Organic silicon leveling agent and preparation method thereof, black matrix photosensitive resin composition, color filter and liquid crystal display device

Abstract

The present application provides an organosilicon leveling agent and a preparation method thereof, a black matrix photosensitive resin composition, a color filter and a liquid crystal display device, and relates to the field of materials. The general structural formula of the organosilicon leveling agent is: The preparation method thereof comprises: reacting a siloxane compound and a furan cyclopropene-containing ester in the presence of a catalyst and an inhibitor, and then adding an propylene polyether compound to react; after the reaction, adjusting the pH of the system to hydrolyze the silane ether to obtain a silanol, and then dripping acryloyl chloride to react to obtain an organosilicon leveling agent. The black matrix photosensitive resin composition comprises an organosilicon leveling agent. The raw materials of the color filter include a black matrix photosensitive resin composition. The liquid crystal display device includes a color filter. The organosilicon leveling agent provided in the present application can provide an excellent leveling effect in a photoresist with a high concentration of black pigment, and can still provide a good leveling effect after development, reducing the defects of roughness and poor uniformity of the coating film during the post-baking process.

Description

Technical Field

[0001] The present application relates to the field of materials, and in particular to an organic silicon leveling agent and a preparation method thereof, a black matrix photosensitive resin composition, a color filter and a liquid crystal display device. Background Art

[0002] Color filter is a key component for TFT-LCD (thin film transistor liquid crystal display) to realize color display. Usually, black photoresist is first applied on the surface of transparent substrates such as glass to form a black matrix, and then pixels of different color photoresists such as R, G, B are formed in a grid-like, striped pattern. Among them, the black matrix BM can prevent R, G, B color pixels from mixing with each other, as well as block and absorb internal and external light to maintain the necessary color saturation and contrast of the color filter, which requires BM to have a high light shielding degree. In order to achieve the target light shielding degree with a thinner film thickness as much as possible, it is usually to increase the proportion of black pigment in the black matrix photosensitive resin composition, which correspondingly reduces other components except black pigment, which can cause the following problems: increased viscosity, poor coating, uneven film thickness, and rough surface.

[0003] Leveling agent is an effective means to solve the above problems. In the existing technology, polyether modified silicone leveling agent is often used. For example, CN112111065A discloses a polyether modified silicone leveling agent structure and a preparation method thereof, which has good defoaming and foam suppression functions in water-based coatings, and also has excellent properties of no cracking, no stickiness, and no shrinkage cavities, but is not applicable in organic systems. CN105315757B discloses a polyether polyester modified silicone leveling agent structure and a preparation method thereof, which can effectively reduce surface tension in both organic coatings and water-based coatings and provide good leveling properties. In addition, CN112831003B discloses a polyether modified silicone leveling agent with an anchoring group and a fluorocarbon side chain and a preparation method thereof, which is prepared by allyl polyether, fluoroacrylate, acrylamide and hydrogen-containing silicone oil through a silylation reaction. The leveling agent has good affinity for pigments, a significant leveling effect, and can effectively eliminate shrinkage cavities.

[0004] The working principle of the leveling agent used in photoresist is as follows: the leveling agent is enriched on the surface of the photoresist solution, reducing the surface tension and increasing the spreadability of the coating. However, the surface-enriched leveling agent is easily washed away during the development process, and only a small amount of residue remains after development. Therefore, the leveling effect of conventional leveling agents is greatly reduced after development, and the surface roughness is difficult to eliminate during the post-baking process.

[0005] Therefore, it is necessary to develop a material that can still provide effective leveling effect during the post-baking flow process. Summary of the invention

[0006] The purpose of the present application is to provide an organic silicone leveling agent and a preparation method thereof, a black matrix photosensitive resin composition, a color filter and a liquid crystal display device to solve the above problems.

[0007] To achieve the above objectives, this application adopts the following technical solutions:

[0008] An organosilicon leveling agent, the general structural formula of which is:

[0009]

[0010] Wherein, a is any integer from 4 to 30, b is any integer from 0 to 10, m is any integer from 4 to 20, n is any integer from 2 to 10, and p is any integer from 4 to 20.

[0011] Preferably, m is any integer from 4 to 10, n is any integer from 2 to 6, and p is any integer from 4 to 10;

[0012] Preferably, m:n:p=4:2:4 or m:n:p=8:4:8.

[0013] The present application also provides a method for preparing the organosilicon leveling agent, comprising:

[0014] The siloxane compound and benzofuran cyclopropene are subjected to a first reaction in the presence of a catalyst and a polymerization inhibitor, and then an propylene polyether compound is added to carry out a second reaction;

[0015] After the second reaction is completed, the pH of the system is adjusted to hydrolyze the silane ether to obtain silanol, and then acryloyl chloride is added dropwise to carry out a third reaction to obtain the organosilicon leveling agent.

[0016] Preferably, the siloxane compound comprises siloxane C 20 H 65 O 13 Si 12 and / or Siloxane C 34 H 113 O 23 Si 22 ;

[0017] Preferably, the acryl polyether compound includes acryl polyether C 49 H 98 O 21 ;

[0018] Preferably, the catalyst comprises chloroplatinic acid;

[0019] Preferably, the polymerization inhibitor comprises hydroquinone.

[0020] The present application also provides a black matrix photosensitive resin composition, including the organic silicon leveling agent;

[0021] Preferably, the amount of the organosilicon leveling agent is 0.01wt%-1wt% of the total solid content of the black matrix photosensitive resin composition, preferably 0.01wt%-0.2wt%.

[0022] Preferably, the black matrix photosensitive resin composition further comprises an alkali-soluble resin, a photopolymerizable monomer, a photoinitiator, a colorant and a solvent;

[0023] Preferably, the black matrix photosensitive resin composition further comprises a curing accelerator, a coupling agent, an antioxidant, a polymerization inhibitor, and a defoaming agent; the coupling agent is preferably a silane coupling agent.

