Ceramic capacitor mounting device and ceramic capacitor reflow soldering mounting method

Abstract

The present invention discloses a ceramic capacitor mounting device, including a fixed plate and an introduction box, wherein at least one accommodating area is provided on the fixed plate, and a plurality of accommodating holes are provided in the accommodating area; the introduction box includes a first box body and a second box body which are interconnected, and the bottom plate of the first box body is provided with at least one introduction area, the introduction area corresponds to the accommodating area, and each introduction area is provided with an introduction hole corresponding to the accommodating hole on an accommodating area, the aperture of the introduction hole is larger than the aperture of the accommodating hole, and the aperture of the introduction hole is smaller than twice the diagonal length of the end face of the ceramic capacitor. By pouring the ceramic capacitor into the introduction box, there is no need to control the quantity, and the ceramic capacitor will not spill onto the PCB board. By shaking the PCB board and the introduction box, the ceramic capacitor can be quickly shaken into the introduction hole, and the excess ceramic capacitor is left in the introduction box for direct recycling, and there is no need to clean the PCB board, thus saving a lot of time. The present invention also discloses a ceramic capacitor reflow soldering mounting method.

Description

Technical Field

[0001] The present invention relates to the technical field of reflow soldering, and in particular to a ceramic capacitor mounting device and a ceramic capacitor reflow soldering mounting method. Background Art

[0002] Multi-layer ceramic capacitors (MLCC) are a common passive component with the characteristics of small size, large capacity, good moisture and heat resistance, and high cost performance. The existing reflow soldering method for MLCC mainly includes the following steps:

[0003] (1) Prepare a PCB board 200 and a plurality of fixing plates 110, and sequentially install the plurality of fixing plates 110 on the PCB board 200; Figure 1 As shown, each fixing plate 110 is provided with a screw hole, and the fixing plate 110 is mounted on the screws set on the PCB board 200 through the screw hole;

[0004] (2) Install the introduction plate 120' on each fixed plate 110 in sequence, so that the through hole on the introduction plate 120' corresponds to the product receiving hole on the fixed plate 110, see Figure 1 As shown;

[0005] (3) Pour enough MLCC products 300 on one of the lead-in boards 120', and make sure that the MLCC products 300 do not fall onto the PCB board 200 as much as possible. Figure 2 As shown;

[0006] (4) Use your fingers to push the MLCC product 300 into the through hole on the lead-in board 120', and push the excess MLCC product 300 onto the PCB board 200 next to the lead-in board 120', so that there is no excess MLCC product 300 on the lead-in board 120'. Figure 3 As shown;

[0007] (5) Clean and collect the excess MLCC products 300 on the PCB board 200; the cleaning is completed as shown in the following figure: Figure 4 As shown;

[0008] (6) Repeat steps (3) to (5) until all the fixing plates 110 are filled with MLCC products, and then remove each lead-in plate 120' in turn;

[0009] (7) Install the cover plate 130 on each fixing plate 110 in sequence, and use nuts to fix the cover plate 130 and the fixing plate 110. Figure 5 As shown, the board loading process is completed.

[0010] The above-mentioned existing board loading method mainly has the following shortcomings: 1. It is difficult to control the amount of MLCC product 300 when pouring in the above step (3). If the MLCC product 300 is poured too little, it will be difficult to push it into the through hole on the introduction plate 120'. If the MLCC product 300 is poured too much, it will be difficult to clean it later. Therefore, it is necessary to pour the product more slowly, wasting a lot of time; 2. In the above step (4), the MLCC product 300 is pushed into the through hole on the introduction plate 120' with fingers, or slightly shaken to make the MLCC product 300 fall into the through hole, which is extremely inefficient; 3. In the above step (5), a brush, magnet or other tool is used to slowly clean the P After cleaning the excess MLCC products 300 on the CB board, it is necessary to check whether there are any residual MLCC products 300 on the surface of all PCB boards, the surface of the fixing plate 110, and the gaps, which is the most time-consuming step in the method; Fourth, in the existing board installation method, when there are multiple fixing plates 110, installing the fixing plate 110, installing the import plate 120', pouring the product, dialing in the product, cleaning the product, and removing the import plate 120' all need to be repeated multiple times. For example, when there are four fixing plates 110, the above steps need to be repeated four times. The process is relatively cumbersome and time-consuming, resulting in low production capacity.

[0011] Therefore, it is necessary to provide a panel loading device and a panel loading method that can improve the complicated and time-consuming process of panel loading, so as to solve the above-mentioned problems in the prior art. Summary of the invention

[0012] The object of the present invention is to provide a ceramic capacitor mounting device capable of improving the complicated and time-consuming process of mounting.

[0013] Another object of the present invention is to provide a ceramic capacitor reflow soldering method that can improve the complicated and time-consuming process of the board installation process.

