Laser processing system and its automatic monitoring method, device and computer equipment

Abstract

This application relates to a laser processing system, an automatic monitoring method, device and computer equipment thereof. The method includes: when the laser processing system is in a processing state, obtaining processing parameters and determining whether a power monitoring condition is met according to the processing parameters; if so, obtaining the laser processing power value, where the laser processing power value is the laser power reaching the processing table; determining whether the laser processing power value is within a preset power range; if the laser processing power value is not within the preset power range, adjusting the parameters of the laser processing device and returning to the step of obtaining the laser processing power value to keep the laser power used for processing within the preset power range, ensuring the long-term stable operation of the laser processing system. The above automatic monitoring method of the laser processing system automatically completes the control of the laser power during the processing, which is beneficial to improving the processing quality, reducing the labor cost and scrap rate, and thus reducing the production cost.

Description

Technical Field

[0001] This application relates to the field of laser processing technology, and particularly to a laser processing system, an automatic monitoring method, device, and computer equipment thereof. Background Art

[0002] With the continuous development and progress of laser technology, laser processing systems are increasingly applied to the field of industrial manufacturing.

[0003] Traditional laser processing systems rely on operators to manually measure and adjust the laser power, which has the problem of high labor costs. At the same time, there is also a problem with the control timing. Often, the laser power problem is only discovered when quality abnormalities occur after processing, and at this time, the processing has been scrapped and cannot be recovered.

[0004] Therefore, traditional laser processing systems have the problem of high production costs. Summary of the Invention

[0005] Based on this, it is necessary to provide a laser processing system, an automatic monitoring method, device, and computer equipment thereof that can reduce the production costs of end customers for the above technical problems.

[0006] An automatic monitoring method for a laser processing system includes:

[0007] Obtain processing parameters, and determine whether the power monitoring condition is reached according to the processing parameters;

[0008] If so, obtain the laser processing power value, where the laser processing power value is the laser power reaching the processing table;

[0009] Determine whether the laser processing power value is within a preset power range;

[0010] If the laser processing power value is not within the preset power range, adjust the parameters of the laser processing device, and return to the step of obtaining the laser processing power value to keep the laser power used for processing within the preset power range to ensure the long-term stable operation of the laser processing system.

[0011] In one embodiment, after determining whether the laser processing power value is within the preset power range, the method further includes:

[0012] If the laser processing power value is within the preset power range, keep the current parameters of the laser processing device unchanged.

[0013] In one embodiment, the step of if the laser processing power value is not within the preset power range, adjust the parameters of the laser processing device, and return to the step of obtaining the laser processing power value includes:

[0014] If the laser processing power value is not within the preset power range, obtain the laser processing device parameters, and determine whether the laser processing device is a multi-axis processing device according to the laser processing device parameters;

[0015] If the laser processing device is a multi-axis processing device, obtain the laser processing power value of each axis, and determine whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power value of each axis;

[0016] If not, adjust the parameters of each axis so that the laser processing device meets the preset multi-axis balance condition;

[0017] Obtain the adjusted laser processing power value, and determine whether the adjusted laser processing power value is within the preset power range;

[0018] If the adjusted laser processing power value is not within the preset power range, adjust the laser processing device parameters and return to the step of obtaining the laser processing power value.

[0019] In one embodiment, after determining whether the laser processing device meets the preset multi-axis balance condition by obtaining the laser processing power value of each axis if the laser processing device is a multi-axis processing device, the method further includes:

[0020] If so, adjust the laser processing device parameters based on the laser processing power value and return to the step of obtaining the laser processing power value.

[0021] In one embodiment, the processing parameters include the processing times interval, the working time interval, whether it is the first processing of a specific part number, and whether it is the first processing after modifying the preset power range; the power monitoring conditions include that the processing times interval reaches the set number of times, the working time interval reaches the set time, the first processing of a specific part number, or the first processing after modifying the preset power range.

[0022] In one embodiment, after the step of adjusting the laser processing device parameters and returning to the step of obtaining the laser processing power value if the laser processing power value is not within the preset power range, the method further includes:

[0023] After a predetermined number of adjustment times, if the laser processing power value is still not within the preset power range, output an alarm message.

[0024] A laser processing system automatic monitoring device, comprising:

[0025] A processing parameter acquisition module, configured to acquire processing parameters and determine whether the power monitoring condition is met according to the processing parameters;

[0026] A laser processing power value acquisition module, which is used to acquire the laser processing power value when the power monitoring condition is met; the laser processing power value is the laser power reaching the processing table.

[0027] A judgment module, which is used to judge whether the laser processing power value is within the preset power range.

[0028] An adjustment module, which is used to adjust the parameters of the laser processing device when the laser processing power value is not within the preset power range, and return to the step of acquiring the laser processing power value, so as to keep the laser power used for processing within the preset power range and ensure the long-term stable operation of the laser processing system.

[0029] In one embodiment, the processing parameters include the processing times interval, the working time interval, whether it is the first processing of a specific part number, and whether it is the first processing after modifying the preset power range; the power monitoring conditions include that the processing times interval reaches the set number of times, the working time interval reaches the set time, the first processing of a specific part number, or the first processing after modifying the preset power range.