[0024] Preferably, the amount of the alkali-soluble resin is 10wt%-30wt% of the total solid content of the black matrix photosensitive resin composition;

[0025] Preferably, the alkali-soluble resin includes a resin having a hydroxyl group, a carboxyl group, a phosphoric acid group, or a sulfonic acid group, preferably having a carboxyl group, and more preferably having both an ethylenically unsaturated group and a carboxyl group;

[0026] Preferably, the alkali-soluble resin comprises a fluorene resin, preferably a bisphenol fluorene resin;

[0027] Preferably, the bisphenol fluorene resin is one or more of the photosensitive resins containing unsaturated groups obtained by reacting a reaction product of an epoxy compound having two glycidyl ether groups derived from bisphenol fluorene with (meth) acrylic acid and a polycarboxylic acid or anhydride thereof;

[0028] Preferably, the general structural formula of the epoxy compound having two glycidyl ether groups derived from bisphenol fluorene is:

[0029]

[0030] Wherein, R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom, and x and y are each independently 0 or 1;

[0031] Preferably, the epoxy compound having two glycidyl ether groups derived from bisphenol fluorene is obtained by etherification reaction of a bisphenol compound with a halogenated alkoxy compound;

[0032] Preferably, the bisphenol compound includes bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl) Dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy- 3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxy-3,5-dichlorophenyl)ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene, 9 ,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol or one or more thereof; preferably a bisphenol compound having a fluorene-9,9-diyl group;

[0033] Preferably, the polycarboxylic acid or its anhydride comprises succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid, cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornanedicarboxylic acid or its monoanhydride;

[0034] Preferably, the average molecular weight M of the bisphenol fluorene resin is w The average molecular weight of the bisphenol fluorene resin is 4000-20000 and the acid value is 30mgKOH / g-200mgKOH / g; more preferably, the average molecular weight M of the bisphenol fluorene resin is w The molecular weight of the polyol is 4000-8000, and the acid value is 30mgKOH / g-100mgKOH / g.

[0035] Preferably, the amount of the photopolymerizable monomer is 5wt%-25wt% of the total solid content of the black matrix photosensitive resin composition;

[0036] Preferably, the photopolymerizable monomer is selected from one or more of pentaerythritol triacrylate, pentaerythritol tetraacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, and ethylene oxide-modified dipentaerythritol hexaacrylate; preferably polydipentaerythritol hexaacrylate;

[0037] Preferably, the amount of the photoinitiator is 0.5wt%-5wt% of the total solid content of the black matrix photosensitive resin composition;

[0038] Preferably, the photoinitiator is selected from one or more of benzoin derivatives, benzil derivatives, dialkoxyacetophenone, α-hydroxyalkyl phenone, α-aminoalkyl phenone, acylphosphine oxide, oxime ester compounds, benzoylformate, benzophenone, thioxanthone, and camphorquinone; preferably oxime ester compounds;

[0039] Preferably, the amount of the colorant is 30wt%-60wt% of the total solid content of the black matrix photosensitive resin composition;

[0040] Preferably, the photoresist film formed by curing the black matrix photosensitive resin composition has an optical density of not less than 3.8 with a film thickness of 1 μm;

[0041] Preferably, the colorant is a carbon black pigment, which is obtained by mixing and grinding raw materials including carbon black, a dispersant, a dispersing resin and a solvent, and then adding a solvent for dilution;

[0042] Preferably, the amount of the solvent is 60wt%-85wt% of the total mass of the black matrix photosensitive resin composition;

[0043] Preferably, the solvent is selected from one or more of propylene glycol methyl ether acetate, propylene glycol methyl ether, ethyl ethoxypropionate, dipropylene glycol methyl ether acetate, 3-methoxybutyl acetate, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and propylene glycol diacetate; preferably propylene glycol methyl ether acetate.

[0044] The present application also provides a color filter, the raw materials of which include the black matrix photosensitive resin composition.

[0045] The present application also provides a liquid crystal display device, comprising the color filter.

[0046] Compared with the prior art, the beneficial effects of this application include:

[0047] The organosilicon leveling agent provided in the present application has an unsaturated double bond at its terminal group, and its side chain is copolymerized with allyl polyether and benzofuran cyclopropylene ester; it can effectively reduce surface tension and enhance coating properties. It can still provide good coating properties under high concentration of carbon black; the organosilicon leveling agent contains unsaturated double bonds, so it forms weak crosslinks during exposure, and the leveling agent is not washed off during development. The post-baking process can also provide leveling effects, effectively solving the problems of rough surface and uneven film thickness.

[0048] The black matrix photosensitive resin composition provided in the present application can provide a black matrix with a smooth surface and excellent film thickness uniformity.

[0049] The color filter and liquid crystal display device provided in this application have high yield rate and stable and excellent product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope of the present application.

[0051] Figure 1 GPC test chart of synthetic A1 of Example 1;

[0052] Figure 2 GPC test chart of synthetic A2 of Example 2;

[0053] Figure 3 GPC test chart of synthetic A3 of Example 3;

[0054] Figure 4 Example 6 contact angle test diagram;

[0055] Figure 5 Example 7 contact angle test diagram;

[0056] Figure 6 Comparative Example 1: Contact angle test diagram;

[0057] Figure 7 Contact angle test diagram of comparative example 2. DETAILED DESCRIPTION

[0058] As used herein:

[0059] "Prepared from" is synonymous with "comprising." As used herein, the terms "comprising," "including," "having," "containing," or any other variation thereof, are intended to cover a non-exclusive inclusion. For example, a composition, process, method, article, or apparatus that comprises the listed elements is not necessarily limited to only those elements but may include other elements not expressly listed or inherent to such composition, process, method, article, or apparatus.

