A probe card analyzer

Abstract

The application discloses a probe card analyzer, and belongs to the field of semiconductor equipment, comprising a base, the base is provided with a turnover plate for mounting a probe card, the base is provided with a lifting mechanism for lifting the turnover plate and a rotating mechanism for rotating the turnover plate, the base is provided below the turnover plate with a detection mechanism, the detection mechanism comprises a sensor group for contacting the probe, the base is provided with an X-axis displacement mechanism, a Y-axis displacement mechanism and a Z-axis displacement mechanism for controlling the movement of the detection mechanism along a three-dimensional coordinate system, the detection mechanism is connected to the Z-axis displacement mechanism, the base is provided above the turnover plate with a first magnifying observation piece, and the base is provided with a position adjusting mechanism for sliding the first magnifying observation piece. The application has the effect of improving the detection efficiency of the probe.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment, and in particular to a probe card analyzer. Background Technology

[0002] With the continuous advancement of semiconductor technology, the functionality and quality of semiconductor equipment are also gradually improving. The most critical component in semiconductor technology is the wafer, which refers to the silicon wafer used to manufacture silicon semiconductor circuits. The quality of the wafer determines the quality of the semiconductor chip. Therefore, wafers need to be inspected during wafer production, and probe cards are used to inspect wafers.

[0003] The probes on a probe card contact the wafer electrodes to perform electrical tests, thereby screening out defective chips. The probe card analyzer is a key instrument in the probe card manufacturing process. During probe card fabrication, it is necessary to test the relative positional relationship between the probes, the diameter and conductivity of the probe tips, and the pressure exerted on the tips. Furthermore, after repeated insertions into the wafer, the probe surface becomes worn, affecting the accuracy of the probe tests. Therefore, to maintain the probe's effectiveness, appropriate performance tests are required before the probe card can be used normally.

[0004] Currently, probe testing typically involves observing the probe's appearance under a microscope, i.e., detecting the relative positional relationship between probes. Probe performance, such as tip pressure and conductivity, is detected by controlling the relative movement and contact between the sensor's contact points and the probe. This requires separate appearance inspection equipment and performance testing equipment to test the corresponding items, making the probe cards need to be installed and removed on different testing equipment, which is cumbersome. Summary of the Invention

[0005] To improve the detection efficiency of probes, this application provides a probe card analyzer.

[0006] The probe card analyzer provided in this application adopts the following technical solution:

[0007] A probe card analyzer includes a base, a flip plate for mounting probe cards, a lifting mechanism for raising and lowering the flip plate, and a rotation mechanism for rotating the flip plate. A detection mechanism is located below the flip plate on the base. The detection mechanism includes a sensor group for contacting probes. The base is equipped with an X-axis displacement mechanism, a Y-axis displacement mechanism, and a Z-axis displacement mechanism for controlling the movement of the detection mechanism along a three-dimensional coordinate system. The detection mechanism is connected to the Z-axis displacement mechanism. A first magnifying observation element is located above the flip plate on the base, and the base is equipped with an adjustment mechanism for sliding the first magnifying observation element.

[0008] By adopting the above technical solution, when installing the probe card, the probes are set facing upwards, which not only facilitates installation but also allows the first magnifying observation piece to check the pinning status of the probes on the probe card. Then, the lifting mechanism raises the flip plate, leaving space for the flip plate to rotate. The rotation mechanism rotates the flip plate so that the probes face downwards. The adjustment mechanism ensures that the raising and rotation of the flip plate are not obstructed by the first magnifying observation piece. The lifting mechanism then resets the flip plate. The Z-axis displacement mechanism drives the sensor group to rise and contact the probes. The sensor group is used to measure the performance data of the probes. The X-axis and Y-axis displacement mechanisms drive the sensor group to detect different probes. Thus, multiple items of probe testing can be performed using only one device. Furthermore, the flipping and raising mechanisms enable rapid switching of testing items, improving testing efficiency.

[0009] Optionally, the lifting mechanism includes a lifting guide rail disposed on the base, a lifting plate slidably connected to the lifting guide rail, and a lifting drive component for driving the lifting plate to slide. The rotating mechanism is connected to the lifting plate, and the tilting plate is connected to the rotating mechanism.

[0010] By adopting the above technical solution, the lifting guide rail provides guidance, and the lifting plate realizes the lifting and lowering of the flipping plate under the drive of the lifting drive component, leaving space for the flipping plate to rotate.