[0030] In one embodiment, the adjustment module is further used to keep the current parameters of the laser processing device unchanged when the laser processing power value is within the preset power range.

[0031] In one embodiment, the adjustment module specifically is used for: when the laser processing power value is not within the preset power range, acquiring the parameters of the laser processing device, and judging whether the laser processing device is a multi-axis processing device according to the parameters of the laser processing device; if the laser processing device is a multi-axis processing device, acquiring the laser processing power values of each axis, and judging whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power values of each axis; if not, adjusting the parameters of each axis so that the laser processing device meets the preset multi-axis balance condition; acquiring the adjusted laser processing power value, and judging whether the adjusted laser processing power value is within the preset power range; if the adjusted laser processing power value is not within the preset power range, adjusting the parameters of the laser processing device and returning to the step of acquiring the laser processing power value.

[0032] In one embodiment, the adjustment module is further used for: when the laser processing device meets the preset multi-axis balance condition, adjusting the parameters of the laser processing device based on the laser processing power value, and returning to the step of acquiring the laser processing power value.

[0033] In one embodiment, the laser processing system automatic monitoring device further includes: an alarm module, which is used to output an alarm message when the laser processing power value is still not within the preset power range after a predetermined number of adjustment times.

[0034] A computer device includes a processor and a memory. The memory stores a computer program. When the computer program is executed by the processor, the processor is caused to execute the steps of the above method.

[0035] A laser processing system includes a laser processing device, a power detection device, and the computer device as described above; the computer device is connected to the laser processing device and the power detection device.

[0036] In one embodiment, the laser processing device includes a laser, an optical path system, and a galvanometer system; the initial laser emitted by the laser passes through the optical path system and the galvanometer system in sequence and then reaches the workbench surface.

[0037] The above laser processing system automatic monitoring method, when the laser processing system is in a processing state and it is determined according to the processing parameters that the power monitoring condition has been reached, and by determining whether the laser processing power value reaching the processing table is within a preset power range, so that if the laser processing power value is not within the preset power range, the parameters of the laser processing device are adjusted, and the step of obtaining the laser processing power value is returned, so that the laser power for processing is always maintained within the preset power range, thereby achieving: on the one hand, without human participation, the computer device automatically detects and adjusts the laser power, which is beneficial to reducing labor costs; on the other hand, the control of the laser power is completed during the processing, which is equivalent to providing a pre-control method, which can realize the long-term stable production of the laser processing system, improve the processing quality, and reduce the scrap rate. The above two aspects are both beneficial to reducing the production cost of end customers. Description of the Drawings

[0038] Figure 1 It is a flowchart of the laser processing system automatic monitoring method in one embodiment;

[0039] Figure 2 It is a flowchart of the laser processing system automatic monitoring method in another embodiment;

[0040] Figure 3 It is a flowchart of the step of adjusting the parameters of the laser processing device and returning to the step of obtaining the laser processing power value if the laser processing power value is not within the preset power range in one embodiment;

[0041] Figure 4 It is a structural block diagram of the laser processing system automatic monitoring device in one embodiment;

[0042] Figure 5 It is a structural block diagram of the laser processing system automatic monitoring device in another embodiment;

[0043] Figure 6 It is a structural block diagram of the computer device in one embodiment;

[0044] Figure 7 is a structural block diagram of a laser processing system in an embodiment;

[0045] Figure 8 is a working flowchart of a laser processing system in an embodiment. Detailed implementation manners

[0046] In order to make the objectives, technical solutions and advantages of the present application clearer and more understandable, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which this application belongs. The terms used in the specification of this application herein are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0048] It can be understood that in the following embodiments, "connection", if there is an electrical signal or data transmission between the connected circuits, modules, units, etc., should be understood as "electrical connection", "communication connection", etc.

[0049] As used herein, the singular forms "a", "an" and "the" may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprise / include" or "have" etc. specify the presence of the stated features, wholes, steps, operations, components, parts or combinations thereof, but do not preclude the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0050] With the in-depth development of intelligent manufacturing, laser processing systems have penetrated into all aspects of the manufacturing industry. However, the current laser processing systems have the problems of low intelligence level and high manual participation. In the existing scenarios, the inventors found that the measurement and adjustment of laser power usually still rely on the manual method of operators, which not only has the problem of high labor cost, but also has the problem of control timing, and often the problem of laser power is only found when quality abnormalities occur after processing, and at this time, the processing has been scrapped and cannot be recovered.

[0051] Moreover, under the trend of automation, the development of laser processing systems towards unmanned operation is an irresistible trend. Among them, the automatic control of laser power is an important part of the automatic control of laser processing systems, directly determining the processing quality of laser processing systems. Taking the laser cutting system as an example, the laser power represents the magnitude of the energy output by the laser in the laser cutting system. If the energy is too large, defects such as carbonization, blackening, and widened line width will occur, affecting the cutting quality; if the energy is too small, it may lead to incomplete cutting and cause product scrapping. Especially for laser processing equipment, the stability of the laser power reaching the surface of the processed workpiece plays a decisive role in the processing quality. Therefore, it is necessary to continuously control the laser power to ensure that the processing quality of the laser processing device can be stable for a long time.

[0052] To solve the above technical problems, the inventive concept of this application came into being, which will be specifically described through the following embodiments.

