Double-sided grinding method for multi-layer copper materials

Abstract

This invention discloses a double-sided grinding method for multi-layer copper materials. The grinding method includes the following steps: simultaneously grinding the multi-layer copper material using an upper grinding disc and a lower grinding disc, wherein the grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. This double-sided grinding method optimizes the grinding disc's formula to alter its properties and eliminate resin agglomerates within the grinding disc, thereby preventing deep scratches on the workpiece and further improving grinding efficiency. Combined with optimized multi-stage grinding parameters, it effectively avoids problems such as poor surface roughness, burrs at edges, edge collapse, and deep scratches on the copper material.

Description

Technical Field

[0001] This invention relates to the field of metal material processing, and in particular to a double-sided grinding method for multilayer copper materials. Background Technology

[0002] Since its development in the 1950s, ultra-precision machining technology has seen continuous improvement in machining accuracy and a wider range of materials being processed, including ultra-precision grinding and polishing, and cutting. Each technology has its own processing characteristics and limitations depending on the material. Among these, grinding and polishing, as the most classic machining processes, are the most important methods in ultra-precision machining. Compared to cutting, grinding and polishing offer advantages such as higher production efficiency, higher surface quality, and less machining damage. Furthermore, bonded abrasive grinding and polishing methods maximize the advantages of grinding.

[0003] However, traditional grinding processes are not suitable for processing copper materials, such as Figure 1 The workpiece surface after processing still has problems such as poor roughness, burrs on the edges and corners, collapsed edges and deep scratches. For multi-layer copper materials such as copper-molybdenum copper, copper-diamond and copper-molybdenum multi-layer structures, there are obvious differences in hardness and ductility compared with ordinary copper materials. Traditional grinding processes are even less able to meet the grinding requirements of multi-layer copper materials. Summary of the Invention

[0004] Therefore, in order to avoid problems such as poor surface roughness, burrs at the edges and corners, collapsed edges and deep scratches on the surface of multilayer copper materials, it is necessary to provide a double-sided grinding method for multilayer copper materials.

[0005] This invention provides a method for double-sided grinding of multilayer copper materials, comprising the following steps:

[0006] The multi-layered copper material is simultaneously ground using an upper and lower grinding disc, and the grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding.

[0007] The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, include: 20%–30% resin binder, 65%–75% silicon carbide, and 2%–6% stabilizer.

[0008] The parameters for the first double-sided grinding include: a first pressure of 600N to 1200N, a first grinding disc rotation speed of 1Hz to 15Hz, and a first planetary wheel rotation speed of 1Hz to 10Hz.

[0009] The parameters for the second double-sided grinding include: a second pressure of 800N to 1700N, a second grinding disc rotation speed of 5Hz to 35Hz, and a second planetary wheel rotation speed of 5Hz to 25Hz.

[0010] The parameters for the third double-sided grinding include: a third pressure of 1300N to 2600N, a third grinding disc rotation speed of 15Hz to 35Hz, and a third planetary wheel rotation speed of 5Hz to 25Hz.

[0011] The parameters for the fourth double-sided grinding include: a fourth pressure of 600N to 1200N and a fourth grinding disc rotation speed of 5Hz to 25Hz.

[0012] In one embodiment, the resin binder is an acetal resin.

[0013] In one embodiment, the stabilizer is polyvinyl alcohol.

[0014] In one embodiment, the parameters of the first double-sided grinding include: the first grinding time is 1s to 15s.

[0015] In one embodiment, the parameters of the second double-sided grinding include: the second grinding time is 5s to 15s.

[0016] In one embodiment, the parameters of the third double-sided grinding include: the third grinding time is 50s to 400s.

[0017] In one embodiment, the parameters of the fourth double-sided grinding include: the fourth grinding time is 1s to 15s.

[0018] In one embodiment, the grinding process is followed by a cleaning and passivation step.

[0019] In one embodiment, the cleaning conditions include cleaning in a solution with a pH of 0.8 to 1.3 for 5 to 30 seconds.

[0020] In one embodiment, the passivation conditions include passivation treatment in a passivation solution for 3 to 8 minutes.

