature value of the server. In other words, the temperature value obtained from the temperature sensor stops updating, leading to abnormal temperature readings. Consequently, the device cannot adjust the power of its cooling system based on these abnormal temperature values, causing the cooling adjustment strategy to fail and ultimately damaging the internal components.

[0034] In related technologies, when the temperature value obtained by the computing device is abnormal, the power of the heat dissipation device is adjusted to its maximum value to ensure that the internal environment of the server does not become too hot. However, while this can meet the server's cooling requirements, it has some problems. On the one hand, the heat dissipation device operating at maximum power far exceeds the server's cooling needs, leading to increased energy consumption and wasted resources. On the other hand, the heat dissipation device operating at maximum power generates noise, seriously affecting the user experience.

[0035] Based on this, this application provides a heat dissipation control method applied to a computing device equipped with a heat dissipation device. The method includes: identifying abnormal temperature measurement points from multiple temperature measurement points in the computing device; predicting the actual temperature value of the abnormal temperature measurement point according to a first preset correspondence, where the first preset correspondence is the correspondence between the temperature values ​​of multiple temperature measurement points; determining the target power of the heat dissipation device based on the actual temperature value; and controlling the heat dissipation device to adjust its power to the target power. The method provided in this application, when an abnormal temperature measurement point exists among multiple temperature measurement points in the computing device, predicts the actual temperature value of the abnormal temperature measurement point through the first preset correspondence, and controls the heat dissipation device to adjust its power to the target power based on the actual temperature value. This can prevent the cooling strategy of the computing device from failing, thereby preventing damage to the internal components of the computing device. Furthermore, controlling the heat dissipation device to operate at the target power can reduce energy consumption and save resources while meeting the cooling requirements of the computing device. Simultaneously, it can also reduce the noise generated during the operation of the computing device, improving the user experience.

[0036] See Figure 1 , Figure 1 This diagram illustrates a structural block diagram of a computing device according to an embodiment of this application. The computing device 100 includes a processor 110, a memory 120, a baseboard management controller 130, a heat dissipation device 140, and a temperature sensing device 150. The baseboard management controller 130 is connected to both the heat dissipation device 140 and the temperature sensing device 150. The baseboard management controller 130 acquires temperature values ​​from multiple temperature measurement points from the temperature sensing device. When an abnormal temperature measurement point exists in the computing device 100, it determines the actual temperature value of the abnormal temperature measurement point, determines the target power of the heat dissipation device 140 based on the actual temperature value, and controls the heat dissipation device 140 to adjust its power to the target power.

[0037] It should be noted that the computing device may include a server, laptop computer, personal digital assistant (PDA), personal computer, laptop, in-vehicle device, etc. No particular restrictions are placed on the specific implementation of the computing device here.

[0038] The processor 110 may be a central processing unit (CPU). An operating system (OS) runs on the processor 110. The processor 110 may also include memory for storing instructions and data. In some embodiments, the memory in the processor 110 is a cache memory. This memory can store instructions or data that the processor 110 has just used or that are used repeatedly. If the processor 110 needs to use the instruction or data again, it can retrieve it directly from the memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves system efficiency.

[0039] In some embodiments, the processor 110 may include one or more interfaces. Interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc.

[0040] The I2C interface is a bidirectional synchronous serial bus that includes a serial data line (SDA) and a serial clock line (SCL). In some embodiments, the processor 110 may include multiple I2C buses.

[0041] The UART interface is a universal serial data bus used for asynchronous communication. This bus can be a bidirectional communication bus. It converts the data to be transmitted between serial and parallel communication. In some embodiments, the UART interface is typically used to connect to processor 110.

[0042] GPIO interfaces are configurable via software. They can be configured as control signals or data signals. GPIO interfaces can also be configured as I2C, I2S, UART, MIPI, and other interfaces.

[0043] It is understood that the interface connection relationships between the modules illustrated in the embodiments of the present invention are merely illustrative and do not constitute a structural limitation on the computing device 100. In other embodiments of this application, the computing device 100 may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0044] The memory 120 may include random access memory (RAM) or read-only memory (ROM). Optionally, the memory 120 may include a non-transitory computer-readable storage medium. The memory 120 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 120 may include a program storage area and a data storage area, wherein the program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (such as touch function, sound playback function, image playback function, etc.), instructions for implementing the various method embodiments described above, etc.

[0045] The baseboard management controller 130 (hereinafter referred to as BMC) generates operation control signals based on the instruction opcode and timing signals to control instruction fetching and execution. The BMC drives devices connected to different interfaces of the processor 110 by sending different control signals. For example, the BMC can obtain the temperature of multiple temperature measurement points from multiple temperature sensors, and the BMC can also send control signals through serial interfaces such as I2C, I3C, or SGPIO. The control signal can be a pulse width modulation (PWM) signal, which is used to control the heat dissipation device 140. For example, the PWM signal output by the BMC can be used to adjust the power of the heat dissipation device 140. In this embodiment, the BMC identifies an abnormal temperature measurement point from multiple temperature measurement points, whose temperature value has not been updated within a preset time period. The BMC predicts the actual temperature value of the abnormal temperature measurement point based on a first preset correspondence relationship, which is the correspondence between the temperature values ​​of multiple temperature measurement points. The BMC determines the target power of the heat dissipation device 140 based on the actual temperature value. The BMC sends a PWM signal to the heat sink 140 to control the heat sink 140 to adjust the power to the target power.

