Electronic device

Abstract

An electronic device is provided. The electronic device includes a substrate and a plurality of modulation units. The plurality of modulation units are disposed on the substrate. Each of the modulation units includes a first electronic element and a second electronic element, a first signal line, a second signal line, and a third signal line. The first signal line provides a first voltage to the first electronic element. The second signal line provides a second voltage to the second electronic element. The third signal line provides a third voltage to the first electronic element and / or the second electronic element. The first voltage is different from the second voltage, and the third voltage is different from the first voltage and / or the second voltage. The electronic device of the embodiments of the present disclosure has modulation units capable of modulating the phase, bandwidth, intensity, or polarization state of electromagnetic waves.

Description

Technical Field

[0001] This disclosure relates to an electronic device, and more particularly to an electronic device having a modulation unit that can modulate the phase, bandwidth, intensity, or polarization state of an electromagnetic wave. Background Technology

[0002] Electronic devices, or spliced ​​electronic devices, are widely used in mobile phones, televisions, monitors, tablets, automotive displays, wearable devices, and desktop computers. With the rapid development of electronic devices, the quality requirements for them are increasing, and these electronic products often also function as electronic modulation devices, for example, as antennas that can modulate electromagnetic waves. However, existing antenna devices still do not fully meet consumer needs in every aspect. Summary of the Invention

[0003] This disclosure provides an electronic device having a modulation unit that can modulate the phase, bandwidth, intensity, or polarization state of an electromagnetic wave.

[0004] According to embodiments disclosed herein, an electronic device includes a substrate and a plurality of modulation units. The plurality of modulation units are disposed on the substrate. Each modulation unit includes a first electronic component and a second electronic component, a first signal line, a second signal line, and a third signal line. The first signal line provides a first voltage to the first electronic component. The second signal line provides a second voltage to the second electronic component. The third signal line provides a third voltage to the first electronic component and / or the second electronic component. The first voltage is different from the second voltage, and the third voltage is different from the first voltage and / or the second voltage. Attached Figure Description

[0005] The accompanying drawings are included to further illustrate the present disclosure, and are incorporated in and form a part of this specification. The drawings illustrate embodiments of the present disclosure and, together with the description, serve to explain the principles of the disclosure.

[0006] Figure 1A This is a partial top view schematic diagram of an electronic device according to an embodiment of the present disclosure;

[0007] Figure 1B for Figure 1A A cross-sectional schematic diagram of the electronic device along section line I-I';

[0008] Figure 2A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0009] Figure 2B for Figure 2A A cross-sectional schematic diagram of the electronic device along section line Ⅱ-Ⅱ';

[0010] Figure 3A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0011] Figure 3B for Figure 3A A cross-sectional schematic diagram of the electronic device along section line Ⅲ-Ⅲ';

[0012] Figure 4A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0013] Figure 4B for Figure 4A A cross-sectional schematic diagram of the electronic device along section line Ⅳ-Ⅳ';

[0014] Figure 5 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0015] Figure 6 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0016] Figure 7 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0017] Figure 8 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0018] Figure 9 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0019] Figure 10 This is a functional schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0020] Figure 11 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0021] Figure 12 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0022] Figure 13 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0023] Figure 14 This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure;

[0024] Figures 15 to 17 This is a partial top view schematic diagram of an electronic device according to several embodiments disclosed herein.

[0025] Explanation of icon numbers

[0026] 10, 10g, 10h, 10i, 10j, 20: Electronic devices;

[0027] 100, 100a, 100b, 100c, 100d, 100e, 100f, 100g, 100h, 100i, 100j, 100k, 100m, 100n, 100p, 100q: Modulation units;

[0028] 101: Substrate;

[0029] 120, 120d, 120e, 120f, 120k, 120m: Pattern of the first conductive layer;

[0030] 121: Part One;

[0031] 122: Part Two;

[0032] 123: Part Three;

[0033] 124: Part Four;

[0034] 125, 126, 127, 128: Part Five;

[0035] 129: Opening area;

[0036] 130: First insulating layer;

[0037] 132: Second insulating layer;

[0038] 140: Electronic components;

[0039] 141, 141d: First electronic component;

[0040] 141a, 141b, 142a, 142b: Sealing pads;

[0041] 142, 142d, 142k: Second electronic components;

[0042] 150: Signal line;

[0043] 151, 151a, 151d: First signal lines;

[0044] 152, 152a, 152d: Second signal lines;

[0045] 153, 153a: Third signal lines;

[0046] 154: Fourth signal line;

[0047] 161, 162, 163, 164, 165: Joint pads;

[0048] 165, 166, 167, 168: Welding balls;

[0049] 170: Radio frequency choke coil;

[0050] 180, 180d: Pattern of the second conductive layer;

[0051] 181: First pad;

[0052] 182: Second pad;

[0053] 183: Third pad;

[0054] 190: Conductive hole;

[0055] 11, 11i, 11j: Modulation modules;

[0056] 12: Launch source;

[0057] 21: Low-frequency circuits;

[0058] 22: Phased array antenna;

[0059] 200: Antenna;

[0060] 220, 230: Converters;

[0061] 240: Intermediate frequency circuit;

[0062] 241: Filter;

[0063] 242, 245: Amplifiers;

[0064] 243, 261: Mixers;

[0065] 244: Local oscillator;

[0066] 260: High-frequency circuits;

[0067] 262: Phase shifter;

[0068] 263: Power amplifier;

[0069] 264: Duplexer;

[0070] 265: Antenna element;

[0071] 266: Low-noise amplifier;

[0072] C: Chip;

[0073] D: Drain;

[0074] DL: Signal line;

[0075] EM: Signal;

[0076] G: Gate;

[0077] T: Thickness;

[0078] V1: First voltage;

[0079] V2: Second voltage;

[0080] V3: Third voltage;

[0081] V4: Fourth voltage;

[0082] S: Source pole;

[0083] SL: Scan line;

[0084] TFT1, TFT2, TFT3: Transistors. Detailed Implementation

[0085] This disclosure can be understood by referring to the following detailed description in conjunction with the accompanying drawings. It should be noted that, for ease of understanding and for the sake of brevity, many of the drawings in this disclosure depict only a portion of the electronic device, and certain components in the drawings are not drawn to scale. Furthermore, the number and dimensions of the components in the drawings are for illustrative purposes only and are not intended to limit the scope of this disclosure.

