Printing template and method for manufacturing the same

Abstract

A printing template (100) and a manufacturing method thereof. The manufacturing method of the printing template (100) comprises: providing a substrate layer (10), a layer of curable material (20) and a master plate assembly (30); providing a mask plate (40), the orthographic projection of the connecting piece (34) on the substrate layer (10) is located in the orthographic projection of the non-light-transmitting area (410) of the mask plate (40) on the substrate layer (10), and the orthographic projection of the printing graph (31) on the substrate layer (10) is located in the orthographic projection of the light-transmitting area (420) of the mask plate (40) on the substrate layer (10); irradiating the layer of curable material (20) through the mask plate (40) by using light (UV) to cure the part of the layer of curable material (20) corresponding to the light-transmitting area (420), and the part of the layer of curable material (20) corresponding to the non-light-transmitting area (410) is not cured; removing the uncured part of the layer of curable material (20). The manufacturing method of the printing template (100) improves the appearance of the printing template (100) and guarantees the quality of the printing template (100).

Description

Technical Field

[0001] The embodiments of the present disclosure relate to a method for manufacturing a printing template and a printing template manufactured by the manufacturing method. Background Art

[0002] Imprint technology is a pattern transfer technique that offers the advantages of low cost and high efficiency. Imprint technology involves transferring a pattern from a mold onto a pattern layer to form an imprint template. The resulting micropatterns range in size from nanometers to micrometers and are applicable to a variety of fields, including semiconductor materials, optical materials, storage media, micromechanics, and biology. Summary of the Invention

[0003] The embodiments of the present disclosure provide a method for manufacturing a printing template and a printing template manufactured by the manufacturing method.

[0004] According to a first aspect of the present disclosure, a method for manufacturing a printing template is provided, comprising:

[0005] Providing a base layer, a curable material layer, and a motherboard assembly, and transferring a printed pattern of the motherboard assembly onto the curable material layer, wherein the base layer, the curable material layer, and the motherboard assembly are stacked with the curable material layer located between the base layer and the motherboard assembly, the motherboard assembly comprising two motherboards and a connector located between the two motherboards, the connector connecting the two motherboards to each other, and each motherboard comprising the printed pattern;

[0006] Providing a mask, the mask being located on a side of the base layer away from the curable material layer, and comprising a light-transmitting area and a light-impermeable area, the orthographic projection of the connector on the base layer being located within the orthographic projection of the light-impermeable area on the base layer, and the orthographic projection of the printed pattern on the base layer being located within the orthographic projection of the light-transmitting area on the base layer;

[0007] irradiating the curable material layer with light through the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured;

[0008] The curable material layer is separated from the mother board assembly, and an uncured portion of the curable material layer is removed to form a pattern layer of the printing template on the base layer.

[0009] In at least one example, each of the motherboards includes an edge area near the connector, each of the motherboards includes an edge surface facing the curable material layer in the edge area, the connector includes a connecting surface facing the curable material layer, and the edge surface is not coplanar with the connecting surface.

[0010] In at least one example, the connection surface includes a non-planar surface, and the non-planar surface includes protrusions and / or grooves.

[0011] In at least one example, the connector includes a protrusion, the thickness of the curable material layer is greater than or equal to the height of the protrusion relative to the edge surface of the motherboard, and when the printed pattern of the motherboard assembly is transferred to the curable material layer, the protrusion enters the curable material layer but does not contact the base layer.

[0012] In at least one example, the thickness of the curable material layer is 1.25 to 50 times the height of the protrusion.

[0013] In at least one example, the printed pattern includes multiple groups of sub-printed patterns, each group of sub-printed patterns includes at least one sub-printed pattern, and the multiple groups of sub-printed patterns are arranged at intervals; the mask includes multiple light-transmitting areas, and the multiple light-transmitting areas are arranged at intervals.

[0014] In at least one example, each of the light-transmitting areas corresponds to at least one of the multiple groups of sub-printed patterns, and the orthographic projection of the at least one group of sub-printed patterns on the base layer is located within the orthographic projection of the light-transmitting area corresponding to the at least one group of sub-printed patterns on the base layer.

[0015] In at least one example, each of the light-transmitting areas corresponds to two groups of the multiple groups of sub-printed patterns, and the orthographic projections of the two groups of sub-printed patterns on the base layer and the orthographic projections of the area between the two groups of sub-printed patterns on the base layer are all located within the orthographic projection of the same light-transmitting area on the base layer.

[0016] In at least one example, each of the light-transmitting regions corresponds to one of the multiple groups of sub-printed patterns, and the orthographic projection of each group of sub-printed patterns on the base layer is located within the orthographic projection of the corresponding light-transmitting region on the base layer.

[0017] In at least one example, the curable material layer includes a plurality of portions to be irradiated, and the plurality of portions to be irradiated correspond one-to-one to the plurality of light-transmitting areas;

[0018] The step of irradiating the curable material layer with light through the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured comprises: irradiating a plurality of portions to be irradiated with light through the plurality of light-transmitting areas of the mask so that the plurality of portions to be irradiated are cured;

[0019] The curable material layer is separated from the motherboard assembly, and the uncured portion of the curable material layer is removed to form a pattern layer of the printing template on the base layer, and the multiple cured portions to be irradiated remain on the base layer to form multiple curing units in the pattern layer, wherein the at least one group of sub-printed patterns is transferred to one of the multiple curing units.

[0020] In at least one example, the mask plate includes a plurality of the non-light-transmitting areas, the plurality of the non-light-transmitting areas are arranged at intervals, and the plurality of the non-light-transmitting areas are arranged alternately with the plurality of the light-transmitting areas, and the orthographic projection of the connecting member on the base layer is located within the orthographic projection of one of the plurality of the non-light-transmitting areas on the base layer.

[0021] In at least one example, the multiple non-light-transmitting areas include a first non-light-transmitting area and multiple second non-light-transmitting areas, the orthographic projection of the connecting member on the base layer is located within the orthographic projection of the first non-light-transmitting area on the base layer, and the multiple second non-light-transmitting areas are respectively distributed on both sides of the first non-light-transmitting area.

[0022] In at least one example, each of the motherboards further includes a plurality of spacers, one of the plurality of spacers is arranged between each two adjacent groups of the sub-printed patterns, and the orthographic projection of each of the second non-light-transmitting areas on the base layer is located within the orthographic projection of one of the plurality of spacers on the base layer.

[0023] In at least one example, the curable material layer includes a plurality of non-irradiated portions, and the plurality of non-irradiated portions correspond one-to-one to the plurality of non-light-transmitting regions;

[0024] The step of irradiating the curable material layer with light via the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured comprises: a plurality of the non-irradiated portions are not irradiated by the light, and thus the plurality of the non-irradiated portions are not cured;

[0025] The step of separating the curable material layer from the motherboard assembly and removing the uncured portion of the curable material layer to form the pattern layer of the printing template on the base layer includes: removing the uncured multiple non-irradiated portions to form a plurality of grooves in the pattern layer, wherein one of the multiple grooves is provided between each two adjacent curing units.

[0026] In at least one example, the connecting member extends along a first direction between the two motherboards, each of the non-light-transmitting areas extends along the first direction, and each of the light-transmitting areas extends along the first direction.

[0027] In at least one example, in a plane perpendicular to the first direction, a cross-sectional width of each of the non-light-transmitting areas is greater than a cross-sectional width of the connector and smaller than a cross-sectional width of the spacer.

[0028] In at least one example, providing a base layer, a curable material layer, and a master assembly, and transferring the printed pattern of the master assembly to the curable material layer includes:

[0029] providing a base layer and the curable material layer stacked with the base layer; and

[0030] The master assembly is pressed against the layer of curable material such that the printed pattern is pressed into the layer of curable material.