[0046] The heat dissipation device 140 may include an air-cooled heat sink or a liquid-cooled heat sink, used to transfer the heat generated by the electronic device during operation in a timely manner to avoid affecting the normal operation of the electronic device. For example, the heat dissipation device 140 may be a fan assembly that receives a PWM signal from the baseboard management controller 130 and adjusts the fan speed according to the PWM signal to adjust the power of the heat dissipation device 140.

[0047] Temperature sensing device 150 is used to measure temperature. In this embodiment, there are multiple temperature sensing devices 150. Multiple temperature sensing devices 150 are respectively set at multiple temperature measuring points in computing device 100 to measure the temperature of the multiple temperature measuring points and convert the temperature of the multiple temperature measuring points into a usable output signal so that the substrate management controller 130 can obtain the temperature of the multiple temperature measuring points.

[0048] In one example, the multiple temperature measurement points can be located on multiple devices within the server (e.g., device surfaces). For instance, these multiple temperature measurement points can be located on the surfaces of the processor 110, the memory 120, and the board management controller 130, respectively. Thus, by using the temperature sensing device 150 at each measurement point, the temperature values ​​of different devices inside the server can be measured separately. In another example, the multiple temperature measurement points can also be located at different points within the computing device 100. For example, the temperature measurement points can be located at the air inlet and air outlet of the computing device 100. In this case, by using the temperature sensing devices 150 at the multiple measurement points, the air inlet temperature and air outlet temperature of the computing device 100 can be measured separately.

[0049] It should be noted that the processor 110 can also store the temperature values ​​of multiple temperature measurement points measured by the temperature sensing device 150 in the memory 120, so that the substrate management controller 130 can obtain the temperature values ​​of multiple temperature measurement points from the memory 120. The specific implementation method of the substrate management controller 130 obtaining the temperature values ​​of multiple temperature measurement points is not particularly limited here.

[0050] Taking the aforementioned computing device as an example, see [link to relevant documentation]. Figure 2 , Figure 2 A structural block diagram of another computing device provided in an embodiment of this application is shown. This computing device 100... Figure 1Based on the structure shown, it also includes at least one hard drive 160, at least one PCIe (peripheral component interconnect express) card 170, a power supply 180, and a programmable logic device 190 (complex programmable logic device, CPLD). Temperature measurement points can also correspond to at least one hard drive 160, at least one PCIe card 170, and at least one power supply 180. Temperature sensors 150 located at the temperature measurement points measure the temperature values ​​of at least one hard drive 160, at least one PCIe card 170, and at least one power supply 180, respectively. The hard drive 160 can be mounted on a hard drive backplane, and the temperature measurement points can correspond to the hard drive backplane to measure the temperature value of the hard drive backplane of the computing device 100.

[0051] The programmable logic device 190 is used to determine the status information of the temperature sensing device 150 so that the board management controller 130 can acquire the status information of the temperature sensing device 150. The status information includes normal or abnormal. Normal status information indicates that the temperature sensing device 150 is in a normal state and can operate normally, while abnormal status information indicates that the temperature sensing device 150 is in an abnormal state and cannot operate normally.

[0052] The substrate management controller 130 is further configured to identify the temperature measurement point corresponding to the temperature sensing device with abnormal status information as an abnormal temperature measurement point, and predict the actual temperature value of the abnormal temperature measurement point according to a first preset correspondence. The substrate management controller 130 controls the heat dissipation device 140 to adjust the power to the target power according to the actual temperature value.

[0053] In addition, those skilled in the art will understand that the structure illustrated in this embodiment does not constitute a specific limitation on the computing device 100. In other embodiments of this application, the computing device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements.

[0054] The heat dissipation control method provided in the embodiments of this application will be described below with reference to the accompanying drawings. For ease of explanation, the following description uses a server as an example of the computing device 100.

[0055] Figure 3 This is a flowchart illustrating a heat dissipation control method provided in an embodiment of this application. Optionally, this method can be implemented by a... Figure 1 or Figure 2 The BMC of the computing device 100 with the illustrated hardware structure is executed. The method may include the following steps:

[0056] S301. Identify abnormal temperature measurement points from multiple temperature measurement points in the server.

[0057] Multiple temperature measuring points are each equipped with multiple temperature sensing devices. These temperature measuring points can be located on the surfaces of multiple devices within the server. In this way, the temperature sensing devices located at multiple temperature measuring points can measure the temperature values ​​of multiple devices within the server.

[0058] For example, multiple temperature sensing points are respectively set on the surfaces of the processor, memory, baseboard management controller, hard disk, PCIe card, and power supply, so that during server operation, the temperature sensing device corresponding to each temperature sensing point can measure the processor temperature (T). 处理器 ), memory temperature (T) 存储器 ), substrate management controller temperature (T) BMC Hard drive temperature (T) 硬盘 ), PCIe card temperature (T) PCIE卡 and power supply temperature (T) 电源 ).

