TOSA component of high-speed optical module and assembly method thereof

Abstract

The present invention discloses a TOSA component of a high-speed optical module and an assembly method thereof, wherein the component comprises a semiconductor refrigerator, a COC, a lens array and a heat sink; the heat sink comprises a first heat sink part and a second heat sink part, the semiconductor refrigerator is provided with a COC and a lens array, the COC is provided with a laser array, and the laser array is coupled and aligned with the lens array; a preset number of grooves are provided at a preset position of the second heat sink part, the grooves are provided on the contact surface between the second heat sink part and the semiconductor refrigerator, the grooves are filled with a soft glue for absorbing stress, and the soft glue abuts against the bottom of the semiconductor refrigerator to avoid the coupling misalignment of the laser array and the lens array caused by the stress deformation of the bottom of the semiconductor refrigerator. The present invention reduces the stress on the contact surface between the semiconductor refrigerator and the heat sink through the soft glue by providing a groove and filling the groove with soft glue, and effectively avoids the problem of inaccurate light alignment of the laser lens caused by the bending of the bottom surface of the semiconductor refrigerator to a certain extent.

Description

Technical Field

[0001] The present invention relates to the technical field of optical modules, and in particular to a TOSA component of a high-speed optical module and an assembling method thereof. Background Art

[0002] At present, the field of optical communication is developing rapidly, and the amount of data in data centers is also increasing rapidly, which makes optical modules develop towards higher and higher rates, from 100G, 200G, 400G, 800G to the current 1.6T. The rate is getting faster and faster, which also puts higher requirements on the packaging and reliability of optical modules. Especially for the eight-channel solution of 800G and 1.6T optical modules, more channels lead to complex design and more difficult to take into account the requirements of reliability. Semiconductor cooler 1 is the most commonly used solution for controlling the temperature of lasers in optical modules. In an 8-channel optical module, semiconductor cooler 1 is required to control the temperature of 8 lasers. A single semiconductor cooler 11 controls 8 is a better solution. Using multiple semiconductor coolers 1 will greatly increase the cost of materials. However, a single semiconductor cooler 11 controls 8 lasers, which will cause a problem, that is, the aspect ratio of semiconductor cooler 1 will be much larger than when semiconductor cooler 11 controls 4 or 1 controls 2. The substrate of the semiconductor refrigerator 1 is usually made of aluminum nitride ceramic. The larger the aspect ratio of this material, the easier it is to bend under stress. This will cause a certain risk of high and low temperature cycle reliability of the module using such a semiconductor refrigerator 1. Excessive stress may tear the glue at the bottom, causing the semiconductor refrigerator 1 to shift up and down, causing COC2 to shift as well, causing the laser light to deviate from the coupled lens, resulting in a decrease in optical power, which means a decrease in performance or even failure of the optical module.

[0003] In view of this, overcoming the defects of the prior art is an urgent problem to be solved in the field of this technology. Summary of the invention

[0004] The technical problem to be solved by the present invention is how to solve the problem that the bottom of the semiconductor refrigerator 1 is warped and deformed due to stress during the high and low temperature cycle of the module of the semiconductor refrigerator 1, thereby causing inaccurate coupling between the laser and the lens.

[0005] The present invention adopts the following technical solution:

[0006] In a first aspect, the present invention provides a TOSA assembly of a high-speed optical module, comprising a semiconductor cooler 1, a COC 2, a lens array 3 and a heat sink 4;

[0007] The heat sink 4 includes a first heat sink portion 41 and a second heat sink portion 42. The first heat sink portion 41 is higher than the second heat sink portion 42 by a first preset height. The first heat sink portion 41 and the second heat sink portion 42 are integrally formed.