[0086] In the following description and claims, the words “containing” and “including” are open-ended terms, and therefore should be interpreted as “containing but not limited to…”.

[0087] It should be understood that when an element or membrane is referred to as being "on" or "connected" to another element or membrane, it can be directly on or directly connected to that other element or membrane, or there may be an inserted element or membrane between them (indirect cases). Conversely, when an element is referred to as being "directly" on or "directly connected" to another element or membrane, there may be no inserted element or membrane between them.

[0088] Although the terms "first," "second," "third," etc., can be used to describe multiple components, the components are not limited to these terms. These terms are used only to distinguish a single component from other components in the specification. The same terms may not be used in the claims, but rather replaced by "first," "second," "third," etc., according to the order of the elements declared in the claims. Therefore, in the following description, a first component may be a second component in the claims.

[0089] In this text, the terms "about," "approximately," "substantially," and "roughly" typically indicate that a given value or range is within 10%, 5%, 3%, 2%, 1%, or 0.5%. The given quantity is an approximate quantity; that is, even without specific mention of "about," "approximately," "substantially," or "roughly," the meaning of "about," "approximately," "substantially," or "roughly" can still be implied.

[0090] In some embodiments disclosed herein, terms such as "connection" and "interconnection," unless specifically defined, may refer to two structures being in direct contact, or to two structures not being in direct contact, with other structures disposed between them. Furthermore, these terms regarding engagement and connection may also include situations where both structures are movable or both structures are fixed. Additionally, the term "coupled" encompasses any direct and indirect electrical connection means.

[0091] Electronic devices may include, but are not limited to, display devices, antenna devices (e.g., liquid crystal antennas), sensing devices, light-emitting devices, touch devices, or splicing devices. Electronic devices may include bendable and flexible electronic devices. The shape of an electronic device may be rectangular, circular, polygonal, with curved edges, or other suitable shapes. Display devices may include, for example, light-emitting diodes (LEDs), liquid crystals, fluorescent, phosphorescent, quantum dots (QDs), other suitable materials, or combinations thereof, but are not limited to. Light-emitting diodes may include, for example, organic light-emitting diodes (OLEDs), inorganic light-emitting diodes, mini LEDs, micro LEDs, or quantum dot LEDs (QDLEDs), other suitable materials, or any arrangement or combination thereof, but are not limited to. Display devices may also include, for example, splicing display devices, but are not limited to. Antenna devices may be, for example, liquid crystal antennas, but are not limited to. Antenna devices may include, for example, antenna splicing devices, but are not limited to. It should be noted that the electronic device can be any of the aforementioned arrangements and combinations, but is not limited thereto. Furthermore, the electronic device can be rectangular, circular, polygonal, have curved edges, or other suitable shapes. The electronic device may have peripheral systems such as a drive system, control system, light source system, and shelving system to support display devices, antenna devices, or splicing devices. The following description will use electronic devices to illustrate the content of this disclosure, but this disclosure is not limited thereto.

[0092] It should be understood that the features in the following embodiments can be replaced, recombined, or mixed to complete other embodiments without departing from the spirit of this disclosure. Features between embodiments can be arbitrarily mixed and combined as long as they do not violate the spirit of the invention or conflict with it.

[0093] Reference will now be made in detail to the exemplary embodiments disclosed herein, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0094] Figure 1A This is a partial top view schematic diagram of an electronic device according to an embodiment of the present disclosure. Figure 1B for Figure 1A A cross-sectional view of the electronic device along section line I-I'. For clarity and ease of explanation, the accompanying drawings are provided. Figure 1A Several components of the electronic device 10 are omitted from the diagram.

[0095] Please refer to the following at the same time Figure 1A and Figure 1B The electronic device 10 of this embodiment includes a substrate 101 and a plurality of modulation units 100. The plurality of modulation units 100 are disposed on the substrate 101 to modulate the intensity, bandwidth, or phase of received electromagnetic wave signals (or optical signals, but not limited thereto). Specifically, each modulation unit 100 includes a first conductive layer pattern 120, a first insulating layer 130, a first electronic component 141, a second electronic component 142, a first signal line 151, a second signal line 152, and a third signal line 153. The substrate 101 may include a rigid substrate, a flexible substrate, or a combination thereof. For example, the material of the substrate 101 may include glass, quartz, silicon wafer, sapphire, III-V semiconductor materials, ceramics, polycarbonate (PC), polyimide (PI), polyethylene terephthalate (PET), other suitable substrate materials, or combinations thereof, but is not limited thereto. In some embodiments, substrate 101 may be a printed circuit board.

[0096] In this embodiment, a conductive layer comprising a first conductive layer pattern 120 is disposed on a substrate 101. The first conductive layer pattern 120 includes a first portion 121, a second portion 122, and a third portion 123. The first portion 121, the second portion 122, and the third portion 123 are separated from each other. The third portion 123 is located between the first portion 121 and the second portion 122. In this embodiment, the first conductive layer pattern 120 can resonate with a received electromagnetic wave signal (or optical signal). The material of the first conductive layer pattern 120 may include copper, aluminum, silver, gold, indium tin oxide (ITO), metal alloys, other suitable conductive materials, or combinations thereof, but is not limited thereto.

[0097] In this embodiment, in the top view of the modulation unit 100 (e.g., Figure 1AAs shown, the pattern of the first conductive layer pattern 120 may include a pattern of a first portion 121, a pattern of a second portion 122, and a pattern of a third portion 123. The patterns of the first portion 121 and the second portion 122 can be considered as E-shaped, and the pattern of the third portion 123 can be considered as a solid square, but are not limited thereto. The patterns of the first portion 121, the second portion 122, and the third portion 123 are separated from each other. The patterns of the first portion 121 and the second portion 122 may surround the pattern of the third portion 123, and the patterns of the first portion 121 and the second portion 122 may be arranged on both sides of the pattern of the third portion 123 in a mirror manner, but are not limited thereto.

[0098] In this embodiment, a first portion of the insulating layer, namely the first insulating layer 130, is disposed on the first conductive layer pattern 120 to cover a portion of the first conductive layer pattern 120 and the portion of the substrate 101 exposed by the openings between the first conductive layer patterns 120. The first insulating layer 130 may expose another portion of the first conductive layer pattern 120 for the placement of bonding pads 161, 162, 163, and 164. In this embodiment, the first insulating layer 130 may be a single-layer or multi-layer structure, and the material of the first insulating layer 130 may include a polymer film, silicon nitride, silicon oxide, silicon oxynitride, or combinations thereof, but is not limited thereto.

