Fuse tinning apparatus and method

Abstract

The application discloses a fuse tinning device and method, wherein the fuse tinning device comprises a fuse melting substrate placing rack for placing a fuse melting substrate; a tin strip placing rack for placing a tin strip; the tin strip placing rack is arranged above the fuse melting substrate placing rack; a flux pool for storing flux; a flux roller is further arranged above the flux pool, and the flux roller applies flux to one side of the tin strip which faces the fuse melting substrate when the tin strip passes through the surface of the flux roller; a pressing roller is further arranged behind the flux pool, and the pressing roller presses the tin strip coated with flux and the fuse melting substrate; a reflow oven is further arranged behind the pressing roller, and the reflow oven fuses the tin strip and the fuse melting substrate by adjusting temperature; and a winding device is further arranged behind the reflow oven, and the winding device winds the tin strip and the fuse melting substrate after fusion.

Description

Technical Field

[0001] This application relates to the field of fuse manufacturing technology, and in particular to a fuse tinning device and method. Background Technology

[0002] Currently, most fuses on the market use copper and silver. However, with the increasing demands for safety and precision in industries such as new energy vehicles, high-speed rail, and aviation, and the shrinking size of fuses, the market demand for increasingly precise fusing is no longer sufficient to meet the needs of the market, which requires the use of only copper or silver fuses.

[0003] The conventional approach is to alter the physical properties of the fuse by using copper or silver as the fuse's base material. By introducing a tin point into the silver or copper fuse medium, the base material undergoes a physical change with the tin, causing it to melt at a temperature lower than the melting point of silver or copper itself. In this way, when a short-circuit current occurs, the fuse heats up to its melting point faster than it releases heat, thus achieving precise control over the fusing current and the fusing position.

[0004] However, how to tin the surface of the fuse substrate has become a technical problem that the industry urgently needs to solve. Summary of the Invention

[0005] In order to at least solve the above-mentioned technical problems, the purpose of this application is to provide a fuse tinning apparatus and method to solve the technical problem of tinning on the surface of the fuse melting substrate.

[0006] To achieve the above objectives, the fuse tinning device provided in this application, used for tinning the fuse fusing substrate, includes:

[0007] A fuse substrate holder for holding fuse substrate; a solder strip holder for holding solder strip; the solder strip holder is positioned above the fuse substrate holder; a flux tank for storing flux; a flux roller is located above the flux tank, and as the solder strip passes through the surface of the flux roller, the flux roller coats the side of the solder strip facing the fuse substrate with flux; a pressure roller is located behind the flux tank, and the pressure roller is used to press the flux-coated solder strip and the fuse substrate together; a reflow oven is located behind the pressure roller, and the reflow oven is used to fuse the solder strip and the fuse substrate by adjusting the temperature; a winding device is located behind the reflow oven, and the winding device is used to wind up the solder strip and the fuse substrate after they have fused together.

[0008] Furthermore, it also includes: a solder strip position corrector, used to adjust the fit between the solder strip and the flux roller;

[0009] The solder strip position corrector is positioned between the solder strip holder and the flux roller.

[0010] Furthermore, it also includes: a fuse fuse substrate position corrector for adjusting the levelness of the fuse fuse substrate;

[0011] The fuse fuse substrate position corrector is installed between the fuse fuse substrate placement frame and the pressure roller.

[0012] Furthermore, the fuse substrate position corrector also includes: controlling the fuse substrate to pass under the flux pool.

[0013] Furthermore, the reflow oven includes multiple temperature zones. Starting from the entrance of the reflow oven, the first temperature zone to the third to last temperature zone heats the bonded solder strip and the fuse-breaking substrate in stages.

[0014] Furthermore, the reflow oven includes multiple temperature zones, starting from the entrance of the reflow oven and from the third to the last temperature zone to the last one, to heat the bonded solder strip and the fuse-fused substrate in stages with progressively decreasing temperatures.

[0015] Furthermore, the temperature of the first temperature zone is 160℃-200℃; the temperature of the third to last temperature zone is 300℃-320℃; the temperature of the second to last temperature zone is 250℃-270℃; and the temperature of the last temperature zone is 200℃-220℃.