[0011] Optionally, the rotating mechanism includes a rotating arm connected to the lifting plate and a rotating seat rotatably connected to the rotating arm, and the flipping plate is connected to the rotating seat.

[0012] By adopting the above technical solution, the rotating arm is connected to the lifting plate, so that the rotating mechanism rises and falls with the lifting plate. When there is enough rotation space, the flip plate can rotate immediately, which improves the speed of switching detection items and improves detection efficiency.

[0013] Optionally, the rotating arm has a mounting cavity, the rotating seat has a rotating platform rotatably connected to the mounting cavity, the rotating arm is connected to a flexible pad, the flexible pad has a pin, the rotating seat has a sliding groove for the pin to slide and connect, the sliding groove is arranged along the rotation path of the rotating seat, the flexible pad has a positioning hole, and the rotating seat has a positioning ball that engages with the positioning hole.

[0014] By adopting the above technical solution, the rotational engagement between the rotating table and the mounting cavity, and the sliding engagement between the pin and the slide groove, improve the stability of the rotating plate. The snap-fit ​​engagement between the positioning ball and the positioning hole can keep the rotating plate stable when it does not need to rotate, so as to facilitate testing.

[0015] Optionally, the rotating arm is provided in two parts and is respectively connected to the opposite ends of the flip plate. The rotating seat has a support platform on the side away from the rotating arm, and the support platform is connected to the side of the flip plate away from the probe of the probe card.

[0016] By adopting the above technical solution, the rotating arm provides rotational support from the opposite ends of the flip plate, improving the stability of the flip plate flipping and detection processes. The support platform can support the flip plate from the back of the force-bearing surface, improving the stability of the probe during detection.

[0017] Optionally, the detection mechanism further includes a detection mounting base, and the sensor group includes a pressure sensor and a conductivity sensor mounted on the detection mounting base. The contacts of the pressure sensor and the conductivity sensor are both used to contact the probe, and the detection mounting base has a detection hole for the contacts of the pressure sensor and the conductivity sensor to extend out.

[0018] By adopting the above technical solution, the pressure sensor can test the mechanical properties of the probe, and the conductivity sensor can test the current conduction capability of the probe. With the movement of the detection mechanism along the X and Y axes of the coordinate system, the corresponding sensor can detect the corresponding probe. Furthermore, the detection mounting base can protect the pressure sensor and the conductivity sensor, and reduce mutual interference between the probe and the pressure sensor and the conductivity sensor except for the contact points.

[0019] Optionally, the detection mounting base is equipped with a second magnifying observation element, which is located between the pressure sensor and the conductivity sensor. The detection mounting base has an observation hole through which the second magnifying observation element observes the tip of the probe.

[0020] By adopting the above technical solution, under the action of the Z-axis displacement mechanism, the second magnifying observation piece can observe the tip of the probe at close range, thereby better identifying the defects in the probe.

[0021] Optionally, the Y-axis displacement mechanism includes a base plate that slides along the Y-axis, and the Z-axis displacement mechanism includes an adjusting screw rotatably mounted on the base plate, a Z-axis drive component for driving the adjusting screw to rotate, an adjusting displacement block threaded to the adjusting screw, an adjusting slide rail fixed to the base plate, an inclined support block fixed to the adjusting displacement block and slidably connected to the adjusting slide rail, a fixed plate fixed to the base plate, a lifting slider slidably connected to the fixed plate along the Z-axis direction, and an inclined lifting block fixed to the lifting slider. The inclined surface of the inclined lifting block is slidably connected to the inclined surface of the inclined support block, and the detection mechanism is mounted on the inclined lifting block.

[0022] By adopting the above technical solution, the adjusting screw drives the adjusting displacement block to move, thereby realizing the movement of the inclined support block. Under the guidance of the inclined support block and the lifting slider, the inclined lifting block rises and falls, thereby realizing the movement of the detection mechanism along the Z-axis.

[0023] Optionally, the adjustment mechanism includes an adjustment slide rail, a sliding block connected to the adjustment slide rail, and a connecting component connected to the sliding block. The adjustment slide rail extends in a direction parallel to the rotation axis of the flip plate, and the first magnified observation element is connected to the connecting component.

[0024] By adopting the above technical solution, the adjustment slide rail and the moving block enable the first magnifying observation piece to move, which facilitates the observation of probes at different parts of the probe card, and ensures that the flip plate is not obstructed by the first magnifying observation piece when it is raised, lowered and flipped.

