Voice coil structure and speaker

Abstract

The present application provides a voice coil structure and a loudspeaker, wherein the voice coil structure includes a substrate, a first wire layer and a first insulating layer. The first wire layer is disposed on the substrate, the first wire layer is wound, and the first wire layer includes a first lead-out end and a second lead-out end; the first insulating layer is disposed on the first wire layer, the first insulating layer is provided with a through hole and a first notch, the first lead-out end is exposed to the first insulating layer through the through hole, and the second lead-out end is exposed to the first insulating layer through the first notch. The present application can reduce the volume occupied by the voice coil structure in the loudspeaker, which is conducive to the thinning and miniaturization of the loudspeaker.

Description

Technical Field

[0001] The present application relates to the technical field of voice coil structures, and in particular to a voice coil structure and a loudspeaker. Background Art

[0002] A speaker is a transducer element that converts electrical signals into acoustic signals. Speakers are important acoustic components in electronic devices (such as computers and mobile phones). Speakers mainly include a magnetic circuit system and a sound membrane structure. The sound membrane structure includes a diaphragm and a voice coil convexly arranged on the diaphragm. When the speaker makes a sound, the magnetic circuit system generates a magnetic field. When the external current changes, the voice coil moves with the magnitude and direction of the current, thereby generating sound. However, this voice coil structure occupies a large volume, which affects the development of thin speakers. Summary of the invention

[0003] In view of this, the present application provides a voice coil structure and a loudspeaker to solve the above problems.

[0004] The present application provides a voice coil structure, comprising a substrate, a first conductor layer and a first insulating layer. The first conductor layer is arranged on the substrate, the first conductor layer is wound, and the first conductor layer comprises a first lead-out end and a second lead-out end; the first insulating layer is arranged on the first conductor layer, the first insulating layer is provided with a through hole and a first notch, the first lead-out end is exposed to the first insulating layer through the through hole, and the second lead-out end is exposed to the first insulating layer through the first notch.

[0005] In some embodiments, the voice coil structure also includes a second wire layer and a second insulating layer, the second wire layer includes a third lead-out end and a fourth lead-out end, the second insulating layer is provided with a second notch and a third notch located at the edge of the second insulating layer, the second notch corresponds to the first notch, the second lead-out end is exposed to the second insulating layer through the first notch and the second notch, the third lead-out end is electrically connected to the first lead-out end through the through hole, and the fourth lead-out end is exposed to the second insulating layer through the third notch.

[0006] In some embodiments, the voice coil structure further includes a first pad and a second pad, the first pad and the second wire layer are located in the same layer, the first pad is electrically connected to the second lead-out end through a first notch, and the first pad is exposed to the second insulating layer through the second notch;

[0007] The second pad is located in the same layer as the first conductive line layer. The first insulating layer is further provided with a fourth notch. The second pad is electrically connected to the fourth lead-out end through the fourth notch.

[0008] In some embodiments, the first pad and the fourth lead-out end are exposed on the same side of the second insulating layer.

[0009] In some embodiments, the second conductor layer is coiled.

[0010] In some embodiments, the substrate has a thickness of 10 μm-500 μm, the first conductive line layer has a thickness of 0.1 μm-50 μm, and a line width of 1.0 μm-100 μm.

[0011] In some embodiments, the material of the first conductive line layer includes at least one of aluminum, copper, silver, or gold.

[0012] In some embodiments, the substrate includes at least one of glass, polydimethylsiloxane, and polyimide.

[0013] In some embodiments, the first conductive line layer includes alternating straight segments and bent segments, and the bent segments bulge outward in a direction away from the straight segments.

[0014] In some embodiments, the first conductor layer is formed by winding a conductor, the conductor has the first lead-out end as a starting end and the second lead-out end as an end, the second lead-out end is wound around the first lead-out end as a center to form the first conductor layer, and the first lead-out end and the second lead-out end are located in the same plane.

[0015] The present application also provides a loudspeaker, comprising a diaphragm and the voice coil structure, wherein a surface of the substrate facing away from the first conductor layer is arranged on the diaphragm.

[0016] In some embodiments, the speaker also includes a supporting frame, the diaphragm is arranged on the supporting frame, and the surface of the supporting frame is provided with a first conductive rubber segment and a second conductive rubber segment, the first conductive rubber segment is used to be electrically connected to the first lead-out end, and the second conductive rubber segment is used to be electrically connected to the second lead-out end.

