A control cabinet

Abstract

The application relates to a control cabinet which comprises a cabinet body and a cabinet door hinged to the cabinet body; a heat dissipation device for dissipating heat of electrical elements in the cabinet body, an environment monitoring assembly for monitoring the environment temperature inside and outside the cabinet body and a decision controller are installed in the cabinet body; an exhaust heat dissipation hole is arranged at the top of one side of the cabinet body, and an air suction heat dissipation hole is arranged at the bottom of the cabinet body; the heat dissipation device comprises a directional heat dissipation assembly, an air flow cooling assembly and a guide assembly; the directional heat dissipation assembly comprises an exhaust fan and an air suction fan; the environment monitoring assembly comprises an external temperature sensor for collecting the external environment temperature of the cabinet body and an internal temperature sensor for collecting the internal environment temperature of the cabinet body; the decision controller receives the temperature information collected by the environment monitoring assembly in real time, judges the application scene of the control cabinet according to the temperature information, adjusts the opening and closing of the heat dissipation device and the heat dissipation power for heat dissipation. The application has the effects of effectively improving the equipment scene applicability and prolonging the service life of the equipment in the control cabinet.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of control cabinets, in particular to a control cabinet. BACKGROUND

[0002] The control cabinet is a kind of closed or semi-closed metal cabinet or screen frame equipped with switching equipment, measuring instruments, protective appliances or auxiliary equipment. The control cabinet is commonly used in the power supply or electrical control facilities in modern buildings, and is used to control the operation of one or a group of electrical facilities to meet the normal production and life needs of people. In order to ensure the normal operation of the electrical components in the control cabinet, a forced air cooling device is generally provided in the control cabinet to send outside air into the control cabinet to regulate the internal environment temperature of the control cabinet and cool the electrical components in the control cabinet. However, the application site of some control cabinets is too high in temperature due to production activities, resulting in poor heat dissipation performance of the control cabinet.

[0003] Chinese patent with publication number 201910310365.7 discloses a high-efficiency heat dissipation control cabinet, which comprises a cabinet body and at least one directional heat dissipation device arranged in the cabinet body. The directional heat dissipation device comprises a plurality of high-heat-output component mounting plates connected to the plurality of side plates of the cabinet body at both ends, a plurality of heat-conducting plates, a plurality of sealing plates, a suction fan and an exhaust fan. The two side ends of one sealing plate are connected to the one side ends of the plurality of heat-conducting plates in a one-to-one correspondence. The two side ends of the other sealing plate are connected to the other side ends of the plurality of heat-conducting plates in a one-to-one correspondence. The outer ends of the plurality of heat-conducting plates are connected to the opposite ends of the plurality of high-heat-output component mounting plates in a one-to-one correspondence. The suction fan is arranged at one air vent and connected to one side plate. The exhaust fan is arranged at the other air vent and connected to the other side plate. The application uses the suction fan and the exhaust fan to realize air cooling and heat dissipation. However, when the external environment temperature is too high due to production activities, weather and other factors, the heat dissipation efficiency is poor, which affects the normal operation and service life of the electrical components in the control cabinet.

[0004] In view of the above-mentioned related technologies, the existing control cabinet has a straight-line decrease in heat dissipation efficiency when the external environment temperature is too high, which easily affects the normal operation and service life of the electrical components in the control cabinet. SUMMARY

[0005] In order to solve the problem that the existing control cabinet has a straight-line decrease in heat dissipation efficiency when the external environment temperature is too high, which easily affects the normal operation and service life of the electrical components in the control cabinet, the present application provides a control cabinet.

[0006] In a first aspect, the present application provides a control cabinet, which adopts the following technical solution:

[0007] A control cabinet, comprising a cabinet body and a cabinet door, the cabinet door is hinged to the cabinet body; a heat dissipation device for dissipating heat of electrical components in the cabinet body, an environment monitoring assembly for monitoring the temperature of the environment inside and outside the cabinet body and a decision controller are installed in the cabinet body; an exhaust heat dissipation hole is formed at the top of one side of the cabinet body, and an air suction heat dissipation hole is formed at the bottom of the cabinet body; the heat dissipation device and the environment monitoring assembly are in communication connection with the decision controller;

[0008] The heat dissipation device comprises a directional heat dissipation assembly for guiding the directional flow of heat dissipation air in the cabinet body, an air flow cooling assembly for cooling the heat dissipation air flow and a guide assembly for adjusting the direction of the heat dissipation air flow; the directional heat dissipation assembly comprises an exhaust fan arranged at the exhaust heat dissipation hole and an air suction fan arranged at the air suction heat dissipation hole in the cabinet body;

[0009] The environment monitoring assembly comprises an external temperature sensor for collecting the temperature of the external environment of the cabinet body and an internal temperature sensor for collecting the temperature of the internal environment of the cabinet body;

[0010] The decision controller receives the temperature information collected by the environment monitoring assembly in real time, and adjusts the opening and closing of the heat dissipation device and the heat dissipation power according to the temperature information to dissipate heat.