[0025] Optionally, the connecting assembly includes a fixed block connected to the movable block, a guide rod that passes through and is slidably connected to the fixed block, a connecting block connected to the guide rod, a lifting column connected to the connecting block, a lifting cylinder that is sleeved and slidably connected to the lifting column, and a locking member that is threadedly connected to the lifting cylinder and abuts against the side wall of the lifting column, wherein the first magnified observation member is connected to the lifting cylinder.

[0026] By adopting the above technical solution, the position of the first magnifying observation piece on the probe card is further adjusted, and the distance between the first magnifying observation piece and the probe card is adjusted, so as to adjust the observation range.

[0027] In summary, this application has the following beneficial effects:

[0028] 1. In this application, when testing probes, the probe holder is supported by a flip plate with the probe facing upwards. The first magnifying observation piece is used to check the pinning status of the probe on the probe holder. Then, the lifting mechanism raises the flip plate, leaving space for the flip plate to rotate. The rotation mechanism rotates the flip plate so that the probe faces downwards. The adjustment mechanism ensures that the raising and rotation of the flip plate are not obstructed by the first magnifying observation piece. The lifting mechanism then resets the flip plate. The Z-axis displacement mechanism drives the sensor group to rise and contact the probe. The sensor group measures the performance data of the probe. The X-axis displacement mechanism and Y-axis displacement mechanism drive the sensor group to detect different probes. Thus, multiple items of probe testing can be performed with only one device. Furthermore, the flipping and raising mechanisms enable rapid switching of testing items, improving testing efficiency.

[0029] 2. The testing mechanism of this application is equipped with a pressure sensor, a conductivity sensor, and a second magnifying observation device, which can not only test the mechanical and electrical properties of the probe, but also further observe the appearance of the probe at close range, simplifying the testing steps and improving the testing efficiency. Attached Figure Description

[0030] Figure 1 This is a three-dimensional structural diagram of an embodiment of this application.

[0031] Figure 2 This is a three-dimensional structural diagram of an embodiment of this application from another angle.

[0032] Figure 3 This is an exploded structural diagram of the rotating arm and rotating seat according to an embodiment of this application.

[0033] Figure 4 This is an exploded structural view of the rotating arm and rotating seat from another angle according to an embodiment of this application.

[0034] Figure 5 yes Figure 1 A magnified view of part A in the image.

[0035] Figure 6 This is an exploded structural diagram of the X-axis displacement mechanism, Y-axis displacement mechanism and Z-axis displacement mechanism according to an embodiment of this application.

[0036] Figure 7 This is a cross-sectional structural diagram of the Z-axis displacement mechanism according to an embodiment of this application.

[0037] Figure 8 This is a three-dimensional structural diagram of the testing mechanism according to an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1. Base; 11. Base; 12. Fixed guide rail column; 13. Horizontal fixed seat; 14. Upper microscope; 15. Adjustment mechanism; 151. Adjustment slide rail; 152. Moving block; 153. Fixed block; 154. Guide rod; 155. Connecting block; 156. Lifting column; 157. Lifting cylinder; 158. Locking bolt; 159. Handle; 2. Flip plate; 21. Fixed ring; 3. Lifting mechanism; 31. Lifting guide rail; 32. Moving guide rail plate; 33. Electric cylinder; 34. Lifting plate; 35. Reinforcing seat; 36. Reinforcing plate; 37. Reinforcing plate; 4. Rotating mechanism; 41. Connecting arm; 42. Rotating arm; 43. Rotating seat; 431. Rotating table; 432. Slide groove; 433. Positioning ball; 44. Support platform; 45. Flexible pad; 451. Mounting hole; 452. Pin; 45 3. Positioning hole; 5. Slide plate; 51. X-axis drive component; 52. X-axis lead screw; 53. X-axis shift block; 54. X-axis slide rail; 55. X-axis slider; 6. Base plate; 61. Y-axis drive component; 62. Y-axis lead screw; 63. Y-axis shift block; 64. Y-axis slide rail; 65. Y-axis slider; 7. Z-axis displacement mechanism; 71. Z-axis drive component; 72. Adjusting lead screw; 73. Adjusting shift block; 74. Inclined support block; 75. Fixing plate; 76. Lifting slider; 77. Inclined lifting block; 78. Vertical slide rail; 79. Inclined slide rail; 710. Inclined slider; 8. Detection mechanism; 81. Detection mounting base; 811. Upper base plate; 812. Lower base plate; 813. Mounting column; 82. Detection hole; 83. Observation hole; 84. Pressure sensor; 85. Conductivity sensor; 86. Lower microscope. Detailed Implementation

[0040] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0041] This application discloses a probe card analyzer. For example... Figure 1 As shown, a probe card analyzer includes a base 1, a base 11 fixed inside the base 1, a lifting mechanism 3, an X-axis displacement mechanism, a Y-axis displacement mechanism and a Z-axis displacement mechanism 7. The Z-axis displacement mechanism 7 is connected to a detection mechanism 8. The lifting mechanism 3 is connected to a rotating mechanism 4. The rotating mechanism 4 is connected to a flip plate 2. The flip plate 2 is located above the detection mechanism 8. The flip plate 2 is used to install the probe card. The detection mechanism 8 detects the probe performance of the probe card.