[0059] Multiple temperature measurement points can also be located at different points within the server, allowing the temperature sensors to measure the temperature values ​​at multiple points. For example, multiple temperature measurement points can be located at the server's air outlet, air inlet, and hard drive backplane, so that during server operation, the temperature sensors at each measurement point can individually measure the server's air outlet temperature (T). 出风口 ), inlet air temperature (T) 进风口 ) and hard drive backplane temperature (T 硬盘背板 ).

[0060] An abnormal temperature measurement point is a temperature measurement point corresponding to an abnormal temperature value. Alternatively, it can be understood as a temperature measurement point where the measured temperature value is abnormal.

[0061] Optionally, if the temperature value of a temperature measuring point does not update within a preset time period, that is, the temperature value of the temperature measuring point remains stable, then the temperature value is an abnormal temperature value, and the temperature measuring point corresponding to the abnormal temperature value is an abnormal temperature measuring point.

[0062] In one possible implementation, see Figure 4 The above-mentioned S301 specifically includes the following steps:

[0063] S401. Within a preset time period, the BMC acquires the temperature values ​​of multiple temperature measurement points in the server through multiple temperature sensing devices.

[0064] In one possible implementation, the temperature values ​​of multiple temperature measurement points in the server are acquired at least twice within a preset time period;

[0065] It should be understood that the preset duration and the number of times the BMC acquires temperature values ​​within the preset duration can be set according to the user's actual needs. For example, the preset duration can be 10 minutes, 30 minutes, or 1 hour, and the number of temperature values ​​acquired must be at least twice. It can also be 5 times or 10 times. There are no special restrictions on the specific time of the preset duration and the number of times the temperature values ​​are acquired within the preset duration.

[0066] It should be noted that the BMC can directly obtain temperature values ​​from multiple temperature measuring points in the server from multiple temperature sensors. Alternatively, it can obtain these values ​​from a memory containing the most recent temperature measurements from multiple temperature measuring points.

[0067] For example, see Figure 5 , Figure 5 This diagram illustrates a BMC (Body Temperature Controller) acquiring temperature values ​​from multiple measurement points. The server is configured with three temperature measurement points: a first measurement point, a second measurement point, and a third measurement point. Each measurement point is equipped with a corresponding temperature sensor. The sensor at the first measurement point measures the server's processor temperature, the sensor at the second measurement point measures the server's air inlet temperature, and the sensor at the third measurement point measures the server's air outlet temperature. The preset timeout is 30 minutes, and the BMC acquires temperature values ​​four times within that timeout, as shown in Table 1 below. Table 1 displays the temperature values ​​acquired by the BMC from the three measurement points four times within 30 minutes.

[0068] Table 1

[0069] round Processor temperature (°C) Inlet air temperature (°C) Air outlet temperature (°C) 1 60 40 65 2 60 42 67 3 60 45 71 4 60 48 74

[0070] S402. If there is an abnormal temperature value among the temperature values ​​of multiple temperature measurement points, the BMC will determine the temperature measurement point corresponding to the abnormal temperature value as the abnormal temperature measurement point. The abnormal temperature value is the temperature value that has not been updated within a preset time period.

[0071] The BMC (Body Temperature Controller) determines whether there are any abnormal temperature values ​​among the temperature values ​​acquired from multiple temperature measurement points on the server within a preset time period. In this way, the BMC can acquire temperature values ​​from multiple measurement points multiple times within the preset time period, analyze these values, and identify any temperature values ​​that have not been updated within the preset time period as abnormal. This allows for rapid identification of abnormal temperature measurement points from multiple measurement points, enabling timely adjustment of the power of the heat dissipation devices to prevent the heat dissipation strategy from failing and causing damage to internal server components.

[0072] Combination Figure 5 The processor temperature value of the processor 110 obtained by the BMC from the first temperature measurement point is determined as an abnormal temperature value. Then, the BMC can determine the first temperature measurement point corresponding to the abnormal temperature value as an abnormal temperature measurement point.

[0073] As shown in Table 1, the processor temperature value was not updated within the preset time of 30 minutes. Therefore, the processor temperature value is an abnormal temperature value, and the first temperature measurement point corresponding to the processor temperature value is an abnormal temperature measurement point.

[0074] It should be noted that in this example, the number of abnormal temperature measurement points is one. It is understood that the number of abnormal temperature measurement points existing simultaneously on the server can also be multiple. There is no specific limit to the number of abnormal temperature measurement points existing simultaneously on the server.

[0075] In one possible implementation, the BMC periodically acquires the temperature values ​​of multiple temperature measurement points in the server. When the temperature value of a temperature measurement point does not update within a preset number of acquisitions, that is, the temperature value of the temperature measurement point remains stable, then the temperature value is an abnormal temperature value, and the temperature measurement point corresponding to the abnormal temperature value is an abnormal temperature measurement point.

[0076] BMC periodically acquires temperature values ​​from multiple temperature measurement points within the server. It analyzes these values, identifying those not updated within a preset acquisition count as abnormal temperatures. This allows for the rapid identification of these abnormal temperature points, enabling timely adjustments to the power of heat dissipation devices and preventing heat dissipation strategy failures that could damage internal server components.

[0077] In one possible implementation, see Figure 6a The above S301 includes the following steps:

[0078] S501, Obtain the status information of multiple temperature sensing devices.

