Heating assembly, heat treatment equipment and substrate processing method

Abstract

The present invention discloses a heating assembly, a heat treatment device and a substrate processing method, wherein the heating assembly is used for the heat treatment device, the heat treatment device comprises a processing chamber, a base and a base support arm, the base and the base support arm are arranged in the processing chamber, the base is used to carry the substrate, and the heating assembly is used to heat the substrate, comprising: a support member, a plurality of heating units distributed on the support member in a matrix, each heating unit correspondingly forming a heating zone on the plane where the substrate is located; a control device connected to each heating unit for independently controlling each heating unit; the heating zone comprises a low temperature zone that changes synchronously with the rotation of the base support arm; and a thermal compensation zone that changes synchronously with the low temperature zone in real time for compensating the temperature of the low temperature zone. The present invention improves the temperature uniformity of the substrate surface.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a heating component, heat treatment equipment and a substrate processing method. Background Art

[0002] Chemical Vapor Deposition (CVD) is a chemical technology used to produce high-purity, high-performance solid materials. The semiconductor industry uses this technology to grow thin films. The typical CVD process is to expose the wafer (substrate) to one or more different precursors, and chemical reactions and / or chemical decompositions occur on the substrate surface to produce the film to be deposited. Different by-products are usually produced during the reaction process, but most of them will be carried away with the gas flow and will not remain in the reaction chamber.

[0003] In existing CVD epitaxial equipment, the substrate is supported by a multi-arm shaft inside the chamber and below the substrate, among which the three-arm shaft evenly distributed around the circumference is more common. The three-arm shaft can be used to rotate, lift, and support the substrate. The three-arm shaft is usually made of transparent quartz with high light transmittance.

[0004] When the CVD epitaxial equipment performs the epitaxial process, the infrared heating lamps installed outside the reaction chamber provide the substrate inside the chamber with the temperature required for the reaction (1100-1200 degrees Celsius), wherein the upper and lower parts of the chamber are made of transparent quartz, or the entire chamber is made of transparent quartz. The heating lamps are respectively distributed in the upper and lower parts of the chamber to heat the front and back of the substrate. At the same time, the substrate is driven to rotate by the three-arm shaft to achieve heating of the substrate.

[0005] However, due to the influence of structure and materials (transparent quartz cannot transmit heating light 100%), in actual applications, due to the existence of the three-arm axis, the three arms will always block the heating light from the heating lamp group below, thereby affecting the temperature of the substrate in the area corresponding to the three arms. The temperature is lower than that in the area not affected by the three arms, resulting in a difference in the surface temperature of the substrate; and because the rotation speed of the three-arm axis is not high during actual process operation, the effect of eliminating this influence caused by the structure and materials is not ideal, and there will always be a low-temperature shadow area formed by the shielding effect in the substrate position area corresponding to the three arms. Summary of the invention

[0006] The object of the present invention is to provide a heating component, a heat treatment device and a substrate processing method, which are used to solve the problem of uneven heating of the substrate due to the obstruction of the multi-arm shaft.

[0007] In order to solve the above problems, the present invention is implemented by the following technical solutions:

[0008] A heating assembly is used for heat treatment equipment, the heat treatment equipment includes a processing chamber, a base and a base support arm, the base and the base support arm are arranged in the processing chamber, the base is used to carry a substrate, the base support arm is used to support the base and drive the base to rotate, the heating assembly is used to heat the substrate, including: a support member, a plurality of heating units, the plurality of heating units are distributed on the support member in a matrix manner, each of the heating units forms a corresponding heating zone on the plane where the substrate is located; a control device, which is connected to each of the heating units and is used to independently control each heating unit; the heating zone includes a low-temperature zone, the low-temperature zone is formed due to the base support arm blocking the heating unit, and the low-temperature zone changes synchronously with the rotation of the base support arm; a thermal compensation zone, which changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone.

[0009] Optionally, the control device is used to correspondingly increase the output power of the heating unit directly opposite to the low temperature zone to form the thermal compensation zone.

[0010] Optionally, a plurality of the heating units are distributed on the support plate in a concentric circle pattern; or, a plurality of the heating units are distributed on the support plate in a rectangular pattern.