[0042] An installation port is provided in the middle of the flip plate 2. A fixing ring 21 is fixed to the side wall of the installation port. The fixing ring 21 fixes the probe card with a clamp. Specifically, the probe card is installed with the probe facing upwards, so that the testing personnel can see the position of the probe while bending over to install the probe card, and try to avoid accidentally touching the probe during the installation process and causing damage to the probe.

[0043] A fixed guide post 12 is vertically fixedly installed on one side of the base 1. There are two fixed guide posts 12. The top of the two fixed guide posts 12 are fixedly connected to a horizontal fixed seat 13. The top surface of the horizontal fixed seat 13 is provided with an adjustment mechanism 15. The adjustment mechanism 15 is connected to a first magnifying observation piece, which is specifically an upper microscope 14. The adjustment mechanism 15 can adjust the position of the upper microscope 14.

[0044] The adjustment mechanism 15 includes an adjustment slide rail 151, a moving block 152, and a connecting assembly. Two adjustment slide rails 151 are provided and extend along the X-axis. The moving block 152 is slidably connected to the two adjustment slide rails 151 on both sides. The connecting assembly includes a fixing block 153, guide rods 154, connecting blocks 155, lifting columns 156, lifting cylinders 157, and locking components. The fixing block 153 is fixedly connected to the moving block 152. Two guide rods 154 are provided and slidably connected to the fixing block 153. Two connecting blocks 155 are provided. The connecting block 155 is fixedly connected to the same end of the two guide rods 154. A handle 159 is fixedly connected to the side of the connecting block 155. The lifting column 156 is fixedly connected to the connecting block 155 near the base 11. The lifting column 156 extends along the Z-axis. The lifting cylinder 157 is sleeved and slidably connected to the lifting column 156. The locking component is a locking bolt 158. The locking bolt 158 ​​is threadedly connected to the lifting cylinder 157 and its end abuts against the side wall of the lifting column 156, so that the relative position of the lifting cylinder 157 and the lifting column 156 is fixed. The upper microscope 14 is fixedly connected to the lifting cylinder 157.

[0045] The magnification effect of the upper microscope 14 can be used to assist in observing the needle insertion of the probe on the probe card. The inspector drags the handle 159, and under the guidance of the adjustment slide rail 151, guide rod 154 and lifting column 156, the upper microscope 14 can move in the three-dimensional coordinate system, which is convenient for observing the probes at different parts of the probe card, and adjusting the distance between the first magnified observation piece and the probe card to adjust the observation range and improve the accuracy of the detection.

[0046] like Figure 1 and Figure 2 As shown, the lifting mechanism 3 includes a lifting guide rail 31, a movable guide rail plate 32, a lifting plate 34, and a lifting drive component. There are two lifting guide rails 31, which are respectively installed on two fixed guide rail columns 12. The movable guide rail plate 32 is slidably connected to the lifting guide rail 31. Both sides of the lifting plate 34 are fixedly connected to the movable guide rail plate 32. The lifting drive component is installed on the base 1 and located below the base 11. The lifting drive component is specifically an electric cylinder 33. The output end of the electric cylinder 33 is fixedly connected to the lifting plate 34. When the electric cylinder 33 is started, under the guidance of the lifting guide rail 31, the lifting plate 34 slides in the vertical direction, driving the tilting plate 2 to rise and fall. The rotating mechanism 4 is connected to the lifting plate 34.

[0047] Specifically, two reinforcing seats 35 are fixedly installed on the side of the base 11 near the fixed guide column 12. A reinforcing plate 36 is fixedly connected between the two reinforcing seats 35. A reinforcing plate 37 is fixedly connected to the reinforcing plate 36. The reinforcing plate 37 is fixedly connected to the outer side of the cylinder body of the electric cylinder 33, thereby enhancing the firmness of the electric cylinder 33 installation and improving the stability of the electric cylinder 33 when driving the lifting plate 34.

