Chip packaging process

Abstract

The application discloses a chip packaging process, which comprises the following steps: preparing a plurality of SIP semi-finished products and a jig plate, the surface of the jig plate being attached with an adhesive film; using a chip mounter to attach the plurality of SIP semi-finished products on the adhesive film at intervals; and performing surface mounting treatment on the plurality of SIP semi-finished products. The chip packaging process of the technical scheme can position products without using mechanical positioning structures, can improve production efficiency, and can be used for producing miniaturized SIP modules.

Description

Technical Field

[0001] This invention relates to the field of chip packaging technology, and in particular to a chip packaging process. Background Technology

[0002] With the rapid development of SIP (system in package) technology, higher requirements have been placed on the size of packaged devices. To meet the trend of miniaturization and micro-miniaturization of SIP modules, the substrate size is minimized during the design process. In this context, to ensure the performance of SIP modules, a double-sided surface-mount (SMT) packaging process is often adopted. However, considering that SIP modules are mostly used in environments with high electromagnetic shielding requirements, such as TWS earphones, the second-side packaging often requires a single-chip processing approach.

[0003] However, existing single-chip packaging processes mostly employ mechanical positioning and panel printing. Mechanical positioning requires extremely high fixture precision, which cannot meet the demands of increasingly smaller chip sizes. Furthermore, mechanical positioning requires a large area for the panel fixture, resulting in fewer panel sizes and low production efficiency. Simultaneously, single-chip positioning printing requires a single-chip printing press, increasing production costs and reducing efficiency. In addition, single-chip positioning printing necessitates leaving blank areas on the product to facilitate steel sheet pressing, hindering miniaturization. Moreover, the steel sheet pressing process requires embedding magnets in the fixture, which can magnetically attract the chip components, causing misalignment and affecting product quality. Summary of the Invention

[0004] The main objective of this invention is to provide a chip packaging process that uses colloids to fix products, increasing the number of product panels and thus improving the efficiency of fixture use and production; it also eliminates the need for steel sheet pressing, further reducing product size without affecting product quality.

[0005] To achieve the above objectives, the chip packaging process proposed in this invention includes the following steps:

[0006] Prepare multiple SIP semi-finished products and a jig template, the surface of which is covered with an adhesive film;

[0007] Multiple SIP semi-finished products are spaced together on the adhesive film using a pick-and-place machine;

[0008] Surface mount technology is applied to multiple of the aforementioned SIP semi-finished products.

[0009] In an optional embodiment, the step of surface mounting treatment for each of the SIP semi-finished products specifically includes:

[0010] The chip is attached to the surface of the substrate of the SIP semi-finished product;

[0011] The chip and the substrate are electrically connected.

[0012] In an optional embodiment, after the step of surface mounting the plurality of SIP semi-finished products, the method further includes:

[0013] Remove the surface-mounted SIP semi-finished product from the adhesive film;

[0014] The surface-mounted SIP semi-finished product is transferred to the detection station for testing.

[0015] In an optional embodiment, an adsorbent is movably provided above the fixture plate, and the step of removing the surface-mounted SIP semi-finished product from the adhesive film is specifically as follows:

[0016] The adsorber is driven to move downwards and adsorb the SIP semi-finished product after surface mounting treatment;

[0017] The adsorber is driven to move upward and cause the SIP semi-finished product to detach from the adhesive film.

[0018] In an optional embodiment, after preparing multiple SIP semi-finished products and a jig template, wherein the surface of the jig template is coated with an adhesive film, the method further includes:

[0019] Multiple clearance holes are formed on the surface of the fixture plate;

[0020] The fixture plate has a pin at its bottom. The step of driving the suction device to move downwards and suction the surface-mounted SIP semi-finished product also includes:

[0021] The ejector pin is driven to move upward through the clearance hole and push the adhesive film upward.

[0022] In an optional embodiment, after the step of forming a plurality of clearance holes on the surface of the fixture plate, the method further includes:

[0023] Multiple openings are formed in the adhesive film at positions corresponding to the clearance holes;

[0024] The specific steps of using a pick-and-place machine to periodically attach multiple SIP semi-finished products to the adhesive film are as follows:

[0025] A pick-and-place machine is used to attach one of the aforementioned SIP semi-finished products to an opening, and to cover each of the openings.