[0011] Optionally, a distribution area of ​​the plurality of heating units is greater than or equal to an area of ​​the heated substrate.

[0012] Optionally, each of the heating units is a heating lamp.

[0013] Optionally, each of the heating units is a point lamp and / or a strip lamp.

[0014] Optionally, it also includes: a temperature compensator, which is arranged between the heated substrate and the plurality of heating units and corresponds to the low temperature zone in real time, and the temperature compensator is used to converge the heating light emitted by the corresponding heating unit located in the vertical direction thereof, so as to correspondingly enhance the illumination energy of the low temperature zone to form the thermal compensation zone.

[0015] Optionally, the temperature compensator includes a plurality of focusing blades and a compensator shaft, and one end of each of the focusing blades is arranged on the compensator shaft at intervals around the compensator shaft; each of the focusing blades is located between the heated substrate and the plurality of heating units, and corresponds to the low temperature zone in real time.

[0016] Optionally, the compensator shaft is hollow inside.

[0017] Optionally, a cross section of each of the focusing blades is in the shape of a convex lens structure.

[0018] On the other hand, the present invention also provides a heat treatment equipment, including: a first and a second heating component, a processing chamber, a base and a base support arm, the base and the base support arm are arranged in the chamber, the base is used to carry a substrate, and the base support arm is used to support the base and drive the base to rotate; a first heating component, which is located on the top outer surface of the processing chamber, and the first heating component is used to heat the front side of the substrate to be processed; a second heating component, which is located on the bottom outer surface of the processing chamber, and the second heating component is used to heat the back side of the substrate to be processed; the first heating component and / or the second heating component adopts the heating component described above.

[0019] Optionally, the processing chamber comprises a chamber wall, a chamber top cover and a chamber bottom cover; the chamber top cover is located above the chamber wall, and the chamber bottom cover is located below the chamber wall.

[0020] Optionally, the base support arm includes: a rotating shaft, one end of which is connected to the bottom of the base, and the other end passes through the chamber bottom cover and extends to the outside of the processing chamber; a plurality of support arms, which are arranged at intervals around the rotating shaft, one end of each of the support arms is connected to the bottom of the base, and the other end is connected to the rotating shaft; the rotating shaft drives the base to rotate.

[0021] Optionally, the chamber wall is made of any one of stainless steel, aluminum, quartz and ceramic; the chamber top cover is made of transparent quartz material; and the chamber bottom cover is made of transparent quartz material.

[0022] Optionally, when the substrate to be processed is heated, the control device in the first heating assembly controls the output power of the heating unit in the first heating assembly located directly above the low-temperature zone to reach a first preset compensation value, and controls the output power of the remaining heating units to maintain a first original set value; the control device in the second heating assembly controls the output power of the heating unit in the second heating assembly located directly below the low-temperature zone to reach a second preset compensation value, and controls the output power of the remaining heating units to maintain a second original set value.

[0023] Optionally, the first preset compensation value and the second preset compensation value are the same or different; the first original setting value and the second original setting value are the same or different.

[0024] Optionally, the first heating component also includes a first temperature compensator, which includes a plurality of first focusing blades and a first compensator shaft, and the first temperature compensator is arranged between the chamber top cover and several groups of the heating units, and corresponds to the low temperature zone in real time; the second heating component also includes a second temperature compensator, which includes a plurality of second focusing blades and a second compensator shaft, and the second temperature compensator is arranged between the chamber bottom cover and several groups of the heating units, and corresponds to the low temperature zone in real time; the first compensator shaft of the first temperature compensator is arranged at the center of the first heating component, or on the chamber top cover; the second compensator shaft of the second temperature compensator is arranged at the center of the second heating component, or on the rotating shaft.

[0025] Optionally, it also includes an external first driver and a second driver, wherein the first driver is connected to the first compensator shaft, and is used to drive the first compensator shaft to rotate synchronously with the rotating shaft, so that each of the first focusing blades is facing the corresponding low-temperature zone in real time; the second driver is connected to the second compensator shaft, and is used to drive the second compensator shaft to rotate synchronously with the rotating shaft, so that each of the second focusing blades is facing the corresponding low-temperature zone in real time.

