Electronic device, camera and mobile device

Abstract

The electronic device comprises a first substrate, a second substrate, a first metal plate, and a second metal plate. The first substrate and the second substrate are equipped with electronic components and are arranged in a stacking direction with their main surfaces facing each other. The first metal plate comprises a flat plate portion interposed between the first substrate and the second substrate and directly or indirectly in contact with the electronic components respectively carried by the first substrate and the second substrate, and a first shielding portion covering a portion of the side surface of the first substrate. The second metal plate comprises a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate. The first metal plate and the second metal plate are in direct or indirect contact with each other.

Description

[0001] This application is a divisional application of the invention patent application with the application date of March 12, 2020, application number 202080022997.4, and name “Electronic device, shooting device and mobile body”.

[0002] Cross-reference to related applications

[0003] This application claims the priority of Japanese Patent Application No. 2019-053724 filed in Japan on March 20, 2019, and all the disclosed contents of the prior application are incorporated herein by reference. Technical Field

[0004] The present disclosure relates to an electronic device, a camera, and a mobile object. Background Art

[0005] In electronic devices such as vehicle-mounted cameras, miniaturization and high-speed processing of various processes are required. As circuit substrates are multilayered and highly integrated for miniaturization, the radiation noise and heat generation of electronic devices of circuit substrates increase. Therefore, the following structure is proposed: the entire side of the circuit substrate is covered with a shielding member, and the circuit substrate and the heat-conducting member are abutted via a heat-conducting member formed of a soft material such as silicone gel (see Patent Document 1).

[0006] Prior art literature

[0007] Patent Literature

[0008] Patent Document 1: Japanese Patent Application Publication No. 2011-259101. Summary of the invention

[0009] In order to solve the above problems, an electronic device according to a first aspect has:

[0010] The first substrate and the second substrate are provided with electronic components and arranged in a stacking direction with their main surfaces facing each other;

[0011] A first metal plate having a flat plate portion interposed between the first substrate and the second substrate and in direct or indirect contact with the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a portion of a side surface of the first substrate; and

[0012] a second metal plate having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate;

[0013] The first metal plate and the second metal plate are in direct or indirect contact with each other.

[0014] In addition, the second aspect of the imaging device has:

[0015] The first substrate and the second substrate are provided with electronic components and arranged in a stacking direction with their main surfaces facing each other;

[0016] A first metal plate having a flat plate portion interposed between the first substrate and the second substrate and in direct or indirect contact with the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a portion of a side surface of the first substrate; and

[0017] a second metal plate having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate;

[0018] The first metal plate and the second metal plate are in direct or indirect contact with each other.

[0019] In addition, the mobile object of the third aspect is equipped with a camera, and the camera has:

[0020] The first substrate and the second substrate are provided with electronic components and arranged in a stacking direction with their main surfaces facing each other;

[0021] A first metal plate having a flat plate portion interposed between the first substrate and the second substrate and in direct or indirect contact with the electronic components mounted on the first substrate and the second substrate, and a first shielding portion covering a portion of a side surface of the first substrate; and

[0022] a second metal plate having a second shielding portion covering the entire circumference of the side surface of the second substrate and the side surface of the first substrate exposed from the first metal plate;

[0023] The first metal plate and the second metal plate are in direct or indirect contact with each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a layout diagram showing the mounting position of the electronic device in the mobile object according to the first embodiment.

[0025] Figure 2 Yes means Figure 1 A cross-sectional view showing the schematic structure of an electronic device cut along the optical axis of the imaging optical system.

[0026] Figure 3 Yes Figure 1 Electronic devices from Figure 2 The cross-section is a cross-sectional view after rotating 90° around the optical axis.

[0027] Figure 4Yes means Figure 2 , 3 A front perspective view of the appearance of the first substrate and the second substrate.

[0028] Figure 5 Yes means Figure 2 , 3 A back side stereoscopic view of the appearance of the first substrate and the second substrate.

[0029] Figure 6 Yes means Figure 2 , 3 A perspective view of the appearance of the first metal sheet.

[0030] Figure 7 yes Figure 6 A plan view of the first metal sheet.

[0031] Figure 8 Yes means Figure 2 , 3 A perspective view of the appearance of a second metal sheet.

[0032] Fig. 9 yes Figure 8 Developed plan view of the second metal sheet.

[0033] Fig.10 Yes means Figure 2 , 3 A three-dimensional diagram of the appearance of the first frame.

[0034] Fig.11 Yes means Figure 2 , 3 A three-dimensional diagram of the appearance of the second frame.

[0035] Fig.12 Yes means Figure 2 , 3 The figure is a diagram of a method for manufacturing an electronic device, and is a diagram showing a process of assembling a third metal plate and an imaging element cover to an imaging optical system.