[0014] To achieve the above-mentioned purpose, the technical solution of the present invention is: to provide a ceramic capacitor mounting device, which includes a fixed plate and an import box; wherein, the fixed plate is provided with at least one accommodating area, and the accommodating area is provided with a plurality of accommodating holes; the import box includes a first box body and a second box body which are interconnected, and the bottom plate of the first box body is provided with at least one import area, and the import area corresponds to the accommodating area, and each of the import areas is penetrated by an import hole corresponding to an accommodating hole on the accommodating area, the aperture of the import hole is larger than the aperture of the accommodating hole, and the aperture of the import hole is less than twice the diagonal length of the end face of the ceramic capacitor.

[0015] Preferably, the diameter of the accommodating hole is larger than the diagonal length of the end surface of the ceramic capacitor and smaller than twice the diagonal length of the end surface of the ceramic capacitor.

[0016] Preferably, the thickness of the fixing plate and the thickness of the bottom plate of the first box body are both smaller than the length of the ceramic capacitor.

[0017] Preferably, the accommodating holes and the introducing holes are arranged in an array.

[0018] Preferably, the accommodating area is further provided with a first mounting hole, and the introducing area is provided with a second mounting hole corresponding to the first mounting hole.

[0019] Preferably, the introduction box is provided with an opening communicating with the first box body and / or the second box body, and the opening is used for installing the ceramic capacitor into the introduction box.

[0020] Compared with the prior art, the ceramic capacitor mounting device of the present invention is provided with an introduction box, the introduction box is provided with a first box body and a second box body that are interconnected, and the bottom plate of the first box body is provided with at least one introduction area, the introduction area corresponds to the accommodation area on the fixed plate, each introduction area is provided with an introduction hole corresponding to the accommodation hole on an accommodation area, and the aperture of the introduction hole is larger than the aperture of the accommodation hole, and the aperture of the introduction hole is smaller than twice the diagonal length of the end face of the ceramic capacitor. In this way, when pouring the ceramic capacitor into the introduction box, it is not necessary to control the quantity, and the ceramic capacitor will not fall onto the PCB board. The ceramic capacitor can be quickly shaken into the introduction hole by shaking the PCB board and the introduction box synchronously, and the excess ceramic capacitor is directly left in the introduction box for direct recycling, and there is no need to clean the PCB board, saving a lot of time, and it can also ensure that no ceramic capacitor remains on the PCB board to cause damage to the PCB board.

[0021] The present invention also provides a ceramic capacitor reflow soldering mounting method, which uses the ceramic capacitor mounting device as described above, and comprises the following steps:

[0022] (1) providing a PCB board and at least one fixing plate, and installing the fixing plate on the PCB board;

[0023] (2) providing an introduction box, the introduction box having an introduction area corresponding to the number of the accommodating areas of the fixing plate;

[0024] (3) installing the introduction box on the fixing plate so that the introduction area corresponds to the accommodating area one by one, and the introduction hole on each of the introduction areas corresponds to the accommodating holes on the accommodating area one by one;

[0025] (4) Pour a sufficient amount of ceramic capacitors into the introduction box;

[0026] (5) fixing the relative positions of the PCB board and the introduction box, and then shaking the PCB board and the introduction box synchronously so that the ceramic capacitors in the introduction box fall into the introduction holes until all the introduction holes are filled with ceramic capacitors;

[0027] (6) synchronously tilting the PCB board and the introduction box toward the direction of the second box body of the introduction box, so that all the ceramic capacitors that have not entered the introduction hole slide into the second box body;

[0028] (7) detaching the introduction box from the fixing plate and ensuring that the ceramic capacitor in the second box body does not slide into the first box body;

[0029] (8) Provide a cover plate, install the cover plate on the fixing plate, and lock the cover plate and the fixing plate.

[0030] Preferably, the step (3) of "installing the import box on the fixed plate" is specifically as follows: making the second mounting hole of the import area correspond one-to-one with the first mounting hole of the accommodating area, and making the second mounting hole and the first mounting hole both connected to the connector on the PCB board.

[0031] Preferably, the "fixing the relative positions of the PCB board and the import box" in the step (5) is specifically: fixing by hand by an operator or fixing by using a fixing member.

[0032] Preferably, the thickness of the fixing plate and the thickness of the bottom plate of the first box body are both smaller than the length of the ceramic capacitor, so that after step (7), the accommodating hole only accommodates one ceramic capacitor, and the ceramic capacitor partially protrudes from the fixing plate.

