High efficiency film processor and method of using same

Abstract

The application belongs to the technical field of semiconductors, and particularly relates to a high-efficiency film reversing machine and a use method thereof. The high-efficiency film reversing machine comprises a rack, wherein the rack is provided with a workbench; the workbench is provided with a first feeding port, a second feeding port, a first work station and a second work station; the high-efficiency film reversing machine further comprises: a first conveying mechanism for conveying a first material flower basket in which silicon wafers are placed from the first feeding port to the first work station; a second conveying mechanism for conveying an empty second material flower basket from the second feeding port to the second work station; a silicon wafer separating mechanism for lifting the silicon wafers from the first material flower basket; a silicon wafer clamping mechanism for clamping the separated silicon wafers; and a carrying mechanism for carrying the second material flower basket from the second work station to the first work station. The application can automatically pour a plurality of silicon wafers in the first material flower basket into the second material flower basket.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor technology, specifically relating to a high-efficiency wafer flipping machine and its usage method. Background Technology

[0002] A silicon wafer is a silicon chip used in the fabrication of silicon semiconductor integrated circuits. Because of its circular shape, it is called a wafer. Silicon wafers are the carrier used in the production of integrated circuits; generally, silicon wafers refer to single-crystal silicon wafers. Single-crystal silicon wafers are made by drawing and refining ordinary silicon sand, followed by a series of processes including dissolution, purification, and distillation to produce single-crystal silicon rods. After polishing and slicing, the single-crystal silicon rods become silicon wafers.

[0003] Silicon wafer processing generally includes the following steps: first, the silicon wafer is properly cleaned, then oxidation and chemical vapor deposition are performed on its surface, followed by repeated steps such as coating, exposure, development, etching, ion implantation, and metal sputtering, and finally, several layers of circuits and components are processed and fabricated on the silicon wafer.

[0004] Before processing, silicon wafers are typically placed in wafer baskets, which include PP baskets (made of PP) and PFA baskets (made of PFA). PP baskets, due to their light weight, are commonly used for transporting silicon wafers; however, PP baskets lack acid and alkali resistance and high-temperature resistance, making them unsuitable for direct use in processes such as wafer cleaning. PFA baskets, on the other hand, possess acid and alkali resistance and high-temperature resistance, allowing for cleaning processes even when silicon wafers are present.

[0005] Therefore, there is a need for a device that automatically pours silicon wafers from a PP basket into a PFA basket, or automatically pours silicon wafers that have completed the process from a PFA basket into a PP basket. Summary of the Invention

[0006] This invention addresses the lack of a technical method for transferring silicon wafers from PP baskets to PFA baskets during silicon wafer processing, and aims to provide a high-efficiency wafer transfer machine and its usage method.

[0007] A high-efficiency film turning machine includes a frame on which a worktable is provided;

[0008] The workbench is provided with a first feeding port, a second feeding port, a first station, and a second station;

[0009] The high-efficiency wafer turning machine also includes:

[0010] The first conveying mechanism transports the first material basket containing silicon wafers from the first loading port to the first workstation.

[0011] The second conveying mechanism transports the empty second material flower basket from the second feeding port to the second workstation;

[0012] A silicon wafer detachment mechanism lifts the silicon wafer from the first material basket;

[0013] A silicon wafer clamping mechanism clamps the raised silicon wafer;

[0014] A transport mechanism moves the flower basket made of the second material from the second workstation to the first workstation.

[0015] With the above design, the present invention allows for the following: an external feeding mechanism or manual operation delivers a first material basket containing silicon wafers into the first loading port and an empty second material basket into the second loading port. A first conveying mechanism moves the first material basket to the first workstation, while a second conveying mechanism moves the empty second material basket to the second workstation. A wafer detachment mechanism lifts the silicon wafer from the first material basket, detaching it from the first material basket. A wafer clamping mechanism then clamps the detached wafer, and the wafer detachment mechanism returns to its original position. The empty first material basket is then returned to the first loading port by the first conveying mechanism for collection by the external feeding mechanism or manual operation. Simultaneously, a transport mechanism transports the empty second material basket from the second workstation to the first workstation. The wafer detachment mechanism lifts the clamped wafer, the wafer clamping mechanism releases the wafer, and as the wafer detachment mechanism returns to its original position, the wafer is poured into the second material basket located at the first workstation, thus completing the wafer pouring process.