[0036] Fig.13 Yes means Figure 2 , 3 The figure of the manufacturing method of the electronic device is a figure showing the process of assembling the first substrate to the imaging optical system.

[0037] Fig.14 Yes means Figure 2 , 3 The figure of the manufacturing method of the electronic device is a figure showing another process of assembling the first substrate and the second substrate to the first metal plate.

[0038] Fig.15 Yes means Figure 2 ,3 The figure of the manufacturing method of the electronic device is a figure showing another process of assembling the first substrate and the second substrate to the first metal plate.

[0039] Fig.16 Yes means Figure 2 , 3 The figure of the manufacturing method of the electronic device is a figure showing the process of assembling the second metal plate member to the first metal plate member.

[0040] Fig.17 Yes means Figure 2 , 3 A three-dimensional diagram of the appearance of the internal structure of an electronic device.

[0041] Fig.18 It is a perspective view showing the appearance of another internal structure of the electronic device according to the second embodiment.

[0042] Fig.19 Yes means Fig.18 A three-dimensional view of the appearance of a first metal plate included in an internal structure.

[0043] Fig. 20 It means from Fig.19 Observation from different angles Fig.19 A perspective view of the appearance of the first metal sheet.

[0044] Fig.21 yes Fig.19 A plan view of the first metal sheet.

[0045] Fig. 22 Yes means Fig.18 A three-dimensional view of the appearance of a second metal plate included in the internal structure.

[0046] Fig.23 yes Fig. 22 Developed plan view of the second metal sheet.

[0047] Fig.24 Yes means Fig.18 The figure is a diagram of a method for manufacturing an internal structure of the present invention, and is a diagram showing a process of assembling a first metal plate member to a first substrate.

[0048] Fig.25 It means that Fig.24 The diagram shows a state where the first metal plate is assembled to the first substrate.

[0049] Fig.26 Yes means Fig.18 The figure is a diagram of a method for manufacturing the internal structure of the optical system, and is a diagram showing a process of assembling the second substrate to the imaging optical system. DETAILED DESCRIPTION

[0050] Electronic devices are required to have shielding properties against radiated noise and further improve heat dissipation with a simple structure. The present disclosure aims to provide an electronic device, a camera, and a mobile object that have shielding properties against radiated noise and further improve heat dissipation with a simple structure.

[0051] Hereinafter, an electronic device, a camera, and a moving object according to a first embodiment of the present disclosure will be described with reference to the drawings.

[0052] Specifically, the electronic device of the first embodiment is, for example, a camera. Figure 1 As shown, an electronic device 10 applied to the imaging device of the first embodiment is mounted on a moving object 11 , for example.

[0053] The mobile body 11 may include, for example, vehicles, ships, and airplanes. Vehicles may include, for example, automobiles, industrial vehicles, railway vehicles, life vehicles, and fixed-wing aircraft traveling on runways. Automobiles may include, for example, passenger cars, trucks, buses, motorcycles, and trolley buses. Industrial vehicles may include, for example, agricultural and construction-oriented industrial vehicles. Industrial vehicles may include, for example, forklifts and golf carts. Agricultural-oriented industrial vehicles may include, for example, tractors, tillers, transplanters, harvesters and bundlers, combine harvesters, and mowers. Construction-oriented industrial vehicles may include, for example, bulldozers, shovels, forklifts, cranes, dump trucks, and road rollers. Vehicles may include vehicles driven by manpower. The classification of vehicles is not limited to the above. For example, automobiles may include industrial vehicles that can travel on roads. Multiple classifications may include the same vehicle. Ships may include, for example, offshore jets, boats, and tankers. Aircraft may include, for example, fixed-wing aircraft and rotary-wing aircraft.

[0054] like Figure 2 , 3 As shown, the electronic device 10 includes a first substrate 12, a second substrate 13, a first metal plate 14, and a second metal plate 15. The electronic device 10 may further include a photographing optical system 16, a first frame 17, and a second frame 18.

[0055] like Figure 4 , 5 As shown, the first substrate 12 is in the shape of a flat plate. The first substrate 12 may be substantially rectangular. Figure 2 , 3As shown, the first substrate 12 is equipped with an image sensor 19 as an electronic component on the side opposite to the surface facing the flat plate portion 23 described later. The image sensor 19 is, for example, a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor, which generates an image signal by capturing an optical image formed on the light receiving surface. The first substrate 12 is equipped with an electronic component 20 on at least one main surface. The electronic component 20 drives the image sensor 19 or processes the image signal generated by the image sensor 19.

