Display assembly, method of manufacture and apparatus

Abstract

The application provides a display assembly, a preparation method and a device, relates to the technical field of display, and solves the problem that current display assemblies cannot quickly dredge and reduce instantaneous heat, which easily leads to local temperature concentration of the screen being too high and affects the service life of the screen, and comprises a display panel main body, a metal support layer and a circuit board, the metal support layer is provided with a heat dissipation circulation channel, and a liquid heat dissipation working medium is arranged in the heat dissipation circulation channel; when the circuit board generates heat, the liquid heat dissipation working medium absorbs heat and evaporates to form hot steam, and the hot steam is condensed to form the liquid heat dissipation working medium in the heat dissipation circulation channel during heat conduction. The application quickly dredges the heat in the display assembly through the heat dissipation circulation channel, the heat dissipation efficiency is higher, the high heat is avoided from being transmitted to the display device layer of the display assembly, the service life of the display device layer is improved, and the purpose of protecting the display device layer is achieved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display component, manufacturing method, and apparatus. Background Technology

[0002] With the development of flexible organic light-emitting diode (OLED) display technology, and with the continuous improvement of the performance of electronic products, the application of high-frequency and high-power components is becoming more widespread, while their size is constantly shrinking and their integration is constantly increasing. In the context of increasingly smaller electronic products, the problem of heat dissipation is inevitable in order to bring out more performance.

[0003] Currently, electronic products mainly use thermally conductive materials to solve the thermal management problem of electronic devices. Thermally conductive materials include thermally conductive pads, thermally conductive gels, metal backplates, thermally conductive graphite, etc., which are applied between the thermal interfaces of the system. They mainly fill the rough and uneven bonding surfaces to reduce the thermal resistance and thus improve the heat dissipation efficiency of semiconductor components.

[0004] With the increasing demand for high-frequency switching in electronic products and the integrated design of large-scale application software, existing heat dissipation designs are insufficient to meet the requirements. Especially in high-heat-flux-density areas such as integrated chips within the electronic product structure, if instantaneous heat cannot be dissipated and reduced quickly, it will be directly transferred to the flexible module through the metal frame or other structural components. If the screen temperature becomes excessively high in certain areas and operates for extended periods, it will directly affect the screen's lifespan, and in extreme cases, black spots and screen burn-in may occur. Summary of the Invention

[0005] This application provides a display component, its manufacturing method, and apparatus that integrate a heat dissipation structure to improve overall heat dissipation efficiency, prevent high heat from being directly transferred to the display panel body, and thus extend the service life of the display panel body.

[0006] On one hand, this application provides a display component, including a display panel body, a metal support layer attached to the display panel body, and a circuit board disposed on the side of the metal support layer away from the display panel body. The metal support layer includes a bending area and a non-bending area. The metal support layer has a heat dissipation circulation channel in the non-bending area and on the side away from the display panel body. A liquid heat dissipation working fluid is disposed in the heat dissipation circulation channel.

[0007] When the circuit board generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot vapor. During the conduction process in the heat dissipation circulation channel, the hot vapor dissipates heat and condenses to reform the liquid heat dissipation medium.

[0008] In one possible implementation of this application, the heat dissipation circulation channel includes an evaporation zone, a condensation zone, and a compensation zone that are sequentially connected.

[0009] The evaporation zone is used to evaporate the liquid heat dissipation working fluid and form the hot steam;

[0010] The condensation zone is used to conduct the hot steam output from the evaporation zone, and the hot steam is condensed and cooled in the condensation zone to reform into a liquid heat dissipation medium.

[0011] The compensation zone is used to store the reformed liquid heat dissipation medium output from the condensation zone and to provide liquid heat dissipation medium to the evaporation zone.

[0012] In one possible implementation of this application, the condensation zone includes a plurality of heat dissipation channels arranged in an array, and any two adjacent heat dissipation channels are interconnected.

[0013] The heat dissipation channels are used to conduct and condense the hot steam, which dissipates heat and condenses during the conduction process through the multiple heat dissipation channels, and reforms into a liquid heat dissipation working fluid.

[0014] In one possible implementation of this application, the heat dissipation channel includes interconnected sub-heat dissipation channels. Each sub-heat dissipation channel includes a long side channel segment and two short side channel segments. The two short side channel segments are located at both ends of the long side channel segment and are interconnected with the long side channel segment. Within the same heat dissipation channel, the two short side channel segments of one sub-heat dissipation channel are connected one-to-one with the two short side channel segments of another sub-heat dissipation channel.