[0017] In the present application, a voice coil structure is provided on a substrate, and the voice coil formed by surrounding an existing cylindrical coil is designed as a conductor layer, thereby reducing the volume occupied by the coil in the voice coil structure, and reducing the volume occupied by the voice coil structure in the loudspeaker, which is conducive to the thinning and miniaturization of the loudspeaker. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic structural diagram of a voice coil structure provided in one embodiment of the present application.

[0019] Figure 2 for Figure 1 An exploded view of a voice coil structure in one embodiment is shown.

[0020] Figure 3 Exploded views of voice coil structures in other embodiments.

[0021] Figure 4 for Figure 3 Schematic diagram of the structure of the first conductor layer in the voice coil structure shown.

[0022] Figure 5 Schematic diagram of the structure of the first conductor layer in some other embodiments.

[0023] Figure 6 An exploded view of a voice coil structure provided in another embodiment of the present application.

[0024] Figure 7 A schematic structural diagram of a speaker provided in another embodiment of the present application.

[0025] Figure 8 for Figure 7 An exploded view of a loudspeaker in one embodiment is shown.

[0026] Fig. 9 for Figure 8 An exploded view of a loudspeaker from another perspective in one embodiment is shown.

[0027] Fig.10 for Figure 7 A cross-sectional view of a loudspeaker along line XX in an embodiment is shown.

[0028] Fig.11 for Figure 7 A schematic diagram of the structure after the support frame and the voice coil structure are assembled in one embodiment is shown.

[0029] Fig.12 for Fig.11 A schematic structural diagram of a fixing base in another perspective of an embodiment is shown.

[0030] Main component symbols

[0031] Voice coil structures 100a, 100b

[0032] Substrate 10

[0033] First conductor layer 20

[0034] The first outlet 21

[0035] The second outlet 22

[0036] Straight section 23 Bending section 24 The first insulating layer 30 Through hole 31 First gap 32 Fourth Gap 33

[0037] The second conductor layer 40

[0038] The third outlet 41

[0039] Fourth outlet 42 The second insulating layer 50 Second gap 51 The third gap 52 First pad 61 Second pad 62 Speaker 200 Diaphragm 210 The first magnetic block 220 The second magnetic block 230 First housing 240 Second housing 250 Support frame 260 The first conductive rubber segment 261 The second conductive rubber segment 262 Fixed seat 270 First mounting groove 271 Second mounting groove 272 The first conductive sheet 281 The second conductive sheet 282

[0040] First welding pad 283

[0041] Second welding plate 284

[0042] Tuning mesh 290

[0043] The following specific implementation method will be combined with the above-mentioned Figure 1-12 Further explain this application. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. When an element is considered to be "set on" another element, it may be directly set on the other element or there may be a central element at the same time.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0047] In order to further explain the technical means and effects adopted by the present application to achieve the intended purpose, the present application is described in detail below in conjunction with the accompanying drawings and implementation methods.

[0048] See also Figure 1 and Figure 2 In one embodiment of the present application, a voice coil structure 100a is provided, comprising a substrate 10, a first conductor layer 20 and a first insulating layer 30. The first conductor layer 20 is disposed on the substrate 10, and the first insulating layer 30 is disposed on the first conductor layer 20. The first conductor layer 20 is wound. The first conductor layer 20 comprises a first lead-out end 21 and a second lead-out end 22. The first lead-out end 21 and the second lead-out end 22 are two free ends of the first conductor layer 20, wherein the first lead-out end 21 is located in the middle of the first conductor layer 20, and the second lead-out end 22 is located on the outside of the first conductor layer 20. The first insulating layer 30 is provided with a through hole 31 and a first notch 32. The first lead-out end 21 is exposed to the first insulating layer 30 through the through hole 31, and the second lead-out end 22 is exposed to the first insulating layer 30 through the first notch 32. The first conductor layer 20 can be connected to an external power source through the first lead-out end 21 and the second lead-out end 22, so that current flows through the first conductor layer 20, and the first magnetic blocks 220 (see FIG. 2 ) disposed on both sides of the first conductor layer 20. Figure 8 ) Under the magnetic field of the second magnetic block 230, the first conductor layer 20 is forced to move according to the magnitude and direction of the current, thereby pushing the diaphragm 210 connected to the first conductor layer 20 (see Figure 5 ) reciprocates in the normal direction of the substrate 10, thereby generating sound.