[0079] The baseboard management controller acquires status information from multiple temperature sensors via programmable logic devices. This status information includes "normal" or "abnormal." A "normal" status indicates that the temperature sensor is in a normal state and can function normally, while an "abnormal" status indicates that the temperature sensor is in an abnormal state and cannot function normally.

[0080] S502. Identify the temperature measurement point corresponding to the temperature sensing control with abnormal status information as an abnormal temperature measurement point.

[0081] The method provided in this application acquires the status information of multiple temperature sensing devices in real time. When a temperature sensing device malfunctions, the corresponding temperature measurement point is immediately identified as an abnormal temperature measurement point. This allows for timely adjustment of the power of the heat dissipation device, preventing the heat dissipation strategy from failing and causing damage to internal components of the server.

[0082] In one possible implementation, S301 includes the following steps: Within a preset time period, the BMC acquires temperature values ​​at multiple temperature measurement points in the server using multiple temperature sensors. If an abnormal temperature value exists among the multiple temperature measurement points, the BMC acquires the status information of the temperature sensor corresponding to the abnormal temperature value, where the abnormal temperature value is a temperature value that has not been updated within the preset time period. If the status information of the temperature sensor is abnormal, the BMC determines the temperature measurement point with the abnormal temperature value as an abnormal temperature measurement point.

[0083] For example, in combination Figure 5 As shown in Table 1, the processor temperature value was not updated within the preset time of 30 minutes, so the processor temperature value was an abnormal temperature value. The BMC obtained the status information of the temperature sensing device located at the first temperature measuring point. When the status information of the temperature sensing device at the first temperature measuring point was abnormal, the first temperature measuring point was determined as an abnormal temperature measuring point.

[0084] The method provided in this application obtains the status information of the temperature sensing device corresponding to the abnormal temperature value when there is an abnormal temperature value among the temperature values ​​of multiple temperature measuring points. When the temperature sensing device is malfunctioning, the temperature measuring point corresponding to the temperature sensing device is immediately identified as an abnormal temperature measuring point, and the power of the heat dissipation device is adjusted in a timely manner to avoid the failure of the heat dissipation strategy and damage to the internal components of the server.

[0085] In one possible implementation, see Figure 6b The aforementioned S402 specifically includes:

[0086] S601. If there are abnormal temperature values ​​among multiple temperature measurement points, adjust the power of the heat dissipation device to the preset power.

[0087] The preset power is set according to the user's actual heat dissipation needs. For example, the preset power can be greater than or less than the current power of the heat dissipation device, or it can be the maximum power of the heat dissipation device. There are no special restrictions on the value of the preset power here.

[0088] S602. Obtain the target temperature value of the temperature measuring point corresponding to the abnormal temperature value after power adjustment.

[0089] S603. When the target temperature value and the abnormal temperature value are the same, the temperature measurement point corresponding to the abnormal temperature value shall be determined as the abnormal temperature measurement point.

[0090] It is understandable that after the power of the heat dissipation device is adjusted to a preset power, if the preset power is greater than the current power of the heat dissipation device, the temperature value at the measuring point corresponding to the abnormal temperature value will be lower than the abnormal temperature value due to the increased power of the heat dissipation device and thus improved heat dissipation capacity. Conversely, if the preset power is less than the current power of the heat dissipation device, the temperature value at the measuring point corresponding to the abnormal temperature value will be higher due to the decreased power of the heat dissipation device and thus improved heat dissipation capacity. Therefore, if the target temperature value obtained by the adjusted BMC does not change, it indicates that the measuring point is an abnormal measuring point.

[0091] For example, in combination Figure 5 When the BMC determines the processor temperature value to be abnormal, the power of the heat sink is 20W. First, the preset power of the heat sink is adjusted; in this example, the preset power is 40W. After adjusting the heat sink power to 40W, the processor temperature value at the first temperature measurement point is obtained again, and the processor temperature value is 60℃. Referring to Table 1, since the processor temperature value has not changed, the first temperature measurement point is determined to be an abnormal temperature measurement point.

[0092] Optionally, if the target temperature value and the abnormal temperature value are different, the temperature measurement point corresponding to the abnormal temperature value is the normal temperature measurement point. The BMC controls the heat dissipation device to restore the power. It should be understood that power restoration means adjusting the power of the heat dissipation device from the preset power to the power before the adjustment.

[0093] The method provided in this application adjusts the power of the heat dissipation device to a preset power, and then re-verifies the abnormal temperature measurement point based on the temperature value obtained again. This avoids the BMC from classifying a temperature measurement point as an abnormal point because the actual temperature of a certain temperature measurement point has not changed for a long time, thus improving the accuracy of abnormal temperature measurement point judgment and enhancing the user experience.

[0094] S302. Predict the actual temperature value of the abnormal temperature measurement point according to the first preset correspondence relationship. The first preset correspondence relationship is the correspondence relationship between the temperature values ​​of multiple temperature measurement points.

[0095] In one possible implementation, the first preset correspondence may include a combination of temperature values ​​from multiple temperature measurement points at different times during normal server operation.

[0096] It should be noted that the power of the heat dissipation device can be the same or different at different times. At any given moment, since multiple temperature measurement points are located inside the server, there is a correlation between the temperature values ​​of these multiple measurement points. Therefore, based on the temperature values ​​of the multiple temperature measurement points at a given moment, excluding the abnormal temperature measurement point, the actual temperature value of the abnormal temperature measurement point can be predicted.