[0033] Compared with the prior art, the ceramic capacitor reflow soldering method of the present invention has the following effects: 1. In the above step (4), the ceramic capacitor is poured into the introduction box, so enough ceramic capacitors can be poured without controlling the quantity, and the ceramic capacitors will not fall onto the PCB board, so time can be saved; 2. In the above step (5), the ceramic capacitor can be quickly shaken into the introduction hole by synchronously shaking the PCB board and the introduction box, saving a lot of time; 3. In the above step (6), the redundant ceramic capacitor can be recovered by tilting the introduction box. Since the entire bottom surface of the introduction box is flat, no ceramic capacitor will remain in the first box body, and there is no need to specially clean the ceramic capacitor, which can save a lot of time, and at the same time, it can also ensure that no ceramic capacitor remains on the PCB board and causes damage to the PCB board; 4. Even if there are multiple fixed plates, installing the introduction box, pouring the product, shaking the product in, tilting the product back, and removing the introduction box only need to be performed once, and the process is greatly simplified, thereby saving a lot of time. In summary, the board loading method of the present invention can greatly reduce the board loading time, improve the board loading efficiency, and thus improve the production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the state after the fixing plate and the import plate are installed on the PCB board in the prior art.

[0035] Figure 2 is Figure 1 Schematic diagram of the status of pouring MLCC products onto the Zhongyi import board.

[0036] Figure 3 Yes Figure 2 Schematic diagram of the MLCC product status after being dialed into the import board.

[0037] Figure 4 Yes Figure 3 Schematic diagram of the scattered MLCC products after cleaning.

[0038] Figure 5 Yes Figure 4 Schematic diagram of the status after the lead-in plate is removed and the cover plate is installed.

[0039] Figure 6 It is a structural schematic diagram of the ceramic capacitor mounting device of the present invention.

[0040] Figure 7 yes Figure 6 Schematic diagram of the structure with the top plate removed from the import box.

[0041] Figure 8 It is a structural schematic diagram of the ceramic capacitor mounting device of the present invention installed on a PCB board.

[0042] Fig. 9 yes Figure 8 A partial cross-sectional view of .

[0043] Fig.10 It is a structural schematic diagram of the PCB board provided in the present invention.

[0044] Fig.11 exist Fig.10 Schematic diagram of the state after the fixing plate is installed on the PCB board.

[0045] Fig.12 is Fig.11 Schematic diagram of the status of installing the import box on the fixed plate in.

[0046] Fig.13 is Fig.12 Schematic diagram of the state of pouring ceramic capacitors into the introduction box in.

[0047] Fig.14 Yes Fig.13 Schematic diagram of the PCB board and the guide box being tilted to recover the ceramic capacitor.

[0048] Fig.15 yes Fig.14 Schematic diagram of the ceramic capacitor after recycling.

[0049] Fig.16 yes Fig.15 Schematic diagram of the state after the introduction box is removed.

[0050] Fig.17 The cover is installed on Fig.16 Schematic diagram of the status on the fixed plate in.

[0051] Fig.18 It is a schematic diagram of the structure of the ceramic capacitor in the present invention. DETAILED DESCRIPTION

[0052] The embodiments of the present invention are now described with reference to the accompanying drawings, in which similar element numbers represent similar elements. It should be noted that the orientation descriptions involved in the present invention, such as the orientations or positional relationships indicated by up, down, left, right, front, and back, are all based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the technical solutions of the present application or / and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. The first, second, etc. described are only used to distinguish technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0053] First combine Figure 6-Figure 18As shown, the ceramic capacitor mounting device 100 provided by the present invention is mainly suitable for ceramic capacitor reflow soldering, but is not limited to this, nor is it limited to the mounting of ceramic capacitors 300, and can also be used for the mounting of other similar micro devices.

[0054] Combine the following Figure 6-Figure 10 As shown, in the present invention, the ceramic capacitor mounting device 100 includes a fixed plate 110 and an introduction box 120. Among them, at least one accommodating area 110a is provided on the fixed plate 110, and the accommodating area 110a is provided with a plurality of accommodating holes 111. The introduction box 120 includes a first box body 120a and a second box body 120b that are interconnected, and the bottom plate of the first box body 120a is provided with at least one introduction area 121a, and the number of the introduction areas 121a corresponds to the number of the accommodating areas 110a, and each of the introduction areas 121a is provided with an introduction hole 1211 corresponding to the accommodating hole 111 on the accommodating area 110a. After the fixing plate 110 and the introduction box 120 are sequentially installed on the PCB board 200 , the introduction holes 1211 of the introduction area 121a correspond one-to-one with the accommodating holes 111 of the accommodating area 110a , and the ceramic capacitor is introduced into the accommodating holes 111 on the fixing plate 110 through the introduction holes 1211 on the introduction box 120 .

[0055] See also Fig.18 As shown, since the conventional ceramic capacitor 300 is in a rectangular shape, its length is a, width is b, and height is h. Therefore, the receiving holes 111 on the fixing plate 110 are respectively set according to the specific model of the ceramic capacitor 300 to ensure that the ceramic capacitor 300 can be introduced and received in the receiving holes 111.