[0008] The semiconductor refrigerator 1 is disposed on the second heat sink portion 42, and the side wall of the semiconductor refrigerator 1 is disposed in parallel with the side wall of the first heat sink portion 41 at a preset distance;

[0009] The semiconductor refrigerator 1 is provided with a COC2 and a lens array 3, the COC2 is provided with a laser array 5, and the laser array 5 is coupled and aligned with the lens array 3;

[0010] A preset number of grooves 421 are arranged at a preset position of the second heat sink portion 42, and the grooves 421 are arranged on the contact surface between the second heat sink portion 42 and the semiconductor refrigerator 1. The grooves 421 are filled with soft glue for absorbing stress, and the soft glue abuts against the bottom of the semiconductor refrigerator 1 to avoid stress deformation at the bottom of the semiconductor refrigerator 1 causing coupling misalignment between the laser array 5 and the lens array 3.

[0011] Preferably, when a groove 421 is provided at a preset position of the second heat sink portion 42, the groove 421 is provided at the center of the bonding surface between the semiconductor refrigerator 1 and the heat sink 4, and the opening of the groove is parallel to the direction of the optical path;

[0012] When two grooves 421 are provided at the preset position of the second heat sink portion 42, the two grooves 421 are symmetrically arranged on both sides of the center of the bonding surface between the semiconductor refrigerator 1 and the heat sink 4, and the openings of the grooves are parallel to the direction of the light path;

[0013] When three grooves 421 are provided at the preset position of the second heat sink portion 42, two of the grooves are symmetrically arranged on both sides of the center of the bonding surface between the semiconductor cooler 1 and the heat sink 4, and the other groove is arranged at the center of the bonding surface between the semiconductor cooler 1 and the heat sink 4, and the opening of the groove is parallel to the direction of the light path.

[0014] Preferably, the laser array 5 includes at least one laser, the lens array 3 includes at least one lens, the number of the lasers is the same as the number of the lenses, and they are coupled and aligned in a one-to-one correspondence.

[0015] Preferably, it further comprises a PCB board 6 , wherein the PCB board 6 is arranged on the first heat sink portion 41 , a control circuit is arranged inside the PCB board 6 , and the laser is electrically connected to the control circuit.

[0016] Preferably, the contact surface between the semiconductor refrigerator 1 and the second heat sink 42 is filled with structural adhesive to fix the semiconductor refrigerator 1 on the second heat sink 42 .

[0017] Preferably, the height of the semiconductor refrigerator 1 is greater than the first preset height.

[0018] Preferably, the ratio of the opening area of ​​the groove 421 to the bottom surface of the semiconductor refrigerator 1 is 5%≤10%.

[0019] In a second aspect, the present invention further provides an assembly method of a TOSA component of a high-speed optical module, the assembly method being applied to the TOSA component of the high-speed optical module of the first aspect, the assembly method comprising:

[0020] Apply structural adhesive on the contact surface between the PCB board 6 and the first heat sink 41, and then put it into an oven to cure the structural adhesive;

[0021] Fill the solidified soft glue in the groove 421 of the second heat sink 42, fill the structural glue on the contact surface between the semiconductor refrigerator 1 and the second heat sink 42 on both sides of the groove 421, and then use an oven to solidify the structural glue;

[0022] Structural adhesive is filled on the contact surface between the semiconductor refrigerator 1 and COC2, and then the structural adhesive is baked and cured in an oven; after the curing is completed, the lens is coupled with the laser to complete the assembly of the TOSA component.

[0023] Preferably, the method further includes using a microscope to move the semiconductor refrigerator 1 to a first preset position so that the lower surface of the semiconductor refrigerator 1 is aligned with the soft glue in the groove 421 .

[0024] Preferably, the method further comprises using a microscope to move the COC2 to a second preset position of the semiconductor refrigerator 1 so as to facilitate coupling and alignment of the laser and lens provided on the COC2.

