A FLASH chip detection device and detection method

Abstract

This invention relates to the field of chip testing, specifically to a FLASH chip testing device and method. It includes a chassis, a chip unloading mechanism, a wafer feeding mechanism, a high-temperature testing mechanism, and a drive mechanism. The chassis has an infeed channel at the top and an outfeed channel at the bottom. The chip unloading mechanism includes a ring-shaped feed strip, multiple wafer holders evenly distributed on the outer circumference of the feed strip, and a rotating roller mechanism for spreading the feed strip and rotating it so that the wafer holders carry the FLASH chips from top to bottom through the infeed channel. The starting end of the wafer feeding mechanism is connected to the bottom end of the chip unloading mechanism, and its ending end is located outside the outfeed channel of the chassis. The high-temperature testing mechanism includes a testing chamber, a heater, a support bracket, and a sealing assembly. The testing chamber has an infeed port and an outfeed port at both ends along the feeding direction of the wafer feeding mechanism. The heater is located inside the testing chamber, and two sets of sealing assemblies are provided. This invention can accurately deliver FLASH chips so that they accurately enter the testing chamber for heating.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and in particular to a FLASH chip testing device and testing method. Background Technology

[0002] A FLASH chip is a type of memory chip that allows data to be modified using a specific program. In the electronics and semiconductor fields, FLASH often stands for Flash Memory.

[0003] Chinese Patent Publication No. CN113539348A discloses a FLASH chip testing device, including a base. A support frame is fixedly connected to the top of the base, and gears are movably sleeved at both ends of the support frame. A fixed disk is fixedly connected to the front of the gears, and a track groove is opened on the front of the fixed disk. A conveyor belt is movably sleeved on the outside of the gears at both ends, and toothed blocks are equidistantly distributed on the inner wall of the conveyor belt. The conveyor belt is connected to the gears through the meshing of the toothed blocks. By setting up a motor, a third support rod, a movable stud, a second support rod, a first support rod, gears, and a fixed disk, the two support rods rotate in the track groove in the fixed disk, thereby causing the gears to intermittently drive the toothed blocks and the conveyor belt to operate. This achieves the purpose of intermittent transmission of the conveyor belt with pauses, providing testing time for subsequent chip conveying and testing, and improving work efficiency.

[0004] However, the technical solutions described in the aforementioned patents have the following shortcomings:

[0005] The short handle of the L-shaped rod pushes the load-bearing block, which falls under gravity in the feed box, to slide out on the guide rail frame and be guided by the guide plate to the conveyor belt. During the process of being guided by the guide plate to the conveyor belt, the load-bearing block may bump and shake, resulting in inaccurate position of the load-bearing block after conveying, and it may not be able to accurately enter the detection hood. Summary of the Invention

[0006] The purpose of this invention is to address the problems existing in the background art by proposing a FLASH chip testing device and method that can accurately deliver FLASH chips so that they can be accurately placed into a testing chamber for heating.

[0007] On the one hand, the present invention proposes a FLASH chip testing device, including a chassis, a chip unloading mechanism, a wafer feeding mechanism, a high temperature testing mechanism, and a driving mechanism;

[0008] The top of the chassis has a film inlet channel, and the bottom of the chassis has a film outlet channel.

[0009] The chip feeding mechanism includes a ring-shaped material strip, multiple material racks evenly distributed on the outer circumference of the material strip, and a rotating roller mechanism for spreading the material strip and driving it to rotate so that the material racks can drive the FLASH chip through the feeding channel from top to bottom.

[0010] The starting end of the wafer feeding mechanism is connected to the bottom end of the chip unloading mechanism, and its ending end is located outside the wafer exit channel of the chassis.

[0011] The high-temperature testing mechanism includes a testing box, a heater, a support d, and a sealing assembly. The testing box is mounted on the support d, which is mounted on the chassis. The testing box has a wafer inlet and a wafer outlet at both ends along the conveying direction of the wafer feeding mechanism. The heater is located inside the testing box. There are two sets of sealing assemblies, which are located at the wafer inlet and the wafer outlet, respectively.

[0012] The drive mechanism is used to drive the rotating roller mechanism, the feeding mechanism and the sealing component to move intermittently, so as to intermittently transport the FLASH chips on the material rack to the feeding mechanism and then to the detection box, and then seal the inlet and outlet for high-temperature heating.