[0056] Combination Fig. 9 , Fig.16 , Fig.18 As shown, in the present invention, the thickness of the fixing plate 110 is less than the length a of the ceramic capacitor 300, so that after the ceramic capacitor 300 is introduced into the receiving hole 111, a portion of the ceramic capacitor 300 protrudes above the fixing plate 110. In addition, the aperture d1 of the receiving hole 111 is greater than the diagonal length L of the end face of the ceramic capacitor 300, and the diagonal length L is calculated by the formula √(b 2 +h 2 ) is calculated, and at the same time, the aperture d1 of the receiving hole 111 is smaller than twice the aforementioned diagonal length L, that is, smaller than 2L, so that it is ensured that the ceramic capacitor 300 can be introduced into each receiving hole 111, and only one ceramic capacitor 300 can be introduced.

[0057] Continue to combine Fig. 9 , Fig.18As shown, in the present invention, the aperture d2 of the introduction hole 1211 of the introduction box 120 is larger than the aperture d1 of the accommodating hole 111. At the same time, the aperture d2 of the introduction hole 1211 is smaller than twice the diagonal length L of the end face of the ceramic capacitor, that is, smaller than 2L. The purpose of this setting is to make it easier for the ceramic capacitor 300 to enter the introduction hole 1211, and two ceramic capacitors 300 cannot enter the introduction hole 1211 at the same time.

[0058] In addition, at least the thickness of the bottom plate of the first box body 120a is less than the length a of the ceramic capacitor 300, so that the two ceramic capacitors 300 cannot be vertically stacked into the introduction hole 1211. In a preferred embodiment, the thickness of the entire bottom plate of the introduction box 120 is less than the length a of the ceramic capacitor 300.

[0059] See also Figure 6 , Fig.10 As shown, in the present invention, only one accommodating area 110a may be provided on one fixing plate 110. Thus, when multiple areas on the PCB 200 need to be introduced into the ceramic capacitor 300, multiple fixing plates 110 are selected and the multiple fixing plates 110 are respectively installed on the PCB 200. In a more preferred embodiment, multiple accommodating areas 110a are provided on one fixing plate 110. Thus, only one fixing plate 110 needs to be installed on the PCB 200 to implement the introduction into multiple areas. Since it only needs to be installed once, it can save more operation time.

[0060] exist Figure 6-Figure 10 In the illustrated embodiment, four regions need to be introduced on the PCB board 200, and a receiving area 110a is formed on a fixing plate 110. Therefore, four identical fixing plates 110 are selected and the four fixing plates 110 are respectively installed in set regions on the PCB board 200, thereby obtaining four receiving areas 110a.

[0061] Correspondingly, the number of the import areas 121a on the import box 120 is set according to the PCB board 200. In one embodiment, four spaced import areas 121a are provided on the bottom plate of the first box body 120a, and the positions of the four import areas 121a correspond to the set areas on the PCB board 200, and the shape and size of each import area 121a correspond to one fixed plate 110, so that when the import box 120 is installed on the fixed plate 110, the four import areas 121a can correspond to the four fixed plates 110 one by one, and the import box 120 only needs to be installed once, which greatly saves installation time.

[0062] It is understandable that the number of areas on the PCB board 200 and the number of fixing plates 110 are not limited to four, and other numbers can be set as needed.

[0063] Continue to view Figure 6 As shown, in the present invention, the receiving holes 111 on the fixing plate 110 and the introduction holes 1211 of the introduction area 121a are arranged in an array. Of course, the arrangement is not limited to the array, and the receiving holes 111 and the introduction holes 1211 can be arranged in any manner as needed.

[0064] Combination Figure 6-8 , Fig.10 As shown, in the present invention, the accommodating area 110a is further provided with a first mounting hole 112, and the introduction area 121a is provided with a second mounting hole 1212 corresponding to the first mounting hole 112. In this way, when installing the fixing plate 110, the first mounting hole 112 thereon is connected to the connecting member 210 already provided on the PCB board 200, such as a screw, and the introduction box 120 is connected to the connecting member 210 on the PCB board 200 through the second mounting hole 1212 to achieve installation, thereby quickly achieving the installation of the fixing plate 110 and the introduction box 120, saving installation time.

[0065] See below Figure 6-8 As shown, in the present invention, the relative positions of the first box body 120a and the second box body 120b are not specifically limited, and the introduction box 120 is provided with an opening 120c connecting the first box body 120a and / or the second box body 120b, and the opening 120c is used to load the ceramic capacitor into the introduction box 120.

[0066] More specifically, the introduction box 120 includes a bottom plate 121 and four side plates 122 connected to the bottom plate 121. The four side plates 122 are connected in sequence to form a frame. The bottom plate 121 and the four side plates 122 together form the introduction box 120. In addition, the front half of the introduction box 120 forms a first box body 120a, and the rear half of the introduction box 120 forms a second box body 120b. Figure 7 As shown, since the bottom plate 121 of the introduction box 120 is a planar structure, the first box body 120a and the second box body 120b are completely connected.