[0016] As a preferred embodiment, the workbench is provided with two conveying channels arranged side by side along the front-to-back direction. The length direction of the conveying channels is the left-to-right direction. The two ends of one conveying channel are the first feeding port and the first working position, respectively, and the two ends of the other conveying channel are the second feeding port and the second working position, respectively.

[0017] As a preferred embodiment, the first transportation mechanism and the second transportation mechanism use the same transportation mechanism, which includes:

[0018] A conveying and moving mechanism is fixed on the frame below the workbench and has a moving end that can move left and right;

[0019] A conveying and lifting mechanism has a lifting end for lifting, which is fixed on the moving end of the conveying and moving mechanism and is driven by the conveying and moving mechanism to move left and right;

[0020] A conveying plate is fixed on the lifting end of the conveying lifting mechanism and is driven by the conveying lifting mechanism to perform lifting and lowering movements. During the lifting and lowering process, the conveying plate can pass through the corresponding conveying groove.

[0021] As a preferred embodiment, the silicon wafer detachment mechanism includes:

[0022] A machine is detached from the lifting mechanism and fixed on the frame on the side of the first workstation, and has a lifting end for lifting.

[0023] A silicon wafer carrier mechanism is fixed on the lifting end of the disengagement lifting mechanism and is driven by the disengagement lifting mechanism to perform lifting and lowering movements. During the lifting and lowering process of the silicon wafer carrier mechanism, it can pass through the transport groove at the first work station.

[0024] As a preferred embodiment, the silicon wafer clamping mechanism includes:

[0025] A clamping drive device is fixed on the frame;

[0026] A pair of clamping connecting shafts, one end of which is connected to the clamping drive device via a transmission mechanism, the pair of clamping connecting shafts are arranged parallel to each other and are driven by the clamping drive device to rotate in opposite directions or in opposite directions;

[0027] A pair of silicon wafer clamps are symmetrically fixed on the clamping connecting shaft and are driven by the clamping connecting shaft to perform opening and closing movements. The silicon wafer clamps are located above the silicon wafer release mechanism.

[0028] As a preferred embodiment, the conveying mechanism includes:

[0029] A transport and moving mechanism is fixed on the frame on the side of the workbench and has a moving end that can move back and forth;

[0030] A conveying drive device is fixed on the moving end of the conveying and moving mechanism and is driven by the conveying and moving mechanism to move back and forth;

[0031] A pair of transport connecting shafts, one end of which is connected to the transport drive device via a transmission mechanism, the pair of transport connecting shafts are arranged parallel to each other and are driven by the transport drive device to rotate in opposite directions or in opposite directions;

[0032] At least one pair of transport clamps are symmetrically fixed on the transport connecting shaft and driven by the transport connecting shaft to perform opening and closing movements. The transport clamps have an L-shaped structure with a bent bottom.

[0033] As a preferred embodiment, the workbench further includes a third station and a fourth station;

[0034] The conveying mechanism moves the second material basket containing silicon wafers from the first workstation to the third workstation;

[0035] Also includes:

[0036] The high-efficiency wafer turning machine also includes:

[0037] A transfer mechanism transports a second material basket containing silicon wafers from the third workstation to the fourth workstation.

[0038] As a preferred embodiment, a transfer groove is provided on the workbench along the front-to-back direction, the length direction of the transfer groove is the left-to-right direction, and the two ends of the transfer groove are the third work station and the fourth work station, respectively.

[0039] As a preferred embodiment, the first transport mechanism, the second transport mechanism, and the transfer mechanism are arranged side by side in the front-to-back direction.

[0040] As a preferred embodiment, the transfer mechanism adopts the same structure as the first conveying mechanism, that is, the transfer mechanism includes:

[0041] A transfer mechanism is fixed on the frame below the workbench and has a movable end that can move left and right;

[0042] A transfer and lifting mechanism has a lifting end for lifting, which is fixed on the moving end of the transfer and moving mechanism and is driven by the transfer and moving mechanism to move left and right;

[0043] A transfer plate is fixed on the lifting end of the transfer lifting mechanism and is driven by the transfer lifting mechanism to perform lifting and lowering movements. During the lifting and lowering process, the transfer plate can pass through the transfer groove.