[0015] In one possible implementation of this application, two adjacent heat dissipation channels are interconnected and share a long side channel segment or a short side channel segment.

[0016] In one possible implementation of this application, the ratio of the length of the long side channel segment to the length of the short side channel segment is 1.2 to 1.5.

[0017] In one possible implementation of this application, the ratio of the maximum spacing width between the boundaries of the two sub-heat dissipation channels to the channel width of the sub-heat dissipation channels is 6 to 8.

[0018] In one possible implementation of this application, the heat dissipation circulation channel further includes a first conductive region disposed between the evaporation zone and the condensation zone, wherein the first conductive region is interconnected with both the evaporation zone and the condensation zone;

[0019] The first conductive zone is used to conduct the heat generated by the circuit board to the evaporation zone and to conduct the hot steam to the condensation zone.

[0020] In one possible implementation of this application, the heat dissipation circulation channel further includes a second conductive region disposed between the condensation region and the compensation region, wherein the second conductive region is interconnected with both the condensation region and the compensation region;

[0021] The second conduction zone is used to conduct the liquid heat dissipation working fluid, which is reformed after the hot steam dissipates heat and condenses, to the compensation zone.

[0022] In one possible implementation of this application, the heat dissipation circulation channel further includes a third conduction zone disposed between the compensation zone and the evaporation zone, wherein the third conduction zone is interconnected with the compensation zone and the evaporation zone;

[0023] The third conduction zone is used to conduct the liquid heat dissipation working fluid in the compensation zone to the evaporation zone.

[0024] In one possible implementation of this application, the area of ​​the condensation zone is 3 to 6 times the area of ​​the evaporation zone.

[0025] In one possible implementation of this application, the display component further includes a cover plate disposed on the side of the metal support layer away from the display panel body, and the position of the cover plate corresponds to the area on the metal support layer where the heat dissipation circulation channel is located, and the cover plate is used to cover the heat dissipation circulation channel.

[0026] In one possible implementation of this application, the display component further includes a thermal pad, and the metal support layer is bonded to the circuit board via the thermal pad.

[0027] In one possible implementation of this application, the liquid heat dissipation medium includes any one or a combination of distilled water, ammonia, methanol, and acetone.

[0028] On the other hand, this application provides a display device, which includes the display components as described above.

[0029] This application provides a heat dissipation circulation channel on the side of the non-bending area of ​​the metal support layer away from the display panel body. A liquid heat dissipation medium is placed in the heat dissipation circulation channel. When the circuit board generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot vapor. The hot vapor dissipates heat and condenses during conduction in the heat dissipation circulation channel to form the liquid heat dissipation medium. That is, a heat dissipation and cooling circulation loop is formed through the heat dissipation circulation channel. When the circuit board in the display component experiences instantaneous high temperature, the heat in the display component can be quickly dissipated through the heat dissipation circulation channel, resulting in higher heat dissipation efficiency and preventing high heat from being directly transferred to the display panel body, thereby improving the service life of the display panel body. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of an embodiment of the display component provided in this application;

[0032] Figure 2 This is a schematic diagram of an embodiment of the display component provided in this application;

[0033] Figure 3 This is a schematic diagram of an embodiment of the display component provided in this application;

[0034] Figure 4 This is a schematic diagram of an embodiment of the metal support layer provided in this application.

[0035] Figure 5 This is a schematic diagram of the structure of an embodiment of the condensation zone provided in this application;

[0036] Figure 6 This is a schematic diagram of a heat dissipation efficiency test of a display component provided in an embodiment of this application;

[0037] Figure 7 This is a schematic diagram of a heat dissipation efficiency test of a display component provided in an embodiment of this application;

[0038] Figure 8 This is a schematic diagram of an embodiment of the metal support layer provided in this application.