[0048] like Figure 1 As shown, the rotating mechanism 4 includes a connecting arm 41, a rotating arm 42, and a rotating seat 43. The connecting arm 41 is fixedly connected to the movable guide plate 32, and the rotating arm 42 is fixedly connected to the connecting arm 41. The rotating arm 42 extends in a direction away from the fixed guide post 12, and the rotating arms 42 of the two fixed guide posts 12 are symmetrically arranged.

[0049] like Figure 3 and Figure 4 As shown, the rotating arm 42 has an internal mounting cavity at the end away from the fixed guide post 12. A flexible pad 45 is fixed on the side of the rotating arm 42 near the rotating seat 43. The flexible pad 45 is specifically a rubber pad. The flexible pad 45 abuts against the rotating seat 43. The middle of the flexible pad 45 has a mounting hole 451 that communicates with the mounting cavity. A rotating platform 431 is fixed on the side of the rotating seat 43 near the rotating arm 42. The rotating platform 431 extends into and is rotatably connected to the mounting cavity, thereby realizing the rotatable connection between the flip plate 2 and the rotating arm 42. Manually applying force to the flip plate 2 can drive the flip plate 2 to rotate.

[0050] A pin 452 is fixed on the side of the flexible pad 45 near the rotating seat 43. The rotating seat 43 has a sliding groove 432 for the pin 452 to slide and connect. The sliding groove 432 is set along the rotation path of the rotating seat 43. Specifically, the setting path of the sliding groove 432 is a semicircle with the center of the rotating table 431 as the center, so as to satisfy the limitation of rotating the flip plate 2 by 180°.

[0051] Two positioning holes 453 are provided on the side of the flexible pad 45 near the rotating seat 43. The two positioning holes 453 are symmetrically arranged with respect to the center of the mounting hole 451. The rotating seat 43 is fixed with a positioning ball 433. When the flip plate 2 is in the initial horizontal state and in the horizontal state after rotating 180°, the positioning ball 433 is engaged with the positioning hole 453, thereby improving the stability of the flip plate 2 during testing. The positioning ball 433 is hemispherical and protrudes from the side of the rotating seat 43. With the deformable characteristics of the flexible pad 45, when force is applied to the flip plate 2, the positioning ball 433 can be driven to disengage from the positioning hole 453, thereby realizing the rotation of the flip plate 2.

[0052] like Figure 1 and Figure 5As shown, the rotating seat 43 has a support platform 44 integrally formed on the side opposite to the rotating arm 42. The opposite ends of the flip plate 2 are fixedly connected to the support platform 44 to realize the installation of the flip plate 2. When the rotating seat 43 rotates, it drives the flip plate 2 to rotate. The flip plate 2 rotates along the X-axis direction. Specifically, the rotation axis of the flip plate 2 is parallel to the extension direction of the adjustment slide rail 151.

[0053] After inspecting the probe using the upper microscope 14, its mechanical and electrical properties need to be tested. The upper microscope 14 is moved away using the adjusting mechanism 15, and the lifting plate 34 of the lifting mechanism 3 raises the flip plate 2, creating space for its rotation. Then, the rotating seat 43 rotates the flip plate 2 180°, and the flip plate 2 is lowered back to its original position. At this point, the probe is positioned downwards, allowing the testing mechanism 8 below the flip plate 2 to perform mechanical and electrical property tests. This allows for multiple tests on the probe using a single device, with rapid switching between tests, resulting in high testing efficiency.

[0054] Specifically, the support platform 44 is connected to the side of the flip plate 2 facing away from the probe card, which increases the connection area between the flip plate and the rotating seat 43. That is, when the probe is set upward, the support platform 44 is below the flip plate 2, and the weight of the flip plate 2 is borne by the support platform 44, which improves the stability of the flip plate 2. When the probe is set downward, the detection mechanism 8 will contact the probe and generate an upward force on the flip plate 2. At this time, the support platform 44 is located above the flip plate 2, preventing the flip plate 2 from moving in the direction of the force on the flip plate 2, further maintaining the stability of the flip plate 2, thereby improving the stability of the probe card during detection.

