Color film substrate, manufacturing method thereof and display device

Abstract

The present invention discloses a color filter substrate, a manufacturing method thereof and a display device. By arranging a thickness compensation structure in the area where the second color resist with a lower thickness is located, the overall thickness of the area where the first color resist is located and the area where the second color resist is located can be made consistent. In this way, the overall film thickness on the color filter substrate can be made uniform, thereby preventing the problem of color deviation in side view and light leakage in dark state, and preventing the problem of color resist precipitation due to the high step difference between color resists with different heights.

Description

Technical Field

[0001] The present invention relates to the technical field of liquid crystal display, and in particular to a color film substrate, a manufacturing method thereof and a display device. Background Art

[0002] TFT-LCD (Thin Film Transistor Liquid Crystal Display) has become an important display platform in modern information technology and video products. The main working principle of TFT-LCD is to load appropriate voltage between the liquid crystal layer between the array substrate and the color film (CF) substrate, so that the liquid crystal molecules in the liquid crystal layer are deflected under the action of voltage, and different voltages are used to control different transmittances, thereby realizing display. Summary of the invention

[0003] The embodiments of the present invention provide a color film substrate, a manufacturing method thereof and a display device, which are used to solve the problem of high step difference between different color resists due to the demand for high color gamut products, resulting in color deviation and dark state light leakage in side view, and to solve the problem of thin thickness of the protective layer at the high step difference between different color resists, resulting in color resist precipitation.

[0004] An embodiment of the present invention provides a color filter substrate, comprising:

[0005] substrate substrate;

[0006] A color filter layer is arranged on one side of the base substrate; the color filter layer comprises a first color resist and a second color resist, and the thickness of the first color resist is greater than the thickness of the second color resist;

[0007] The thickness compensation structure is arranged on a side of the color filter layer away from the base substrate, and the thickness compensation structure is arranged in the area where the second color filter is located.

[0008] Optionally, in the color filter substrate provided by an embodiment of the present invention, the thickness of the thickness compensation structure is the thickness difference between the first color resist and the second color resist.

[0009] Optionally, in the color filter substrate provided in the embodiment of the present invention, it further includes a protection layer arranged on a side of the thickness compensation structure and the color filter layer away from the base substrate.

[0010] Optionally, in the color filter substrate provided in the embodiment of the present invention, it further includes a protection layer arranged between the color filter layer and the thickness compensation structure.

[0011] Optionally, in the color filter substrate provided by an embodiment of the present invention, the material of the thickness compensation structure is a transparent conductive material.

[0012] Optionally, in the color filter substrate provided in an embodiment of the present invention, it further includes a spacer arranged on a side of the protective layer and the thickness compensation structure away from the base substrate, and the spacer and the thickness compensation structure are formed by a single patterning process.

[0013] Optionally, in the color filter substrate provided in the embodiment of the present invention, it further includes a blocking layer arranged on a side of the spacer away from the base substrate.

[0014] Optionally, in the color filter substrate provided by an embodiment of the present invention, the material of the barrier layer is a transparent conductive material.

[0015] Correspondingly, an embodiment of the present invention further provides a display device, comprising: an array substrate and a color filter substrate arranged opposite to each other, and a liquid crystal layer arranged between the array substrate and the color filter substrate; the color filter substrate is the above-mentioned color filter substrate provided in an embodiment of the present invention.

[0016] Accordingly, an embodiment of the present invention further provides a method for manufacturing a color filter substrate, comprising:

[0017] A color filter layer is formed on one side of the base substrate; the color filter layer includes a first color resist and a second color resist, and the thickness of the first color resist is greater than the thickness of the second color resist;

[0018] A thickness compensation structure is formed on a side of the color filter layer away from the base substrate and arranged in the area where the second color resist is located.