[0039] Figure 9 This is a thermal simulation diagram of the display component provided in an embodiment of this application;

[0040] Figure 10 This is a thermal simulation diagram of the display component provided in an embodiment of this application;

[0041] Figure 11 This is a schematic flowchart of an embodiment of the method for preparing a display component provided in this application. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0043] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] In this application, the term "exemplary" is used to mean "serving as an example, illustration, or description." Any embodiment described as "exemplary" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to make and use the invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the invention can be made without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the invention with unnecessary detail. Therefore, the invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0045] With the development of flexible OLED display technology, the performance of foldable display phones and computers is constantly improving. The application of high-frequency, high-power components is becoming more widespread, while their size is shrinking and their integration is increasing. Therefore, as foldable phones and computers become smaller, maximizing their performance inevitably involves heat dissipation. Users are increasingly demanding longer usage times for their phones and computers, and demanding mobile games and multitasking require higher processor performance, leading to overheating and negatively impacting the user experience. Therefore, the development of heat dissipation materials significantly affects product performance. Existing heat dissipation / thermal conductive materials primarily address thermal management issues in electronic devices, applied between system thermal interfaces. They mainly fill rough, uneven surfaces, reducing thermal resistance and improving the heat dissipation efficiency of semiconductor components.

[0046] Currently, the main thermally conductive materials on the market include thermal pads, thermal gels, metal backplates, and thermally conductive graphite. Among them, high thermal conductivity graphite film is a relatively ideal material for mobile phone heat dissipation, but its cost remains high and the technology is challenging. Metal backplates are widely used due to their low cost and high yield rate. Thermal pads and thermal gels cannot meet the heat dissipation requirements of highly integrated functional chips. Moreover, with the increasing demand for high-frequency switching applications in mobile phones and the integrated design of large application software, existing heat dissipation designs are insufficient. Especially in high heat flux density areas such as integrated chips inside the phone structure, if instantaneous heat cannot be quickly dissipated and reduced, it will be directly transferred to the flexible module through the phone's metal frame structure or other structural components. If the screen temperature is concentrated too high locally and operates for a long time, it will directly affect the screen's lifespan, and in extreme cases, black spots and screen burn-in may occur.

[0047] To address the aforementioned issues, this application provides a display component and a display device, which will be described in detail below.

[0048] like Figure 1 and Figure 2 The diagram shown is a schematic structural representation of a display component according to an embodiment of this application. The display component includes a display panel body 2, a metal support layer 1 bonded to the display panel body 2, and a circuit board 4 disposed on the side of the metal support layer 1 away from the display panel body 2. The metal support layer 1 includes a bending area 11 and non-bending areas 12. Specifically, the metal support layer 1 includes a bending area 11 and two non-bending areas 12 located within the bending area 11, as shown below. Figure 3As shown, a heat dissipation circulation channel 5 is provided in one of the non-bending areas 12 and on the side away from the display panel body 2. The heat dissipation circulation channel 5 is located at the end of the metal support layer 1 close to the circuit board 4, and a liquid heat dissipation working fluid is provided in the heat dissipation circulation channel 5.

[0049] When the circuit board 4 generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot steam. During the heat dissipation circulation channel 5, the hot steam dissipates heat and condenses to form liquid heat dissipation medium.

[0050] In this embodiment, specifically, the display panel body 2 includes a substrate, which is a flexible substrate of the display panel body 2; the display panel body 2 also includes a light-emitting functional layer, which includes an anode layer, an auxiliary electrode layer, a hole injection layer, a hole transport layer, a light-emitting layer, an electron transport layer, an electron injection layer, and a cathode layer (not shown in the structural drawings of the display panel body 2) sequentially disposed on the substrate; the display panel body 2 also includes an encapsulation layer located above the light-emitting functional layer. In this embodiment, the display panel body 2 is used to realize the light-emitting display of the display component.

[0051] In this embodiment, the metal support layer 1 is made of metal material. For example, the metal support layer 1 can be made of stainless steel alloy. The metal support layer 1 is used to support the display panel body 2, and at the same time, the metal support layer 1 constitutes the support structure of the heat dissipation circulation channel 5 (see below for details). The metal support layer 1 with the above-mentioned metal structure has the advantages of good heat dissipation, light weight, strong corrosion resistance, and non-flammability, which can effectively ensure the normal operation of the metal support layer 1, thereby enabling the display component as a whole to quickly dissipate and reduce instantaneous heat. In this embodiment, the metal support layer 1 can also be made of other materials and other structures, which are not specifically limited in this embodiment.

[0052] In this embodiment, the circuit board 4 includes a driver chip and an integrated circuit electrically connected to the driver chip. Both the driver chip and the integrated circuit are electrically connected to semiconductor devices in the display panel body 2. The pixel driving function of the driver chip, integrated circuit, and semiconductor devices drives the light-emitting layer in the display panel body 2 to display.