[0056] like Figure 4 , 5 As shown, the second substrate 13 is in the shape of a flat plate. The second substrate 13 may be substantially rectangular. The second substrate 13 carries an electronic component 20 on at least one main surface. The electronic component 20 drives the imaging element 19 or processes the image signal generated by the imaging element 19. The second substrate 13 may carry a first connector 21 for electrical connection with the second frame 18 on one main surface.

[0057] The first substrate 12 can be electrically connected to the second substrate 13 through the flexible substrate 22. Figure 4 As shown, in a state where the flexible substrate 22 is entirely extended into a flat plate shape, the imaging element 19 of the first substrate 12 and the first connector 21 of the second substrate 13 can be mounted on the main surface of the same side.

[0058] like Figure 2 , 3 As shown, in the electronic device 10 , the first substrate 12 and the second substrate 13 are arranged in the stacking direction so that their main surfaces face each other.

[0059] like Figure 6 As shown, the first metal plate 14 has a flat plate portion 23 and a first shielding portion 24 .

[0060] The flat plate portion 23 is in the shape of a flat plate. The flat plate portion 23 may be a substantially rectangular shape that is wider than the first substrate 12 and the second substrate 13. Figure 2 , 3 As shown, in the electronic device 10, the flat plate portion 23 is interposed between the first substrate 12 and the second substrate 13 in the stacking direction. In the electronic device 10, the main surface of the flat plate portion 23 is substantially parallel to the main surfaces of the first substrate 12 and the second substrate 13.

[0061] like Figure 6 As shown in FIG. 1 , the flat plate portion 23 has an opening 25 near the side connected to the first shielding portion 24. The opening 25 may also be substantially rectangular. Figure 2As shown, in the electronic device 10 , the opening 25 is locked with the two locking portions 33 of the second metal plate 15 .

[0062] In the electronic device 10, the flat plate portion 23 is in direct or indirect contact with the electronic components 20 mounted on the first substrate 12 and the second substrate 13, respectively. In the electronic device 10, the flat plate portion 23 is in indirect contact with the image sensor 19 as an electronic component, for example, via the heat sink 27 and the first substrate 12. In the electronic device 10, the flat plate portion 23 is in indirect contact with the electronic component 20 mounted on the second substrate 13, for example, via the heat sink 27. The heat sink 27 can be formed of a soft material having shape-conforming properties and relatively high thermal conductivity, such as silicone rubber with fillers added.

[0063] like Figure 6 As shown, the first shielding portion 24 is erected along a portion of the outer edge of the flat plate portion 23 on the main surface side of the flat plate portion 23 that is opposite to the first substrate 12. For example, the first shielding portion 24 is erected along the entirety of any one side of the flat plate portion 23 and a portion of both sides sandwiching the one side. Figure 2 , 3 As shown, in the electronic device 10 , the first shielding portion 24 covers a portion of the side surface of the first substrate 12 .

[0064] like Figure 6 As shown in FIG. 2 , the first shielding portion 24 has a first fixing portion 26. In the present embodiment, the first shielding portion 24 has the first fixing portion 26 at a substantially central portion of a side opposite to a side connected to the flat plate portion 23. Figure 2 , 3 As shown, the first metal plate 14 is fixed to the lens barrel 16A containing the photographing optical system 16 by the first fixing portion 26. The fixing of the lens barrel 16A of the photographing optical system 16 by the first fixing portion 26 is, for example, fixing based on snap-fitting, but is not limited thereto, and welding, bonding based on adhesives, and fastening based on screw fastening may also be applied.

[0065] The first metal sheet 14 is formed by a metal sheet. Figure 7 The desired shape is formed by bending a predetermined portion of a metallic flat plate as shown. Figure 7 In the figure, the straight line that bends toward the front side is indicated by a dotted line, and the straight line that bends toward the back side is indicated by a dashed line. Therefore, by stretching the bent portion of the first metal plate 14 to form a flat surface, any parts of the first metal plate 14 will not interfere with each other and separate. The first metal plate 14 can be formed of a metal with high thermal conductivity, such as copper.

[0066] like Figure 8 As shown, the second metal sheet 15 has a second shielding portion 28 .

[0067] The second shielding portion 28 is a substantially rectangular square tube, and one side of the rectangular cross section in the axial direction and a part of the two sides sandwiching the one side protrude in the axial direction in a C-shaped shape. That is, the second shielding portion 28 includes a substantially rectangular square tube-shaped full shielding portion 30, and a square tube-shaped partial shielding portion 29 that is a continuous square tube-shaped portion cut off from the full shielding portion 30 in the axial direction. Figure 2 , 3 As shown, in the electronic device 10, the second metal plate 15 covers the entire circumference of the side of the second substrate 13 and the side of the first substrate 12 exposed from the first metal plate 14. In this structure, the full shielding portion 30 covers the entire circumference of the side of the second substrate 13. In addition, the partial shielding portion 29 covers the side of the first substrate 12 exposed from the first metal plate 14.