[0026] In an optional embodiment, the area of ​​the opening accounts for more than 50% of the area of ​​the SIP semi-finished product.

[0027] In an optional embodiment, the opening width and / or length of the adhesive film is set to be greater than the distance between the two openings;

[0028] And / or, the area of ​​the clearance hole is smaller than the area of ​​the opening, and the projection of the opening onto the fixture completely covers the clearance hole.

[0029] In an optional embodiment, the adhesive film is double-sided adhesive.

[0030] In an optional embodiment, the preparation of multiple SIP semi-finished products and a jig template, wherein the surface of the jig template is coated with an adhesive film, includes the following steps:

[0031] Prepare the substrate;

[0032] At least two chips are attached to one surface of the substrate;

[0033] The substrate and chip are electrically connected and then encapsulated to form a SiP semi-finished product;

[0034] The SIP semi-finished product is subjected to sputtering metal treatment.

[0035] In the technical solution of this invention, the SIP semi-finished product is a product structure in a double-sided system-in-package (SIIP) structure where multiple chips on one side have been packaged, but the single chip on the other side has not yet been packaged. In this chip packaging process, by preparing multiple SIP semi-finished products and a fixture, subsequent positioning and surface mount processes are facilitated. Here, the surface of the fixture is provided with an adhesive film, which adhesively fixes the SIP semi-finished products, replacing the existing mechanical positioning structure. This allows more products to be placed on the surface of the fixture, improving area utilization. Furthermore, the SIP semi-finished products do not require a blank area for steel sheet pressing, allowing application to smaller SIP products; the fixture also does not require magnets, eliminating the need for additional surface mount components (non-ferrous components, etc.) on the SIP semi-finished products, making it suitable for more product types.

[0036] Simultaneously, the SIP semi-finished product is mounted onto the adhesive film using a pick-and-place machine. The placement accuracy of the pick-and-place machine ensures the positioning accuracy of each SIP semi-finished product, guaranteeing product quality. Then, surface mount technology (SMT) is applied to multiple SIP semi-finished products simultaneously, enabling single-chip packaging and completing multiple product printing at once, resulting in high production efficiency. Therefore, this chip packaging process significantly improves the production efficiency of SMT2 in system-in-package (SIP) and the utilization rate of the jig, while also meeting the production needs of smaller SIP modules. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0038] Figure 1 This is a flowchart of an embodiment of the chip packaging process of the present invention;

[0039] Figure 2 This is a flowchart of another embodiment of the chip packaging process of the present invention;

[0040] Figure 3 This is a flowchart of yet another embodiment of the chip packaging process of the present invention;

[0041] Figure 4 This is a flowchart of another embodiment of the chip packaging process of the present invention;

[0042] Figure 5 This is a longitudinal sectional view of the fixture plate used in the chip packaging process of the present invention;

[0043] Figure 6 This is a flowchart illustrating the preparation of a SIP semi-finished product in the chip packaging process of this invention.

[0044] Explanation of icon numbers:

[0045] label name label name 1 Jig version 3 SIP semi-finished products 11 clearance hole 4 Adsorber 2 Adhesive film 5 thimble

[0046] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0047] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0048] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0049] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0051] In existing SIP module packaging processes, double-sided SMT packaging is generally used. SMT2 packaging requires mechanical positioning structures to press and position the product, which occupies a large fixture area, reducing production efficiency. Furthermore, it requires a larger product surface area for steel plate pressing, hindering miniaturization. Therefore, this application proposes a chip packaging process that, during SMT2 packaging, uses adhesive film to position the product, thereby improving production efficiency and fixture utilization, and reducing product size to meet the production needs of miniaturized SIP modules.

[0052] Please refer to Figure 1 and Figure 5 In an optional embodiment of the present invention, the chip packaging process includes the following steps:

[0053] Step S1: Prepare multiple SIP semi-finished products 3 and a jig plate 1, wherein the surface of the jig plate 1 is covered with an adhesive film 2;

[0054] Step S3: Use a pick-and-place machine to attach multiple SIP semi-finished products 3 to the adhesive film 2 at intervals;

[0055] Step S5: Perform surface mounting treatment on multiple SIP semi-finished products 3.

