Apparatus, system, and method for mitigating spring-loaded heat sink distortion

Abstract

The disclosed devices can include: (1) a heat-generating component; (2) a heat spreader including a designated area thermally coupled to the heat-generating component; (3) a plurality of springs applying a force supporting the thermal coupling between the designated area of the heat spreader and the heat-generating component; and (4) a platen concentrating the force applied by the springs toward the designated area of the heat spreader. Various other devices, systems, and methods are also disclosed.

Description

Background Technology

[0001] Heat sinks are often a critical factor in electronic and mechanical equipment. For example, telecommunications equipment (such as routers or switches) may include circuit boards with electronic components that generate heat during operation, causing the operating temperature of these components and / or adjacent components to rise. If the operating temperature rises above a certain level, such components can overheat, malfunction, or even be damaged. To prevent such problems, many electronic components may be equipped with heat sinks designed to transfer and / or dissipate heat. Heat sinks may include thermally conductive materials that transfer heat away from the electronic components, thereby cooling the electronic components and / or enabling them to achieve higher performance.

[0002] Heat sinks can also introduce certain risks to telecommunications equipment. For example, high-performance heat sinks may be relatively heavy and / or represent heavy loads, pressing against electronic components via one or more springs. Unfortunately, the pressure applied to the heat sink by the springs can actually deform and / or bend the heat sink. Such deformation and / or bending of the heat sink can weaken, reduce, and / or destroy its performance (e.g., causing the heat sink's heat spreader to crack, causing thermal coupling between the heat sink and electronic components to fail, and / or causing the electronic components to break).

[0003] Similarly, the pressure applied to a heat sink by a spring can actually deform, break, and / or otherwise damage electronic components. Such deformation and / or damage to electronic components can weaken, reduce, and / or destroy their performance. Therefore, this disclosure discovers and solves the need for additional and improved devices, systems, and methods to mitigate deformation of spring-loaded heat sinks and / or mitigate damage to electronic components cooled by such heat sinks. Summary of the Invention

[0004] As will be described in more detail below, this disclosure generally relates to apparatus, systems, and methods for mitigating deformation of a spring-loaded radiator. In one example, an apparatus for accomplishing such a task may include: (1) a heat-generating component; (2) a radiator including a designated area thermally coupled to the heat-generating component; (3) a plurality of springs that apply forces supporting the thermal coupling between the designated area of ​​the radiator and the heat-generating component; and (4) a pressure plate that concentrates the forces applied by the springs toward the designated area of ​​the radiator.

[0005] Similarly, a system for accomplishing such a task may include: (1) a computing device; and (2) a spring-loaded heat exchanger incorporated in the computing device; wherein the spring-loaded heat exchanger includes: (A) a heat-generating component; (B) a radiator including a designated area thermally coupled to the heat-generating component; (C) a plurality of springs that apply a force supporting the thermal coupling between the designated area of ​​the radiator and the heat-generating component; and (D) a pressure plate that concentrates the force applied by the springs toward the designated area of ​​the radiator.

[0006] The corresponding method may include: (1) thermally coupling a designated area of ​​a heat sink to a heat-generating component via a spring-loaded heat exchanger, the heat-generating component being mounted on a circuit board; (2) applying a plurality of springs to the spring-loaded heat exchanger, the plurality of springs exerting force to support the thermal coupling between the designated area of ​​the heat sink and the heat-generating component; and (3) applying a pressure plate to the spring-loaded heat exchanger, the pressure plate concentrating the force exerted by the springs toward the designated area of ​​the heat sink.

[0007] Based on the general principles described herein, features from any of the embodiments described above can be combined with each other. These and other embodiments, features, and advantages will be more fully understood upon reading the following detailed description in conjunction with the accompanying drawings and claims. Attached Figure Description

[0008] The accompanying drawings illustrate numerous exemplary embodiments and are part of the specification. Together with the following description, these drawings demonstrate and explain various principles of this disclosure.

[0009] Figure 1 This is an illustration of an example device for mitigating deformation of a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0010] Figure 2 This is an illustration of an example heat-generating component that can be cooled by a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0011] Figure 3 This is an illustration of an example device for mitigating deformation of a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0012] Figure 4 This is an illustration of an example device for mitigating deformation of a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0013] Figure 5 This is an illustration of an example device for mitigating deformation of a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0014] Figure 6This is an illustration of an example device rack for a cage-mounted computing device according to one or more embodiments of the present disclosure.