[0044] As a preferred embodiment, the silicon wafer clamp has the following features:

[0045] Two vertical arms are set at a certain distance apart;

[0046] A support rod, with its two ends connected to the lower parts of the two vertical arms respectively;

[0047] The inclined upper surface of the support rod has several parallel inclined support grooves that are lower on the inside and higher on the outside, supporting the silicon wafer at a single point.

[0048] As a preferred embodiment, the silicon wafer clamp further includes:

[0049] One connecting rod is connected at both ends to the upper part of the two vertical arms respectively.

[0050] As a preferred embodiment, the axial direction of the inclined support groove is a curved axial arc.

[0051] As a preferred embodiment, the inclined support groove has:

[0052] The first port is located on the inside;

[0053] An upper port is located on the outside, and the line connecting the lower port and the upper port forms the curved axial arc.

[0054] As a preferred embodiment, the radius of curvature of the curved axial arc is 2.21R~3.16R, preferably 2.82R~3.01R, and more preferably 2.94R, where R is the radius of the silicon wafer.

[0055] As a preferred embodiment, the inclined support groove has:

[0056] A chamfered groove for a row of liquids is formed within the inner inclined upper surface of the support rod;

[0057] An upper groove for supporting the silicon wafer is formed on the inner inclined upper surface of the support rod and located above the chamfered lower groove, and is integrally connected with the chamfered lower groove.

[0058] As a preferred embodiment, the included angle α of the chamfered groove is 15.6°~19.2°, preferably 16.8°~18.4°, and more preferably 17.6°.

[0059] As a preferred embodiment, the included angle β formed by the two upper groove walls is 45°~65°, preferably 48°~60°, and more preferably 53°~55°.

[0060] As a preferred embodiment, the chamfered groove has: an arc-shaped bottom wall and two chamfered groove walls extending from both sides of the arc-shaped bottom wall, the two chamfered groove walls forming an included angle α of the chamfered groove;

[0061] The upper groove has two upper groove walls that extend from the sides of the two chamfered groove walls of the lower groove at an included angle β.

[0062] As a preferred embodiment, the inner wall of the support rod has a plurality of inner grooves for draining liquid, and one end of the inner grooves is connected to the lower port of the inclined support groove.

[0063] A method for using a high-efficiency film rewinding machine includes:

[0064] The first material basket containing silicon wafers at the first feeding port is moved to the first workstation by the first conveying mechanism, and the empty second material basket at the second feeding port is moved to the second workstation by the second conveying mechanism.

[0065] The silicon wafer is detached from the first material basket by the silicon wafer detachment mechanism. After the detached silicon wafer is picked up by the silicon wafer clamping mechanism, the silicon wafer detachment mechanism returns to its original position, and the empty first material basket is sent back to the first feeding port by the first conveying mechanism.

[0066] The second material basket at the second workstation is transported to the first workstation by the transport mechanism. The silicon wafer is lifted by the silicon wafer clamping mechanism by the silicon wafer detachment mechanism. The silicon wafer clamping mechanism releases the silicon wafer. When the silicon wafer returns to its original position by the silicon wafer detachment mechanism, the silicon wafer is poured into the second material basket.

[0067] As a preferred option, it also includes:

[0068] The second material basket containing silicon wafers at the first workstation is transported to the third workstation by the transport mechanism, and the second material basket at the third workstation is moved to the fourth workstation by the transfer mechanism.

[0069] The significant advantages of this invention are: the high-efficiency wafer-turning machine and its method of use can automatically turn multiple silicon wafers from a first material basket into a second material basket. The invention has a rational layout and can achieve the goal of high-efficiency wafer turning. Attached Figure Description

[0070] Figure 1(a) is a schematic diagram of an overall structure of the present invention;

[0071] Figure 1(b) is a top view of Figure 1(a);

[0072] Figure 1(c) is a side view of Figure 1(a);

[0073] Figure 1(d) is the rear view of Figure 1(a);

[0074] Figure 2(a) is a schematic diagram of one structure of the conveying mechanism of the present invention;

[0075] Figure 2(b) is the front view of Figure 2(a);

[0076] Figure 2(c) is a side view of Figure 2(a);

[0077] Figure 3 This is a schematic diagram of one structure of the silicon wafer detachment mechanism of the present invention;

[0078] Figure 4(a) is a schematic diagram of one structure of the silicon wafer clamping mechanism of the present invention;