[0056] In this embodiment, during step S1, multiple SIP semi-finished products 3 and a jig plate 1 are prepared. The jig plate 1 can be made of metal, such as steel plate. An adhesive film 2 is attached to the surface of the jig plate 1. The adhesive film 2 can be double-sided adhesive, which facilitates application, thereby improving the efficiency and neatness of application. It also avoids excessive flow of liquid adhesive, which could lead to uneven thickness of the adhesive film 2, thus improving the positioning accuracy and flatness of the SIP semi-finished products 3. Of course, in other embodiments, the adhesive film 2 can also be formed by applying adhesive or by sputtering.

[0057] The preparation of SIP semi-finished product 3 involves chip packaging on the SMT1 side of the SIP product, with at least two chips on this side to improve the integration rate of the SIP product. The type of chip is not limited; it can be a sensor chip, such as a microphone chip or speaker chip, or other functional storage chips, such as ROM or DRAM. In step S3, a pick-and-place machine is used to fix and place multiple SIP semi-finished products 3. The pick-and-place machine is a device that accurately places components in the required positions by moving the placement head. Its type is not limited; it can be fully automatic or manual, and it can have one or multiple placement heads to improve the efficiency of placing the SIP semi-finished products 3. Multiple SIP products are spaced apart on the adhesive film 2, which holds them in place by the adhesive film 2. Of course, the speed and power during the placement process can be set according to the actual product and equipment type, which will not be elaborated here.

[0058] In step S5, surface mount technology (SIP) is applied to multiple SIP semi-finished products 3, with a single chip mounted on the surface of each SIP semi-finished product 3. Here, due to the adhesive film 2, the distance between multiple SIP semi-finished products 3 can be reduced, allowing the use of existing equipment for simultaneous multi-chip mounting and printing. This eliminates the need for equipment designed for single-chip printing, effectively saving costs and simultaneously enabling batch mounting of SIP semi-finished products 3, thus improving production efficiency.

[0059] In the technical solution of this invention, the SIP semi-finished product 3 is a product structure in a double-sided system-in-package (SIIP) structure where multiple chips on one side have been packaged, but the single chip on the other side has not been packaged. In this chip packaging process, by preparing multiple SIP semi-finished products 3 and the fixture plate 1, subsequent positioning and surface mount processes are facilitated. Here, the surface of the fixture plate 1 is provided with an adhesive film 2, which adhesively fixes the SIP semi-finished products 3, thereby replacing the existing mechanical positioning structure. This allows more products to be placed on the surface of the fixture plate 1, improving area utilization. Furthermore, the SIP semi-finished product 3 does not require a blank area for steel sheet pressing, allowing it to be applied to smaller SIP products; the fixture plate 1 also does not require magnets, eliminating the need for additional components (non-ferrous components, etc.) to be mounted on the surface of the SIP semi-finished product 3, making it suitable for more product types.

[0060] Simultaneously, the SIP semi-finished product 3 is mounted onto the adhesive film 2 using a pick-and-place machine. The placement accuracy of the pick-and-place machine ensures the positioning accuracy of each SIP semi-finished product 3, guaranteeing product quality. Then, surface mount technology (SMT) is applied to multiple SIP semi-finished products 3 simultaneously, achieving single-chip packaging and completing multiple product printing at once, resulting in high production efficiency. Therefore, this chip packaging process significantly improves the production efficiency of SMT2 and the utilization rate of the fixture board 1 in system-in-package (SIP), while also meeting the production needs of smaller SIP modules.

[0061] Please combine Figure 2 In an optional embodiment, step S5, which involves surface mounting treatment on each of the SIP semi-finished products 3, specifically comprises:

[0062] Step 51: Attach the chip to the surface of the substrate of the SIP semi-finished product 3;

[0063] Step 53: Perform electrical connection processing on the chip and the substrate.

[0064] In this embodiment, the specific steps for SMT2-side chip packaging of the SIP semi-finished product 3 are as follows: First, step S51 is performed, where the chip is attached to the surface of a substrate, which is opposite to another surface where at least two chips are located. One method is direct bonding, where the chip can be glued to the substrate, or it can be placed on the substrate by insertion or other fixing methods. Then, in step S53, electrical connection is performed. For example, the chip can be electrically connected to the substrate by wire bonding, or the chip's pins can be soldered to the pads on the substrate to achieve electrical contact. Of course, the above two steps can also be performed simultaneously, i.e., flip-chip bonding is performed. First, solder paste or conductive adhesive is printed on the surface of the substrate, and then the chip with bumps or solder feet is placed on the substrate and fixed by solder paste or conductive adhesive, which also achieves conductive contact.

