Metal reinforcing plate, lens module and manufacturing method

Abstract

This application provides a method for manufacturing a metal reinforcing plate for a lens module circuit board, comprising the following steps: providing a metal sheet; forming a groove in the metal sheet to form a boss; forming a photosensitive film on the surface of the metal sheet where the groove is located; exposing the photosensitive film located in the boss and the groove to obtain a photosensitive intermediate; developing the photosensitive intermediate to obtain a patterned photosensitive film; etching the metal sheet through the patterned photosensitive film to form a support; and removing the patterned photosensitive film to obtain the metal reinforcing plate. This application can reduce contamination caused by adhesive layer flow and improve the flatness of the circuit board. This application also provides a metal reinforcing plate for a lens module circuit board manufactured by the method described above. This application also provides a method for manufacturing a lens module including the metal reinforcing plate. This application also provides a lens module manufactured by the method described above.

Description

Technical Field

[0001] This application relates to the field of electronic and optical device technology, and in particular to a metal reinforcing plate for a lens module circuit board and a method for manufacturing the same, as well as a lens module including the metal reinforcing plate and a method for manufacturing the same. Background Technology

[0002] Currently, lens modules typically include a circuit board and a metal reinforcing plate. To achieve a thinner lens module, the circuit board is usually thinned through and cut, with the corresponding area pressed against the metal reinforcing plate, and the image sensor is assembled on the metal reinforcing plate. To prevent the adhesive layer attached to the metal reinforcing plate from overflowing during the pressing process with the circuit board, causing surface contamination and attracting environmental foreign matter, the adhesive layer on the metal reinforcing plate undergoes an inward shrinkage process. The current industry problem is that during the pressing process between the metal reinforcing plate and the circuit board, the adhesive layer attached to the metal reinforcing plate flows under pressure and fills the inward shrinkage area. The corresponding cut edges of the circuit board lose support due to the flow of the adhesive layer at the bottom, resulting in localized collapse and reduced flatness of the circuit board. Furthermore, since this area is also involved in the subsequent assembly of lens elements, it also affects the yield rate of the lens module and its actual fine focusing capability. Summary of the Invention

[0003] In view of this, this application provides a method for manufacturing a metal reinforcing plate for a lens module circuit board that can reduce contamination caused by adhesive layer flow and improve the flatness of the circuit board.

[0004] In addition, it is necessary to provide a metal reinforcing plate for a lens module circuit board manufactured by the above-described method.

[0005] Additionally, it is necessary to provide a method for manufacturing a lens module including the aforementioned metal reinforcing plate.

[0006] In addition, it is necessary to provide a lens module including the aforementioned metal reinforcing plate, which is manufactured by the above-described method.

[0007] The first embodiment of this application provides a method for manufacturing a metal reinforcing plate for a lens module circuit board, comprising the following steps:

[0008] Provide metal sheets;

[0009] A groove is formed in the metal sheet to create a boss, and the groove is arranged around the boss;

[0010] A photosensitive film is formed on the surface of the metal sheet where the groove is provided, and the photosensitive film also fills the groove;

[0011] The photosensitive film located in the protrusion and the groove is exposed to obtain a photosensitive intermediate;

[0012] The photosensitive intermediate is developed to obtain a patterned photosensitive film;

[0013] The metal sheet is etched using the patterned photosensitive film to form a support, and the support is disposed around the groove; and

[0014] The patterned photosensitive film is removed to obtain the metal reinforcing plate.

[0015] The first embodiment of this application also provides a metal reinforcing plate for a lens module circuit board. The metal reinforcing plate has a groove, a boss and a support body. The groove is arranged around the boss and the support body is arranged around the groove.

[0016] The second embodiment of this application provides a method for manufacturing a lens module including the aforementioned metal reinforcing plate, comprising the following steps:

[0017] Provide circuit boards;

[0018] A first through hole and an opening are formed in the circuit board, and the first through hole is connected to the opening. The area of ​​the circuit board corresponding to the opening is a thinning area.