[0079] Figure 4(b) is a side view of Figure 4(a);

[0080] Figure 4(c) is a front view of the silicon wafer clamping mechanism of the present invention;

[0081] Figure 5(a) is a schematic diagram of one structure of the handling mechanism of the present invention;

[0082] Figure 5(b) is a side view of Figure 5(a);

[0083] Figures 6(a) and 6(b) are schematic diagrams of the cross-sectional structure of the support rod of the silicon wafer clamp of the present invention along the axial direction of the support groove;

[0084] Figure 6(c) is a schematic diagram of the support rod of the silicon wafer clamp of the present invention along the radial cross-section of the support groove;

[0085] Figure 6(d) is a partially enlarged schematic diagram of the silicon wafer clamp of the present invention when holding a silicon wafer. Detailed Implementation

[0086] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below with reference to specific illustrations.

[0087] Referring to Figures 1(a) to 1(d), the present invention provides a high-efficiency wafer flipping machine, including a frame 1, a first conveying mechanism 2, a second conveying mechanism 3, a silicon wafer detachment mechanism 4, a silicon wafer clamping mechanism 5, and a transport mechanism 6.

[0088] The frame 1 is equipped with a worktable 11, and the worktable 11 is equipped with a first feeding port, a second feeding port, a first station and a second station.

[0089] In this embodiment, referring to Figures 1(a) and 1(b), two conveying channels, namely conveying channel 12 and conveying channel 13, are arranged side by side along the front-to-back direction on the worktable 11. The length direction of both conveying channels is left-to-right. The two ends of conveying channel 12 are the first feeding port and the first working position, respectively, and the two ends of conveying channel 13 are the second feeding port and the second working position, respectively. In specific implementation, the positions of the first feeding port and the first working position, and the second feeding port and the second working position can be reversed, as long as the first feeding port and the first working position are located at the two ends of the same conveying channel, and the second feeding port and the second working position are located at the two ends of the same conveying channel.

[0090] The first conveying mechanism 2 transports a first-material basket 81 containing silicon wafers 9 from the first loading port to the first workstation. This first-material basket 81 can be a PP basket or another basket different from the second material. The second conveying mechanism 3 transports an empty second-material basket 82 from the second loading port to the second workstation. This second-material basket 82 can be a PFA basket or another basket different from the first material. With this design, an external feeding mechanism or manual operation feeds the first-material basket 81 containing silicon wafers 9 into the first loading port and the empty second-material basket 82 into the second loading port. The first conveying mechanism 2 moves the first-material basket 81 to the first workstation, while the second conveying mechanism 3 moves the empty second-material basket 82 to the second workstation.

[0091] In this embodiment, the first conveying mechanism 2 and the second conveying mechanism 3 use the same conveying mechanism. Referring to Figures 2(a) to 2(c), the conveying mechanism includes a conveying moving mechanism 21, a conveying lifting mechanism 22, and a conveying plate 23. The conveying moving mechanism 11 is fixed on the frame 1 below the workbench 11, and has a moving end for left and right movement. The conveying lifting mechanism 22 has a lifting end for lifting, and is fixed on the moving end of the conveying moving mechanism 11, which drives the conveying lifting mechanism 22 to move left and right. The conveying plate 23 is fixed on the lifting end of the conveying lifting mechanism 22, which drives the conveying plate 23 to move up and down. During the lifting and lowering process, the conveying plate 23 can pass through the corresponding conveying groove. For example, the conveying plate of the first conveying mechanism 2 can pass through the conveying groove 12 during the lifting and lowering process, and the conveying plate of the second conveying mechanism 3 can pass through the conveying groove 13 during the lifting and lowering process.

[0092] In this embodiment, when the space of the frame 1 is limited and the layout between multiple conveying mechanisms is restricted, a conveying transition plate can be added between the conveying lifting mechanism 22 and the conveying plate 23 for transition, so that the lifting mechanism 22 and the conveying plate 23 are not in the same height range. At this time, the conveying plate 23 can be located above one side of the lifting mechanism 22 and can pass through the corresponding conveying groove during the lifting process, so as to lift the flower basket for movement.

[0093] The silicon wafer detachment mechanism 4 lifts the silicon wafer 9 from the first material basket 81. This invention achieves the detachment of the silicon wafer 9 from the first material basket 81 through the silicon wafer detachment mechanism 4; this process is performed at the first workstation.