[0053] Based on this, this application proposes a laser processing system and its automatic monitoring method, device, and computer equipment, which can be applied to fields such as laser cutting, laser drilling, and laser welding, and is particularly suitable for the laser processing field in the PCB (Printed Circuit Board) industry. It can automatically monitor and adjust the laser power of the laser processing device, achieve continuous and stable processing of the equipment, ensure the processing quality of the equipment under automation conditions, reduce the dependence of the equipment on manual labor, and lay a foundation for improving the reliability of laser processing products and exploring unmanned automated factories.

[0054] In the first aspect of this application, as Figure 1 shown, an automatic monitoring method for a laser processing system is provided, including steps S200 to S500.

[0055] Step S200: When the laser processing system is in the processing state, obtain the processing parameters and determine whether the power monitoring condition is met according to the processing parameters.

[0056] Among them, the processing parameters refer to the parameters related to laser processing. Taking the laser cutting system as an example, the processing parameters include laser power, cutting times, cutting speed, working time interval, and part number, etc. According to the preset rules and the corresponding relationship between the processing parameters and the preset rules, it can be determined whether the power monitoring condition is currently met.

[0057] Further, the power monitoring conditions are not unique. For example, it can be that the cumulative working time reaches a preset duration, or it can be that the cumulative number of processing times reaches a preset number. In one embodiment, the processing parameters include the processing times interval, the working time interval, whether it is the first processing of a specific part number, and whether it is the first processing after modifying the preset power range; the power monitoring conditions include that the processing times interval reaches the set number, the working time interval reaches the set time, the first processing of a specific part number, or the first processing after modifying the preset power range.

[0058] Specifically, when the laser processing system is in the processing state, the computer device automatically obtains the processing parameters, and determines whether the power monitoring conditions are met according to the processing parameters. If the power monitoring conditions are not met, the processing is performed based on the current processing parameters. If the power monitoring conditions are met, step S300 is executed: obtaining the laser processing power value.

[0059] Among them, the laser processing power value is the laser power reaching the processing table, that is, the laser power reaching the surface of the workpiece to be processed, which is also the final laser power used for processing. In one embodiment, the laser processing power value can be measured by a power detection device. The power detection device can be a photothermal type detection device or an optoelectronic type detection device. Further, the power detection device can measure the initial laser emitted by the laser in the laser processing device and combine the theoretical loss value to obtain the final laser power used for processing; it can also directly measure the laser power finally emitted by the laser processing device to the worktable surface to improve the accuracy of power detection. Taking a galvanometer laser processing device as an example, the power detection device can measure the laser power emitted by the galvanometer system to the worktable surface to obtain the laser processing power value.

[0060] In one embodiment, the power detection device can be a laser energy meter, and the laser processing power value is obtained by measuring the power of continuous laser or the average power of pulsed laser over a certain period of time. Further, the probe for laser energy detection in the laser energy meter is fixed to the worktable surface through a connecting device. During the laser processing, the probe does not affect the normal processing of the workpiece; when power measurement is required, the connecting device drives the probe to move so that the probe is located above the worktable surface to directly measure the laser power reaching the worktable surface. That is, adopting the control method of the present application can be integrated into the production process, and the automatic control of laser power can be realized without interrupting the production process.

[0061] Specifically, if the power monitoring conditions are met, the computer device sends a power measurement instruction to the power detection device, instructing the power detection device to perform laser power measurement to obtain the laser processing power value. Further, the specific way for the computer device to obtain the laser processing power value can be active acquisition or passive reception.

[0062] Step S400: Determine whether the laser processing power value is within a preset power range.

[0063] As described above, too high or too low laser power will affect the processing quality. Therefore, in this application, the preset power range is a threshold range centered on the target laser power and including upper and lower limits. The target laser power can be characterized in the form of a percentage of the laser rated power or in the form of a power value (unit: W). In one embodiment, the target laser power is characterized in the form of a power value, using a direct numerical expression, which is simple and clear. Taking the case where the target laser power is P1 and the laser processing power value is P2 as an example, the preset power range can be (1 + X) * P1, where X is the acceptable floating range. It can be understood that the value of X is not unique. For example, it can be ±4%, ±5% or ±6%. It is set by the operator according to the specific processing accuracy requirements of the workpiece to be processed and the performance parameters of the laser in the laser processing device. Further, a computer device can provide a power setting window for the operator to set parameters.

[0064] Specifically, after the computer device obtains the laser processing power value, it compares the laser processing power value with the preset power range to determine whether the laser processing power value is within the preset power range.

[0065] Step S500: If the laser processing power value is not within the preset power range, adjust the parameters of the laser processing device.

[0066] Among them, the parameters of the laser processing device include the excitation voltage and cooling parameters of the laser, as well as the deflection angles, deflection directions and relative positions of the lenses in the optical path system and / or the galvanometer system. Specifically, when the laser processing power value is not within the preset power range, according to the difference between the laser processing power value and the upper and lower limits of the preset power range, and the corresponding relationship between the laser power and the parameters of the laser processing device, the parameters of the laser processing device are adjusted so that the adjusted laser processing power value, that is, the laser power used for processing, remains within the preset power range, ensuring the long-term stable operation of the laser processing system and guaranteeing the processing quality of the workpiece to be processed.