[0025] In the embodiment of the present invention, at least one groove 421 is provided at the connection between the semiconductor refrigerator 1 and the second heat sink part 42, and soft glue is provided in the groove 421. After the soft glue is cured by baking in an oven, the semiconductor refrigerator 1 and the heat sink 4 are bonded together. Through the effect of the soft glue, on the one hand, the area of ​​structural adhesive bonding between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, and the stress on the contact surface between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, wherein the soft glue can play a buffering role; on the other hand, the stress on the contact surface can be absorbed by the soft glue, thereby avoiding the problem of misalignment of the semiconductor refrigerator array 1 and the lens array 3 caused by the bending of the bottom surface of the semiconductor refrigerator 1. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0027] Figure 1 It is a side view of a TOSA component of a high-speed optical module provided by the present invention;

[0028] Figure 2 It is a schematic diagram of the overall structure of a TOSA component of a high-speed optical module provided by the present invention;

[0029] Figure 3 It is a schematic diagram of the groove setting position of a TOSA component of a high-speed optical module provided by the present invention;

[0030] Figure 4 It is a schematic diagram of simulation of the deformation amount of the bottom of a semiconductor cooler when no groove is provided on the heat sink of a TOSA component of a high-speed optical module provided by the present invention;

[0031] Figure 5 It is a schematic diagram of simulation of the deformation amount of the bottom of a semiconductor cooler when a groove is provided on a heat sink of a TOSA component of a high-speed optical module provided by the present invention;

[0032] Figure 6 It is a schematic diagram of simulation of the deformation amount of the bottom of a semiconductor cooler when two grooves are provided on a heat sink of a TOSA component of a high-speed optical module provided by the present invention;

[0033] Figure 7 It is a schematic diagram of simulation of the deformation amount of the bottom of a semiconductor cooler when three grooves are arranged on a heat sink of a TOSA component of a high-speed optical module provided by the present invention;

[0034] Figure 8 It is a flow chart of an assembly method of a TOSA component of a high-speed optical module provided by the present invention;

[0035] Wherein, the accompanying drawings of the present invention are marked as:

[0036] 1-semiconductor refrigerator; 2-COC; 3-lens array; 4-heat sink; 41-first heat sink; 42-second heat sink; 421-groove; 5-laser array; 6-PCB board. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0038] In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "upper", "lower", "top", "bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and do not require that the present invention must be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0039] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0040] Embodiment 1:

[0041] Embodiment 1 of the present invention provides a TOSA component of a high-speed optical module, including a semiconductor cooler 1, a COC 2, a lens array 3 and a heat sink 4;

[0042] The heat sink 4 includes a first heat sink portion 41 and a second heat sink portion 42. The first heat sink portion 41 is higher than the second heat sink portion 42 by a first preset height. The first heat sink portion 41 and the second heat sink portion 42 are integrally formed.

[0043] The semiconductor refrigerator 1 is disposed on the second heat sink portion 42, and the side wall of the semiconductor refrigerator 1 is disposed in parallel with the side wall of the first heat sink portion 41 at a preset distance;

[0044] The semiconductor refrigerator 1 is provided with a COC2 and a lens array 3, the COC2 is provided with a laser array 5, and the laser array 5 is coupled and aligned with the lens array 3;

[0045] A preset number of grooves 421 are arranged at a preset position of the second heat sink portion 42, and the grooves 421 are arranged on the contact surface between the second heat sink portion 42 and the semiconductor refrigerator 1. The grooves 421 are filled with soft glue for absorbing stress, and the soft glue abuts against the bottom of the semiconductor refrigerator 1 to avoid stress deformation at the bottom of the semiconductor refrigerator 1 causing coupling misalignment between the laser array 5 and the lens array 3.