[0021] The aforementioned double-sided grinding method optimizes the grinding disc's formula to alter its properties and eliminate resin agglomerates within the disc, thereby preventing deep scratches on the workpiece after grinding and further improving grinding efficiency. Furthermore, by incorporating optimized multi-stage grinding parameters, it effectively avoids problems such as poor surface roughness, burrs at edges and corners, edge collapse, and deep scratches on copper materials. Attached Figure Description

[0022] Figure 1 Traditional grinding methods can lead to defects on the sample surface, such as (a) oxidation and chipping at the edges and corners, (b) random patterns, (c) collapsed edges, and (d) deep scratches.

[0023] Figure 2The surface of a good sample after grinding, provided for an example. Detailed Implementation

[0024] This invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure of this invention. Of course, they are merely examples and are not intended to limit the invention. Furthermore, reference numerals and / or letters may be repeated in different instances. Such repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or settings discussed.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of the invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified. In the description of the present invention, "a number" means at least one, such as one, two, etc., unless otherwise explicitly specified.

[0026] Unless otherwise specified, all percentages, fractions, and ratios are calculated based on the total mass of the compositions of the present invention. Unless otherwise specified, all masses of the listed ingredients give an amount of active substance and therefore do not include solvents or byproducts that may be present in commercially available materials. The term "percentage by mass" may be expressed by the symbol "%".

[0027] The terms “comprising,” “including,” “containing,” “having,” “comprising,” or other variations thereof are intended to cover non-closed inclusion, and no distinction is made between these terms. The term “comprising” means that other steps and ingredients may be added without affecting the final result. The term “comprising” also includes the terms “consisting of” and “substantially composed of.” The compositions and methods / processes of the present invention comprise, consist of, and substantially consist of the essential elements and limitations described herein, as well as any additional or optional ingredients, components, steps, or limitations described herein. No distinction is made between the terms “efficacy,” “performance,” “effect,” and “potency” herein.

[0028] The terms "preferred," "more preferably," etc., used in this invention refer to embodiments of the invention that provide certain beneficial effects under certain circumstances. However, other embodiments may also be preferred under the same or other circumstances. Furthermore, the description of one or more preferred embodiments does not imply that other embodiments are unavailable, nor is it intended to exclude other embodiments from the scope of this invention.

[0029] When a numerical range is disclosed herein, the range is considered continuous and includes the minimum and maximum values ​​of the range, as well as every value between the minimum and maximum values. Furthermore, when the range refers to integers, it includes every integer between the minimum and maximum values ​​of the range. Additionally, when multiple ranges are provided to describe a feature or characteristic, the ranges may be combined. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges to which they are incorporated.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the specification of this invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0031] This invention provides a method for double-sided grinding of multilayer copper materials, comprising the following steps:

[0032] The multi-layered copper material is simultaneously ground using an upper and lower grinding disc, and the grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding.

[0033] The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, include: 20%–30% resin binder, 65%–75% silicon carbide, and 2%–6% stabilizer.

[0034] The parameters for the first double-sided grinding mentioned above include: a first pressure of 600N to 1200N, and a first grinding disc rotation speed of 1Hz to 15Hz.

[0035] The parameters for the second double-sided grinding mentioned above include: a second pressure of 800N to 1700N, and a second grinding disc rotation speed of 5Hz to 35Hz.

[0036] The parameters for the third double-sided grinding mentioned above include: a third pressure of 1300N to 2600N, and a third grinding disc rotation speed of 15Hz to 35Hz.

[0037] The parameters for the fourth double-sided grinding mentioned above include: the fourth pressure is 600N to 1200N, and the fourth grinding disc speed is 5Hz to 25Hz.

[0038] Furthermore, the parameters for the first double-sided grinding include: a first pressure of 800N to 1000N, and a first grinding disc rotation speed of 5Hz to 10Hz.

[0039] The parameters for the second double-sided grinding mentioned above include: a second pressure of 1000N to 1500N, and a second grinding disc rotation speed of 10Hz to 25Hz.

[0040] The parameters for the third double-sided grinding mentioned above include: a third pressure of 1500N to 2400N, and a third grinding disc rotation speed of 20Hz to 30Hz.

[0041] The parameters for the fourth double-sided grinding mentioned above include: the fourth pressure is 800N to 1000N, and the fourth grinding wheel speed is 10Hz to 20Hz.