[0031] In at least one example, providing a base layer, a curable material layer, and a master assembly, and transferring the printed pattern of the master assembly to the curable material layer includes:

[0032] providing the motherboard assembly;

[0033] forming a layer of the curable material covering the printed pattern on the mother board assembly;

[0034] The base layer is formed on the curable material layer.

[0035] In at least one example, separating the curable material layer from the motherboard assembly and removing an uncured portion of the curable material layer to form the pattern layer of the printing template on the base layer includes:

[0036] An uncured portion of the curable material layer is removed using an organic solvent or deionized water.

[0037] In at least one example, each of the mother boards has a convex portion, and the printed pattern is disposed at an end portion of the convex portion.

[0038] According to a second aspect of the present disclosure, there is provided a printing template manufactured according to the manufacturing method described in any of the above embodiments, comprising:

[0039] the base layer;

[0040] The pattern layer is stacked with the base layer, and the pattern layer includes:

[0041] a plurality of curing units, the printed pattern being transferred onto the plurality of curing units;

[0042] A plurality of grooves, one of the plurality of grooves is provided between two adjacent ones of the plurality of curing units, and the depths of the plurality of grooves are the same.

[0043] In at least one example, the printed pattern transferred to the plurality of curing units is embedded in the plurality of curing units and has a first depth, and each of the grooves has a second depth that is greater than the first depth.

[0044] In at least one example, the difference between the second depth and the first depth is 5 to 20 times the first depth. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings of the embodiments will be briefly introduced below. Obviously, the drawings in the following description only relate to some embodiments of the present disclosure, rather than limiting the present disclosure.

[0046] Figure 1 A flow chart of a method for manufacturing a printing template provided in an embodiment of the present disclosure;

[0047] Figure 2 Schematic cross-sectional view of a base layer, a curable material layer, and a motherboard assembly in a method for manufacturing a printing template according to an embodiment of the present disclosure;

[0048] Figure 3 A schematic plan view of a motherboard assembly in a method for manufacturing a printing template according to an embodiment of the present disclosure;

[0049] Figure 4 Schematic diagram of the structure of each step for forming a base layer, a curable material layer and a motherboard assembly in the method for making a printing template according to an embodiment of the present disclosure;

[0050] Figure 5 Schematic diagram of the structure of the steps for forming a base layer, a curable material layer and a motherboard assembly in a method for manufacturing a printing template according to another embodiment of the present disclosure;

[0051] Figure 6 A schematic plan view of a motherboard assembly in a method for manufacturing a printing template according to another embodiment of the present disclosure;

[0052] Figure 7 It is a partially enlarged cross-sectional schematic diagram of a connecting member in the method for manufacturing a printing template according to an embodiment of the present disclosure;

[0053] Figure 8 This is a partially enlarged cross-sectional schematic diagram of a connector in a method for manufacturing a printing template according to another embodiment of the present disclosure;

[0054] Figure 9 is a cross-sectional schematic diagram of a mask in a method for manufacturing a printing template according to an embodiment of the present disclosure;

[0055] Figure 10 A schematic plan view of a mask in a method for manufacturing a printing template according to an embodiment of the present disclosure;

[0056] Figure 11 A schematic plan view of a mask plate and a motherboard assembly in a method for manufacturing a printing template according to an embodiment of the present disclosure;

[0057] Figure 12 A schematic plan view of a mask plate and a motherboard assembly in a method for manufacturing a printing template according to another embodiment of the present disclosure;

[0058] Figure 13 Schematic cross-sectional views of a curable material layer before and after removal in a method for manufacturing a printing template according to an embodiment of the present disclosure are shown;

[0059] Figure 14 A partially enlarged cross-sectional schematic diagram of a printing template according to an embodiment of the present disclosure;

[0060] Figure 15 A schematic diagram of a printing template according to an embodiment of the present disclosure used in a transfer process;

[0061] Figure 16 A schematic cross-sectional view of a downstream product manufactured using the printing template of an embodiment of the present disclosure;

[0062] Figure 17 and Figure 18 Schematic cross-sections of different steps in the method for manufacturing a printing template are shown respectively. DETAILED DESCRIPTION

[0063] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0064] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by persons of ordinary skill in the field to which the invention belongs. The words "first", "second" and similar terms used in the specification and claims of this patent application do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" and similar words mean that the elements or objects appearing before "include" or "comprise" include the elements or objects listed after "include" or "comprise" and their equivalents, and do not exclude other elements or objects. Words such as "connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0065] In imprint technology, the time required to create the pattern on the mold makes the mold very expensive and limited in size. Consequently, the printed templates made from these molds are also difficult to manufacture in larger sizes. To address this, large-scale imprint templates can be fabricated by splicing multiple master plates together.

[0066] Figure 17 and Figure 18 The structural diagrams of different steps in the method for manufacturing the printed template are shown respectively. Figure 17 As shown, when the two molds 3 and 4 are connected together, a protrusion 5 is inevitably formed at the connection between the two molds 3 and 4. The photosensitive resin layer 2 can be cured by irradiating the photosensitive resin layer 2 with light L through the base layer 1. Figure 18 As shown, when the base layer 1 and the cured photosensitive resin layer 2 are peeled off from the molds 3 and 4, a defect 6 is formed in the photosensitive resin layer 2 due to the presence of the protrusion 5. Because the defect 6 is formed on the surface of the printing template, it is more easily noticed, thereby reducing the aesthetics of the printing template and potentially affecting the quality and appearance of the printing template and its downstream products.

[0067] The embodiments of the present disclosure provide a method for manufacturing a printing template and a printing template manufactured by the manufacturing method, which can eliminate visual defects caused by protrusions between molds, not only improving the aesthetics of the printing template, but also ensuring the quality of the printing template and its downstream products.

[0068] The manufacturing method of the printing template provided by the embodiment of the present disclosure is further described in detail below through specific examples.

[0069] Figure 1 Flowchart of the method for manufacturing a printing template provided by the embodiment of the present disclosure. Figure 1As shown, the manufacturing method of the printing template provided by the embodiment of the present disclosure includes:

[0070] S10: providing a base layer, a curable material layer, and a motherboard assembly, and transferring a printed pattern of the motherboard assembly onto the curable material layer, wherein the base layer, the curable material layer, and the motherboard assembly are stacked and the curable material layer is located between the base layer and the motherboard assembly, the motherboard assembly includes two motherboards and a connector located between the two motherboards, the connector splicing the two motherboards together, and each motherboard includes the printed pattern;

[0071] S20: providing a mask plate, wherein the mask plate is located on a side of the base layer away from the curable material layer, and the mask plate includes a light-transmitting area and a light-impermeable area, the orthographic projection of the connecting member on the base layer is located within the orthographic projection of the light-impermeable area on the base layer, and the orthographic projection of the printed pattern on the base layer is located within the orthographic projection of the light-transmitting area on the base layer;

[0072] S30: irradiating the curable material layer with light via the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured; and

[0073] S40: separating the curable material layer from the mother board assembly, and removing an uncured portion of the curable material layer to form a pattern layer on the base layer.

[0074] In the disclosed embodiment, a non-light-transmissive area of ​​the mask is used to block a portion of the curable material layer. Furthermore, the connector between the two motherboards is positioned within this blocked portion of the curable material layer. Consequently, when the curable material layer is cured using light, the blocked portion is not exposed to the light and remains uncured, requiring subsequent removal. This eliminates visual defects on the surface of the resulting printed template, improving the aesthetics of the printed template and ensuring the quality of the printed template and its downstream products.

[0075] Figure 2 It is a cross-sectional schematic diagram of a base layer, a curable material layer, and a motherboard assembly in a method for manufacturing a printing template according to an embodiment of the present disclosure. Figure 3 It is a schematic plan view of a motherboard assembly in the method for manufacturing a printing template according to an embodiment of the present disclosure.