[0015] Figure 7 This is an illustration of an example rack-mounted computing device according to one or more embodiments of the present disclosure.

[0016] Figure 8 This is a flowchart of an example method for mitigating deformation of a spring-loaded radiator according to one or more embodiments of the present disclosure.

[0017] Throughout the accompanying drawings, the same reference numerals and descriptions indicate similar but not necessarily identical elements. While the exemplary embodiments described herein are readily adaptable to various modifications and alternatives, specific embodiments have been shown by way of example in the drawings and will be described in detail herein. However, the exemplary embodiments described herein are not intended to be limited to the specific forms disclosed. Rather, this disclosure covers all modifications, equivalents, and alternatives falling within the scope of the appended claims. Detailed Implementation

[0018] This disclosure describes various devices, systems, and methods for mitigating deformation of spring-loaded heat sinks. As will be explained in more detail below, embodiments of this disclosure may include and / or involve a pressure plate that concentrates forces applied by a plurality of springs toward a designated area of ​​the heat sink. For example, a spring-loaded heat sink may include and / or involve springs coupled to a mounting rod that holds the heat sink in place on top of a heat-generating component. In this example, a spring-loaded heat sink may include and / or involve a pressure plate that concentrates forces applied and / or concentrated by these springs toward a pedestal of the heat sink that contacts the heat-generating component.

[0019] By concentrating and / or focusing the forces applied by these springs toward the base, the pressure plate can safely align and / or transfer these forces to the base pressing against the heat-generating component, thereby preventing these forces from being distributed to parts of the radiator that could potentially cause deformation and / or bending, or even damage to the heat-generating component. Therefore, the pressure plate enables the spring-loaded radiator to maintain a strong thermal coupling with the heat-generating component, thereby improving or maximizing radiator performance, extending the radiator's structural integrity or heat transfer capacity, and / or protecting the function of the heat-generating component.

[0020] The following will be referenced Figures 1 to 7 Detailed descriptions of example components, devices, systems, configurations, and / or implementations for mitigating deformation of spring-loaded heat sinks are provided. Furthermore, corresponding to… Figure 8 The discussion will provide a detailed description of example methods for assembling and / or manufacturing devices for mitigating deformation of spring-loaded radiators.

[0021] Figure 1An example device 100 for mitigating deformation of a spring-loaded radiator is shown. Figure 1 As shown, example device 100 may include and / or represent various features, components, and / or devices constituting and / or forming a spring-loaded heat sink. For example, device 100 may include and / or represent a heat sink 104, springs 106(1) and 106(2), and a pressure plate 108. In this example, heat sink 104 may be spring-loaded by springs 106(1) and 106(2) to press against a heat-generating component 102 coupled to circuit board 110. Specifically, heat sink 104 may include and / or incorporate a designated area (e.g., pedestal 112) that physically contacts and / or intersects with the upper surface of heat-generating component 102. Although Figure 1 Only two springs are shown, but the device 100 may also include and / or represent one or more additional springs that help to spring-load the radiator 104 to press against the heat-generating component 102.

[0022] like Figure 1 As further shown, the example device 100 may include and / or represent mounting rods 130(1) and 130(2), which hold and / or retain the heat sink 104 in proper position on top of the heat-generating component 102 via a pressure plate 108. Although Figure 1 Only two mounting rods are shown. The device 100 may also include and / or represent one or more additional mounting rods that help to hold and / or retain the radiator 104 in the proper position on top of the heat-generating component 102 via the pressure plate 108.

[0023] In some examples, mounting rods 130(1) and 130(2) may engage and / or intersect with a backplate 114, which is applied to and / or positioned relative to the circuit board 110 to press and / or lock the pressure plate 108 onto the heat sink 104 via springs 106(1) and 106(2). In these examples, springs 106(1) and 106(2) may be coupled to mounting rods 130(1) and 130(2), respectively, and apply forces supporting the thermal coupling between a designated area of ​​the heat sink 104 (e.g., pedestal 112) and the heat-generating component 102. In one example, the pressure plate 108 may concentrate and / or focus these forces applied by springs 106(1) and 106(2) toward a designated area of ​​the heat sink 104. In this way, the pressure plate 108 can safely align and / or transfer these forces to a designated area of ​​the heat sink 104 pressing against the heat-generating component 102, thereby preventing these forces from being distributed to parts of the heat sink 104 that could potentially cause the heat sink 104 to deform and / or bend or even damage the heat-generating component 102.