[0026] Optionally, it also includes a plurality of first thermometers and a plurality of second thermometers; the plurality of first thermometers are evenly distributed on the first heating component, and are used to detect the temperature of the substrate to be processed in the processing chamber; the plurality of second thermometers are evenly distributed on the second heating component, and are used to detect the temperature of the substrate to be processed.

[0027] On the other hand, the present invention also provides a method for treating a substrate using a heat treatment device, comprising: providing the heat treatment device as described above; using the first heating component to heat the front side of the substrate to be treated; using the second heating component to heat the back side of the base; the plane where the substrate to be treated is located is divided into a plurality of heating zones, and each group of the heating units in the first heating component and the second heating component corresponds to a heating zone; there are a plurality of low-temperature zones in the plurality of heating zones; the low-temperature zone is formed due to the base support arm blocking the heating unit, and the low-temperature zone changes synchronously with the rotation of the base support arm; a thermal compensation zone is formed, which changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone.

[0028] The present invention has at least one of the following advantages:

[0029] A heating component provided by the present invention can be used in heat treatment equipment. Through the provided thermal compensation zone, it changes synchronously with the low-temperature zone in real time to achieve the purpose of compensating the temperature of the low-temperature zone, thereby achieving the improvement of the temperature uniformity of the substrate surface when the heat treatment equipment is used for film forming processes such as wafer epitaxial deposition, thereby improving the quality of the deposited film layer.

[0030] The heating assembly provided by the present invention is used to increase the output power of the heating unit directly facing the low temperature zone through the control device, thereby increasing the heating temperature of the corresponding low temperature zone and achieving the purpose of compensating the temperature of the low temperature zone.

[0031] The heating assembly provided by the present invention can also converge the heating light emitted by the corresponding heating unit located in the vertical direction thereof through the provided temperature compensator, so as to correspondingly enhance the illumination energy of the low temperature zone to form the thermal compensation zone.

[0032] The temperature compensator includes a plurality of focusing blades and a compensator shaft, one end of each focusing blade is arranged on the compensator shaft at intervals around the compensator shaft; each focusing blade is located between the heated substrate and a plurality of the heating units, and corresponds to the low temperature zone in real time.

[0033] Specifically, the low-temperature zone is formed because the base support arm blocks the heating unit, and the low-temperature zone changes synchronously with the rotation of the base support arm; the thermal compensation zone provided by the present invention changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone, thereby achieving the purpose of improving the temperature uniformity of the substrate surface and further improving the quality of the deposited film layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic diagram of the structure of a heat treatment device provided by one embodiment of the present invention;

[0035] Figure 2 A schematic diagram of a heating component provided in the first embodiment of the present invention performing temperature compensation on a low temperature area at time T1;

[0036] Figure 3 A schematic diagram of a heating component providing embodiment 1 of the present invention performing temperature compensation on a low temperature area at time T2;

[0037] Figure 4 A schematic diagram of a heating component providing a second embodiment of the present invention performing temperature compensation on a low temperature area at time T3;

[0038] Figure 5 A schematic diagram of a heating component providing a second embodiment of the present invention performing temperature compensation on a low temperature area at time T4;

[0039] Figure 6 A schematic diagram of the structure of a temperature compensator for a heating assembly provided in Embodiment 2 of the present invention;

[0040] Figure 7 This is a schematic diagram of the focusing blades of the heating assembly provided in the second embodiment of the present invention converging heating light. DETAILED DESCRIPTION

[0041] The following is a further detailed description of a heating component, heat treatment equipment and substrate processing method proposed in the present invention in combination with the specific implementation methods. According to the following description, the advantages and features of the present invention will be clearer. It should be noted that the drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation methods of the present invention. In order to make the purposes, features and advantages of the present invention more obvious and easy to understand, please refer to the drawings. It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no technical substantive significance. Any structural modification, change in proportional relationship or adjustment of size, without affecting the effects that the present invention can produce and the purposes that can be achieved, should still fall within the scope of the technical content disclosed in the present invention.

[0042] Embodiment 1

[0043] Combination Figure 1 to Figure 3 As shown, this embodiment provides a heat treatment device, including: a processing chamber, the processing chamber including a chamber wall 100, a chamber top cover 101 and a chamber bottom cover 102; the chamber top cover 101 is located above the chamber wall 100, and the chamber bottom cover 102 is located below the chamber wall 100.