[0049] In some embodiments, the first conductor layer 20 is a coil that is wound, and the entire coil is formed on the same plane.

[0050] In the prior art, a plurality of cylindrical coils are usually arranged in a surrounding manner in the thickness direction of the diaphragm, and a plurality of cylindrical coils are arranged in a surrounding manner to form a voice coil, and a plurality of coils are stacked along the thickness direction of the diaphragm. Compared with the prior art, in the present application, the first conductor layer 20 is arranged in a surrounding manner and is approximately a two-dimensional planar structure, which can reduce the volume occupied by the voice coil structure 100a, and further reduce the volume occupied by the voice coil structure 100a in the loudspeaker 200, which is conducive to the thinning and miniaturization of the loudspeaker 200. In some embodiments, the substrate 10 can be made of at least one of glass (Glass), polydimethylsiloxane (Polydimethylsiloxane, PDMS), and polyimide (Polyimide, PI). The substrate 10 serves as a carrier for carrying the first conductor layer 20. The substrate 10 is selected according to different material properties, and the material of the above-mentioned substrate 10 is used to reduce the resistance to the vibration of the diaphragm 210.

[0051] In some embodiments, the thickness of the substrate 10 is 10 μm-500 μm, within which not only the hardness of the substrate 10 can be ensured, but also the thickness of the voice coil structure 100 a will not be affected. For example, the thickness of the substrate 10 is 10 μm, 15 μm, 20 μm, 25 μm or 30 μm.

[0052] In some embodiments, the thickness of the first conductor layer 20 is 0.1 μm-50 μm, and the line width is 1.0 μm-100 μm. Compared with the existing cylindrical coil, the first conductor layer 20 is approximately a planar structure in the same plane. Within this thickness range, the thickness of the voice coil structure 100a can be reduced while meeting the impedance requirements of the voice coil structure 100a for the first conductor layer 20.

[0053] See also Figure 3 In other embodiments, the voice coil structure 100a further includes a second conductor layer 40 and a second insulating layer 50. The second conductor layer 40 is disposed on the first insulating layer 30, and the second insulating layer 50 is disposed on the second conductor layer 40. The second conductor layer 40 includes a third lead-out end 41 and a fourth lead-out end 42. The third lead-out end 41 and the fourth lead-out end 42 are two free ends of the second conductor layer 40. The third lead-out end 41 is electrically connected to the first lead-out end 21 through the through hole 31, thereby realizing electrical connection between the first conductor layer 20 and the second conductor layer 40 of different layers. The second insulating layer 50 is provided with a second notch 51 and a third notch 52 located at the corners of the second insulating layer 50. The second notch 51 corresponds to the first notch 32. The second lead-out end 22 is exposed to the second insulating layer 50 through the first notch 32 and the second notch 51. The fourth lead-out end 42 is exposed to the second insulating layer 50 through the third notch 52.

[0054] Figure 2In the structure shown, the first conductor layer 20 is electrically connected to the external power supply through the first lead-out end 21 and the second lead-out end 22. Since the first lead-out end 21 is always located in the middle of the first conductor layer 20, during welding with the external power supply, the first lead-out end 21 needs to be led out through an external wire (not shown) and then welded with the external power supply. Figure 3 In the structure shown, the third lead-out end 41 of the second conductor layer 40 is electrically connected to the first lead-out end 21, and the first lead-out end 21 is connected to the fourth lead-out end 42 connected to the third lead-out end 41. The fourth lead-out end 42 is used to transfer and replace the welding position of the first lead-out end 21 and the external power supply, and the second conductor layer 40 is provided here to play the role of electrical connection. The positive and negative connection ends of the external power supply can be electrically connected to the fourth lead-out end 42 and the second lead-out end 22 exposed in the second insulating layer 50, respectively, so that current can pass through the first conductor layer 20 and the second conductor layer 40. The fourth lead-out end 42 leads the first lead-out end 21 to the edge of the second insulating layer 50, which is convenient for subsequent welding with the external power supply through the fourth lead-out end 42, thereby improving the welding efficiency and also improving the aesthetics of the voice coil structure 100a.