[0024] In some examples, radiator 104 may include and / or represent any type or form of device, structure, and / or mechanism designed to conduct, transfer, absorb, and / or dissipate heat. Radiator 104 may include and / or incorporate a variety of thermally conductive materials. Examples of such thermally conductive materials include, but are not limited to, copper, aluminum, diamond, silver, gold, alloys of one or more of the same materials, combinations or variations of one or more of the same materials, and / or any other suitable material.

[0025] In some examples, the radiator 104 may comprise and / or consist of a series of ridges or ridges extending from the base. For example, the radiator 104 may include and / or combine fins and / or pin fin configurations or designs. This configuration can increase the surface area of ​​the conductive material within the radiator, thereby increasing the heat dissipated by the radiator. The radiator 104 may also include any additional or alternative structures designed to promote and / or increase heat dissipation, such as wicks, heat pipes, and / or vapor chambers.

[0026] In some examples, the heat sink 104 may include and / or incorporate a pedestal 112 that engages and / or contacts the heat-generating component 102. In one example, the pedestal 112 may be sized to substantially match the dimensions of the heat-generating component 102. For example, the pedestal 112 may be sized to cover the top surface of the heat-generating component 102, thereby providing sufficient area to achieve the necessary heat transfer. In this example, the pedestal 112 may be positioned on top of the heat-generating component 102 to form and / or establish thermal coupling with the heat-generating component 102.

[0027] In some examples, spring 106(1) and spring 106(2) may each include and / or represent any type or form of mechanical device and / or apparatus capable of storing, absorbing and / or releasing energy or force. In one example, spring 106(1) and spring 106(2) may each include and / or represent a compression helical spring. Other examples of spring 106(1) and spring 106(2) include, but are not limited to, tension springs, extension springs, horseshoe springs, torsion springs, helical springs, constant force springs, gas springs, combinations or variations of one or more of the above springs, and / or any other suitable spring.

[0028] Springs 106(1) and 106(2) may include and / or combine a variety of materials. Examples of such materials include, but are not limited to, metals, copper, aluminum, alloys, plastics, polymers, combinations or variations of one or more of the above materials, and / or any other suitable material.

[0029] In some examples, the pressure plate 108 may include and / or represent any type or form of physical structure and / or mechanism for pressing the radiator 104 against the heat-generating electrical assembly 102. In one example, the pressure plate 108 may include and / or incorporate a contact area 122 that presses against and / or contacts the top surface of the radiator 104 (e.g., a finned structure). In this example, the contact area 122 of the pressure plate 108 may be positioned on top of the radiator 104 relative to the pedestal 112 of the radiator 104. By positioning the pressure plate 108 on top of the radiator 104 in this manner, the boundary of the contact area 122 may be substantially aligned with and / or coincide with the boundary of the pedestal 112 of the radiator 104. In some examples, the pressure plate 108 may be located and / or positioned between the mounting rods 130(1) and 130(2) and the springs 106(1) and 106(2) of the radiator 104. This position and / or configuration of the pressure plate 108 can facilitate the spring-loaded pressure plate 108 toward a designated area of ​​the heat sink 104. Therefore, the pressure plate 108 can avoid contact with the heat sink 104 outside the contact area 122 to protect the structural integrity of the heat sink 104 (1).

[0030] In some examples, circuit board 110 may include and / or represent any sheet of insulating material that facilitates the mounting (e.g., mechanical support) and / or interconnection (e.g., electrical coupling) of electrical and / or electronic components. In one example, circuit board 110 may include and / or represent a printed circuit board (PCB). Examples of circuit board 102 include, but are not limited to, single-sided boards, double-sided boards, multilayer boards, motherboards, line cards, backplanes, intermediate boards, and / or any other suitable type of circuit board. Various components (e.g., heat-generating components 102) may be laminated, etched, attached, soldered, and / or otherwise coupled to circuit board 110.

[0031] In some examples, circuit board 110 may include various conductive layers and / or traces (not necessarily on a surface). Figure 1 (As shown in the diagram). Such conductive layers and / or traces may include and / or represent conductive materials. Examples of such conductive materials include, but are not limited to, copper, aluminum, silver, gold, alloys of one or more of the same materials, combinations or variations of one or more of the same materials, and / or any other suitable material.

