Electronic slurry for beryllium oxide ceramics and preparation method thereof

Abstract

The present application is applicable to the field of electronic material technology, and provides an electronic paste for beryllium oxide ceramics and a preparation method thereof, the preparation method comprising: mixing inorganic powder and metal powder and ball milling to obtain a mixed powder, wherein the inorganic powder comprises one or more of aluminum oxide, silicon dioxide, calcium oxide, magnesium oxide and chromium trioxide; heating and stirring the mixed powder and a binder solvent to obtain a basic paste, and then grinding and drying the mixed powder and a binder solvent by a disperser to obtain a basic paste; rolling the basic paste to obtain an electronic paste for beryllium oxide ceramics. The electronic paste prepared by the preparation method disclosed in the present application can achieve high-strength bonding with high-purity beryllium oxide ceramics, and can also protect the workers who prepare the electronic paste from the harm of beryllium oxide powder.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic materials, and in particular relates to an electronic paste for beryllium oxide ceramics and a preparation method thereof. Background Art

[0002] High-purity beryllium oxide ceramics are widely used in microwave electronic vacuum, microelectronics, optoelectronic devices, especially in high-power IC, high-power devices and electric vacuum devices due to their high thermal conductivity, high insulation, low dielectric constant, low dielectric loss and strong process adaptability.

[0003] Generally speaking, due to the poor wettability of solder on the ceramic surface, pure ceramics cannot be directly sealed with other metal parts. Therefore, the beryllium oxide ceramic must be metallized first, that is, a layer of electronic paste is applied to the surface of the beryllium oxide ceramic, and then sintered in a reducing atmosphere. However, in the process of metallization of ceramic parts, the metallization strength is often low or even falls off. In order to improve the bonding strength between the electronic paste and the high-purity beryllium oxide ceramic, inorganic phases such as beryllium oxide powder must be added to the tungsten paste to achieve vacuum sealing between the tungsten paste and the beryllium oxide ceramic. The sintering temperature of beryllium oxide powder is usually above 1700℃, so the sintering temperature of tungsten paste with beryllium oxide powder is also high. In addition, beryllium oxide powder is highly toxic, which seriously endangers the health of workers who prepare electronic paste.

[0004] Therefore, there is an urgent need for an electronic paste that does not contain beryllium oxide powder, which can achieve high-strength bonding with high-purity beryllium oxide ceramics while avoiding the harm of beryllium oxide powder to operators. Summary of the invention

[0005] In order to overcome the problems existing in the related art, the embodiment of the present application provides an electronic paste for beryllium oxide ceramics and a preparation method thereof. The electronic paste prepared by the preparation method can achieve high-strength bonding with high-purity beryllium oxide ceramics while protecting the workers preparing the electronic paste from the harm of beryllium oxide powder.

[0006] This application is implemented through the following technical solutions:

[0007] In a first aspect, an embodiment of the present application provides a method for preparing an electronic slurry for beryllium oxide ceramics, comprising: mixing an inorganic powder and a metal powder and ball-milling them to obtain a mixed powder, wherein the inorganic powder comprises one or more of aluminum oxide, silicon dioxide, calcium oxide, magnesium oxide and chromium oxide; heating and stirring the mixed powder and a binder solvent to obtain a base slurry, and then grinding and drying the mixed powder and a binder solvent by a disperser to obtain a base slurry; and rolling the base slurry to obtain an electronic slurry for beryllium oxide ceramics.

[0008] In a possible implementation of the first aspect, the binder solvent accounts for 10-15% of the mass percentage of the electronic paste, the inorganic powder accounts for 5-10% of the mass percentage of the electronic paste, and the metal powder accounts for 80-85% of the mass percentage of the electronic paste; wherein the binder solvent includes, by mass percentage, 1-1.5% of the resin, 7.5-13.5% of the solvent, and 0.5-1% of the plasticizer.

[0009] In a possible implementation manner of the first aspect, the resin includes one or more of ethyl cellulose, acrylic resin, and polyvinyl butyral resin.

[0010] In a possible implementation manner of the first aspect, the solvent includes one or more of terpineol, carbitol acetate, and triethylene glycol dimethyl ether.

[0011] In a possible implementation manner of the first aspect, the plasticizer includes one or more of dibutyl phthalate, dioctyl phthalate, and di-n-octyl phthalate.