[0055] like Figure 1 and Figure 6 As shown, the X-axis displacement mechanism, Y-axis displacement mechanism, and Z-axis displacement mechanism 7 are all located below the flip plate 2. The X-axis displacement mechanism includes an X-axis drive unit 51, an X-axis lead screw 52, ​​an X-axis shift block 53, an X-axis slide rail 54, and a slide plate 5. The X-axis drive unit 51 is fixedly installed on the base 11 and is specifically a servo motor. The X-axis lead screw 52 is rotatably installed on the base 11, and the output end of the X-axis drive unit 51 is fixedly connected to one end of the X-axis lead screw 52. The X-axis shift block 53 is set with... The X-axis slide rail 54 is parallel to the X-axis screw 52 and fixedly installed on the base 11. The X-axis slide rail 54 is slidably connected to the X-axis slider 55. The middle part of the slide plate 5 is fixedly connected to the X-axis shift block 53. The two sides of the slide plate 5 are fixedly connected to the X-axis slider 55. When the X-axis drive unit 51 is activated, the X-axis screw 52 is driven to rotate. Under the guidance of the X-axis slide rail 54, the slide plate 5 moves with the movement of the X-axis shift block 53, with the direction of movement of the slide plate 5 as the X-axis direction.

[0056] The Y-axis displacement mechanism is mounted on the slide plate 5. The Y-axis displacement mechanism includes a Y-axis drive unit 61, a Y-axis lead screw 62, a Y-axis shifting block 63, a Y-axis slide rail 64, and a base plate 6. The Y-axis drive unit 61 is fixedly mounted on the slide plate 5 and is specifically a servo motor. The Y-axis lead screw 62 is rotatably mounted on the slide plate 5. The output end of the Y-axis drive unit 61 is fixedly connected to one end of the Y-axis lead screw 62. The Y-axis shifting block 63 is sleeved and threadedly connected to the Y-axis lead screw 62. The Y-axis slide rail 64 is... The Y-axis lead screw 62 is parallel to and fixedly installed on the slide plate 5. The Y-axis slide rail 64 is slidably connected to the Y-axis slider 65. The middle part of the base plate 6 is fixedly connected to the Y-axis shift block 63. The two sides of the base plate 6 are fixedly connected to the Y-axis slider 65. When the Y-axis drive unit 61 is activated, the Y-axis lead screw 62 is driven to rotate. Under the guidance of the Y-axis slide rail 64, the base plate 6 moves with the movement of the Y-axis shift block 63. The direction of movement of the base plate 6 is the Y-axis direction. The X-axis direction is perpendicular to the Y-axis direction on the horizontal plane.

[0057] like Figure 6 and Figure 7 As shown, the Z-axis displacement mechanism 7 is mounted on the base plate 6. The Z-axis displacement mechanism 7 includes a Z-axis drive component 71, an adjusting screw 72, an adjusting displacement block 73, an adjusting slide rail, an inclined support block 74, a fixed plate 75, a lifting slider 76, and an inclined lifting block 77. The fixed plate 75 is fixedly connected to one end of the base plate 6. The Z-axis drive component 71 is fixedly mounted on the fixed plate 75. The Z-axis drive component 71 is specifically a servo motor. The adjusting screw 72 is rotatably mounted on the base plate 6. The output end of the Z-axis drive component 71 passes through the fixed plate 75 and is fixedly connected to one end of the adjusting screw 72. Next, the adjusting displacement block 73 is sleeved and threadedly connected to the adjusting screw 72. The adjusting slide rail is parallel to the adjusting screw 72 and fixedly installed on the base plate 6. The adjusting slide rail is slidably connected to the adjusting displacement block 73. The bottom center of the inclined support block 74 is fixedly connected to the adjusting displacement block 73, and the two sides of the bottom surface of the inclined support block 74 are fixedly connected to the adjusting displacement block 73. The Z-axis drive unit 71 is started, driving the adjusting screw 72 to rotate. Under the guidance of the adjusting slide rail, the inclined support block 74 moves with the movement of the adjusting displacement block 73. The inclined support block 74 moves along the X-axis direction.

[0058] A vertical slide rail 78 is fixedly installed on a fixed plate 75. A lifting slider 76 is slidably connected to the vertical slide rail 78 along the Z-axis direction. An inclined lifting block 77 is fixedly connected to the lifting slider 76. The inclined lifting block 77 is used to connect with the detection mechanism 8. An inclined slide rail 79 is installed on the inclined surface of the inclined lifting block 77. An inclined slider 710 is installed on the inclined surface of the inclined support block 74. The inclined slider 710 is slidably connected to the inclined slide rail 79, so that the inclined surface of the inclined lifting block 77 is slidably connected to the inclined surface of the inclined support block 74. When the inclined support block 74 moves, the inclined lifting block 77 moves under the action of the inclined surface and the guiding action of the lifting slider 76. The direction of movement of the inclined lifting block 77 is the Z-axis direction, and the Z-axis direction is the vertical direction, thereby realizing the lifting and lowering of the inclined lifting block 77, driving the detection mechanism 8 to move closer to or away from the probe card.