[0060] The conjunction "consisting of excludes any unspecified element, step, or component. If used in a claim, this phrase renders the claim closed-ended so that it does not include materials other than those described, except for conventional impurities associated therewith. When the phrase "consisting of" appears in a clause of the body of a claim rather than immediately following the subject matter, it limits only the elements described in that clause; other elements are not excluded from the claim as a whole.

[0061] When an amount, concentration, or other value or parameter is expressed as a range, a preferred range, or a range defined by a series of upper preferred values ​​and lower preferred values, this should be understood as specifically disclosing all ranges formed by any pairing of any range upper limit or preferred value with any range lower limit or preferred value, regardless of whether the range is disclosed separately. For example, when a range of "1 to 5" is disclosed, the described range should be interpreted as including ranges "1 to 4", "1 to 3", "1 to 2", "1 to 2 and 4 to 5", "1 to 3 and 5", etc. When a numerical range is described in this article, unless otherwise stated, the range is intended to include its end values ​​and all integers and fractions within the range.

[0062] In these examples, parts and percentages are by mass unless otherwise indicated.

[0063] "Parts by mass" refers to the basic unit of measurement for expressing the mass ratio of multiple components. 1 part can represent any unit mass, such as 1g or 2.689g. If we say that the mass of component A is a parts and the mass of component B is b parts, it means the ratio of the mass of component A to the mass of component B is a:b. Alternatively, it means that the mass of component A is aK and the mass of component B is bK (K is an arbitrary number, indicating a multiple factor). It should not be misunderstood that, unlike the mass parts, the sum of the mass of all components is not limited to 100 parts.

[0064] "And / or" is used to indicate that one or both of the stated situations may occur, for example, A and / or B includes (A and B) and (A or B).

[0065] An organosilicon leveling agent, the general structural formula of which is:

[0066]

[0067] Among them, the polymerization degree a of C2H4O-structure (hereinafter referred to as EO) is any integer from 4 to 30, the polymerization degree b of C3H6O-structure (hereinafter referred to as PO) is any integer from 0 to 10, m is any integer from 4 to 20, n is any integer from 2 to 10, and p is any integer from 4 to 20.

[0068] In an optional embodiment, m is any integer from 4 to 10, n is any integer from 2 to 6, and p is any integer from 4 to 10;

[0069] In an optional embodiment, m:n:p=4:2:4 or m:n:p=8:4:8.

[0070] 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, b may be any one of 0, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, m may be any one of 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, n may be any one of 2, 3, 4, 5, 6, 7, 8, 9, 10, and p may be any one of 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20.

[0071] The present application also provides a method for preparing the organosilicon leveling agent, comprising:

[0072] The siloxane compound and benzofuran cyclopropene are subjected to a first reaction in the presence of a catalyst and a polymerization inhibitor, and then an propylene polyether compound is added to carry out a second reaction;

[0073] After the second reaction is completed, the pH of the system is adjusted to hydrolyze the silane ether to obtain silanol, and then acryloyl chloride is added dropwise to carry out a third reaction to obtain the organosilicon leveling agent.

[0074] The reaction equation is as follows:

[0075]

[0076] In an optional embodiment, the siloxane compound includes siloxane C 20 H 65 O 13 Si 12 and / or Siloxane C 34 H 113 O 23 Si 22 ;

[0077] In an optional embodiment, the acryl polyether compound includes acryl polyether C 49 H 98 O 21 ;

[0078] In an alternative embodiment, the catalyst comprises chloroplatinic acid;

[0079] In an optional embodiment, the polymerization inhibitor includes hydroquinone.

[0080] The present application also provides a black matrix photosensitive resin composition, including the organic silicon leveling agent;

[0081] In an optional embodiment, the amount of the organosilicon leveling agent is 0.01 wt%-1 wt% of the total solid content of the black matrix photosensitive resin composition, preferably 0.01 wt%-0.2 wt%.

[0082] Optionally, the amount of the silicone leveling agent can be 0.01wt%, 0.05wt%, 0.1wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.6wt%, 0.7wt%, 0.8wt%, 0.9wt%, 1wt% or any value between 0.01wt% and 1wt% of the total solid content of the black matrix photosensitive resin composition.

[0083] In an optional embodiment, the black matrix photosensitive resin composition further comprises an alkali-soluble resin, a photopolymerizable monomer, a photoinitiator, a colorant and a solvent;

[0084] In an optional embodiment, the black matrix photosensitive resin composition further comprises a curing accelerator, a coupling agent, an antioxidant, a polymerization inhibitor, and a defoaming agent; the coupling agent is preferably a silane coupling agent.

[0085] In an optional embodiment, the amount of the alkali-soluble resin is 10wt%-30wt% of the total solid content of the black matrix photosensitive resin composition;

[0086] Optionally, the amount of the alkali-soluble resin may be 10wt%, 15wt%, 20wt%, 25wt%, 30wt% or any value between 10wt% and 30wt% of the total solid component mass of the black matrix photosensitive resin composition;

[0087] In an optional embodiment, the alkali-soluble resin includes a resin having a hydroxyl group, a carboxyl group, a phosphoric acid group, or a sulfonic acid group, preferably having a carboxyl group, and more preferably having both an ethylenically unsaturated group and a carboxyl group;

[0088] In order to dissolve the unexposed part in the alkaline developer and to leave the unexposed part during the development process, it is generally required that the solubility of the exposed and unexposed parts of the resin composition coating film in the alkaline developer changes after exposure.

[0089] In an optional embodiment, the alkali-soluble resin includes a fluorene resin, preferably a bisphenol fluorene resin;

[0090] The fluorene resin mentioned above can be obtained from any source and can be obtained by purchasing commercial products or prepared by a publicly available method, such as Japanese Patent Application Publication No. 8-278629 and Chinese Patent Application No. CN106397752B.