[0019] An adhesive layer is provided, wherein the adhesive layer has a second through hole;

[0020] The metal reinforcing plate, the adhesive layer, and the circuit board are stacked in sequence, with the adhesive layer located in the opening, the first through hole corresponding to the second through hole, and the boss and the support body located in the second through hole. The positions of the support body and the adhesive layer are both corresponding to the thinning area, and the end of the support body adjacent to the thinning area abuts against the thinning area.

[0021] The metal reinforcing plate, the adhesive layer, and the circuit board are pressed together so that the circuit board and the metal reinforcing plate are bonded together by the adhesive layer;

[0022] A photosensitive chip is disposed on the protrusion and positioned within the first through-hole; and

[0023] A lens is placed on the circuit board and the lens and the photosensitive chip are aligned to obtain the lens module.

[0024] The second embodiment of this application also provides a lens module including the aforementioned metal reinforcing plate, further comprising:

[0025] A circuit board having a first through hole and an opening, wherein the first through hole communicates with the opening, and the area of ​​the circuit board corresponding to the opening is a thinning area;

[0026] An adhesive layer, wherein a second through hole is provided in the adhesive layer;

[0027] The metal reinforcing plate, the adhesive layer, and the circuit board are stacked sequentially. The adhesive layer is located in the opening, and the first through hole corresponds to the second through hole. The boss and the support are located in the second through hole. The positions of the support and the adhesive layer are both corresponding to the thinning area, and the end of the support near the thinning area abuts against the thinning area.

[0028] A photosensitive chip, the photosensitive chip being located on the protrusion and within the first through-hole; and

[0029] A lens is located on the circuit board, and the lens is opposite to the photosensitive chip.

[0030] This application creates the groove in the metal sheet to form the boss, and etches the metal sheet to form the support. The support can reduce contamination caused by adhesive layer flow and support the circuit board, reducing the probability of circuit board collapse and improving the flatness of the circuit board, thereby improving the yield of the lens module and the actual fine focusing capability. Attached Figure Description

[0031] Figure 1 This is a cross-sectional schematic diagram of the metal sheet provided in the first embodiment of this application.

[0032] Figure 2 Is Figure 1 The diagram shows a cross-sectional view of the metal sheet after a protective layer has been formed.

[0033] Figure 3 Is Figure 2 The diagram shows a cross-sectional view of the metal sheet after a groove has been created.

[0034] Figure 4 Is Figure 2 The diagram shows a top view of the metal sheet after grooves have been cut into it.

[0035] Figure 5 Is Figure 3 The diagram shows a cross-sectional view of the metal sheet and the groove after the photosensitive film has been formed.

[0036] Figure 6 It is Figure 5 The diagram shows a cross-sectional view of the photosensitive film after exposure.

[0037] Figure 7 It is Figure 6 The diagram shows a cross-sectional view of the photosensitive intermediate after development.

[0038] Figure 8This is a schematic cross-sectional view of the metal sheet shown in Figure 7 after etching.

[0039] Figure 9 This is a top view of the metal sheet shown in Figure 7 after it has been etched.

[0040] Figure 10 It is Figure 8 The diagram shows a cross-sectional view after the removal of the graphic photosensitive film.

[0041] Figure 11 It is Figure 8 The diagram shown is a top view of the image after the graphic photosensitive film has been removed.

[0042] Figure 12 It is Figure 10 The diagram shows a cross-sectional view of the metal reinforcing plate obtained after the protective layer has been removed.

[0043] Figure 13 This is a cross-sectional schematic diagram of the circuit board provided in the second embodiment of this application.

[0044] Figure 14 Is Figure 13 The diagram shows a cross-sectional view of the circuit board after the first through hole is opened.

[0045] Figure 15 This is a cross-sectional schematic diagram of the adhesive layer provided in the second embodiment of this application.

[0046] Figure 16 It is Figure 12 The metal reinforcing plate shown Figure 15 The adhesive layer shown and Figure 14 The diagram shows a cross-sectional view of the circuit boards after they have been stacked and pressed together.

[0047] Figure 17 Is Figure 16 The diagram shows a cross-sectional view of a lens module with a photosensitive chip mounted on the protrusion and a lens mount, voice coil motor, and lens sequentially mounted on the circuit board.