[0019] Optionally, in the manufacturing method provided in the embodiment of the present invention, forming a thickness compensation structure disposed in the area where the second color filter is located on a side of the color filter layer away from the base substrate specifically includes:

[0020] A compensation film layer is deposited on a side of the color filter layer away from the base substrate; the thickness of the compensation film layer is the difference between the thickness of the first color resist and the thickness of the second color resist;

[0021] Patterning the compensation film layer, removing the compensation film layer above the first color resist, so as to form the thickness compensation structure in the area where the second color resist is located;

[0022] The manufacturing method further includes: forming a protective layer on a side of the color filter layer and the thickness compensation structure away from the base substrate.

[0023] Optionally, in the manufacturing method provided in the embodiment of the present invention, forming a thickness compensation structure disposed in the area where the second color filter is located on a side of the color filter layer away from the base substrate specifically includes:

[0024] forming a protective layer on a side of the color filter layer away from the base substrate;

[0025] Depositing a compensation film layer on the side of the protective layer away from the base substrate; the thickness of the compensation film layer is the difference between the thickness of the first color resist and the thickness of the second color resist;

[0026] The compensation film layer is patterned to remove the compensation film layer above the first color resist, so as to form the thickness compensation structure in the area where the second color resist is located.

[0027] Optionally, in the manufacturing method provided in the embodiment of the present invention, forming a thickness compensation structure disposed in the area where the second color filter is located on a side of the color filter layer away from the base substrate specifically includes:

[0028] forming a protective layer on a side of the color filter layer away from the base substrate;

[0029] A layer of photoresist is coated on the side of the protective layer away from the substrate; the material of the photoresist is a negative photoresist material;

[0030] The photoresist is exposed using a grayscale mask; the grayscale mask comprises an opaque area, a fully transparent area, a first semi-transparent area, and a second semi-transparent area, wherein the opaque area corresponds to an area where the first color resist is located, the fully transparent area corresponds to an area where the main spacer of the color filter substrate is located, the first semi-transparent area corresponds to an area where the auxiliary spacer of the color filter substrate is located, and the second semi-transparent area corresponds to an area where the second color resist is located;

[0031] The exposed photoresist is developed to form the thickness compensation structure, the main spacer and the auxiliary spacer.

[0032] The beneficial effects of the embodiments of the present invention are as follows:

[0033] A color filter substrate, a manufacturing method thereof, and a display device provided by an embodiment of the present invention can make the overall thickness of the area where the first color resist is located and the area where the second color resist is located consistent by setting a thickness compensation structure in the area where the second color resist is located. In this way, the overall film thickness on the color filter substrate can be uniform, thereby preventing the problem of color deviation in side view and light leakage in dark state, and preventing the problem of color resist precipitation due to the high step difference between color resists of different heights. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 A schematic structural diagram of a color filter substrate provided by an embodiment of the present invention;

[0035] Figure 2 A schematic structural diagram of another color filter substrate provided by an embodiment of the present invention;

[0036] Figure 3 A schematic structural diagram of another color filter substrate provided by an embodiment of the present invention;

[0037] Figure 4 A schematic structural diagram of another color filter substrate provided by an embodiment of the present invention;

[0038] Figure 5 A schematic flow chart of a method for manufacturing a color filter substrate provided by an embodiment of the present invention;

[0039] Figure 6A-6D Made for Figure 1 The color filter substrate shown is a schematic structural diagram after each step is performed;

[0040] Figure 7A-7C Made for Figure 2 The color filter substrate shown is a schematic structural diagram after each step is performed;

[0041] Figure 8A-8B Made for Figure 3 and Figure 4 The color filter substrate shown is a schematic structural diagram after each step is performed;

[0042] Fig. 9 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical scheme and advantages of the present invention clearer, the following is a detailed description of a color filter substrate, a manufacturing method thereof and a specific implementation of a display device provided by an embodiment of the present invention in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described below are only used to illustrate and explain the present invention, and are not used to limit the present invention. In addition, the embodiments and features in the embodiments of this application can be combined with each other if there is no conflict.

[0044] The thickness, size and shape of each thin film layer in the accompanying drawings do not reflect the actual proportion of the color filter substrate, and the purpose is only to illustrate the content of the present invention.