[0055] See also Figure 3 In some embodiments, the voice coil structure 100a further includes a first pad 61 and a second pad 62, wherein the first pad 61 and the second conductor layer 40 are located in the same layer, and the first pad 61 is electrically connected to the second lead-out end 22 through the first notch 32, so that the first pad 61 is exposed to the second insulating layer 50, so that the second lead-out end 22 in the first conductor layer 20 leads to a welding point. The second pad 62 and the first conductor layer 20 are located in the same layer, and a fourth notch 33 is further provided at the corner of the first insulating layer 30, and the fourth notch 33 and the first notch 32 are located on the same side of the first insulating layer 30. The second pad 62 is electrically connected to the fourth lead-out end 42 through the fourth notch 33, so that the fourth lead-out end 42 is exposed to the second insulating layer 50.

[0056] In some embodiments, the first solder pad 61 and the fourth lead-out terminal 42 are exposed on the same side of the second insulating layer 50. In this way, when the positive and negative connection terminals of the external power supply are respectively welded to the second lead-out terminal 22 and the fourth lead-out terminal 42, the pulling of the welding wire between the connection terminal and the lead-out terminal can be reduced, and welding is facilitated. In the present application, the first lead-out terminal 21, the second lead-out terminal 22, the third lead-out terminal 41 and the fourth lead-out terminal 42 are all solder pad-shaped structures.

[0057] See also Figure 4In some embodiments, the first conductor layer 20 further includes two straight sections 23 and two bent sections 24 disposed between the two straight sections 23, and the bent sections 24 are convex away from the straight sections 23. The straight sections 23 and the bent sections 24 are alternately disposed. The coil is wound from the first lead-out end 21 to the second lead-out end 22 to form the first conductor layer 20. The bent section 24 is an arc-shaped structure, and the first conductor layer 20 is roughly a runway-shaped structure. The straight section 23 and the bent section 24 each include a plurality of spaced parallel coil segments.

[0058] See also Figure 5 In other embodiments, the wire is wound to form a coil-shaped first wire layer 20, the wire takes the first lead-out end 21 as the starting end, the second lead-out end 22 as the end, the second lead-out end 22 is wound around the first lead-out end 21 as the center to form the first wire layer 20, and the first lead-out end 21 and the second lead-out end 22 are located in the same plane. The outline of the first wire layer 20 is roughly a circular structure. It can be understood that the wire starts from the first lead-out end 21, and the second lead-out end 22 is wound around the first lead-out end 21 to form a plurality of annular concentric coils, wherein two concentric coils are arranged at intervals. In some embodiments, the outline of the first wire layer 20 can be a regular polygon such as a circle, a square, a hexagon, or an irregular polygon. In actual application, the shape of the first wire layer 20 can be set according to requirements.

[0059] See also Figure 6 Another embodiment of the present application also provides a voice coil structure 100b. Different from the above-mentioned voice coil structure 100a, the second wire layer 40 in the voice coil structure 100b is a coil that is wound. The design of the first wire layer 20 and the second wire layer 40 enables the voice coil structure 100b to have a larger resistance value by setting multiple layers of coils, further improving the vibration amplitude of the voice coil structure 100b, so that the voice coil structure 100b drives the diaphragm 210 to produce mid-high tones. In the present application, the shape, size and impedance of the first wire layer 20 and the second wire layer 40 as well as the impedance of the coil can be adjusted according to requirements. For example, the shape of the coil can be annular, square or spiral, etc. The impedance of the first wire layer 20 and the second wire layer 40 are the same, and the resistance values ​​are both between 16-18Ω.

[0060] In some embodiments, the number and size of the windings of the first wire layer 20 and the second wire layer 40 can be set as required. The material of the first wire layer 20 and the second wire layer 40 includes at least one of aluminum, copper, silver or gold, for example, the coil uses any one of copper wire, aluminum wire, silver wire or gold wire. The first insulating layer 30 and the second insulating layer 50 can both use any one of epoxy resin (Epoxy), siloxane (Siloxane), polybenzoxazole (Polybenzoxazole; PBO), and acrylic resin (Acrylic resin).

[0061] In some embodiments, multiple conductor layers and corresponding insulating layers may be disposed on the second insulating layer 50 as required to achieve a multi-layer arrangement of the voice coil structure 100 .

[0062] See also Figure 7 , Figure 8 and Fig. 9 The present application also provides a loudspeaker 200, which includes a diaphragm 210, a voice coil structure 100a (100b), and a first magnetic block 220 and a second magnetic block 230 disposed on both sides of the voice coil structure 100a (100b). The surface of the substrate 10 in the voice coil structure 100a (100b) that is away from the first wire layer 20 is disposed on the diaphragm 210, and a glue layer (not shown) is further disposed between the diaphragm 210 and the substrate 10, and the diaphragm 210 and the substrate 10 are bonded by the glue layer. When the wire layer in the voice coil structure 100a (100b) is energized, a magnetic field is generated, and the wire layer generates reciprocating vibrations under the interaction of the first magnetic block 220 and the second magnetic block 230, thereby driving the diaphragm 210 to vibrate, thereby generating sound.