[0067] Furthermore, the way for the computer device to adjust the parameters of the laser processing device is not unique. For example, only one parameter can be adjusted, or two or more parameters can be adjusted simultaneously. In one embodiment, the laser processing device includes a galvanometer system, and the computer device specifically adjusts the parameters of the galvanometer system to adjust the laser power. In addition, the parameters can be adjusted according to a preset adjustment span, or according to the difference degree between the laser processing power value and the upper and lower limits of the preset power range. Taking the case where the laser processing power value exceeds the upper limit of the preset power range as an example, the parameters can be adjusted according to the preset adjustment span to improve the stability of the laser processing system during the adjustment process; or the parameter adjustment amplitude can be determined according to the difference degree between the laser processing power value and the upper limit of the preset power range. When the difference degree is large, the parameter adjustment amplitude is increased, and when the difference degree is small, the parameter adjustment amplitude is decreased to improve the laser power control efficiency.

[0068] It can be understood that after the computer device adjusts the parameters of the laser processing device, it is necessary to return to step S300 to re-obtain the laser processing power value to determine whether the adjusted laser processing power value is within the preset power range. If so, the control of the current laser power ends and normal processing is carried out; if not, step S500 is continued to adjust the parameters of the laser processing device again.

[0069] The above-mentioned automatic monitoring method for the laser processing system, when the laser processing system is in the processing state and it is determined according to the processing parameters that the power monitoring condition is reached, and by judging whether the laser processing power value reaching the processing table is within the preset power range, so that if the laser processing power value is not within the preset power range, the parameters of the laser processing device are adjusted, and the step of obtaining the laser processing power value is returned, so that the laser power for processing always remains within the preset power range, thus achieving: on the one hand, without human participation, the computer device automatically detects and adjusts the laser power, which is not only beneficial to reducing labor costs, but also can realize continuous and stable processing of the equipment, ensure the processing quality of the equipment under the condition of automation, lay a foundation for improving the reliability of laser processing products, and exploring a unmanned automatic factory; on the other hand, completing the control of the laser power during the processing process is equivalent to providing a pre-control method, which can realize the long-term stable production of the laser processing system, improve the processing quality, and reduce the scrap rate. The above two aspects are both beneficial to reducing the production cost of end customers.

[0070] In one embodiment, as Figure 2 shown, after step S400, there is also step S600: if the laser processing power value is within the preset power range, keep the current parameters of the laser processing device unchanged.

[0071] Specifically, if the laser processing power value is within the preset power range, it indicates that the current processing parameters are applicable to the workpiece to be processed. At this time, keep the parameters of the current laser processing device unchanged, and control the laser processing device to perform normal processing on the workpiece to be processed. Further, after completing the current processing, it is necessary to return to step S200, re-obtain the processing parameters, and determine whether the power monitoring condition is met according to the processing parameters.

[0072] In the above embodiment, the working mode in the case where the laser processing power value is within the preset power range is illustrated, which can ensure the continuous processing of the laser processing system in this case and guarantee the automatic operation of the system.

[0073] In one embodiment, please continue to refer to Figure 2 , after step S500, it further includes step S700: after a predetermined number of adjustment times, if the laser processing power value is still not within the preset power range, an alarm message is output.

[0074] Among them, the number of adjustment times refers to the number of times the computer device adjusts the parameters of the laser processing device when the laser processing power value is not within the preset power range, so that the adjusted laser processing power value is kept within the preset power range. Specifically, when the laser processing power value is not within the preset power range, according to the difference between the laser processing power value and the upper and lower limits of the preset power range, and the corresponding relationship between the laser power and the parameters of the laser processing device, the parameters of the laser processing device are adjusted, and the laser processing power value is re-obtained to determine whether the adjusted laser processing power value is within the preset power range. If so, the control of the current laser power is ended and normal processing is performed. At this time, the number of adjustment times is one; if not, step S500 is continued to adjust the parameters of the laser processing device again, and the number of adjustment times is incremented by one, and so on. After a predetermined number of adjustment times, if the laser processing power value is still not within the preset power range, it indicates that there is a fault in the laser processing system or the parameter adjustment range is set unreasonably. At this time, an alarm message is output so that the operator can perform abnormal troubleshooting and handling in time.

[0075] Further, the output object and specific content of the alarm message are not unique. For example, the output object of the alarm message can be a display or a terminal, and the specific content of the alarm message can be text information, or it can be sound, light, or a combination of sound and light. In one embodiment, the computer device outputs the alarm message via the display in the form of a pop-up window alarm.

[0076] In the above embodiment, after a predetermined number of adjustment times, when the laser processing power value is still not within the preset power range, an alarm message is output, which can facilitate the operator to timely understand the abnormal situation of the system, perform abnormal troubleshooting and handling, and is beneficial to improving the scientificity of the automatic monitoring method.

[0077] In one embodiment, as Figure 3 shown, step S500 includes steps S510 to S550.

[0078] Step S510: If the laser processing power value is not within the preset power range, obtain the laser processing device parameters, and determine whether the laser processing device is a multi-axis processing device according to the laser processing device parameters.