[0091] In an optional embodiment, the bisphenol fluorene resin is one or more of the photosensitive resins containing unsaturated groups obtained by reacting a reactant of an epoxy compound having two glycidyl ether groups derived from bisphenol fluorene with (meth) acrylic acid and a polycarboxylic acid or anhydride thereof;

[0092] It should be noted that the above-mentioned "(meth)acrylic acid" is a general term for acrylic acid and methacrylic acid, and may refer to one or both of them.

[0093] In an optional embodiment, the general structural formula of the epoxy compound having two glycidyl ether groups derived from bisphenol fluorene is:

[0094]

[0095] Wherein, R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom, and x and y are each independently 0 or 1;

[0096] In an optional embodiment, the epoxy compound having two glycidyl ether groups derived from bisphenol fluorene is obtained by etherification reaction of a bisphenol compound with a halogenated alkoxy compound;

[0097] In an optional embodiment, the bisphenol compound includes bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5- bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3,5-dibromophenyl)propane 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxy-3,5-dichlorophenyl)ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9-bis(4-hydroxy-3-bromophenyl)fluorene , 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, 3,3'-biphenol or more; preferably a bisphenol compound having a fluorene-9,9-diyl group;

[0098] In an optional embodiment, the polycarboxylic acid or its anhydride includes succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid, cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornanedicarboxylic acid or its monoanhydride;

[0099] In an optional embodiment, the average molecular weight M of the bisphenol fluorene resin is w The average molecular weight of the bisphenol fluorene resin is 4000-20000 and the acid value is 30mgKOH / g-200mgKOH / g; more preferably, the average molecular weight M of the bisphenol fluorene resin is w The molecular weight of the polyol is 4000-8000, and the acid value is 30mgKOH / g-100mgKOH / g.

[0100] In an optional embodiment, the amount of the photopolymerizable monomer is 5wt%-25wt% of the total solid content of the black matrix photosensitive resin composition;

[0101] Optionally, the amount of the photopolymerizable monomer may be 5wt%, 10wt%, 15wt%, 20wt%, 25wt% or any value between 5wt% and 25wt% of the total solid component mass of the black matrix photosensitive resin composition;

[0102] In an optional embodiment, the photopolymerizable monomer is selected from one or more of pentaerythritol triacrylate (abbreviated as PETA, CAS No.: 3524-68-3), pentaerythritol tetraacrylate (abbreviated as PETTA, CAS No.: 4986-89-4), polydipentaerythritol pentaacrylate (abbreviated as DPEPA, CAS No.: 60506-81-2), polydipentaerythritol hexaacrylate (abbreviated as DPHA, CAS No.: 29570-58-9), and ethylene oxide-modified dipentaerythritol hexaacrylate (abbreviated as DPEA-12); preferably polydipentaerythritol hexaacrylate;

[0103] In an optional embodiment, the amount of the photoinitiator is 0.5wt%-5wt% of the total solid content of the black matrix photosensitive resin composition;

[0104] Optionally, the amount of the photoinitiator can be 0.5wt%, 1wt%, 1.5wt%, 2wt%, 2.5wt%, 3wt%, 3.5wt%, 4wt%, 4.5wt%, 5wt% or any value between 0.5wt% and 5wt% of the total solid component mass of the black matrix photosensitive resin composition;

[0105] In an optional embodiment, the photoinitiator is selected from one or more of benzoin derivatives, benzil derivatives, dialkoxyacetophenones, α-hydroxyalkyl phenones, α-aminoalkyl phenones, acylphosphine oxides, oxime ester compounds, benzoylformate, benzophenone, thioxanthone, and camphorquinone; preferably oxime ester compounds;

[0106] In an optional embodiment, the amount of the colorant is 30wt%-60wt% of the total solid content of the black matrix photosensitive resin composition;

[0107] Colorants are light-shielding substances, and their content should be determined according to the required light-shielding degree.

[0108] Optionally, the amount of the colorant may be 30wt%, 40wt%, 50wt%, 60wt% or any value between 30wt% and 60wt% of the total solid component mass of the black matrix photosensitive resin composition;

[0109] In an optional embodiment, the photoresist film formed by curing the black matrix photosensitive resin composition has an optical density of not less than 3.8 with a film thickness of 1 μm;

[0110] In an optional embodiment, the colorant is a carbon black pigment dispersion, which is obtained by mixing and grinding raw materials including carbon black, a dispersant, a dispersing resin, and a solvent, and further diluting the mixture by adding a solvent;

[0111] The source of carbon black is not limited and can be obtained by purchasing commercial products. Specific examples include: DIAGRAM BLACKII, DIAGRAMBLACK N339, DIAGRAM BLACK SH, DIAGRAM BLACK H, DIAGRAM LH, DIAGRAM HA, DIAGRAM SF, DIAGRAM N550M, DIAGRAM M, DIAGRAM E, DIAGRAM G, DIAGRAM R, DIAGRAMN760M, DIAGRAM LR, #2700, #2600, #2350, #2300, #2200, #1000, #980, #900, MCF88, #52, #50, #47, #45, #45L, #25, #CF9, #95, #3030, #3050, MA7, MA77, MA8, MA11, OIL7B, OIL9B, OIL11B, OIL30B and OIL31B (by Mitsubishi Chemical Corporation); PRINTEX-U, PRINTEX-V, PRINTEX-140U, PRINTEX-140V, PRINTEX-95, PRINTEX-85, PRINTEX-75, PRINTEX-55, PRINTEX-45, PRINTEX-300, PRINTEX-35, PRINTEX-25, PRINTEX-200, PRINTEX-40, PRINTEX-30, PRINTEX-3, PRINTEX-A, SPECIAL BLACK-550, SPECIAL BLACK-350, SPECIAL BLACK-250, SPECIAL BLACK-100 and LAMP BLACK-101 (produced by Degussa Japan Co., Ltd.); they can be used alone or in combination.