[0076] refer to Figure 1 、 Figure 2 、 Figure 3In step S10, for example, a base layer 10, a curable material layer 20, and a motherboard assembly 30 are provided. The base layer 10, the curable material layer 20, and the motherboard assembly 30 are stacked, and the curable material layer 20 is located between the base layer 10 and the motherboard assembly 30. The motherboard assembly 30 includes a first motherboard M1 and a second motherboard M2. In order to connect the first motherboard M1 and the second motherboard M2 together to achieve a larger printing area, the motherboard assembly 30 also includes a connector 34 located between the first motherboard M1 and the second motherboard M2. The connector 34 is used to splice the first motherboard M1 and the second motherboard M2 together.

[0077] For example, the base layer 10 is used to support the curable material layer 20. The base layer 10 may be made of a light-transmitting material or a light-impermeable material. Figure 2 As shown, when the base layer 10 is made of a light-transmitting material, light can be irradiated onto the curable material layer 20 from the side of the base layer 10 away from the curable material layer 20 (the upper side of the base layer 10 shown in the figure) to cure it. In at least one example, the base layer 10 is formed of a light-transmitting material such as resin, quartz, etc., preferably resin. By using resin, a printing template of a desired size (or a large area) can be obtained using the manufacturing method of the embodiment of the present disclosure. For example, the resin includes at least one of polyethylene terephthalate, polycarbonate, polyester, polyolefin, polyimide, polysulfone, polyethersulfone, cyclic polyolefin and polyethylene naphthalate. In at least one example, when the base layer 10 is made of resin, the thickness of the resin is preferably in the range of 25 microns to 500 microns. Furthermore, the base layer 10 can have a flexible material or a rigid material. When a flexible material is used, it is more suitable for the bending of the printing template and is therefore preferred.

[0078] For example, the curable material layer 20 includes a photocurable material. In at least one example, the curable material layer 20 is composed of a photocurable resin composition. For example, the composition contains a photopolymerizable monomer, a photoinitiator and an inhibitor, and has the property of being cured by irradiation with curing light (a general term for energy lines that can cure resins, such as UV light, visible light, and electron beams). As photopolymerizable monomers, for example, there are photopolymerizable monomers for forming (meth)acrylic resins, styrene resins, olefin resins, polycarbonate resins, polyester resins, epoxy resins, silicone resins, etc., preferably photopolymerizable (meth)acrylic monomers. The photoinitiator is a component added to promote the polymerization of the monomer, and the inhibitor is a component added to inhibit the polymerization of the monomer, and is added to inhibit curing erosion within the mask. The disclosed embodiments do not specifically limit the types of photoinitiators and inhibitors.

[0079] For example, each of the first motherboard M1 and the second motherboard M2 can be formed of an opaque material or a translucent material. In at least one example, the opaque material includes a metal material such as nickel. Further, for example, the first motherboard M1 (and / or the second motherboard M2) can be formed by forming a transparent resin layer on a transparent substrate and then forming a printed pattern on the transparent resin layer. For another example, the first motherboard M1 and the second motherboard M2 can be made by photolithography of a silicon wafer, and the size of which is less than 12 inches (diagonal dimension). For another example, the first motherboard M1 and the second motherboard M2 are copied from a silicon wafer and formed of glass and light-curing glue, and the size is the same as the size of the silicon wafer.

[0080] For example, when the first motherboard M1 is formed of a light-transmitting material, light can be directed from the underside of the motherboard assembly 30 through the motherboard assembly 30 to illuminate the curable material layer 20. In this case, a mask plate also needs to be positioned under the motherboard assembly 30. In the disclosed embodiment, the first motherboard M1 and the second motherboard M2 can be made of the same material and dimensions, or different. Using the same material and dimensions is preferred, as it reduces manufacturing costs and improves the aesthetics of the printed template.

[0081] For example, Figure 2 and Figure 3 As shown, the first motherboard M1 and the second motherboard M2 both include a printed pattern 31, and the printed pattern 31 of the motherboard assembly 30 is transferred to the curable material layer 20. The printed pattern may include a micro-pattern. The micro-pattern generally has a concave-convex structure and is a pattern repeated according to a certain period. When the printed pattern is used in the imprinting technology, the size of the protrusions and / or grooves in the micro-pattern is generally from nanometer level to micron level. In at least one example, the period of the micro-pattern is 10nm to 2mm, and the depth is 10nm to 500μm. Furthermore, in at least one example, the surface of the micro-pattern can be subjected to a peeling treatment to prevent adhesion to the curable material layer 20. The peeling treatment can be to form a peeling layer (not shown).

[0082] In step S10, the transfer of the printed pattern 31 of the motherboard assembly 30 to the curable material layer 20 can be achieved in two ways. Figure 2 、 Figure 4 and Figure 5 These two implementation methods are described separately.

[0083] Figure 4 It is a structural schematic diagram of the steps for forming a base layer, a curable material layer and a motherboard assembly in the method for manufacturing a printing template according to an embodiment of the present disclosure. Figure 5 It is a structural schematic diagram of the steps for forming a base layer, a curable material layer and a motherboard assembly in a method for manufacturing a printing template according to another embodiment of the present disclosure.

[0084] For example, Figure 4 As shown, providing a base layer, a curable material layer and a master board assembly, and transferring the printed pattern of the master board assembly to the curable material layer includes:

[0085] S101: providing a base layer 10 and the curable material layer 20 stacked with the base layer 10; and

[0086] S102: Press the motherboard assembly 30 onto the curable material layer 20 so that the printed pattern 31 is pressed into the curable material layer 20, thereby obtaining Figure 2 The substrate layer 10 , the curable material layer 10 and the motherboard assembly 30 are shown.

[0087] For example, in step S101 , the photocurable resin composition may be coated on the transparent substrate by using methods such as spin coating, spray coating, dip coating, die coating, and slit coating.

[0088] For example, in step S102, when the surface of the motherboard assembly 30 having the printed pattern 31 is pressed against the curable material layer 20, the motherboard assembly 30 and the curable material layer 20 are completely adhered to each other. Furthermore, for example, the thickness of the curable material layer 20 is greater than the greater of the height of the printed pattern 31 in the motherboard assembly 30 and the height of the protrusion 36 of the connector 34, so that the curable material layer 20 fully fills the concave-convex structure (including the printed pattern 31) of each motherboard. This further ensures that the printed pattern 31 of each motherboard is completely and accurately transferred to the curable material layer 20.

[0089] For example, Figure 5 As shown, providing a base layer, a curable material layer and a master board assembly, and transferring the printed pattern of the master board assembly to the curable material layer includes:

[0090] S111: providing the motherboard assembly 930;

[0091] S112: forming the curable material layer 920 covering the printed pattern 931 on the motherboard assembly 930;

[0092] S113 : forming the base layer 910 on the curable material layer 920 .

[0093] For example, in step S111 , the motherboard assembly 930 includes a first motherboard M91 and a second motherboard M92 , and the first motherboard M91 and the second motherboard M92 are spliced ​​together via a connector 934 .

[0094] For example, in step S112, the photocurable resin composition can be coated on the mother plate assembly 920 using a method such as spin coating, spray coating, dip coating, die coating, and slit coating to form the layer of curable material 920. Further, for example, the second mother plate M92 includes a plurality of protrusions 932 and a printed pattern 931 located at the end of the protrusions 932. The first mother plate M91 has the same structure as the second mother plate M92, which will not be described here. As shown in Figure 5 the total height of the printed pattern 931 and the protrusions 932 in the mother plate assembly 930 is defined as a first height, and the height of the protruding portion 936 of the connecting piece 934 is defined as a second height, then the thickness of the layer of curable material 920 is greater than the larger of the first height and the second height, so that the layer of curable material 920 can fill the concave-convex structure of each mother plate (including the printed pattern 931 and the protrusions 932).