[0079] Among them, a multi-axis processing device refers to a processing device that can provide laser beams in at least two directions, respectively for processing a workpiece to be processed along different coordinate axis directions. This multi-axis processing device can use one laser and obtain at least two directions of laser beams through beam splitting, or use multiple lasers, with each laser providing initial laser for each axis respectively, and finally obtaining at least two directions of laser beams. The laser processing device parameters include the laser optical path composition of the processing device. Specifically, the computer device obtains the laser processing device parameters, and according to the laser processing device parameters, can determine the number of laser optical paths in different emission directions, and then determine whether the laser processing device is a multi-axis processing device.

[0080] Step S520: If the laser processing device is a multi-axis processing device, obtain the laser processing power value of each axis, and determine whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power value of each axis.

[0081] Among them, the laser processing power value of each axis refers to the laser processing power value obtained by the power detection device measuring the laser power in the direction where each axis is located respectively. The multi-axis balance condition refers to the tolerance allowed between the laser processing power values of different axes on the premise that the laser power is not adjusted. It can be understood that the smaller the tolerance, the smaller the difference between the laser processing power values of each axis, and the higher the requirements for the laser processing device. Therefore, the operator sets the preset multi-axis balance condition in combination with the specific processing accuracy requirements of the workpiece to be processed and the performance parameters of the laser processing device. For example, the preset multi-axis balance condition can be set as tolerance ≤ 2% or tolerance ≤ 3%. Further, the method of the power detection device measuring the laser power in the direction where each axis is located respectively can be that one power detection device is configured with multiple probes, and each probe measures the laser power of each axis at the same time, or multiple power detection devices are configured, and each power detection device measures the laser power of each axis at the same time.

[0082] Specifically, the computer device sends a multi-axis power measurement instruction to the power detection device, instructing the power detection device to measure the laser power of each axis respectively, obtain the laser processing power value of each axis and send it to the computer device. Then, the computer device determines whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power value of each axis and the preset multi-axis balance condition.

[0083] If not, perform step S530: Adjust the parameters of each axis to make the laser processing device meet the preset multi-axis balance condition.

[0084] If the laser processing device does not meet the preset multi-axis balance condition, there may be an abnormality in the optical path system of one or more axes. For example, the deflection vibration rate of the polarization crystal is abnormal, or the beam splitting ratio is abnormal. Specifically, the parameters of each axis can be adjusted according to the specific type of the multi-axis laser processing device. If the multi-axis laser processing device uses one laser and realizes multi-axis processing through beam splitting, the multi-axis balance is achieved by adjusting the beam splitting ratio. If the laser optical paths of each axis of the multi-axis laser processing device are independent of each other, the device parameters on the optical path of each axis can be correspondingly adjusted, and then the ratio between the laser powers of each axis can be adjusted. Further, the intermediate value among the laser processing power values of each axis can be used as a reference to adjust the parameters of the corresponding axis outside the tolerance range to improve the efficiency.

[0085] Step S540: Obtain the adjusted laser processing power value and determine whether the adjusted laser processing power value is within the preset power range.

[0086] Step S550: If the adjusted laser processing power value is not within the preset power range, adjust the parameters of the laser processing device and return to step S300.

[0087] Specifically, by adjusting the parameters of each axis, the laser processing device can meet the preset multi-axis balance condition, achieve power balance between axes, and ensure the same processing effect among multiple axes. After ensuring that the laser processing device meets the preset multi-axis balance condition, then perform step S540 and step S550, obtain the adjusted laser processing power value, determine whether the adjusted laser processing power value is within the preset power range, and when the adjusted laser processing power value is not within the preset power range, adjust the parameters of the laser processing device to keep the adjusted laser processing power value within the preset power range.

[0088] Take the case of a multi-axis laser processing device that uses one laser and splits the initial laser emitted by the laser through a light path system into two parts to achieve two-axis processing. Assume that the initial laser power is P, and the two-axis laser powers are P3 and P4 respectively. Ignoring the optical path loss, the sum of P3 and P4 is P. The power adjustment for each axis performed in step S530 is to adjust the ratio of P3 and P4 by the splitting ratio, thereby achieving the power balance between axes. At this time, P3 and P4 change, while the value of P remains unchanged. The adjustment of the parameters of the laser processing device performed in step S550 is to uniformly adjust the laser power of each axis, which will cause the power of each axis to change synchronously without affecting the power balance between axes. That is, step S550 adjusts the value of P without changing the ratio of P3 and P4. In the ideal state of power balance between axes, P3 and P4 should satisfy P3 = P4 = P / 2, but in reality, the situation of power imbalance between axes may occur. For example, P3 = 3P / 5 and P4 = 2P / 5. At this time, the system will first perform the power adjustment for each axis until P3 and P4 satisfy the preset multi-axis balance condition. For example, the ratio of P3 to P4 is ≥ 98% or ≤ 102%. Then, it is judged whether the adjusted laser processing power value is within the preset power range. If not, the value of P is adjusted to make P3 and P4 change synchronously until the laser processing power values of each axis are all within the preset power range.

[0089] In the above embodiment, when performing power control of the multi-axis processing equipment, first perform the balance detection of the multi-axis power. After ensuring that the preset multi-axis balance condition is met, then perform the adjustment of the laser power, which can avoid processing defects caused by power imbalance between axes and is beneficial to further improving the processing quality of the laser processing system.