[0044] The base 200 and the base support arm 201 are arranged in the processing chamber. The base 200 is used to carry the substrate 202, and the base support arm 201 is used to support the base 200 and drive the base 200 to rotate.

[0045] The base support arm 201 includes: a rotating shaft 2012, one end of which is connected to the bottom of the base 200, and the other end passes through the chamber bottom cover 102 and extends to the outside of the processing chamber; a plurality of support arms 2011, which are arranged at intervals around the rotating shaft 2012, one end of each of the support arms 2011 is connected to the bottom of the base 200, and the other end is connected to the rotating shaft 2012; the rotating shaft 2012 drives the base 200 to rotate.

[0046] In this embodiment, the chamber wall is made of any one of stainless steel, aluminum, quartz and ceramic; the chamber top cover 101 is made of transparent quartz material; and the chamber bottom cover 102 is made of transparent quartz material.

[0047] The present embodiment also includes a heating component for heating the substrate 202, and the heating component includes: a support member, a plurality of heating units, the plurality of heating units are distributed in a matrix on the support member, each of the heating units corresponding to a heating zone on the plane where the substrate is located; a control device, which is connected to each of the heating units and is used to independently control each heating unit; the heating zone includes a low-temperature zone, the low-temperature zone is formed because the base support arm blocks the heating unit, causing the heat released by the heating unit to attenuate after passing through the base support arm, and the low-temperature zone changes synchronously with the rotation of the base support arm; a thermal compensation zone, which changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone.

[0048] The control device is used to correspondingly increase the output power of the heating unit directly facing the low temperature zone to form the thermal compensation zone.

[0049] This embodiment provides a thermal compensation zone, which changes synchronously with the low-temperature zone in real time to achieve the purpose of compensating the temperature of the low-temperature zone, thereby improving the temperature uniformity of the substrate surface when using this thermal treatment equipment to perform film forming processes such as wafer epitaxial deposition, thereby improving the quality of the deposited film layer.

[0050] In this embodiment, the number of the heating components is two groups, which are recorded as a first heating component 301 and a second heating component 303; the first heating component 301 is located on the outer surface of the top of the processing chamber (chamber top cover 101), and the first heating component 301 is used to heat the front side of the substrate 202 to be processed; the second heating component 303 is located on the outer surface of the bottom of the processing chamber (chamber bottom cover 102), and the second heating component 303 is used to heat the back side of the substrate 202 to be processed.

[0051] It can be understood that, in some other embodiments, the number of the heating components can be one group, that is, a first heating component 301 or a second heating component 303 is provided.

[0052] When the first heating assembly 301 is arranged above the chamber top cover 101, the output power of the heating unit directly opposite to the low temperature zone can be increased by adjusting the control device in the first heating assembly 301 to form the thermal compensation zone.

[0053] A heating lamp group in the prior art can be arranged under the chamber bottom cover 102 .

[0054] When the second heating assembly 303 is disposed under the chamber bottom cover 102, the output power of the heating unit directly opposite to the low temperature zone can be increased by adjusting the control device in the second heating assembly 303 to form the thermal compensation zone.

[0055] A heating lamp group in the prior art can be arranged above the chamber top cover 101 .

[0056] In this embodiment, the first heating assembly 301 and the second heating assembly 303 have the same structure. When heating the substrate 202 to be processed, the control device in the first heating assembly 301 controls the output power of the heating unit located directly above the low temperature zone in the first heating assembly 301 to reach the first preset compensation value, and controls the output power of the remaining heating units to maintain the first original setting value. The control device in the second heating assembly 303 controls the output power of the heating unit located directly below the low temperature zone in the second heating assembly 303 to reach the second preset compensation value, and controls the output power of the remaining heating units to maintain the second original setting value.

[0057] The first preset compensation value and the second preset compensation value are the same or different; the first original setting value and the second original setting value are the same or different.

[0058] The structure of the heating component is further described below by taking the first heating component 301 as an example:

[0059] Please continue to refer to Figure 2 and Figure 3 As shown, the plurality of heating units 3010 included in the first heating assembly 301 are distributed on the support plate in a concentric circle manner; or, the plurality of heating units 3010 are distributed on the support plate in a rectangular manner.