[0112] In an optional embodiment, the amount of the solvent is 60wt%-85wt% of the total mass of the black matrix photosensitive resin composition;

[0113] Optionally, the amount of the solvent may be 60wt%, 65wt%, 70wt%, 75wt%, 80wt%, 85wt% or any value between 60wt% and 85wt% of the total mass of the black matrix photosensitive resin composition;

[0114] In an optional embodiment, the solvent is selected from one or more of PMA (propylene glycol methyl ether acetate), PM (propylene glycol methyl ether), EEP (ethyl ethoxypropionate), DPMA (dipropylene glycol methyl ether acetate), 3MBA (3-methoxybutyl acetate), DBDG (diethylene glycol dibutyl ether), DMDG (diethylene glycol dimethyl ether), EDM (diethylene glycol methyl ethyl ether), and PGDA (propylene glycol diacetate); preferably propylene glycol methyl ether acetate.

[0115] The present application also provides a color filter, the raw materials of which include the black matrix photosensitive resin composition.

[0116] The present application also provides a liquid crystal display device, comprising the color filter.

[0117] The embodiments of the present application will be described in detail below in conjunction with specific examples, but it will be appreciated by those skilled in the art that the following examples are only used to illustrate the present application and should not be considered as limiting the scope of the present application. If specific conditions are not specified in the examples, they are carried out according to normal conditions or the conditions recommended by the manufacturer. If the manufacturer is not specified for the reagents or instruments used, they are all conventional products that can be purchased commercially.

[0118] Example 1

[0119] This embodiment provides an organosilicon leveling agent, and the preparation method thereof is as follows:

[0120] Add 8.50g of Siloxane C into a four-necked flask. 20 H 65 O 13 Si 12 (m:n:p=4:2:4), 3.76g benzofuran cyclopropene ester C 11 H8O3, add chloroplatinic acid catalyst (2wt% chloroplatinic acid isopropanol solution) and inhibitor (hydroquinone), keep nitrogen flowing for 10 minutes, stir at a speed of 150-200r / min, heat to 80℃ and react at a constant temperature for 6 hours. After the reaction is completed, raise the temperature to 120℃. Add more catalyst and inhibitor, and drop 40.92g of propylene polyether C 49 H 98 O21 (EO / PO=15:5), continue to maintain a constant temperature of 120℃ for 4h and then cool naturally to room temperature. After the flask cools to room temperature, prepare an ice bath to keep its temperature range at 0~5℃, slowly adjust the pH to weak acidity 5~6 with malonic acid to promote the hydrolysis of silane ether to silanol, and continue to drop 1.8g of acryloyl chloride. After the dropwise addition is completed, start to heat slowly, and keep the temperature at 40℃ for 3h. Cool down, remove low boiling points under reduced pressure, and purify the product to obtain modified silicone A1.

[0121] Modified silicone A1 was confirmed by mass spectrometry and GPC: MS (m / z): 5369M + ; GPC measured weight average molecular weight M w =5997.

[0122] Example 1 The GPC test chart of the synthetic compound A1 is as follows Figure 1 shown.

[0123] Example 2

[0124] This embodiment provides an organosilicon leveling agent, and the preparation method thereof is as follows:

[0125] Add 15.08 g of Siloxane C into a four-necked flask. 34 H 113 O 23 Si 22 (m:n:p=8:4:8), 7.52g benzofuran cyclopropene ester C 11 H8O3, add chloroplatinic acid catalyst (2wt% chloroplatinic acid isopropanol solution) and inhibitor (hydroquinone), keep nitrogen flowing for 10 minutes, stir at a speed of 150-200r / min, heat to 90℃ and react at a constant temperature for 8 hours. After the reaction is completed, raise the temperature to 120℃. Add more catalyst and inhibitor, and drop 81.84g of propylene polyether C 49 H 98 O 21 (EO / PO=15:5), continue to maintain a constant temperature of 120℃ for 8h and then cool naturally to room temperature. After the flask cools to room temperature, prepare an ice bath to keep its temperature range at 0~5℃, slowly adjust the pH to weak acidity 5~6 with malonic acid to promote the hydrolysis of silyl ether to silanol, and continue to drop 1.8g of acryloyl chloride. After the addition is completed, start heating slowly, and keep the temperature at 40℃ for 3h. Cool down, remove low boiling points under reduced pressure, and purify the product to obtain modified silicone A2.

[0126] Modified silicone A2 was confirmed by mass spectrometry and GPC: MS (m / z): 10493M + ; GPC measured weight average molecular weight M w =11017.

[0127] Example 2 The GPC test chart of the synthetic compound A2 is as follows Figure 2 shown.

[0128] Example 3

[0129] This embodiment provides an organosilicon leveling agent, and the preparation method thereof is as follows:

[0130] Add 15.08 g of Siloxane C into a four-necked flask. 34 H 113 O 23 Si 22 (m:n:p=8:4:8), 7.52g benzofuran cyclopropene ester C 11 H8O3, add chloroplatinic acid catalyst (2wt% chloroplatinic acid isopropanol solution) and inhibitor (hydroquinone), keep nitrogen flowing for 10 minutes, stir at a speed of 150-200r / min, heat to 90℃ and react at a constant temperature for 8 hours. After the reaction is completed, raise the temperature to 120℃. Add more catalyst and inhibitor, and drop 87.44g of propylene polyether C 49 H 98 O 21 (EO / PO=10:10), keep the constant temperature at 120℃ for 4h and then cool naturally to room temperature. After the flask cools to room temperature, prepare an ice bath to keep the temperature range at 0~5℃, slowly adjust the pH to 5~6 with malonic acid to promote the hydrolysis of silyl ether to silanol, and continue to drop 1.8g of acryloyl chloride. After the dropwise addition is completed, start heating slowly, and keep the temperature at 40℃ for 3h. Cool down, remove low-boiling substances under reduced pressure, and purify the product to obtain modified silicone A3.