[0094] In this embodiment, refer to Figure 3 The silicon wafer detachment mechanism 4 includes a detachment lifting mechanism 41 and a silicon wafer carrying mechanism 42. The detachment lifting mechanism 41 is fixed to the frame 1 on the side of the first workstation and has a lifting end for lifting. The silicon wafer carrying mechanism 42 is fixed to the lifting end of the detachment lifting mechanism 41 and is driven by the detachment lifting mechanism 41 to move up and down. During the lifting process, the silicon wafer carrying mechanism 42 can pass through the transport trough at the first workstation. During the upward movement of the silicon wafer carrying mechanism 42, it can lift the silicon wafer 9 in the basket at the first workstation, thereby detaching the silicon wafer 9 from the basket. Conversely, during the downward movement of the silicon wafer carrying mechanism 42, it can place the lifted silicon wafer 9 back into the basket at the first workstation. The silicon wafer carrying mechanism 42 can adopt a structure of existing technology, such as the silicon wafer carrying mechanism described in Chinese Patent CN207572345U.

[0095] The silicon wafer clamping mechanism 5 clamps the detached silicon wafer 9. The silicon wafer clamping mechanism 5 works in conjunction with the silicon wafer detachment mechanism 4. After the silicon wafer detachment mechanism 4 lifts the silicon wafer 9 from the basket to the target height, the silicon wafer clamping mechanism 5 clamps the lifted silicon wafer 9 in one go. When it is necessary to pour the silicon wafer 9 back into the basket, after the silicon wafer detachment mechanism 4 lifts the silicon wafer 9 again, the silicon wafer clamping mechanism 5 releases the silicon wafer 9.

[0096] In this embodiment, referring to Figures 4(a) to 4(c), the silicon wafer clamping mechanism 5 includes a clamping drive device 51, a pair of clamping connecting shafts 52, and a pair of silicon wafer clamps 53. The clamping drive device 51 is fixed on the frame 1. One end of each clamping connecting shaft 52 is connected to the clamping drive device 51 via a transmission mechanism. The pair of clamping connecting shafts 52 are arranged parallel to each other and are driven by the clamping drive device 51 to rotate in opposite directions. The pair of silicon wafer clamps 53 are symmetrically fixed on the clamping connecting shafts 52 and are driven by the clamping connecting shafts 52 to perform opening and closing movements. The silicon wafer clamps 53 are located above the silicon wafer release mechanism 4. Specifically, the silicon wafer clamps 53 are located above the silicon wafer carrying mechanism 42. The clamping drive device 51 can be a drive device in the prior art, as long as it can drive the pair of clamping connecting shafts 52 to rotate in opposite directions via a transmission mechanism.

[0097] The silicon wafer clamp 53 of the present invention can adopt the clamps used in the prior art for clamping a row of silicon wafers 9 at one time, and preferably adopts the following design.

[0098] In this embodiment, referring to Figures 4(a) to 4(c) and 6(a) to 6(d), the silicon wafer clamp 53 has two vertical arms 531 and a support rod 532. The two vertical arms 531 are spaced apart by a certain distance. One end of the support rod 532 is connected to the lower part of one of the vertical arms 531, and the other end is connected to the lower part of the other vertical arm 531, thereby connecting the lower ends of the two vertical arms 531 through the support rod 532. This connection can also be a fixed connection. The upper surface of the support rod 532 is an inclined upper surface, which is lower on the inner side and higher on the outer side. There are several parallel inclined support grooves 533 on the inclined upper surface. From the axial cross-section of the inclined support grooves 533, the inclined support grooves 533 have the characteristics of being lower on the inner side and higher on the outer side. Therefore, when the silicon wafer 9 is clamped between the two clamps, the liquid remaining on the silicon wafer 9 can flow down from the outer side to the inner side.

[0099] In this embodiment, the silicon wafer clamp also has an upper connecting rod 534, one end of which is connected to the upper part of one of the vertical arms 531, and the other end is connected to the upper part of the other vertical arm 531, thereby connecting the upper ends of the two vertical arms 531 through the upper connecting rod 534. This connection can be, for example, a fixed connection. The silicon wafer clamp is fixedly connected to the clamping connecting shaft 52 through the upper connecting rod 534.