[0097] For example, see Table 2 below. Table 2 is a first preset correspondence table shown in the embodiments of this application, which includes multiple temperature value combinations corresponding to different times during normal operation of the server.

[0098] Table 2

[0099] time Processor temperature (°C) Inlet air temperature (°C) Air outlet temperature (°C) 1 45 40 65 2 48 42 67 3 52 45 71 4 55 48 74

[0100] Referring to Table 1, if the first temperature measurement point is an abnormal temperature measurement point, the processor temperature value in Table 1 is an abnormal temperature value. According to Table 2, if the temperature value at the second temperature measurement point is 48℃ and the temperature value at the third temperature measurement point is 74℃, the actual temperature value of the abnormal temperature measurement point is predicted to be 55℃ based on the first preset correspondence.

[0101] In another possible implementation, the first preset correspondence can be a preset temperature value conversion formula between the temperature values ​​of any two temperature measuring points in the server. Based on this conversion formula, the temperature value of one temperature measuring point can be calculated from the temperature value of the other. Optionally, this temperature value conversion formula is determined based on the operator's experience and is pre-stored in the server.

[0102] For example, in combination Figure 5 The first preset correspondence includes a temperature value conversion formula between the first and second temperature measuring points. This formula states that the temperature at the first temperature measuring point equals the temperature at the second temperature measuring point. Referring to Table 1, if the first temperature measuring point is an abnormal temperature measuring point, the processor temperature value in Table 1 is an abnormal temperature value. According to the above temperature value conversion formula, the actual temperature value of the first temperature measuring point equals the temperature value of the second temperature measuring point, and the actual temperature value of the first temperature measuring point is 48℃.

[0103] It should be noted that the above example of the first preset correspondence is only for illustrative purposes. The first preset correspondence may also include the functional relationship between the temperature values ​​of multiple temperature measuring points in the server. There are no special restrictions on the first preset correspondence here.

[0104] In one possible implementation, the following steps are included before S301:

[0105] A first preset correspondence is generated based on the temperature values ​​of multiple temperature measurement points when the heat dissipation device is running at different power.

[0106] In this system, the BMC controls the heat dissipation device to operate at different power levels, and the BMC acquires the temperature values ​​of multiple temperature measurement points at different times through temperature sensors. The BMC then generates a first preset correspondence based on the temperature values ​​of the multiple temperature measurement points at different times.

[0107] It should be noted that the first preset correspondence can be in tabular form, such as Table 2. It can also be in the form of a function, such as a temperature value conversion formula between multiple temperature measurement points. There are no particular restrictions on the specific form of the first preset correspondence.

[0108] The method provided in this application can accurately predict the actual temperature value of abnormal temperature measurement points by pre-generating a first preset correspondence relationship, based on the normal temperature values ​​obtained from multiple temperature measurement points and the first preset correspondence relationship, thereby determining the target power of the heat dissipation device and completing the power adjustment of the heat dissipation device.

[0109] S303. Determine the target power of the heat dissipation device based on the actual temperature value.

[0110] In one possible implementation, the above method further includes: determining the target power of the heat dissipation device based on the actual temperature value, the temperature values ​​of multiple temperature measurement points excluding abnormal temperature measurement points, and a second preset correspondence, wherein the second preset correspondence is the correspondence between the temperature values ​​of multiple temperature measurement points and the power of the heat dissipation device.

[0111] The method provided in this application determines the target power of the heat dissipation device through a second preset correspondence, ensuring that the heat dissipation device operates at the target power to meet the server's heat dissipation requirements. On the one hand, this avoids energy waste caused by the heat dissipation device's power exceeding the server's cooling needs. On the other hand, it avoids the problem of noise generated by the heat dissipation device operating at high power, which could negatively impact the user experience.

[0112] In one possible implementation, the following steps are included before S303 above:

[0113] A second preset correspondence is generated based on the temperature values ​​of multiple temperature measurement points when the heat dissipation device operates at different power levels and the corresponding power of the heat dissipation device.

[0114] Optionally, the second preset correspondence can be the correspondence between the temperature value of any temperature measuring point in the server and the power of the heat dissipation device. For example, see Table 3 below, which is a second preset correspondence table shown in an embodiment of this application. Combining Table 1 and Table 2, the actual temperature value of the first temperature measuring point is 55℃.

[0115] Table 3

[0116] Power of heat dissipation device (W) Processor temperature (°C) 5 T<10 10 10-40 20 40-80 40 T>80

[0117] Thus, based on Table 1, the abnormal temperature measurement point of the processor is determined, and according to the prediction of the actual temperature of the processor as 55℃ by S302, combined with the second preset correspondence shown in Table 3, the power of 20W corresponding to the temperature range of 40℃-80℃, including 55℃, is determined as the target power of the heat dissipation device.

[0118] Optionally, the second preset correspondence may include the correspondence between the temperature values ​​of multiple temperature measurement points in the server and the power of the heat dissipation device.

[0119] For example, refer to Table 4 below, which is another second preset correspondence table shown in the embodiments of this application. According to Table 1, the actual temperature value of the first temperature measuring point is 55°C, the temperature value of the second temperature measuring point is 48°C, and the temperature value of the third temperature measuring point is 74°C. Thus, combined with the second preset correspondence shown in Table 4, the target power of the heat dissipation device is determined to be 30W.