[0060] The distribution area of ​​the plurality of heating units 3010 is greater than or equal to the area of ​​the heated substrate 202. Each of the heating units 3010 is a heating lamp. Each of the heating units 3010 is a point lamp and / or a strip lamp.

[0061] The low temperature zone is formed due to the support arm 2011 shielding the heating unit, and the low temperature zone changes synchronously with the rotation of the support arm 2011. In this embodiment, the number of the support arms 2011 is three, so the projections of the three support arms 2011 on the back of the substrate 202 or the back of the base 200 are three, and the three projection areas are three low temperature zones. The corresponding thermal compensation zones are also three, and they are in a one-to-one correspondence with the low temperature zones, and correspond to the low temperature zones in real time, and are recorded as the first thermal compensation zone 3011, the second thermal compensation zone 3012 and the third thermal compensation zone 3013, and each thermal compensation zone is Figure 2At time T1, the first support arm of the three support arms is located at Figure 2 On the positive axis of the X-axis shown, the second support arm is located Figure 2 In the second quadrant shown, the third support arm is located at Figure 2 Thus, the control device can simultaneously increase the output power of the plurality of heating units included in the first thermal compensation zone 3011 located directly above the first support arm, the output power of the plurality of heating units included in the second thermal compensation zone 3012 located directly above the second support arm, and the output power of the plurality of heating units included in the third thermal compensation zone 3013 located directly above the third support arm, thereby achieving synchronous temperature compensation for the three low-temperature zones, thereby achieving the purpose of improving the temperature uniformity of the substrate surface.

[0062] Since the three support arms rotate synchronously with the rotation axis 2012, at time T2, Figure 3 As shown, the first support arm of the three support arms is located at Figure 3 The second support arm is located on the negative axis of the X-axis shown in FIG. Figure 3 In the fourth quadrant shown, the third support arm is located at Figure 3 The first quadrant area is shown.

[0063] Therefore, the control device can simultaneously increase the output power of several heating units included in the first thermal compensation zone 3011 located directly above the first support arm, the output power of several heating units included in the second thermal compensation zone 3012 located directly above the second support arm, and the output power of several heating units included in the third thermal compensation zone 3013 located directly above the third support arm, thereby achieving synchronous temperature compensation for the three low-temperature zones, thereby achieving the purpose of improving the temperature uniformity of the substrate surface.

[0064] Please continue to refer to Figure 1 As shown, this embodiment also includes a plurality of first thermometers 302 and a plurality of second thermometers 304; a plurality of the first thermometers 302 are evenly distributed on the first heating component 301, and are used to detect the temperature of the upper surface of the substrate 202 to be processed in the processing chamber; a plurality of the second thermometers 304 are evenly distributed on the second heating component 303, and are used to detect the temperature of the lower surface of the substrate 202 to be processed.

[0065] Embodiment 2

[0066] Combination Figure 1 , Figures 4 to 7As shown, the difference between this embodiment and embodiment 1 is that the heating component includes: a support member, a plurality of heating units, and the plurality of heating units are distributed in a matrix on the support member, and each of the heating units forms a corresponding heating zone on the plane where the substrate is located.

[0067] A temperature compensator is arranged between the heated substrate and the plurality of heating units, and corresponds to the low temperature zone in real time. The temperature compensator is used to converge the heating light emitted by the corresponding heating unit in the vertical direction thereof, so as to correspondingly enhance the illumination energy of the low temperature zone to form the thermal compensation zone.

[0068] The temperature compensator includes a plurality of focusing blades and a compensator shaft 3017, and one end of each of the focusing blades is arranged on the compensator shaft 3017 at intervals around the compensator shaft 3017; each of the focusing blades is located between the heated substrate and the plurality of heating units, and corresponds to the low temperature zone in real time.

[0069] Please continue to refer to Figure 6 As shown, in this embodiment, the number of the focusing blades is three, namely, a first focusing blade 3014 , a second focusing blade 3015 and a third focusing blade 3016 .