[0059] like Figure 8 As shown, the detection mechanism 8 includes a detection mounting base 81 and a sensor assembly. The detection mounting base 81 includes an upper base plate 811, a lower base plate 812, and a mounting column 813. The lower base plate 812 is fixedly connected to the inclined support block 74, and the mounting column 813 is fixedly connected between the upper base plate 811 and the lower base plate 812, thereby forming a space for the sensor assembly to be installed in the detection mounting base 81.

[0060] The sensor group includes a pressure sensor 84 and a conductivity sensor 85. Both the pressure sensor 84 and the conductivity sensor 85 are mounted on the side of the upper plate 811 facing the lower plate 812. The upper plate 811 has two detection holes 82, which allow the contacts of the pressure sensor 84 and the conductivity sensor 85 to extend out, respectively, so that the contacts can contact the probe. The pressure sensor 84 is used to detect the mechanical properties of the probe, and the conductivity sensor 85 is used to detect the current conduction performance of the probe. The upper plate 811 can protect the pressure sensor 84 and the conductivity sensor 85, reducing the possibility of interference between the pressure sensor 84 and the conductivity sensor 85 and the probe, except for the contacts.

[0061] like Figure 1 and Figure 8 As shown, during testing, the probe on the flip plate 2 faces downwards, and the Z-axis displacement mechanism 7 drives the testing mounting base 81 to move vertically upwards, realizing the relative movement between the probe and the sensor group, so that the contact of the pressure sensor 84 or the contact of the conductivity sensor 85 comes into contact with the probe, completing the test. By moving the testing mounting base 81 in the X-axis and Y-axis directions, different performance tests can be performed on the same probe, or probes at different positions on the probe card can be tested.

[0062] A second magnifying observation element, specifically a lower microscope 86, is fixedly mounted on the lower base plate 812. The lower microscope 86 is located between the pressure sensor 84 and the conductivity sensor 85. An observation hole 83 is provided on the upper base plate 811, located in the middle of the upper base plate 811 and between two detection holes 82. The center of the observation hole 83 is collinear with the centers of the two detection holes 82. When the sensor assembly detects the probe, the movement of the detection mounting base 81 in the X and Y axes allows the observation hole 83 to align with the probe. The lower microscope 86 then observes the probe tip closely through the observation hole 83, thus better identifying any defects in the probe.

[0063] The implementation principle of a probe card analyzer according to an embodiment of this application is as follows:

[0064] The probe card is fixedly installed on the fixing ring 21 with the probe facing upward. The upper microscope 14 is used to check the piercing condition of the probe on the probe card. After the inspection is completed, the upper microscope 14 is removed, and the electric cylinder 33 is started to control the lifting plate 34 to rise, which drives the flip plate 2 to rise. Then, the flip plate 2 is controlled to rotate 180° so that the probe faces downward. The electric cylinder 33 is then started to control the flip plate 2 to descend to its original position. Driven by the X-axis displacement mechanism and the Y-axis displacement mechanism, the lower microscope 86, pressure sensor 84 or conductivity sensor 85 are aligned with the corresponding probe. The lower microscope 86 detects the appearance of the probe tip. Then, driven by the Z-axis displacement mechanism 7, the contact of the pressure sensor 84 or the contact of the conductivity sensor 85 contacts the probe to measure the mechanical or electrical properties of the probe.