[0067] Of course, a partition of a certain width may be provided between the first box body 120a and the second box body 120b, so that while ensuring that the first box body 120a and the second box body 120b are interconnected, the probability of the ceramic capacitor recovered into the second box body 120b sliding into the first box body 120a can be reduced.

[0068] In this embodiment, the introduction box 120 is further provided with a top plate 123, which is connected to the top of the side plate 122, and the top plate 123 only covers the rear half of the introduction box 120, that is, covers the top of the second box body 120b, and forms the aforementioned opening 120c above the first box body 120a. Figure 6 , Figure 8 Therefore, the introduction box 120 forms a semi-enclosed structure, and the ceramic capacitor is conveniently poured into the introduction box 120 through the opening 120c set at the top.

[0069] It is understandable that the introduction box 120 may not be provided with the top plate 123 , so that the entire top of the introduction box 120 forms the opening 120 c .

[0070] In summary, the ceramic capacitor mounting device 100 of the present invention is provided with an introduction box 120, on which a first box body 120a and a second box body 120b that are interconnected are provided, and a bottom plate 121 of the first box body 120a is provided with at least one introduction area 121a, and the introduction area 121a corresponds to the accommodating area 110a on the fixed plate 110, and each introduction area 121a is provided with an introduction hole 1211 corresponding to an accommodating hole 111 on an accommodating area 110a, and an aperture d2 of the introduction hole 1211 is larger than an aperture d1 of the accommodating hole 111, and the aperture d2 of the introduction hole 1211 is smaller than twice the diagonal length L of the end face of the ceramic capacitor 300. In this way, when pouring the ceramic capacitor 300 into the introduction box 120, there is no need to control the quantity, and the ceramic capacitor 300 will not spill onto the PCB board 200. By shaking the PCB board 200 and the introduction box 120 synchronously, the ceramic capacitor 300 can be quickly shaken into the introduction hole 1211, and the excess ceramic capacitor 300 is directly left in the introduction box 120 for direct recycling. There is no need to clean the PCB board 200, thereby saving a lot of time and ensuring that no ceramic capacitor 300 remains on the PCB board 200 to cause damage to the PCB board 200.

[0071] Combine the following Figure 6-17 As shown, the ceramic capacitor reflow soldering mounting method provided by the present invention uses the ceramic capacitor mounting device 100 as described above. The method comprises the following steps:

[0072] S01, providing a PCB board 200 and at least one fixing plate 110, and installing the fixing plate 110 on the PCB board 200;

[0073] See also Fig.10As shown, the PCB board 200 provided in the present invention is provided with areas to be introduced as required, and each area is correspondingly fixed with a connector 210. In one embodiment, there are four areas to be introduced on the PCB board 200, and each area is respectively connected with two connectors 210. The connector 210 is preferably a screw, but is not limited thereto.

[0074] See also Figure 10-11 As shown, a fixing plate 110 is provided according to the number of areas on the PCB board 200 that need to be imported, and the fixing plate 110 can be one or more. Specifically, under the premise that there are several areas on the PCB board 200 that need to be imported, if a fixing plate 110 is provided with multiple accommodating areas 110a, and the number of accommodating areas 110a corresponds to the number of areas on the PCB board 200 that need to be imported, only one fixing plate 110 is provided, and the fixing plate 110 is installed on the PCB board 200, and each accommodating area 110a on the fixing plate 110 corresponds to the area on the PCB board 200 that needs to be imported. This method only requires the fixing plate 110 to be installed once, so it saves more time. When only one accommodating area 110a is provided on a fixing plate 110, multiple fixing plates 110 are provided, and the multiple fixing plates 110 are installed in sequence on the areas on the PCB board 200 that need to be imported.

[0075] Continue to view Figure 10-11 As shown, in a specific embodiment, there are four areas on the PCB board 200 that need to be introduced, and only one accommodating area 110a is provided on one fixing plate 110, so four fixing plates 110 are provided. In addition, two first mounting holes 112 are provided in the middle of each fixing plate 110, and the positions of the two first mounting holes 112 correspond to the connectors 210 that have been installed on the PCB board 200. The first mounting holes 112 are preferably screw holes. Then, the four fixing plates 110 are sequentially connected to the connectors 210 on the PCB board 200, so that the four fixing plates 110 are respectively located in the four areas on the PCB board 200 that need to be introduced, as shown in FIG. Fig.11 shown.

[0076] In addition, other structures of the fixing plate 110 are as described above and will not be described again.