[0070] In this embodiment, the number of the support arms 2011 is three, and since the three support arms rotate synchronously with the rotation axis 2012, at time T3, Figure 4 As shown, the first support arm of the three support arms is located at Figure 4 In the first quadrant shown, the second support arm is located Figure 4 In the third quadrant shown, the third support arm is located at Figure 4 The second quadrant area shown. The distribution angles of the three focusing blades are consistent with the distribution angles of the three support arms, and the compensator shaft 3017 rotates synchronously with the rotation shaft 2012, so that the first focusing blade 3014 is directly opposite to the first support arm, the second focusing blade 3015 is directly opposite to the second support arm, and the third focusing blade 3016 is directly opposite to the third support arm. Further, the heating light emitted by the corresponding heating unit in the vertical direction is converged to correspondingly enhance the light energy of the low temperature zone to form the thermal compensation zone.

[0071] like Figure 7As shown, in this embodiment, the cross section of each of the focusing blades is in the shape of a convex lens structure. For example, the first focusing blade 3014 converges the heating light emitted by the plurality of heating units located above it, and allows the converged heating light and heat to penetrate the chamber top cover 101 of the processing chamber and irradiate the substrate 202. The converged heating light can increase the temperature of the area irradiated on the substrate 202. The compensator shaft 3017 can be a solid shaft or a hollow shaft. When the compensator shaft 3017 is hollow (a hollow shaft), the heating light and heat emitted by the heating unit located directly above the compensator shaft 3017 can penetrate the inside of the compensator shaft 3017 and irradiate the center of the substrate 202, thereby improving the temperature uniformity of the substrate surface.

[0072] In this embodiment, the heating component can adopt two groups, namely a first heating component and a second heating component, the first heating component includes a first temperature compensator, the first temperature compensator is arranged between the chamber top cover and several groups of the heating units, and corresponds to the low temperature zone in real time; the second heating component includes a second temperature compensator, the second temperature compensator is arranged between the chamber bottom cover and several groups of the heating units, and corresponds to the low temperature zone in real time; the first compensator axis of the first temperature compensator is arranged on the center of the first heating component, or on the chamber top cover; the second compensator axis of the second temperature compensator is arranged on the center of the second heating component, or on the rotating shaft 2012.

[0073] In this embodiment, it also includes an external first driver and a second driver, wherein the first driver is connected to the first compensator shaft, and is used to drive the first compensator shaft to rotate synchronously with the rotating shaft 2012, so that each focusing blade in the first temperature compensator is directly opposite to the corresponding low-temperature zone in real time; the focusing blades in the first compensator converge the heating light emitted by the heating unit located above it, so as to correspondingly enhance the light energy of the low-temperature zone.

[0074] The second driver is connected to the second compensator shaft, and is used to drive the second compensator shaft to rotate synchronously with the rotating shaft 2012, so that each of the focusing blades in the second temperature compensator is directly opposite to the corresponding low temperature zone in real time. The heating light emitted by the heating unit located below is concentrated by the focusing blades in the second compensator, so as to correspondingly enhance the light energy of the low temperature zone.

[0075] The present embodiment also provides a method for processing a substrate using the heat treatment equipment described in the above-mentioned embodiment one or two, comprising: using the first heating component to heat the front side of the substrate to be processed; using the second heating component to heat the back side of the base; the plane where the substrate to be processed is located is divided into a plurality of heating zones, and each group of the heating units in the first heating component and the second heating component corresponds to a heating zone; there are a plurality of low-temperature zones in the plurality of heating zones; the low-temperature zone is formed due to the base support arm blocking the heating unit, and the low-temperature zone changes synchronously with the rotation of the base support arm; a thermal compensation zone is formed, which changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone.

[0076] To sum up, the heating component provided in this embodiment can be used in heat treatment equipment. Through the provided thermal compensation zone, it changes synchronously with the low-temperature zone in real time to achieve the purpose of compensating the temperature of the low-temperature zone, thereby achieving the temperature uniformity of the substrate surface when using this heat treatment equipment to perform film forming processes such as wafer epitaxial deposition, thereby improving the quality of the deposited film layer.

[0077] The heating assembly provided in this embodiment is used to increase the output power of the heating unit directly opposite to the low temperature zone through the control device provided therein, thereby increasing the heating temperature of the corresponding low temperature zone and achieving the purpose of compensating the temperature of the low temperature zone.