Claims

1. A probe card analyzer, comprising a base (1), characterized in that: The base (1) is provided with a flip plate (2) for mounting a probe card. The base (1) is provided with a lifting mechanism (3) for raising and lowering the flip plate (2) and a rotating mechanism (4) for driving the flip plate (2) to rotate. The base (1) is provided with a detection mechanism (8) below the flip plate (2). The detection mechanism (8) includes a sensor group for contacting the probe. The base (1) is provided with an X-axis displacement mechanism, a Y-axis displacement mechanism and a Z-axis displacement mechanism (7) for controlling the movement of the detection mechanism (8) along a three-dimensional coordinate system. The detection mechanism (8) is connected to the Z-axis displacement mechanism (7). The base (1) is provided with a first magnified observation piece above the flip plate (2). The base (1) is provided with an adjustment mechanism (15) for sliding the first magnified observation piece. The lifting mechanism (3) includes a lifting guide rail (31) disposed on the base (1), a lifting plate (34) slidably connected to the lifting guide rail (31), and a lifting drive component for driving the lifting plate (34) to slide. The rotating mechanism (4) is connected to the lifting plate (34), and the flipping plate (2) is connected to the rotating mechanism (4). The rotating mechanism (4) includes a rotating arm (42) connected to the lifting plate (34) and a rotating seat (43) rotatably connected to the rotating arm (42), and the flipping plate (2) is connected to the rotating seat (43); The rotating arm (42) has an installation cavity, and the rotating seat (43) has a rotating platform (431) rotatably connected to the installation cavity. The rotating arm (42) is connected to a flexible pad (45), and the flexible pad (45) has a pin (452). The rotating seat (43) has a sliding groove (432) for the pin (452) to slide and connect. The sliding groove (432) is arranged along the rotation path of the rotating seat (43). The flexible pad (45) has a positioning hole (453), and the rotating seat (43) has a positioning ball (433) that engages with the positioning hole (453). The rotating arm (42) is provided in two parts and is respectively connected to the opposite ends of the flip plate (2). The rotating seat (43) is provided with a support platform (44) on the side away from the rotating arm (42). The support platform (44) is connected to the side of the flip plate (2) away from the probe of the probe card. The detection mechanism (8) further includes a detection mounting base (81), and the sensor group includes a pressure sensor (84) and a conductivity sensor (85) mounted on the detection mounting base (81). The contacts of the pressure sensor (84) and the contacts of the conductivity sensor (85) are used to contact the probe. The detection mounting base (81) has a detection hole (82) for the contacts of the pressure sensor (84) and the contacts of the conductivity sensor (85) to extend out. The detection mounting base (81) is equipped with a second magnifying observation device, which is located between the pressure sensor (84) and the conductivity sensor (85). The detection mounting base (81) has an observation hole (83), through which the second magnifying observation device observes the tip of the probe. The Y-axis displacement mechanism includes a base plate (6) that slides along the Y-axis. The Z-axis displacement mechanism (7) includes an adjusting screw (72) rotatably mounted on the base plate (6), a Z-axis drive (71) for driving the adjusting screw (72) to rotate, an adjusting displacement block (73) threaded to the adjusting screw (72), an adjusting slide rail fixed to the base plate (6), an inclined support block (74) fixed to the adjusting displacement block (73) and slidably connected to the adjusting slide rail, a fixing plate (75) fixed to the base plate (6), a lifting slider (76) slidably connected to the fixing plate (75) along the Z-axis direction, and an inclined lifting block (77) fixed to the lifting slider (76). The inclined surface of the inclined lifting block (77) is slidably connected to the inclined surface of the inclined support block (74). The detection mechanism (8) is mounted on the inclined lifting block (77). The procedure also includes the following steps: the probe card is fixedly installed on the fixing ring (21) with the probe facing upwards. The upper microscope (14) is used to check the puncture status of the probe on the probe card. After the check is completed, the upper microscope (14) is removed, the lifting drive is started to control the lifting plate (34) to rise, which drives the flip plate (2) to rise. Then the flip plate (2) is controlled to rotate 180° so that the probe faces downwards. The lifting drive is then started to control the flip plate (2) to fall back to its original position. Under the drive of the X-axis displacement mechanism and the Y-axis displacement mechanism, the lower microscope (86), pressure sensor (84) or conductivity sensor (85) is aligned with the corresponding probe. The lower microscope (86) detects the appearance of the probe tip. Then, under the drive of the Z-axis displacement mechanism (7), the contact of the pressure sensor (84) or the contact of the conductivity sensor (85) contacts the probe to measure the mechanical or electrical properties of the probe.

2. The probe card analyzer according to claim 1, characterized in that: The adjustment mechanism (15) includes an adjustment slide rail (151), a sliding block (152) connected to the adjustment slide rail (151), and a connecting component connected to the sliding block (152). The adjustment slide rail (151) extends in a direction parallel to the rotation axis of the flip plate (2), and the first magnified observation element is connected to the connecting component.

3. The probe card analyzer according to claim 2, characterized in that: The connecting assembly includes a fixed block (153) connected to the movable block (152), a guide rod (154) passing through and slidably connected to the fixed block (153), a connecting block (155) connected to the guide rod (154), a lifting column (156) connected to the connecting block (155), a lifting cylinder (157) sleeved and slidably connected to the lifting column (156), and a locking member threadedly connected to the lifting cylinder (157) and abutting against the side wall of the lifting column (156). The first magnified observation member is connected to the lifting cylinder (157).

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