[0099] In this embodiment, each modulation unit 100 further includes bonding pads 161, 162, 163, and 164. Bonding pad 161 is disposed on a first portion 121 of the first conductive layer pattern 120 to contact the first portion 121. Bonding pad 162 is disposed on a second portion 122 of the first conductive layer pattern 120 to contact the second portion 122. Bonding pads 163 and 164 are respectively disposed on a third portion 123 of the first conductive layer pattern 120 to contact the third portion 123. In this embodiment, the materials of bonding pads 161, 162, 163, and 164 may include copper, aluminum, silver, gold, indium tin oxide, metal alloys (e.g., electroless nickel immersion gold (ENIG)), other suitable conductive materials, or combinations of the foregoing materials, but are not limited thereto.

[0100] In this embodiment, each modulation unit 100 further includes a plurality of solder balls 165, 166, 167, and 168, which are respectively disposed on bonding pads 161, 162, 163, and 164. Solder ball 165 can contact bonding pad 161, solder ball 166 can contact bonding pad 162, solder ball 167 can contact bonding pad 163, and solder ball 168 can contact bonding pad 164.

[0101] In this embodiment, a first electronic component 141 and a second electronic component 142 are disposed on a first signal line 151, a second signal line 152, and a third signal line 153. The first electronic component 141 has pads 141a and 141b, and the second electronic component 142 has pads 142a and 142b. The first electronic component 141 can be bonded to a bonding pad 161 via a solder ball 165 through pad 141a, and to a bonding pad 163 via a solder ball 167 through pad 141b. The second electronic component 142 can be bonded to a bonding pad 162 via a solder ball 166 through pad 142a, and to a bonding pad 164 via a solder ball 168 through pad 142b. That is, the first electronic component 141 can be bonded to the first conductive layer pattern 120 via bonding pads 161 and 163, and the second electronic component 142 can be bonded to the first conductive layer pattern 120 via bonding pads 162 and 164.

[0102] In this embodiment, the first electronic component 141 and the second electronic component 142 may be sensitive to external stimuli, and their characteristics can be modulated by external stimuli to change their inherent properties. These external stimuli may be, for example, voltage, current, or temperature, and their inherent properties may be, for example, capacitance or resistance, but are not limited thereto. In this embodiment, the first electronic component 141 and the second electronic component 142 may, for example, include capacitors, inductors, or resistors, but are not limited thereto. For example, when the first electronic component 141 and / or the second electronic component 142 is a capacitor, the modulation unit 100 can use an applied voltage to modulate this capacitor to change its capacitance value.

[0103] Furthermore, in some embodiments, the first electronic component 141 and the second electronic component 142 may also be, for example, electronic components containing materials sensitive to external stimuli, electronic components containing elements sensitive to external stimuli, or electronic components containing structures sensitive to external stimuli. The materials sensitive to external stimuli may be, for example, liquid crystal or vanadium oxide; the elements sensitive to external stimuli may be, for example, PIN diodes, varactor diodes, Schottky diodes, or Gunn diodes; and the structures sensitive to external stimuli may be, for example, microelectromechanical systems (MEMS), but are not limited thereto.

[0104] Furthermore, in some embodiments, the first electronic component 141 and the second electronic component 142 may be different electronic components. For example, the first electronic component 141 may be an inductor and the second electronic component 142 may be a capacitor, or the first electronic component 141 may be a switching element and the second electronic component 142 may be a diode. Therefore, a single modulation element can modulate two different characteristics.

[0105] In this embodiment, the first signal line 151, the second signal line 152, and the third signal line 153 are respectively disposed on the substrate 101 and the first insulating layer 130. The first signal line 151, the second signal line 152, and the third signal line 153 may be the same film layer as the first conductive layer pattern 120, but are not limited thereto. The first signal line 151 can contact and couple to the first portion 121 of the first conductive layer pattern 120, the second signal line 152 can contact and couple to the second portion 122 of the first conductive layer pattern 120, and the third signal line 153 can contact and couple to the third portion 123 of the first conductive layer pattern 120.

[0106] In this embodiment, the first signal line 151 has a first voltage V1, the second signal line 152 has a second voltage V2, and the third signal line 153 has a third voltage V3. The first voltage V1, the second voltage V2, and the third voltage V3 are low-frequency voltage signals, for example, with a frequency range of 0 to 100 MHz. The first signal line 151 can provide the first voltage V1 to the first electronic component 141 through the first portion 121, bonding pad 161, solder ball 165, and pad 141a. The second signal line 152 can provide the second voltage V2 to the second electronic component 142 through the second portion 122, bonding pad 162, solder ball 165, and pad 142b. The third signal line 153 provides a third voltage V3 to the first electronic component 141 via the third portion 123, bonding pad 163, solder ball 165, and pad 141b, and provides a third voltage V3 to the second electronic component 142 via the third portion 123, bonding pad 164, solder ball 165, and pad 142a. Therefore, in this embodiment, the third voltage V3 of the third signal line 153, combined with the first voltage V1 of the first signal line 151, can be used to regulate the first electronic component 141 and change its characteristics. Similarly, the third voltage V3 of the third signal line 153, combined with the second voltage V2 of the second signal line 152, can be used to regulate the second electronic component 142 and change its characteristics. This allows the modulation unit 100 to modulate the phase, intensity, bandwidth, or polarization state of a received electromagnetic wave signal (or optical signal, but not limited thereto), and output the modulated electromagnetic wave signal (or optical signal, but not limited thereto).

[0107] Furthermore, in this embodiment, the voltage difference in the first electronic component 141 (i.e., the difference between the first voltage V1 and the third voltage V3) and the voltage difference in the second electronic component 142 (i.e., the difference between the first voltage V1 and the second voltage V2) can be independently controlled by the first signal line 151, the second signal line 152, and / or the third signal line 153. In this embodiment, since the first electronic component 141 and the second electronic component 142 can share the third voltage V3 of the third signal line 153, the overall circuit configuration of the modulation unit 100 is simpler and less complex. In this embodiment, since the first voltage V1 can be different from the second voltage V2, and the third voltage V3 can be different from the first voltage V1 and the second voltage V2, the controlled first electronic component 141 and the second electronic component 142 can exhibit a variety of different characteristics, thereby increasing the moduliability factor of the modulation unit 100 or increasing the selection of the first electronic component 141 and the second electronic component 142.