[0048] Explanation of main component symbols

[0049] Metal reinforcing plate 100

[0050] Metal sheet 10

[0051] Groove 11

[0052] First groove portion 111

[0053] Second groove portion 112

[0054] Third groove 113

[0055] Fourth groove 114

[0056] 12 convex surfaces

[0057] Protective layer 20

[0058] Photosensitive film 30

[0059] Photosensitive intermediate 31

[0060] Graphical photosensitive film 32

[0061] Support 40

[0062] First support section 401

[0063] Second support section 402

[0064] Third Support Section 403

[0065] Fourth Support Section 404

[0066] Lens Module 200

[0067] Circuit board 210

[0068] First through hole 2101

[0069] Opening 2102

[0070] Thinning zone 211

[0071] Adhesive layer 220

[0072] Second through hole 2201

[0073] Image sensor 230

[0074] Mirror base 240

[0075] 250 voice coil motor

[0076] Lens 260

[0077] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0078] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0079] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0080] To further illustrate the technical means and effects adopted by this application in achieving its intended purpose, the following detailed description of this application is provided in conjunction with the accompanying drawings and preferred embodiments.

[0081] The first embodiment of this application provides a method for manufacturing a metal reinforcing plate for a lens module circuit board, comprising the following steps:

[0082] Step S11, please refer to Figure 1 10 metal sheets are provided.

[0083] In this embodiment, the metal sheet 10 may be made of copper. In other embodiments, the metal sheet 10 may also be made of stainless steel.

[0084] Step S12, please refer to Figure 2 A protective layer 20 is formed on one of the surfaces of the metal sheet 10.

[0085] In this embodiment, the protective layer 20 may be a polyethylene terephthalate (PET) film. The protective layer 20 is used to protect the surface of the metal sheet 10 from damage during subsequent processing.

[0086] Step S13, please refer to Figure 3 and Figure 4 A groove 11 is formed in the metal sheet 10 to form a boss 12, and the groove 11 is arranged around the boss 12.

[0087] The groove 11 and the protective layer 20 are located on different surfaces of the metal sheet 10, and the groove 11 does not penetrate the metal sheet 10.

[0088] In this embodiment, the groove 11 includes a first groove portion 111, a second groove portion 112, a third groove portion 113, and a fourth groove portion 114 connected in sequence. The first groove portion 111 and the third groove portion 113 are opposite to and parallel to each other, and the second groove portion 112 and the fourth groove portion 114 are opposite to and parallel to each other.

[0089] In this embodiment, the longitudinal sections of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 along the thickness direction of the metal sheet 10 can all be rectangular. In other embodiments, the longitudinal sections of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 along the thickness direction of the metal sheet 10 can also be inverted trapezoidal.

[0090] The dimensions (such as depth, lateral length, and width) of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 can be changed as needed.

[0091] Step S14, please refer to Figure 5 A photosensitive film 30 is formed on the surface of the metal sheet 10 where the groove 11 is provided, and the photosensitive film 30 also fills the groove 11.

[0092] Specifically, photosensitive ink can be printed on the surface of the metal sheet 10 where the groove 11 is provided, and during the printing of the photosensitive ink, the photosensitive ink also fills the groove 11, and after baking, the photosensitive film 30 is formed.

[0093] In one embodiment, the baking temperature may be 75°C and the baking time may be 30 minutes.

[0094] Step S15, please refer to Figure 6 The photosensitive film 30 located in the protrusion 12 and the groove 11 is exposed to obtain the photosensitive intermediate 31.

[0095] That is, selective exposure is performed on the photosensitive film 30. During exposure, the photosensitive film 30 located in the protrusion 12 and the groove 11 polymerizes and solidifies under the action of ultraviolet light, while another part of the photosensitive film 30 does not undergo polymerization reaction (i.e., does not solidify) because it is not exposed to ultraviolet light.

[0096] Step S16, please refer to Figure 7 The photosensitive intermediate 31 is developed to obtain a patterned photosensitive film 32.

[0097] Specifically, the photosensitive intermediate 31, except for those on the protrusion 12 and in the groove 11, is removed by developing solution, that is, the uncured photosensitive film 30 is removed.