[0013] Preferably, the rotating roller mechanism includes a rotating roller assembly and a support a. Two sets of rotating roller assemblies are arranged side by side in the vertical direction. The rotating roller assembly includes a rotating roller a and a rotating shaft a. The material belt is sleeved on the two rotating rollers a. The rotating roller a is set on the rotating shaft a. The lower rotating shaft a is rotatably set on the machine housing. The upper rotating shaft a is rotatably set on the support a. The support a is set on the top of the machine housing.

[0014] Preferably, the film feeding mechanism includes a conveyor belt, a drive roller assembly, a bracket b, and a bracket c. Two sets of drive roller assemblies are arranged side by side in the horizontal direction. The drive roller assembly includes a rotating roller b and a rotating shaft b. The conveyor belt is sleeved on the two rotating rollers b and passes through the film output channel. The rotating roller b is set on the rotating shaft b. The two rotating shafts b are respectively rotatably set on the bracket b and the bracket c.

[0015] Preferably, the sealing assembly includes a baffle, a pulley e, a belt c, a pulley f, a rotating shaft d, a connecting rod a, a connecting rod b, a connecting platform, a guide rod, and a fixing plate. The guide rod is vertically mounted on the top of the baffle and slidably mounted on the fixing plate. The fixing plate is mounted on the detection box. The pulley e is connected to the pulley f via the belt c. The pulley f is mounted on the rotating shaft d, which is rotatably mounted on the detection box. One end of the connecting rod a is connected to the rotating shaft d, and the other end of the connecting rod a is rotatably connected to the connecting rod b. The end of the connecting rod b away from the connecting rod a is rotatably connected to the connecting platform, which is mounted on the baffle.

[0016] Preferably, the drive mechanism includes a motor, a driving gear, driven gear a, driven gear b, a rotating shaft c, pulley a, belt a, pulley b, pulley c, belt b, pulley d, a transmission shaft, bevel gear a, bevel gear b, and a rotating rod. The motor is mounted on the housing and is driven by the driving gear. The driving gear meshes with driven gear a and driven gear b respectively. Driven gear a is mounted on the lower rotating shaft a. Driven gear b, pulley a, and pulley c are coaxially mounted on the rotating shaft c. The rotating shaft c is rotatably mounted on the housing. Pulley a is driven by pulley b via belt a. Pulley b is mounted on the rotating shaft b. Pulley c is driven by pulley d via belt b. Pulley d and bevel gear a are coaxially mounted on the transmission shaft. Bevel gear a meshes with bevel gear b. Bevel gear b is mounted on the rotating rod. The rotating rod is rotatably mounted on the detection box. Pulley e is mounted on the rotating rod.

[0017] Preferably, the chassis is equipped with a mounting cover, and the driving gear, driven gear a, driven gear b, pulley c, belt b, pulley d, drive shaft, bevel gear a and bevel gear b are all located inside the mounting cover.

[0018] Preferably, the material rack has a U-shaped structure, with the U-shaped opening located on the side of the material rack away from the material belt, and the edge of the material rack has a limiting step.

[0019] On the other hand, the present invention proposes a detection method for the above-mentioned FLASH chip detection device, the method comprising the following steps:

[0020] S1. Place the FLASH chips to be tested sequentially onto multiple racks on the conveyor belt;

[0021] S2. Start the drive mechanism. The drive mechanism drives the rotating roller mechanism, the feeding mechanism and the sealing component to move intermittently to intermittently transport the FLASH chips on the material rack to the feeding mechanism, then to the detection box, and then seal the inlet and outlet.

[0022] S3. Start the heater to heat the FLASH chip inside the test chamber;

[0023] S4. The drive mechanism continues to operate, unblocking the inlet and outlet of the wafer, and removing the heated FLASH chip from the testing box and conveying it out through the outlet channel;

[0024] S5. Detect the performance of the output FLASH chip;

[0025] S6. Repeat steps S2-S5 to intermittently batch test the performance of FLASH chips.