[0100] In this embodiment, the inclined support groove 533 has a lower port 535 located on the inner side and an upper port 536 located on the outer side. The line connecting the lower port 535 and the upper port 536 forms a curved axial arc. The radius of curvature of this curved axial arc is much larger than the radius of the circular silicon wafer 9. Therefore, the inclined support groove 533 in the form of a curved axial arc can support the silicon wafer 9 in a single-point support manner. That is, there is only one contact point 91 on each side of the silicon wafer 9 that contacts its respective clamp. Therefore, the single-point support method can greatly reduce the contact area between the silicon wafer 9 and the clamp, and greatly reduce the probability of particles in the liquid remaining on the silicon wafer 9.

[0101] In this embodiment, the radius of curvature of the curved axial arc is more than twice the radius R of the silicon wafer, preferably 2.21R~3.16R, more preferably 2.82R~3.01R, and more preferably 2.94R, where R is the radius of the silicon wafer 9.

[0102] In this embodiment, viewed in radial cross-section, the inclined support groove 533 has a chamfered lower groove 533a for draining liquid, formed within the inner inclined upper surface of the support rod 532. The inclined support groove 533 also has an upper groove 533b for supporting the silicon wafer, formed on the inner inclined upper surface of the support rod 532 and located above the chamfered lower groove 533a, integrally connected with the chamfered lower groove 533a. Due to the chamfered lower groove 533a, when the silicon wafer 9 is supported in the upper groove 533b using a single-point support method, the liquid flowing down from the portion above the single-point support on the inclined upper surface of the support rod 532 will flow directly down into the chamfered lower groove, no longer flowing through the single-point support point between the silicon wafer 9 and the support rod 532. This greatly reduces the contact between the liquid and the silicon wafer 9, reduces the probability of particles remaining on the silicon wafer 9, and improves the product yield.

[0103] In this embodiment, the chamfered groove 533a has an arc-shaped bottom wall 5331 and two chamfered groove walls 5332 extending from both sides of the arc-shaped bottom wall 5331. The two chamfered groove walls 5332 form an included angle α of the chamfered groove. The included angle α of the chamfered groove is 15.6°~19.2°, preferably 16.8°~18.4°, and more preferably 17.6°.

[0104] In this embodiment, the upper groove has two upper groove walls 5333 extending from the sides of the two chamfered groove walls 5332 of the lower groove at an included angle β. The included angle β formed by the two upper groove walls 5333 is 45°~65°, preferably 48°~60°, and more preferably 53°~55°.

[0105] In this embodiment, the first inclined surface 532a of the inner sidewall of the support rod 532 has a plurality of inner grooves 537 for drainage. One end of the inner groove 537 is connected to the lower port of the inclined support groove 533, and the other end of the inner groove 537 extends to the bottom wall of the support rod 532. The outer inclined surface 532b of the outer sidewall of the support rod 532 has a plurality of outer grooves 538 for drainage. The upper end of the outer groove 538 starts from the outer sidewall and extends along the outer inclined surface 532b to the bottom wall of the support rod 532. Preferably, the outer groove 538 and the inner groove 537 can converge at a point on the bottom wall of the support rod 532, as shown in Figures 6(a) and 6(b).

[0106] The transport mechanism 6 transports the empty second material basket 82 from the second station to the first station, so that the second material basket 82 is ready to hold the silicon wafer 9. After the second material basket 82 is placed at the first station, the silicon wafer detachment mechanism 4 and the silicon wafer clamping mechanism 5 work together to hold the silicon wafer 9 into the empty second material basket 82, thus realizing the placement of the silicon wafer 9.

[0107] In this embodiment, referring to Figures 5(a) and 5(b), the transport mechanism 6 includes a transport moving mechanism 61, a transport driving device 62, a pair of transport connecting shafts 63, and at least a pair of transport clamps 64. The transport moving mechanism 61 is fixed on the frame 1 on the side of the workbench 11, and has a moving end for forward and backward movement. The transport driving device 62 is fixed on the moving end of the transport moving mechanism 61, and is driven by the transport moving mechanism 61 to move forward and backward. One end of the transport connecting shaft 63 is connected to the transport driving device 62 through a transmission mechanism. The pair of transport connecting shafts 63 are arranged parallel to each other and are driven by the transport driving device 62 to rotate in opposite directions. Each pair of transport clamps 64 is symmetrically fixed on the transport connecting shaft 63, and each pair of transport clamps 64 is driven by the transport connecting shaft 63 to perform opening and closing movements. The transport clamps 64 have an L-shaped structure with a bent bottom. As shown in Figure 5(a), there are two pairs of transport clamps 64, and two independent transport clamps 64 are provided on each connecting shaft 63.