[0095] For example, the connecting piece 34 includes an adhesive material for bonding the first mother plate M1 and the second mother plate M2 to each other. In at least one example, the adhesive material includes a photocurable material. For example, the photocurable material includes at least one of an acrylic resin, an epoxy resin, and a silicone resin.

[0096] For example, as shown in Figure 3 the plane in which the base layer 10 is located is the xy plane, and the first mother plate M1 and the second mother plate M2 are arranged along a second direction (the x direction shown in the figure, and the first direction is the y direction and the second direction is the x direction in the embodiments of the present disclosure) parallel to the xy plane in which the base layer 10 is located. It can be understood that the first mother plate M1 and the second mother plate M2 can also be arranged along the y direction or other directions, as long as the first mother plate M1 and the second mother plate M2 are arranged along a direction parallel to the base layer 10.

[0097] For example, as shown in Figure 3 the connecting piece 34 extends between the first mother plate M1 and the second mother plate M2 along the y direction. In the embodiments of the present disclosure, the extension direction of the connecting piece 34 parallel to the base layer depends on the extension direction of the joint between the first mother plate M1 and the second mother plate M2, and therefore, the extension direction of the connecting piece 34 is not limited to the y direction as shown in Figure 3 .

[0098] In at least one example, the extension direction of the connecting piece can also be another direction parallel to the base layer. Figure 6 A plan view of a mother plate assembly in a manufacturing method of a printing template according to another embodiment of the present disclosure. For example, as shown in Figure 6As shown, the motherboard assembly includes a first motherboard M61, a second motherboard M62, and a connector 634 for splicing the first motherboard M61 and the second motherboard M62 together. The splicing seam between the first motherboard M61 and the second motherboard M62 extends along an inclined direction, and the angle between the inclined direction and the x-direction is θ. At this time, the connector 634 also extends along the inclined direction. It can be understood that the embodiment of the present disclosure is only described by splicing two motherboards together as an example. In other embodiments, three or more motherboards can be spliced ​​together to form two or more connectors. In this case, a plurality of non-light-transmitting areas corresponding to the plurality of connectors need to be provided in the mask. The embodiment of the present disclosure does not specifically limit the number of motherboards and the number of connectors.

[0099] In at least some embodiments, each of the motherboards includes an edge area near the connector, each of the motherboards includes an edge surface facing the curable material layer in the edge area, the connector includes a connecting surface facing the curable material layer, and the edge surface is not coplanar with the connecting surface.

[0100] Figure 7 This is a partially enlarged cross-sectional schematic diagram of a connector in the method for manufacturing a printed template according to an embodiment of the present disclosure. For example, Figure 7 for Figure 2 FIG. 3 is a partial enlarged cross-sectional view of the connecting member 34. Figure 7As shown, the first motherboard M1 includes a first edge region 321, and the second motherboard M2 includes a second edge region 322. A connector 34 is located between the first edge region 321 and the second edge region 322, and is used to connect the first edge region 321 and the second edge region 322. The first motherboard M1 includes a first edge surface 301 (the upper surface of the first motherboard M1 shown in the figure) facing the curable material layer 20, located in the first edge region 321. The second motherboard M2 includes a second edge surface 302 (the upper surface of the second motherboard M2 shown in the figure) facing the curable material layer 20, located in the second edge region 322. The connector 34 includes a connecting surface 303 (the upper surface of the connecting surface 34 shown in the figure) facing the curable material layer 20. The connecting surface 303 is not coplanar with the first edge surface 301, nor is the connecting surface 303 coplanar with the second edge surface 302. In the embodiment of the present disclosure, the first edge surface 301 of the first motherboard M1 and the second edge surface 302 of the second motherboard M2 may be coplanar or non-coplanar. When the first edge surface 301 and the second edge surface 302 are coplanar, the depth uniformity of the transferred pattern in the printing template can be improved, and therefore this is preferred. In the present embodiment, the coplanarity of the first edge surface 301 and the second edge surface 302 is used as an example for illustration. The lower surface of the connector 34, the lower surface of the first motherboard M1 located in the first edge region 321, and the lower surface of the second motherboard M2 located in the second edge region 322 may or may not be coplanar, and this is not specifically limited in the present embodiment.

[0101] In at least some embodiments, the connection surface comprises a non-planar surface, wherein the non-planar surface comprises protrusions and / or grooves. A non-planar surface refers to a surface that is uneven. For example, Figure 7 As shown, the connection surface 303 comprises a non-planar surface including protrusions. Figure 8 FIG. 1 is a partially enlarged cross-sectional schematic diagram of a connector in a method for manufacturing a printing template according to another embodiment of the present disclosure. Figure 8 As shown, the motherboard assembly includes a first motherboard 81 and a second motherboard 82, and also includes a connector 834 connecting the first motherboard 81 and the second motherboard 82. The connecting surface 803 of the connector 834 facing the curable material includes a non-flat surface including a groove.

[0102] For example, Figure 2As shown, the connector 34 includes a protrusion 36. The thickness T of the curable material layer 20 is greater than or equal to the height H of the protrusion 36 relative to the first edge surface 301 of the first motherboard M1 (or the second edge surface 302 of the second motherboard M2). Preferably, the thickness T of the curable material layer 20 is greater than the height H of the protrusion 36 relative to the first edge surface 301 of the first motherboard M1 (or the second edge surface 302 of the second motherboard M2). When the printed pattern 31 of the motherboard assembly 30 is transferred to the curable material layer 20, the protrusion 36 enters the curable material layer 20 but does not contact the base layer 10. This ensures that the portion of the curable material layer 20 located above and in contact with the protrusion 36 is not cured and can be easily removed, thereby preventing the shape of the protrusion 36 from remaining in the curable material layer 20.

[0103] In at least some embodiments, the thickness T of the curable material layer 20 is 1.25 to 50 times the height H of the protrusion 36. For example, the thickness T of the curable material layer 20 is 10 μm to 50 μm. If the thickness T is too large, curing will be difficult; if it is too small, the protrusion may not be covered. For example, the height H of the protrusion 36 is 1 μm to 40 μm.

[0104] Figure 9 Schematic cross-sectional view of a mask in a method for manufacturing a printing template according to an embodiment of the present disclosure. Figure 10 It is a planar schematic diagram of a mask in the method for manufacturing a printing template according to an embodiment of the present disclosure. Figure 11 This is a schematic plan view of a mask and a motherboard assembly in a method for manufacturing a printing template according to an embodiment of the present disclosure.

[0105] refer to Figure 1 、 Figure 9 and Figure 10 In step S20, for example, a mask plate 40 is provided, and the mask plate 40 is located on a side of the base layer 10 away from the curable material layer 20 (for example, the upper side of the base layer 10 shown in the figure). The mask plate 40 includes a light-transmitting area 420 and a non-light-transmitting area 410. Figure 9 and Figure 11As shown, the orthographic projection of the connector 34 on the base layer 10 is located within the orthographic projection of the non-light-transmitting area 410 on the base layer 10, and the orthographic projection of the printed pattern 31 on the base layer 10 is located within the orthographic projection of the light-transmitting area 420 on the base layer 10. In at least one example, when the first motherboard M1 and the second motherboard M2 in the motherboard assembly 30 are both made of light-transmitting materials, the light used to cure the curable material layer 20 can be irradiated onto the curable material layer 20 from a side of the motherboard assembly 30 away from the curable material layer 20 (the lower side of the motherboard assembly 30 shown in the figure) to cause the curable material layer 20 to cure. In this case, the mask 40 is also disposed on the lower side of the motherboard assembly 30.

[0106] In at least some embodiments, each master printed pattern includes multiple sets of sub-printed patterns 310. For example, Figure 3 As shown, the first motherboard M1 includes multiple groups of first sub-printed patterns 311 (for example, two groups as shown in the figure), and the multiple groups of the first sub-printed patterns 311 are arranged at intervals. The second motherboard M2 includes multiple groups of second sub-printed patterns 312 (for example, two groups as shown in the figure), and the multiple groups of the second sub-printed patterns 312 are arranged at intervals. It can be understood that Figure 3 The two groups of sub-printed patterns shown are for illustrative purposes only. Each motherboard may include more than two groups of sub-printed patterns. The embodiment of the present disclosure does not specifically limit the number of sub-printed pattern groups.