[0046] like Figure 1-3As shown, the semiconductor refrigerator 1 of the embodiment of the present invention is provided with COC2, and the laser array 5 is provided on COC2. The laser array 5 generates heat during operation, which is transmitted to the semiconductor refrigerator 1 through COC2, and then the heat is transferred to the heat sink 4 through the action of the semiconductor refrigerator 1, and finally the heat in the heat sink 4 component is dissipated. When the TOSA component is working, it will experience a process of repeated heating and cooling; in the process of repeated low-temperature and high-temperature cycles, the bottom surface of the semiconductor refrigerator 1 will inevitably cause a certain degree of bending (due to thermal expansion and contraction, the bottom surface of the semiconductor refrigerator 1 will bend and deform), causing the COC2 set on the semiconductor to also undergo a certain degree of displacement. In addition, the laser array 5 is set on the COC2, so the bending of the area where the COC2 and the semiconductor refrigerator 1 are connected is the most serious, and the lens array 3 is usually set on the semiconductor refrigerator 1 slightly away from the COC2; relative to the area where the laser array 5 generates heat, the area where the lens array 3 contacts the semiconductor refrigerator 1 is less bent, resulting in inconsistent bending degrees of the semiconductor refrigerator 1 corresponding to the lens array 3 and the laser array 5, which in turn leads to inaccurate coupling between the laser array 5 and the lens array 3.

[0047] In order to avoid the above situation, in the embodiment of the present invention, at least one groove 421 is provided at the connection between the semiconductor refrigerator 1 and the second heat sink 42, and soft glue is provided in the groove 421. When a groove 421 is provided at a preset position of the second heat sink 42, the groove 421 is provided at the center of the bonding surface between the semiconductor refrigerator 1 and the heat sink 4, and the opening of the groove is parallel to the direction of the optical path.

[0048] When two grooves 421 are provided at the preset position of the second heat sink portion 42 , the two grooves 421 are symmetrically arranged on both sides of the center of the bonding surface between the semiconductor refrigerator 1 and the heat sink 4 , and the openings of the grooves are parallel to the direction of the light path.

[0049] When three grooves 421 are provided at the preset position of the second heat sink portion 42, two of the grooves are symmetrically arranged on both sides of the center of the bonding surface between the semiconductor cooler 1 and the heat sink 4, and the other groove is arranged at the center of the bonding surface between the semiconductor cooler 1 and the heat sink 4, and the opening of the groove is parallel to the direction of the light path.

[0050] After the soft glue of the embodiment of the present invention is cured by baking in an oven, the semiconductor refrigerator 1 and the heat sink 4 are bonded together (actually, one end of the cured soft glue is bonded to the bottom surface of the semiconductor refrigerator 1, and the other end of the soft glue is bonded to the inner wall of the groove 421 of the heat sink 4). Through the effect of the soft glue, on the one hand, the area of ​​structural adhesive bonding between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, and the stress on the contact surface between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, wherein the soft glue can play a buffering role; on the other hand, the stress on the contact surface can be absorbed by the soft glue to avoid the bottom surface of the semiconductor refrigerator 1 being pulled, thereby causing the bottom surface of the semiconductor refrigerator 1 to be torn, thereby improving the reliability of the optical module. It is worth noting that the groove 421 of the embodiment of the present invention is usually arranged at the center of the bonding surface between the semiconductor refrigerator 1 and the heat sink 4, and is parallel to the direction of the light path.

[0051] In the embodiment of the present invention, a groove 421 is provided on the heat sink 4 at the connection between the semiconductor cooler 1 and the heat sink 4 in the TOSA assembly of the high-speed optical module, and soft glue is filled in the groove 421. The soft glue absorbs stress so as to achieve the purpose of reducing the stress in the semiconductor cooler 1, thereby avoiding the problem that the bottom of the semiconductor cooler 1 may be torn due to repeated heating and cooling of the semiconductor cooler 1.

[0052] The purpose of setting the groove 421 in the embodiment of the present invention is actually to fill the groove 421 with soft glue, so as to use the soft glue to absorb the thermal stress generated by the semiconductor refrigerator 1 during repeated heating and cooling; through the action of the soft glue, the problem of the bottom surface of the semiconductor refrigerator 1 being broken is avoided. For the groove 421, the opening size of the groove 421 actually represents the area size of the soft glue and the semiconductor refrigerator 1 being bonded.