[0053] In this embodiment, the liquid heat dissipation medium includes any one or a combination of distilled water, ammonia, methanol, and acetone. Since distilled water, ammonia, methanol, and acetone all have good heat dissipation capabilities at both high and low temperatures, ensuring the heat dissipation effect of the heat dissipation circulation channel 5 of this application, other heat dissipation mediums that can also play a cooling role can also be used in this embodiment; this embodiment does not specifically limit the use of any particular medium.

[0054] This application provides a heat dissipation circulation channel 5 on the side of the non-bending area 12 of the metal support layer 1 away from the display panel body 2. A liquid heat dissipation medium is provided in the heat dissipation circulation channel 5. When the circuit board 4 generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot vapor. The hot vapor dissipates heat and condenses during conduction in the heat dissipation circulation channel 5 to form the liquid heat dissipation medium. That is, a heat dissipation and cooling circulation loop is formed through the heat dissipation circulation channel 5. When the circuit board 4 in the display component experiences instantaneous high temperature, the heat in the display component can be quickly dissipated through the heat dissipation circulation channel 5, resulting in higher heat dissipation efficiency and preventing high heat from being directly transferred to the display panel body 2, thereby improving the service life of the display panel body 2.

[0055] In this embodiment, as Figure 3 As shown, the display assembly also includes a back panel 201, a polarizer 203, a protective glass 204, and a screen protective window 205. The display panel body 2, polarizer 203, protective glass 204, and screen protective window 205 are sequentially disposed on the back panel 201. The back panel 201, display panel body 2, polarizer 203, protective glass 204, and screen protective window 205 are all bonded together with each other using optically clear adhesive (OCA). The protective glass 204 is made of ultra-thin glass (UTG). When the display assembly is used in a display screen, the protective glass 204 and the screen protective window 205 together constitute the screen window or screen cover of the display screen. The display screen can also use other structures as the screen window or screen cover of the display screen, and this embodiment does not specifically limit this.

[0056] In this embodiment, the back panel 201, display panel body 2, polarizer 203, protective glass 204 and screen protective window 205 in the display assembly are all made of flexible materials, which allows the display assembly to be bent. In this embodiment, the display panel body 2 may also include other flexible structures, which are not specifically limited in this embodiment.

[0057] In this embodiment, the display component also includes a middle frame 3, which is used to encapsulate the circuit board 4. The display component may also include more layers, which can be designed as needed. This embodiment does not make specific limitations on this.

[0058] In another embodiment of this application, such as Figure 4As shown, the heat dissipation circulation channel 5 includes an evaporation zone 501, a condensation zone 503, and a compensation zone 505 that are connected in sequence. The evaporation zone 501 is used to evaporate the liquid heat dissipation medium and form hot steam. The condensation zone 503 is used to conduct the hot steam output from the evaporation zone 501. After the hot steam dissipates heat and condenses in the condensation zone 503, it reforms into liquid heat dissipation medium. The compensation zone 505 is used to store the reformed liquid heat dissipation medium output from the condensation zone 503 and to provide liquid heat dissipation medium to the evaporation zone 501.

[0059] In this embodiment, when the metal support layer 1 is attached to the circuit board 4, the position of the heat dissipation circulation channel 5 on the metal support layer 1 corresponds to the area where the circuit board 4 is located.

[0060] Therefore, in this embodiment, when heat is generated on the circuit board 4, the liquid heat dissipation medium in the evaporation zone 501 absorbs heat and evaporates to form hot steam. The hot steam is conducted through the condensation zone 503. During the conduction process, the hot steam is condensed and reformed into liquid heat dissipation medium. The liquid heat dissipation medium is stored in the compensation zone 505 and reformed into liquid heat dissipation medium. The liquid heat dissipation medium is then continuously replenished to the evaporation zone 501 through the compensation zone 505, thus continuously circulating to form a heat dissipation and cooling loop.

[0061] Specifically, in this embodiment, the heat dissipation circulation channel 5 further includes a first conduction zone 502 disposed between the evaporation zone 501 and the condensation zone 503. The first conduction zone 502 is interconnected with both the evaporation zone 501 and the condensation zone 503. The first conduction zone 502 is used to conduct the heat generated by the circuit board 4 to the evaporation zone 501 and to conduct the hot steam to the condensation zone 503. During application, when the circuit board 4 generates heat, the first conduction zone 502 conducts the heat to the evaporation zone 501, and when the liquid heat dissipation medium absorbs heat and evaporates to form hot steam, it transmits the hot steam to the condensation zone 503.