[0045] At present, the color gamut requirements of liquid crystal display products are getting higher and higher, and product requirements can only be met by increasing the film thickness of color resists of different colors. This may lead to a high step difference between color resists, thereby affecting the liquid crystal alignment and causing dark state light leakage. What's more, due to the high color blocking difference, the side view color deviation problem is caused. In addition, the prior art usually applies a protective layer (overcoat layer, referred to as OC layer) as a flat layer after the color resist material of the color film substrate is completed. The OC layer at the high color resist step difference is relatively thin, and it is more susceptible to the influence of the developer, PI solvent, exposure process, etc. in the subsequent process, so that the shielding property of the OC layer is greatly reduced at the high color resist step difference, causing the color resist to precipitate, pollute the liquid crystal in the box, and cause the problem of broken bright spots (Zara) or uneven brightness (Mura) when the panel is displayed.

[0046] In view of this, in order to solve a series of problems caused by high color blocking difference in liquid crystal display products, an embodiment of the present invention provides a color filter substrate, such as Figure 1-Figure 4 As shown, including:

[0047] Base substrate 1;

[0048] The color filter layer 2 is arranged on one side of the base substrate 1; the color filter layer 2 includes a first color resist 21 and a second color resist 22, and the thickness of the first color resist 21 is greater than the thickness of the second color resist 22;

[0049] The thickness compensation structure 3 is arranged on the side of the color filter layer 2 facing away from the base substrate 1 , and the thickness compensation structure 3 is arranged in the area where the second color resist 22 is located.

[0050] The color filter substrate provided in the embodiment of the present invention can make the overall thickness of the area where the first color resist is located and the area where the second color resist is located consistent by setting a thickness compensation structure in the area where the second color resist is located. In this way, the overall film thickness on the color filter substrate can be uniform, thereby preventing color deviation in side view and light leakage in dark state, and preventing color resist precipitation due to the high step difference between color resists of different heights.

[0051] In specific implementation, the color filter layer generally includes red color resist R, green color resist G and blue color resist B. As the color gamut requirements of liquid crystal display products become higher and higher, the product requirements can only be met by increasing the film thickness of RGB color resist, which leads to a high discontinuity problem between RGB color resist. Optionally, the three RGB color resists may have different film thicknesses; it is also possible that two of the color resists have the same film thickness, and the film thickness of the other color resist is higher than the film thickness of the two color resists of the same thickness; it is also possible that two of the color resists have the same film thickness, and the film thickness of the two color resists of the same thickness is higher than the film thickness of the other color resist; and so on.

[0052] It should be noted that the first color resist 21 and the second color resist 22 in the embodiment of the present invention do not refer to a single color resist. When the film thicknesses of the three color resists RGB are different, for example, the film thickness of the red color resist R is higher than the film thickness of the green color resist G, and the film thickness of the green color resist G is higher than the film thickness of the blue color resist B, then the first color resist 21 in the present invention may be the red color resist R, and the second color resist 22 may be the green color resist G and the blue color resist B; for another example, the film thicknesses of the red color resist R and the blue color resist B are the same, and the film thickness of the green color resist G is higher than the film thicknesses of the red color resist R and the blue color resist B, then the first color resist 21 in the present invention is the green color resist G, and the second color resist 22 is the red color resist R and the blue color resist B; for another example, the film thicknesses of the red color resist R and the blue color resist B are the same, and the film thicknesses of the red color resist R and the blue color resist B are higher than the film thickness of the green color resist G, then the first color resist 21 in the present invention is the red color resist R and the blue color resist B, and the second color resist 22 is the green color resist G; and so on. Therefore, as long as the color filter substrate includes RGB color resists of different film thicknesses, a thickness compensation structure is set in the area where one or two color resists with lower film thickness are located to make the thicknesses of the three RGB color resists in the area consistent, which all falls within the scope of protection of the embodiments of the present invention.

[0053] In specific implementation, Figure 1-Figure 4 As shown, the embodiment of the present invention is described by taking the first color resist 21 as the green color resist G, the second color resist 22 including the red color resist R and the blue color resist B, and the film thickness of the red color resist R and the blue color resist B is the same, and the film thickness of the green color resist G is higher than the film thickness of the red color resist R and the blue color resist B as an example.