[0053] In order to verify that the soft glue can absorb the thermal stress in the semiconductor refrigerator 1 of the embodiment of the present invention, the embodiment of the present invention also performs a corresponding simulation study on the number of grooves 421 provided. Figure 4-7 As shown, Figure 4-7 The dotted line frame represents the part where the bottom surface of the semiconductor refrigerator 1 is connected to the heat sink 4, and the dotted line frame represents other areas of the heat sink 4. The bottom surface deformation of the semiconductor refrigerator 1 in the dotted line frame is larger, and the heat sink 4 deformation outside the dotted line is smaller. Figure 4 The deformation simulation diagram of the heat sink 4 without the groove 421 is shown in FIG. Figure 4 It can be seen from the figure that when the heat sink 4 is not provided with the groove 421, the maximum deformation amount of the bottom surface of the semiconductor refrigerator 1 is 0.048 mm. Figure 5 The deformation simulation diagram of a groove 421 corresponding to the heat sink 4 is shown in FIG. Figure 5 It can be seen from the figure that when a groove 421 is provided on the heat sink 4, the maximum deformation amount of the bottom surface of the semiconductor refrigerator 1 is 0.030 mm. Figure 6The corresponding deformation simulation diagram when two grooves 421 are set on the heat sink 4 is shown in FIG. Figure 6 It can be seen from the figure that when two grooves 421 are provided on the heat sink 4, the maximum deformation amount of the bottom surface of the semiconductor refrigerator 1 is 0.049 mm. Figure 7 The corresponding deformation simulation diagram when three grooves 421 are set on the heat sink 4 is shown in FIG. Figure 7 It can be seen from the figure that when three grooves 421 are provided on the heat sink 4, the maximum deformation amount of the bottom surface of the semiconductor refrigerator 1 is 0.067 mm.

[0054] from Figure 2-5 It can be seen from the deformation simulation diagram shown that: when a groove 421 is opened, the change of deformation is the smallest (smaller than the deformation when the groove 421 is not opened), and at this time, compared with the case where the groove 421 is not opened, there is a certain improvement effect; as the number of grooves 421 opened increases, the direct contact area between the semiconductor refrigerator 1 and the heat sink 4 becomes smaller, and when it is less than a certain percentage, it will affect the heat dissipation effect of the semiconductor refrigerator 1, and increase the thermal stress at the bottom of the semiconductor refrigerator 1. Therefore, in the embodiment of the present invention, only one groove 421 is usually opened on the heat sink 4, so as to absorb the thermal stress of the semiconductor refrigerator 1 through the soft glue, thereby avoiding the problem of bending of the bottom surface of the semiconductor refrigerator 1 due to thermal stress to a certain extent. In the embodiment of the present invention, the opening area ratio of the groove 421 to the bottom surface of the semiconductor refrigerator 1 is usually set between 5% and 10% (including 5% and 10%), that is, 5%≤the opening area ratio of the groove 421 to the bottom surface of the semiconductor refrigerator 1≤10%. In addition, in order to ensure that the simulation data is comparable as much as possible when the number of grooves 421 is changed, in the simulation process of the embodiment of the present invention, all the grooves 421 have the same shape, and when multiple grooves 421 are set on the heat sink 4 for simulation, the grooves 421 are usually evenly distributed, so that the thermal stress generated by the semiconductor refrigerator 1 during the simulation is more uniform. In addition, in the simulation process of the embodiment of the present invention, except for the change in the number of grooves 421, other conditions remain unchanged. For Figures 4-7, the ratio of the opening area of ​​the groove 421 to the area of ​​the bottom surface of the semiconductor refrigerator 1 during the simulation is 8.3%, and the structural adhesive used is EO1016, and the soft adhesive is OP-60. It is worth noting that the structural adhesive used in the embodiment of the present invention may be but is not limited to EO1016, and the soft adhesive used may be but is not limited to OP-60.