[0016] Furthermore, it also includes: a fuse position corrector, comprising multiple rollers for adjusting the position of the fuse exiting the reflow oven;

[0017] The fuse position corrector is installed between the reflow oven and the winding device.

[0018] Furthermore, it also includes a cooling device, which is installed between the reflow oven and the fuse position corrector. The cooling device is used to cool down the fuses coming out of the reflow oven.

[0019] To achieve the above objectives, the fuse tinning method provided in this application employs the aforementioned fuse tinning apparatus, comprising:

[0020] Start the reflow oven for preheating;

[0021] When each temperature zone in the reflow oven reaches the preset temperature threshold, the feeding of the solder strip and the fuse to melt the substrate is initiated.

[0022] The feed speed of the solder strip is the same as the feed speed of the fuse substrate;

[0023] Apply flux to the side of the solder strip facing the fuse substrate;

[0024] When the flux-coated solder strip and the fuse substrate are fed under the pressure roller, the pressure roller presses the flux-coated solder strip and the fuse substrate together;

[0025] The reflow oven fuses the flux-coated solder strip and the fuse substrate;

[0026] The winding device winds up the fused tin strip and the fuse-fused substrate.

[0027] The fuse tinning apparatus and method of this application presses the flux-coated solder strip and the fuse fusing substrate together with a pressure roller, and then the two are fused together in a reflow oven, which improves the yield of fuses. It can also flexibly adjust the temperature of each temperature zone according to the needs of quality, so that the yield of fuses can reach more than 90%. The production speed of fuses is not less than 60 meters / hour, which greatly improves the production efficiency. It also has a wider range of selectable fuse fusing substrates, which is beneficial for material selection. Attached Figure Description

[0028] The accompanying drawings are provided to further illustrate the present application and form part of the specification. Together with the embodiments of the present application, they serve to explain the present application but do not constitute a limitation thereof. In the drawings:

[0029] Figure 1 This is a schematic diagram of the fuse tinning device according to an embodiment of this application;

[0030] Figure 2 This is a schematic diagram of the fuse tinning method according to an embodiment of this application.

[0031] Figure label:

[0032] 101-Fuse substrate placement rack; 102-Solder strip placement rack; 103-Solder strip position straightener; 104-Fluoride roller; 105-Fluoride pool; 106-Pressure roller; 107-Fuse substrate position straightener; 108-Fuse substrate; 109-Solder strip; 110-Reflow oven; 111-Fuse position straightener; 112-Rewinding device; 113-Fuse; 114-Cooling device. Detailed Implementation

[0033] Embodiments of this application will now be described in more detail with reference to the accompanying drawings. While some embodiments of this application are shown in the drawings, it should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of this application. It should be understood that the drawings and embodiments of this application are for illustrative purposes only and are not intended to limit the scope of protection of this application.

[0034] It should be understood that the steps described in the method embodiments of this application may be performed in different orders and / or in parallel. Furthermore, the method embodiments may include additional steps and / or omit the steps shown. The scope of this application is not limited in this respect.

[0035] The term "comprising" and its variations as used herein are open-ended inclusions, meaning "including but not limited to". The term "based on" means "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". Definitions of other terms will be given in the description below.

[0036] It should be noted that the terms "one" and "multiple" used in this application are illustrative rather than restrictive, and those skilled in the art should understand that, unless explicitly stated otherwise in the context, they should be understood as "one or more". "Multiple" should be understood as two or more.

[0037] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0038] This invention provides a fuse tinning device for tinning the fuse fusing substrate, comprising:

[0039] A fuse substrate holder for holding fuse substrate; a solder strip holder for holding solder strip; the solder strip holder is positioned above the fuse substrate holder; a flux tank for storing flux; a flux roller is located above the flux tank, and as the solder strip passes through the surface of the flux roller, the flux roller coats the side of the solder strip facing the fuse substrate with flux; a pressure roller is located behind the flux tank, and the pressure roller is used to press the flux-coated solder strip and the fuse substrate together; a reflow oven is located behind the pressure roller, and the reflow oven is used to fuse the solder strip and the fuse substrate by adjusting the temperature; a winding device is located behind the reflow oven, and the winding device is used to wind up the solder strip and the fuse substrate after they have fused together.