[0054] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1-Figure 4 As shown, the thickness of the thickness compensation structure 3 is the difference between the thickness of the first color resist 21 and the second color resist 22. In this way, the overall thickness of the area where the first color resist 21 and the area where the second color resist 22 are located can be completely consistent, and then the overall film thickness on the color filter substrate can be completely uniform, thereby improving the contrast of the product, improving the picture quality and product competitiveness, and improving the product reliability and product yield.

[0055] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1 As shown, it also includes a protective layer 4 (OC layer) arranged on the side of the thickness compensation structure 3 and the color filter layer 2 away from the substrate 1. Figure 1The thickness compensation structure 3 is arranged between the protective layer 4 and the color filter layer 2, and is correspondingly arranged above the red color resist R and the blue color resist B, that is, after the RGB color resist is manufactured, the step difference generated by the RGB is filled, and the problem of light leakage in the dark state and color deviation in the side view will not be caused; and the protective layer 4 manufactured subsequently can be a flat film layer, so that the problem of the protective layer 4 being too thin at the step difference will not occur, thereby improving the shielding performance of the protective layer 4, so that the RGB color resist will not precipitate from the side of the protective layer 4, and the corrosion of the protective layer by the developer, PI solvent, and exposure process used in the subsequent process can be avoided, thereby greatly increasing the shielding ability of the protective layer 4 and improving the reliability and product yield of the product.

[0056] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 2 As shown, it also includes a protective layer 4 disposed between the color filter layer 2 and the thickness compensation structure 3. Specifically, the embodiment of the present invention Figure 2 The RGB color resist is first made and then the protective layer 4 is made. Since the RGB color resist has a step difference, the protective layer 4 is also uneven, and the protective layer 4 is thinner at the step difference. That is, after the protective layer 4 is made, the thickness compensation structure 3 is used to fill the step difference of the protective layer 4 at different positions caused by the step difference of the RGB color resist, so that the problem of light leakage in the dark state and color deviation in side view will not be caused; and the thickness compensation structure 3 is used as a shielding structure at the position where the thickness of the protective layer 4 is thin, which can also improve the overall shielding performance of the protective layer 4, so that the RGB color resist will not precipitate from the side of the protective layer 4, and the corrosion of the developer, PI solvent, and exposure process used in the subsequent process to the protective layer can be avoided, which greatly increases the shielding ability of the protective layer 4 and improves the reliability and product yield of the product.

[0057] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1 and Figure 2 As shown, the material of the thickness compensation structure 3 can be a transparent conductive material. Since the density of the transparent conductive material is much better than that of the protective layer 4 (organic material), the use of the transparent conductive material to make the thickness compensation structure 3 can greatly improve the shielding property, greatly reduce the impact of the developer, PI solution, etc. on the protective layer, and the high shielding property of the transparent conductive material can prevent the RGB material of the protective layer 4 from precipitating, thereby improving the product quality.

[0058] Optionally, the transparent conductive material includes ITO, IGZO, etc.

[0059] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 3As shown, the protective layer 4 is arranged between the color filter layer 2 and the thickness compensation structure 3, and the color filter substrate further comprises a spacer 5 arranged on the side of the protective layer 4 and the thickness compensation structure 3 away from the base substrate 1, and the spacer 5 and the thickness compensation structure 3 are formed by a single patterning process. In this way, the material of the thickness compensation structure 3 can be the same as that of the spacer 5, that is, only the original patterning pattern needs to be changed when forming the spacer 5, and the pattern of the thickness compensation structure 3 and the spacer 5 can be formed by a single patterning process, without adding a process for preparing the thickness compensation structure 3 separately, which can simplify the preparation process, save production costs, and improve production efficiency.

[0060] Specifically, Figure 3 As shown, the spacer 5 is generally made of a photoreactive material, namely a photoresist material, which can be a negative photoresist material or a positive photoresist material. When making the spacer 5 and the thickness compensation structure 3, a grayscale mask process (Tri-Tone technology) can be used to form the spacer 5 and the thickness compensation structure 3. For a detailed manufacturing method, please refer to the relevant description in the subsequent color film substrate manufacturing method.