[0055] In order to facilitate the explanation of the complete scheme of the embodiment of the present invention, the specific details of the embodiment of the present invention are explained in detail below. The semiconductor refrigerator 1 of the embodiment of the present invention is arranged on the second heat sink part 42, so that the laser array 5 transfers heat through the semiconductor refrigerator 1. The laser array 5 of the embodiment of the present invention includes at least one laser, and the lens array 3 includes at least one lens. The number of the lasers is the same as that of the lenses, and they are coupled and aligned one by one. During the operation, it is necessary to always ensure that the laser and the lens are coupled and aligned so that the optical signal can be transmitted.

[0056] Further, the PCB board 6 of the embodiment of the present invention is arranged on the first heat sink part 41, a control circuit is arranged in the PCB board 6, the laser is electrically connected to the control circuit, and the height of the semiconductor refrigerator 1 is greater than the first preset height. The PCB board 6 of the embodiment of the present invention is arranged with a printed line, which can actually be considered as a wire arranged in the PCB board 6. In order to enable the laser array 5 of the embodiment of the present invention to be connected to the control circuit, the printed line on the control circuit of the PCB board 6 of the embodiment of the present invention needs to be connected to the laser array 5. Based on this, the embodiment of the present invention artificially divides the heat sink 4 into the first heat sink part 41 and the second heat sink part 42. In fact, the first heat sink part 41 and the second heat sink part 42 are usually arranged in an integral molding, and the height of the first heat sink part 41 is higher than the height of the second heat sink part 42 by a first preset height, so that the PCB board 6 can be aligned with the electrical interface of the laser array 5 after being arranged in the first heat sink part 41. It is worth noting that the first preset height of the embodiment of the present invention is set according to actual conditions to ensure that the printed line of the PCB board 6 can be electrically connected to the laser array 5.

[0057] In order to avoid displacement when using the semiconductor refrigerator 1 to cool the TOSA assembly of the embodiment of the present invention, the contact surface between the semiconductor refrigerator 1 and the second heat sink 42 of the embodiment of the present invention is filled with structural adhesive to fix the semiconductor refrigerator 1 on the second heat sink 42. After the contact surface between the semiconductor refrigerator 1 and the heat sink 4 is filled with structural adhesive, it is cured by baking in an oven to avoid displacement between the semiconductor refrigerator 1 and the heat sink 4.

[0058] In the embodiment of the present invention, at least one groove 421 is provided at the connection between the semiconductor refrigerator 1 and the second heat sink part 42, and soft glue is provided in the groove 421. After the soft glue is cured by baking in an oven, the semiconductor refrigerator 1 and the heat sink 4 are bonded together. Through the effect of the soft glue, on the one hand, the area of ​​structural adhesive bonding between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, and the stress on the contact surface between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, wherein the soft glue can play a buffering role; on the other hand, the stress on the contact surface can be absorbed by the soft glue, thereby avoiding the problem of misalignment of the semiconductor refrigerator array 1 and the lens array 3 caused by the bending of the bottom surface of the semiconductor refrigerator 1.

[0059] Embodiment 2:

[0060] Compared with the first embodiment of the present invention, the present invention further provides a method for assembling a TOSA component of a high-speed optical module, which is used for the TOSA component of the high-speed optical module described in the first embodiment. Figure 8 As shown, the assembly method includes:

[0061] Step 201: Apply structural adhesive on the contact surface between the PCB board 6 and the first heat sink 41 , and then put the PCB board 6 into an oven to cure the structural adhesive.

[0062] Among them, in the process of assembling the TOSA component of the high-speed optical module in the embodiment of the present invention, it is first necessary to fix the PCB board 6 on the heat sink 4, and use structural adhesive to bond and cure the PCB board 6 and the first heat sink part 41. The first heat sink part 41 is higher than the second heat sink part 42 by a first preset height. The PCB board 6 is raised by the first heat sink part 41 so that the printed wires in the PCB board 6 can be electrically connected to the laser.