[0032] In one example, each layer may include and / or represent a conductive plane, which is etched and / or laid during the manufacturing stage to create various conductive traces throughout the circuit board 110. In this example, the etched and / or laid conductive traces may be separated from each other and / or interconnected as needed to form one or more circuits that incorporate electrical components and / or electronics across the circuit board 110.

[0033] In some examples, the backplate 114 may include and / or represent any type or form of physical structure and / or mechanism for pressing the heat sink 104 to the heat-generating electrical assembly 102. In one example, the backplate 114 may provide support and / or additional structures to the spring-loaded heat sink. In one example, the heat sink 104 may be applied to... Figure 1 The top side of the circuit board 110 is used to facilitate contact with the heat-generating component 102, and a backplate 114 can be applied to it. Figure 1 The bottom side of the circuit board 110. In this example, the back plate 114 and / or the pressure plate 108 can be fixed in place by mounting rods 130(1) and 130(2).

[0034] In some examples, mounting rod 130(1) and mounting rod 130(2) may each include and / or represent any type or form of attachment, mounting, and / or coupling structure or device. For example, mounting rod 130(1) and mounting rod 130(2) may each include and / or represent mating screws and threaded rods or uprights. In another example, mounting rod 130(1) and mounting rod 130(2) may each include and / or represent mating pins and extension rods or brackets.

[0035] Mounting rods 130(1) and 130(2) may include and / or combine a variety of materials. Examples of such materials include, but are not limited to, metals, copper, aluminum, alloys, plastics, polymers, combinations or variations of one or more of the above materials, and / or any other suitable material.

[0036] Figure 2 An example embodiment of a heat-generating component 102 capable of being cooled by a spring-loaded heat sink is illustrated. In some examples, the heat-generating component 102 may include and / or represent any type or form of heat-generating device, component, and / or circuitry. In one example, the heat-generating component 102 may include and / or represent an integrated circuit. Other examples of the heat-generating component 102 include, but are not limited to, a central processing unit (CPU), a microprocessor, a microcontroller, a field-programmable gate array (FPGA) implementing a soft-core processor, an application-specific integrated circuit (ASIC), a memory (e.g., a high-bandwidth memory device), variations or combinations of one or more of the above, and / or any other suitable heat-generating component.

[0037] Figure 3 An example device 300 for mitigating deformation of a spring-loaded radiator is shown. Figure 3 As shown, example device 300 may include and / or represent various features, components, and / or devices constituting and / or forming a spring-loaded radiator assembly. In some examples, device 300 may include and / or represent the above combinations. Figure 1 Any feature, component, and / or device described in device 100.

[0038] In some examples, device 300 may include and / or represent heat sinks 104(1) and 104(2), springs 304(1) and 304(2), and pressure plate 108. In this example, heat sink 104(1) may be spring-loaded by spring 304(1) to press against a heat-generating component coupled to circuit board 110. Additionally, heat sink 104(2) may be spring-loaded by spring 304(2) to press against an additional heat-generating component coupled to circuit board 110. In one example, a mounting rod may secure pressure plate 108 to a back plate 114, which is applied and / or positioned relative to the circuit board to press and / or lock pressure plate 108 against heat sinks 104(1) and 104(2) respectively via springs 304(1) and 304(2).

[0039] In some examples, the pressure plate 108 may include and / or represent spring-loaded extensions 318(1) and 318(2) that concentrate the forces exerted by springs 304(1) and 304(2) toward designated areas (e.g., pedestals) of the radiator 104(1) and radiator 104(2), respectively. For example, the spring-loaded extension 318(1) may include and / or incorporate a spring 304(1) that presses and / or extends from the pressure plate 108 toward another surface and / or platform. In this example, the extendable surface and / or platform may constitute and / or represent a contact area positioned relative to the pedestal of the radiator 104(1) on top of the radiator 104(1). By positioning the contact area on top of the radiator 104(1) in this manner, the boundary of the contact area may be substantially aligned with the boundary of the pedestal of the radiator 104(1). Therefore, the pressure plate 108 can avoid contact with the heat sink 104(1) outside the contact area to protect the structural integrity of the heat sink 104(1).