[0120] Table 4

[0121]

[0122]

[0123] Optionally, if the temperature measurement point is located on the surface of any device in the server, the second preset correspondence can be the correspondence between the temperature value of any temperature measurement point in the server and the power and model of the heat dissipation device.

[0124] See Table 5. Table 4 is another second preset correspondence table shown in the embodiments of this application.

[0125] Table 5

[0126] Power of heat dissipation device (W) Processor Model Processor temperature (°C) 5 A T<10 10 A 10-40 20 A 40-80 40 A T>80 10 B T<10 20 B 10-40 30 B 40-80 40 B T>80

[0127] Thus, by combining Table 1, the abnormal temperature measurement point of the processor is determined, and according to S302, the actual temperature of the processor is predicted to be 55℃, and the processor model is B. Combining the second preset correspondence shown in Table 5, the temperature range of 40℃-80℃, which includes 55℃, and the processor model is B, corresponds to a heat dissipation device power of 30W. Therefore, the target power of the heat dissipation device is determined to be 30W.

[0128] It should be noted that the device model can be the device name, device code, or any other information used to identify the device. There are no special restrictions on the specific implementation of the device model here.

[0129] It should be noted that the heat dissipation device may also include multiple fans, each corresponding to a temperature measuring point. The second preset correspondence can also be the relationship between the temperature value of each measuring point and the fan corresponding to that measuring point. Based on the actual temperature value of the abnormal measuring point, the target power of the fan corresponding to that abnormal measuring point can be determined. No particular restrictions are placed on the specific structure of the heat dissipation device here.

[0130] The method provided in this application, through a pre-determined second preset correspondence, can determine the target power of the heat dissipation device based on the actual temperature value of the abnormal temperature measurement point and the temperature values ​​from other temperature measurement points outside the abnormal temperature measurement point, so that the heat dissipation device operates at the target power. On the one hand, it meets the server's heat dissipation requirements while avoiding energy waste due to excessive power of the heat dissipation device. On the other hand, it avoids the problem of noise generated by the heat dissipation device operating at high power, which would affect the user experience.

[0131] S304, Control the heat dissipation device to adjust the power to the target power.

[0132] The BMC sends control signals to the heat dissipation device via serial interfaces such as I2C, I3C, or SGPIO. These control signals can be PWM signals, which are used to control the heat dissipation device to adjust its power to the target power.

[0133] As described in S301-S304 above, the method provided in this application, when there are abnormal temperature measurement points among multiple temperature measurement points in the server, predicts the actual temperature value of the abnormal temperature measurement point through a first preset correspondence, and controls the heat dissipation device to adjust its power to the target power based on the actual temperature value. This can prevent the server's heat dissipation strategy from failing, thereby preventing damage to internal components of the server. Furthermore, controlling the heat dissipation device to operate at the target power can reduce energy consumption and save resources while meeting the server's heat dissipation requirements. Simultaneously, it can also reduce the noise generated during server operation, improving the user experience.

[0134] In one possible implementation, after S304, if the fault at the abnormal temperature measurement point is resolved, the temperature values ​​of multiple temperature measurement points are acquired. Based on these multiple temperature values, the power of the heat dissipation device is adjusted.

[0135] In this way, once the fault at the abnormal temperature measurement point is resolved, the BMC adjusts the power of the heat dissipation device based on the temperature values ​​from multiple measurement points. This provides a more flexible heat dissipation adjustment strategy, which can reduce server energy consumption and thus save energy.

[0136] The foregoing mainly describes the solutions of the embodiments of this application from a methodological perspective. It is understood that, in order to achieve the above functions, the heat dissipation control device includes at least one of the hardware structures and software modules corresponding to each function. Those skilled in the art should readily recognize that, based on the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed in hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0137] This application embodiment can divide the heat dissipation control device into functional units according to the above method example. For example, each function can be divided into a separate functional unit, or two or more functions can be integrated into one processing unit. The integrated unit can be implemented in hardware or as a software functional unit. It should be noted that the unit division in this application embodiment is illustrative and only represents one logical functional division. In actual implementation, there may be other division methods.

[0138] For example, Figure 7 A structural block diagram of a heat dissipation control device according to an embodiment of this application is shown. The device includes a first determining unit 710, a temperature prediction unit 720, a second determining unit 730, and a power adjustment unit 740. The first determining unit 710 is used to determine an abnormal temperature measuring point from multiple temperature measuring points in a computing device, wherein the temperature value of the abnormal temperature measuring point has not been updated within a preset time period. The temperature prediction unit 720 is used to predict the actual temperature value of the abnormal temperature measuring point according to a first preset correspondence relationship, wherein the first preset correspondence relationship is the correspondence relationship between the temperature values ​​of multiple temperature measuring points. The second determining unit 730 is used to determine the target power of the heat dissipation device based on the actual temperature value. The power adjustment unit 740 is used to control the heat dissipation device to adjust its power to the target power. For example, combined with... Figure 3 The first determining unit 710 can be used to perform, for example... Figure 3 As shown in S301, the temperature prediction unit 720 can be used to perform, for example... Figure 3 As shown in S302, the second determining unit 730 can be used to perform, for example... Figure 3 As shown in S303, the power adjustment unit 740 can be used to perform, for example... Figure 3 S304 is shown.