[0131] Modified silicone A3 was confirmed by mass spectrometry and GPC: MS (m / z): 11053M + ; GPC measured weight average molecular weight M w =12750.

[0132] Example 3 The GPC test chart of the synthetic compound A3 is as follows Figure 3 shown.

[0133] <Carbon Black Dispersion>

[0134] The carbon black dispersion used is the self-made Sineva-01, and its composition and mass ratio are as follows:

[0135] Carbon black: MA77 (produced by Mitsubishi Chemical Corporation): 23.00 wt%;

[0136] Dispersing resin: V259ME (produced by Nippon Steel Chemical Corporation): 5.00%;

[0137] The dispersant is BYK-167 (produced by BYK Chemical Corporation): 3.35 wt%.

[0138] The solvent is PMA (propylene glycol methyl ether acetate): 68.65 wt%.

[0139] <Cardo resin>

[0140] As the Cardo resin, a mixture of V259ME and propylene glycol methyl ether acetate (produced by Nippon steel Chemical Corporation) is used, and the solid content is 56.4 wt%.

[0141] <Photopolymerizable monomer>

[0142] As the photopolymerizable monomer, DPHA (dipentaerythritol hexaacrylate) (produced by Nippon Kayaku Co., Ltd.) is used.

[0143] <Oxime ester initiator>

[0144] As the photoinitiator, an oxime ester OXE-03 (produced by BASF) is used.

[0145] <Coupling agent>

[0146] As the silane coupling agent, KBM-503 (produced by Shin-Etsu Chemical Co., Ltd.) is used.

[0147] <Leveling agent>

[0148] The leveling agents used are self-made silicone leveling agents A1, A2, and A3, and 3775M (produced by Dow Chemical Company) is used for comparison at the same time.

[0149] Examples 4-9 and Comparative Examples 1-2

[0150] The above components are used to prepare the black matrix photosensitive resin compositions of Examples 4-9 and the compositions of Comparative Examples 1-2 according to the formulations described in Table 1.

[0151] Table 1 Formulation Table

[0152]

[0153]

[0154] Manufacture of the light-shielding film

[0155] The photosensitive resin composition shown in Table 1 was dripped onto a 7cm×7cm glass substrate with a clean and dry surface, and coated using a spin coater to form a coating with a film thickness of 1.2μm after hardening. The coating was placed at 23℃ for 10min, and then pre-baked on a 120℃ hot plate for 2min. Then, exposure was performed, and the exposure gap was adjusted to 75μm, with an i-line illumination of 40mW / cm 2 The ultra-high pressure mercury lamp provides an exposure of 40mJ / cm 2 The ultraviolet irradiation is used for photohardening reaction to form a light-shielding film. Next, the light-shielding film is developed, and the developing solution is 23°C, 0.022% potassium hydroxide solution, and the development is carried out at a shower pressure of 0.1Mpa for 75 seconds. After completion, a spray water wash of 0.15Mpa is performed for 10 seconds to remove the unexposed part of the light-shielding film. After development, a hot air dryer is used to perform post-baking at 230°C for 25 minutes to prepare the light-shielding film of the black matrix photosensitive resin composition described in Examples 4 to 9 and Comparative Examples 1 to 2.

[0156] The following items were evaluated for the black matrix photosensitive resin compositions of Examples 4 to 9 and Comparative Examples 1 to 2 prepared above and the light shielding films formed by curing thereof.

[0157] <Surface tension>

[0158] The surface tension of the black matrix photosensitive resin compositions of Examples 4 to 9 and Comparative Examples 1 to 2 was measured using a surface tension tester. The test results are shown in Table 2.

[0159] <Contact Angle>

[0160] The contact angles of the black matrix photosensitive resin compositions of Examples 4 to 9 and Comparative Examples 1 to 2 with the glass substrate were measured using a HARKE CAST-KR contact angle tester. The test results are shown in Table 2.

[0161] Example 6 Contact angle test diagram Figure 4 As shown, the contact angle test diagram of Example 7 is as follows Figure 5 As shown, the contact angle test diagram of comparative example 1 is as follows Figure 6 As shown, the contact angle test diagram of comparative example 2 is as follows Figure 7 shown.

[0162] <Surface Roughness>

[0163] The surface roughness of the light shielding films formed by curing the black matrix photosensitive resin compositions of Examples 4 to 9 and Comparative Examples 1 to 2 was measured using a Dektak XT roughness tester. The test method was as follows: X, Y Scan size: 10 μm, Scan rate: 1.0 Hz. The test results are shown in Table 2.

[0164] <Film Thickness Uniformity>

[0165] The thickness uniformity of the light-shielding films formed by curing the black matrix photosensitive resin compositions of Examples 4 to 9 and Comparative Examples 1 to 2 was measured using a Dektak XT film thickness tester. Three points were measured at fixed positions to obtain the range of the three points. The calculation results are shown in Table 2. The light-shielding film requires uniform film thickness to ensure uniform light shielding, and the range of the film thickness should not be greater than 0.05 μm.

[0166] Table 2 Test results

[0167]

[0168] According to the above test results, compared with the black matrix photosensitive resin composition of Comparative Example 1, the black matrix photosensitive resin compositions of Examples 4, 6, and 8 have lower surface tension, smaller contact angle, stronger spreadability on the surface of the glass substrate, and better coating properties, among which Example 6 has the lowest. Under high concentration of carbon black, compared with the black matrix photosensitive resin composition of Comparative Example 2, the black matrix photosensitive resin compositions of Examples 5, 7, and 9 have smaller surface tension and contact angle, stronger spreadability on the surface of the glass substrate, and better coating properties, among which Example 7 has the lowest.