[0068] like Figure 8 As shown, the second shielding portion 28 has a second fixing portion 31 at the end portion on the axial side of the partial shielding portion 29. That is, the second shielding portion 28 has a second fixing portion 31 at the edge of the partial shielding portion 29 on the opposite side of the continuous direction of the full shielding portion 30. In this embodiment, the second fixing portion 31 is arranged on the surface of the partial shielding portion 29 that is sandwiched by the other two surfaces. Figure 2 As shown, the second metal plate 15 is fixed to the lens barrel 16A containing the photographing optical system 16 by the second fixing portion 31. The fixing of the second fixing portion 31 to the lens barrel 16A of the photographing optical system 16 is, for example, fixing based on snap-fitting, but is not limited thereto, and welding, bonding based on adhesives, and fastening based on screw fastening may also be applied.

[0069] like Figure 8 As shown, the full shielding portion 30 of the second shielding portion 28 has a gap 32 in the circumferential direction. The gap 32 is a gap between the ends of the flat plate when the second metal plate 15 is formed by bending the metallic flat plate. The full shielding portion 30 of the second shielding portion 28 has two stopper portions 33 adjacent to each other across the gap 32 near the gap 32. The two stopper portions 33 are located at the ends of the full shielding portion 30 on the axial side. Figure 2 As shown, in the electronic device 10 , the two locking portions 33 are locked with the opening 25 of the first metal plate 14 .

[0070] like Figure 8 As shown in FIG. 2 , in the second shielding portion 28, the second fixing portion 31 and the two locking portions 33 are arranged on surfaces facing each other. Figure 2 As shown, when the first metal plate 14 and the second metal plate 15 are installed in the electronic device 10, the first fixing portion 26 of the first metal plate 14 and the second fixing portion 31 of the second metal plate 15 clamp the lens barrel 16A containing the photographing optical system 16 from two directions perpendicular to the optical axis.

[0071] The second metal sheet 15 is passed through the metal sheet, in other words, Fig. 9 The desired shape is formed by bending a predetermined portion of a metallic flat plate as shown. Fig. 9 In the figure, the straight line that bends toward the front side is indicated by a dotted line, and the straight line that bends toward the back side is indicated by a dashed line. Therefore, by stretching the bent portion of the second metal plate 15 to form a flat surface, any parts of the second metal plate 15 will not interfere with each other and separate. The second metal plate 15 can be formed of a metal with high thermal conductivity, such as copper.

[0072] The imaging optical system 16 is composed of optical elements such as lenses. The imaging optical system 16 is designed so that optical characteristics such as angle of view and depth of field become desired values. The imaging optical system 16 forms an imaged subject image on the light receiving surface of the imaging element 19 .

[0073] like Fig.10 As shown, the first frame 17 may be a cylindrical shape with a rectangular cross section. Figure 2 , 3 As shown, the first frame 17 can accommodate the photographing optical system 16 in such a manner that the optical axis of the photographing optical system 16 is substantially consistent with the axis of the first frame 17 and the photographing optical system 16 is exposed from one opening. The first frame 17 can accommodate the first substrate 12 so that the imaging element 19 is fixed to the photographing optical system 16 at a predetermined position and in a predetermined posture. The first frame 17 can also accommodate the second substrate 13, the first metal plate 14, and the second metal plate 15 in such a manner that the above-mentioned structure is satisfied for the first substrate 12.

[0074] like Figure 2 , 3 As shown, a third metal plate 34 and an imaging element cover 35 are provided between the imaging optical system 16 and the first substrate 12 to surround the side surface with respect to the stacking direction of the imaging element 19. The third metal plate 34 can be formed of a metal with high thermal conductivity such as copper. The third metal plate 34 and the imaging element cover 35 dissipate the heat generated by the imaging element 19 to the outside. The imaging element cover 35 can be formed of a soft material with relatively high thermal conductivity having shape-following properties such as silicone rubber with fillers added.

[0075] like Fig.11 As shown, the second frame 18 may have a flat plate portion and a quadrangular prism extending perpendicularly to the main surface of the flat plate portion. The second frame 18 may have a second connector 36 that can be mated with the first connector 21. The second frame 18 may have a fourth metal plate 37. Figure 2 , 3As shown, in the electronic device 10, the fourth metal plate 37 is in contact with the second metal plate 15. The second frame 18 can be sealed at the flat plate portion on the side of the first frame 17 opposite to the side where the photographing optical system 16 is exposed, that is, on the image side opening in the optical axis direction of the photographing optical system 16.

[0076] Next, a method for manufacturing the electronic device 10 will be described below.

