A method, device and storage medium for confirming a photolithography process window
By automatically acquiring and updating the lithography process window through the APC system, the problem of subjective judgment error by engineers is solved, enabling rapid and accurate confirmation of the lithography process window and supporting the rapid introduction of new processes and new products.
Patent Information
- Application Number
- CN202211704129.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2022-12-28
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2042-12-28
AI Technical Summary
The existing confirmation mechanism for photolithography process windows relies on the subjective judgment of engineers, which is prone to error and makes it difficult to quickly adapt to new processes and products, leading to potential risks to chip manufacturing quality.
An advanced process control system (APC system) is used to automatically acquire measurement data. By filtering, comparing and plotting Poisson curves, the photolithography process window can be automatically confirmed and updated, reducing human error and improving production efficiency.
It reduces human error in engineers' judgments, improves the accuracy and speed of confirming the lithography process window, and supports the rapid introduction of new processes and products.
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Figure CN115981110B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of photolithography technology, and in particular to a method for confirming a photolithography process window, a device for confirming a photolithography process window, a device for confirming a photolithography process window, and a computer-readable storage medium. Background Technology
[0002] Setting the photolithography process parameters is a primary responsibility of engineers to provide the linewidth (CD, critical dimension) required for integrated circuit manufacturing processes. Currently, the process for determining photolithography process parameters is as follows: Energy, focus, and step size are set in the photolithography machine's exposure conditions to obtain patterns under different energy-focus conditions. The corresponding linewidth data is then obtained using a scanning electron microscope (CDSEM). Based on the distribution of the obtained CDSEM measurement data and the exposure conditions, a Poisson curve is plotted. The optimal process parameters are then determined by combining the edge smoothness and trench depth uniformity of the corresponding images.
[0003] Currently, lithography process windows are determined manually by engineers processing exposure focus-energy matrix (FEM) data. This subjective judgment of optimal exposure conditions by engineers introduces inherent errors, posing potential safety hazards to chip manufacturing quality. Furthermore, existing process window confirmation mechanisms are insufficient to support the rapid adoption of new processes and products. Therefore, providing a technical solution that can automatically confirm and quickly implement lithography process windows is a problem urgently needing to be solved by those skilled in the art. Summary of the Invention
[0004] The purpose of this invention is to provide a method for confirming a lithography process window, which can automatically confirm and quickly import the lithography process window; another purpose of this invention is to provide a device for confirming a lithography process window, a device for confirming a lithography process window, and a computer-readable storage medium, which can automatically confirm and quickly import the lithography process window.
[0005] To address the aforementioned technical problems, this invention provides a method for confirming the photolithography process window, applied to an APC system, comprising:
[0006] Measurement data is acquired based on the APC system; the measurement data includes the lithography process parameters of the current batch, and the linewidth data formed after the corresponding lithography exposure;
[0007] Obtain the current batch's loading conditions, and filter the measurement data based on the current batch's loading conditions to obtain first filtered data; the loading conditions are the filtering conditions corresponding to the photolithography process parameters.
[0008] The line width data in the first filtered data is compared with the standard line width data, and the first filtered data is filtered according to the comparison results to obtain the second filtered data;
[0009] Plot a Poisson curve based on the second selected data;
[0010] Based on the automatic feedback mechanism of the APC system, the next batch's feed conditions are updated according to the Poisson curve to confirm the lithography process window.
[0011] Optionally, the photolithography process parameters include the energy, focal length, and step size set during the photolithography machine exposure operation.
[0012] Optionally, the linewidth data includes linewidth values and linewidth images.
[0013] Optionally, comparing the line width data in the first filtered data with the standard line width data includes:
[0014] Based on image recognition technology, the linewidth image is compared with a pre-stored standard linewidth image.
[0015] Optionally, the step of plotting the Poisson curve based on the second filtered data includes:
[0016] Based on the second screening data, a Poisson curve is plotted, and Poisson curves outside the specified range are removed.
[0017] Optionally, the acquisition of measurement data based on the APC system includes:
[0018] Measurement data is captured from the CDSEM instrument using the APC system.