[0169] From the above, it can be considered that the organic silicon leveling agent provided by the present application can effectively reduce the surface tension and enhance the coating property. Even at a high concentration of carbon black, it can still provide good coating performance.

[0170] On the other hand, compared with the light-shielding films formed by curing the black matrix photosensitive resin compositions of Comparative Examples 1 to 2, the light-shielding films formed by curing the black matrix photosensitive resin compositions of Examples 4 to 9 have lower surface roughness and better film thickness uniformity.

[0171] From the above, it can be considered that the silicone leveling agent provided in the present application contains unsaturated double bonds, which form weak crosslinks during the exposure process. The leveling agent is not washed away during the development process, and the post-baking process can also provide a leveling effect, effectively solving the problems of rough surface and uneven film thickness.

[0172] It can be seen from the above that the black matrix photosensitive resin composition provided in the present application can provide a black matrix with a smooth surface and excellent film thickness uniformity.

[0173] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0174] In addition, those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the above claims, any one of the claimed embodiments may be used in any combination. The information disclosed in this background technology section is intended only to deepen the understanding of the overall background technology of the present application and should not be regarded as an admission or in any form of implication that the information constitutes prior art known to those skilled in the art.

Claims

1. An organosilicon leveling agent, characterized in that: Its general structural formula is: ； Wherein, a is any integer from 4 to 30, b is any integer from 0 to 10, m is any integer from 4 to 20, n is any integer from 2 to 10, and p is any integer from 4 to 20.

2. The organosilicon leveling agent according to claim 1, characterized in that: m is any integer from 4 to 10, n is any integer from 2 to 6, and p is any integer from 4 to 10.

3. The organosilicon leveling agent according to claim 2, characterized in that: m： n:p=4:2:

4.

4. A method for preparing the organosilicon leveling agent according to any one of claims 1 to 3, characterized in that: include: The siloxane compound and benzofuran cyclopropene are subjected to a first reaction in the presence of a catalyst and a polymerization inhibitor, and then an propylene polyether compound is added to carry out a second reaction; After the second reaction is completed, the pH of the system is adjusted to hydrolyze the silane ether to obtain silanol, and then acryloyl chloride is added dropwise to carry out a third reaction to obtain the organosilicon leveling agent.

5. The preparation method according to claim 4, characterized in that: The siloxane compound includes siloxane C 20 H 65 O 13 Si 12 and / or Siloxane C 34 H 113 O 23 Si 22 .

6. The preparation method according to claim 4, characterized in that: The acryl polyether compound includes acryl polyether C 49 H 98 O 21 .

7. The preparation method according to claim 4, characterized in that: The catalyst includes chloroplatinic acid.

8. The preparation method according to claim 4, characterized in that: The polymerization inhibitor includes hydroquinone.

9. A black matrix photosensitive resin composition, characterized in that: The invention comprises the organosilicon leveling agent according to any one of claims 1 to 3.

10. The black matrix photosensitive resin composition according to claim 9, characterized in that: The amount of the organosilicon leveling agent used is 0.01wt%-1wt% of the total solid content of the black matrix photosensitive resin composition.

11. The black matrix photosensitive resin composition according to claim 10, characterized in that: The amount of the organosilicon leveling agent used is 0.01wt%-0.2wt% of the total solid content of the black matrix photosensitive resin composition.

12. The black matrix photosensitive resin composition according to claim 9, characterized in that: It also includes an alkali-soluble resin, a photopolymerizable monomer, a photoinitiator, a colorant and a solvent.

13. The black matrix photosensitive resin composition according to claim 9, characterized in that: The black matrix photosensitive resin composition further comprises a curing accelerator, a coupling agent, an antioxidant, a polymerization inhibitor, and a defoaming agent.

14. The black matrix photosensitive resin composition according to claim 13, characterized in that The coupling agent is a silane coupling agent.

15. The black matrix photosensitive resin composition according to claim 12, characterized in that: The amount of the alkali-soluble resin used is 10wt%-30wt% of the total solid content of the black matrix photosensitive resin composition.

16. The black matrix photosensitive resin composition according to claim 12, characterized in that: The alkali-soluble resin includes a resin having a hydroxyl group, a carboxyl group, a phosphoric acid group or a sulfonic acid group.

17. The black matrix photosensitive resin composition according to claim 15, characterized in that: The alkali-soluble resin is a resin having a carboxyl group.

18. The black matrix photosensitive resin composition according to claim 17, characterized in that: The alkali-soluble resin is a resin having both an ethylenically unsaturated group and a carboxyl group.

19. The black matrix photosensitive resin composition according to claim 12, characterized in that: The alkali-soluble resin includes a fluorene-based resin.

20. The black matrix photosensitive resin composition according to claim 19, characterized in that: The alkali-soluble resin includes bisphenol fluorene resin.

21. The black matrix photosensitive resin composition according to claim 20, characterized in that: The bisphenol fluorene resin is one or more photosensitive resins containing unsaturated groups obtained by reacting a reaction product of an epoxy compound having two glycidyl ether groups derived from bisphenol fluorene with (meth) acrylic acid and a polycarboxylic acid or anhydride thereof.

22. The black matrix photosensitive resin composition according to claim 21, characterized in that: The general structural formula of the epoxy compound having two glycidyl ether groups derived from bisphenol fluorene is: ； Wherein, R1, R2, R3, R4, R5, and R6 are each independently a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogen atom, and x and y are each independently 0 or 1.

23. The black matrix photosensitive resin composition according to claim 21, characterized in that: The bisphenol fluorene-derived epoxy compound having two glycidyl ether groups is obtained by etherification reaction of a bisphenol compound and a halogenated alkoxy compound.