[0062] In this embodiment, the heat dissipation circulation channel 5 further includes a second conduction zone 504 disposed between the condensation zone 503 and the compensation zone 505. The second conduction zone 504 is interconnected with both the condensation zone 503 and the compensation zone 505. The second conduction zone 504 is used to conduct the liquid heat dissipation working fluid reformed after the hot steam dissipates heat and condenses to the compensation zone 505. During application, when the hot steam dissipates heat and condenses in the condensation zone 503 and reforms into a liquid heat dissipation working fluid, the liquid heat dissipation working fluid is conducted to the compensation zone 505 through the second conduction zone 504.

[0063] In this embodiment, the heat dissipation circulation channel 5 further includes a third conduction zone 506 disposed between the compensation zone 505 and the evaporation zone 501. The third conduction zone 506 is interconnected with the compensation zone 505 and the evaporation zone 501. The third conduction zone 506 is used to conduct the liquid heat dissipation medium in the compensation zone 505 to the evaporation zone 501. During application, the liquid heat dissipation medium in the compensation zone 505 is conducted to the evaporation zone 501 through the third conduction zone 506, indicating the return flow of the liquid heat dissipation medium.

[0064] Therefore, in this embodiment, the evaporation zone 501, the first conduction zone 502, the condensation zone 503, the second conduction zone 504, the compensation zone 505 and the third conduction zone 506, which are connected in sequence and interconnected with each other, together form a heat dissipation and cooling loop. The evaporation zone 501 and the condensation zone 503 are separated by the first conduction zone 502, so that the two are far apart, which facilitates the condensation of hot steam in the condensation zone 503.

[0065] During application, when the circuit board 4 in the display component or the semiconductor device in the display panel body 2 generates a high amount of heat, the heat is transferred to the evaporation zone 501 through the first conduction zone 502. The liquid heat dissipation medium in the evaporation zone 501 absorbs heat and evaporates to form hot steam. That is, the liquid heat dissipation medium absorbs the heat in the display component. After a phase change (the liquid absorbs heat and the gas absorbs heat), the temperature of the evaporation zone 501 is reduced. The heat is dispersed to the condensation zone 503, which is far away from the evaporation zone 501, through the hot steam. The heat gradually condenses into liquid in the condensation zone 503, which has a lower temperature, and reforms into liquid heat dissipation medium. The liquid heat dissipation medium is conducted to the compensation zone 505 through the second conduction zone 504. The liquid heat dissipation medium in the compensation zone 505 flows back to the evaporation zone 501 through the third conduction zone 506, thereby forming a heat dissipation and cooling cycle system.

[0066] In this way, when the circuit board 4 in the display component or the semiconductor device in the display panel body 2 experiences a sudden high temperature, the heat dissipation circulation channel 5 can quickly dissipate the heat in the display component, resulting in higher heat dissipation efficiency and preventing excessive heat from being transferred to the display panel body 2 of the display component, thereby improving the service life of the display panel body 2 and achieving the purpose of protecting the display panel body 2.

[0067] In another embodiment of this application, the area of ​​the condensation zone 503 is 3 to 6 times the area of ​​the evaporation zone 501.

[0068] For example, when the area of ​​the evaporation zone 501 is 200 square millimeters (mm) 2 When ), the area of ​​the condensation zone 503 can be 600 mm². 2 ~1200mm 2The area size of the condensing zone 503 is set to 3 to 6 times the area size of the evaporating zone 501, so that the condensing zone 503 has a larger condensing area, which facilitates the rapid and uniform dispersion of heat by the hot steam in the condensing zone 503, thereby achieving a rapid cooling effect. In this embodiment, the area size of the condensing zone 503 and the area size of the evaporating zone 501 can be designed according to actual needs, and are not limited to the above examples. This application does not make any specific limitation in this regard.

[0069] In another embodiment of this application, the condensation zone 503 includes a plurality of arrayed heat dissipation channels 8, any two adjacent heat dissipation channels 8 are interconnected, and the heat dissipation channels 8 are used to transport hot steam. During the transmission of hot steam through the plurality of heat dissipation channels 8, the hot steam dissipates heat, condenses and reforms into a liquid heat dissipation working fluid.