[0107] Furthermore, in at least one example, multiple groups of sub-printed patterns are arranged periodically, which is conducive to forming a periodic transfer pattern. Multiple groups of the first sub-printed patterns 311 are arranged periodically, and multiple groups of the second sub-printed patterns 312 are arranged periodically. Further, for example, Figure 3 As shown, multiple groups of the first sub-printed patterns 311 are arranged at equal intervals along the x-direction at a first spacing S1, and multiple groups of the second sub-printed patterns 312 are arranged at equal intervals along the x-direction at a second spacing S2. In the disclosed embodiment, the first spacing S1 and the second spacing S2 can be equal or unequal. When the first spacing S1 and the second spacing S2 are equal, the manufacturing difficulty of the mask 40 is simplified and the aesthetics of the printed template are improved, which is therefore preferred. Figure 3 , the first interval S1 and the second interval S2 are equal to each other.

[0108] Furthermore, when the first spacing S1 and the second spacing S2 are equal to each other, optionally, the spacing between the first sub-printed pattern group closest to the connector in the first motherboard and the second sub-printed pattern group closest to the connector in the second motherboard is equal to the first spacing. Figure 3As shown, a third spacing S3 is defined between the first sub-printed pattern group 311 closest to the connector 34 in the first motherboard M1 and the second sub-printed pattern group 312 closest to the connector 34 in the second motherboard M2. This spacing S3 is equal to the first spacing S1, i.e., S1 = S2 = S3. Thus, because all sub-printed pattern groups on the motherboard assembly are arranged periodically, a periodically arranged light-transmitting area can be formed when manufacturing the light-transmitting area of ​​the mask. This not only simplifies the mask manufacturing process but also improves the aesthetics of the final printed mask.

[0109] In at least one example, each group of sub-printed patterns includes at least one sub-group, and each sub-group includes multiple sub-printed patterns. The following is explained using the first sub-printed pattern group on the first motherboard as an example. The setting method of the printed pattern on the second motherboard can be the same as the printed pattern on the first motherboard, so it will not be repeated.

[0110] For example, Figure 3 As shown, the first sub-printing pattern group 311 includes four sub-groups 351, and the four sub-groups are arranged in a row along the y direction. Further, for example, the four sub-groups 351 are arranged at equal intervals along the y direction. For example, each sub-group 351 includes nine sub-printing patterns 331, and the nine sub-printing patterns 331 are arranged in a 3×3 array. It can be understood that Figure 3 The four subgroups and nine sub-printed patterns shown are for illustration only. Each sub-printed pattern group may include other numbers (e.g., less than or more than four) of subgroups, and each subgroup may also include other numbers (e.g., less than or more than nine) of sub-printed patterns. The embodiments of the present disclosure do not impose any specific restrictions on the number of subgroups and sub-printed patterns. Figure 3 The arrangement of the four subgroups in a row along the y direction is also illustrative, and the four subgroups can also be arranged in other ways. For example, the four subgroups can be arranged in a 2×2 array, or the four subgroups 351 can be arranged with non-equidistant spacing, etc. The embodiment of the present disclosure does not specifically limit the specific arrangement of the multiple subgroups. Similarly, Figure 3 The arrangement of the nine sub-printed patterns in a 3×3 array is also illustrative. The nine sub-printed patterns may also be arranged in other ways. The embodiment of the present disclosure does not specifically limit the specific arrangement of the multiple sub-printed patterns.

[0111] In at least some embodiments, the mask includes a plurality of light-transmitting regions, and the plurality of light-transmitting regions are arranged at intervals. Furthermore, in at least one example, the plurality of light-transmitting regions are arranged periodically. For example, Figure 10As shown, the mask plate 40 includes a plurality of light-transmitting regions 420 (eg, four in the figure), which are arranged at equal intervals along the x-direction. This not only simplifies the manufacturing process of the mask plate 40 but also improves the aesthetics of the final printed template.

[0112] It is understandable that Figure 10 The four light-transmitting areas 420 and their arrangement shown in the figure are only for illustration, and the mask plate 40 may include other numbers of light-transmitting areas and may also have other arrangements. It should be noted that each printed pattern on the motherboard corresponds to at least one light-transmitting area, so that the printed pattern can be transferred to the curable material layer. Generally, the arrangement of the light-transmitting areas is determined by the arrangement of the printed pattern on the motherboard. In at least some embodiments, the number of light-transmitting areas of the mask plate is at least equal to the number of motherboards in the motherboard assembly, and the printed pattern on each motherboard can correspond to one light-transmitting area. For example, in the following Figure 12 In the illustrated embodiment, the mask 840 has two light-transmitting areas 821 and 822 corresponding to the printed pattern on the first motherboard M1 and the printed pattern on the second motherboard M2, respectively.

[0113] In at least some embodiments, in order to allow the curing light to pass through the light-transmitting area and irradiate the printed pattern, each of the light-transmitting areas corresponds to at least one of the multiple groups of sub-printed patterns, and the orthographic projection of the at least one group of sub-printed patterns on the base layer is located within the orthographic projection of the light-transmitting area corresponding to the at least one group of sub-printed patterns on the base layer.

[0114] For example, Figure 11 As shown, each of the light-transmitting regions 420 corresponds to one of the plurality of sub-printing patterns 310. That is, the plurality of light-transmitting regions 420 correspond to the plurality of sub-printing patterns 310 in a one-to-one manner. Figure 11 As shown, the plurality of light-transmitting regions 420 include two first light-transmitting regions 421 and two second light-transmitting regions 422. The plurality of groups of sub-printed patterns 310 include two groups of first sub-printed patterns 311 and two groups of second sub-printed patterns 312. Each first light-transmitting region 421 corresponds to a group of first sub-printed patterns 311 on the first motherboard M1. The orthographic projection of the group of first sub-printed patterns 311 on the substrate 10 is located within the orthographic projection of the corresponding first light-transmitting region 421 on the substrate 10. Each second light-transmitting region 422 corresponds to a group of second sub-printed patterns 312 on the second motherboard M2. The orthographic projection of the group of second sub-printed patterns 312 on the substrate 10 is located within the orthographic projection of the corresponding second light-transmitting region 422 on the substrate 10.

[0115] Figure 12This is a schematic plan view of a mask and motherboard assembly in a method for manufacturing a printing template according to another embodiment of the present disclosure. For example, Figure 12 In the manufacturing method of the printed template shown in FIG, the base layer, the curable material layer and the template assembly can refer to Figure 2 and Figure 3 The arrangement of the base layer 10, the curable material layer 20 and the motherboard assembly 30. Figure 12 In the manufacturing method of the printed template shown, a base layer 10, a curable material layer 20 and a motherboard assembly 30 are provided and the printed pattern 31 of the motherboard assembly 30 is transferred to the curable material layer 20, wherein the base layer 10, the curable material layer 20 and the motherboard assembly 30 are stacked and the curable material layer 20 is located between the base layer 10 and the motherboard assembly 30, and the motherboard assembly 30 includes a first motherboard M1, a second motherboard M2 and a connecting member 34 located between the first motherboard M1 and the second motherboard M2, and the connecting member 34 connects the first motherboard M1 and the second motherboard M2 to each other, and each of the motherboards includes the printed pattern 31. For example, as Figure 12 As shown, the first mother substrate M1 includes multiple groups of first sub-printed patterns 311 , and the second mother substrate M2 includes multiple groups of second sub-printed patterns 312 .