[0139] Optionally, before determining the abnormal temperature measurement point from multiple temperature measurement points in the computing device, the first determining unit 710 is further configured to generate a first preset correspondence based on the temperature values ​​of multiple temperature measurement points when the heat dissipation device is running at different power.

[0140] Optionally, the second determining unit 730 is specifically used to determine the target power of the heat dissipation device based on the actual temperature value, the temperature values ​​of multiple temperature measuring points excluding abnormal temperature measuring points, and a second preset correspondence. The second preset correspondence is the correspondence between the temperature values ​​of multiple temperature measuring points and the power of the heat dissipation device.

[0141] Optionally, before determining the target power of the heat dissipation device based on the actual temperature value, the first determining unit 710 is further configured to generate a second preset correspondence relationship based on the temperature values ​​of multiple temperature measuring points and the corresponding power of the heat dissipation device when the heat dissipation device is running at different power.

[0142] Optionally, the computing device also includes multiple temperature sensors, each disposed at multiple temperature measurement points. These sensors detect the temperature values ​​at the measurement points. The first determining unit 710 is specifically used to repeatedly acquire the temperature values ​​of the multiple temperature measurement points in the computing device through the multiple temperature sensors within a preset time period. If an abnormal temperature value exists among the multiple temperature measurement points, the measurement point corresponding to the abnormal temperature value is determined as an abnormal measurement point. The abnormal temperature value is a temperature value that has not been updated within the preset time period. For example, combined with... Figure 4 The first determining unit 710 can be used to perform, for example... Figure 4 S401-S402 are shown.

[0143] Optionally, the first determining unit 710 is specifically used to adjust the power of the heat dissipation device to a preset power when there is an abnormal temperature value among the temperature values ​​of multiple temperature measurement points. It obtains the target temperature value of the temperature measurement point corresponding to the abnormal temperature value after power adjustment. If the target temperature value is the same as the abnormal temperature value, the temperature measurement point corresponding to the abnormal temperature value is determined as the abnormal temperature measurement point. For example, combined with... Figure 6b The first determining unit 710 can be used to perform, for example... Figure 6b S601-S603 are shown.

[0144] Optionally, the computing device also includes multiple temperature sensors, each disposed at multiple temperature measurement points, used to detect the temperature value at each measurement point. The first determining unit 710 is further configured to acquire status information of the multiple temperature sensors, including whether they are operating normally or abnormally; if any of the multiple temperature sensors exhibit abnormal operation, the temperature measurement point corresponding to the temperature sensor with the abnormal operation status is determined as an abnormal temperature measurement point. For example, in conjunction with... Figure 6a The first determining unit 710 can be used to perform, for example... Figure 6a S501-S502 are shown.

[0145] As an example, combined Figure 1 or Figure 2The functions implemented by some or all of the first determining unit 710, temperature prediction unit 720, second determining unit 730, and power adjustment unit 740 in the above-mentioned device can be achieved through Figure 1 or Figure 2 The baseboard management controller 130 in the middle executes Figure 1 or Figure 2 The program code is implemented in memory 120.

[0146] For a detailed description of the above-mentioned optional methods, please refer to the foregoing method embodiments, which will not be repeated here. Furthermore, the explanation of any of the heat dissipation control devices provided above and the description of their beneficial effects can be found in the corresponding method embodiments described above, which will not be repeated here.

[0147] This application also provides a computing device, including a baseboard management controller (BMC) and a memory. The BMC is connected to the memory. The memory stores computer execution instructions, and the BMC executes the computer execution instructions stored in the memory to implement the methods of the above embodiments. Explanations of the relevant content and descriptions of the beneficial effects of any of the computing devices provided above can be found in the corresponding embodiments described above, and will not be repeated here.

[0148] This application also provides a computer-readable storage medium storing at least one computer instruction, which is loaded and executed by a processor to implement the methods of the various embodiments described above. Explanations of the relevant content and descriptions of the beneficial effects of any of the computer-readable storage media provided above can be found in the corresponding embodiments described above, and will not be repeated here.

[0149] This application also provides a chip. The chip integrates a control circuit for implementing the functions of the aforementioned fault injection heat dissipation control device and one or more ports. Optionally, the functions supported by the chip can be referred to above, and will not be repeated here. Those skilled in the art will understand that all or part of the steps of the above embodiments can be implemented by a program instructing related hardware. The program can be stored in a computer-readable storage medium. The aforementioned storage medium can be a read-only memory, random access memory, etc. The aforementioned processing unit or processor can be a central processing unit, a general-purpose processor, an application-specific integrated circuit (ASIC), a microprocessor (digital signal processor, DSP), a field-programmable gate array (FPGA), or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof.

[0150] This application also provides a computer program product containing instructions that, when executed on a computer, cause the computer to perform any of the methods described in the above embodiments. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the flow or function according to the embodiments of this application is generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, computer instructions may be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium accessible to a computer or may include one or more data storage devices such as servers or data centers that can be integrated with the medium. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., SSD), etc.