[0090] In one embodiment, please continue to refer to Figure 3 , after step S520, if the laser processing device meets the preset multi-axis balance condition, then execute step S560: Based on the laser processing power value, adjust the parameters of the laser processing device and return to step S300. For the specific limitations of step S560, please refer to step S500, which will not be elaborated here. Specifically, after the computer device adjusts the parameters of the laser processing device, it needs to return to step S300 to re-obtain the laser processing power value to judge whether the adjusted laser processing power value is within the preset power range. If so, end the control of the current laser power and perform normal processing; if not, continue to execute step S560 to adjust the parameters of the laser processing device again.

[0091] It should be understood that although the steps in each flowchart involved in the above embodiments are displayed in sequence according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless there is a clear indication in this document, the execution of these steps has no strict order restriction, and these steps can be executed in other orders. Moreover, at least a part of the steps in each flowchart involved in the above embodiments may include multiple sub-steps or multiple stages. These sub-steps or stages are not necessarily executed at the same time, but can be executed at different times. The execution order of these sub-steps or stages is not necessarily sequential, but can be executed alternately or in turn with at least a part of other steps or sub-steps or stages of other steps.

[0092] In the second aspect of the present application, as Figure 4 shown, a laser processing system automatic monitoring device is provided, including: a processing parameter acquisition module 200, configured to acquire processing parameters when the laser processing system is in a processing state, and determine whether the power monitoring condition is met according to the processing parameters; a laser processing power value acquisition module 300, configured to acquire the laser processing power value when the power monitoring condition is met; the laser processing power value is the laser power reaching the processing table; a judgment module 400, configured to judge whether the laser processing power value is within a preset power range; an adjustment module 500, configured to adjust the parameters of the laser processing device when the laser processing power value is not within the preset power range, and return to the step of acquiring the laser processing power value; so as to keep the laser power used for processing within the preset power range and ensure the long-term stable operation of the laser processing system.

[0093] In one embodiment, the processing parameters include the processing times interval, the working time interval, whether it is the first processing of a specific part number, and whether it is the first processing after modifying the preset power range; the power monitoring condition includes that the processing times interval reaches the set number of times, the working time interval reaches the set time, the first processing of a specific part number or the first processing after modifying the preset power range.

[0094] In one embodiment, the adjustment module 500 is further configured to keep the current laser processing device parameters unchanged when the laser processing power value is within the preset power range.

[0095] In one embodiment, the adjustment module 500 is specifically configured to: when the laser processing power value is not within the preset power range, obtain the laser processing device parameters, and determine whether the laser processing device is a multi-axis processing device according to the laser processing device parameters; if the laser processing device is a multi-axis processing device, obtain the laser processing power values of each axis, and determine whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power values of each axis; if not, adjust the parameters of each axis so that the laser processing device meets the preset multi-axis balance condition; obtain the adjusted laser processing power value, and determine whether the adjusted laser processing power value is within the preset power range; if the adjusted laser processing power value is not within the preset power range, adjust the laser processing device parameters, and return to the step of obtaining the laser processing power value.

[0096] In one embodiment, the adjustment module 500 is further configured to: when the laser processing device meets the preset multi-axis balance condition, adjust the laser processing device parameters based on the laser processing power value, and return to the step of obtaining the laser processing power value.

[0097] In one embodiment, as Figure 5 shown, the automatic monitoring device of the laser processing system further includes: an alarm module 600, configured to output an alarm message when the laser processing power value is still not within the preset power range after a predetermined number of adjustments.

[0098] For the specific limitations of the automatic monitoring device of the laser processing system, reference may be made to the limitations of the automatic monitoring method of the laser processing system in the foregoing text, which will not be elaborated here. Each module in the above automatic monitoring device of the laser processing system can be implemented in whole or in part by software, hardware, and their combination. The above modules can be embedded in the processor of the computer device in hardware form or independent of it, or stored in the memory of the computer device in software form, so that the processor can call and execute the operations corresponding to the above respective modules.

[0099] In the third aspect of the present application, a computer device is provided. The computer device may be a terminal, and its internal structure diagram may be as Figure 6As shown in the figure. The computer device includes a processor, a memory, a communication interface, a display screen, and an input device connected by a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and computer programs. The internal memory provides an environment for the operation of the operating system and computer programs in the non-volatile storage medium. The communication interface of the computer device is used to communicate with external terminals in a wired or wireless manner, and the wireless manner can be implemented through WIFI, carrier network, NFC (Near Field Communication), or other technologies. When the computer program is executed by the processor, it realizes a servo system life test method. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer device can be a touch layer covered on the display screen, or a button, trackball, or touchpad set on the computer device housing, or an external keyboard, touchpad, or mouse, etc.

[0100] Those skilled in the art can understand that Figure 6 the structure shown in the figure is only a block diagram of some structures related to the solution of this application, and does not constitute a limitation on the computer device to which the solution of this application is applied. The specific computer device may include more or fewer components than those shown in the figure, or combine some components, or have different component arrangements.

[0101] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory, and when the processor executes the computer program, it realizes the steps in the above method embodiments.

[0102] In the fourth aspect of this application, a laser processing system is provided, including a laser processing device, a power detection device, and the above computer device; the computer device is connected to the laser processing device and the power detection device.