[0063] See also Figure 8 , Fig. 9 and Fig.10In some embodiments, the speaker 200 further includes a first housing 240, a second housing 250, a support frame 260, a fixing seat 270, a first conductive sheet 281, and a second conductive sheet 282. The first housing 240 and the second housing 250 are connected by snaps. The diaphragm 210, the first magnetic block 220, the second magnetic block 230, the voice coil structure 100a (100b), and the support frame 260 are all disposed in the first housing 240 and the second housing 250. The first magnetic block 220 is fixed in the cavity of the first housing 240, for example, the first magnetic block 220 can be glued or embedded in the first housing 240. The second magnetic block 230 is fixed in the cavity of the second housing 250, for example, the second magnetic block 230 can be glued or embedded in the second housing 250. The support frame 260 is fixed on the inner wall of the first housing 240, and is used to fix the diaphragm 210 on the first housing 240. The support frame 260 is roughly square. The support frame 260 is made of a soft board, for example, a board made of a flexible plastic material. The support frame 260 is bonded to the edge of the diaphragm 210 by glue. In some embodiments, the first magnetic block 220 and the second magnetic block 230 may each include a magnetic block composed of a plurality of magnets.

[0064] See also Figure 8 , Fig.10 and Fig.11 , the voice coil structure 100a (100b) is located in the hollow part of the support frame 260. The diaphragm 210 and the voice coil structure 100a (100b) reciprocate and vibrate through the hollow part of the support frame 260. In some embodiments, the surface of the support frame 260 is further provided with a first conductive rubber segment 261 and a second conductive rubber segment 262, and the first conductive rubber segment 261 and the second conductive rubber segment 262 are arranged at intervals and are not connected. The first conductive rubber segment 261 and the second conductive rubber segment 262 are located on the same surface of the support frame 260. The first conductive rubber segment 261 is used to be electrically connected to the first soldering pad 61 of the voice coil structure 100a (100b), and the second conductive rubber segment 262 is used to be electrically connected to the fourth lead-out end 42 of the voice coil structure 100a (100b).

[0065] See also Fig.11 and Fig.12The fixing seat 270 is arranged on one side after the first shell 240 and the second shell 250 are assembled. The fixing seat 270 can be fixed to the first shell 240 and the second shell 250 by bonding or bolts. The first conductive sheet 281 and the first conductive sheet 281 are both installed on the fixing seat 270. The fixing seat 270 is provided with a first mounting groove 271 and a second mounting groove 272. The first mounting groove 271 and the second mounting groove 272 have the same structure and are both located on the surface of the fixing seat 270 away from the first shell 240. The first conductive sheet 281 is accommodated in the first mounting groove 271 and exposed on the surface of the fixing seat 270. One end of the first conductive sheet 281 passes through the fixing seat 270 and extends to the top of the first conductive rubber segment 261, and is electrically connected to the first conductive rubber segment 261. The second conductive sheet 282 is accommodated in the second mounting groove 272 and exposed on the surface of the fixing seat 270. One end of the second conductive sheet 282 passes through the fixing seat 270 and extends to the top of the second conductive rubber segment 262, and is electrically connected to the second conductive rubber segment 262. The first conductive sheet 281 is electrically connected to the positive electrode of the external power supply, and the first conductive sheet 281 is electrically connected to the first pad 61 of the voice coil structure 100a (100b) through the first conductive rubber segment 261. The second conductive sheet 282 is electrically connected to the negative electrode of the external power supply, and the second conductive sheet 282 is electrically connected to the fourth lead-out end 42 of the voice coil structure 100a (100b) through the second conductive rubber segment 262, so that the wire end of the voice coil structure 100a (100b) is led out to the outside of the speaker 200 housing through the first conductive sheet 281 and the second conductive sheet 282, so as to be electrically connected to the external power supply.