[0077] like Fig.12 As shown, a third metal plate 34 and an image sensor cover 35 are attached to the image side of the lens barrel 16A that accommodates the image pickup optical system 16 in the optical axis direction of the image pickup optical system 16. The third metal plate 34 is fixed to the lens barrel 16A of the image pickup optical system 16 by a third fixing portion 38 included in the third metal plate 34.

[0078] like Fig.13 As shown, the first substrate 12 is fixed to the image side in the optical axis direction of the imaging optical system 16 so that the imaging optical system 16 and the imaging element 19 face each other.

[0079] like Fig.14 As shown, the flat plate portion 23 of the first metal plate 14 is attached to the first substrate 12. A heat sink 27 may be used in attaching the flat plate portion 23 of the first metal plate 14 to the first substrate 12. At this time, the first shielding portion 24 of the first metal plate 14 does not cover the portion of the first substrate 12 where the flexible substrate 22 is provided. In addition, the first metal plate 14 is fixed to the lens barrel 16A by the first fixing portion 26.

[0080] like Fig.15 As shown, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23. A heat sink 27 may be used to attach the flat plate portion 23 of the first metal plate 14 to the second substrate 13.

[0081] like Fig.16 As shown, the second metal plate 15 is installed in a manner that covers the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the photographing optical system 16. The two locking portions 33 of the second metal plate 15 are locked with the opening portion 25 of the first metal plate 14. In addition, the second metal plate 15 is fixed to the lens barrel 16A of the photographing optical system 16 by the second fixing portion 31. Fig.17 As shown, an internal structure 39 constituting the electronic device 10 is shown.

[0082] like Figure 2 , 3As shown, the second substrate 13 is connected to the second frame 18 by fitting the first connector 21 into the second connector 36. As a result, the fourth metal plate 37 is in contact with the second metal plate 15. Then, the first frame 17 is covered by the second frame 18 in a manner covering the internal structure 39. That is, the first frame 17 is covered by the second frame 18 in a manner covering the photographing optical system 16, the first substrate 12, the second substrate 13, the first metal plate 14, and the second metal plate 15. In a state where the first frame 17 covers the internal structure 39, the electronic device 10 is manufactured by fixing the first frame 17 to the second frame 18. The fixing of the first frame 17 and the second frame 18 is applied by, for example, welding, bonding by an adhesive, and fastening by screw fastening.

[0083] The electronic device 10 of the first embodiment having the above structure has a flat plate portion 23 interposed between the first substrate 12 and the second substrate 13, and is in indirect contact with the image sensor 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13. With such a structure, since the image sensor 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13, which are heat sources, are close to the flat plate portion 23, which generally has a higher thermal conductivity than the heat sink 27, the electronic device 10 has improved heat dissipation compared to a structure in which only the heat sink 27 is interposed.

[0084] Furthermore, the electronic device 10 of the first embodiment covers the side surface of the first substrate 12 over the entire circumference by the first shielding portion 24 and the second shielding portion 28. With such a structure, the electronic device 10 can have shielding properties against the radiation noise of the electronic component 20 mounted on the first substrate 12. In addition, the electronic device 10 of the first embodiment covers the side surface of the second substrate 13 over the entire circumference by the second shielding portion 28. With such a structure, the electronic device 10 can have shielding properties against the radiation noise of the electronic component 20 mounted on the second substrate 13.

[0085] Furthermore, in the electronic device 10 of the first embodiment, the first metal plate 14 has the flat plate portion 23 and the first shielding portion 24. In addition, in the electronic device 10, the second metal plate 15 has the second shielding portion 28. With such a structure, in the electronic device 10, the flat plate portion 23 and the first shielding portion 24 having the above structure, and the second shielding portion 28 having the above structure can be manufactured with a simple structure without going through processes such as welding.

[0086] Therefore, as described above, the electronic device 10 according to the first embodiment has shielding properties against radiation noise and can further improve heat dissipation properties with a simple structure.

[0087] In the electronic device 10 of the first embodiment, the first metal plate 14 and the second metal plate 15 are in direct or indirect contact with each other. With such a structure, the electronic device 10 can improve the heat conduction between the first metal plate 14 and the second metal plate 15 compared with a structure in which the first metal plate 14 and the second metal plate 15 are separated from each other. Therefore, the electronic device 10 can further improve the heat dissipation by conducting the heat generated by the component that directly or indirectly contacts only one of the first metal plate 14 and the second metal plate 15 to the other metal plate. For example, in the above-mentioned structure, in a structure in which one of the first metal plate 14 and the second metal plate 15 is in contact with a heat conductor such as the fourth metal plate 37 for conducting the heat inside the electronic device 10 to the outside, the electronic device 10 can conduct the heat of the other metal plate to the heat conductor.