[0019] Optionally, before the measurement data is captured from the CDSEM machine using the APC system, the following steps are also included:
[0020] Add a specific suffix to the name of the measurement formula so that the name of the generated measurement data inherits the specific suffix;
[0021] The measurement data captured from the CDSEM equipment using the APC system includes:
[0022] The measurement data is captured using the APC system based on the suffix of the data in the CDSEM instrument.
[0023] The present invention also provides a verification device for a photolithography process window, applied to an APC system, comprising:
[0024] The measurement data acquisition module is used to acquire measurement data based on the APC system; the measurement data includes the lithography process parameters of the current batch, and the linewidth data formed after the corresponding lithography exposure;
[0025] The batch passing condition acquisition module is used to acquire the batch passing conditions of the current batch and filter the measurement data according to the batch passing conditions of the current batch to obtain the first filtered data; the batch passing conditions are the filtering conditions corresponding to the photolithography process parameters.
[0026] The second filtering module is used to compare the line width data in the first filtering data with the standard line width data, and filter the first filtering data according to the comparison result to obtain the second filtering data;
[0027] The Poisson curve module is used to draw a Poisson curve based on the second filtered data;
[0028] The update module is used to update the feed conditions for the next batch based on the automatic feedback mechanism of the APC system, in order to confirm the lithography process window.
[0029] The present invention also provides a device for confirming the photolithography process window, comprising:
[0030] Memory, used to store computer programs;
[0031] A processor, configured to implement the steps of the photolithography process window confirmation method as described in any of the preceding embodiments when executing the computer program.
[0032] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements the steps of the photolithography process window confirmation method as described in any of the preceding claims.
[0033] The present invention provides a method for confirming a lithography process window, applied to an APC system, comprising: acquiring measurement data based on the APC system; the measurement data including the lithography process parameters of the current batch and the linewidth data formed after the corresponding lithography exposure; acquiring the throughput conditions of the current batch, and filtering the measurement data according to the throughput conditions of the current batch to obtain first filtered data; the throughput conditions are the filtering conditions of the corresponding lithography process parameters; comparing the linewidth data in the first filtered data with standard linewidth data, and filtering the first filtered data according to the comparison result to obtain second filtered data; plotting a Poisson curve based on the second filtered data; and updating the throughput conditions of the next batch according to the Poisson curve based on the automatic feedback mechanism of the APC system to confirm the lithography process window.
[0034] Based on the automatic feedback compensation mechanism of the advanced process control system, the lithography process window for the next batch is automatically generated according to the lithography data of the current batch, thereby reducing the error of human judgment by engineers and improving production efficiency.
[0035] The present invention also provides a photolithography process window confirmation device, a photolithography process window confirmation equipment, and a computer-readable storage medium, which have the same beneficial effects as described above, and will not be described in detail here. Attached Figure Description
[0036] To more clearly illustrate the technical solutions of the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0037] Figure 1 A process flow diagram of a photolithography process window confirmation method provided in an embodiment of the present invention;
[0038] Figure 2 A flowchart illustrating a specific method for confirming a photolithography process window, provided in an embodiment of the present invention;
[0039] Figure 3 A structural block diagram of a photolithography process window confirmation device provided in an embodiment of the present invention;
[0040] Figure 4 This is a structural block diagram of a photolithography process window verification device provided in an embodiment of the present invention. Detailed Implementation
[0041] The core of this invention is to provide a method for confirming the lithography process window. In the prior art, the lithography process window is currently determined manually by engineers through processing exposure focus-energy matrix (FEM) data. The subjective judgment of engineers regarding the optimal exposure conditions has a certain degree of error, posing potential safety hazards to chip manufacturing quality. In addition, the existing process window confirmation mechanism is insufficient to support the rapid introduction of new processes and products.
[0042] The present invention provides a method for confirming a lithography process window, applied to an APC system, comprising: acquiring measurement data based on the APC system; the measurement data including the lithography process parameters of the current batch and the linewidth data formed after the corresponding lithography exposure; acquiring the throughput conditions of the current batch, and filtering the measurement data according to the throughput conditions of the current batch to obtain first-filtered data; the throughput conditions are the filtering conditions of the corresponding lithography process parameters; comparing the linewidth data in the first-filtered data with standard linewidth data, and filtering the first-filtered data according to the comparison result to obtain second-filtered data; plotting a Poisson curve based on the second-filtered data; and updating the throughput conditions of the next batch according to the Poisson curve based on the automatic feedback mechanism of the APC system to confirm the lithography process window.