[0108] In this embodiment, the workbench 11 also includes a third station and a fourth station. The transport mechanism 6 transports the second material basket 82 containing the silicon wafer 9 from the first station to the third station. The high-efficiency wafer foundry also includes a transfer mechanism 7, which transports the second material basket 82 containing the silicon wafer 9 from the third station to the fourth station.

[0109] In this embodiment, referring to Figures 1(a) and 1(b), a transfer groove 14 is provided on the worktable 11 along the front-to-back direction. The length direction of the transfer groove 14 is the left-to-right direction, and the two ends of the transfer groove 14 are the third station and the fourth station, respectively.

[0110] In this embodiment, referring to Figures 1(a) to 1(d), the first conveying mechanism 2, the second conveying mechanism 3, and the transfer mechanism 7 are arranged side by side in the front-to-back direction. At this time, the conveying trough 12, the conveying trough 13, and the transfer trough 14 are also arranged side by side in the front-to-back direction.

[0111] In this embodiment, the transfer mechanism 7 adopts the same structure as the first conveying mechanism 2, that is, the transfer mechanism 7 includes a transfer moving mechanism, a transfer lifting mechanism, and a transfer plate. The transfer moving mechanism is fixed on the frame 1 below the workbench 11, and has a moving end for left and right movement. The transfer lifting mechanism has a lifting end for lifting, and is fixed on the moving end of the transfer moving mechanism, driving the transfer lifting mechanism to move left and right. The transfer plate is fixed on the lifting end of the transfer lifting mechanism, and is driven by the transfer lifting mechanism to move up and down, passing through the transfer groove 14 during the lifting process.

[0112] This invention also provides a method for using a high-efficiency wafer turning machine, comprising the following steps:

[0113] The first material basket 81, which contains silicon wafers 9, is moved from the first loading port to the first station by the first conveying mechanism 2, and the empty second material basket 82 at the second loading port is moved to the second station by the second conveying mechanism 3.

[0114] The silicon wafer 9 is detached from the first material basket 81 by the silicon wafer detachment mechanism 4. After the detached silicon wafer 9 is picked up by the silicon wafer clamping mechanism 5, the silicon wafer detachment mechanism 4 returns to its original position and the empty first material basket 81 is sent back to the first feeding port by the first conveying mechanism 2.

[0115] The second material basket 82 at the second workstation is transported to the first workstation by the transport mechanism 6. The silicon wafer detachment mechanism 4 lifts up the silicon wafer 9 held by the silicon wafer clamping mechanism 5. When the silicon wafer clamping mechanism 5 releases the silicon wafer 9 and returns to its original position by the silicon wafer detachment mechanism 4, the silicon wafer 9 falls into the second material basket 82.

[0116] In this embodiment, when the high-efficiency wafer foundry is equipped with a third station, a fourth station, and a transfer mechanism 7, the second material basket 82 containing silicon wafers 9 at the first station is transported to the third station by the transport mechanism 6, and then the second material basket 82 at the third station is moved to the fourth station by the transfer mechanism 7. At this time, silicon wafers 9 are placed in the second material basket 82 at the fourth station for subsequent silicon wafer cleaning and other process steps.