[0061] Specifically, photoresist materials can be divided into two types according to whether the exposed area is removed or retained during the development process: positive photoresist materials and negative photoresist materials. The exposed part of the positive photoresist material undergoes a photochemical reaction and dissolves in the developer, while the unexposed part does not dissolve in the developer and remains on the substrate, copying the same pattern as on the mask onto the substrate. The exposed part of the negative photoresist material is insoluble in the developer due to cross-linking and curing, while the unexposed part dissolves in the developer, copying the opposite pattern of the mask onto the substrate.

[0062] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 4 As shown, a barrier layer 6 is also included which is arranged on the side of the spacer 5 away from the base substrate 1. Optionally, the material of the barrier layer 6 is a transparent conductive material, such as ITO, IGZO, etc. In this way, on the basis of filling the gap of the RGB color resistance when making the spacer 5, the high shielding property of the barrier layer 6 is used to further improve the problems of dark state light leakage and RGB color resistance precipitation, and the barrier layer 6 can also play the role of electrostatic shielding.

[0063] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1 As shown, a spacer 5 is provided on the side of the protective layer 4 away from the base substrate 1; Figure 2 As shown, a spacer 5 is provided on the side of the protective layer 4 and the thickness compensation structure 3 away from the substrate 1. Optionally, as Figure 1 and Figure 2As shown, in order to further prevent the developer, PI solvent, and exposure process used in the subsequent process from corroding the protective layer 4, a barrier layer 6 can also be provided on the side of the spacer 5 away from the substrate 1. Specifically, the material of the barrier layer 6 is a transparent conductive material, such as ITO, IGZO, etc., and the barrier layer 6 can also play a role in electrostatic shielding.

[0064] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1-Figure 4 As shown, the spacer 5 includes a main spacer 51 and an auxiliary spacer 52, and the height of the main spacer 51 is greater than the height of the auxiliary spacer 52. Specifically, when the color filter substrate provided in the embodiment of the present invention is packaged with the array substrate to form a liquid crystal display panel, the main spacer 51 and the auxiliary spacer 52 with a height difference can increase the pressure bearing capacity and recovery elasticity of the liquid crystal display panel while providing support. When a pressing force is applied to the screen to deform the main spacer 51 until the auxiliary spacer 52 contacts the array substrate, the support force of the screen is significantly increased, which can prevent the screen from being excessively deformed. When the pressing force is removed, the screen can bounce upward under the joint action of the main spacer 51 and the auxiliary spacer 52 to restore its original shape.

[0065] In a specific implementation, in the above color filter substrate provided in an embodiment of the present invention, if Figure 1-Figure 4 As shown, it also includes a black matrix layer 7 arranged between the base substrate 1 and the color filter layer 2. The black matrix layer 7 has a plurality of openings, and each color resist of the color filter layer 2 is arranged in a corresponding opening.

[0066] Based on the same inventive concept, the embodiment of the present invention also provides a method for manufacturing a color filter substrate, such as Figure 5 As shown, including:

[0067] S501, forming a color filter layer on one side of the base substrate; the color filter layer includes a first color resist and a second color resist, and the thickness of the first color resist is greater than the thickness of the second color resist;

[0068] S502 , forming a thickness compensation structure disposed in the area where the second color resist is located on the side of the color filter layer away from the base substrate.

[0069] The method for manufacturing the color filter substrate provided in an embodiment of the present invention can make the overall thickness of the area where the first color resist is located and the area where the second color resist is located consistent by forming a thickness compensation structure in the area where the second color resist is located. In this way, the overall film thickness on the color filter substrate can be uniform, thereby preventing color deviation in side view and light leakage in dark state, and preventing color resist precipitation due to the high step difference between color resists of different heights.