[0116] For example, Figure 12 The mask plate 840 is located on the side of the base layer 10 away from the curable material layer 20, for example, Figure 9 The mask 30 is set as shown. Figure 12 The corresponding relationship between the multiple light-transmitting areas of the mask 840 and the multiple groups of sub-printed patterns is as shown in FIG. Figure 11 The mask 30 shown is different. Figure 11 In the embodiment, there is a one-to-one correspondence between the plurality of light-transmitting regions 420 and the plurality of groups of sub-printed patterns 310 . Figure 12 In the embodiment, one light-transmitting area corresponds to at least two groups of the multiple groups of sub-printed patterns.

[0117] For example, Figure 12As shown, the mask 840 includes two light-transmitting regions 821 and 822 and multiple non-light-transmitting regions 810 (e.g., three as shown in the figure). The light-transmitting regions 821 correspond to two of the multiple groups of first sub-printed patterns 311. The orthographic projections of the two groups of first sub-printed patterns 311 on the substrate 10, as well as the orthographic projections of the regions 315 between the two groups of first sub-printed patterns 311 on the substrate 10, are all located within the orthographic projections of the same light-transmitting region 821 on the substrate 10. The light-transmitting regions 822 correspond to two of the multiple groups of second sub-printed patterns 312. The orthographic projections of the two groups of second sub-printed patterns 312 on the substrate 10, as well as the orthographic projections of the regions 316 between the two groups of second sub-printed patterns 311 on the substrate 10, are all located within the orthographic projections of the same light-transmitting region 822 on the substrate 10.

[0118] In the embodiment of the present disclosure, Figure 12 Mask 840 and Figure 11 The mask plates 40 are all provided with non-light-transmitting areas in the non-joint seam areas, so that a periodic structure can be formed in the pattern layer of the final printed template, which is less likely to cause visual defects.

[0119] refer to Figure 1 and Figure 9 In step S30, for example, ultraviolet (UV) light is used to irradiate the curable material layer 20 through the mask plate 40 so that the portion of the curable material layer 20 corresponding to the light-transmitting area 420 is cured, and the portion of the curable material layer 20 corresponding to the non-light-transmitting area 410 is not cured.

[0120] Figure 13 The following is a schematic diagram showing the structure of the curable material layer before and after removal in the method for manufacturing the printing template according to the embodiment of the present disclosure. For example, Figure 13 The method for manufacturing the printing template of the embodiment of the present disclosure is shown. Figure 9 Schematic diagram of the structure of the curable material layer 20 before and after removal.

[0121] For example, Figure 9 and Figure 13 As shown in (A) of FIG. 1 , the curable material layer 20 includes a plurality of to-be-irradiated portions 220, each corresponding to a plurality of the light-transmitting regions 420. The UV light is irradiated through the light-transmitting regions 420 of the mask plate 40 to cure the plurality of to-be-irradiated portions 220, thereby transferring the printed pattern from the motherboard to the curable material layer 20.

[0122] refer to Figure 1 、 Figure 9 、 Figure 13 In step S40, for example, the curable material layer 20 is separated from the motherboard assembly 30, and the uncured portion of the curable material layer 20 is removed to form the pattern layer 50 of the printing template 100 on the base layer 10. In this way, the cured portion has a transfer pattern consistent with the pattern printed on the motherboard, while the uncured portion is removed. Since the removed portion corresponds to the location of the connector, the effect of the connector 34 on the appearance of the cured curable material layer 20 is eliminated. Furthermore, in at least one example, the uncured portion of the curable material layer 20 is removed using an organic solvent or deionized water. For example, the organic solvent includes alcohol or other liquids suitable for removal.

[0123] In at least one example, in order to facilitate separation of the curable material layer 20 from the motherboard assembly 30, a peeling layer may be formed between the curable material layer 20 and the motherboard assembly 30, and the peeling layer may include a release agent. Further, for example, in order to facilitate operation, the curable material layer 20 is separated from the motherboard assembly 30 together with the base layer 10 to obtain Figure 13 The structure shown in (A).

[0124] For example, Figure 13 As shown in (B), the cured portions to be irradiated 220 remain on the base layer 10 to form a plurality of curing units 510 in the pattern layer 50. In at least one example, the at least one group of sub-printed patterns 310 is transferred to one of the plurality of curing units. Figure 13 As shown in Figures (A) and (B), one of the multiple sets of sub-printed patterns 310 is transferred to one of the multiple curing units 510, forming a transfer pattern 530. In this embodiment, the multiple sets of sub-printed patterns 310 correspond one-to-one to the multiple curing units 510, so each curing unit 510 has a transfer pattern 530. It should be noted that the transfer pattern 530 and the printed pattern on the master are complementary. For example, if the printed pattern includes protrusions, the transfer pattern 530 has grooves at the positions corresponding to the protrusions.

[0125] For example, Figure 9 and Figure 10 As shown, the mask 40 includes a plurality of non-light-transmitting areas 410 (e.g., five as shown in the figure), the plurality of non-light-transmitting areas 410 are arranged at intervals, and the plurality of non-light-transmitting areas 410 are arranged alternately with the plurality of light-transmitting areas 420, and the orthographic projection of the connecting member 34 on the base layer 10 is located within the orthographic projection of one of the plurality of non-light-transmitting areas 410 on the base layer 10. Furthermore, in at least one example, the plurality of non-light-transmitting areas 410 are arranged periodically. For example, Figure 10As shown, the plurality of non-light-transmitting regions 410 are arranged at equal intervals along the x-direction. This not only simplifies the manufacturing process of the mask 40 but also improves the aesthetics of the final printed template.

[0126] It is understandable that Figure 10 The five non-light-transmitting regions 410 and their arrangement shown in FIG are merely illustrative, and the mask 40 may include other numbers of non-light-transmitting regions and may also have other arrangements. Figure 12 As shown, the mask 840 includes three non-light-transmitting regions 810 , and the three non-light-transmitting regions 810 are alternately arranged with two light-transmitting regions 821 and 822 .

[0127] Further, for example, Figure 9 、 Figure 10 and Figure 11 As shown, the plurality of non-light-transmitting regions 410 include a first non-light-transmitting region 413 and a plurality of second non-light-transmitting regions 411 (e.g., four as shown in the figure). For example, the orthographic projection of the connector 34 on the base layer 10 is located within the orthographic projection of the first non-light-transmitting region 413 on the base layer 10, and the plurality of second non-light-transmitting regions 411 are respectively distributed on both sides of the first non-light-transmitting region 413.

[0128] For example, Figure 9 and Figure 13 As shown, the curable material layer includes a plurality of non-irradiated portions 210, and the plurality of non-irradiated portions 210 correspond one to one with the plurality of non-light-transmitting regions 410. Thus, when the mask 40 is irradiated with UV light, the plurality of non-irradiated portions 210 are not irradiated by the UV light, and thus the plurality of non-irradiated portions 210 are not cured. Figure 13 As shown in (A).

[0129] Next, for example, Figure 13 As shown in (B), the uncured non-irradiated portions 210 are removed to form a plurality of grooves 520 in the pattern layer 50, and finally a Figure 13 The printing template 100 shown in (B) is shown in FIG. In this embodiment, the plurality of non-light-transmitting regions 410 correspond one-to-one with the plurality of non-illuminated portions 210, and the plurality of non-illuminated portions 210 correspond one-to-one with the plurality of grooves 520. For example, the non-illuminated portions 210 corresponding to the first non-light-transmitting region 413 are removed to form grooves 521 in the pattern layer 50, and the non-illuminated portions 210 corresponding to the second non-light-transmitting region 411 are removed to form grooves 522 in the pattern layer 50. A groove 520 is provided between each two adjacent curing units 510. Thus, in the final printing template 100, the appearance defects caused by the connector 34 are eliminated, improving the aesthetics and quality of the printing template 100.