[0065] Please refer to Figure 3 and Figure 5 In an optional embodiment, after step S5 of surface mounting treatment of the plurality of SIP semi-finished products 3, the method further includes:

[0066] Step S7: Remove the surface-mounted SIP semi-finished product 3 from the adhesive film 2;

[0067] Step S9: Transfer the surface-mounted SIP semi-finished product 3 to the detection position for detection.

[0068] In this embodiment, after the individual chip is mounted on the SMT2 side, a SIP finished product is formed. To ensure its processing quality, each SIP finished product needs to be removed from the adhesive film 2 and then sent for testing. Here, the removal operation in step S7 can be performed by automatic gripping by a robotic arm, manual removal, or removal by other devices; no limitation is made here. In step S9, it is transferred to the testing position for testing. The testing here can be optical testing and / or electrical testing to ensure the fixing effect and electrical connection effect.

[0069] Please refer to Figure 4 and Figure 5 In an optional embodiment, an adsorbent 4 is movably provided above the fixture plate 1. Step S7, which involves removing the surface-mounted SIP semi-finished product 3 from the adhesive film 2, specifically comprises:

[0070] Step S71: Drive the adsorber 4 to move down and adsorb the SIP semi-finished product 3 after surface mounting treatment;

[0071] Step S72: Drive the adsorber 4 upward and cause the surface-mounted SIP semi-finished product 3 to detach from the adhesive film 2.

[0072] In this embodiment, the suction device 4 is selected to remove the surface-mounted SIP semi-finished product 3, i.e., the finished SIP product, which can reduce damage to the finished product and ensure product quality; at the same time, it can also improve efficiency. The suction device 4 is movably disposed above the fixture plate 1. This suction device 4 can be driven up and down by a driving component, so that after the surface mounting is completed, it can move downwards and adhere to the surface of the SIP finished product, and then be driven upwards by the driving component to remove the SIP finished product, causing it to detach from the adhesive film 2. The suction device 4 can be a vacuum suction cup, a vacuum nozzle, or any structure that can generate negative pressure to adsorb the product. The cross-sectional shape of the suction device 4 can match the cross-sectional shape of the SIP semi-finished product 3, thereby increasing the adsorption area and ensuring the adsorption and separation effect.

[0073] Please refer to Figure 5 In an optional embodiment, after preparing multiple SIP semi-finished products 3 and a jig plate 1, wherein the surface of the jig plate 1 is coated with an adhesive film 2, the method further includes:

[0074] Step S21: A plurality of clearance holes 11 are made on the surface of the fixture plate 1;

[0075] The fixture plate 1 has a pin 5 located below it. In step S71, which drives the suction device 4 to move downwards and suction the surface-mounted SIP semi-finished product 3, the process also includes:

[0076] Step S71”: Drive the ejector pin 5 to move upward through the clearance hole 11 and push the adhesive film 2 upward.

[0077] In this embodiment, to further facilitate the detachment of the SIP finished product, a push pin 5 is provided while the adsorber 4 performs adsorption and separation. Correspondingly, multiple clearance holes 11 are provided on the surface of the fixture plate 1, each corresponding to a multiple SIP semi-finished products 3. Thus, while the adsorber 4 moves downward and adsorbs the SIP semi-finished product 3, the push pin 5 is driven upward through the clearance holes 11 to lift the adhesive film 2, thereby providing an upward support force to ensure the adsorption effect. Simultaneously, the lifting of the middle part partially separates the adhesion between the edge of the SIP semi-finished product 3 and the adhesive film 2, accelerating the separation. Here, the order of opening the clearance holes 11 and applying the adhesive film 2 on the surface of the fixture plate is not limited; the clearance holes 11 can be opened first, followed by the application of the adhesive film 2. The shape of the clearance holes 11 can be circular, square, or polygonal, etc., and is not limited here. The cross-sectional area of ​​the push pin 5 is smaller than the opening size of the clearance holes 11, thus facilitating the insertion of the push pin 5. The cross-sectional shape of the ejector pin 5 can be matched with the shape of the SIP semi-finished product 3, for example, both being rectangular, to provide a stable ejector function.