[0043] Based on the automatic feedback compensation mechanism of the advanced process control system, the lithography process window for the next batch is automatically generated according to the lithography data of the current batch, thereby reducing the error of human judgment by engineers and improving production efficiency.
[0044] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0045] Please refer to Figure 1 , Figure 1 This is a process flow diagram of a photolithography process window confirmation method provided in an embodiment of the present invention.
[0046] See Figure 1 In this embodiment of the invention, the method for confirming the photolithography process window includes:
[0047] S101: Acquire measurement data based on the APC system.
[0048] In this embodiment of the invention, the measurement data includes the lithography process parameters of the current batch and the linewidth data formed after the corresponding lithography exposure. The lithography process window confirmation method provided in this embodiment is specifically applied to an APC (Application Reference) system, i.e., an advanced process control system. Advanced process control (APC) is a general term for control strategies that differ from conventional single-loop control and have better control effects than conventional PID (Proportional Integral Derivative) control, rather than referring to a specific computer control algorithm. The task of advanced process control is to handle complex industrial process control problems where conventional control methods are ineffective or even impossible. In this embodiment of the invention, the confirmation of the lithography process window is specifically based on the automatic feedback compensation mechanism in the advanced process control system.
[0049] Specifically, in this step, measurement data is first acquired based on the APC system. This measurement data includes the lithography process parameters for the current batch and the linewidth data formed after the corresponding lithography exposure. That is, after the current batch undergoes exposure using the lithography machine, lithography process parameters corresponding to the specific parameters of the lithography machine are generated, along with the corresponding exposure results, i.e., the linewidth data formed after the lithography exposure. The aforementioned lithography process parameters typically include the energy, focus, and step size set during the lithography machine exposure operation. The corresponding linewidth data includes the linewidth values and linewidth images generated after exposure. The aforementioned lithography process parameters are usually the parameters set by the lithography machine, while the linewidth data is usually obtained by scanning the exposed sample using a scanning electron microscope (CDSEM).
[0050] S102: Obtain the current batch's transit conditions and filter the measurement data based on the current batch's transit conditions to obtain the first filtered data.
[0051] In this embodiment of the invention, the pass-through condition refers to the screening conditions corresponding to the lithography process parameters. Specifically, this pass-through condition corresponds to the screening conditions for the lithography process parameters in the current batch of data. In this step, the acquired measurement data is first screened according to this pass-through condition to obtain first-screened data, thus avoiding measurement data that does not meet the pass-through condition due to errors in the lithography machine itself. The pass-through condition for the current batch is specifically generated based on the measurement data of the previous batch. The specific value of this pass-through condition needs to be set according to the actual situation and is not specifically limited here. In subsequent processes of this embodiment of the invention, the pass-through condition corresponding to the next batch will be generated.
[0052] S103: Compare the line width data in the first filtered data with the standard line width data, and filter the first filtered data according to the comparison results to obtain the second filtered data.
[0053] Prior to this step, a database is typically established to store standard linewidth data. This standard linewidth data may include standard linewidth values and corresponding standard linewidth images. The specific type of this standard linewidth data must correspond to the linewidth data type obtained in S101 above. For example, if the linewidth data includes linewidth images, which are image type data, then the standard linewidth data must also include standard linewidth images of the image type.
[0054] In this step, the line width data in the first filtered data will be compared with the standard line width data. Based on the comparison result, the first filtered data will be further filtered to obtain the second filtered data.
[0055] S104: Plot the Poisson curve based on the second screening data.
[0056] In this step, a Poisson curve will be plotted based on the second screening data mentioned above. Specifically, this Poisson curve corresponds to the current batch of data.
[0057] S105: Based on the automatic feedback mechanism of the APC system, the next batch's feed conditions are updated according to the Poisson curve to confirm the lithography process window.