[0108] In this embodiment, since the first signal line 151, the second signal line 152, and the third signal line 153 can be electrically connected to the first conductive layer pattern 120, each modulation unit 100 needs to additionally provide multiple radio frequency chokes 170 to block high-frequency signals or AC voltages in the first conductive layer pattern 120 from entering (or interfering with) the first signal line 151, the second signal line 152, and the third signal line 153, which have low-frequency signals or DC voltages. Specifically, the radio frequency chokes 170 are respectively disposed in the first signal line 151, the second signal line 152, and the third signal line 153 to stabilize the first voltage V1, the second voltage V2, and the third voltage V3.

[0109] Although the first voltage V1, the second voltage V2, and the third voltage V3 are all different in this embodiment, this disclosure is not limited thereto. That is, in some embodiments, it is possible to make any two of the first voltage, the second voltage, and the third voltage different.

[0110] Although the first signal line 151, the second signal line 152, and the third signal line 153 in this embodiment can be the same film layer as the first conductive layer pattern 120, this disclosure is not limited thereto. That is, in some embodiments, the first signal line, the second signal line, and the third signal line can also be different film layers from the first conductive layer pattern, such as... Figure 2A , Figure 2B , Figure 3A , Figure 3BAs shown. In some embodiments, one or two of the first signal line, second signal line, and third signal line may be in the same film layer as the first conductive layer pattern, while the other one or two signal lines may be in a different film layer from the first conductive layer pattern, such as... Figure 6 As shown.

[0111] In this embodiment, in the top view of the modulation unit 100 (e.g., Figure 1A In the diagram shown, although the outlines of the first signal line 151, the second signal line 152, and the third signal line 153 are straight lines, this disclosure is not limited thereto. In some embodiments, the outlines of the first signal line, the second signal line, and the third signal line may also be wavy or looped.

[0112] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0113] Figure 2A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Figure 2B for Figure 2A A cross-sectional view of the electronic device along section line II-II'. Please also refer to... Figures 1A to 1B and Figures 2A to 2B The modulation unit 100a in this embodiment is generally similar to Figures 1A to 1B The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100a in this embodiment differs from the modulation unit 100 in that each modulation unit 100a in this embodiment also includes a second insulating layer 132 and a second conductive layer pattern 180.

[0114] Specifically, please refer to Figure 2A and Figure 2B In this embodiment, a portion of another insulating layer, namely the second insulating layer 132, is disposed on the first insulating layer 130 to cover at least a portion of the first insulating layer 130 and expose another portion of the first insulating layer 130. The second insulating layer 132 may be a single-layer or multi-layer structure, and the material of the second insulating layer 132 may include polymer films, silicon nitride, silicon oxide, silicon oxynitride, or combinations thereof, but is not limited thereto.

[0115] In this embodiment, the first signal line 151a, the second signal line 152a, and the third signal line 153a are disposed on the first insulating layer 130 exposed by the second insulating layer 132. A second conductive layer pattern 180 is disposed on the first signal line 151a, the second signal line 152a, and the third signal line 153a. That is, the second conductive layer pattern 180 can be disposed between the signal line 150 and the electronic component 140, wherein the signal line 150 includes the first signal line 151a, the second signal line 152a, and the third signal line 153a, and the electronic component 140 includes the first electronic component 141 and the second electronic component 142. The second conductive layer pattern 180 includes a first pad 181, a second pad 182, and a third pad 183 that are separated from each other. The first pad 181 can be disposed corresponding to the first portion 121, the second pad 182 can be disposed corresponding to the second portion 122, and the third pad 183 can be disposed corresponding to the third portion 123.

[0116] In this embodiment, the first signal line 151a is accessible and electrically connected to the first pad 181, the second signal line 152a is accessible and electrically connected to the second pad 182, and the third signal line 153a is accessible and electrically connected to the third pad 183. Specifically, the first pad 181 is electrically connected to the first signal line 151a and the first electronic component 141, the second pad 182 is electrically connected to the second signal line 152a and the second electronic component 142, and the third pad 183 is electrically connected to the third signal line 153a and the first electronic component 141 and / or the second electronic component 142.

[0117] In this embodiment, since the high-frequency signal or AC voltage in the first conductive layer pattern 120 will not enter (or interfere with) the first signal line 151a, the second signal line 152a and the third signal line 153a which have low-frequency signal or DC voltage, each modulation unit 100a does not need to be provided with multiple additional radio frequency chokes.

[0118] In this embodiment, since the first conductive layer pattern 120 is electrically connected to the first electronic component 141 and the second electronic component 142, the first electronic component 141 and the second electronic component 142 need to regulate the electromagnetic wave signal (or light signal, but not limited thereto) between the first conductive layer pattern 120 by means of induction.

[0119] In this embodiment, the thickness T of the first insulating layer 130 can be... The thickness ranges from angstroms to 10 μm (micrometers), where the thickness T is the minimum thickness of the first insulating layer 130 measured along the normal direction of the substrate 101.

[0120] Figure 3A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Figure 3B for Figure 3A A cross-sectional view of the electronic device along section line Ⅲ-Ⅲ'. Please also refer to... Figures 2A to 2B and Figures 3A to 3B The modulation unit 100b in this embodiment is generally similar to Figures 2A to 2B The modulation unit 100a is the same as that in both embodiments, so the same and similar components will not be described again here. The modulation unit 100b in this embodiment differs from the modulation unit 100a in that each modulation unit 100b in this embodiment also includes a conductive hole 190.

[0121] Specifically, please refer to Figure 3A and Figure 3B In this embodiment, the conductive hole 190 can penetrate the first insulating layer 130 and electrically connect the second conductive layer pattern 180 and the first conductive layer pattern 120. Since the first signal line 151a, the second signal line 152a, and the third signal line 153a can be electrically connected to the first conductive layer pattern 120 through the second conductive layer pattern 180 and the conductive hole 190, the modulation unit 100b in this embodiment needs to additionally provide multiple radio frequency chokes 170 in the first signal line 151a, the second signal line 152a, and the third signal line 153a.