[0040] Example 1

[0041] Figure 1 This is a schematic diagram of the fuse tinning device according to an embodiment of the present invention. The following will refer to... Figure 1 The fuse tinning device according to an embodiment of the present invention will be described in detail.

[0042] In one exemplary embodiment, the fuse tinning device of the present invention is used for tinning the fuse melting substrate.

[0043] In an exemplary embodiment, the fuse tinning device of the present invention includes: a fuse fuse substrate placement rack 101, a solder strip placement rack 102, a flux pool 105, a flux roller 104, a pressure roller 106, a reflow oven 110, and a winding device 112.

[0044] In one exemplary embodiment, the fuse substrate holder 101 is used to hold the fuse substrate 108.

[0045] In one exemplary embodiment, the fuse fusing substrate 108 includes a copper strip or a silver strip.

[0046] In one exemplary embodiment, the width of the fuse fusing substrate 108 includes 8mm-65mm.

[0047] In one exemplary embodiment, a solder strip holder 102 is used to hold solder strip 109.

[0048] In one exemplary embodiment, the solder strip holder 102 is positioned above the fuse fuse substrate holder 101 (above includes vertical above and also includes oblique above).

[0049] In one exemplary embodiment, the width of the solder strip 109 includes 3mm-15mm.

[0050] In one exemplary embodiment, flux pool 105 is used to store flux (it can be understood that flux pool 105 is a box-shaped object used to store flux).

[0051] In one exemplary embodiment, a flux roller 104 is provided above the flux pool 105, and the flux roller 104 is in contact with the flux in the flux pool 105.

[0052] In one exemplary embodiment, as the solder ribbon 109 passes through the surface of the flux roller 104, the flux roller 104 applies flux to the solder ribbon 109 (i.e., applies flux to the side of the solder ribbon 109 facing the fuse-breaking substrate 108).

[0053] In one exemplary embodiment, a solder strip position corrector 103 is also provided between the solder strip placement rack 102 and the flux roller 104.

[0054] In one exemplary embodiment, the solder strip position corrector 103 is used to adjust the fit between the solder strip 109 and the flux roller 104 (i.e., the solder strip position corrector 103 is adjustable, and the solder strip 109 contacts the flux roller 104 after passing through the solder strip position corrector 103).

[0055] In one exemplary embodiment, solder strip 109 passes over flux roller 104.

[0056] In one exemplary embodiment, a fuse substrate position corrector 107 is provided between the fuse substrate placement frame 101 and the pressure roller 106.

[0057] In one exemplary embodiment, the fuse substrate position corrector 107 is used to adjust the levelness of the fuse substrate 108 (which can be understood as preventing the fuse substrate 108 from rolling up by the fuse substrate position corrector 107; and also ensuring that the fuse substrate 108 after passing through the fuse substrate position corrector 107 is on the same horizontal plane).

[0058] In one exemplary embodiment, the fuse fuse substrate position corrector 107 further includes controlling the fuse fuse substrate 108 to pass under the flux pool 105.

[0059] In one exemplary embodiment, a pressure roller 106 is also provided behind the flux pool 105.

[0060] In one exemplary embodiment, the pressure roller 106 presses the flux-coated solder strip 109 and the fuse substrate 108 together (after being pressed by the pressure roller 106, the solder strip 109 and the fuse substrate 108 are more closely bonded).

[0061] In one exemplary embodiment, the reflow oven 110 adjusts the temperature to fuse the solder strip 109 to the fuse substrate 108 (i.e., the solder strip 109 is fused to the fuse substrate 108 by heating the reflow oven 110).

[0062] In one exemplary embodiment, the reflow oven 110 also includes a temperature range that can be adjusted by the quality of the fused fuse.