[0130] In the disclosed embodiment, ideally, the curable material in the groove 520 should be completely removed, that is, no residual curable material should remain in the groove 520. However, in actual products, due to the scattering of light from the light-transmitting area, a small amount of curable material remains at the bottom and sidewalls of the groove 520, forming a thin layer at the bottom of the groove 520 with a thickness of 1 μm to 4 μm, and causing the sidewalls of the groove 520 to be formed with a gradually decreasing distance from the base layer 10. For example, the groove 520 has an arc shape (i.e., a downwardly concave shape) as shown in the figure.

[0131] For example, Figure 10 As shown, each of the non-light-transmitting regions extends along the y-direction, and each of the light-transmitting regions extends along the y-direction. In this embodiment, when the connector 34 extends along the y-direction, to ensure that the entire connector 34 is shielded, the non-light-transmitting regions also extend along the y-direction. Furthermore, to facilitate transfer of the printed pattern on each motherboard, each of the light-transmitting regions also extends along the y-direction.

[0132] For example, Figure 9 As shown, each motherboard further includes multiple spacers, one of which is provided between each two adjacent groups of sub-printed patterns, and the orthographic projection of each second non-light-transmitting region on the substrate layer is located within the orthographic projection of one of the multiple spacers on the substrate layer. For example, taking the first motherboard M1 as an example, the first motherboard M1 includes multiple spacers 320, one of which is provided between each two adjacent groups of first sub-printed patterns 311, and the orthographic projection of each second non-light-transmitting region 411 on the substrate layer 10 is located within the orthographic projection of the spacer 320 on the substrate layer 10.

[0133] In the embodiment of the present disclosure, in a plane perpendicular to the y direction (eg Figure 9 In the zx plane shown in FIG, the cross-sectional widths of the plurality of spacers 320 may be the same or different. In at least one example, when the cross-sectional widths of the plurality of spacers 320 are the same, it is advantageous to improve the aesthetics of the printed template, and is therefore preferred. In addition, the spacers 320 may also be provided at the edge of the motherboard, for example, Figure 9 As shown, the spacers 320 can also be disposed in the left and right edge regions of the first motherboard M1. Optionally, the spacers 320 can also be disposed in the left and right edge regions of the second motherboard M2. Therefore, the specific location of the spacers 320 can be determined based on actual needs and is not limited in this embodiment of the present disclosure.

[0134] For example, Figure 10 As shown, in a plane perpendicular to the y direction (eg Figure 9In the zx plane shown in FIG, the cross-sectional width of each of the non-light-transmitting areas 410 is greater than the cross-sectional width of the connector 34 and smaller than the cross-sectional width of the spacer 320. In this way, it is possible to ensure that the connector 34 is completely covered by the non-light-transmitting area 410, while preventing the printed pattern from being blocked by the non-light-transmitting area 410, thereby affecting the transfer of the transfer pattern from the motherboard to the printing template. For example, the cross-sectional width of the connector is 2μm to 40μm, the cross-sectional width of the non-light-transmitting area 410 is 5μm to 60μm, and the cross-sectional width of the spacer 320 is 10μm to 70μm. Furthermore, in at least one example, the spacer includes a portion of the motherboard substrate, such as Figure 9 As shown, the spacer 320 is formed by the substrate of each motherboard (eg, the first motherboard M1 or the second motherboard M2). In another example, the spacer includes air. Figure 5 As shown, each motherboard (eg, the first motherboard M91 or the second motherboard M92 ) includes an air space between two adjacent protrusions 932 .

[0135] In the above-described method for manufacturing a printed template provided by the disclosed embodiment, the non-transparent region 410 of the mask plate 40 is used to block a portion of the curable material layer 20. Furthermore, the connector 34 between the first motherboard M1 and the second motherboard M2 is positioned within this blocked portion of the curable material layer. Thus, when the curable material layer 20 is cured using UV light, the blocked portion is not exposed to UV light and thus remains uncured. The blocked portion is then removed in subsequent processes. Consequently, the resulting printed template 100 is free of visual defects caused by the connector, improving not only the aesthetics and quality of the printed template 100 but also the quality and aesthetics of downstream products derived from the printed template 100.

[0136] An embodiment of the present disclosure also provides a printing template manufactured according to the method described in any of the previous embodiments, the printing template comprising: the base layer; the pattern layer, stacked with the base layer, the pattern layer comprising: a plurality of curing units, the printed pattern being transferred to the plurality of curing units; a plurality of grooves, one of the plurality of grooves being arranged between two adjacent curing units in the plurality of curing units, and the depths of the plurality of grooves being the same.

[0137] For example, Figure 13 As shown in (B), the present disclosure provides a method according to Figure 1The printing template 100 manufactured by the manufacturing method shown in FIG. The printing template 100 includes: the base layer 10; the pattern layer 50, stacked with the base layer 10; and the pattern layer 50 includes: a plurality of curing units 510, onto which the printed pattern is transferred. The pattern layer 50 also includes: a plurality of grooves 520, one of which is provided between adjacent two curing units 510, and the depths of the plurality of grooves 520 are the same.

[0138] In the printing template 100 provided in the embodiment of the present disclosure, there is no longer any visual defect caused by the presence of the connector, thereby improving the aesthetics and quality of the printing template 100 .

[0139] Figure 14 This is a partially enlarged cross-sectional schematic diagram of the printing template of the embodiment of the present disclosure. For example, Figure 14 for Figure 13 (B) is a partial enlarged cross-sectional view of the printing template 100. Figure 14 As shown, the printed pattern (i.e., the transfer pattern 530) transferred to the multiple curing units 510 is embedded in the multiple curing units 510 and has a first depth D1, and each of the grooves 520 has a second depth D2, which is greater than the first depth D1.

[0140] In at least one example, the difference between the second depth D2 and the first depth is 5 to 20 times the first depth. For example, the first depth is less than or equal to 1 micron, and the second depth is 5 to 20 microns.

[0141] The printing template in the embodiment of the present disclosure can be used to replicate or transfer the pattern on it to other carriers. For example, the printing template can be used as an imprint template in a transfer process, and the pattern on the imprint template can be transferred to a film layer with glass as the carrier.

[0142] Figure 15 Schematic diagram of a printing template according to an embodiment of the present disclosure used in a transfer process. Figure 16 Schematic diagram of the structure of the downstream products manufactured using the printing template of the embodiment of the present disclosure. Figure 15 As shown, a curable adhesive 200 is coated on one side of the pattern layer 50 of the printing template 100, and a glass substrate 300 supporting the curable adhesive 200 is formed on the curable adhesive 200. Figure 15 As shown, the thickness of the curable adhesive 200 is greater than that of the pattern layer 50, so that the curable adhesive 200 completely covers the pattern layer 50. Then, the curable adhesive 200 is cured by light L to form a pattern layer 400 on the glass substrate 300. Finally, the glass substrate 300 and the cured adhesive are separated from the printing template 100 to obtain Figure 16 The downstream products shown. Figure 16 It can be seen that the pattern layer 50 of the printing template 100 eliminates the defects in appearance. Figure 16 The pattern layer 400 of the downstream product shown also has no defects in appearance.

[0143] It can be seen that since the printing template provided by the embodiment of the present disclosure does not have any appearance defects, the downstream products made using the printing template also do not have appearance defects, thereby improving the aesthetics and quality of the downstream products.

[0144] In summary, the manufacturing method of the printing template provided by the embodiment of the present disclosure and the printing template manufactured by the manufacturing method can eliminate the visual defects caused by the protrusions between the molds, which not only improves the aesthetics of the printing template, but also ensures the quality of the printing template and its downstream products.

[0145] In this article, the following points need to be explained:

[0146] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0147] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale.

[0148] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0149] The foregoing description is merely an exemplary embodiment of the present disclosure and is not intended to limit the scope of protection of the present disclosure. The scope of protection of the present disclosure is determined by the appended claims.