[0103] Among them, the laser processing device can be a single-axis processing device or a multi-axis processing device, and can also be a laser cutting device, a laser drilling device, or a laser welding device. The power detection device can be a photothermal type detection device or an optoelectronic type detection device. In one embodiment, the power detection device is a laser energy meter, and the laser processing power value is obtained by measuring the power of continuous laser or the average power of pulsed laser over a certain period of time. Further, the probe used for laser energy detection in the laser energy meter is fixed to the workbench surface through a connecting device. During the laser processing process, the probe does not affect the normal processing of the workpiece; when power measurement is required, the connecting device drives the probe to move so that the probe is located above the workbench surface to measure the laser power reaching the workbench surface.

[0104] Specifically, the laser processing device is used to provide a laser light source for processing the workpiece to be processed. The power detection device is used to measure the laser power, obtain the laser processing power value and send it to the computer device. The computer device automatically monitors the laser power during the workpiece processing to keep the laser power used for processing within the preset power range, ensuring the long-term stable operation of the laser processing system and guaranteeing the processing quality of the processed workpiece.

[0105] For the above laser processing system, on the one hand, without human participation, the computer device automatically detects and adjusts the laser power, which not only helps to reduce labor costs, but also enables continuous and stable processing of the equipment, guarantees the processing quality of the equipment under automation conditions, lays a foundation for improving the reliability of laser processing products and exploring unmanned automated factories; on the other hand, completing the control of the laser power during the processing is equivalent to providing a pre-control method, which can achieve long-term stable production of the laser processing system, improve the processing quality and reduce the scrap rate. The above two aspects are both conducive to reducing the production cost of end customers.

[0106] In one embodiment, the laser processing device includes a laser, an optical path system and a galvanometer system; the initial laser emitted by the laser passes through the optical path system and the galvanometer system in sequence and then reaches the workbench surface.

[0107] Among them, the laser can be a solid-state laser, a CO2 gas laser or a fiber laser, which is used to provide the initial laser. The optical path system includes devices such as beam expanders, mirrors, beam splitters, etc., which are used to direct the initial laser to the required direction. The galvanometer system includes a driving device, a motor and a lens, which are used to achieve the focusing and deflection of the laser beam, so that the laser focus moves on the workpiece to be processed according to the required requirements.

[0108] Specifically, the initial laser emitted by the laser passes through the optical path system and the galvanometer system in sequence and then reaches the workbench surface, forming a laser focus with a certain power density. Further, in one embodiment, the power detection device is used to measure the laser power reaching the workbench surface to ensure the accuracy of the laser processing power value.

[0109] In the above embodiment, it is equivalent to providing a galvanometer-type laser processing system, which is beneficial to improving the scanning speed and repeat positioning accuracy of the processing system, and thus improving the processing quality.

[0110] For ease of understanding, the following combines Figure 7 and Figure 8 , and details the laser processing system and its automatic monitoring method involved in the present application. The laser processing system includes a laser processing device, a power detection device and a computer device. Among them, as Figure 7As shown in the figure, the laser processing device includes a laser 1, an optical path system 2, and a galvanometer system 3. The galvanometer system 3 includes a focusing module, and the power detection device is a power meter 4 including a monitoring probe. The initial laser emitted by the laser 1 passes through the optical path system 2 and the galvanometer system 3 in sequence, and then reaches the workbench surface 5, forming a laser focus with a certain power density. The power meter 4 is used to measure the laser power on the optical path between the galvanometer system 3 and the workbench surface 5.

[0111] Further, taking the laser cutting system as an example, the main parameters of the laser processing device are laser power, cutting speed, cutting times, etc. Laser power represents the energy output by the laser. If the energy is too large, the cutting quality will decline (bringing negative effects such as carbonization, blackening, and widened line width), and if the energy is too small, the workpiece to be processed cannot be cut through, resulting in product scrapping. Therefore, it is necessary to control the laser power of the laser processing device to ensure the stability of the laser power.

[0112] Specifically, before batch laser processing, first conduct first-piece verification and adjust the parameters of the laser processing device, including laser power. In this embodiment, the goal of automatic monitoring is to maintain the laser power during processing to be the same as that during the first-piece test, ensuring long-term processing stability. Further, laser power generally has two representation forms. One is a percentage, specifically referring to the percentage of the rated power of the laser, and the other is a direct numerical expression with the unit W. In this embodiment, the direct numerical expression is adopted, which is more simple and clear.

[0113] The operation steps of this system are as follows:

[0114] Verify the first piece of the product, debug the laser parameters, including relevant parameters such as laser power P1, cutting speed, and cutting times, and save these parameters into the computer system as subsequent mass production parameters.

[0115] Enter the mass production stage. During the first processing, the power meter 4 automatically measures the laser power P2 reaching the tabletop and compares it with the parameter (laser power) saved in the first piece in the first step to determine whether P2 satisfies 95% * P1 ≤ P2 ≤ 105% * P1. If this condition is not met, the computer device automatically adjusts the parameters of the laser processing device to make P2 satisfy 95% * P1 ≤ P2 ≤ 105% * P1. If after a preset number of adjustments, P2 still cannot meet the above conditions, the computer device will give an alarm, prompting the operator that the laser power is abnormal.