[0026] Compared with the prior art, the present invention has the following beneficial technical effects:

[0027] This invention accurately delivers FLASH chips into the testing chamber for heating. Multiple FLASH chips added to the rack are staggered. During a predetermined time run, the drive mechanism operates, causing the rotating roller mechanism to rotate, which in turn moves the rack, conveying the FLASH chips downwards. The chips on the rack are then transported away by the wafer feeding mechanism, which rotates the rack away from the outside of the feeding mechanism. Two sets of sealing components simultaneously move upwards from the inlet and outlet. The chip is then conveyed through the inlet by the wafer feeding mechanism into the testing chamber. The heater is then activated to heat the chip. After heating is complete, the drive mechanism runs again for a predetermined time, conveying the heated chip out while simultaneously feeding new chips into the testing chamber for heating. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention;

[0029] Figure 2 This is a partial structural cross-sectional view of an embodiment of the present invention;

[0030] Figure 3 This is a partial structural diagram of an embodiment of the present invention;

[0031] Figure 4 for Figure 3 Enlarged view of the structure at point A in the middle;

[0032] Figure 5 This is a distribution diagram of the material rack on the material belt in an embodiment of the present invention.

[0033] Reference numerals: 1. Material belt; 2. Rotating roller a; 3. Rotating shaft a; 4. Support a; 5. Material rack; 6. Conveyor belt; 7. Rotating roller b; 8. Rotating shaft b; 9. Support b; 10. Support c; 11. Detection box; 111. Inlet; 112. Outlet; 12. Heater; 13. Baffle; 14. Mounting cover; 15. Motor; 16. Driven gear; 17. Driven gear a; 18. Driven gear b; 19. Rotating Shaft c; 20. Pulley a; 21. Belt a; 22. Pulley b; 23. Pulley c; 24. Belt b; 25. Pulley d; 26. Rotating rod; 27. Pulley e; 28. Belt c; 29. ​​Pulley f; 30. Rotating shaft d; 31. Connecting rod a; 32. Connecting rod b; 33. Connecting platform; 34. Guide rod; 35. Fixing plate; 36. Chassis; 361. Film inlet channel; 362. Film outlet channel; 37. Support d. Detailed Implementation

[0034] Example 1

[0035] like Figures 1-5As shown, the present invention proposes a FLASH chip testing device, which includes a chassis 36, a chip unloading mechanism, a chip feeding mechanism, a high-temperature testing mechanism, and a driving mechanism.

[0036] The top of the chassis 36 has a film inlet channel 361, and the bottom of the chassis 36 has a film outlet channel 362.

[0037] The chip feeding mechanism includes an annular strip 1, multiple feed racks 5 evenly distributed on the outer circumference of the strip 1, and a rotating roller mechanism for spreading the strip 1 and rotating the strip 1 so that the feed racks 5 can carry the FLASH chip from top to bottom through the feeding channel 361; the feed rack 5 has a U-shaped structure, and its U-shaped opening is located on the side of the feed rack 5 away from the strip 1, and the edge of the feed rack 5 has a limiting step.

[0038] The starting end of the wafer feeding mechanism is connected to the bottom end of the chip unloading mechanism, and its ending end is located outside the wafer exit channel 362 of the chassis 36.

[0039] The high-temperature testing mechanism includes a testing box 11, a heater 12, a bracket d37, and a sealing assembly. The testing box 11 is mounted on the bracket d37, which is mounted on the chassis 36. The testing box 11 has a wafer inlet 111 and a wafer outlet 112 at both ends along the conveying direction of the wafer feeding mechanism. The heater 12 is located inside the testing box 11. There are two sets of sealing assemblies, which are located at the wafer inlet 111 and the wafer outlet 112, respectively.

[0040] The drive mechanism is used to drive the rotating roller mechanism, the feeding mechanism and the sealing assembly to move intermittently so that the FLASH chips on the material rack 5 are first transported to the feeding mechanism and then to the detection box 11. Then the inlet 111 and outlet 112 are sealed for high-temperature heating.

[0041] The testing method of the above-mentioned FLASH chip testing equipment includes the following steps:

[0042] S1. Place the FLASH chips to be tested sequentially onto the multiple racks 5 on the strip 1;

[0043] S2. Start the drive mechanism. The drive mechanism drives the rotating roller mechanism, the feeding mechanism and the sealing components to move intermittently to intermittently transport the FLASH chips on the material rack 5 to the feeding mechanism, then to the detection box 11, and then seal the inlet 111 and outlet 112. The drive mechanism runs for the same amount of time each time. Within the time range of each run, it will transport one chip on the material rack 5 to the feeding mechanism and remove the two sets of sealing components from the inlet 111 and outlet 112. Then the chip is transported to the detection box 11 through the feeding mechanism, and the two sets of sealing components are used to seal the inlet 111 and outlet 112.