[0117] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A high-efficiency wafer turning machine, comprising a frame, wherein a worktable is provided on the frame; Its features are, The workbench is provided with a first feeding port, a second feeding port, a first station, and a second station; The high-efficiency wafer turning machine also includes: The first conveying mechanism transports the first material basket containing silicon wafers from the first loading port to the first workstation. The second conveying mechanism transports the empty second material flower basket from the second feeding port to the second workstation; A silicon wafer detachment mechanism lifts the silicon wafer from the first material basket; A silicon wafer clamping mechanism clamps the raised silicon wafer; A transport mechanism moves the flower basket made of the second material from the second workstation to the first workstation; The workbench is provided with two conveying channels arranged side by side along the front-to-back direction. The length direction of the conveying channels is the left-to-right direction. The two ends of one conveying channel are the first feeding port and the first working position, respectively. The two ends of the other conveying channel are the second feeding port and the second working position, respectively. The first and second transportation mechanisms use the same transportation mechanism, which includes: A conveying and moving mechanism is fixed on the frame below the workbench and has a moving end that can move left and right; A conveying and lifting mechanism has a lifting end for lifting, which is fixed on the moving end of the conveying and moving mechanism and is driven by the conveying and moving mechanism to move left and right; A conveying plate is fixed on the lifting end of the conveying lifting mechanism and is driven by the conveying lifting mechanism to perform lifting and lowering movements. During the lifting and lowering process, the conveying plate can pass through the corresponding conveying groove. The silicon wafer detachment mechanism includes: A machine is detached from the lifting mechanism and fixed on the frame on the side of the first workstation, and has a lifting end for lifting. A silicon wafer carrier mechanism is fixed on the lifting end of the disengagement lifting mechanism and is driven by the disengagement lifting mechanism to perform lifting and lowering movements. During the lifting and lowering process of the silicon wafer carrier mechanism, it can pass through the transport groove at the first work station.

2. The high-efficiency wafer turning machine as described in claim 1, characterized in that, The silicon wafer clamping mechanism includes: A clamping drive device is fixed on the frame; A pair of clamping connecting shafts, one end of which is connected to the clamping drive device via a transmission mechanism, the pair of clamping connecting shafts are arranged parallel to each other and are driven by the clamping drive device to rotate in opposite directions or in opposite directions; A pair of silicon wafer clamps are symmetrically fixed on the clamping connecting shaft and are driven by the clamping connecting shaft to perform opening and closing movements. The silicon wafer clamps are located above the silicon wafer release mechanism.

3. The high-efficiency wafer turning machine as described in claim 1, characterized in that, The transport mechanism includes: A transport and moving mechanism is fixed on the frame on the side of the workbench and has a moving end that can move back and forth; A conveying drive device is fixed on the moving end of the conveying and moving mechanism and is driven by the conveying and moving mechanism to move back and forth; A pair of transport connecting shafts, one end of which is connected to the transport drive device via a transmission mechanism, the pair of transport connecting shafts are arranged parallel to each other and are driven by the transport drive device to rotate in opposite directions or in opposite directions; At least one pair of transport clamps are symmetrically fixed on the transport connecting shaft and driven by the transport connecting shaft to perform opening and closing movements. The transport clamps have an L-shaped structure with a bent bottom.

4. The high-efficiency wafer turning machine as described in any one of claims 1 to 3, characterized in that, The workbench also includes a third workstation and a fourth workstation; The conveying mechanism moves the second material basket containing silicon wafers from the first workstation to the third workstation; The high-efficiency wafer turning machine also includes: A transfer mechanism transports a second material basket containing silicon wafers from the third workstation to the fourth workstation.

5. The high-efficiency wafer turning machine as described in claim 4, characterized in that, A transfer groove is provided on the workbench along the front-to-back direction. The length direction of the transfer groove is the left-to-right direction. The two ends of the transfer groove are the third station and the fourth station, respectively.

6. The high-efficiency wafer turning machine as described in claim 4, characterized in that, The transfer mechanism adopts the same structure as the first transport mechanism.

7. A method of using the high-efficiency wafer turning machine according to any one of claims 1 to 6, characterized in that, include: The first material basket containing silicon wafers at the first feeding port is moved to the first workstation by the first conveying mechanism, and the empty second material basket at the second feeding port is moved to the second workstation by the second conveying mechanism. The silicon wafer is detached from the first material basket by the silicon wafer detachment mechanism. After the detached silicon wafer is picked up by the silicon wafer clamping mechanism, the silicon wafer detachment mechanism returns to its original position, and the empty first material basket is sent back to the first feeding port by the first conveying mechanism. The second material basket at the second workstation is transported to the first workstation by the transport mechanism. The silicon wafer is lifted by the silicon wafer clamping mechanism by the silicon wafer detachment mechanism. The silicon wafer clamping mechanism releases the silicon wafer. When the silicon wafer returns to its original position by the silicon wafer detachment mechanism, the silicon wafer is poured into the second material basket.

8. The method of use as described in claim 7, characterized in that, Also includes: The second material basket containing silicon wafers at the first workstation is transported to the third workstation by the transport mechanism, and the second material basket at the third workstation is moved to the fourth workstation by the transfer mechanism.

Images