Claims

1. A method for manufacturing a printing template, comprising: Providing a base layer, a curable material layer, and a motherboard assembly, and transferring a printed pattern of the motherboard assembly onto the curable material layer, wherein the base layer, the curable material layer, and the motherboard assembly are stacked with the curable material layer located between the base layer and the motherboard assembly, the motherboard assembly comprising two motherboards and a connector located between the two motherboards, the connector connecting the two motherboards to each other, and each motherboard comprising the printed pattern; Providing a mask, the mask being located on a side of the base layer away from the curable material layer, and comprising a light-transmitting area and a light-impermeable area, the orthographic projection of the connector on the base layer being located within the orthographic projection of the light-impermeable area on the base layer, and the orthographic projection of the printed pattern on the base layer being located within the orthographic projection of the light-transmitting area on the base layer; irradiating the curable material layer with light through the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured; The curable material layer is separated from the mother board assembly, and an uncured portion of the curable material layer is removed to form a pattern layer of the printing template on the base layer.

2. The manufacturing method according to claim 1, wherein each of the mother boards includes an edge area close to the connector, each of the mother boards includes an edge surface facing the curable material layer in the edge area, the connector includes a connecting surface facing the curable material layer, and the edge surface is not coplanar with the connecting surface. 3 . The manufacturing method according to claim 2 , wherein the connection surface comprises a non-planar surface including protrusions and / or grooves.

4. The manufacturing method according to claim 2, wherein the connecting member comprises a protrusion, and the thickness of the curable material layer is greater than or equal to the height of the protrusion relative to the edge surface of the mother board, When the printed pattern of the mother board assembly is transferred to the curable material layer, the protrusion enters the curable material layer but does not contact the base layer. 5 . The manufacturing method according to claim 4 , wherein the thickness of the curable material layer is 1.25 to 50 times the height of the protrusion.

6. The manufacturing method according to any one of claims 1 to 5, wherein the printed pattern includes multiple groups of sub-printed patterns, each group of sub-printed patterns includes at least one sub-printed pattern, and the multiple groups of sub-printed patterns are arranged at intervals; the mask includes multiple light-transmitting areas, and the multiple light-transmitting areas are arranged at intervals.

7. The manufacturing method according to claim 6, wherein each of the light-transmitting areas corresponds to at least one of the multiple groups of sub-printed patterns, and the orthographic projection of the at least one group of sub-printed patterns on the base layer is located within the orthographic projection of the light-transmitting area corresponding to the at least one group of sub-printed patterns on the base layer.

8. The manufacturing method according to claim 7, wherein each of the light-transmitting areas corresponds to two groups of the multiple groups of sub-printed patterns, and the orthographic projections of the two groups of sub-printed patterns on the base layer and the orthographic projections of the area between the two groups of sub-printed patterns on the base layer are all located within the orthographic projection of the same light-transmitting area on the base layer.

9. The manufacturing method according to claim 7, wherein each of the light-transmitting areas corresponds to one of the multiple groups of sub-printed patterns, and the orthographic projection of each group of sub-printed patterns on the base layer is located within the orthographic projection of the corresponding light-transmitting area on the base layer.

10. The manufacturing method according to any one of claims 7 to 9, wherein the curable material layer comprises a plurality of portions to be irradiated, and the plurality of portions to be irradiated correspond one-to-one to the plurality of light-transmitting regions; The step of irradiating the curable material layer with light via the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured comprises: irradiating the plurality of portions to be irradiated via the plurality of light-transmitting regions of the mask using the light, so that the plurality of portions to be irradiated are cured; The curable material layer is separated from the motherboard assembly, and the uncured portion of the curable material layer is removed to form a pattern layer of the printing template on the base layer, and the multiple cured portions to be irradiated remain on the base layer to form multiple curing units in the pattern layer, wherein the at least one group of sub-printed patterns is transferred to one of the multiple curing units.

11. The manufacturing method according to any one of claims 6 to 10, wherein the mask plate comprises a plurality of the non-light-transmitting areas, the plurality of the non-light-transmitting areas are arranged at intervals, and the plurality of the non-light-transmitting areas are arranged alternately with the plurality of the light-transmitting areas, and the orthographic projection of the connecting member on the base layer is located within the orthographic projection of one of the plurality of the non-light-transmitting areas on the base layer.

12. The manufacturing method according to claim 11, wherein the plurality of non-light-transmitting areas include a first non-light-transmitting area and a plurality of second non-light-transmitting areas, the orthographic projection of the connecting member on the base layer is located within the orthographic projection of the first non-light-transmitting area on the base layer, and the plurality of second non-light-transmitting areas are respectively distributed on both sides of the first non-light-transmitting area.

13. The manufacturing method according to claim 12, wherein each of the motherboards further comprises a plurality of spacers, one of the plurality of spacers is provided between each two adjacent groups of the sub-printed patterns, and the orthographic projection of each of the second non-light-transmitting areas on the base layer is located within the orthographic projection of one of the plurality of spacers on the base layer.

14. The manufacturing method according to claim 10, wherein the curable material layer comprises a plurality of non-irradiated portions, and the plurality of non-irradiated portions correspond one-to-one to the plurality of non-light-transmitting regions; The step of irradiating the curable material layer with light via the mask so that a portion of the curable material layer corresponding to the light-transmitting area is cured, and a portion of the curable material layer corresponding to the non-light-transmitting area is not cured comprises: The plurality of non-irradiated portions are not irradiated by the light, so that the plurality of non-irradiated portions are not cured; The step of separating the curable material layer from the motherboard assembly and removing the uncured portion of the curable material layer to form the pattern layer of the printing template on the base layer includes: removing the uncured multiple non-irradiated portions to form a plurality of grooves in the pattern layer, wherein one of the multiple grooves is provided between each two adjacent curing units. 15 . The manufacturing method according to claim 13 , wherein the connecting member extends along a first direction between the two motherboards, each of the non-light-transmitting regions extends along the first direction, and each of the light-transmitting regions extends along the first direction. 16 . The manufacturing method according to claim 15 , wherein in a plane perpendicular to the first direction, a cross-sectional width of each of the non-light-transmitting areas is greater than a cross-sectional width of the connecting member and smaller than a cross-sectional width of the spacer.

17. The manufacturing method according to any one of claims 1 to 16, wherein providing a base layer, a curable material layer, and a motherboard assembly, and transferring the printed pattern of the motherboard assembly to the curable material layer comprises: providing a base layer and the curable material layer stacked with the base layer; as well as The master assembly is pressed against the layer of curable material such that the printed pattern is pressed into the layer of curable material.

18. The manufacturing method according to any one of claims 1 to 16, wherein providing a base layer, a curable material layer, and a motherboard assembly, and transferring the printed pattern of the motherboard assembly to the curable material layer comprises: providing the motherboard assembly; forming a layer of the curable material covering the printed pattern on the mother board assembly; The base layer is formed on the curable material layer.

19. The manufacturing method according to any one of claims 1 to 18, wherein separating the curable material layer from the mother board assembly and removing an uncured portion of the curable material layer to form the pattern layer of the printing template on the base layer comprises: An uncured portion of the curable material layer is removed using an organic solvent or deionized water.

20. The manufacturing method according to any one of claims 1 to 19, wherein each of the mother boards has a convex portion, and the printed pattern is provided at an end portion of the convex portion.

21. A printing template comprising: basal layer; The pattern layer is directly stacked with the base layer, and the pattern layer includes: a plurality of curing units, to which the printed pattern is transferred; a plurality of grooves, one of the plurality of grooves being provided between two adjacent ones of the plurality of curing units, and the depths of the plurality of grooves being the same and less than the thickness of the pattern layer; The printed patterns transferred onto the plurality of curing units are embedded in the plurality of curing units and have a first depth, and each of the grooves has a second depth that is greater than the first depth.

22. The printing template of claim 21, wherein a difference between the second depth and the first depth is 5 to 20 times greater than the first depth.

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