[0070] Below Figure 1Taking the color filter substrate shown in FIG. 1 as an example, the method for manufacturing the color filter substrate provided by the embodiment of the present invention is described in detail:

[0071] (1) A black matrix layer 7 and a color filter layer 2 are sequentially formed on one side of a base substrate 1. The color filter layer includes a first color resist 21 (green color resist G) and a second color resist 22 (red color resist R and blue color resist B). The thickness of the green color resist G is greater than that of the red color resist R and the blue color resist B. The thickness of the red color resist R is the same as that of the blue color resist B. Fig. 6A As shown; the manufacturing method of the black matrix layer 7 and the color filter layer 2 is the same as that of the prior art and will not be described in detail here.

[0072] (2) A compensation film layer 3' is deposited on the side of the color filter layer 2 facing away from the base substrate 1. The thickness of the compensation film layer 3' is the difference between the thickness of the first color resist 21 and the second color resist 22. Figure 6B As shown; optionally, the material of the compensation film layer 3' is ITO.

[0073] (3) Patterning the compensation film layer 3', removing the compensation film layer 3' above the first color resist 21 (G), so as to form a thickness compensation structure 3 in the area where the second color resist 22 (R and B) is located, as shown in FIG. Figure 6C As shown; the thickness of the thickness compensation structure 3 formed in this way is the thickness difference between the first color resist 21 (G) and the second color resist 22 (R and B).

[0074] (4) forming a protective layer 4 on the side of the color filter layer 2 and the thickness compensation structure 3 away from the substrate 1, such as Fig.6D shown.

[0075] (5) forming a spacer 5 on the side of the protective layer 4 away from the base substrate 1, such as Figure 1 As shown; the manufacturing method of the spacer 5 is the same as that of the prior art and will not be described in detail here.

[0076] The above steps (1) to (5) form the Figure 1 The color film substrate shown.

[0077] Below Figure 2 Taking the color filter substrate shown in FIG. 1 as an example, the method for manufacturing the color filter substrate provided by the embodiment of the present invention is described in detail:

[0078] (1) A black matrix layer 7 and a color filter layer 2 are sequentially formed on one side of a base substrate 1. The color filter layer includes a first color resist 21 (green color resist G) and a second color resist 22 (red color resist R and blue color resist B). The thickness of the green color resist G is greater than that of the red color resist R and the blue color resist B. The thickness of the red color resist R is the same as that of the blue color resist B. Fig. 6A As shown; the manufacturing method of the black matrix layer 7 and the color filter layer 2 is the same as that of the prior art and will not be described in detail here.

[0079] (2) forming a protective layer 4 on the side of the color filter layer 2 facing away from the base substrate 1, such as Fig. 7A shown.

[0080] (3) A compensation film layer 3' is deposited on the side of the protective layer 4 away from the base substrate 1. The thickness of the compensation film layer 3' is the difference between the thickness of the first color resist 21 and the thickness of the second color resist 22, such as Figure 7B As shown; optionally, the material of the compensation film layer 3' is ITO.

[0081] (4) Patterning the compensation film layer 3', removing the compensation film layer 3' above the first color resist 21 (G), so as to form a thickness compensation structure 3 in the area where the second color resist 22 (R and B) is located, as shown in FIG. Figure 7C As shown; the thickness of the thickness compensation structure 3 formed in this way is the thickness difference between the first color resist 21 (G) and the second color resist 22 (R and B).

[0082] (5) A spacer 5 is formed on the side of the color filter layer 2 and the thickness compensation structure 3 away from the substrate 1, such as Figure 2 As shown; the manufacturing method of the spacer 5 is the same as that of the prior art and will not be described in detail here.

[0083] The above steps (1) to (5) form the Figure 2 The color film substrate shown.

[0084] Below are 3 and Figure 4 Taking the color filter substrate shown in FIG. 1 as an example, the method for manufacturing the color filter substrate provided by the embodiment of the present invention is described in detail:

[0085] (1) A black matrix layer 7 and a color filter layer 2 are sequentially formed on one side of a base substrate 1. The color filter layer includes a first color resist 21 (green color resist G) and a second color resist 22 (red color resist R and blue color resist B). The thickness of the green color resist G is greater than that of the red color resist R and the blue color resist B. The thickness of the red color resist R is the same as that of the blue color resist B. Fig. 6A As shown; the manufacturing method of the black matrix layer 7 and the color filter layer 2 is the same as that of the prior art and will not be described in detail here.