[0012] In a possible implementation of the first aspect, the metal powder includes tungsten powder and molybdenum powder, and the particle size D of the tungsten powder is 50 The particle size of molybdenum powder is 1 μm. 50 1 μm; Alumina includes α-alumina, and the particle size of α-alumina is D 50 is 2μm.

[0013] In a possible implementation of the first aspect, the ball milling speed is 80 to 100 r / min, and the ball milling time is 4 to 6 hours.

[0014] In a possible implementation of the first aspect, the mixed powder and binder solvent are heated and stirred uniformly, including: a stirring time of 4 to 6 hours, a stirring rate of 200 to 300 rpm, and a stirring temperature of 60 to 70°C.

[0015] In a possible implementation of the first aspect, the set temperature of the disperser is 30 to 50° C., and the set time is 1 to 2 hours.

[0016] In a second aspect, an embodiment of the present application provides an electronic paste for beryllium oxide ceramics, which is prepared by the method for preparing the electronic paste for beryllium oxide ceramics as described in any one of the first aspects.

[0017] Compared with the prior art, the embodiments of the present invention have the following beneficial effects:

[0018] In the method for preparing an electronic paste for beryllium oxide ceramics provided in an embodiment of the present application, inorganic powder, metal powder and binder solvent are subjected to ball milling, dispersion, rolling and other processes in sequence to obtain an electronic paste for beryllium oxide ceramics. The electronic paste optimizes the components of the inorganic powder and removes the highly toxic beryllium oxide powder, which not only achieves high-strength bonding with high-purity beryllium oxide ceramics and reduces the sintering temperature of the electronic paste, but also protects the electronic paste preparation personnel from the harm of highly toxic materials.

[0019] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present specification. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described in detail below in conjunction with the embodiments. It should be understood that the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0021] The present application provides a method for preparing an electronic slurry for beryllium oxide ceramics, and the specific steps are described as follows:

[0022] Inorganic powder and metal powder are mixed and ball-milled to obtain mixed powder, wherein the inorganic powder includes one or more of aluminum oxide, silicon dioxide, calcium oxide, magnesium oxide and chromium trioxide; the mixed powder and binder solvent are heated and stirred evenly, and then ground and dried by a disperser to obtain a basic slurry; the basic slurry is rolled to obtain an electronic slurry for beryllium oxide ceramics.

[0023] In the method for preparing an electronic paste for beryllium oxide ceramics provided in an embodiment of the present application, inorganic powder, metal powder and binder solvent are subjected to ball milling, dispersion, rolling and other processes in sequence to obtain an electronic paste for beryllium oxide ceramics. The electronic paste optimizes the components of the inorganic powder and removes the highly toxic beryllium oxide powder, which not only achieves high-strength bonding with high-purity beryllium oxide ceramics and reduces the sintering temperature of the electronic paste, but also protects the electronic paste preparation personnel from the harm of highly toxic materials.

[0024] In some embodiments, the process of mixing the inorganic powder and the metal powder and ball milling to obtain the mixed powder can be achieved by performing steps (a) and (b), as described in detail below:

[0025] Step (a), mixing inorganic powders and ball milling to obtain mixed inorganic powders.

[0026] Optionally, the inorganic powder includes one or more of aluminum oxide, silicon dioxide, calcium oxide, magnesium oxide and chromium oxide.

[0027] Furthermore, the calcium oxide and magnesium oxide in the inorganic powder can also be replaced by carbonate substances containing calcium and magnesium elements.

[0028] Preferably, the aluminum oxide may be α-alumina, and the particle size D of the α-alumina is 50 is 2μm.

[0029] In this step, the inorganic powder can be added into the ball milling tank of the planetary ball mill for mixing and ball milling.

[0030] Optionally, ball milling balls may be placed in the ball milling jar to improve the ball milling effect. The ball milling balls may be zirconia balls or steel balls, etc., and this application does not further limit this.

[0031] Preferably, the planetary ball mill is set at a ball milling speed of 80 to 100 r / min, and a ball milling time of 4 to 6 h.

[0032] Step (b), mixing the mixed inorganic powder and the metal powder and ball milling to obtain a mixed powder.

[0033] Optionally, the metal powder may include tungsten powder and molybdenum powder.