24. The black matrix photosensitive resin composition according to claim 23, characterized in that: The bisphenol compounds include bis(4-hydroxyphenyl)ketone, bis(4-hydroxy-3,5-dimethylphenyl)ketone, bis(4-hydroxy-3,5-dichlorophenyl)ketone, bis(4-hydroxyphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dimethylphenyl)hexafluoropropane, bis(4-hydroxy-3,5-dichlorophenyl)hexafluoropropane, bis(4-hydroxyphenyl)dimethylsilane, bis(4-hydroxy-3,5-dimethylphenyl)dimethylsilane, bis(4-hydroxy-3,5-dichlorophenyl)dimethylsilane, bis(4-hydroxyphenyl)methane, bis(4-hydroxy-3,5-dichlorophenyl)methane, bis(4-hydroxy-3,5-dibromophenyl)methane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(4-hydroxy-3,5-dimethylphenyl)propane, ,2-bis(4-hydroxy-3,5-dichlorophenyl)propane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxy-3-chlorophenyl)propane, bis(4-hydroxyphenyl)ether, bis(4-hydroxy-3,5-dimethylphenyl)ether, bis(4-hydroxy-3,5-dichlorophenyl)ether, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis(4-hydroxy-3-methylphenyl)fluorene, 9,9-bis(4-hydroxy-3-chlorophenyl)fluorene, 9,9- One or more of bis(4-hydroxy-3-bromophenyl)fluorene, 9,9-bis(4-hydroxy-3-fluorophenyl)fluorene, 9,9-bis(4-hydroxy-3-methoxyphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dimethylphenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dichlorophenyl)fluorene, 9,9-bis(4-hydroxy-3,5-dibromophenyl)fluorene, 4,4'-biphenol, and 3,3'-biphenol.

25. The black matrix photosensitive resin composition according to claim 23, characterized in that: The bisphenol compound is a bisphenol compound having a fluorene-9,9-diyl group.

26. The black matrix photosensitive resin composition according to claim 21, characterized in that: The polycarboxylic acid or its anhydride includes succinic acid, acetylsuccinic acid, maleic acid, adipic acid, itaconic acid, azelaic acid, citramalic acid, malonic acid, glutaric acid, citric acid, tartaric acid, oxoglutaric acid, pimelic acid, sebacic acid, suberic acid, diglycolic acid, cyclobutanedicarboxylic acid, cyclopentanedicarboxylic acid, hexahydrophthalic acid, tetrahydrophthalic acid, norbornanedicarboxylic acid or its monoanhydride.

27. The black matrix photosensitive resin composition according to claim 20, characterized in that: The average molecular weight M of the bisphenol fluorene resin w The acid value is 4000-20000 and the acid value is 30mgKOH / g-200mgKOH / g.

28. The black matrix photosensitive resin composition according to claim 27, characterized in that: The average molecular weight M of the bisphenol fluorene resin w The molecular weight of the polyol is 4000-8000, and the acid value is 30mgKOH / g-100mgKOH / g.

29. The black matrix photosensitive resin composition according to claim 12, characterized in that: The amount of the photopolymerizable monomer used is 5 wt % to 25 wt % of the total solid content of the black matrix photosensitive resin composition.

30. The black matrix photosensitive resin composition according to claim 12, characterized in that: The photopolymerizable monomer is selected from one or more of pentaerythritol triacrylate, pentaerythritol tetraacrylate, polydipentaerythritol pentaacrylate, polydipentaerythritol hexaacrylate, and ethylene oxide-modified dipentaerythritol hexaacrylate.

31. The black matrix photosensitive resin composition according to claim 30, characterized in that: The photopolymerizable monomer is polydipentaerythritol hexaacrylate.

32. The black matrix photosensitive resin composition according to claim 12, characterized in that: The amount of the photoinitiator used is 0.5wt%-5wt% of the total solid content of the black matrix photosensitive resin composition.

33. The black matrix photosensitive resin composition according to claim 12, characterized in that: The photoinitiator is selected from one or more of benzoin derivatives, benzil derivatives, dialkoxyacetophenones, α-hydroxyalkyl phenones, α-aminoalkyl phenones, acylphosphine oxides, oxime ester compounds, benzoylformate, benzophenone, thioxanthone, and camphorquinone.

34. The black matrix photosensitive resin composition according to claim 33, characterized in that: The photoinitiator is an oxime ester compound.

35. The black matrix photosensitive resin composition according to claim 12, characterized in that: The amount of the colorant used is 30wt%-60wt% of the total solid content of the black matrix photosensitive resin composition.

36. The black matrix photosensitive resin composition according to claim 12, characterized in that: The photoresist film formed by curing the black matrix photosensitive resin composition has an optical density of not less than 3.8 with a film thickness of 1 μm.

37. The black matrix photosensitive resin composition according to claim 12, characterized in that: The colorant is a carbon black pigment, which is obtained by mixing and grinding raw materials including carbon black, a dispersant, a dispersing resin and a solvent, and then adding a solvent for dilution.

38. The black matrix photosensitive resin composition according to claim 12, characterized in that: The amount of the solvent used is 60wt%-85wt% of the total mass of the black matrix photosensitive resin composition.

39. The black matrix photosensitive resin composition according to claim 12, characterized in that: The solvent is selected from one or more of propylene glycol methyl ether acetate, propylene glycol methyl ether, ethyl ethoxypropionate, dipropylene glycol methyl ether acetate, 3-methoxybutyl acetate, diethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and propylene glycol diacetate.

40. The black matrix photosensitive resin composition according to claim 39, characterized in that: The solvent is propylene glycol methyl ether acetate.

41. A color filter, characterized in that: The raw materials include the black matrix photosensitive resin composition described in any one of claims 9-40.

42. A liquid crystal display device, characterized in that: Includes the color filter described in claim 41.

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