[0070] Specifically, in this embodiment, such as Figure 5 As shown, the heat dissipation channel 8 includes two sub-heat dissipation channels 81 that are symmetrically arranged along the transmission axis and are interconnected. For example, the structure of the heat dissipation channel 8 can be a hexagonal structure. In this embodiment, the transmission axis can be as follows: Figure 5 As shown by the first axis L1, each sub-heat dissipation channel 81 includes a long side channel segment 811 and two short side channel segments 812. The two short side channel segments 812 are located at both ends of the long side channel and are connected to the long side channel segment 811. Within the same heat dissipation channel, the two short side channel segments of one sub-heat dissipation channel are connected to the two short side channel segments of another sub-heat dissipation channel in a one-to-one correspondence. When the structure of the heat dissipation channel 8 is a hexagonal structure, each side of the hexagon corresponds to one long side channel segment 811 or one short side channel segment 812.

[0071] In this embodiment, two adjacent heat dissipation channels 8 are interconnected and share at least one long side channel segment 811 or one short side channel segment 812;

[0072] In this embodiment, the heat dissipation efficiency of the display component is related to the size of the heat dissipation channel 8. Specifically, as shown in the figure... Figure 6 and Figure 7 As shown, the horizontal axis is the ratio C / B of the length C of the long side channel segment 811 to the length B of the short side channel segment 812, and the vertical axis is the heat dissipation efficiency of the display component, expressed as a percentage. After testing and simulation, when the ratio C / B is between 1.2 and 1.5, the heat dissipation efficiency of the display component is in the range of 90% to 92%. Figure 7 In the middle, the horizontal axis represents heat dissipation channel 8 along the direction perpendicular to the transmission axis (see details). Figure 5The ratio D / A of the overall channel width D (indicated by the second axis L2 shown in the figure) to the channel width A of the channel segment in the radial direction is given by the vertical axis, which represents the heat dissipation efficiency of the display component as a percentage. After testing and simulation, when the ratio D / A is between 6 and 8, the heat dissipation efficiency of the display component is in the range of 90% to 91%.

[0073] Therefore, in this embodiment, in order to make the display component have high heat dissipation efficiency, the heat dissipation channel 8 can be specifically as follows:

[0074] The ratio of the length of the long side channel of the long side channel segment 811 to the length of the short side channel of the short side channel segment 812 is 1.2 to 1.5; the ratio of the maximum spacing width between the boundaries of the two sub-heat dissipation channels to the channel width of the sub-heat dissipation channel 8118 is 6 to 8.

[0075] For example, the length C of the long side channel segment 811 can be 3.5mm to 4mm, and the length B of the short side channel segment 812 can be 2mm to 2.5mm. That is, the ratio of the length C of the long side channel segment 811 to the length B of the short side channel segment 812 is N, where N = C / B = 1.2 to 1.5. The overall width D of the heat dissipation channel 8 along the width direction of the long side channel segment can be 3mm to 6mm, and the channel width A of each channel segment along the radial direction can be 0.3mm to 0.5mm. That is, the ratio M of the overall width D of the heat dissipation channel 8 along the width direction of the long side channel segment to the channel width A of the channel segment along the radial direction is M, where M = D / A = 6 to 8.

[0076] In this embodiment, the condensation zone 503 adopts the heat dissipation channel 8 with the above-described structure to form a heat dissipation network with a large area, which facilitates the free and uniform flow of hot steam inside the heat dissipation network, ensuring rapid and uniform heat dispersion, and thus facilitating the rapid condensation of high-heat hot steam inside the entire condensation zone 503, thereby improving heat dissipation efficiency. In addition, in this embodiment, other structures of heat dissipation channel 8 can also be used. For example, the structure of heat dissipation channel 8 can also be a quadrilateral structure composed of four channel segments or a pentagonal structure composed of five channel segments. The length and width of heat dissipation channel 8 can be designed according to actual needs, and this application does not make specific limitations in this regard.

[0077] In another embodiment of this application, such as Figure 3 and Figure 8As shown, the display assembly also includes a cover plate 6, which is disposed on the side of the metal support layer 1 away from the display panel body 2. The position of the cover plate 6 corresponds to the area where the heat dissipation circulation channel 5 is located on the metal support layer 1. The cover plate 6 is used to cover the heat dissipation circulation channel 5 and is integrally encapsulated with the metal support layer 1. After the heat dissipation circulation channel 5 is formed on the metal support layer 1, the cover plate 6 is integrally encapsulated with the metal support layer 1, thus ultimately forming the heat dissipation circulation channel 5 on the metal support layer 1.