[0086] (2) forming a protective layer 4 on the side of the color filter layer 2 facing away from the base substrate 1, such as Fig. 7A shown.

[0087] (3) A layer of photoresist 35 is coated on the side of the protective layer 4 facing away from the substrate 1, such as Fig. 8A As shown; optionally, the material of the photoresist 35 is a negative photoresist material.

[0088] (4) The photoresist 35 is exposed using a grayscale mask 8 (Tri-Tone technology); the grayscale mask 8 includes an opaque area 81, a fully transparent area 82, a first semi-transparent area 83, and a second semi-transparent area 84. The opaque area 81 corresponds to the area where the first color resist 21 (G) is located, the fully transparent area 82 corresponds to the area where the main spacer 51 of the color filter substrate is located, the first semi-transparent area 83 corresponds to the area where the auxiliary spacer 52 of the color filter substrate is located, and the second semi-transparent area 84 corresponds to the area where the second color resist 22 (R and B) is located. Figure 8B Specifically, the light transmittance of the first semi-light-transmitting area 83 and the light transmittance of the second semi-light-transmitting area 84 are determined according to the thickness of the auxiliary spacer 52 and the step difference of the RGB color resist.

[0089] (5) Developing the exposed photoresist 35 to form a thickness compensation structure 3, a main spacer 51 and an auxiliary spacer 52, such as Figure 3 shown.

[0090] (6) forming a barrier layer 6 on the side of the spacer 5 facing away from the substrate 1, such as Figure 4 As shown; optionally, the material of the barrier layer 6 is ITO.

[0091] The above steps (1) to (5) form the Figure 3 The color film substrate shown in the figure is formed by the above steps (1) to (6) to form the color film substrate provided in the embodiment of the present invention. Figure 4 The color film substrate shown.

[0092] It should be noted that the above production Figure 4 The material of the photoresist 35 used in the thickness compensation structure 3, the main spacer 51 and the auxiliary spacer 52 shown is a negative photoresist material, of course, the material of the photoresist can also be a positive photoresist material. Specifically, when the material of the photoresist is a positive photoresist material, the opaque area of ​​the grayscale mask corresponds to the area where the main spacer is located, the fully transparent area corresponds to the area where the first color resistance of the color filter substrate is located, and the area where the auxiliary spacer is located and the area where the second color resistance is located correspond to the semi-transparent area respectively, and the degree of light transmission of the two semi-transparent areas depends on the thickness of the auxiliary spacer and the step difference of the RGB color resistance.

[0093] Based on the same inventive concept, an embodiment of the present invention further provides a display device, such as Fig. 9 As shown, it includes: an array substrate 100 and a color filter substrate 200 arranged opposite to each other, and a liquid crystal layer 300 arranged between the array substrate 100 and the color filter substrate 200; the color filter substrate 200 is the color filter substrate provided in the embodiment of the present invention. Fig. 9 The color film substrate is based on Figure 4 The structure shown in the figure is taken as an example, of course it can also be Figure 1-Figure 3Any of the structures shown.

[0094] In a specific implementation, in the above display device provided in an embodiment of the present invention, if Fig. 9 As shown, the array substrate mainly includes thin film transistors, pixel electrodes, common electrodes, and some flat layers, passivation layers and other structures.

[0095] In a specific implementation, in the above display device provided in an embodiment of the present invention, if Fig. 9 As shown, the array substrate 100 includes a first alignment layer (not shown) close to the liquid crystal layer 300, and the color film substrate 200 also includes a second alignment layer (not shown) close to the liquid crystal layer 300;

[0096] The display device also includes: a first polarizer (not shown) arranged on the side of the array substrate 100 away from the color film substrate 200, a second polarizer (not shown) arranged on the side of the color film substrate 200 away from the array substrate 100, and a backlight source (not shown) arranged on the side of the first polarizer away from the color film substrate 200.