[0077] S02, providing an introduction box 120, wherein the introduction box 120 has an introduction area 121a corresponding to the number of the accommodating areas 110a of the fixing plate 110;

[0078] See also Figure 6-9As shown, the bottom plate 121 of the first box body 120a of the introduction box 120 is provided with introduction areas 121a corresponding to the number of the accommodating areas 110a. In a specific embodiment, four introduction areas 121a are provided on the bottom plate 121 of the first box body 120a, and the shape and size of each introduction area 121a correspond to one accommodating area 110a, that is, the same as one fixed plate 110. At the same time, each introduction area 121a is provided with an introduction hole 1211 corresponding to the accommodating hole 111 of one accommodating area 110a, that is, each introduction area 121a is provided with an introduction hole 1211 corresponding to the accommodating hole 111 on one fixed plate 110.

[0079] Combination Fig.18 As shown, the aperture d2 of the introduction hole 1211 is larger than the aperture d1 of the accommodation hole 111. At the same time, the aperture d2 of the introduction hole 1211 is smaller than twice the diagonal length L of the end face of the ceramic capacitor, that is, smaller than 2L. The purpose of this setting is to make it easier for the ceramic capacitor 300 to enter the introduction hole 1211, and two ceramic capacitors 300 cannot enter one introduction hole 1211 at the same time.

[0080] In addition, the structures of other parts of the introduction box 120 are as described above and will not be repeated here.

[0081] S03, installing the introduction box 120 on the fixing plate 110, so that the introduction area 121a corresponds to the accommodating area 110a one by one, and the introduction hole 1211 on each of the introduction areas 121a corresponds to the accommodating hole 111 on the accommodating area 110a one by one;

[0082] Specific reference Fig.10 , Fig.12 As shown, the import box 120 is connected to the screw on the PCB board 200 through the second mounting hole 1212 thereon, that is, the second mounting hole 1212 on the import box 120 corresponds one-to-one with the first mounting hole 112 of the accommodating area 110a and is connected to the screw at the same time, so as to realize the installation of the import box 120, and make the four import areas 121a on the import box 120 correspond one-to-one with the four fixing plates 110, and at the same time, the import hole 1211 on each import area 121a corresponds one-to-one with the accommodating hole 111 on the fixing plate 110, so as to facilitate the introduction of the ceramic capacitor into the accommodating hole 111.

[0083] S04, pouring a sufficient amount of ceramic capacitors into the introduction box 120;

[0084] Combination Figure 6-7 , Fig.13As shown, a sufficient amount of ceramic capacitors 300 are poured into the introduction box 120 through the opening 120c at the top of the introduction box 120. When pouring, there is no need to control the number of ceramic capacitors 300, because the excess ceramic capacitors 300 can be recovered by tilting the introduction box 120 later, and the recovered ceramic capacitors 300 can be recycled in the subsequent board loading process until they are all used up. In addition, when pouring the ceramic capacitors 300, they will not fall onto the PCB board 200, so the ceramic capacitors 300 can be poured at will without controlling the speed, thereby saving the time of pouring the product.

[0085] S05, fixing the relative positions of the PCB board 200 and the import box 120, and then shaking the PCB board 200 and the import box 120 synchronously, so that the ceramic capacitors 300 in the import box 120 fall into the import holes 1211, until all the import holes 1211 are filled with ceramic capacitors 300;

[0086] In the present invention, the operator can fix the PCB board 200 and the import box 120 by hand or by using a fixing member. Specifically, the operator can hold the PCB board 200 and the import box 120 at the same time for fixing, or after installing the import box 120, further connect the nut to the screw on the PCB board 200, so as to fix the import box 120 and the PCB board 200, or use other fixing members to fix the PCB board 200 and the import box 120. The latter two methods do not require employees to fix by hand, and can also prevent the import box 120 from detaching and causing the product to leak out of the import hole 1211, which is more convenient to use. Of course, it is not limited to the aforementioned fixing method, and other methods can also be used to fix the relative position of the PCB board 200 and the import box 120.

[0087] See also Fig.13 , Fig.15 As shown, after the PCB board 200 and the introduction box 120 are fixed, the PCB board 200 and the introduction box 120 are shaken back and forth and left and right at the same time, as shown in FIG. Fig.13 As shown in the direction of the middle arrow, the ceramic capacitor 300 can be slightly tilted during shaking, so that the ceramic capacitor 300 falls into the introduction hole 1211 of the introduction box 120 during shaking, and then introduced into the containing hole 111. The ceramic capacitor 300 can be quickly shaken into the introduction hole 1211, as shown in FIG. Fig.15 shown.

[0088] Combination Fig.18 As shown, since the size of the ceramic capacitor 300 is very small, for example, the size of 01005 is 0.4mm*0.2mm*0.2mm, and the size of the smallest specification 008004 in the industry is 0.25mm*0.125mm*0.125mm. Therefore, the present invention utilizes the shaking method of the introduction box 120, which can save a lot of time compared to the method of manually inserting the product into the introduction hole 1211 in the prior art.