[0098] In this embodiment, the developing solution may be sodium hydroxide solution.

[0099] Step S17, please refer to Figure 8 and Figure 9The metal sheet 10 is etched by the patterned photosensitive film 32 to form a support 40, and the support 40 is arranged around the groove 11.

[0100] In this embodiment, the support body 40 includes a first support portion 401, a second support portion 402, a third support portion 403, and a fourth support portion 404 connected in sequence. In this embodiment, the side of the first support portion 401 away from the first groove portion 111 is a rounded corner surface, the side of the second support portion 402 away from the second groove portion 112 is a rounded corner surface, the side of the third support portion 403 away from the third groove portion 113 is a rounded corner surface, and the side of the fourth support portion 404 away from the fourth groove portion 114 is a rounded corner surface.

[0101] Step S18, please refer to Figure 10 and Figure 11 Remove the patterned photosensitive film 32.

[0102] like Figure 11 As shown, the two sides of the groove 11 are the boss 12 and the support 40, respectively, that is, the boss 12 and the support 40 together form the groove 11.

[0103] Step S19, please refer to Figure 12 Remove the protective layer 20 to obtain the metal reinforcing plate 100.

[0104] Please see Figure 12 The first embodiment of this application also provides a metal reinforcing plate 100 for a lens module circuit board.

[0105] In this embodiment, the metal sheet 10 may be made of copper. In other embodiments, the metal sheet 10 may also be made of stainless steel.

[0106] The metal reinforcing plate 100 has a groove 11 and a boss 12, and the groove 11 is arranged around the boss 12. The groove 11 does not penetrate the metal reinforcing plate 100.

[0107] In this embodiment, the groove 11 includes a first groove portion 111, a second groove portion 112, a third groove portion 113, and a fourth groove portion 114 connected in sequence. The first groove portion 111 and the third groove portion 113 are opposite to and parallel to each other, and the second groove portion 112 and the fourth groove portion 114 are opposite to and parallel to each other.

[0108] In this embodiment, the longitudinal sections of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 along the thickness direction of the metal reinforcing plate 100 can all be rectangular. In other embodiments, the longitudinal sections of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 along the thickness direction of the metal reinforcing plate 100 can also be inverted trapezoidal.

[0109] The dimensions (such as depth, lateral length, and width) of the first groove 111, the second groove 112, the third groove 113, and the fourth groove 114 can be changed as needed.

[0110] The metal reinforcing plate 100 includes a support body 40, which surrounds the groove 11. In this embodiment, the support body 40 includes a first support portion 401, a second support portion 402, a third support portion 403, and a fourth support portion 404 connected in sequence. In this embodiment, the side of the first support portion 401 away from the first groove 111 is a rounded corner surface, the side of the second support portion 402 away from the second groove 112 is a rounded corner surface, the side of the third support portion 403 away from the third groove 113 is a rounded corner surface, and the side of the fourth support portion 404 away from the fourth groove 114 is a rounded corner surface.

[0111] like Figure 12 As shown, the two sides of the groove 11 are the boss 12 and the support 40, respectively, that is, the boss 12 and the support 40 together form the groove 11.

[0112] The second embodiment of this application provides a method for manufacturing a lens module including the above-described metal reinforcing plate 100, comprising the following steps:

[0113] For step S20, please refer to... Figure 13 Circuit board 210 is provided.

[0114] Step S21, please refer to Figure 14 A first through hole 2101 and an opening 2102 are formed in the circuit board 210, and the first through hole 2101 is connected to the opening 2102.

[0115] Along the direction extending from the circuit board 210, the area of ​​the opening 2102 is larger than the area of ​​the first through hole 2101. Along the thickness direction of the circuit board 210, the projection of the first through hole 2101 falls within the projection of the opening 2102.

[0116] The area corresponding to the opening 2102 on the circuit board 210 is the thinning area 211.

[0117] In this embodiment, both the first through hole 2101 and the opening 2102 can be formed by laser cutting or mechanical cutting.

[0118] Step S22, please refer to Figure 15 Provides adhesive layer 220.

[0119] The adhesive layer 220 has a second through hole 2201, which penetrates the adhesive layer 220.