[0122] Furthermore, since the first conductive layer pattern 120 can be electrically connected to the first electronic component 141 and the second electronic component 142 through the conductive hole 190 and the second conductive layer pattern 180, the modulation unit 100b of this embodiment does not need to limit the thickness of the first insulating layer 130.

[0123] Figure 4A This is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Figure 4B for Figure 4A A cross-sectional view of the electronic device along section line IV-IV'. Please also refer to... Figures 2A to 2B and Figures 4A to 4B The modulation unit 100c in this embodiment is generally similar to Figures 2A to 2B The modulation unit 100a is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100c in this embodiment differs from the modulation unit 100a in that the first signal line 151a, the second signal line 152a and the third signal line 153a in this embodiment do not contact the second conductive layer pattern 180.

[0124] Specifically, please refer to Figure 4A and Figure 4B In this embodiment, the first insulating layer 130 has a plurality of openings to expose the first portion 121, the second portion 122 and the third portion 123 of the first conductive layer pattern 120.

[0125] In this embodiment, the first signal line 151a, the second signal line 152a, and the third signal line 153a are disposed on the first conductive layer pattern 120 exposed by the first insulating layer 130, so that the first signal line 151a can contact the first portion 121, the second signal line 152a can contact the second portion 122, and the third signal line 153a can contact the third portion 123.

[0126] In this embodiment, the second conductive layer pattern 180 is disposed on the first conductive layer pattern 120 exposed by the first insulating layer 130, such that the first pad 181 can contact the first portion 121, the second pad 182 can contact the second portion 122, and the third pad 183 can contact the third portion 123. Specifically, the first pad 181 does not contact the first signal line 151a, the second pad 182 does not contact the second signal line 152a, and the third pad 183 does not contact the third signal line 153a. The first pad 181 can be electrically connected to the first signal line 151a through the first portion 121, the second pad 182 can be electrically connected to the second signal line 152a through the second portion 122, and the third pad 183 can be electrically connected to the third signal line 153a through the third portion 123.

[0127] The second insulating layer 132 is disposed on the first insulating layer 130 to cover the first insulating layer 130, the first signal line 151a, the second signal line 152a, and the third signal line 153a. The second insulating layer 132 may also be disposed in the gap between the first pad 181 and the first signal line 151a, the gap between the second pad 182 and the second signal line 152a, and the gap between the third pad 183 and the third signal line 153a.

[0128] Figure 5 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 5 The modulation unit 100d in this embodiment is roughly similar to Figure 1A The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100d in this embodiment differs from the modulation unit 100 in that, in each modulation unit 100d in this embodiment, the pattern of the first conductive layer pattern 120d can be regarded as a hollow square.

[0129] Specifically, please refer to Figure 5, in the top view schematic diagram of the modulation unit 100d, the pattern of the first part 121 and the pattern of the second part 122 can be regarded as an L shape, and the pattern of the third part 123 can be regarded as a C shape, but not limited thereto. The pattern of the first part 121, the pattern of the second part 122, and the pattern of the third part 123 are separated from each other, and the pattern of the first part 121, the pattern of the second part 122, and the pattern of the third part 123 can be assembled into a hollow square approximately, but not limited thereto. In addition, in this embodiment, the first electronic component 141 and the second electronic component 142 are respectively disposed on both sides of the pattern of the first conductive layer pattern 120d, but not limited thereto.

[0130] Figure 6 It is a partial top view schematic diagram of an electronic device according to another embodiment of the present disclosure. Please refer to Figure 2A and Figure 6 , the modulation unit 100e of this embodiment is substantially similar to Figure 1A the modulation unit 100. Therefore, the same and similar components in the two embodiments will not be repeated here. The difference between the modulation unit 100e of this embodiment and the modulation unit 100 is that in each modulation unit 100e of this embodiment, the first electronic component 141d and the second electronic component 142d both have 3 pads (not shown).

[0131] Specifically, please refer to Figure 6 , in the top view schematic diagram of the modulation unit 100e, the first conductive layer pattern 120e includes a first part 121, a second part 122, and a third part 123. Among them, the pattern of the first part 121 and the pattern of the second part 122 can be regarded as a solid square, and the pattern of the third part 123 can be regarded as an I shape, but not limited thereto. The pattern of the first part 121, the pattern of the second part 122, and the pattern of the third part 123 are separated from each other, and the pattern of the first part 121, the pattern of the second part 122, and the pattern of the third part 123 can be assembled into a Chinese character "Ri" shape approximately (that is, the pattern of the first conductive layer pattern 120e can be regarded as a Chinese character "Ri" shape approximately), but not limited thereto. In addition, in this embodiment, the first electronic component 141d and the second electronic component 142d are respectively disposed on both sides of the pattern of the first conductive layer pattern 120e, but not limited thereto.

[0132] In this embodiment, a second conductive layer pattern 180d is disposed on a first conductive layer pattern 120e and includes a first pad 181 and a second pad 182 that are separated from each other. The first pad 181 may correspond to a first portion 121, and the second pad 182 may correspond to a second portion 122. Bonding pads 161, 162, 163, and 164 are respectively disposed on a third portion 123 of the first conductive layer pattern 120e to contact the third portion 123. A first electronic component 141 having three pads can be bonded to the first conductive layer pattern 120e via bonding pads 161, 181, and 163, and a second electronic component 142 having three pads can be bonded to the first conductive layer pattern 120e via bonding pads 162, 182, and 164.

[0133] In this embodiment, since the third signal line 153 can contact and be electrically connected to the third portion 123 of the first conductive layer pattern 120e, an additional RF choke 170 is required in the third signal line 153. Furthermore, no additional RF chokes are required in the first signal line 151d electrically connected to the first pad 181 and the second signal line 152d electrically connected to the second pad 182.

[0134] Figure 7 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 7 The modulation unit 100f in this embodiment is roughly similar to Figure 1A The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100f in this embodiment differs from the modulation unit 100 in that each modulation unit 100f in this embodiment also includes a fourth signal line 154, and the first conductive layer pattern 120f also includes a fourth part 124, a fifth part 125, a fifth part 126, a fifth part 127, and a fifth part 128.