[0058] In this step, based on the automatic feedback mechanism of the APC system and the Poisson curve plotted using the current batch data, the feed conditions for the next batch are determined, i.e., the feed conditions are updated to confirm the lithography process window. When determining the feed conditions for the next batch based on the Poisson curve, the optimal process parameters can be obtained by comprehensively considering the edge smoothness and trench depth uniformity of the corresponding image.
[0059] This invention provides a method for confirming a lithography process window, applied to an APC system, comprising: acquiring measurement data based on the APC system; the measurement data including the lithography process parameters of the current batch and the linewidth data formed after the corresponding lithography exposure; acquiring the throughput conditions of the current batch, and filtering the measurement data according to the throughput conditions of the current batch to obtain first filtered data; the throughput conditions are the filtering conditions for the corresponding lithography process parameters; comparing the linewidth data in the first filtered data with standard linewidth data, and filtering the first filtered data according to the comparison result to obtain second filtered data; plotting a Poisson curve based on the second filtered data; and updating the throughput conditions of the next batch according to the Poisson curve based on the automatic feedback mechanism of the APC system to confirm the lithography process window.
[0060] Based on the automatic feedback compensation mechanism of the advanced process control system, the lithography process window for the next batch is automatically generated according to the lithography data of the current batch, thereby reducing the error of human judgment by engineers and improving production efficiency.
[0061] The specific details of the photolithography process window confirmation method provided by this invention will be described in detail in the following embodiments.
[0062] Please refer to Figure 2 , Figure 2 This is a flowchart illustrating a specific method for confirming a photolithography process window, as provided in an embodiment of the present invention.
[0063] See Figure 2 In this embodiment of the invention, the method for confirming the photolithography process window includes:
[0064] S201: Capture measurement data from the CDSEM machine based on the APC system.
[0065] In this step, measurement data needs to be captured from the scanning electron microscope stage using the APC system. The specific content of the measurement data has been described in detail in the above embodiments of the invention, and will not be repeated here.
[0066] Specifically, prior to this step, the following can be included: adding a specific suffix to the name of the metrology formula so that the name of the generated metrology data inherits the specific suffix. The aforementioned metrology formula is data generated by exposing the same batch of samples using a lithography machine. Here, a naming rule for the metrology formula can be defined, such as adding "FEM" to the end of a normal metrology formula. When the APC system recognizes this specially named formula, it activates the APC system's automatic feedback compensation mechanism to automatically confirm the lithography performance window. Correspondingly, this step can be specifically defined as: using the APC system, based on the suffix of the data in the CDSEM machine terminal, to retrieve the metrology data.
[0067] S202: Obtain the current batch's transit conditions and filter the measurement data based on the current batch's transit conditions to obtain the first filtered data.
[0068] This step is basically the same as S102 in the above-described embodiment of the invention. For details, please refer to the above-described embodiment of the invention. It will not be repeated here.
[0069] S203: Based on image recognition technology, the line width image is compared with the pre-stored standard line width image, and the first screening data is filtered according to the comparison result to obtain the second screening data.
[0070] Since the captured linewidth data includes linewidth images, the database established before this step can collect and store standard linewidth images. In this step, image recognition technology from the field of artificial intelligence can be used to compare the captured linewidth images with the stored standard linewidth images. Based on this comparison result, the first set of filtered data is filtered to obtain the second set of filtered data. Specifically, this step involves removing unqualified graphics and their corresponding linewidth data from the first set of filtered data.
[0071] S204: Plot a Poisson curve based on the second screening data, and remove Poisson curves that are outside the specification range.
[0072] In this step, Poisson curves of key dimensions as a function of focal length under different energy conditions will be plotted based on the second screening data mentioned above. Poisson curves outside the specification range will be automatically removed by specification restrictions, thereby further eliminating data that does not meet the specifications.
[0073] S205: Based on the automatic feedback mechanism of the APC system, the next batch's feed conditions are updated according to the Poisson curve to confirm the lithography process window.
[0074] This step is basically the same as S105 in the above-described embodiment of the invention. For details, please refer to the above-described embodiment of the invention, and will not be repeated here. In this embodiment of the invention, the conditions of the automatic feedback compensation mechanism can be controlled within a range through the APC system to prevent obviously abnormal feedback values from participating in online order processing.