[0089] S06, synchronously tilting the PCB board 200 and the introduction box 120 toward the direction of the second box body 120b of the introduction box 120, so that all the ceramic capacitors 300 that have not entered the introduction hole 1211 slide into the second box body 120b;

[0090] Combination Figure 6-7 , Figure 14-15 As shown, since the first box body 120a and the second box body 120b are connected to each other, the entire bottom plate 121 of the introduction box 120 is flat, so after the PCB board 200 and the introduction box 120 are synchronously tilted toward the direction of the second box body 120b, as shown in FIG. Fig.14 As shown, the ceramic capacitors 300 that have not entered the introduction hole 1211 can all slide into the second box body 120b, and all the ceramic capacitors 300 that have not been introduced can be recovered, and no ceramic capacitors 300 will remain in the first box body 120a. Fig.15 shown.

[0091] Combination Fig.18 As shown, since the size of the ceramic capacitor 300 is very small, the existing method of using a brush or a magnet or other tools to clean the excess ceramic capacitor 300 on the PCB board 200 is very time-consuming and labor-intensive. Compared with the existing method, the present invention does not need to clean the ceramic capacitor 300 on the PCB board 200, thereby saving a lot of time and ensuring that no ceramic capacitor 300 remains on the PCB board 200 to cause damage to the PCB board 200.

[0092] S07, detaching the introduction box 120 from the fixing plate 110, and ensuring that the ceramic capacitor 300 in the second box body 120b does not slide into the first box body 120a;

[0093] See also Fig.15 As shown, since the first box body 120a and the second box body 120b are completely connected, when removing the introduction box 120, gently pick up the introduction box 120 to ensure that the ceramic capacitor 300 at the rear of the introduction box 120 (in the second box body 120b) does not slide forward. The state of removing the introduction box 120 is as shown in FIG. Fig.16 shown.

[0094] S08 , providing a cover plate 130 , installing the cover plate 130 on the fixing plate 110 , and locking the cover plate 130 and the fixing plate 110 .

[0095] In the present invention, the cover plate 130 can be one or more. Specifically, when the shape and size of a cover plate 130 corresponds to a receiving area 110a, that is, corresponds to a fixed plate 110, multiple cover plates 130 are provided, and the multiple cover plates 130 are installed on the fixed plates 110 in sequence. When the area of ​​a cover plate 130 is larger than the area of ​​all the receiving areas 110a, only one cover plate 130 is provided, and the cover plate 130 is installed on each fixed plate 110. Using one cover plate to cover multiple fixed plates 110 at the same time, this method only requires installing the cover plate 130 once, so it saves more time.

[0096] See also Fig.17 As shown, in a specific implementation, the shape and size of a cover plate 130 corresponds to a fixed plate 110, and four cover plates 130 need to be provided. The four cover plates 130 are sequentially installed on four fixed plates 110 to complete the panel installation.

[0097] In combination with the above, the ceramic capacitor reflow soldering mounting method of the present invention is used to mount a PCB board 200 provided with four fixing plates 110. When a skilled worker uses the mounting method to mount a PCB board 200, it takes about 2-3 minutes. Compared with the prior art method in which a skilled worker takes about 10-15 minutes to mount a PCB board 200, the present invention saves about 80% of the time.

[0098] Furthermore, in the reflow soldering method for mounting ceramic capacitors 300 of the present invention, the introduction box 120 storing the remaining ceramic capacitors 300 after the current round of mounting can be directly mounted on the fixing plate 110 when the next PCB board 200 is mounted, and the ceramic capacitors 300 in the introduction box 120 can be shaken to enter the introduction hole 1211, and the introduction box 120 can be picked up again after tilting and retracting the ceramic capacitors 300, waiting for the next board to be mounted. In other words, the ceramic capacitors 300 poured into the introduction box 120 at one time can be used for multiple board mountings, thereby saving a lot of time.

[0099] In summary, the ceramic capacitor reflow soldering mounting method of the present invention has the following effects: 1. In the above step (4), the ceramic capacitor 300 is poured into the introduction box 120, so a sufficient number of ceramic capacitors 300 can be poured without controlling the number, and the ceramic capacitor 300 will not fall onto the PCB board 200, thereby saving time; 2. In the above step (5), the ceramic capacitor 300 can be quickly shaken into the introduction hole 1211 by synchronously shaking the PCB board 200 and the introduction box 120, thereby saving a lot of time; 3. In the above step (6), the introduction box 120 can be tilted to Excess ceramic capacitors 300 can be recycled. Since the entire bottom surface of the introduction box 120 is flat, no ceramic capacitors 300 will remain in the first box body 120a. There is no need to specially clean the ceramic capacitors 300, which can save a lot of time. At the same time, it can also ensure that no ceramic capacitors 300 remain on the PCB board 200 and cause damage to the PCB board 200. Fourth, even if there are multiple fixed plates 110, installing the introduction box 120, pouring the product, shaking the product in, tilting the product back, and removing the introduction box 120 only need to be done once, which greatly simplifies the process and saves a lot of time. In summary, the board loading method of the present invention can greatly reduce the board loading time, improve the board loading efficiency, and thus increase production capacity.