[0078] The heating assembly provided in this embodiment can also converge the heating light emitted by the corresponding heating unit located in the vertical direction thereof through the provided temperature compensator, so as to correspondingly enhance the illumination energy of the low temperature zone to form the thermal compensation zone.

[0079] The temperature compensator includes a plurality of focusing blades and a compensator shaft, one end of each focusing blade is arranged on the compensator shaft at intervals around the compensator shaft; each focusing blade is located between the heated substrate and a plurality of the heating units, and corresponds to the low temperature zone in real time.

[0080] Specifically, the low-temperature zone is formed because the base support arm blocks the heating unit, and the low-temperature zone changes synchronously with the rotation of the base support arm; the thermal compensation zone provided by the present invention changes synchronously with the low-temperature zone in real time and is used to compensate for the temperature of the low-temperature zone, thereby achieving the purpose of improving the temperature uniformity of the substrate surface and further improving the quality of the deposited film layer.

[0081] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0082] In the description of the present invention, it should be understood that the terms "center", "height", "thickness", "up", "down", "vertical", "horizontal", "top", "bottom", "inside", "outside", "axial", "radial", "circumferential" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0083] In the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0084] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0085] Although the content of the present invention has been described in detail through the above preferred embodiments, it should be appreciated that the above description should not be considered as a limitation of the present invention. After reading the above content, it will be apparent to those skilled in the art that various modifications and substitutions of the present invention will occur. Therefore, the protection scope of the present invention should be limited by the appended claims.

Claims

1. A heating assembly for a heat treatment device, the heat treatment device comprising a processing chamber, a base and a base support arm, the base and the base support arm are arranged in the processing chamber, the base is used to carry a substrate, the base support arm is used to support the base and drive the base to rotate, the heating assembly is used to heat the substrate, characterized in that: include: Supports, A plurality of heating units, wherein the plurality of heating units are distributed on the support member in a matrix manner, and each of the heating units forms a corresponding heating zone on the plane where the substrate is located; a control device connected to each of the heating units and used to independently control each heating unit; The heating zone includes a low temperature zone, which is formed due to the base support arm shielding the heating unit, and the low temperature zone changes synchronously with the rotation of the base support arm; The thermal compensation zone changes synchronously with the low temperature zone in real time and is used to compensate for the temperature of the low temperature zone.

2. The heating assembly according to claim 1, characterized in that The control device is used to correspondingly increase the output power of the heating unit directly facing the low temperature zone to form the thermal compensation zone.

3. The heating assembly according to claim 2, characterized in that A plurality of the heating units are distributed on the support member in a concentric circle pattern; or, a plurality of the heating units are distributed on the support member in a rectangular pattern.

4. The heating assembly according to claim 3, characterized in that The distribution area of ​​the plurality of heating units is greater than or equal to the area of ​​the heated substrate.

5. The heating assembly according to claim 4, characterized in that Each of the heating units is a heating lamp.

6. The heating assembly according to claim 5, characterized in that Each of the heating units is a point lamp and / or a strip lamp.

7. The heating assembly according to claim 1 or 2, characterized in that: Also includes: A temperature compensator is arranged between the heated substrate and the plurality of heating units, and corresponds to the low temperature zone in real time. The temperature compensator is used to converge the heating light emitted by the corresponding heating unit in the vertical direction thereof, so as to correspondingly enhance the illumination energy of the low temperature zone to form the thermal compensation zone.

8. The heating assembly according to claim 7, characterized in that The temperature compensator includes a plurality of focusing blades and a compensator shaft, one end of each focusing blade is arranged on the compensator shaft at intervals around the compensator shaft; each focusing blade is located between the heated substrate and a plurality of the heating units, and corresponds to the low temperature zone in real time.

9. The heating assembly according to claim 8, characterized in that The compensator shaft is hollow inside.

10. The heating assembly according to claim 8, characterized in that The cross section of each of the focusing blades is in the shape of a convex lens structure.

11. A heat treatment device, characterized in that: include: A first and second heating components, a processing chamber, a susceptor and a susceptor support arm, wherein the susceptor and the susceptor support arm are arranged in the chamber, the susceptor is used to carry the substrate, and the susceptor support arm is used to support the susceptor and drive the susceptor to rotate; A first heating component, which is located on the top outer surface of the processing chamber, and the first heating component is used to heat the front side of the substrate to be processed; A second heating component is located on the outer surface of the bottom of the processing chamber, and the second heating component is used to heat the back side of the substrate to be processed; The first heating component and / or the second heating component adopts the heating component as described in any one of claims 1 to 10.