[0097] Specifically, the first alignment layer, the second alignment layer, the first polarizer, the second polarizer, and the backlight source are the same as those in the prior art and are not described in detail herein.

[0098] The display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, etc. The implementation of the display device can refer to the above-mentioned color filter substrate embodiment, and the repeated parts will not be repeated.

[0099] A color filter substrate, a manufacturing method thereof, and a display device provided by an embodiment of the present invention can make the overall thickness of the area where the first color resist is located and the area where the second color resist is located consistent by setting a thickness compensation structure in the area where the second color resist is located. In this way, the overall film thickness on the color filter substrate can be uniform, thereby preventing the problem of color deviation in side view and light leakage in dark state, and preventing the problem of color resist precipitation due to the high step difference between color resists of different heights.

[0100] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A color film substrate, characterized in that: include: substrate substrate; A color filter layer is arranged on one side of the base substrate; the color filter layer comprises a first color resist and a second color resist, and the thickness of the first color resist is greater than the thickness of the second color resist; A thickness compensation structure is arranged on a side of the color filter layer away from the base substrate, and the thickness compensation structure is arranged in the area where the second color filter is located; A protective layer, disposed between the color filter layer and the thickness compensation structure; A spacer is arranged on a side of the protective layer and the thickness compensation structure away from the substrate; the spacer and the thickness compensation structure are formed by a single patterning process; A barrier layer is arranged on a side of the spacer away from the substrate; The thickness of the thickness compensation structure is the difference between the thickness of the first color resist and the thickness of the second color resist; The material of the thickness compensation structure and the material of the barrier layer are both transparent conductive materials.

2. A display device, characterized in that: include: An array substrate and a color filter substrate arranged opposite to each other, and a liquid crystal layer arranged between the array substrate and the color filter substrate; The color filter substrate is the color filter substrate according to claim 1.

3. A method for manufacturing a color film substrate as claimed in claim 1, characterized in that: include: forming a color film layer on one side of the base substrate; The color filter layer includes a first color resist and a second color resist, and the thickness of the first color resist is greater than the thickness of the second color resist; Forming a thickness compensation structure on a side of the color filter layer away from the base substrate and arranged in the area where the second color filter is located; The production method further comprises: forming a protective layer on a side of the color filter layer away from the base substrate; forming a spacer on a side of the protective layer and the thickness compensation structure away from the substrate; the spacer and the thickness compensation structure are formed by a single patterning process; A barrier layer is formed on a side of the spacer away from the base substrate.

4. The method according to claim 3, characterized in that: A thickness compensation structure is formed on a side of the color filter layer away from the base substrate and arranged in the area where the second color filter is located, specifically comprising: forming a protective layer on a side of the color filter layer away from the base substrate; Depositing a compensation film layer on the side of the protective layer away from the base substrate; the thickness of the compensation film layer is the difference between the thickness of the first color resist and the thickness of the second color resist; The compensation film layer is patterned to remove the compensation film layer above the first color resist, so as to form the thickness compensation structure in the area where the second color resist is located.

5. The manufacturing method according to claim 3, characterized in that: A thickness compensation structure is formed on a side of the color filter layer away from the base substrate and arranged in the area where the second color filter is located, specifically comprising: forming a protective layer on a side of the color filter layer away from the base substrate; A layer of photoresist is coated on the side of the protective layer away from the substrate; the material of the photoresist is a negative photoresist material; The photoresist is exposed using a grayscale mask; the grayscale mask comprises an opaque area, a fully transparent area, a first semi-transparent area, and a second semi-transparent area, wherein the opaque area corresponds to an area where the first color resist is located, the fully transparent area corresponds to an area where the main spacer of the color filter substrate is located, the first semi-transparent area corresponds to an area where the auxiliary spacer of the color filter substrate is located, and the second semi-transparent area corresponds to an area where the second color resist is located; The exposed photoresist is developed to form the thickness compensation structure, the main spacer and the auxiliary spacer.

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