Improvement method of resin wheel dressing step for 12-inch silicon wafer chamfering process

Abstract

This invention relates to an improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers, belonging to the field of silicon wafer processing technology. The method includes the following steps: Step 1: Groove preparation. First, determine the height of the base peripheral grinding wheel and the notch grinding wheel. Place the silicon wafer on a grinding table for rough and fine grinding of the grooves. Step 2: Baffle test grinding. First, perform rough peripheral grinding and notch grinding on the baffle. If the [upper width - lower width] > 20 μm, proceed to the correction interface to ensure that [upper width - lower width] ≤ 20 μm, and then perform fine peripheral grinding and notch grinding again. The center of the peripheral grinding wheel and the notch grinding wheel is found through the baffle test grinding process. Step 3: Resin grinding wheel shaping. Step 4: The shaped resin grinding wheel is test-ground using a grinding program, followed by test-grounding of the baffle. After the test grinding meets the requirements, silicon wafer chamfering processing is carried out. This systematizes the operation steps, avoiding overly cumbersome procedures that could lead to errors and waste of manpower, resources, and time.

Description

Technical Field

[0001] This invention relates to the field of silicon wafer processing technology, and specifically to an improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers. Background Technology

[0002] The beveling process for silicon wafers relies heavily on resin grinding wheels, but these wheels wear down and require reshaping. However, the resin grinding wheel reshaping process for 12-inch silicon wafers presents the following drawbacks:

[0003] 1) Due to the complicated process, the resin grinding wheel shaping process for the chamfering of 12-inch silicon wafers often fails.

[0004] 2) Frequent staff turnover and loss of experienced personnel lead to a break in the succession of skills, resulting in wasted time and materials;

[0005] 3) Lack of systematic organization leads to wasted training time and insignificant results;

[0006] 4) The lack of a unified work process caused chaos in on-site operations. Summary of the Invention

[0007] This invention addresses the shortcomings of existing technologies by providing an improved method for the resin wheel shaping step in the chamfering process of 12-inch silicon wafers. This method is characterized by its ease of operation and high effectiveness. By systematizing the operation steps, operators gain a clear logical approach to operating the machine, effectively managing the resin wheel shaping process and avoiding overly cumbersome procedures that could lead to errors and waste of manpower, resources, and time.

[0008] The above-mentioned technical problems of the present invention are mainly solved by the following technical solutions:

[0009] An improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers includes the following steps:

[0010] Step 1: Perform trenching. First, find the height of the base peripheral grinding wheel and the Notch grinding wheel. Place the silicon wafer on the grinding table and perform peripheral rough grinding (800 grit), peripheral fine grinding (3000 grit), Notch rough grinding (800 grit), and Notch fine grinding (1500 grit) on the silicon wafer in sequence.

[0011] Step 2: Perform test grinding of the baffle. Locate the center of the outer peripheral grinding wheel and the Notch grinding wheel. First, perform rough grinding of the outer peripheral baffle and rough grinding of the Notch. During the test grinding of the baffle, if the [upper width - lower width] > 20 μm, go to the correction interface and make the [upper width - lower width] ≦ 20 μm. Then, perform fine grinding of the outer peripheral baffle and fine grinding of the Notch again. By finding the center of the outer peripheral grinding wheel and the Notch grinding wheel through the test grinding process of the baffle, a solid foundation is laid for the shaping of the resin grinding wheel.

[0012] Step 3: Shape the resin grinding wheel. Test the dressing groove with a test piece, then test the dressing groove with a shaping piece, then grind the shaping piece with a grooving program, and finally test grind with a test piece.

[0013] Step 4: After shaping, the resin grinding wheel is tested with a grinding program. Depending on the specifications, one-time molding or two-time molding is selected. Then, the baffle is tested with a grinding program. After the test grinding meets the requirements, the silicon wafer chamfering process is carried out.

[0014] As a preferred option, when no groove grinding is performed during the grooving process, the height of the grinding table is adjusted based on the Z-axis data input.

[0015] As a preferred option, when testing the trimming groove with a test piece, if the upper width minus the lower width is greater than 20 μm, then proceed to the correction interface and ensure that the upper width minus the lower width is less than or equal to 20 μm.

[0016] As a preferred option, when testing the trimming groove with the shaping plate, if the upper width - lower width > 30 μm, then go to the correction interface and make the upper width - lower width ≤ 30 μm.

[0017] Preferably, when grinding and shaping the wafer using the grooving program, if the upper width minus the lower width is greater than 50 μm, then go to the correction interface and make the upper width minus the lower width less than 50 μm.

[0018] As a preferred option, when testing with the test piece, if the upper width minus the lower width is greater than 20 μm, then proceed to the correction interface and ensure that the upper width minus the lower width is less than or equal to 20 μm.

[0019] Preferably, when testing the baffle with a grinding program after the resin grinding wheel has been shaped, if the upper width minus the lower width is greater than 20 μm, then proceed to the correction interface and ensure that the upper width minus the lower width is less than or equal to 20 μm.

[0020] The present invention can achieve the following effects:

[0021] This invention provides an improved method for the resin wheel shaping step in the chamfering process of 12-inch silicon wafers. Compared with existing technologies, it features convenient operation and better results. The systematization of the operation steps provides operators with a clear logical framework for operating the machine, effectively managing the resin wheel shaping process and avoiding overly cumbersome procedures that could lead to errors and waste of manpower, resources, and time. Detailed Implementation

[0022] The technical solution of the invention will be further described in detail below through examples.