[0034] As a preferred embodiment, the particle size D of the tungsten powder is 50 The particle size of molybdenum powder is 1 μm. 50 1μm.

[0035] In this step, the inorganic powder can be added into the ball milling tank of the planetary ball mill for mixing and ball milling.

[0036] Optionally, ball milling balls may be placed in the ball milling jar to improve the ball milling effect. The ball milling balls may be zirconia balls or steel balls, etc., and this application does not further limit this.

[0037] Preferably, the planetary ball mill is set at a ball milling speed of 80 to 100 r / min, and a ball milling time of 4 to 6 h.

[0038] In some embodiments, the mixed powder and the binder solvent are heated and stirred uniformly, and then ground and dried by a disperser to obtain a basic slurry, which can be achieved by the following steps (c) and (d), as described in detail below:

[0039] Step (c), heating and stirring the mixed powder and binder solvent evenly.

[0040] Exemplarily, the binder solvent may include a resin, a solvent, and a plasticizer.

[0041] Furthermore, the resin may include one or more combinations of ethyl cellulose, acrylic resin, and polyvinyl butyral resin.

[0042] Further, a combination of one or more of terpineol, carbitol acetate, and triethylene glycol dimethyl ether is exemplified, and the mixed powder and the binder solvent are added into a reaction kettle for heating and stirring.

[0043] Exemplarily, one or more of magnetic stirring or mechanical stirring may be used for stirring once, which is not further limited in the present application.

[0044] Preferably, the stirring time is 4 to 6 hours, the stirring rate is 200 to 300 rpm, and the stirring temperature is 60 to 70°C.

[0045] Step (d), grinding and drying the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry.

[0046] Optionally, the uniformly stirred mixed powder and binder solvent are ground and dried by a vacuum disperser. The vacuum disperser disperses and dissolves the lumps that are not completely dissolved in the mixed powder through the high-speed rotation of the rotor, so that the inorganic powder, the metal powder and the binder solvent are better integrated to achieve an emulsified and homogenized state.

[0047] Optionally, the setting temperature of the vacuum disperser is 30-50° C., and the setting time is 1-2 hours.

[0048] In some embodiments, the process of rolling the base slurry to obtain the electronic slurry for beryllium oxide ceramics can be achieved by performing step (e).

[0049] Optionally, the base slurry is ground and dispersed by a three-roll mill to obtain an electronic slurry for beryllium oxide ceramics. The particle size of the obtained electronic slurry is less than 2 μm.

[0050] The above is a method for preparing electronic paste for beryllium oxide ceramics.

[0051] The present application also provides an electronic paste prepared by a method for preparing an electronic paste for beryllium oxide ceramics. The mass proportions of the components in the electronic paste are as follows:

[0052] Preferably, the binder solvent accounts for 10-15% of the electronic paste by mass, the inorganic powder accounts for 5-10% of the electronic paste by mass, and the metal powder accounts for 80-85% of the electronic paste by mass.

[0053] More preferably, the binder solvent comprises, by mass percentage, 1 to 1.5% of resin, 7.5 to 13.5% of solvent, and 0.5 to 1% of plasticizer.

[0054] In the method for preparing an electronic paste for beryllium oxide ceramics provided in an embodiment of the present application, inorganic powder, metal powder and binder solvent are subjected to ball milling, dispersion, rolling and other processes in sequence to obtain an electronic paste for beryllium oxide ceramics. The electronic paste optimizes the components of the inorganic powder and removes the highly toxic beryllium oxide powder, which not only achieves high-strength bonding with high-purity beryllium oxide ceramics and reduces the sintering temperature of the electronic paste, but also protects the electronic paste preparation personnel from the harm of highly toxic materials.

[0055] In order to verify the beneficial effects of the electronic paste prepared by the method for preparing the electronic paste for beryllium oxide ceramics provided in the present application, the following specific examples are provided, which are described in detail as follows:

[0056] Embodiment 1:

[0057] The first electronic paste for beryllium oxide ceramics comprises the following components in percentage by weight:

[0058] Binder solvent accounts for 10%, inorganic powder accounts for 5%, and metal powder accounts for 85%.

[0059] The binder solvent 10% includes 1% resin, 8.5% solvent and 0.5% plasticizer; the inorganic powder includes 4% α-alumina, 0.3% silicon dioxide, 0.3% calcium oxide and 0.4% magnesium oxide.