[0066] See also Fig.11 and Fig.12 In some embodiments, a first welding pad 283 is provided between the first conductive adhesive segment 261 and the first conductive sheet 281, and a second welding pad 284 is provided between the second conductive adhesive segment 262 and the second conductive sheet 282. The first welding pad 283 is electrically connected between the first conductive sheet 281 and the first conductive adhesive segment 261. The second welding pad 284 is electrically connected between the second conductive sheet 282 and the second conductive adhesive segment 262.

[0067] In some embodiments, a tuning mesh 290 is fixed to the fixing base 270 , and the tuning mesh 290 is adhered to the fixing base 270 .

[0068] The voice coil structure 100a (100b) provided in the present application can replace the voice coil in the prior art, and can be combined with the existing diaphragm 210 without changing the structure of the existing diaphragm 210, and can reduce the volume of the speaker 200, and has strong universality. Moreover, compared with the existing voice coil, the voice coil structure 100a (100b) in the present application is thinner, and can also increase the bonding area between the voice coil structure 100a (100b) and the glue, improve the stability of the voice coil structure 100a (100b) installed on the diaphragm 210, and reduce the risk of the voice coil structure 100a (100b) falling off.

[0069] In the present application, a voice coil structure 100a (100b) is provided on the substrate 10, and the voice coil formed by surrounding an existing cylindrical coil is designed as a conductor layer, thereby reducing the volume occupied by the coil in the voice coil structure 100a (100b), and reducing the volume occupied by the voice coil structure 100a (100b) in the speaker 200, which is beneficial to the thinning and miniaturization of the speaker 200.

[0070] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the present application and are not intended to limit it. Although the present application has been described in detail with reference to the embodiments, a person skilled in the art should understand that the technical solution of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present application.

Claims

1. A loudspeaker, comprising a diaphragm, characterized in that: The loudspeaker further comprises a voice coil structure and a support frame, wherein the voice coil structure comprises: A substrate having a thickness of 10 μm-500 μm; A first wire layer is arranged on the substrate, the first wire layer is wound, the first wire layer comprises a first lead-out end and a second lead-out end, a surface of the substrate away from the first wire layer is arranged on the diaphragm, the first wire layer has a thickness of 0.1 μm-50 μm, and a line width of 1.0 μm-100 μm; A first insulating layer is disposed on the first conductive line layer, wherein the first insulating layer is provided with a through hole and a first notch, wherein the first lead-out end is exposed to the first insulating layer through the through hole, and the second lead-out end is exposed to the first insulating layer through the first notch; a second conductor layer and a second insulating layer, the second conductor layer comprising a third lead-out end and a fourth lead-out end, the second insulating layer being provided with a second notch and a third notch located at an edge of the second insulating layer, the second notch corresponding to the first notch, the second lead-out end being exposed to the second insulating layer through the first notch and the second notch, the third lead-out end being electrically connected to the first lead-out end through the through hole, and the fourth lead-out end being exposed to the second insulating layer through the third notch; a first pad and a second pad, wherein the first pad and the second conductor layer are located in the same layer, the first pad is electrically connected to the second lead-out end through a first notch, and the first pad is exposed to the second insulating layer through the second notch; the second pad and the first conductor layer are located in the same layer, the first insulating layer is further provided with a fourth notch, and the second pad is electrically connected to the fourth lead-out end through the fourth notch; The diaphragm is arranged on the support frame, and a first conductive rubber segment and a second conductive rubber segment are provided on the surface of the support frame. The first conductive rubber segment is used to be electrically connected to the first lead-out end, and the second conductive rubber segment is used to be electrically connected to the second lead-out end.

2. The loudspeaker according to claim 1, characterized in that The first pad and the fourth lead-out end are exposed on the same side of the second insulating layer.

3. The loudspeaker according to claim 1, characterized in that The second conductor layer is wound.

4. The loudspeaker according to claim 1, characterized in that The material of the first conductive line layer includes at least one of aluminum, copper, silver or gold.

5. The loudspeaker according to claim 1, characterized in that The substrate includes at least one of glass, polydimethylsiloxane and polyimide.

6. The loudspeaker according to claim 1, characterized in that The first conductor layer includes straight sections and bent sections that are alternately arranged, and the bent sections protrude outward in a direction away from the straight sections.

7. The loudspeaker according to claim 1, characterized in that The first conductor layer is formed by winding a conductor, the conductor has the first lead-out end as a starting end and the second lead-out end as an end, the second lead-out end is wound around the first lead-out end as a center to form the first conductor layer, and the first lead-out end and the second lead-out end are located in the same plane.

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