[0078] Specifically, in this embodiment, the cover plate 6 and the metal support layer 1 are integrally encapsulated using processes such as friction stir welding and mechanical structural adhesive. The cover plate 6 is used to cover the heat dissipation circulation channel 5 on the metal support layer 1 to achieve complete sealing of the heat dissipation circulation channel 5;

[0079] In this embodiment, the cover plate 6 is made of copper alloy. Copper alloy has better encapsulation and higher heat dissipation efficiency, thereby further improving the overall heat dissipation effect of the display component. In this embodiment, the cover plate 6 can also be made of carbon fiber or other alloy materials. The heat dissipation efficiency of the cover plate 6 can be improved by coating the surface of the cover plate 6 with graphite coating, graphene heat dissipation coating or a combination thereof. This embodiment does not make specific limitations on this.

[0080] In another embodiment of this application, such as Figure 3 As shown, the display assembly also includes thermally conductive foam 206 disposed between the display panel body 2 and the metal support layer 1. The display panel body 2, the thermally conductive foam 206 and the metal support layer 1 are all bonded together with OCA optical adhesive. Specifically, the thermally conductive foam 206 is graphene thermally conductive foam 206. Graphene thermally conductive foam 206 has high infrared emissivity and high thermal conductivity, which means it has good heat dissipation performance, so as to improve the heat dissipation effect on the display panel body 2.

[0081] In another embodiment of this application, such as Figure 1 As shown, the display assembly also includes a thermal pad 7, and the metal support layer 1 and the driver chip in the circuit board 4 are bonded together via the thermal pad 7. The thermal pad 7 conducts heat from the driver chip to the metal support layer 1, improving the heat conduction speed in the display module and facilitating rapid heat dissipation.

[0082] After adopting the display component proposed in this application, a thermal simulation comparative analysis was conducted between the display component proposed in this application and a display component that has not been improved based on this application. The results are shown below. Figure 9 and Figure 10 As shown, Figure 9 The local temperature peak value measured for a display component that has not been improved based on this application. Figure 10The measured local temperature peak of the display component proposed in this application is 34.1 degC, compared to a display component not based on this application. Here, degC is a unit of temperature in Celsius. Therefore, it is demonstrated that by adopting the integrated metal support layer 1 structure proposed in the above embodiments, heat in the display component can be quickly dissipated, resulting in a significant improvement in heat dissipation.

[0083] In another embodiment of this application, a method for manufacturing a display component is provided. Figure 11 This is a flowchart illustrating a method for fabricating a display component according to an embodiment of this application. It should be noted that although a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than that shown here. The fabrication method includes steps 601 to 605:

[0084] 601. Provide a display panel body 2;

[0085] 602. A metal support layer 1 is attached to one side of the display panel body 2. The metal support layer 1 includes a bending area 11 and non-bending areas 12 at both ends of the bending area 11.

[0086] 603. Patterning is performed on the non-bending area 12 of the metal support layer 1 and on the side away from the main body 2 of the display panel to form a heat dissipation circulation channel 5;

[0087] 604. A liquid heat dissipation medium is placed in the heat dissipation circulation channel 5, and the heat dissipation circulation channel 5 is encapsulated;

[0088] 605. A circuit board 4 is attached to the side of the metal support layer 1 away from the display panel body 2;

[0089] When the circuit board 4 generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot steam. During the heat dissipation circulation channel 5, the hot steam dissipates heat and condenses to reform the liquid heat dissipation medium.

[0090] In this embodiment, in step 603, a heat dissipation circulation channel is formed in the non-bending area of ​​the metal support layer and on the side away from the main body of the display panel by any one or a combination of etching and laser engraving processes. The heat dissipation circulation channel 5 is formed in this way, and the manufacturing process is simple and convenient, which helps to save on the manufacturing cost of the display components.

[0091] In this embodiment, the metal support layer 1 is not etched or laser-engraved in the area away from the heat dissipation circulation channel 5 to ensure the flatness of the metal support layer 1, the thermal pad 7 (see above), and the circuit board 4, thereby ensuring the heat conduction effect of the thermal pad 7.

[0092] In another embodiment of this application, a display device is provided, which includes the display components as described above, or is prepared using the method for preparing the display components as described above.