[0135] Specifically, please refer to Figure 7In this embodiment, the first part 121, the second part 122, the third part 123, the fourth part 124, the fifth part 125, the fifth part 126, the fifth part 127, and the fifth part 128 are separated from each other. The first part 121, the second part 122, the third part 123, and the fourth part 124 are disposed in the middle of the first conductive layer pattern 120f, and the fifth parts 125, the fifth part 126, the fifth part 127, and the fifth part 128 are disposed around the periphery of the first conductive layer pattern 120f. The patterns of the first part 121, the second part 122, the third part 123, the fourth part 124, the fifth part 125, the fifth part 126, the fifth part 127, and the fifth part 128 can be roughly arranged in a star shape (that is, the pattern of the first conductive layer pattern 120f can be roughly regarded as a star shape), but it is not limited thereto.

[0136] In this embodiment, bonding pad 161 is disposed on the first portion 121, bonding pad 162 is disposed on the second portion 122, bonding pad 163 is disposed on the third portion 123, and bonding pad 164 is disposed on the fourth portion 124. The first electronic component 141 can be bonded to the first conductive layer pattern 120f via bonding pads 161 and 163, and the second electronic component 142 can be bonded to the first conductive layer pattern 120f via bonding pads 162 and 164.

[0137] In this embodiment, the first signal line 151 is accessible and electrically connected to the first portion 121, the second signal line 152 is accessible and electrically connected to the second portion 122, the third signal line 153 is accessible and electrically connected to the third portion 123, and the fourth signal line 154 is accessible and electrically connected to the fourth portion 124. The first signal line 151 can provide a first voltage V1 to the first electronic component 141, and the third signal line 153 can provide a third voltage V3 to the first electronic component 141. The second signal line 152 can provide a second voltage V2 to the second electronic component 142, and the fourth signal line 154 can provide a fourth voltage V4 to the second electronic component 142.

[0138] Figure 8 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 8 In this embodiment, the electronic device 10g is substantially similar to the modulation unit 100g. Figures 1A to 1BThe electronic device 10 and modulation unit 100g in this embodiment are identical and similar components, so they will not be repeated here. The electronic device 10g and modulation unit 100g in this embodiment differ from the electronic device 10 and modulation unit 100g in that the electronic device 10g in this embodiment also includes multiple scan lines SL, multiple signal lines DL and modulation module 11, and each modulation unit 100g also includes a chip C.

[0139] Specifically, please refer to Figure 8 The modulation module 11 includes a plurality of modulation units 100g arranged in an array, wherein the modulation units 100g disposed in the modulation module 11 may be the same or different. A plurality of scan lines SL and a plurality of signal lines DL are respectively disposed on the substrate 101. The plurality of scan lines SL and the plurality of signal lines DL are interleaved to define the plurality of modulation units 100g arranged in an array.

[0140] In this embodiment, since the scan line SL is electrically connected to the wafer C, the signal line DL is electrically connected to the wafer C, and the first portion 121, the second portion 122, and the third portion 123 of the first conductive layer pattern 120 are electrically connected to the wafer C via the first signal line 151, the second signal line 152, and the third signal line 153, respectively, the wafer C can independently control each modulation unit 100g. In this embodiment, the wafer C may be, for example, a wafer packaged from an IC or multiple TFT elements, or a bare die formed from multiple TFT elements. The wafer C includes a driving circuit, and the driving circuit can be electrically connected to the first signal line 151, the second signal line 152, and the third signal line 153, respectively.

[0141] Figure 9 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 8 and Figure 9 The electronic device 10h in this embodiment is generally similar to Figure 8 The electronic device 10g is the same as that in the two embodiments, so the same and similar components will not be repeated here. The electronic device 10h in this embodiment differs from the electronic device 10g in that the electronic device 10h in this embodiment also includes a transmitter 12.

[0142] Specifically, please refer to Figure 9In this embodiment, the transmitter 12 is configured to emit a signal EM (e.g., an electromagnetic wave signal or an optical signal). The signal EM (e.g., an electromagnetic wave signal or an optical signal) may propagate in any direction in free space, but is not limited thereto. In some embodiments, the signal EM (e.g., an electromagnetic wave signal or an optical signal) may also propagate in a waveguide structure (not shown), such as a transmission line, a dielectric-filled waveguide, or a gas-filled waveguide, but is not limited thereto.

[0143] In this embodiment, when each modulation unit 100h in the modulation module 11 receives a signal EM (e.g., an electromagnetic wave signal or an optical signal) emitted by the transmitter 12, the modulation module 11 can adjust the phase, amplitude, or polarization state of the signal EM (e.g., an electromagnetic wave signal or an optical signal) incident on each modulation unit 100h, so that each modulation unit 100h outputs the signal EM (e.g., an electromagnetic wave signal or an optical signal) in the same direction (i.e., a first direction D1 or a second direction D2), but is not limited thereto. In some embodiments, after the modulation module 11 adjusts the phase of the signal EM (e.g., an electromagnetic wave signal or an optical signal) incident on each modulation unit 100h, each modulation unit 100h can also output the signal EM (e.g., an electromagnetic wave signal or an optical signal) to the same position (not shown).

[0144] In this embodiment, the electronic device 10h can be applied to an antenna device, an image display device, or a 5G millimeter wave amplifier, but is not limited thereto.

[0145] Furthermore, although the modulation module 11 in this embodiment is located outside the transmitter 12 to modulate the phase of the signal EM (e.g., an electromagnetic wave signal or an optical signal) emitted by the transmitter 12, this disclosure does not limit the configuration location of the modulation module 11. In some embodiments, the modulation module can be located inside the transmitter to modulate the phase of the signal (e.g., an electromagnetic wave signal or an optical signal) before it is emitted, such as... Figure 10 As shown.

[0146] Figure 10 This is a functional schematic diagram of an electronic device according to another embodiment of the present disclosure.

[0147] Please refer to Figure 10In this embodiment, the electronic device 20 can be considered as an antenna device, including a low-frequency circuit 21 and a phase array antenna 22. Specifically, the phase array antenna 22 includes multiple antennas 200, and each antenna 200 includes a converter 220, a converter 230, an intermediate frequency circuit 240, and a high-frequency circuit 260. The intermediate frequency circuit 240 includes a filter 241, an amplifier 242, a mixer 243, a local oscillator 244, and an amplifier 245. The high-frequency circuit 260 includes a mixer 261, a phase shifter 262, a power amplifier 263, a duplexer 264, an antenna element 265, and a low-noise amplifier 266.