[0042] Understandably, multilayer copper materials can be, but are not limited to, copper-molybdenum copper, copper-diamond, and copper-molybdenum multilayer structures, and they differ significantly from ordinary copper materials in terms of hardness and ductility.

[0043] In one specific example, the resin binder mentioned above is an acetal resin.

[0044] Furthermore, the viscosity of the acetal resin is 3 mPa·s to 14 mPa·s. It is understood that the viscosity of the acetal resin may be, but is not limited to, 3 mPa·s, 4 mPa·s, 5 mPa·s, 6 mPa·s, 7 mPa·s, 8 mPa·s, 9 mPa·s, 10 mPa·s, 11 mPa·s, 12 mPa·s, 13 mPa·s or 14 mPa·s, and preferably the viscosity of the acetal resin is 8 mPa·s.

[0045] In one specific example, the stabilizer mentioned above is polyvinyl alcohol.

[0046] Furthermore, the raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, include: 22% to 26% resin binder, 69% to 73% silicon carbide, and 3.5% to 5.5% stabilizer.

[0047] In a specific example, the parameters for the first double-sided grinding mentioned above include: the rotation speed of the first planetary wheel is 1Hz to 10Hz, and the first grinding time is 1s to 15s.

[0048] In a preferred example, the parameters for the first double-sided grinding include: the rotational speed of the first planetary wheel is 1Hz to 8Hz, and the first grinding time is 5s to 10s.

[0049] Understandably, the rotational speed of the first planetary wheel can be, but is not limited to, 1Hz, 2Hz, 3Hz, 4Hz, 5Hz, 6Hz, 7Hz, or 8Hz.

[0050] Furthermore, the first grinding time may be, but is not limited to, 5s, 6s, 7s, 8s, 9s, or 10s.

[0051] In a specific example, the parameters for the second double-sided grinding mentioned above include: the rotation speed of the second planetary wheel is 5Hz to 25Hz, and the second grinding time is 5s to 15s.

[0052] In a preferred example, the parameters for the second double-sided grinding include: a second frequency of 10Hz to 20Hz and a second grinding time of 6s to 12s.

[0053] Furthermore, the rotational speed of the second planetary gear can be, but is not limited to, 10Hz, 11Hz, 12Hz, 13Hz, 14Hz, 15Hz, 16Hz, 17Hz, 18Hz, 19Hz or 20Hz.

[0054] Furthermore, the second grinding time may be, but is not limited to, 6s, 7s, 8s, 9s, 10s, 11s, or 12s.

[0055] In a specific example, the parameters for the third double-sided grinding mentioned above include: the rotation speed of the third planetary wheel is 5Hz to 25Hz, and the grinding time is 50s to 400s.

[0056] In a preferred example, the parameters for the third double-sided grinding include: the rotational speed of the third planetary gear is 10Hz to 20Hz, and the grinding time is 100s to 360s.

[0057] Furthermore, the speed of the third planetary gear can be, but is not limited to, 10Hz, 11Hz, 12Hz, 13Hz, 14Hz, 15Hz, 16Hz, 17Hz, 18Hz, 19Hz or 20Hz.

[0058] Furthermore, the third grinding time may be, but is not limited to, 110s, 120s, 130s, 140s, 150s, 160s, 170s, 180s, 190s, 200s, 210s, 220s, 230s, 240s, 250s, 260s, 270s, 280s, 290s, 300s, 310s, 320s, 330s, 340s, 350s, or 360s.

[0059] In a specific example, the parameters for the fourth double-sided grinding mentioned above include: the fourth grinding time is 1s to 15s.

[0060] Understandably, the planetary wheel did not rotate during the fourth grinding.

[0061] In a preferred example, the parameters for the fourth double-sided grinding include: the fourth grinding time is 4s to 10s.

[0062] The aforementioned double-sided grinding method optimizes the grinding disc's formula to alter its properties and eliminate resin agglomerates within the disc, thereby preventing deep scratches on the workpiece after grinding and further improving grinding efficiency. Furthermore, by incorporating optimized multi-stage grinding parameters, it effectively avoids problems such as poor surface roughness, burrs at edges and corners, edge collapse, and deep scratches on copper materials.