[0060] The resin is ethyl cellulose, the solvent is pineol, and the plasticizer is dioctyl phthalate.

[0061] The first method for preparing an electronic paste for beryllium oxide ceramics comprises the following steps:

[0062] Step 101, mixing inorganic powders and ball-milling to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 100 r / min, and the ball milling time is 6 h.

[0063] Step 102: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 100 r / min and the ball milling time is 6 hours.

[0064] Step 103: Heat and stir the mixed powder and binder solvent evenly, wherein the stirring time is 4 hours, the stirring rate is 200 rpm, and the stirring temperature is 60°C.

[0065] Step 104: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 50° C. and the setting time is 2 hours.

[0066] Step 105 : Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0067] Step 106: Print the electronic paste on a raw ceramic tape of high-purity beryllium oxide, and manufacture a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0068] Embodiment 2:

[0069] The second electronic paste for beryllium oxide ceramics includes the following composition in percentage by weight:

[0070] The binder solvent accounts for 10%, the inorganic powder accounts for 10%, and the metal powder accounts for 80%.

[0071] The binder solvent 10% includes 1% resin, 8.5% solvent and 0.5% plasticizer; the inorganic powder includes 8% α-alumina, 0.6% silicon dioxide, 0.6% calcium oxide and 0.8% magnesium oxide.

[0072] The resin is a combination of ethyl cellulose and acrylic resin, the solvent is a combination of pineol and carbitol acetate, and the plasticizer is a combination of dioctyl phthalate and dioctyl phthalate.

[0073] The second method for preparing the electronic paste for beryllium oxide ceramics comprises the following steps:

[0074] Step 201: Mix inorganic powders and perform ball milling to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 90 r / min and the ball milling time is 5 h.

[0075] Step 202: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 90 r / min and the ball milling time is 5 h.

[0076] Step 203: Heat and stir the mixed powder and binder solvent evenly, wherein the stirring time is 6 hours, the stirring rate is 300 rpm, and the stirring temperature is 70°C.

[0077] Step 204: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 40° C. and the setting time is 1.5 hours.

[0078] Step 205 : Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0079] Step 206: Print the electronic paste on a raw ceramic tape of high-purity beryllium oxide, and manufacture a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0080] Embodiment 3:

[0081] A third electronic paste for beryllium oxide ceramics includes the following composition in percentage by weight:

[0082] Binder solvent accounts for 10%, inorganic powder accounts for 8%, and metal powder accounts for 82%.

[0083] The binder solvent 10% includes 1% resin, 8.5% solvent and 0.5% plasticizer; the inorganic powder includes 6% α-alumina, 0.4% silicon dioxide, 0.6% calcium oxide and 1% magnesium oxide.

[0084] The resin is a combination of ethyl cellulose, acrylic resin and polyvinyl butyral resin, the solvent is a combination of pineol, carbitol acetate and triethylene glycol dimethyl ether, and the plasticizer is a combination of dioctyl phthalate, dioctyl phthalate and di-n-octyl phthalate.

[0085] The third method for preparing the electronic paste for beryllium oxide ceramics comprises the following steps:

[0086] Step 301: Mix inorganic powders and perform ball milling to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 80 r / min and the ball milling time is 4 h.

[0087] Step 302: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 80 r / min and the ball milling time is 4 hours.

[0088] Step 303: Heat and stir the mixed powder and binder solvent evenly, wherein the stirring time is 5 hours, the stirring rate is 255 rpm, and the stirring temperature is 67°C.

[0089] Step 304: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 30° C. and the setting time is 1 hour.

[0090] Step 305: Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0091] Step 306: Print the electronic paste on the raw ceramic tape of high-purity beryllium oxide, and make a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0092] Embodiment 4:

[0093] A fourth electronic paste for beryllium oxide ceramics includes the following composition in percentage by weight:

[0094] Binder solvent accounts for 15%, inorganic powder accounts for 5%, and metal powder accounts for 80%.

[0095] The binder solvent 15% includes 1.5% resin, 12.5% ​​solvent and 1% plasticizer; the inorganic powder includes 4% α-alumina, 0.3% silicon dioxide, 0.3% calcium oxide and 4% magnesium oxide.