[0088] In the electronic device 10 of the first embodiment, the first shielding portion 24 of the first metal plate 14 covers a portion of the side surface of the first substrate 12, and the second shielding portion 28 of the second metal plate 15 covers a portion of the side surface of the first substrate 12 and the entire circumference of the second substrate 13 exposed from the first shielding portion 24. With such a structure, even if the electronic device 10 has a structure in which the first substrate 12 and the second substrate 13 are connected by wiring such as the flexible substrate 22 extending from the side surface of the first substrate 12, the first substrate 12 and the second substrate 13 can be easily attached to the first metal plate 14, and shielding can be achieved against radiation noise of the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13.

[0089] In addition, in the electronic device 10 of the first embodiment, the second metal plate 15 has the locking portion 33, and the first metal plate 14 and the second metal plate 15 are directly abutted by the locking portion 33. With such a structure, the electronic device 10 can increase the heat conduction between the first metal plate 14 and the second metal plate 15, and stably connect the first metal plate 14 and the second metal plate 15.

[0090] In the electronic device 10 of the first embodiment, the second metal plate 15 has two adjacent stoppers 33 with a gap 32 in between in the second shielding portion 28. With such a structure, in the electronic device 10, the stoppers 33 can have elasticity, and the stoppers 33 of the second metal plate 15 can be easily inserted and fixed into the opening 25 of the first metal plate 14. Furthermore, the electronic device 10 uses the opening 25 to clamp the two adjacent stoppers 33 with the gap 32 in between, making it difficult for the gap 32 to expand, thereby reducing the decline in shielding properties.

[0091] In addition, in the electronic device 10 of the first embodiment, the flexible substrate 22 connecting the first substrate 12 and the second substrate 13 is covered by the second shielding portion 28. With such a structure, the electronic device 10 can suppress a decrease in shielding properties against radiation noise of the electronic components 20 mounted on each of the first substrate 12 and the second substrate 13 while using the flexible substrate 22 that contributes to facilitation of manufacturing and reduction of manufacturing costs.

[0092] Next, refer to Figures 18 to 26 The electronic device 10 according to the second embodiment of the present disclosure is described. In the second embodiment, the structure of the internal structure of the electronic device 10 is different from that of the first embodiment. Fig.18 As shown, in the internal structure 39-2 of the second embodiment, the shapes of the first metal plate 14-2 and the second metal plate 15-2 are similar to those of the first metal plate 14-2 and the second metal plate 15-2. Fig.17 The first embodiment shown has different shapes of the first metal plate 14 and the second metal plate 15 of the internal structure 39. The second embodiment will be described below with the differences from the first embodiment as the center. It should be noted that the same reference numerals are given to the parts having the same structure as the first embodiment.

[0093] Reference Fig.19 and Fig. 20 The first metal sheet 14-2 is described. Fig.19 As shown, the first metal plate 14 - 2 has a flat plate portion 23 - 2 and a first shielding portion 24 - 2 .

[0094] The flat plate portion 23-2 is different from the flat plate portion 23 of the first embodiment in that its main surface does not have the opening portion 25. The structure of the flat plate portion 23-2 other than the point that it does not have the opening portion 25 may be the same as that of the flat plate portion 23 of the first embodiment. In addition, the relationship between the flat plate portion 23-2 and the first substrate 12 and the second substrate 13 may be the same as that of the first embodiment.

[0095] The first shielding portion 24-2 is erected along a portion of the outer edge of the flat plate portion 23-2. For example, the first shielding portion 24-2 is connected to the flat plate portion 23-2 on all of any two opposing sides of the flat plate portion 23-2. The first shielding portion 24-2 is erected along the two sides and a portion of the other two sides sandwiching the two sides. On one of the two sides not connected to the first shielding portion 24-2, the first shielding portion 24-2 is erected at both ends of the side with a gap of a distance D. The distance D may be longer than the width of the flexible substrate 22.

[0096] The flat plate portion 23-2 has an erected portion 40 erected along a portion of the outer edge of the flat plate portion 23-2 in the opposite direction to the first shielding portion 24-2. The main surface of the erected portion 40 faces the surface of the first shielding portion 24-2 with a gap of a distance D. The erected portion 40 is connected to the first shielding portion 24-2 and to a side of the outer edge of the flat plate portion 23-2 that is different from the side connected to the first shielding portion 24-2.

[0097] Fig. 20 It means from Fig.19 Compared to the figure of the first metal plate 14-2 viewed from the opposite side in the direction perpendicular to the flat plate portion 23-2. Fig. 20 As shown, the first shielding portion 24 - 2 has a contact portion 41 extending to the opposite side of the upright portion 40 on the surface opposite to the surface with the gap of distance D. In the electronic device 10 , the contact portion 41 contacts the third metal plate 34 .