[0151] It should be noted that the devices for storing computer instructions or computer programs provided in the embodiments of this application, such as, but not limited to, the aforementioned memory, computer-readable storage medium, and communication chip, are all non-transitory. Those skilled in the art should recognize that the functions described in the embodiments of this application in one or more of the above examples can be implemented using hardware, software, firmware, or any combination thereof. When implemented using software, these functions can be stored in a computer-readable storage medium or transmitted as one or more instructions or code on a computer-readable storage medium. Computer-readable storage media include computer storage media and communication media, wherein communication media include any medium that facilitates the transmission of computer programs from one place to another. Storage media can be any available medium accessible to general-purpose or special-purpose computers. The above descriptions are merely optional embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A heat dissipation control method, characterized in that, Applied to a computing device equipped with a heat dissipation device, the method includes: An abnormal temperature measurement point is determined from multiple temperature measurement points in the computing device. The abnormal temperature measurement point is a temperature measurement point whose temperature value has not been updated within a preset time period. The actual temperature value of the abnormal temperature measurement point is predicted according to the first preset correspondence relationship, where the first preset correspondence relationship is the correspondence relationship between the temperature values ​​of the multiple temperature measurement points. The target power of the heat dissipation device is determined based on the actual temperature value; The heat dissipation device is controlled to adjust its power to the target power.

2. The method according to claim 1, characterized in that, Before determining the abnormal temperature measurement point from the plurality of temperature measurement points in the computing device, the method further includes: The first preset correspondence is generated based on the temperature values ​​of the multiple temperature measuring points when the heat dissipation device is running at different power.

3. The method according to claim 1 or 2, characterized in that, Determining the target power of the heat dissipation device based on the actual temperature value includes: The target power of the heat dissipation device is determined based on the actual temperature value, the temperature values ​​of the multiple temperature measuring points excluding abnormal temperature measuring points, and a second preset correspondence. The second preset correspondence is the correspondence between the temperature values ​​of the multiple temperature measuring points and the power of the heat dissipation device.

4. The method according to claim 3, characterized in that, Before determining the target power of the heat dissipation device based on the actual temperature value, the method further includes: The second preset correspondence is generated based on the temperature values ​​of the multiple temperature measuring points when the heat dissipation device operates at different power levels and the corresponding power of the heat dissipation device.

5. The method according to any one of claims 1, 2, and 4, characterized in that, The computing device also includes a plurality of temperature sensing devices, which are respectively disposed at the plurality of temperature measuring points, and the temperature sensing devices are used to detect the temperature value of the temperature measuring points. The step of determining abnormal temperature measurement points from multiple temperature measurement points in the computing device includes: Within the preset time period, the temperature values ​​of multiple temperature measuring points in the computing device are acquired multiple times through the multiple temperature sensing devices; If there is an abnormal temperature value among the temperature values ​​of the multiple temperature measurement points, the temperature measurement point corresponding to the abnormal temperature value is determined as the abnormal temperature measurement point, and the abnormal temperature value is the temperature value that has not been updated within the preset time period.

6. The method according to claim 5, characterized in that, In the case where there is an abnormal temperature value among the temperature values ​​of the multiple temperature measurement points, the temperature measurement point corresponding to the abnormal temperature value is identified as an abnormal temperature measurement point, including: If there is an abnormal temperature value among the temperature values ​​of the multiple temperature measurement points, the power of the heat dissipation device will be adjusted to a preset power. Obtain the target temperature value of the temperature measuring point corresponding to the abnormal temperature value after adjusting the power. If the target temperature value is the same as the abnormal temperature value, the temperature measurement point corresponding to the abnormal temperature value is determined as the abnormal temperature measurement point.

7. The method according to any one of claims 1, 2, 4, and 6, characterized in that, The computing device also includes a plurality of temperature sensing devices, which are respectively disposed at the plurality of temperature measuring points, and the temperature sensing devices are used to detect the temperature value of the temperature measuring points. The step of determining abnormal temperature measurement points from multiple temperature measurement points in the computing device includes: Acquire the status information of the plurality of temperature sensing devices, the status information including normal or abnormal; The temperature measurement point corresponding to the temperature sensing control whose status information is abnormal is determined as the abnormal temperature measurement point.

8. A heat dissipation control device, characterized in that, The device is applied to a computing device, the computing device being equipped with a heat dissipation device, and the device includes: The first determining unit is used to determine an abnormal temperature measuring point from multiple temperature measuring points in the computing device, wherein the temperature value of the abnormal temperature measuring point has not been updated within a preset time period; A temperature prediction unit is used to predict the actual temperature value of the abnormal temperature measurement point according to a first preset correspondence relationship, wherein the first preset correspondence relationship is the correspondence relationship between the temperature values ​​of the multiple temperature measurement points. The second determining unit is used to determine the target power of the heat dissipation device based on the actual temperature value; A power adjustment unit is used to control the heat dissipation device to adjust the power to the target power.

9. A computing device, characterized in that, include: The baseboard management controller (BMC) and the memory are connected together. The memory is used to store computer execution instructions, and the baseboard management controller (BMC) executes the computer execution instructions stored in the memory to implement the method as described in any one of claims 1-7.

10. A computer program product, characterized in that, The computer program product includes computer execution instructions that, when executed on a computer, cause the computer to perform the method as described in any one of claims 1-7.

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