[0096] The resin is a combination of ethyl cellulose, acrylic resin and polyvinyl butyral resin, the solvent is a combination of pineol, carbitol acetate and triethylene glycol dimethyl ether, and the plasticizer is a combination of dioctyl phthalate, dioctyl phthalate and di-n-octyl phthalate.

[0097] A fourth method for preparing an electronic paste for beryllium oxide ceramics comprises the following steps:

[0098] Step 401: Mix and ball-mill the inorganic powders to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 85 r / min and the ball milling time is 4.5 h.

[0099] Step 402: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 85 r / min and the ball milling time is 4.5 h.

[0100] Step 403: Heat and stir the mixed powder and binder solvent until uniform, wherein the stirring time is 5 hours, the stirring rate is 255 pm, and the stirring temperature is 67°C.

[0101] Step 404: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 35° C. and the setting time is 1.5 hours.

[0102] Step 405: Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0103] Step 406: Print the electronic paste on a raw ceramic tape of high-purity beryllium oxide, and manufacture a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0104] Comparative Example 1:

[0105] A fifth electronic paste for beryllium oxide ceramics comprises the following composition in percentage by weight:

[0106] Binder solvent accounts for 15%, inorganic powder accounts for 15%, and metal powder accounts for 70%.

[0107] The binder solvent 15% includes 1.5% resin, 12.5% ​​solvent and 1% plasticizer; the inorganic powder

[0108] The body contains 11% α-alumina, 1% silicon dioxide, 1% calcium oxide and 2% magnesium oxide.

[0109] The resin is a combination of ethyl cellulose, acrylic resin and polyvinyl butyral resin, the solvent is a combination of pineol, carbitol acetate and triethylene glycol dimethyl ether, and the plasticizer is a combination of dioctyl phthalate, dioctyl phthalate and di-n-octyl phthalate.

[0110] A fifth method for preparing an electronic paste for beryllium oxide ceramics comprises the following steps:

[0111] Step 501: Mix inorganic powders and perform ball milling to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 80 r / min and the ball milling time is 4 h.

[0112] Step 502: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 80 r / min and the ball milling time is 4 hours.

[0113] Step 503: Heat and stir the mixed powder and binder solvent until uniform, wherein the stirring time is 3 hours.

[0114] The stirring rate was 200 rpm and the stirring temperature was 80 °C.

[0115] Step 504: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 30° C. and the setting time is 1 hour.

[0116] Step 505: Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0117] Step 506: Print the electronic paste on a raw ceramic tape of high-purity beryllium oxide, and manufacture a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0118] Comparative Example 2:

[0119] A sixth electronic paste for beryllium oxide ceramics comprises the following compositions in percentage by weight:

[0120] Binder solvent accounts for 15%, inorganic powder accounts for 5%, and metal powder accounts for 80%.

[0121] The binder solvent 15% includes 1.5% resin, 12.5% ​​solvent and 1% plasticizer; the inorganic powder includes 4% α-alumina, 0.3% silicon dioxide, 0.3% calcium oxide and 4% magnesium oxide.

[0122] The resin is a combination of ethyl cellulose, acrylic resin and polyvinyl butyral resin, the solvent is a combination of pineol, carbitol acetate and triethylene glycol dimethyl ether, and the plasticizer is a combination of dioctyl phthalate, dioctyl phthalate and di-n-octyl phthalate.

[0123] A sixth method for preparing an electronic paste for beryllium oxide ceramics comprises the following steps:

[0124] Step 601: Mix inorganic powders and perform ball milling to obtain mixed inorganic powders, wherein the ball milling speed of the planetary ball mill is 70 r / min and the ball milling time is 3 h.

[0125] Step 602: Mix the mixed inorganic powder and the metal powder and perform ball milling to obtain a mixed powder, wherein the ball milling speed of the planetary ball mill is 70 r / min and the ball milling time is 3 h.

[0126] Step 603: Heat and stir the mixed powder and binder solvent until uniform, wherein the stirring time is 3 hours, the stirring rate is 200 rpm, and the stirring temperature is 75°C.

[0127] Step 604: Grind and dry the uniformly stirred mixed powder and binder solvent by a disperser to obtain a basic slurry. The setting temperature of the vacuum disperser is 25° C. and the setting time is 0.5 h.