[0040] As another example, the spring-loaded extension 318(2) may include and / or incorporate a spring 304(2) that presses and / or extends from the pressure plate 108 onto another surface and / or platform. In this example, the extendable surface and / or platform may form and / or represent another contact area positioned relative to the top of the radiator 104(2) relative to its pedestal. By positioning the other contact area on top of the radiator 104(2) in this manner, the boundary of the other contact area may be substantially aligned with the boundary of the pedestal of the radiator 104(2). Thus, the pressure plate 108 can avoid contact with the radiator 104(2) outside the contact area to protect the structural integrity of the radiator 104(2).

[0041] Figure 4 An example device 400 for mitigating deformation of a spring-loaded radiator is shown. Figure 4 As shown, example device 400 may include and / or represent various features, components, and / or means constituting and / or forming a spring-loaded radiator. For example, device 400 may include and / or represent radiator 104, springs 106(1) and 106(2), and pressure plate 108. In some examples, device 400 may include and / or represent any feature, component, and / or combination thereof. Figure 1 Device 100 and / or Figure 3 The device described in the 300 section.

[0042] In some examples, heat sink 104 may include and / or represent a base 406. In one example, the base 406 of heat sink 104 may include and / or incorporate a heat spreader 404. Alternatively or additionally, heat sink 104 may include and / or represent a plurality of fins 402 coupled to the base 406.

[0043] In some examples, radiator 104 may include and / or represent a reinforcing column 408 that extends, extends, and / or spans at least a portion of the heat spreader 404. In one example, the reinforcing column 408 may reinforce and / or improve the integrity of the structural base 406 to withstand the pressure and / or compression exerted by springs 106(1) and 106(2) without collapsing and / or being damaged. Additionally or alternatively, radiator 104 may include and / or represent a reinforcing standoff 410 that extends, extends, and / or spans at least the length (or slightly above) of the fins 402 from the base 406. In some examples, the reinforcing standoff 410 may reinforce and / or improve the structural integrity of the fins 402 to withstand the pressure exerted by springs 106(1) and 106(2) without collapsing and / or being damaged. For example, a pressure plate 108 may directly contact the reinforcing standoff 410 instead of the fins 402. In this way, the pressure plate 108 can concentrate the force applied by the springs 106(1) and 106(2) toward a designated area of ​​the radiator 104 via the reinforcing stand 410 without applying too much pressure to the fins 402 or risking damage to the fins 402.

[0044] The reinforcing column 408 and / or reinforcing member 410 may include and / or combine a variety of materials. Examples of such materials include, but are not limited to, metals, steel, copper, aluminum, alloys, plastics, polymers, combinations or variations of one or more of the above materials, and / or any other suitable material.

[0045] Figure 5 An example device 500 for mitigating deformation of a spring-loaded radiator is shown. Figure 5As shown, example device 500 may include and / or represent various features, components, and / or devices constituting and / or forming a spring-loaded radiator. For example, device 500 may include and / or represent radiator 104, springs 106(1) and 106(2), and pressure plate 108. In some examples, device 500 may include and / or represent any feature, component, and / or combination thereof. Figure 1 Device 100 in Figure 3 Device 300 and / or Figure 4 The device described in device 400.

[0046] In some examples, the pressure plate 108 may include and / or form an opening 508 adapted to accommodate the heat sink 504. For example, the heat sink 504 may include and / or represent a segment 506 that extends through the opening 504 of the pressure plate 108 to contact the heat-generating component 510. In this example, by making this contact, the segment 506 can thermally couple the heat sink 504 to the heat-generating component 510.

[0047] In some examples, radiator 104 and radiator 504 may be thermally isolated from each other. Therefore, radiator 104 and radiator 504 may substantially constitute and / or form a separate radiator assembly. The thermal isolation between radiator 104 and radiator 504 may accommodate, support, and / or facilitate the individual cooling needs and / or temperature regulation of heat-generating components 102 and 510.

[0048] Figure 6 The illustration shows an example network rack 600 for accommodating and / or rack-mounted network equipment. (See illustration for example.) Figure 6 As shown, network rack 600 may include various holes for mounting rack-mounted network equipment. In this example, network rack 600 can accommodate and / or support rack-mounted network equipment of various sizes. These sizes can be expressed in rack units (e.g., 1U, 2U, 3U, 4U, 5U, etc.).