[0098] The first metal sheet 14-2 is formed by the metal sheet. Fig.21 The desired shape is formed by bending a predetermined portion of a metallic flat plate. Fig.21 In the figure, the straight line that bends toward the front side is indicated by a dotted line, and the straight line that bends toward the back side is indicated by a dashed line. Therefore, by stretching the bent portion of the first metal plate 14-2 to form a flat surface, any parts of the first metal plate 14-2 will not interfere with each other and separate. The first metal plate 14-2 can be formed of a metal with high thermal conductivity, such as copper.

[0099] like Fig. 22 As shown, the second metal sheet 15 - 2 has a second shielding portion 28 - 2 .

[0100] The second shielding portion 28-2 is in the shape of a roughly rectangular square tube, and a portion of any two opposite sides of the rectangular cross section in the axial direction protrudes in the axial direction. That is, the second shielding portion 28-2 has a roughly rectangular square tube-shaped full shielding portion 30-2, and two partial shielding portions 29-2 that protrude from a portion of each of the two opposite sides of the rectangular cross section in the axial direction and are continuous from the full shielding portion 30-2 in the axial direction. The main surfaces of the two partial shielding portions 29-2 are opposite to each other. The width of the main surfaces of the two partial shielding portions 29-2, that is, the length in the direction perpendicular to the axial direction, may be different. In the electronic device 10, the second metal plate 15-2 covers the entire circumference of the side surface of the second substrate 13 and a portion of the side surface of the first substrate 12 exposed from the first metal plate 14-2. In this structure, the full shielding portion 30-2 covers the entire circumference of the side surface of the second substrate 13, and the partial shielding portion 29-2 covers a portion of the side surface of the first substrate 12 exposed from the first metal plate 14.

[0101] The two partial shielding portions 29-2 of the second shielding portion 28-2 each have a second fixing portion 31 at the end portion on the side that is not continuous with the full shielding portion 30-2. Thus, when the second metal plate 15-2 is mounted on the electronic device 10, the two second fixing portions 31 clamp the lens barrel 16A containing the photographing optical system 16 from two directions perpendicular to the optical axis.

[0102] The second shielding portion 28-2 extends over one side of the partial shielding portion 29-2 and the full shielding portion 30-2, and has a gap 32 in the circumferential direction. The gap 32 is provided substantially parallel to the axial direction. The gap 32 is a gap between the ends of the flat plate that are opposite to each other when the second metal plate 15-2 is formed by bending the metallic flat plate. On one side of the partial shielding portion 29-2, the second fixing portion 31 is located near the gap 32. In addition, on the side of the partial shielding portion 29-2, the contact portion 42 adjacent to the second fixing portion 31 across the gap 32 contacts the third metal plate 34 in the electronic device 10.

[0103] The second metal sheet 15-2 is formed by the metal sheet. Fig.23 The desired shape is formed by bending a predetermined portion of a metallic flat plate as shown. Fig.23 In the figure, the straight line that bends toward the front side is indicated by a dotted line, and the straight line that bends toward the back side is indicated by a dashed line. Therefore, by stretching the bent portion of the second metal plate 15-2 to form a flat surface, any parts of the second metal plate 15-2 will not interfere with each other and separate. The second metal plate 15-2 can be formed of a metal with high thermal conductivity, such as copper.

[0104] Next, a method for manufacturing the internal structure 39 - 2 will be described below.

[0105] exist Fig.12 , 13 As described above, the first substrate 12 is attached to the lens barrel 16A that accommodates the imaging optical system 16 via the third metal plate 34 and the imaging element cover 35 .

[0106] like Fig.24 As shown, the flat plate portion 23-2 of the first metal plate 14-2 is attached to the first substrate 12. A heat sink 27 may be used in attaching the flat plate portion 23-2 of the first metal plate 14-2 to the first substrate 12. The first metal plate 14-2 is attached to the first substrate 12 in such a way that the flexible substrate 22 of the first substrate 12 can pass through the gap of the distance D of the first shielding portion 24-2. Fig.25 As shown, the contact portion 41 of the first metal sheet 14-2 is in contact with the third metal sheet 34. In addition, Fig.25 It means by Fig.19The first metal plate 14-2 is observed attached to the first substrate 12 by rotating 180 degrees with the axial direction of the lens barrel 16A as the center. Fig.25 A portion of the flexible substrate 22 and the second substrate 13 are not shown.

[0107] like Fig.26 As shown, the flexible substrate 22 is folded back, and the second substrate 13 is attached to the flat plate portion 23-2. A heat sink 27 may be used to attach the flat plate portion 23-2 of the first metal plate 14-2 to the second substrate 13.