[0063] In one exemplary embodiment, the reflow oven 110 includes multiple temperature zones (which can be understood as multiple heaters being arranged sequentially from the inlet end of the reflow oven 110, such as the first temperature zone, the second temperature zone... the eighth temperature zone, etc.).

[0064] In one exemplary embodiment, starting from the entrance of the reflow oven 110, the bonded solder strip 109 and the fuse-breaking substrate 108 are heated in stages from the first temperature zone to the third-to-last temperature zone.

[0065] In one exemplary embodiment, the reflow oven 110 includes multiple temperature zones, starting from the inlet end of the reflow oven 110 and from the third to the last temperature zone to the last one, to heat the bonded solder strip 109 and the fuse-breaking substrate 108 in a progressively decreasing temperature manner.

[0066] In one exemplary embodiment, for example, starting from the inlet end of the reflow oven 110, the temperature of the first temperature zone is 160℃-200℃, the temperature of the second temperature zone is 190℃-220℃, the temperature of the third temperature zone is 220℃-240℃, the temperature of the fourth temperature zone is 260℃-280℃, the temperature of the fifth temperature zone is 280℃-300℃, the temperature of the sixth temperature zone is 300℃-320℃, the temperature of the seventh temperature zone is 250℃-270℃, and the temperature of the eighth temperature zone is 200℃-220℃.

[0067] In one exemplary embodiment, the temperatures of the first to eighth temperature zones further include: 175°C, 195°C, 235°C, 265°C, 295°C, 315°C, 255°C, and 215°C.

[0068] In one exemplary embodiment, the temperatures of the first to eighth temperature zones further include: 180°C, 215°C, 235°C, 275°C, 290°C, 310°C, 260°C, and 210°C.

[0069] In one exemplary embodiment, a fuse position corrector 111 is also included between the reflow oven 110 and the winding device 112.

[0070] In one exemplary embodiment, a fuse position corrector 111 is used to adjust the position of the fuse 113 exiting the reflow oven 110.

[0071] In one exemplary embodiment, the fuse position corrector 111 includes a plurality of rollers.

[0072] In one exemplary embodiment, a winding device 112 is also included behind the reflow oven 110.

[0073] In one exemplary embodiment, the winding device 112 winds up the solder strip 109 after it has fused with the fuse-breaking substrate 108.

[0074] In one exemplary embodiment, a cooling device 114 is also provided between the reflow oven 110 and the fuse position corrector 111.

[0075] In one exemplary embodiment, the cooling device 114 is used to cool the fuse 113 coming out of the reflow oven 110.

[0076] In one exemplary embodiment, the cooling device 114 employs air-cooling as a cooling method.

[0077] In an exemplary embodiment, when the fuse tinning device of the present invention starts working, the reflow oven 110 needs to be heated to a preset working temperature (each temperature zone reaches the preset temperature), and the feeding speed of the fuse melting substrate 108 and the tin strip 109 is uniform.

[0078] In one exemplary embodiment, the feed speed of the fuse fusing substrate 108 is consistent with that of the solder strip 109.

[0079] In one exemplary embodiment, the feed rate of the fuse substrate 108 and the solder strip 109 includes 60 meters per hour.

[0080] In one exemplary embodiment, the winding speed of fuse 113 includes 60 meters per hour.

[0081] Example 2

[0082] Figure 2 This is a schematic flowchart of the fuse soldering method according to an embodiment of this application. The following will refer to... Figure 2 The method for tinning fuses described in this application is described in detail.

[0083] The fuse tinning method of this invention uses the above-mentioned fuse tinning device.

[0084] First, in step 201, the reflow oven is started for preheating.

[0085] In one exemplary embodiment, the reflow oven is started for preheating.

[0086] In one exemplary embodiment, the reflow oven includes multiple temperature zones (which can be understood as multiple heaters being arranged sequentially from the inlet end of the reflow oven 110, such as the first temperature zone, the second temperature zone... the eighth temperature zone, etc.).

[0087] In one exemplary embodiment, the temperature settings of multiple temperature zones within the reflow oven include: gradually increasing the heating temperature from the first temperature zone to the third-to-last temperature zone starting from the inlet end of the reflow oven 110; and gradually decreasing the heating temperature from the third-to-last temperature zone to the end of the last temperature zone starting from the inlet end of the reflow oven.