[0044] S3. Start heater 12 to heat the FLASH chip in the detection box 11, so that the heat can be fully applied to the FLASH chip;

[0045] S4. The drive mechanism continues to operate, unblocking the inlet 111 and outlet 112, and removing the heated FLASH chip from the detection box 11 and conveying it out through the outlet channel 362.

[0046] S5. Detect the performance of the output FLASH chip. Existing testing devices capable of detecting FLASH chips can be used for performance testing.

[0047] S6. Repeat steps S2-S5 to intermittently batch test the performance of FLASH chips.

[0048] This embodiment accurately delivers FLASH chips into the testing chamber 11 for heating by the heater 12. Multiple FLASH chips added to the feed rack 5 are staggered. During each predetermined run of the drive mechanism, the rotating roller mechanism operates, driving the conveyor belt 1 to rotate. The conveyor belt 1 then moves the feed rack 5, conveying the FLASH chips downwards. The chips on the feed rack 5 are then transported away by the wafer feeding mechanism, and the feed rack 5 rotates away from the outside of the wafer feeding mechanism. Two sets of sealing components simultaneously move upwards from the inlet 111 and outlet 112. The chip is conveyed by the wafer feeding mechanism through the inlet 111 into the testing chamber 11. The heater 12 is then activated to heat the chip. After heating is complete, the drive mechanism runs again for a predetermined time, conveying the heated chip out and simultaneously inputting new chips into the testing chamber 11 for heating. For the heated chips, existing chip performance testing equipment is used to test their performance under high-temperature conditions.

[0049] Example 2

[0050] like Figures 1-5 As shown, the FLASH chip testing device proposed in this invention, compared with Embodiment 1, includes a rotating roller mechanism comprising a rotating roller assembly and a support a4. Two sets of rotating roller assemblies are arranged side-by-side in the vertical direction. Each rotating roller assembly includes a rotating roller a2 and a rotating shaft a3. The material strip 1 is sleeved on the two rotating rollers a2, and the rotating rollers a2 are mounted on the rotating shaft a3. The lower rotating shaft a3 is rotatably mounted on the housing 36, and the upper rotating shaft a3 is rotatably mounted on the support a4. The support a4 is located at the top of the housing 36. The rotating rollers a2 can spread the material strip 1, and then drive the material strip 1 to rotate during rotation, thereby using the material strip 1 to drive multiple material racks 5 to rotate for intermittent feeding.

[0051] The wafer feeding mechanism includes a conveyor belt 6, a drive roller assembly, a bracket b9, and a bracket c10. Two sets of drive roller assemblies are arranged side-by-side in a horizontal direction. Each drive roller assembly includes a rotating roller b7 and a rotating shaft b8. The conveyor belt 6 is fitted onto the two rotating rollers b7 and passes through the wafer exit channel 362. The rotating rollers b7 are mounted on the rotating shafts b8, and the two rotating shafts b8 are rotatably mounted on the brackets b9 and c10, respectively. The drive roller assembly drives the conveyor belt 6 to rotate, thereby utilizing the conveyor belt 6 to connect and transport the wafers.

[0052] The sealing assembly includes a baffle 13, a pulley e27, a belt c28, a pulley f29, a rotating shaft d30, a connecting rod a31, a connecting rod b32, a connecting platform 33, a guide rod 34, and a fixing plate 35. The guide rod 34 is vertically mounted on the top of the baffle 13 and slidably mounted on the fixing plate 35, which is mounted on the detection box 11. The pulley e27 is connected to the pulley f29 via the belt c28. The pulley f29 is mounted on the rotating shaft d30, which is rotatably mounted on the detection box 11. One end of the connecting rod a31 is connected to the rotating shaft d30, and the other end is rotatably connected to the connecting rod b32. The end of the connecting rod b32 away from the connecting rod a31 is rotatably connected to the connecting platform 33, which is mounted on the baffle 13. The two sealing assemblies can simultaneously seal the inlet 111 and the outlet 112, and can simultaneously release the seal. The sealing can be achieved by rotating pulley e27. Pulley e27 drives pulley f29 to rotate via belt c28. Pulley f29 drives rotating shaft d30 to rotate. Rotating shaft d30 drives connecting rod a31 to rotate. Connecting rod a31 drives connecting rod b32 to swing. Connecting rod b32 drives baffle 13 to rise and fall via connecting platform 33. Guide rod 34 is used to guide baffle 13.