[0108] The second metal plate 15-2 is installed in a manner that covers the periphery of the second substrate 13 from the first connector 21 side in the optical axis direction of the photographing optical system 16. The second metal plate 15-2 is fixed to the lens barrel 16A that accommodates the photographing optical system 16 by two second fixing portions 31. As a result, the contact portion 42 of the second metal plate 15-2 contacts the third metal plate 34. Therefore, the first metal plate 14-2 and the second metal plate 15-2 are indirectly abutted via the third metal plate 34. In this way, as Fig.18 As shown, an internal structure 39 - 2 constitutes the electronic device 10 .

[0109] In the electronic device 10 of the second embodiment of the structure described above, the opening for locking the first metal plate 14-2 and the second metal plate 15-2 is not provided on the flat plate portion 23-2 of the first metal plate 14-2 as in the first embodiment. With such a structure, the area of ​​the flat plate portion 23 that can directly or indirectly contact the imaging element 19 mounted on the first substrate 12 and the electronic component 20 mounted on the second substrate 13, which are heat sources, can be expanded, and the electronic device 10 improves heat dissipation.

[0110] In addition, in the electronic device 10 of the present embodiment, the first metal plate 14-2 and the second metal plate 15-2 are indirectly abutted via the third metal plate 34. With such a structure, the electronic device 10 can reduce the heat conduction between the first metal plate 14-2 and the second metal plate 15-2 compared to a structure in which the first metal plate 14-2 and the second metal plate 15-2 are abutted against each other. Therefore, in the electronic device 10, in a structure in which one of the first metal plate 14-2 and the second metal plate 15-2 is close to a component that is greatly affected by high temperature, even if the other one is heated to a high temperature, the heat conduction from the other one to the first one can be reduced.

[0111] The present disclosure has been described based on the drawings and embodiments, and it should be noted that those skilled in the art can easily make various modifications and corrections based on the present disclosure. Therefore, it should be noted that these modifications and corrections are included in the scope of the present disclosure.

[0112] Description of Reference Numerals

[0113] 10 Electronic devices

[0114] 11 Moving Object

[0115] 12. First substrate

[0116] 13. Second substrate

[0117] 14, 14-2 The first metal sheet

[0118] 15.15-2 Second metal sheet

[0119] 16 Photography Optical System

[0120] 16A lens tube

[0121] 17 First frame

[0122] 18 Second frame

[0123] 19 camera elements

[0124] 20Electronic components

[0125] 21 First Connector

[0126] 22 Flexible substrate

[0127] 23.23-2 Flat plate

[0128] 24, 24-2 First shielding part

[0129] 25 Opening

[0130] 26 first fixing part

[0131] 27 heat sink

[0132] 28, 28-2 Second shielding part

[0133] 29, 29-2 Partially shielded part

[0134] 30, 30-2 Fully shielded section

[0135] 31 Second fixing part

[0136] 32 gaps

[0137] 33 stopper

[0138] 34 Third Metal Sheet

[0139] 35 camera cover

[0140] 36 Second connector

[0141] 37 Fourth Metal Sheet

[0142] 38 Third fixing part

[0143] 39.39-2 Internal structure

[0144] 40 vertical setting part

[0145] 41, 42 contact parts

[0146] D distance.

Claims

1. An electronic device having: The first substrate and the second substrate are provided with electronic components and arranged in a stacking direction with their main surfaces facing each other; A first metal plate having a first shielding portion covering a portion of a side surface of the first substrate; as well as a second metal plate having a second shielding portion covering a side surface of the second substrate and a side surface of the first substrate exposed from the first metal plate, The first metal sheet and the second metal sheet are in direct or indirect contact with each other. The second shielding portion includes a substantially rectangular square tube-shaped full shielding portion and a square tube-shaped partial shielding portion which is continuous in the axial direction from the full shielding portion and has a portion of the circumferential direction cut off. The partial shielding portion covers the side surface of the first substrate exposed from the first metal plate.

2. The electronic device according to claim 1, wherein: The first metal plate has a flat plate portion interposed between the first substrate and the second substrate.

3. The electronic device according to claim 1, wherein: The electronic device comprises: an imaging element mounted on the first substrate; and The lens barrel houses a photographing optical system that forms an image of a subject on the imaging element.

4. The electronic device according to claim 3, wherein: The first metal plate is fixed to the lens barrel.

5. The electronic device according to claim 4, wherein: The second metal plate is fixed to the lens barrel.

6. The electronic device according to claim 1, wherein: The second metal plate covers the entire circumference of the side surface of the second substrate.

7. The electronic device according to claim 2, wherein: The flat plate portion is in direct or indirect contact with the electronic component mounted on the first substrate or the second substrate.

Images