[0063] Furthermore, the multilayer copper material can be, but is not limited to, one of copper-molybdenum copper, copper-diamond, and copper-molybdenum, and is manufactured through processes such as hot pressing and rolling. For example, copper-molybdenum copper as the copper layer material and molybdenum copper layer material are manufactured through processes such as hot pressing and rolling.

[0064] In one specific example, the grinding process described above is followed by cleaning and passivation steps.

[0065] In one specific example, the cleaning conditions described above include cleaning in a solution with a pH of 0.8 to 1.3 for 5 to 30 seconds.

[0066] Preferably, a 4% (w / w) phosphoric acid aqueous solution is used for washing for 10 to 25 seconds.

[0067] In a specific example, the passivation conditions described above include passivation treatment in a passivation solution for 3 to 8 minutes.

[0068] Furthermore, the passivation solution may be, but is not limited to, one or more selected from chromium-free passivation solutions, trivalent chromium passivation solutions, and hexavalent chromium passivation solutions.

[0069] Preferably, the passivation solution is a chromium-free passivation solution.

[0070] In a preferred example, the passivation treatment time is 5 to 7 minutes. Specifically, the passivation treatment time can be, but is not limited to, 5 minutes, 6 minutes, or 7 minutes.

[0071] Furthermore, the above cleaning method removes dirt and oxides from the workpiece surface without excessively corroding the surface texture.

[0072] The following specific embodiments further illustrate the silver-containing composite paste and its preparation method of the present invention in detail. Unless otherwise specified, all raw materials involved in the following specific embodiments are commercially available. The copper material is formed by hot pressing and rolling processes of TU1 oxygen-free copper and molybdenum copper, and the copper surface roughness is Ra0.5–1.4.

[0073] Example 1

[0074] This embodiment provides a double-sided grinding method for multilayer copper materials. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, consist of 24.53% resin binder, 71.27% silicon carbide, and 4.20% stabilizer. The resin binder is an acetal resin with a viscosity of 8 mPa·s, and the stabilizer is polyvinyl alcohol. The method includes the following steps:

[0075] The upper and lower grinding discs are used simultaneously to grind the multi-layered copper material sequentially. The grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The grinding parameters for each grinding are as follows:

[0076] The parameters for the first double-sided grinding are as follows: initial pressure of 800N, initial grinding disc speed of 10Hz, initial planetary wheel speed of 5Hz, and initial grinding time of 8s.

[0077] The parameters for the second double-sided grinding are as follows: second pressure of 1000N, second grinding disc rotation speed of 20Hz, second planetary wheel rotation speed of 10Hz, and second grinding time of 10s.

[0078] The parameters for the third double-sided grinding are as follows: third pressure of 1800N, third grinding disc speed of 20Hz, third planetary wheel speed of 10Hz, and third grinding time of 110s.

[0079] The parameters for the fourth double-sided grinding include: a fourth pressure of 800N, a fourth grinding speed of 10HZ, and a fourth grinding time of 8s. After the grinding process, the process also includes cleaning with a cleaning agent with pH 0.8 to 1.3 for 10 to 25s and passivation in a chromium-free passivation solution for 5 to 7 minutes.

[0080] Example 2

[0081] This embodiment provides a double-sided grinding method for multilayer copper materials. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, consist of 24.53% resin binder, 71.27% silicon carbide, and 4.20% stabilizer. The resin binder is an acetal resin with a viscosity of 8 mPa·s, and the stabilizer is polyvinyl alcohol. The method includes the following steps:

[0082] The upper and lower grinding discs are used simultaneously to grind the multi-layered copper material sequentially. The grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The grinding parameters for each grinding are as follows:

[0083] The parameters for the first double-sided grinding are as follows: initial pressure of 800N, initial grinding disc speed of 10Hz, initial planetary wheel speed of 5Hz, and initial grinding time of 8s.

[0084] The parameters for the second double-sided grinding are as follows: second pressure of 1000N, second grinding disc rotation speed of 20Hz, second planetary wheel rotation speed of 10Hz, and second grinding time of 10s.

[0085] The parameters for the third double-sided grinding are as follows: third pressure of 1800N, third grinding disc speed of 20Hz, third planetary wheel speed of 10Hz, and third grinding time of 120s.