[0088] In one exemplary embodiment, for example, starting from the inlet end of the reflow oven 110, the temperature of the first temperature zone is 160℃-200℃, the temperature of the second temperature zone is 190℃-220℃, the temperature of the third temperature zone is 220℃-240℃, the temperature of the fourth temperature zone is 260℃-280℃, the temperature of the fifth temperature zone is 280℃-300℃, the temperature of the sixth temperature zone is 300℃-320℃, the temperature of the seventh temperature zone is 250℃-270℃, and the temperature of the eighth temperature zone is 200℃-220℃.

[0089] In one exemplary embodiment, the temperatures of the first to eighth temperature zones further include: 175°C, 195°C, 235°C, 265°C, 295°C, 315°C, 255°C, and 215°C.

[0090] In one exemplary embodiment, the temperatures of the first to eighth temperature zones further include: 180°C, 215°C, 235°C, 275°C, 290°C, 310°C, 260°C, and 210°C.

[0091] In step 202, when all temperature zones in the reflow oven reach the preset temperature threshold, the feeding of the solder strip and the fuse-fused substrate is started, and the feeding speed of the solder strip is the same as the feeding speed of the fuse-fused substrate.

[0092] In one exemplary embodiment, when the temperature of each temperature zone in the reflow oven reaches a preset temperature threshold, the solder strip and fuse-fused substrate are fed (i.e., the solder strip and fuse-fused substrate are output).

[0093] In one exemplary embodiment, the feed speed of the solder strip is the same as the feed speed of the fuse melting substrate (i.e., the two are at the same speed and kept synchronized).

[0094] In one exemplary embodiment, the feed speed of the solder strip and the feed speed of the fuse melting substrate include 60 meters per hour.

[0095] In step 203, flux is applied to the side of the solder strip facing the fuse melting substrate.

[0096] In one exemplary embodiment, as the solder strip passes through the surface of the flux roller, the flux roller coats the side of the solder strip facing the fuse-breaking substrate with flux.

[0097] In step 204, when the flux-coated solder strip and the fuse-breaking substrate are fed under the pressure roller, the pressure roller presses the flux-coated solder strip and the fuse-breaking substrate together.

[0098] In one exemplary embodiment, the solder strip continues to be fed at a constant speed after being coated with flux. When the solder strip and the fuse substrate are fed simultaneously to the bottom of the pressure roller, the pressure roller presses the flux-coated solder strip and the fuse substrate together.

[0099] In one exemplary embodiment, after being pressed by the pressure roller, the solder strip adheres more tightly to the fuse fusing substrate, thereby improving the yield of the fuse.

[0100] In step 205, the reflow oven fuses the flux-coated solder strip and the fuse substrate together.

[0101] In one exemplary embodiment, the solder strip is fused to the fuse fuse substrate by heating in a reflow oven.

[0102] In one exemplary embodiment, the reflow oven can also adjust the temperature of each temperature zone to fuse the solder strip with the fuse-breaking substrate, as needed.

[0103] In one exemplary embodiment, the reflow oven temperature is adjusted based on the quality of the fuse (e.g., yield rate, fusion of solder strip with fuse substrate). Temperature adjustment includes adjusting the temperature of one or more temperatures; it also includes raising or lowering the temperature of a temperature zone.

[0104] In step 206, the winding device winds up the fused tin strip and the fuse-fused substrate.

[0105] In one exemplary embodiment, the fused solder strip and the fuse fuse substrate are wound up (i.e., the fuse is wound up).

[0106] In one exemplary embodiment, the winding speed includes 60 meters per hour.

[0107] In one exemplary embodiment, a cooling step is also included before winding.

[0108] In one exemplary embodiment, the cooling step includes cooling the fuse exiting the reflow oven.

[0109] In one exemplary embodiment, the cooling method includes air cooling.