[0063] Step 202: Fill the groove 421 of the second heat sink 42 with cured soft glue, fill the contact surface between the semiconductor refrigerator 1 and the second heat sink 42 on both sides of the groove 421 with structural glue, and then use an oven to cure the structural glue.

[0064] The laser array 5 of the embodiment of the present invention is arranged on the COC2 on the semiconductor refrigerator 1. After the PCB board 6 is bonded and cured to the first heat sink part 41, a part of the bottom surface of the semiconductor refrigerator 1 is bonded to the cured soft glue in the groove 421, and another part of the bottom surface of the semiconductor refrigerator 1 is directly bonded to the heat sink 4 through the structural glue. The soft glue has the function of absorbing thermal stress. When the opening area of ​​the soft glue is set in a certain range (actually a certain percentage of the semiconductor refrigerator 1), the problem of the bottom surface of the semiconductor refrigerator 1 bending caused by repeated heating and cooling of the bottom surface of the semiconductor refrigerator 1 can be significantly improved (such as Figure 2 and Figure 3As shown, relative to the heat sink 4 without the groove 421, when a groove 421 of a specific size is provided, the deformation amount of the bottom surface of the semiconductor refrigerator 1 is reduced). It is worth noting that in order to enable the laser array 5 and the lens array 3 to be accurately coupled and aligned, the embodiment of the present invention also includes using a microscope to move the semiconductor refrigerator 1 to a first preset position, so as to facilitate the alignment of the lower surface of the semiconductor refrigerator 1 with the soft glue in the groove 421; and then to couple and align the lasers in the laser array 5 with the lenses in the lens array 3 one by one. In addition, the first preset position of the embodiment of the present invention actually refers to the position where the semiconductor refrigerator 1 is coupled and bonded with the soft glue in the groove 421, and is specifically set according to the actual position of the groove 421.

[0065] Step 203: Fill the contact surface between the semiconductor refrigerator 1 and the COC2 with structural adhesive, and then use an oven to bake and solidify the structural adhesive; after the curing is completed, couple the lens with the laser to complete the assembly of the TOSA component.

[0066] After the bottom surface of the semiconductor refrigerator 1 of the embodiment of the present invention is fixed to the heat sink 4, it is necessary to fix the COC2 with the laser array 5 fixed to the corresponding position of the semiconductor refrigerator 1, so as to align the printed line of the control circuit in the PCB board 6 with the interface in the laser array 5, so as to electrically connect the PCB board 6 with the laser array 5. It is worth noting that in order to accurately couple and align the laser array 5 and the lens array 3, it is necessary to set the COC2 with the laser at the second preset position of the semiconductor refrigerator 1, that is, the embodiment of the present invention also includes using a microscope to move the COC2 to the second preset position of the semiconductor refrigerator 1, so as to facilitate the coupling and alignment of the laser and the lens set on the COC2. After alignment, the structural adhesive is baked and cured so that the laser and the PCB board 6 do not move after being fixed. The second preset position of the embodiment of the present invention actually refers to the position where the COC2 is fixed on the semiconductor refrigerator 1, which is specifically set according to the actual position of the groove 421.

[0067] In the embodiment of the present invention, at least one groove 421 is provided at the connection between the semiconductor refrigerator 1 and the second heat sink part 42, and soft glue is provided in the groove 421. After the soft glue is cured by baking in an oven, the semiconductor refrigerator 1 and the heat sink 4 are bonded together. Through the effect of the soft glue, on the one hand, the area of ​​structural adhesive bonding between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, and the stress on the contact surface between the semiconductor refrigerator 1 and the heat sink 4 can be reduced, wherein the soft glue can play a buffering role; on the other hand, the stress on the contact surface can be absorbed by the soft glue, thereby avoiding the problem of misalignment of the semiconductor refrigerator array 1 and the lens array 3 caused by the bending of the bottom surface of the semiconductor refrigerator 1.