12. The heat treatment equipment according to claim 11, characterized in that The processing chamber comprises a chamber wall, a chamber top cover and a chamber bottom cover; The chamber top cover is located above the chamber wall, and the chamber bottom cover is located below the chamber wall.

13. The heat treatment equipment according to claim 12, characterized in that The base support arm comprises: A rotating shaft, one end of which is connected to the bottom of the base, and the other end of which passes through the chamber bottom cover and extends to the outside of the processing chamber; A plurality of support arms, which are arranged at intervals around the rotating shaft, one end of each of the support arms is connected to the bottom of the base, and the other end is connected to the rotating shaft; The rotating shaft drives the base to rotate.

14. The heat treatment equipment according to claim 13, characterized in that The chamber wall is made of any one of stainless steel, aluminum, quartz and ceramic; the chamber top cover is made of transparent quartz material; and the chamber bottom cover is made of transparent quartz material.

15. The heat treatment equipment according to claim 14, characterized in that When heating the substrate to be processed, the control device in the first heating assembly controls the output power of the heating unit located directly above the low temperature zone in the first heating assembly to reach a first preset compensation value, and controls the output power of the remaining heating units to maintain a first original setting value; The control device in the second heating assembly controls the output power of the heating unit located directly below the low temperature zone in the second heating assembly to reach a second preset compensation value, and controls the output power of the remaining heating units to maintain a second original set value.

16. The heat treatment equipment according to claim 15, characterized in that The first preset compensation value and the second preset compensation value are the same or different; the first original setting value and the second original setting value are the same or different.

17. The heat treatment equipment according to claim 16, characterized in that The first heating assembly further includes a first temperature compensator, the first temperature compensator including a plurality of first focusing blades and a first compensator shaft, The first temperature compensator is disposed between the chamber top cover and the plurality of groups of heating units and corresponds to the low temperature zone in real time; The second heating assembly further includes a second temperature compensator, wherein the second temperature compensator includes a plurality of second focusing blades and a second compensator shaft. The second temperature compensator is disposed between the chamber bottom cover and the plurality of groups of heating units and corresponds to the low temperature zone in real time; The first compensator shaft of the first temperature compensator is arranged at the center of the first heating assembly, or on the chamber top cover; The second compensator axis of the second temperature compensator is arranged at the center of the second heating assembly, or on the rotation axis.

18. The heat treatment equipment according to claim 17, characterized in that It also includes an external first driver and a second driver, wherein the first driver is connected to the first compensator shaft and is used to drive the first compensator shaft to rotate synchronously with the rotating shaft, so that each of the first focusing blades is directly opposite to the corresponding low-temperature zone in real time; The second driver is connected to the second compensator shaft, and is used for driving the second compensator shaft to rotate synchronously with the rotating shaft, so that each of the second focusing blades is directly opposite to the corresponding low-temperature zone in real time.

19. The heat treatment equipment according to claim 18, characterized in that Also includes a plurality of first thermometers and a plurality of second thermometers; A plurality of the first temperature measuring instruments are evenly distributed on the first heating assembly and are used to detect the temperature of the substrate to be processed in the processing chamber; A plurality of the second temperature measuring instruments are evenly distributed on the second heating assembly and are used to detect the temperature of the substrate to be processed.

20. A method for treating a substrate using a heat treatment device, characterized in that: include: Providing a heat treatment device as described in any one of claims 11 to 19; Using the first heating component to heat the front side of the substrate to be processed; Using the second heating component to heat the back side of the base; The plane where the substrate to be processed is located is divided into several heating zones. Each group of the heating units in the first heating assembly and the second heating assembly corresponds to one heating zone; There are several low-temperature zones among the several heating zones; the low-temperature zones are formed because the base support arm shields the heating unit, and the low-temperature zones change synchronously with the rotation of the base support arm; A thermal compensation zone is formed, which changes synchronously with the low temperature zone in real time and is used to compensate for the temperature of the low temperature zone.

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