[0049] Figure 7 It shows the adaptation in Figure 6 Example rack-mounted computing device 700 within network rack 600. (e.g.) Figure 7 As shown, the rack-mounted computing device 700 can be configured to be installed on... Figure 6The rack-mounted computing device 700 can be housed within a network rack 600. Therefore, the rack-mounted computing device 700 may be contained within the network rack 600. In this example, the rack-mounted computing device 700 may represent a rack-mounted switch or router. The rack-mounted computing device 700 may house and / or contain all or part of devices 100, 300, 400, and 500. In other words, the rack-mounted computing device 700 may contain all spring-loaded heat sink assemblies and / or corresponding components included in any of these devices.

[0050] Figure 8 This is a flowchart of an example method 800 for assembling and / or manufacturing an apparatus for mitigating deformation of a spring-loaded heat sink. Method 800 may include step (810): thermally coupling a designated area of ​​the heat sink to a heat-generating component via a spring-loaded heat exchanger, the heat-generating component being mounted onto a circuit board. Step 810 may be performed in a variety of ways, including in combination with the above. Figures 1 to 7 Any method described. For example, a computing equipment manufacturer or subcontractor may thermally couple a designated area of ​​a heat sink to a heat-generating component mounted on a circuit board via a spring-loaded heat exchanger.

[0051] Method 800 may further include step (820): applying a plurality of springs to the spring-loaded heat exchanger, the plurality of springs applying force to support thermal coupling between a designated area of ​​the heat sink and the heat-generating component. Step 820 may be performed in a variety of ways, including combinations thereof. Figures 1 to 7 Any method described. For example, a computing equipment manufacturer or subcontractor may apply multiple springs to a spring-loaded heat exchanger, which apply force to support the thermal coupling between a designated area of ​​the radiator and the heat-generating component.

[0052] Method 800 may further include step (830): applying a pressure plate to a spring-loaded heat exchanger, the pressure plate concentrating the force supplied by the spring toward a designated area of ​​the heat exchanger. Step 830 may be performed in a variety of ways, including combinations thereof. Figures 1 to 7 Any method described. For example, a computing equipment manufacturer or subcontractor may apply a pressure plate to a spring-loaded heat exchanger, which concentrates the force given by the spring toward a designated area of ​​the radiator.

[0053] While the foregoing disclosure has illustrated various embodiments using specific block diagrams, flowcharts, and examples, each block diagram component, flowchart step, operation, and / or component described and / or illustrated herein may be configured individually and / or collectively using a wide range of hardware, software, or firmware (or any combination thereof). Furthermore, any disclosure of components included within other components should be considered exemplary in nature, as many other architectures can be implemented to achieve the same functionality.

[0054] The process parameters and sequence of steps described and / or illustrated herein are given by way of example only and may vary as needed. For example, while the steps shown and / or described herein may be shown or discussed in a particular order, these steps do not necessarily need to be performed in the order shown or discussed. The various exemplary methods described and / or illustrated herein may also omit one or more of the steps described or illustrated herein, or include additional steps beyond those disclosed herein.

[0055] The foregoing description has been provided to enable others skilled in the art to best utilize the various aspects of the exemplary embodiments disclosed herein. This exemplary description is not intended to be exhaustive or limited to any precise form disclosed. Many modifications and variations are possible without departing from the spirit and scope of this disclosure. The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. Reference should be made to the appended claims and their equivalents in determining the scope of this disclosure.

[0056] Unless otherwise stated, the terms “connected to” and “coupled” (and their derivatives) as used in the specification and claims shall be construed as allowing direct and indirect (i.e., via other elements or components) connections. Furthermore, the terms “a” or “an” as used in the specification and claims shall be construed as “at least one”. Finally, for ease of use, the terms “comprising” and “having” (and their derivatives) as used in the specification and claims may be used interchangeably with the word “including” and have the same meaning.

Claims

1. A device for reducing deformation of a spring-loaded radiator, comprising: The heat-generating component is coupled to the circuit board; Radiator, the radiator comprising: base At least one reinforcing member coupled to the base, and A designated area physically coupled to the heating element; Multiple springs apply force that supports the physical coupling between the designated area of ​​the radiator and the heat-generating component; A pressure plate, coupled between the radiator and the plurality of springs, and in direct contact with the at least one reinforcing member, concentrates the force applied by the plurality of springs toward the designated area of ​​the radiator via the at least one reinforcing member; and A backplate is applied relative to the circuit board and the pressure plate, and is secured to the pressure plate via a plurality of mounting rods.