[0068] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A TOSA component of a high-speed optical module, characterized in that: It comprises a semiconductor refrigerator (1), a COC (2), a lens array (3) and a heat sink (4); The heat sink (4) comprises a first heat sink portion (41) and a second heat sink portion (42); the height of the first heat sink portion (41) is higher than that of the second heat sink portion (42) by a first preset height; the first heat sink portion (41) and the second heat sink portion (42) are integrally formed; The semiconductor refrigerator (1) is arranged on the second heat sink portion (42), and the side wall of the semiconductor refrigerator (1) is arranged in parallel with the side wall of the first heat sink portion (41) at a preset distance; The semiconductor refrigerator (1) is provided with a COC (2) and a lens array (3), the COC (2) is provided with a laser array (5), and the laser array (5) is coupled and aligned with the lens array (3); When a groove (421) is provided at a preset position of the second heat sink portion (42), the groove (421) is provided at the center of the bonding surface between the semiconductor refrigerator (1) and the heat sink (4), and the opening of the groove (421) is parallel to the direction of the optical path; the groove (421) is provided on the contact surface between the second heat sink portion (42) and the semiconductor refrigerator (1), the groove (421) is filled with a soft glue for absorbing stress, and the soft glue abuts against the bottom of the semiconductor refrigerator (1) to avoid coupling misalignment of the laser array (5) and the lens array (3) caused by stress deformation at the bottom of the semiconductor refrigerator (1); the ratio of the opening area of ​​the groove (421) to the area of ​​the bottom surface of the semiconductor refrigerator (1) is 5%≤≤10%.

2. The TOSA component of the high-speed optical module according to claim 1, characterized in that: The laser array (5) comprises at least one laser, the lens array (3) comprises at least one lens, the number of the lasers is the same as the number of the lenses, and they are coupled and aligned in a one-to-one correspondence.

3. The TOSA assembly of the high-speed optical module according to claim 2, characterized in that: It also comprises a PCB board (6), the PCB board (6) being arranged on the first heat sink part (41), a control circuit being arranged inside the PCB board (6), and the laser being electrically connected to the control circuit.

4. The TOSA assembly of the high-speed optical module according to claim 1, characterized in that: The contact surface between the semiconductor refrigerator (1) and the second heat sink (42) is filled with structural adhesive to fix the semiconductor refrigerator (1) on the second heat sink (42).

5. The TOSA assembly of the high-speed optical module according to claim 1, characterized in that: The height of the semiconductor refrigerator (1) is greater than the first preset height.

6. A method for assembling a TOSA component of a high-speed optical module, characterized in that: The assembly method is applied to the TOSA component of the high-speed optical module according to any one of claims 1 to 5, and the assembly method comprises: Applying structural adhesive on the contact surface between the PCB board (6) and the first heat sink (41), and then placing the PCB board (6) in an oven to cure the structural adhesive; Filling the groove (421) of the second heat sink (42) with cured soft glue, filling the contact surface between the semiconductor refrigerator (1) and the second heat sink (42) on both sides of the groove (421) with structural glue, and then curing the structural glue in an oven; Structural adhesive is filled on the contact surface between the semiconductor refrigerator (1) and the COC (2), and then the structural adhesive is baked and cured in an oven; after the curing is completed, the lens is coupled with the laser to complete the assembly of the TOSA component.

7. The method for assembling a TOSA component of a high-speed optical module according to claim 6, characterized in that: The method also includes using a microscope to move the semiconductor refrigerator (1) to a first preset position so as to facilitate alignment of the lower surface of the semiconductor refrigerator (1) with the soft glue in the groove (421).

8. The method for assembling a TOSA component of a high-speed optical module according to claim 7, characterized in that: The method also includes using a microscope to move the COC (2) to a second preset position of the semiconductor refrigerator (1) so as to facilitate the coupling and alignment of the laser and lens arranged on the COC (2).

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