[0120] Step S23, please refer to Figure 16 The metal reinforcing plate 100, the adhesive layer 220 and the circuit board 210 are stacked in sequence, such that the adhesive layer 220 is located in the opening 2102, the first through hole 2101 corresponds to the second through hole 2201, and the boss 12 and the support body 40 are both located in the second through hole 2201.

[0121] The positions of the support 40 and the adhesive layer 220 are both corresponding to the thinning region 211, and the end of the support 40 adjacent to the thinning region 211 abuts against the thinning region 211.

[0122] Step S24: Press the metal reinforcing plate 100, the adhesive layer 220 and the circuit board 210 together so that the circuit board 210 and the metal reinforcing plate 100 are bonded together by the adhesive layer 220.

[0123] Step S25, please refer to Figure 17 A photosensitive chip 230 is disposed on the protrusion 12 and the photosensitive chip 230 is located in the first through hole 2101.

[0124] Step S26: A lens mount 240, a voice coil motor 250, and multiple lenses 260 are sequentially arranged on the circuit board 210 to obtain the lens module 200.

[0125] The lens 260 is disposed opposite to the photosensitive chip 230. In this embodiment, part of the lens 260 is located inside the voice coil motor 250, and part of the lens 260 is located outside the voice coil motor 250.

[0126] Please see Figure 17 The second embodiment of this application also provides a lens module 200 including the metal reinforcing plate 100. The lens module 200 further includes a circuit board 210, an adhesive layer 220, a photosensitive chip 230, a lens mount 240, a voice coil motor 250, and a plurality of lenses 260.

[0127] The circuit board 210 has a first through hole 2101 and an opening 2102, and the first through hole 2101 communicates with the opening 2102. Along the direction in which the circuit board 210 extends, the area of ​​the opening 2102 is larger than the area of ​​the first through hole 2101. Along the thickness direction of the circuit board 210, the projection of the first through hole 2101 falls within the projection of the opening 2102. The region of the circuit board 210 corresponding to the opening 2102 is a thinning region 211.

[0128] The adhesive layer 220 has a second through hole 2201. The second through hole 2201 penetrates the adhesive layer 220.

[0129] The metal reinforcing plate 100, the adhesive layer 220, and the circuit board 210 are stacked sequentially. The adhesive layer 220 is located in the opening 2102, and the first through hole 2101 corresponds to the second through hole 2201. The boss 12 and the support body 40 are both located in the second through hole 2201. The positions of the support body 40 and the adhesive layer 220 are both corresponding to the thinning region 211, and the end of the support body 40 adjacent to the thinning region 211 abuts against the thinning region 211.

[0130] The photosensitive chip 230 is located on the boss 12 and is located in the first through hole 2101.

[0131] The lens mount 240, the voice coil motor 250, and the plurality of lenses 260 are sequentially located on the circuit board 210. The lenses 260 are disposed opposite to the photosensitive chip 230. In this embodiment, some of the lenses 260 are located inside the voice coil motor 250, and some are located outside the voice coil motor 250.

[0132] This application creates the groove 11 in the metal sheet 10 to form the boss 12, and etches the metal sheet 10 to form the support 40. The support 40 can reduce contamination caused by the flow of the adhesive layer 220 and can support the circuit board 210, reducing the probability of the circuit board 210 collapsing and improving the flatness of the circuit board 210, thereby improving the yield and actual fine focusing capability of the lens module 200.

[0133] This application also determines the external dimensions of the boss 12 by cutting the groove 11. Compared with the prior art, which forms the boss by etching rounded corners, this application can reduce the dimensional errors caused by etching, thereby facilitating the precision manufacturing of the metal reinforcing plate 100. In addition, the manufacturing method of this application is simple.

[0134] The above description is merely an optimized implementation of this application, but in actual applications, it should not be limited to this implementation.