[0100] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the scope of the patent application of the present invention are still within the scope covered by the present invention.

Claims

1. A ceramic capacitor mounting device, characterized in that: include: A fixing plate, wherein at least one accommodating area is provided on the fixing plate, and a plurality of accommodating holes are opened in the accommodating area; An introduction box, comprising a bottom plate and four side plates connected to the bottom plate, the four side plates are connected in sequence to form a frame, the front half of the introduction box forms a first box body, the back half of the introduction box forms a second box body, the first box body and the second box body are connected to each other, the bottom plate of the first box body is provided with at least one introduction area, the introduction area corresponds to the accommodating area, and each of the introduction areas is provided with an introduction hole corresponding to an accommodating hole on the accommodating area, the aperture of the introduction hole is larger than the aperture of the accommodating hole, and the aperture of the introduction hole is smaller than twice the diagonal length of the end face of the ceramic capacitor; the introduction box is also provided with a top plate, the top plate is connected to the top of each of the side plates, and the top plate covers the top of the second box body, so that an opening is formed on the top of the first box body; A cover plate is installed on the fixing plate, and the cover plate can cover each of the accommodating areas, and the cover plate and the fixing plate are locked to fix the ceramic capacitor introduced into the accommodating hole.

2. The ceramic capacitor mounting device according to claim 1, characterized in that: The diameter of the accommodating hole is larger than the diagonal length of the end surface of the ceramic capacitor and smaller than twice the diagonal length of the end surface of the ceramic capacitor.

3. The ceramic capacitor mounting device according to claim 1, characterized in that: The thickness of the fixing plate and the thickness of the bottom plate of the first box body are both smaller than the length of the ceramic capacitor.

4. The ceramic capacitor mounting device according to any one of claims 1 to 3, characterized in that: The accommodating holes and the introducing holes are arranged in an array.

5. The ceramic capacitor mounting device according to any one of claims 1 to 3, characterized in that: The accommodating area is further provided with a first mounting hole, and the introducing area is provided with a second mounting hole corresponding to the first mounting hole.

6. The ceramic capacitor mounting device according to any one of claims 1 to 3, characterized in that: The introduction box is provided with an opening communicating with the first box body and / or the second box body, and the opening is used to install the ceramic capacitor into the introduction box.

7. A ceramic capacitor reflow soldering method, using the ceramic capacitor soldering device according to any one of claims 1 to 6, characterized in that: The steps include: (1) providing a PCB board and at least one fixing plate, and installing the fixing plate on the PCB board; (2) providing an introduction box, the introduction box having an introduction area corresponding to the number of the accommodating areas of the fixing plate; (3) installing the introduction box on the fixing plate so that the introduction area corresponds to the accommodating area one by one, and the introduction hole on each of the introduction areas corresponds to the accommodating holes on the accommodating area one by one; (4) Pour a sufficient amount of ceramic capacitors into the introduction box; (5) fixing the relative positions of the PCB board and the introduction box, and then shaking the PCB board and the introduction box synchronously so that the ceramic capacitors in the introduction box fall into the introduction holes until all the introduction holes are filled with ceramic capacitors; (6) synchronously tilting the PCB board and the introduction box toward the direction of the second box body of the introduction box, so that all the ceramic capacitors that have not entered the introduction hole slide into the second box body; (7) detaching the introduction box from the fixing plate and ensuring that the ceramic capacitor in the second box body does not slide into the first box body; (8) Provide a cover plate, install the cover plate on the fixing plate, and lock the cover plate and the fixing plate.

8. The ceramic capacitor reflow soldering method as claimed in claim 7, characterized in that: The step (3) of "installing the import box on the fixing plate" specifically includes: making the second mounting hole of the import area correspond one-to-one with the first mounting hole of the accommodating area, and making the second mounting hole and the first mounting hole both connected to the connector on the PCB board.

9. The ceramic capacitor reflow soldering method as claimed in claim 7, characterized in that: The "fixing the relative positions of the PCB board and the import box" in the step (5) is specifically: fixing by hand by an operator or fixing by using a fixing member.

10. The ceramic capacitor reflow soldering method as claimed in claim 7, characterized in that: The thickness of the fixing plate and the thickness of the bottom plate of the first box body are both smaller than the length of the ceramic capacitor, so that after step (7), only one ceramic capacitor is accommodated in the accommodating hole, and the ceramic capacitor partially protrudes from the fixing plate.

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