2. The apparatus of claim 1, wherein the designated area of ​​the heat sink includes a pedestal, the pedestal: Contact with the heating element; and The dimensions are designed to substantially match the dimensions of the heating element.

3. The apparatus according to claim 2, wherein: The pressure plate includes a contact area, the contact area The pedestal of the radiator is positioned on top of the radiator opposite to the radiator's base; and The pedestal of the heat sink includes a boundary that is substantially aligned with the boundary of the contact area of ​​the pressure plate.

4. The apparatus of claim 1, wherein the spring is applied to a plurality of mounting rods that hold the radiator in place on top of the heat-generating component.

5. The apparatus of claim 4, wherein the pressure plate is located between the heat sink and the spring applied to the mounting rod to spring-load the pressure plate toward the designated area of ​​the heat sink.

6. The apparatus of claim 1, wherein the pressure plate includes a spring-loaded extension that concentrates the force applied by the spring toward the designated area of ​​the heat sink, wherein the spring-loaded extension of the pressure plate is coupled to the spring.

7. The apparatus according to claim 6, further comprising: Additional heating element; An additional heat sink, the additional heat sink including a designated area thermally coupled to the additional heat-generating component; as well as Multiple additional springs apply force that supports thermal coupling between the designated area of ​​the additional heat sink and the additional heat-generating component; as well as The pressure plate further includes an additional spring-loaded extension that concentrates the force applied by the additional spring toward the designated area of ​​the additional heat sink, wherein the additional spring-loaded extension of the pressure plate is coupled to the additional spring.

8. The device according to claim 1, wherein the spring comprises a set of compression helical springs.

9. The apparatus of claim 1, wherein the heat sink comprises at least one of the following: Multiple fins; and Heat spreader.

10. The apparatus of claim 1, wherein the heat sink comprises: A heat spreader is incorporated into the base; Multiple fins are coupled to the base; as well as At least one reinforcing column extends across at least a portion of the heat spreader, and the at least one reinforcing column extends from the base at least the length of the fin.

11. The apparatus of claim 1, wherein the pressure plate forms an opening; and further comprises: Additional heating element; as well as An additional heat sink, the additional heat sink comprising a section extending through the opening in the pressure plate to thermally couple the additional heat sink to the additional heat-generating component.

12. A system for mitigating deformation of a spring-loaded radiator, comprising: Computing devices; as well as A spring-loaded heat exchanger is incorporated in the computing device, wherein the spring-loaded heat exchanger comprises: The heat-generating component is coupled to the circuit board; Radiator, the radiator comprising: base At least one reinforcing member coupled to the base, and A designated area physically coupled to the heating element; Multiple springs apply a force that supports the physical coupling between a designated area of ​​the radiator and the heat-generating component; A pressure plate, coupled between the radiator and the plurality of springs, and in direct contact with the at least one reinforcing member, concentrates the force applied by the plurality of springs toward the designated area of ​​the radiator via the at least one reinforcing member; and A backplate is applied relative to the circuit board and the pressure plate, and is secured to the pressure plate via a plurality of mounting rods.

13. The system of claim 12, wherein the designated area of ​​the heat sink includes a pedestal, the pedestal: Contact with the heating element; and The dimensions are designed to substantially match the dimensions of the heating element.

14. A method for reducing deformation of a spring-loaded radiator, comprising: A designated area of ​​a heat sink is physically coupled to a heat-generating component via a spring-loaded heat exchanger. The heat-generating component is mounted on a circuit board. The heat sink includes a base and at least one reinforcing member coupled to the base. Multiple springs are applied to the spring-loaded heat exchanger, and the multiple springs exert force to support the physical coupling between the designated area of ​​the radiator and the heat-generating component; A pressure plate is applied to the spring-loaded heat exchanger, the pressure plate being coupled between the radiator and the plurality of springs, and in direct contact with the at least one reinforcing member, and concentrating the force given by the plurality of springs toward the designated area of ​​the radiator via the at least one reinforcing member; A backplate is applied relative to the circuit board and the pressure plate; as well as The pressure plate is fixed to the back plate via multiple mounting rods.

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