[0148] In this embodiment, when the electronic device 20 transmits a signal, the low-frequency circuit 21 first converts the signal to the intermediate frequency circuit 240 via the converter 220. Then, the signal is transmitted to the high-frequency circuit 260 via the filter 241, amplifier 242, mixer 243, local oscillator 244, and amplifier 245 in the intermediate frequency circuit 240. Next, the signal is transmitted to the outside via the mixer 261, phase shifter 262, power amplifier 263, and duplexer 264 in the high-frequency circuit 260, and finally, the electromagnetic wave signal is transmitted to the outside via the antenna unit 265. Conversely, when the electronic device 20 receives a signal, it first uses the antenna unit 265 to receive the external electromagnetic wave signal, and then transmits it sequentially to the low-frequency circuit 21 via the high-frequency circuit 260, intermediate frequency circuit 240, and converter 230. A modulation module (not shown) or modulation unit (not shown) may be disposed in the antenna unit 265 to adjust the phase, bandwidth, intensity, or polarization state of the electromagnetic wave signal before it is emitted.

[0149] Figure 11 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 11 The electronic device 10i and the modulation unit 100i in this embodiment are substantially similar. Figures 1A to 1B The electronic device 10 and modulation unit 100 are identical or similar components in both embodiments, so they will not be repeated here. The electronic device 10i and modulation unit 100i in this embodiment differ from the electronic device 10 and modulation unit 100 in that the electronic device 10i in this embodiment also includes multiple scan lines SL, multiple signal lines DL, and modulation module 11i, and each modulation unit 100i also includes multiple transistors TFT1, TFT2, and TFT3.

[0150] Specifically, please refer to Figure 11 The modulation module 11i includes a plurality of modulation units 100i arranged in an array, wherein the modulation units 100i disposed in the modulation module 11i may be the same or different. A plurality of scan lines SL and a plurality of signal lines DL are respectively disposed on the substrate 101. The plurality of scan lines SL and the plurality of signal lines DL are interleaved to define the plurality of modulation units 100i arranged in an array.

[0151] In this embodiment, the scan line SL is electrically connected to the gate G of transistors TFT1, TFT2, and TFT3; the signal line DL is electrically connected to the source S of transistors TFT1, TFT2, and TFT3; and the first conductive layer pattern 120 is electrically connected to the drain D of transistors TFT1, TFT2, and TFT3. Transistors TFT1, TFT2, and TFT3 can be electrically connected to the first signal line 151, the second signal line 152, and the third signal line 153, respectively, to independently control each modulation unit 100i.

[0152] Figure 12 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 12 In this embodiment, the electronic device 10j is substantially similar to the modulation unit 100j. Figures 1A to 1B The electronic device 10 and modulation unit 100 are identical or similar components in both embodiments, so they will not be repeated here. The electronic device 10j and modulation unit 100j in this embodiment differ from the electronic device 10 and modulation unit 100 in that the electronic device 10j in this embodiment also includes multiple scan lines SL, multiple signal lines DL, a chip C, and a modulation module 11j.

[0153] Specifically, please refer to Figure 12 The modulation module 11j includes multiple modulation units 100j arranged in an array, wherein the multiple modulation units 100j disposed in the modulation module 11j may be the same or different. Multiple scan lines SL and multiple signal lines DL are respectively disposed on the substrate 101. The multiple scan lines SL and multiple signal lines DL are interleaved to define the modulation units 100j.

[0154] In this embodiment, the wafer C may be, for example, a wafer packaged from an IC or multiple TFT elements, or a bare die formed from multiple TFT elements. The wafer C may include a driving circuit. Since the wafer C can be electrically connected to the first portion 121, the second portion 122, and the third portion 123 of each modulation unit 100j through the first signal line 151, the second signal line 152, and the third signal line 153, respectively, the wafer C can simultaneously drive multiple modulation units 100j.

[0155] Figure 13 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 13 The modulation unit 100k in this embodiment is roughly similar to Figure 1A The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100k in this embodiment differs from the modulation unit 100 in that, in each modulation unit 100k in this embodiment, the first conductive layer pattern 120k further includes a fourth part 124k, and the second electronic component 142k has 3 pads (not shown).

[0156] Specifically, please refer to Figure 13 In this embodiment, the patterns of the first part 121, the second part 122, the third part 123, and the fourth part 124 are separate from each other, and the patterns of the first part 121, the second part 122, and the third part 123 can generally be assembled into a hollow square, but are not limited thereto. Specifically, the pattern of the first part 121 can be considered as an L-shape, the pattern of the second part 122 can be considered as a pattern composed of multiple separate solid squares, the pattern of the third part 123 can be considered as a solid square, and the pattern of the fourth part 124 can be considered as a solid square, but are not limited thereto.

[0157] In this embodiment, bonding pads 161 and 162 are respectively disposed on the first portion 121, bonding pad 163 is disposed on the second portion 122, bonding pad 164 is disposed on the third portion 123, and bonding pad 165 is disposed on the fourth portion 124. The first electronic component 141 can be bonded to the first conductive layer pattern 120k via bonding pads 161 and 163, and the second electronic component 142k, which has three bonding pads, can be bonded to the first conductive layer pattern 120k via bonding pads 162, 164, and 165.

[0158] In this embodiment, the first signal line 151 is accessible and electrically connected to the first portion 121, the second signal line 152 is accessible and electrically connected to the second portion 122 and the third portion 123 respectively, and the third signal line 153 is accessible and electrically connected to the fourth portion 124k. The first signal line 151 can provide a first voltage V1 to the first electronic component 141, and the second signal line 152 can provide a second voltage V2 to the first electronic component 141. The first signal line 151 can also provide the first voltage V1 to the second electronic component 142k, the second signal line 152 can also provide the second voltage V2 to the second electronic component 142k, and the third signal line 153 can provide a third voltage V3 to the second electronic component 142k.

[0159] Figure 14 This is a partial top view schematic diagram of an electronic device according to another embodiment of this disclosure. Please also refer to... Figure 1A and Figure 14 The modulation unit 100m in this embodiment is roughly similar to Figure 1A The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation unit 100m in this embodiment differs from the modulation unit 100 in that, in each modulation unit 100m in this embodiment, the first conductive layer pattern 120m also includes an opening region 129.