[0086] The parameters for the fourth double-sided grinding include: a fourth pressure of 800N, a fourth grinding speed of 10HZ, and a fourth grinding time of 8s. After the grinding process, the process also includes cleaning with a cleaning agent with pH 0.8 to 1.3 for 10 to 25s and passivation in a chromium-free passivation solution for 5 to 7 minutes.

[0087] Comparative Example 1

[0088] The difference between Comparative Example 1 and Example 1 lies in the composition of the grinding disc and the time of the third grinding.

[0089] This comparative example provides a double-sided grinding method for multilayer copper materials. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, consist of 31.29% resin binder, 65.66% silicon carbide, and 3.05% stabilizer. The resin binder is an acetal resin with a viscosity of 8 mPa·s, and the stabilizer is polyvinyl alcohol. The method includes the following steps:

[0090] The upper and lower grinding discs are used simultaneously to grind the multi-layered copper material sequentially. The grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The grinding parameters for each grinding are as follows:

[0091] The parameters for the first double-sided grinding are as follows: initial pressure of 800N, initial grinding disc speed of 10Hz, initial planetary wheel speed of 5Hz, and initial grinding time of 8s.

[0092] The parameters for the second double-sided grinding are as follows: second pressure of 1000N, second grinding disc rotation speed of 20Hz, second planetary wheel rotation speed of 10Hz, and second grinding time of 10s.

[0093] The parameters for the third double-sided grinding are as follows: third pressure of 1800N, third grinding disc speed of 20Hz, third planetary wheel speed of 10Hz, and third grinding time of 330s.

[0094] The parameters for the fourth double-sided grinding include: a fourth pressure of 800N, a fourth grinding disc speed of 10HZ, and a fourth grinding time of 8s. After the grinding process, the process also includes cleaning with a cleaning agent with pH 0.8 to 1.3 for 10 to 25s and passivation in a chromium-free passivation solution for 5 to 7 minutes.

[0095] Comparative Example 2

[0096] The difference between Comparative Example 2 and Example 2 is that the order of the second and third grinding is reversed.

[0097] This comparative example provides a double-sided grinding method for multilayer copper materials. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, consist of 24.53% resin binder, 71.27% silicon carbide, and 4.20% stabilizer. The resin binder is an acetal resin with a viscosity of 8 mPa·s, and the stabilizer is polyvinyl alcohol. The method includes the following steps:

[0098] The upper and lower grinding discs are used simultaneously to grind the multi-layered copper material sequentially. The grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The grinding parameters for each grinding are as follows:

[0099] The parameters for the first double-sided grinding are as follows: initial pressure of 800N, initial grinding disc speed of 10Hz, initial planetary wheel speed of 5Hz, and initial grinding time of 8s.

[0100] The parameters for the second double-sided grinding are as follows: second pressure of 1800N, second grinding disc rotation speed of 20Hz, second planetary wheel rotation speed of 10Hz, and second grinding time of 120s.

[0101] The parameters for the third double-sided grinding are as follows: third pressure of 1000N, third grinding disc speed of 20Hz, third planetary wheel speed of 10Hz, and third grinding time of 10s.

[0102] The parameters for the fourth double-sided grinding include: a fourth pressure of 800N, a fourth grinding disc speed of 10HZ, and a fourth grinding time of 8s. After the grinding process, the process also includes cleaning with a cleaning agent with pH 0.8 to 1.3 for 10 to 25s and passivation in a chromium-free passivation solution for 5 to 7 minutes.

[0103] Comparative Example 3

[0104] The difference between Comparative Example 3 and Example 2 is that the rotational speed of the planetary wheel was set in the fourth grinding.

[0105] This comparative example provides a double-sided grinding method for multilayer copper materials. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, consist of 24.53% resin binder, 71.27% silicon carbide, and 4.20% stabilizer. The resin binder is an acetal resin with a viscosity of 8 mPa·s, and the stabilizer is polyvinyl alcohol. The method includes the following steps:

[0106] The upper and lower grinding discs are used simultaneously to grind the multi-layered copper material sequentially. The grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The grinding parameters for each grinding are as follows:

[0107] The parameters for the first double-sided grinding are as follows: initial pressure of 800N, initial grinding disc speed of 10Hz, initial planetary wheel speed of 5Hz, and initial grinding time of 8s.