Claims

1. A method for manufacturing a metal reinforcing plate for a lens module circuit board, characterized by, The method comprises the following steps: providing a metal sheet; opening a groove in the metal sheet to form a boss, and the groove is arranged around the boss; forming a photosensitive film on the surface of the metal sheet provided with the groove, and the photosensitive film also fills in the groove; exposing the photosensitive film in the boss and the groove to obtain a photosensitive intermediate; developing the photosensitive intermediate to remove the photosensitive film outside the boss and the groove to obtain a patterned photosensitive film; etching the metal sheet not covered by the patterned photosensitive film to form a support, and the support is arranged around the groove, and the surface of the support away from the groove is a rounded surface; and removing the patterned photosensitive film to obtain the metal reinforcing plate; wherein the lens module comprises a circuit board, an adhesive layer and a photosensitive chip, the circuit board is provided with a first through hole and an opening, and the first through hole is in communication with the opening, the area of the circuit board corresponding to the opening is a thinned area; the adhesive layer is provided with a second through hole, the first through hole corresponds to the second through hole, the boss and the support are located in the second through hole, the positions of the support and the adhesive layer both correspond to the thinned area, and one end of the support adjacent to the thinned area abuts against the thinned area, and the boss is used for arranging the photosensitive chip and the photosensitive chip is located in the first through hole.

2. The method of manufacturing a metal reinforcing plate according to claim 1, wherein The groove comprises a first groove part, a second groove part, a third groove part and a fourth groove part connected in sequence, and the support comprises a first support part, a second support part, a third support part and a fourth support part connected in sequence.

3. The method of manufacturing a metal reinforcing plate according to claim 2, wherein The side surface of the first support part away from the first groove part is a rounded surface, the side surface of the second support part away from the second groove part is a rounded surface, the side surface of the third support part away from the third groove part is a rounded surface, and the side surface of the fourth support part away from the fourth groove part is a rounded surface.

4. A metal reinforcing plate for a lens module circuit board, characterized by, The metal reinforcing plate is made by the manufacturing method of any one of claims 1 to 3, the metal reinforcing plate is provided with a groove, a boss and a support, the groove is arranged around the boss, and the support is arranged around the groove.

5. A method of manufacturing a lens module including the metal reinforcing plate according to claim 4, characterized by, The method comprises the following steps: providing a circuit board; opening a first through hole and an opening in the circuit board, and the first through hole is in communication with the opening, and the area of the circuit board corresponding to the opening is a thinned area; providing an adhesive layer, and the adhesive layer is provided with a second through hole; stacking the metal reinforcing plate, the adhesive layer and the circuit board in sequence, and the adhesive layer is located in the opening, the first through hole corresponds to the second through hole, the boss and the support are located in the second through hole, the positions of the support and the adhesive layer both correspond to the thinned area, and one end of the support adjacent to the thinned area abuts against the thinned area; pressing the metal reinforcing plate, the adhesive layer and the circuit board to bond the circuit board and the metal reinforcing plate through the adhesive layer; arranging a photosensitive chip on the boss, and the photosensitive chip is located in the first through hole; and ​ The lens is arranged on the circuit board, and the lens and the photosensitive chip are opposite, so that the lens module is obtained.

6. The manufacturing method of lens module according to claim 5, wherein, After the photosensitive chip is arranged on the boss, the manufacturing method further comprises: arranging a lens seat on the circuit board; and arranging a voice coil motor on the lens seat; Part of the lenses are arranged in the voice coil motor.

7. A lens module comprising the metal reinforcing plate according to claim 4, characterized by Further comprising: a circuit board, wherein a first through hole and an opening are arranged in the circuit board, and the first through hole and the opening are in communication, and a region corresponding to the opening in the circuit board is a thinned region; a glue layer, wherein a second through hole is arranged in the glue layer; wherein the metal reinforcing plate, the glue layer and the circuit board are sequentially stacked, the glue layer is located in the opening, the first through hole corresponds to the second through hole, the boss and the support are located in the second through hole, the positions of the support and the glue layer correspond to the thinned region, and one end of the support adjacent to the thinned region abuts against the thinned region; a photosensitive chip, wherein the photosensitive chip is located on the boss and in the first through hole; and a lens, wherein the lens is located on the circuit board, and the lens and the photosensitive chip are opposite. 8.The lens module of claim 7, wherein, Further comprising: a lens seat located on the circuit board; and a voice coil motor located on the lens seat; Part of the lenses are arranged in the voice coil motor. ​

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