[0078] Optionally, the cross-sectional area of ​​the adsorber 4 is larger than the cross-sectional area of ​​the ejector pin 5. For example, the cross-sectional area of ​​the adsorber 4 is more than twice the cross-sectional area of ​​the ejector pin 5 to ensure the separation and removal rate and effect of the SIP semi-finished product 3.

[0079] In an optional embodiment, after step S21 of forming a plurality of clearance holes 11 on the surface of the fixture plate 1, the method further includes:

[0080] Step S22: A plurality of openings are made on the adhesive film 2 at the positions corresponding to the clearance holes 11;

[0081] Step S3, which involves using a pick-and-place machine to periodically attach multiple SIP semi-finished products 3 to the adhesive film 2, specifically involves:

[0082] Step S31: Use a pick and place machine to attach one of the SIP semi-finished products 3 to an opening, and cover each opening.

[0083] In this embodiment, to further ensure the lifting of the SIP semi-finished product 3, when the surface of the jig plate 1 is provided with clearance holes 11, and after the adhesive film 2 is applied, multiple openings are made on the surface of the adhesive film 2, with one opening corresponding to one clearance hole 11. Thus, when applying and fixing the SIP semi-finished product 3, each SIP semi-finished product 3 is applied to the opening. This allows the SIP semi-finished product 3 to face the opening and clearance hole 11, enabling direct contact with the SIP product when the ejector pin 5 moves upward to eject it. This applies more force to separate from the adhesive film 2, accelerating the removal of the SIP product. Simultaneously, the openings in the adhesive film 2 also reduce the impact on the other side surface of the SIP semi-finished product 3, making it easier to remove the SIP product.

[0084] In an optional embodiment, the area of ​​the opening accounts for more than 50% of the area of ​​the SIP semi-finished product 3.

[0085] In this embodiment, the area of ​​the opening is set to be greater than 50% of the area of ​​the SIP semi-finished product 3, that is, the area of ​​the SIP semi-finished product 3 bonded to the adhesive film 2 is less than 50% of the total area of ​​the SIP semi-finished product 3. This reduces the adhesion between the two, making it more convenient and faster to remove them using the adsorbent 4. Of course, the area of ​​the opening should not be too large, but smaller than the surface area of ​​the SIP semi-finished product 3, to ensure sufficient adhesion to the SIP semi-finished product 3 to provide positioning support and ensure positioning accuracy.

[0086] In an optional embodiment, the opening width and / or length of the adhesive film 2 is set to be greater than the distance between the two openings;

[0087] And / or, the area of ​​the clearance hole 11 is smaller than the area of ​​the opening, and the projection of the opening onto the fixture plate 1 completely covers the clearance hole 11.

[0088] In this embodiment, to ensure the utilization rate of the jig plate 1, when the shape of the opening is square, the side length of the opening in the adhesive film 2 is set to be greater than the distance between the two openings. That is, when the SIP semi-finished product 3 is attached to the adhesive film 2, the distance between the two SIP semi-finished products 3 is less than the area of ​​the SIP semi-finished product 3, thereby increasing the layout rate of the SIP semi-finished products 3 on the jig plate 1. Of course, when the shape of the opening is rectangular, its opening length is greater than the distance between the two openings in the length direction and also greater than the distance between the two openings in the width direction. Its opening width is greater than the distance between the two openings in the length direction and also greater than the distance between the two openings in the width direction, thereby significantly improving the utilization rate of the jig plate 1.

[0089] Based on the above structure, the area of ​​the clearance hole 11 is set to be smaller than the area of ​​the opening, and the projection of the opening on the jig plate 1 completely covers the clearance hole 11. That is, the center of the clearance hole 11 can be set to coincide with the center of the opening, so as to provide a more stable support for the SIP semi-finished product 3 and ensure the uniformity and stability of the force at each position of the SIP semi-finished product 3.