[0075] The method for confirming a photolithography process window provided in this embodiment of the invention achieves automatic confirmation and application of the process window through an APC automatic feedback mechanism, reducing human judgment errors and significantly shortening the time required for process window confirmation.
[0076] The following describes a photolithography process window confirmation device provided by an embodiment of the present invention. The photolithography process window confirmation device described below and the photolithography process window confirmation method described above can be referred to in correspondence.
[0077] Please refer to Figure 3 , Figure 3 This is a structural block diagram of a photolithography process window confirmation device provided in an embodiment of the present invention.
[0078] See Figure 3 In this embodiment of the invention, the device for confirming the photolithography process window may include:
[0079] The measurement data acquisition module 100 is used to acquire measurement data based on the APC system; the measurement data includes the photolithography process parameters of the current batch, and the linewidth data formed after the corresponding photolithography exposure;
[0080] The batch passing condition acquisition module 200 is used to acquire the batch passing conditions of the current batch and filter the measurement data according to the batch passing conditions of the current batch to obtain the first filtered data; the batch passing conditions are the filtering conditions corresponding to the photolithography process parameters.
[0081] The second filtering module 300 is used to compare the line width data in the first filtering data with the standard line width data, and filter the first filtering data according to the comparison result to obtain the second filtering data;
[0082] Poisson curve module 400 is used to draw a Poisson curve based on the second filtered data;
[0083] The update module 500 is used for the automatic feedback mechanism based on the APC system to update the next batch's feed conditions according to the Poisson curve to confirm the lithography process window.
[0084] Preferably, the photolithography process parameters in the embodiments of the present invention include the energy, focal length, and step size set during the exposure operation of the photolithography machine.
[0085] Preferably, in this embodiment of the invention, the line width data includes line width values and line width images.
[0086] Preferably, in this embodiment of the invention, the second screening module 300 is specifically used for:
[0087] Based on image recognition technology, the linewidth image is compared with a pre-stored standard linewidth image.
[0088] Preferably, in this embodiment of the invention, the Poisson curve module 400 is specifically used for:
[0089] Based on the second screening data, a Poisson curve is plotted, and Poisson curves outside the specified range are removed.
[0090] Preferably, in this embodiment of the invention, the measurement data acquisition module 100 is specifically used for:
[0091] Measurement data is captured from the CDSEM instrument using the APC system.
[0092] Preferably, the embodiments of the present invention further include:
[0093] The suffix module is used to add a specific suffix to the naming of the measurement formula, so that the name of the generated measurement data inherits the specific suffix;
[0094] The measurement data acquisition module 100 is used for:
[0095] The measurement data is captured using the APC system based on the suffix of the data in the CDSEM instrument.
[0096] The photolithography process window confirmation device of this embodiment is used to implement the aforementioned photolithography process window confirmation method. Therefore, the specific implementation of the photolithography process window confirmation device can be found in the embodiment section of the photolithography process window confirmation method above. For example, the measurement data acquisition module 100, the shipment condition acquisition module 200, the second screening module 300, the Poisson curve module 400, and the update module 500 are respectively used to implement steps S101 to S105 in the above-mentioned photolithography process window confirmation method. Therefore, its specific implementation can be referred to the description of the corresponding embodiments, and will not be repeated here.
[0097] The following describes a photolithography process window verification device provided by an embodiment of the present invention. The photolithography process window verification device described below can be referred to in correspondence with the photolithography process window verification method and photolithography process window verification device described above.
[0098] Please refer to Figure 4 , Figure 4 This is a structural block diagram of a photolithography process window verification device provided in an embodiment of the present invention.
[0099] Reference Figure 4 The confirmation device for the photolithography process window may include a processor 11 and a memory 12.
[0100] The memory 12 is used to store a computer program; the processor 11 is used to execute the computer program to implement the steps of the photolithography process window confirmation method described in the above embodiments of the invention.
[0101] In this embodiment, the processor 11 in the photolithography process window verification device is used to install the photolithography process window verification device described in the above-described embodiments. Simultaneously, the processor 11, combined with the memory 12, can implement the photolithography process window verification method described in any of the above-described embodiments. Therefore, the specific implementation of the photolithography process window verification device can be found in the preceding sections on the photolithography process window verification method and its embodiments. The specific implementation can be referred to the descriptions of the corresponding embodiments, and will not be repeated here.