[0116] Further, the other three conditions for triggering power monitoring are: reaching the set processing times interval, exceeding the set laser working time interval, and modifying the target power P1. It can be understood that when any of the above conditions is met, laser power monitoring is carried out.

[0117] In addition, if the laser processing device is a multi-axis processing equipment, when the constraint condition of 95% * P1 ≤ P2 ≤ 105% * P1 is not satisfied, the balance detection of the multi-axis power is first performed to ensure that the system meets the multi-axis power balance. Specifically, the balance condition is that the tolerance ≤ 2%.

[0118] For the above laser processing system, on the one hand, without human participation, the computer device automatically detects and adjusts the laser power, which not only helps to reduce the labor cost, but also enables the continuous and stable processing of the equipment, ensuring the processing quality of the equipment in the automated situation, laying a foundation for improving the reliability of laser processing products and exploring unmanned automated factories; on the other hand, the control of the laser power is completed during the processing, which is equivalent to providing a pre-control method, which can realize the long-term stable production of the laser processing equipment, improve the processing quality and reduce the scrap rate. The above two aspects are both beneficial to reducing the production cost of end customers.

[0119] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0120] The above embodiments only represent several implementation manners of the present application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. An automatic monitoring method for a laser processing system, characterized in that, Including: When the laser processing system is in the processing state, obtain processing parameters, and determine whether the power monitoring condition is met according to the processing parameters; If so, obtain the laser processing power value, where the laser processing power value is the laser power reaching the processing table; Determine whether the laser processing power value is within a preset power range; If the laser processing power value is not within the preset power range, obtain the laser processing device parameters, and determine whether the laser processing device is a multi-axis processing device according to the laser processing device parameters; If the laser processing device is a multi-axis processing device, obtain the laser processing power values of each axis, and determine whether the laser processing device meets the preset multi-axis balance condition according to the laser processing power values of each axis; If the laser processing device does not meet the preset multi-axis balance condition, adjust the parameters of each axis so that the laser processing device meets the preset multi-axis balance condition; Obtain the adjusted laser processing power value, and determine whether the adjusted laser processing power value is within the preset power range; If the adjusted laser processing power value is not within the preset power range, adjust the laser processing device parameters, and return to the step of obtaining the laser processing power value.

2. The automatic monitoring method of the laser processing system according to claim 1, wherein After determining whether the laser processing power value is within the preset power range, the method further includes: If the laser processing power value is within the preset power range, keep the current laser processing device parameters unchanged.

3. The automatic monitoring method of the laser processing system according to claim 1, characterized in that, After determining whether the laser processing device meets the preset multi-axis balance condition by obtaining the laser processing power values of each axis if the laser processing device is a multi-axis processing device, it further includes: If the laser processing device meets the preset multi-axis balance condition, adjust the laser processing device parameters based on the laser processing power value, and return to the step of obtaining the laser processing power value.

4. The automatic monitoring method of a laser processing system according to any one of claims 1 to 3, characterized in that, The processing parameters include the processing time interval, the working time interval, whether it is the first processing of a specific part number, and whether it is the first processing after modifying the preset power range; the power monitoring condition includes that the processing time interval reaches the set number of times, the working time interval reaches the set time, the first processing of a specific part number or the first processing after modifying the preset power range.

5. The automatic monitoring method of the laser processing system according to any one of claims 1 to 3, characterized in that, After the step of adjusting the laser processing device parameters and returning to the step of obtaining the laser processing power value if the laser processing power value is not within the preset power range, the method further includes: After a predetermined number of adjustment times, if the laser processing power value is still not within the preset power range, output an alarm message.

6. An automatic monitoring device for a laser processing system, characterized in that, Including: A processing parameter acquisition module, configured to obtain processing parameters when the laser processing system is in the processing state, and determine whether the power monitoring condition is met according to the processing parameters; A laser processing power value acquisition module, configured to obtain the laser processing power value when the power monitoring condition is met; the laser processing power value is the laser power reaching the processing table; A judgment module, configured to judge whether the laser processing power value is within the preset power range; An adjustment module is configured to, if the laser processing power value is not within a preset power range, obtain laser processing device parameters, and determine whether the laser processing device is a multi-axis processing device according to the laser processing device parameters; if the laser processing device is a multi-axis processing device, obtain the laser processing power values of each axis, and determine whether the laser processing device meets a preset multi-axis balance condition according to the laser processing power values of each axis; if the laser processing device does not meet the preset multi-axis balance condition, adjust the parameters of each axis so that the laser processing device meets the preset multi-axis balance condition; obtain the adjusted laser processing power value, and determine whether the adjusted laser processing power value is within the preset power range; if the adjusted laser processing power value is not within the preset power range, adjust the laser processing device parameters, and return to the step of obtaining the laser processing power value.

7. A computer device, comprising a processor and a memory, the memory storing a computer program, characterized in that, When the computer program is executed by the processor, the processor is caused to execute the steps of the method according to any one of claims 1 to 5.

8. A laser processing system, characterized in that, It includes a laser processing device, a power detection device, and the computer device according to claim 7; the computer device is connected to the laser processing device and the power detection device.

9. The laser processing system according to claim 8, wherein, The laser processing device includes a laser, an optical path system, and a galvanometer system; the initial laser emitted by the laser passes through the optical path system and the galvanometer system in sequence and then reaches the workbench surface.

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