[0090] Please refer to Figure 6 In an optional embodiment, multiple SIP semi-finished products 3 and a jig plate 1 are prepared. The surface of the jig plate 1 is covered with an adhesive film 2. The preparation of the SIP semi-finished products 3 in step S1 includes the following steps:

[0091] Step S11: Prepare the substrate;

[0092] Step S12: At least two chips are attached to one surface of the substrate;

[0093] Step S13: Electrically connect the substrate and the chip and perform plastic encapsulation to form a SIP semi-finished product 3;

[0094] Step S14: Sputter metal treatment is performed on the SIP semi-finished product 3.

[0095] In this embodiment, the process of preparing the SIP semi-finished product 3 includes the following steps: First, a substrate is prepared. This substrate is a circuit board, which is a single board structure. Various circuit structures are set on it to form multiple spaced small unit areas, each of which is a substrate. In step S12, surface mounting is performed on one surface of the substrate. At least two chips are set on this surface. The chips can be fixed by flip-chip bonding, adhesive bonding, or lead soldering. Then, the entire board structure is encapsulated to obtain each substrate and at least two chips on each substrate. Then, the entire large board is cut with a laser to obtain multiple SIP semi-finished products 3. Finally, the outer surface of the SIP semi-finished product 3 is sputtered metal (SPT) to form a metal shielding layer on the outer surface, thereby effectively improving the shielding effect. Of course, in other embodiments, other steps can be designed according to the actual chip packaging requirements.

[0096] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A chip packaging process, characterized in that, The chip packaging process includes the following steps: Prepare multiple SIP semi-finished products and a jig template, the surface of which is covered with an adhesive film; Multiple SIP semi-finished products are spaced together on the adhesive film using a pick-and-place machine; Surface mount treatment is performed on multiple of the aforementioned SIP semi-finished products; The specific steps for surface mounting treatment of each of the aforementioned SIP semi-finished products are as follows: The chip is attached to the surface of the substrate of the SIP semi-finished product; The chip and the substrate are electrically connected. The process of surface mounting on multiple SIP semi-finished products further includes: Remove the surface-mounted SIP semi-finished product from the adhesive film; The surface-mounted SIP semi-finished product is transferred to the detection station for testing.

2. The chip packaging process as described in claim 1, characterized in that, An adsorbent is movably mounted above the fixture plate. The specific steps for removing the surface-mounted SIP semi-finished product from the adhesive film are as follows: The adsorber is driven to move downward and adsorb the SIP semi-finished product after surface mounting treatment; The adsorber is driven to move upward and cause the SIP semi-finished product to detach from the adhesive film.

3. The chip packaging process as described in claim 2, characterized in that, After preparing multiple SIP semi-finished products and a jig template, wherein an adhesive film is applied to the surface of the jig template, the process further includes: Multiple clearance holes are formed on the surface of the fixture plate; The fixture plate has a pin at its bottom. The step of driving the suction device to move downwards and suction the surface-mounted SIP semi-finished product also includes: The ejector pin is driven to move upward through the clearance hole and push the adhesive film upward.

4. The chip packaging process as described in claim 3, characterized in that, The step of creating multiple clearance holes on the surface of the fixture plate further includes: Multiple openings are formed in the adhesive film at positions corresponding to the clearance holes; The specific steps of using a pick-and-place machine to periodically attach multiple SIP semi-finished products to the adhesive film are as follows: A pick-and-place machine is used to attach one of the aforementioned SIP semi-finished products to an opening, thereby covering each of the openings.

5. The chip packaging process as described in claim 4, characterized in that, The area of ​​the opening accounts for more than 50% of the area of ​​the SIP semi-finished product.

6. The chip packaging process as described in claim 4, characterized in that, The width and / or length of the opening in the adhesive film are set to be greater than the distance between the two openings; And / or, the area of ​​the clearance hole is smaller than the area of ​​the opening, and the projection of the opening onto the fixture completely covers the clearance hole.

7. The chip packaging process according to any one of claims 1 to 6, characterized in that, The adhesive film is double-sided adhesive.

8. The chip packaging process according to any one of claims 1 to 6, characterized in that, The preparation of multiple SIP semi-finished products and a jig template, wherein the surface of the jig template is covered with an adhesive film, includes the following steps: Prepare the substrate; At least two chips are attached to one surface of the substrate; The substrate and chip are electrically connected and then encapsulated to form a SiP semi-finished product; The SIP semi-finished product is subjected to metal sputtering treatment.

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