[0160] Specifically, please refer to Figure 14 In this embodiment, the patterns of the first part 121, the second part 122, and the third part 123 are separated from each other, and the patterns of the first part 121 and the third part 123 are disposed in the hollow areas within the pattern of the second part 122, but this is not a limitation. The pattern of the first part 121 can be considered as a hollow semicircle, the pattern of the second part 122 can be considered as a hollow square, and the pattern of the third part 123 can be considered as a hollow semicircle, but this is not a limitation.

[0161] In this embodiment, the opening region 129 is the area exposed by the first portion 121, the second portion 122, and the third portion 123 of the first conductive layer pattern 120m. The total area of ​​the first portion 121, the second portion 122, and the third portion 123 is greater than the area of ​​the opening region 129.

[0162] In this embodiment, bonding pads 161 and 162 are respectively disposed on the second portion 122, bonding pad 163 is disposed on the third portion 123, and bonding pad 164 is disposed on the first portion 121. The first electronic component 141 can be bonded to the first conductive layer pattern 120m via bonding pads 161 and 163, and the second electronic component 142 can be bonded to the first conductive layer pattern 120m via bonding pads 162 and 164.

[0163] In this embodiment, the first signal line 151 is accessible and electrically connected to the first portion 121, the second signal line 152 is accessible and electrically connected to the second portion 122, and the third signal line 153 is accessible and electrically connected to the third portion 123. The second signal line 152 can provide a second voltage V2 to the first electronic component 141, and the third signal line 153 can provide a third voltage V3 to the first electronic component 141. The first signal line 151 can provide a first voltage V1 to the second electronic component 142, and the second signal line 152 can also provide a second voltage V2 to the second electronic component 142.

[0164] Figures 15 to 17 This is a partial top view schematic diagram of an electronic device that discloses several embodiments of the present invention. Please also refer to... Figure 1A and Figures 15 to 17 The modulation units 100n, 100p, and 100q in this embodiment are generally similar to... Figure 1A The modulation unit 100 is the same as that in both embodiments, so the same and similar components will not be repeated here. The modulation units 100n, 100p, and 100q in this embodiment differ from the modulation unit 100 in that:

[0165] Please refer to Figure 15 In the modulation unit 100n of this embodiment, the outlines of the first signal line 151n, the second signal line 152n and the third signal line 153n can be arc-shaped wavy structures, thereby eliminating the need to additionally set radio frequency chokes in the first signal line 151n, the second signal line 152n and the third signal line 153n.

[0166] Please refer to Figure 16 In the modulation unit 100p of this embodiment, the outlines of the first signal line 151p, the second signal line 152p and the third signal line 153p can be rectangular wavy structures, thereby eliminating the need to additionally set radio frequency chokes in the first signal line 151p, the second signal line 152p and the third signal line 153p.

[0167] Please refer to Figure 17 In the modulation unit 100q of this embodiment, the outlines of the first signal line 151q, the second signal line 152q and the third signal line 153q can be loop structures, thereby eliminating the need to additionally set radio frequency chokes in the first signal line 151q, the second signal line 152q and the third signal line 153q.

[0168] In summary, in the electronic device of this disclosed embodiment, since the first voltage and the third voltage can regulate the characteristics of the first electronic component itself, and the second voltage and the third voltage can regulate the characteristics of the second electronic component itself, the modulation unit can modulate the intensity, bandwidth, or phase of the received signal (e.g., electromagnetic wave signal or optical signal). Furthermore, since the first and second electronic components can share the third voltage of the third signal line, the overall circuit configuration of the modulation unit is simpler and less complex. Moreover, since the first voltage can be different from the second voltage, and the third voltage can be different from both the first and second voltages, the regulated first and second electronic components can exhibit a variety of different characteristics, thereby increasing the modulating factor of the modulation unit or increasing the selection of the first and second electronic components.

[0169] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions disclosed herein, and are not intended to limit them. Although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments disclosed herein.

Claims

1. An electronic device, characterized by comprising: The application relates to a modulation device, comprising: a substrate; and a plurality of modulation units disposed on the substrate, wherein each of the plurality of modulation units comprises: a first electronic element and a second electronic element; a first signal line for providing a first voltage to the first electronic element; a second signal line for providing a second voltage to the second electronic element; a third signal line for providing a third voltage to the first electronic element and / or the second electronic element; a first conductive layer pattern disposed on the substrate and comprising a first portion, a second portion and a third portion separated from each other; and a first insulating layer disposed on the first conductive layer pattern, wherein the first voltage is different from the second voltage, and the third voltage is different from the first voltage and / or the second voltage, wherein the first signal line, the second signal line and the third signal line are disposed on the first insulating layer, and the first electronic element and the second electronic element are disposed on the first signal line, the second signal line and the third signal line, wherein the first signal line is coupled to the first portion, the second signal line is coupled to the second portion, and the third signal line is coupled to the third portion. 2.The electronic device of claim 1, wherein, Each of the plurality of modulation units further comprises: a plurality of radio frequency chokes respectively disposed in the first signal line, the second signal line and the third signal line to stabilize the first voltage, the second voltage and the third voltage. 3.The electronic device of claim 1, wherein, Each of the plurality of modulation units further comprises: a second conductive layer pattern disposed between the signal line and the electronic element and comprising a first contact pad, a second contact pad and a third contact pad separated from each other, wherein the first contact pad electrically connects the first signal line and the first electronic element, the second contact pad electrically connects the second signal line and the second electronic element, and the third contact pad electrically connects the third signal line and the first electronic element and / or the second electronic element. 4.The electronic device of claim 3, wherein, Each of the plurality of modulation units further comprises: a conductive hole penetrating through the insulating layer and electrically connecting the second conductive layer pattern and the first conductive layer pattern. 5.The electronic device of claim 1, wherein, Each of the plurality of modulation units further comprises: a plurality of transistors respectively electrically connected to the first signal line, the second signal line and the third signal line. 6.The electronic device of claim 1, wherein, Each of the plurality of modulation units further comprises: a driving circuit respectively electrically connected to the first signal line, the second signal line and the third signal line. 7.The electronic device of claim 1, wherein, The application further comprises: a transmitting source configured to emit a signal, wherein each of the plurality of modulation units receives the signal, and modulates a phase, an amplitude or a polarization state of the signal. 8.The electronic device of claim 1, wherein, The first electronic element and the second electronic element comprise a capacitor, an inductor or a resistor.

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