[0110] While the embodiments disclosed in this invention are as described above, they are merely illustrative of the embodiments to facilitate understanding of the invention and are not intended to limit the invention. Any person skilled in the art to which this invention pertains may make any modifications and variations in the form and details of the implementation without departing from the spirit and scope disclosed herein; however, the scope of patent protection for this invention shall still be determined by the scope defined in the appended claims.

Claims

1. A fuse tinning apparatus for tinning a fuse-blown substrate of a fuse, characterized by, The application relates to a fuse link substrate placing rack for placing a fuse link substrate. The application also relates to a tin strip placing rack for placing a tin strip; the tin strip placing rack is arranged above the fuse link substrate placing rack; a flux pool for storing flux; a flux roller is further arranged above the flux pool; when the tin strip passes through the surface of the flux roller, the flux roller applies flux to the surface of the tin strip which faces the fuse link substrate; a pressing roller is further arranged behind the flux pool; the pressing roller is used for pressing the tin strip and the fuse link substrate after the tin strip is applied with flux; a reflow oven is further arranged behind the pressing roller; the reflow oven is used for fusing the tin strip and the fuse link substrate by adjusting temperature; a winding device is further arranged behind the reflow oven; the winding device is used for winding the tin strip and the fuse link substrate after the tin strip and the fuse link substrate are fused. The width of the fuse link substrate comprises 8mm-65mm. The width of the tin strip comprises 3mm-15mm. The application further relates to a tin strip position corrector for adjusting the adhesion of the tin strip and the flux roller.

2. The fuse tinning device of claim 1, wherein The tin strip position corrector is arranged between the tin strip placing rack and the flux roller. The application further relates to a fuse link substrate position corrector for adjusting the levelness of the fuse link substrate. The fuse link substrate position corrector is arranged between the fuse link substrate placing rack and the pressing roller.

3. The fuse tinning device of claim 1, wherein The fuse link substrate position corrector further comprises controlling the fuse link substrate to pass through below the flux pool. The reflow oven comprises multiple temperature zones; from the entrance end of the reflow oven, the first temperature zone to the third last temperature zone are used for heating the tin strip and the fuse link substrate after adhesion by gradually increasing temperature. The reflow oven comprises multiple temperature zones; from the entrance end of the reflow oven, from the third last temperature zone to the first last temperature zone are used for heating the tin strip and the fuse link substrate after adhesion by gradually decreasing temperature.

4. The fuse tinning device of claim 3, wherein The temperature of the first temperature zone comprises 160-200 DEG C; the temperature of the third last temperature zone comprises 300-320 DEG C; the temperature of the second last temperature zone comprises 250-270 DEG C; and the temperature of the first last temperature zone comprises 200-220 DEG C.

5. The fuse tinning device of claim 4, wherein The application further relates to a fuse position corrector comprising multiple rollers for adjusting the position of the fuse after the fuse comes out of the reflow oven.

6. The fuse tinning device of claim 5, wherein The fuse position corrector is arranged between the reflow oven and the winding device.

7. The fuse tinning device of claim 6, wherein The application further relates to a cooling device arranged between the reflow oven and the fuse position corrector; the cooling device is used for cooling the fuse after the fuse comes out of the reflow oven.

8. The fuse tinning device of claim 7, wherein, The application comprises the following steps: Starting the reflow oven to preheat; When the temperature of each temperature zone in the reflow oven reaches a preset temperature threshold, starting the feeding of the tin strip and the fuse link substrate; 9. The fuse tinning device of claim 8, wherein, The feeding speed of the tin strip is consistent with the feeding speed of the fuse link substrate; Applying flux to the surface of the tin strip which faces the fuse link substrate; 10. A method for tinning a fuse, using the fuse tinning apparatus according to any one of claims 1 to 9, characterized by, ​ ​ ​ ​ ​ When the solder flux coated tin ribbon and the fuse melting substrate are fed under the press wheel, the press wheel is used to press the solder flux coated tin ribbon and the fuse melting substrate; The reflow oven is used to fuse the solder flux coated tin ribbon and the fuse melting substrate; The winding device is used to wind the fused tin ribbon and the fuse melting substrate.

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