[0128] Step 605: Grind and disperse the base slurry by a three-roll grinder to obtain electronic slurry for beryllium oxide ceramics.

[0129] Step 606: Print the electronic paste on a raw ceramic tape of high-purity beryllium oxide, and manufacture a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0130] Comparative Example 3:

[0131] The existing electronic paste containing beryllium oxide powder is directly printed on a raw ceramic tape of high-purity beryllium oxide, and is made into a tensile test piece through multiple processes such as high-temperature sintering, nickel plating, and brazing.

[0132] It should be noted that Examples 1 to 4 strictly follow the electronic paste components and electronic paste preparation methods disclosed in this application; Comparative Example 1 does not follow the electronic paste components disclosed in this application, but follows the electronic paste preparation method disclosed in this application; Comparative Example 2 strictly follows the electronic paste components disclosed in this application, but does not follow the electronic paste preparation method disclosed in this application; Comparative Example 3 does not prepare electronic paste.

[0133] The tensile strength test was performed on Examples 1 to 4 and Comparative Examples 1 to 3. The test results are shown in Table 1:

[0134] Table 1

[0135] Maximum force N Tensile strength MPa Example 1 58 28 Example 2 56 25 Example 3 60 30 Example 4 52 23 Comparative Example 1 40 15 Comparative Example 2 44 17 Comparative Example 3 54 24

[0136] From the tensile strength test results in Table 1, it can be seen that the tensile strength of Examples 1 to 4 strictly following the electronic paste composition and electronic paste preparation method disclosed in this application is substantially the same as the tensile strength of Comparative Example 3 of the electronic paste using existing beryllium oxide powder.

[0137] The embodiments described above are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, a person skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. Such modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application, and should all be included in the protection scope of the present application.

Claims

1. A method for preparing an electronic slurry for beryllium oxide ceramics, characterized in that: include: The inorganic powder and the metal powder are mixed and ball-milled to obtain a mixed powder, wherein the inorganic powder is a combination of aluminum oxide, silicon dioxide, calcium oxide, magnesium oxide and chromium trioxide; and the metal powder is a combination of tungsten powder and molybdenum powder; The mixed powder and the binder solvent are heated and stirred uniformly, and then ground and dried by a disperser to obtain a basic slurry; Rolling the base slurry to obtain an electronic slurry for beryllium oxide ceramics; The binder solvent accounts for 10-15% of the mass percentage of the electronic paste, the inorganic powder accounts for 5-10% of the mass percentage of the electronic paste, and the metal powder accounts for 80-85% of the mass percentage of the electronic paste; The binder solvent comprises, by mass percentage, 1-1.5% of resin, 7.5-13.5% of solvent and 0.5-1% of plasticizer; The inorganic powder and the metal powder are mixed and ball-milled to obtain a mixed powder, comprising: the ball milling speed is 80-100 r / min, and the ball milling time is 4-6 h; The mixed powder and binder solvent are heated and stirred uniformly, including: a stirring time of 4 to 6 hours, a stirring rate of 200 to 300 rpm, and a stirring temperature of 60 to 70° C.; The grinding and drying by a disperser includes: the setting temperature of the disperser is 30-50° C., and the setting time is 1-2 hours.

2. The method for preparing an electronic slurry for beryllium oxide ceramics according to claim 1, characterized in that: The resin includes one or more of ethyl cellulose, acrylic resin, and polyvinyl butyral resin.

3. The method for preparing an electronic slurry for beryllium oxide ceramics according to claim 1, characterized in that: The solvent includes one or more of terpineol, carbitol acetate, and triethylene glycol dimethyl ether.

4. The method for preparing an electronic slurry for beryllium oxide ceramics according to claim 1, characterized in that: The plasticizer includes one or more of dibutyl phthalate, dioctyl phthalate, and di-n-octyl phthalate.

5. The method for preparing an electronic slurry for beryllium oxide ceramics according to claim 1, characterized in that: The particle size D of the tungsten powder 50 The particle size D of the molybdenum powder is 1 μm. 50 1μm; The aluminum oxide includes α-aluminum oxide, and the particle size D of the α-aluminum oxide is 50 2μm.

6. An electronic slurry for beryllium oxide ceramics, characterized in that: The invention is prepared by the method for preparing electronic slurry for beryllium oxide ceramics as described in any one of claims 1 to 5.