[0053] The drive mechanism includes a motor 15, a driving gear 16, a driven gear a17, a driven gear b18, a rotating shaft c19, a pulley a20, a belt a21, a pulley b22, a pulley c23, a belt b24, a pulley d25, a transmission shaft, bevel gear a, bevel gear b, and a rotating rod 26. The motor 15 is mounted on a housing 36 and is driven by the driving gear 16. The driving gear 16 meshes with the driven gears a17 and b18 respectively. The driven gear a17 is mounted on the lower rotating shaft a3. 8. Pulleys A20 and C23 are coaxially mounted on rotating shaft C19, which is rotatably mounted on housing 36. Pulley A20 is connected to pulley B22 via belt A21. Pulley B22 is mounted on rotating shaft B8. Pulley C23 is connected to pulley D25 via belt B24. Pulley D25 and bevel gear A are coaxially mounted on transmission shaft. Bevel gear A meshes with bevel gear B, which is mounted on rotating rod 26. Rotating rod 26 is rotatably mounted on detection box 11. Pulley E27 is mounted on rotating rod 26. Motor 15 drives drive gear 16 to rotate, which in turn drives driven gears A17 and B18 to rotate simultaneously. Driven gear A17 drives rotating shaft A3 to operate the rotating roller mechanism, thereby performing the downward conveying process of the chip. Driven gear b18 drives rotating shaft b8 to rotate via rotating shaft c19, pulley a20, belt a21, and pulley b22, thereby realizing the operation of the wafer feeding mechanism to horizontally transport chips via conveyor belt 6. Rotating shaft c19 can also drive rotating rod 26 to rotate via pulley c23, belt b24, pulley d25, drive shaft, bevel gear a, and bevel gear b. Rotating rod 26 drives pulley e27 to rotate, realizing the lifting and lowering of the two baffles 13. This embodiment uses only one motor 15 to realize intermittent feeding, material feeding, and sealing of the detection box 11, which facilitates effective high-temperature heating of chips, reduces heat loss, has a compact structure, occupies little space, and is energy-saving and environmentally friendly.

[0054] The chassis 36 is equipped with a mounting cover 14. The drive gear 16, driven gear a17, driven gear b18, pulley c23, belt b24, pulley d25, drive shaft, bevel gear a and bevel gear b are all located inside the mounting cover 14. Thus, each structure can be effectively shielded and protected by the mounting cover 14, ensuring the cleanliness of the internal structure.

[0055] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited thereto. Various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention.

Claims

1. A FLASH chip testing device, characterized in that, include: The chassis (36) has a film inlet channel (361) at the top and a film outlet channel (362) at the bottom; The chip feeding mechanism includes an annular strip (1), multiple feed racks (5) evenly distributed on the outer periphery of the strip (1), and a rotating roller mechanism for spreading the strip (1) and driving the strip (1) to rotate so that the feed racks (5) drive the FLASH chip through the feeding channel (361) from top to bottom. The wafer feeding mechanism has its starting end connected to the bottom end of the chip unloading mechanism, and its ending end located outside the wafer exit channel (362) of the chassis (36). The high-temperature testing mechanism includes a testing box (11), a heater (12), a bracket d (37), and a sealing assembly. The testing box (11) is mounted on the bracket d (37), and the bracket d (37) is mounted on the chassis (36). The testing box (11) has a wafer inlet (111) and a wafer outlet (112) at both ends along the conveying direction of the wafer feeding mechanism. The heater (12) is mounted inside the testing box (11). There are two sets of sealing assemblies, which are located at the wafer inlet (111) and the wafer outlet (112), respectively. And a drive mechanism for intermittently moving the rotating roller mechanism, the feeding mechanism and the sealing assembly to intermittently transport the FLASH chips on the rack (5) to the feeding mechanism and then to the detection box (11), and then seal the inlet (111) and outlet (112) for high-temperature heating.

2. The FLASH chip testing device according to claim 1, characterized in that, The rotating roller mechanism includes a rotating roller assembly and a support a (4). Two sets of rotating roller assemblies are arranged side by side in the vertical direction. The rotating roller assembly includes a rotating roller a (2) and a rotating shaft a (3). The material belt (1) is sleeved on the two rotating rollers a (2). The rotating rollers a (2) are set on the rotating shaft a (3). The rotating shaft a (3) located at the lower part is rotatably set on the machine box (36). The rotating shaft a (3) located at the upper part is rotatably set on the support a (4). The support a (4) is set on the top of the machine box (36).