[0093] The above provides a detailed description of a display component and display device provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A display component, characterized in that, The device includes a display panel body, a metal support layer attached to the display panel body, and a circuit board disposed on the side of the metal support layer away from the display panel body. The metal support layer includes a bending area and non-bending areas at both ends of the bending area. A heat dissipation circulation channel is provided on the side of the non-bending area away from the display panel body. A liquid heat dissipation medium is disposed in the heat dissipation circulation channel. When the circuit board generates heat, the liquid heat dissipation medium absorbs heat and evaporates to form hot vapor. The hot vapor dissipates heat and condenses during conduction in the heat dissipation circulation channel, reforming into liquid heat dissipation medium. The heat dissipation circulation channel includes an evaporation zone, a condensation zone, and a compensation zone that are connected in sequence. The condensation zone includes multiple heat dissipation channels arranged in an array. Any two adjacent heat dissipation channels are interconnected. Each heat dissipation channel includes two interconnected sub-heat dissipation channels. Each sub-heat dissipation channel includes a long side channel segment and two short side channel segments. The two short side channel segments are located at both ends of the long side channel segment and are both connected to the long side channel segment. The ratio of the length of the long side channel segment to the length of the short side channel segment is 1.2 to 1.5, and the ratio of the maximum gap width between the boundaries of the two sub-heat dissipation channels to the channel width of the sub-heat dissipation channel is 6 to 8.

2. The display component as claimed in claim 1, characterized in that, The evaporation zone is used to evaporate the liquid heat dissipation medium and form the hot steam; the condensation zone is used to conduct the hot steam output from the evaporation zone, and the hot steam is condensed and cooled in the condensation zone to reform the liquid heat dissipation medium; the compensation zone is used to store the reformed liquid heat dissipation medium output from the condensation zone and to provide the liquid heat dissipation medium to the evaporation zone.

3. The display component as described in claim 2, characterized in that, The heat dissipation channels are used to conduct and condense the hot steam, which dissipates heat and condenses during the conduction process through the multiple heat dissipation channels, and reforms into a liquid heat dissipation working fluid.

4. The display component as claimed in claim 3, characterized in that, Within the same heat dissipation channel, the two short-side channel segments of one of the sub-heat dissipation channels are connected one-to-one with the two short-side channel segments of the other sub-heat dissipation channel.

5. The display component as claimed in claim 4, characterized in that, Two adjacent heat dissipation channels are interconnected and share a long side channel segment or a short side channel segment.

6. The display component as claimed in claim 5, characterized in that, The heat dissipation circulation channel further includes a first conductive zone disposed between the evaporation zone and the condensation zone, wherein the first conductive zone is interconnected with both the evaporation zone and the condensation zone; The first conductive zone is used to conduct the heat generated by the circuit board to the evaporation zone and to conduct the hot steam to the condensation zone.

7. The display component as claimed in claim 5, characterized in that, The heat dissipation circulation channel also includes a second conductive zone disposed between the condensation zone and the compensation zone, and the second conductive zone is interconnected with both the condensation zone and the compensation zone; The second conduction zone is used to conduct the liquid heat dissipation working fluid, which is reformed after the hot steam dissipates heat and condenses, to the compensation zone.

8. The display component as claimed in claim 5, characterized in that, The heat dissipation circulation channel further includes a third conduction zone disposed between the compensation zone and the evaporation zone. The third conduction zone is interconnected with the compensation zone and the evaporation zone. The third conduction zone is used to conduct the liquid heat dissipation working fluid in the compensation zone to the evaporation zone.

9. The display component as claimed in claim 2, characterized in that, The area of ​​the condensation zone is 3 to 6 times the area of ​​the evaporation zone.

10. The display component as claimed in claim 1, characterized in that, The display component further includes a cover plate disposed on the side of the metal support layer away from the display panel body, and the position of the cover plate corresponds to the area on the metal support layer where the heat dissipation circulation channel is located, and the cover plate is used to cover the heat dissipation circulation channel.

11. The display component as claimed in claim 1, characterized in that, The display component also includes a thermal pad, and the metal support layer is bonded to the circuit board via the thermal pad.

12. The display component as claimed in claim 1, characterized in that, The liquid heat dissipation medium includes any one or a combination of distilled water, ammonia, methanol, and acetone.

13. A display device, characterized in that, The display device includes the display component as described in any one of claims 1 to 12.

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