[0102] The present invention also provides a computer-readable storage medium storing a computer program, which, when executed by a processor, implements a method for confirming a photolithography process window as described in any of the above embodiments. Further details can be found in the prior art and will not be elaborated upon here.
[0103] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For the apparatus disclosed in the embodiments, since it corresponds to the method disclosed in the embodiments, the description is relatively simple; relevant parts can be referred to in the method section.
[0104] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.
[0105] The steps of the methods or algorithms described in conjunction with the embodiments disclosed herein can be implemented directly by hardware, a software module executed by a processor, or a combination of both. The software module can be located in random access memory (RAM), main memory, read-only memory (ROM), electrically programmable ROM, electrically erasable programmable ROM, registers, hard disk, removable disk, CD-ROM, or any other form of storage medium known in the art.
[0106] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0107] The foregoing has provided a detailed description of the method, apparatus, equipment, and storage medium for confirming a photolithography process window provided by the present invention. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and core ideas of the present invention. It should be noted that those skilled in the art can make various improvements and modifications to the present invention without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of the present invention.
Claims
1. A method for confirming a photolithography process window, characterized in that, Applied to APC systems, including: Measurement data is acquired based on the APC system; the measurement data includes the lithography process parameters of the current batch, and the linewidth data formed after the corresponding lithography exposure; Obtain the current batch's loading conditions, and filter the measurement data according to the current batch's loading conditions to obtain first filtered data; the loading conditions are the filtering conditions corresponding to the photolithography process parameters. The line width data in the first filtered data is compared with the standard line width data, and the first filtered data is filtered according to the comparison results to obtain the second filtered data; Plot a Poisson curve based on the second selected data; Based on the automatic feedback mechanism of the APC system, the next batch's feed conditions are updated according to the Poisson curve to confirm the lithography process window.
2. The method according to claim 1, characterized in that, The lithography process parameters include the energy, focal length, and step size set during the lithography machine's exposure operation.
3. The method according to claim 2, characterized in that, The linewidth data includes linewidth values and linewidth images.
4. The method according to claim 3, characterized in that, The step of comparing the line width data in the first filtered data with the standard line width data includes: Based on image recognition technology, the linewidth image is compared with a pre-stored standard linewidth image.
5. The method according to claim 1, characterized in that, The step of plotting the Poisson curve based on the second selected data includes: Based on the second screening data, a Poisson curve is plotted, and Poisson curves outside the specified range are removed.
6. The method according to claim 1, characterized in that, The measurement data acquired based on the APC system includes: Measurement data is captured from the CDSEM machine using the APC system.
7. The method according to claim 6, characterized in that, Before the APC system captures measurement data from the CDSEM machine, the following is also included: Add a specific suffix to the name of the measurement formula so that the name of the generated measurement data inherits the specific suffix; The measurement data captured from the CDSEM machine using the APC system includes: The measurement data is retrieved using the APC system based on the suffix of the data in the CDSEM instrument.
8. A device for confirming a photolithography process window, characterized in that, Applied to APC systems, including: The measurement data acquisition module is used to acquire measurement data based on the APC system; the measurement data includes the lithography process parameters of the current batch, and the linewidth data formed after the corresponding lithography exposure; The batch passing condition acquisition module is used to acquire the batch passing conditions of the current batch and filter the measurement data according to the batch passing conditions of the current batch to obtain the first filtered data; the batch passing conditions are the filtering conditions corresponding to the photolithography process parameters. The second filtering module is used to compare the line width data in the first filtering data with the standard line width data, and filter the first filtering data according to the comparison result to obtain the second filtering data; The Poisson curve module is used to draw a Poisson curve based on the second filtered data; The update module is used to update the feed conditions for the next batch based on the automatic feedback mechanism of the APC system, in order to confirm the lithography process window.
9. A device for confirming the photolithography process window, characterized in that, include: Memory, used to store computer programs; A processor, configured to implement the steps of the photolithography process window confirmation method as described in any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores a computer program that, when executed by a processor, implements the steps of the photolithography process window confirmation method as described in any one of claims 1 to 7.
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