[0108] The parameters for the second double-sided grinding are as follows: second pressure of 1000N, second grinding disc rotation speed of 20Hz, second planetary wheel rotation speed of 10Hz, and second grinding time of 10s.

[0109] The parameters for the third double-sided grinding are as follows: third pressure of 1800N, third grinding disc speed of 20Hz, third planetary wheel speed of 10Hz, and third grinding time of 120s.

[0110] The parameters for the fourth double-sided grinding include: a fourth pressure of 800N, a fourth grinding disc speed of 10HZ, a fourth planetary wheel speed of 5HZ, and a fourth grinding time of 8s. After the grinding process, the process also includes cleaning with a cleaning agent with pH 0.8 to 1.3 for 10 to 25s and passivation in a chromium-free passivation solution for 5 to 7 minutes.

[0111]

[0112]

[0113] A roughness inspection was performed on randomly selected products after grinding. The roughness characterization of copper materials after grinding using both conventional market methods and the grinding method provided by this invention is shown in the table below.

[0114]

[0115] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0116] The above-described embodiments are merely illustrative of several implementation methods of the present invention, facilitating a detailed and specific understanding of the technical solutions of the present invention. However, they should not be construed as limiting the scope of protection of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the scope of protection of the present invention. It should be understood that technical solutions obtained by those skilled in the art based on the technical solutions provided by the present invention through logical analysis, reasoning, or limited experimentation are all within the scope of protection of the appended claims. Therefore, the scope of protection of this invention patent should be determined by the content of the appended claims, and the specification can be used to interpret the content of the claims.

Claims

1. A method for double-sided grinding of multilayer copper materials, characterized in that, Includes the following steps: The multi-layered copper material is simultaneously ground using an upper and lower grinding disc, and the grinding process includes a first double-sided grinding, a second double-sided grinding, a third double-sided grinding, and a fourth double-sided grinding. The raw materials of the upper grinding disc and the components of the lower grinding disc, by weight percentage, include: 20%~30% acetal resin, 65%~75% silicon carbide, and 2%~6% polyvinyl alcohol. The parameters for the first double-sided grinding include: a first pressure of 600N~1200N, a first grinding disc rotation speed of 1 Hz~15Hz, a first planetary wheel rotation speed of 1Hz~10 Hz, and a first grinding time of 1s~15s. The parameters for the second double-sided grinding include: a second pressure of 800N~1700N, a second grinding disc rotation speed of 5 Hz~35Hz, a second planetary wheel rotation speed of 5Hz~25 Hz, and a second grinding time of 5s~15s. The parameters for the third double-sided grinding include: a third pressure of 1300N~2600N, a third grinding disc rotation speed of 15 Hz~35Hz, a third planetary wheel rotation speed of 5Hz~25 Hz, and a third grinding time of 50s~400s. The parameters for the fourth double-sided grinding include: the fourth pressure is 600N~1200N, the fourth grinding disc speed is 5 Hz~25Hz, and the fourth grinding time is 1s~15s; The multilayer copper material includes one of copper-molybdenum copper, copper-diamond, and copper-molybdenum.

2. The double-sided grinding method as described in claim 1, characterized in that, The viscosity of acetal resin is 3 mPa·s to 14 mPa·s.

3. The double-sided grinding method as described in claim 1, characterized in that, The first planetary wheel rotates at a speed of 1 Hz to 8 Hz, and the first grinding time is 5 s to 10 s.

4. The double-sided grinding method as described in claim 1, characterized in that, The second planetary wheel rotates at a speed of 10 Hz to 20 Hz, and the second grinding time is 6 s to 12 s.

5. The double-sided grinding method as described in claim 1, characterized in that, The third planetary wheel rotates at a speed of 10 Hz to 20 Hz, and the third grinding time is 100 s to 360 s.

6. The double-sided grinding method as described in claim 1, characterized in that, The fourth grinding time is 4s to 10s.

7. The double-sided grinding method according to any one of claims 1 to 6, characterized in that, The grinding process is followed by cleaning and passivation steps.

8. The double-sided grinding method as described in claim 7, characterized in that, The cleaning conditions include cleaning in a solution with a pH of 0.8 to 1.3 for 5 to 30 seconds.

9. The double-sided grinding method as described in claim 7, characterized in that, The passivation conditions include passivation treatment in a passivation solution for 3 to 8 minutes.

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