3. The FLASH chip testing device according to claim 2, characterized in that, The film feeding mechanism includes a conveyor belt (6), a drive roller assembly, a bracket b (9) and a bracket c (10). Two sets of drive roller assemblies are arranged side by side in the horizontal direction. The drive roller assembly includes a rotating roller b (7) and a rotating shaft b (8). The conveyor belt (6) is sleeved on the two rotating rollers b (7). The conveyor belt (6) passes through the film output channel (362). The rotating roller b (7) is set on the rotating shaft b (8). The two rotating shafts b (8) are respectively rotatably set on the bracket b (9) and the bracket c (10).

4. The FLASH chip testing device according to claim 3, characterized in that, The sealing assembly includes a baffle (13), pulley e (27), belt c (28), pulley f (29), rotating shaft d (30), connecting rod a (31), connecting rod b (32), connecting platform (33), guide rod (34), and fixing plate (35). The guide rod (34) is vertically mounted on the top of the baffle (13) and slidably mounted on the fixing plate (35). The fixing plate (35) is mounted on the detection box (11). The pulley e (27) passes through... The belt c (28) is connected to the pulley f (29), the pulley f (29) is set on the rotating shaft d (30), the rotating shaft d (30) is rotatably set on the detection box (11), one end of the connecting rod a (31) is connected to the rotating shaft d (30), the other end of the connecting rod a (31) is rotatably connected to the connecting rod b (32), the end of the connecting rod b (32) away from the connecting rod a (31) is rotatably connected to the connecting platform (33), the connecting platform (33) is set on the baffle (13).

5. The FLASH chip testing device according to claim 4, characterized in that, The drive mechanism includes a motor (15), a driving gear (16), a driven gear a (17), a driven gear b (18), a rotating shaft c (19), a pulley a (20), a belt a (21), a pulley b (22), a pulley c (23), a belt b (24), a pulley d (25), a transmission shaft, bevel gear a, bevel gear b, and a rotating rod (26). The motor (15) is mounted on the housing (36). The motor (15) is driven by the driving gear (16). The driving gear (16) is meshed with the driven gear a (17) and the driven gear b (18) respectively. The driven gear a (17) is mounted on the rotating shaft a (3) located at the bottom. The driven gear b... (18) Pulley a (20) and pulley c (23) are coaxially mounted on rotating shaft c (19), rotating shaft c (19) is rotatably mounted on housing (36), pulley a (20) is connected to pulley b (22) via belt a (21), pulley b (22) is mounted on rotating shaft b (8), pulley c (23) is connected to pulley d (25) via belt b (24), pulley d (25) and bevel gear a are coaxially mounted on transmission shaft, bevel gear a is meshed with bevel gear b, bevel gear b is mounted on rotating rod (26), rotating rod (26) is rotatably mounted on detection box (11); pulley e (27) is mounted on rotating rod (26).

6. The FLASH chip testing device according to claim 5, characterized in that, The chassis (36) is equipped with a mounting cover (14), and the drive gear (16), driven gear a (17), driven gear b (18), pulley c (23), belt b (24), pulley d (25), drive shaft, bevel gear a and bevel gear b are all located inside the mounting cover (14).

7. The FLASH chip testing device according to claim 1, characterized in that, The material rack (5) has a U-shaped structure, with its U-shaped opening located on the side of the material rack (5) away from the material belt (1), and the edge of the material rack (5) has a limiting step.

8. A detection method for a FLASH chip detection device according to claim 1, characterized in that, Includes the following steps: S1. Place the FLASH chips to be tested sequentially onto multiple racks (5) on the strip (1); S2. Start the drive mechanism. The drive mechanism drives the rotating roller mechanism, the feeding mechanism and the sealing component to move intermittently so that the FLASH chips on the material rack (5) are first transported to the feeding mechanism, then transported to the detection box (11), and then the inlet (111) and outlet (112) are sealed. S3. Start the heater (12) to heat the FLASH chip inside the detection box (11); S4. The drive mechanism continues to run, unblocking the inlet (111) and outlet (112), and removes the heated FLASH chip from the test box (11) and sends it out through the outlet channel (362); S5. Detect the performance of the output FLASH chip; S6. Repeat steps S2-S5 to intermittently batch test the performance of FLASH chips.

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