[0023] Example: An improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers, comprising the following steps:

[0024] Step 1: Perform trenching. First, determine the heights of the base peripheral grinding wheel and the Notch grinding wheel. Place the silicon wafer on the grinding table and sequentially perform peripheral rough grinding (800 grit), peripheral fine grinding (3000 grit), Notch rough grinding (800 grit), and Notch fine grinding (1500 grit) grooves on the silicon wafer. If trenching is not performed during the trenching process, adjust the grinding table height according to the Z-axis data input.

[0025] Step 2: Perform test grinding of the baffle. Locate the center of the outer peripheral grinding wheel and the Notch grinding wheel. First, perform rough grinding of the outer peripheral baffle and rough grinding of the Notch. During the test grinding of the baffle, if the [upper width - lower width] > 20 μm, go to the correction interface and make the [upper width - lower width] ≦ 20 μm. Then, perform fine grinding of the outer peripheral baffle and fine grinding of the Notch again. By finding the center of the outer peripheral grinding wheel and the Notch grinding wheel through the test grinding process of the baffle, a solid foundation is laid for the shaping of the resin grinding wheel.

[0026] Step 3: Shape the resin grinding wheel. Use a test piece to test the dressing groove. When testing the dressing groove with the test piece, if the [upper width - lower width] > 20 μm, go to the correction interface and make [upper width - lower width] ≤ 20 μm. Next, use a shaping piece to test the dressing groove. When testing the dressing groove with the shaping piece, if the [upper width - lower width] > 30 μm, go to the correction interface and make [upper width - lower width] ≤ 30 μm. Then, grind the shaping piece using the grooving program. When grinding the shaping piece using the grooving program, if the [upper width - lower width] > 50 μm, go to the correction interface and make [upper width - lower width] ≤ 50 μm. Finally, test grinding is performed using a test piece. When testing with the test piece, if the upper width - lower width > 20 μm, then proceed to the correction interface and ensure that the upper width - lower width is ≤ 20 μm.

[0027] Step 4: After shaping the resin grinding wheel, test grind it using a grinding program. Select one-time or two-time forming according to the specifications. Then, test grind the baffle using the grinding program. When testing the baffle after shaping the resin grinding wheel, if the [upper width - lower width] > 20 μm, proceed to the correction interface to ensure that [upper width - lower width] ≦ 20 μm. After the test grinding meets the requirements, proceed with the silicon wafer chamfering process.

[0028] In summary, the improved method for the resin wheel shaping step in the chamfering process of 12-inch silicon wafers is characterized by its ease of operation and high effectiveness. Systematizing the operation steps provides operators with a clear logical framework for operating the machine, ensuring effective operation of the resin wheel shaping step and avoiding overly cumbersome procedures that could lead to errors and waste of manpower, resources, and time.

[0029] The above description is only a specific embodiment of the present invention, but the structural features of the present invention are not limited thereto. Any changes or modifications made by those skilled in the art within the scope of the present invention are covered by the patent scope of the present invention.

Claims

1. An improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers, characterized in that... The following steps are included: Step 1: Perform trenching. First, find the height of the base peripheral grinding wheel and the Notch grinding wheel. Place the silicon wafer on the grinding table and perform peripheral rough grinding (800 grit), peripheral fine grinding (3000 grit), Notch rough grinding (800 grit), and Notch fine grinding (1500 grit) on the silicon wafer in sequence. Step 2: Perform test grinding of the baffle to locate the center of the outer peripheral grinding wheel and the Notch grinding wheel. First, perform rough grinding of the outer peripheral baffle and rough grinding of the Notch grinding wheel. During the test grinding of the baffle, if the [upper width - lower width] > 20 μm, go to the correction interface and make the [upper width - lower width] ≦ 20 μm. Then, perform fine grinding of the outer peripheral baffle and fine grinding of the Notch grinding wheel again. By finding the center of the outer peripheral grinding wheel and the Notch grinding wheel through the test grinding of the baffle, a solid foundation is laid for the shaping of the resin grinding wheel. Step 3: Shape the resin grinding wheel. Test the dressing groove with a test piece, then test the dressing groove with a shaping piece, then grind the shaping piece with a grooving program, and finally test grind with a test piece. Step 4: After shaping, the resin grinding wheel is tested with a grinding program. Depending on the specifications, one-time molding or two-time molding is selected. Then, the baffle is tested with a grinding program. After the test grinding meets the requirements, the silicon wafer chamfering process is carried out.

2. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When the groove is not being ground during the grooving process, adjust the height of the grinding table according to the Z-axis data input.

3. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When testing the trimming groove with a test piece, if the upper width minus the lower width is greater than 20 μm, then go to the correction interface and make the upper width minus the lower width less than 20 μm.

4. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When testing the trimming groove with a shaping plate, if the upper width minus the lower width is greater than 30 μm, then go to the correction interface and make the upper width minus the lower width less than 30 μm.

5. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When grinding and shaping the wafer using the grooving program, if the upper width minus the lower width is greater than 50 μm, then go to the correction interface and make the upper width minus the lower width less than 50 μm.

6. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When testing with the test piece, if the upper width minus the lower width is greater than 20 μm, then go to the correction interface and make the upper width minus the lower width less than 20 μm.

7. The improved method for the resin grinding wheel shaping step in the chamfering process of 12-inch silicon wafers according to claim 1, characterized in that: When testing the baffle with a grinding program after the resin grinding wheel has been shaped, if the upper width minus the lower width is greater than 20 μm, then proceed to the correction interface and ensure that the upper width minus the lower width is less than or equal to 20 μm.