[0011] Preferably, the directional heat dissipation assembly further comprises a directional mounting plate and a plurality of directional fans mounted on the directional mounting plate for upwardly conveying the heat dissipation air flow, the directional mounting plate is fixedly arranged in the cabinet body to divide the cabinet body into a mounting cavity and a cooling cavity, the air flow cooling assembly is mounted in the cooling cavity, and the air suction heat dissipation hole is in communication with the cooling cavity.

[0012] Preferably, the air flow cooling assembly comprises a plurality of semiconductor refrigeration sheets arranged at the bottom of the cooling cavity, the refrigeration ends of the plurality of semiconductor refrigeration sheets are located in the cooling cavity, and a plurality of heat dissipation fins are arranged on the refrigeration end of the semiconductor refrigeration sheet.

[0013] Preferably, an energy storage box is arranged between adjacent heat dissipation fins, the plurality of energy storage boxes are fixedly arranged on the refrigeration end of the semiconductor refrigeration sheet, the energy storage box comprises a box body and an energy storage medium located in the box body, the box body is made of a material with high thermal conductivity, and the energy storage medium is made of a material with high specific heat capacity.

[0014] Preferably, the guide assembly comprises a mounting frame and a plurality of guide fans mounted on the mounting frame, the mounting frame comprises a plurality of mounting ribs arranged in sequence along the width direction of the cabinet body, both ends of the plurality of mounting ribs are fixedly connected with the inside of the cabinet body; a partition plate is arranged on the top of each of the plurality of mounting ribs, the partition plates of adjacent mounting ribs form a mounting groove, a plurality of mounting waist holes are arranged on both ends of the width direction of each of the plurality of mounting ribs along the length direction thereof, the guide fans are mounted in the mounting groove and fixedly arranged on the mounting frame through the mounting waist holes, and the guide fans are arranged towards the high-heat electric components in the cabinet body.

[0015] Preferably, one side of the exhaust heat dissipation hole of the cabinet body is provided with a closed interlayer, a plurality of closing plates for closing the air inlet heat dissipation hole and the exhaust heat dissipation hole are slidably arranged in the closed interlayer, a plurality of the closing plates are commonly connected with a control connecting rod, and a closing cylinder is arranged on the top of the cabinet body, and the piston rod end of the closing cylinder is connected with the control connecting rod.

[0016] Preferably, the bottom of each of the exhaust fan and the air inlet fan is provided with a supporting rod, the bottom of each of the plurality of supporting rods is hingedly connected with a fixing rod, and the plurality of fixing rods are fixedly connected with the inside of the cabinet body; the top of each of the exhaust fan and the air inlet fan is hingedly connected with an adjusting rod, the plurality of adjusting rods are hingedly connected with the control connecting rod, an adjusting sliding groove for the adjusting rod to slide up and down is formed in the inner wall of the cabinet body, and the adjusting sliding groove is communicated with the closed interlayer.

[0017] Preferably, the decision controller receives the temperature information collected by the environment monitoring assembly in real time, and adjusts the opening and closing and the heat dissipation power of the heat dissipation device according to the temperature information to perform heat dissipation, specifically including the following steps:

[0018] S1, the decision controller receives the temperature information collected by the environment monitoring assembly in real time, and the temperature information includes an external environment temperature T1 and an internal environment temperature T2 of the control cabinet;

[0019] S2, the decision controller determines whether the external environment temperature T1 is greater than a pre-set external heat dissipation threshold C1 based on the temperature information;

[0020] S3, if not, the internal environment temperature T2 of the control cabinet is controlled to control the opening and closing and the power adjustment of the directional heat dissipation assembly, the air flow cooling assembly and the guide assembly to perform heat dissipation;

[0021] S4, if greater, the control of the piston rod of the closed cylinder extends to drive the control connecting rod to descend, the control connecting rod drives the closing plate to slide out of the closed layer to close the air inlet and exhaust heat dissipation holes, and the control connecting rod drives the adjusting rod connected therewith to descend and tilt, and further drives the exhaust fan and the air inlet fan to tilt downward to the inner side wall of the cabinet; and based on the change of the environmental temperature T2 in the control cabinet, the directional heat dissipation assembly, the air flow cooling assembly and the guide assembly are controlled to be opened and closed and the power is adjusted to dissipate heat.

[0022] Preferably, the step S3 and S4 based on the change of the environmental temperature T2 in the control cabinet to control the directional heat dissipation assembly, the air flow cooling assembly and the guide assembly to be opened and closed and the power to be adjusted to dissipate heat specifically comprises the following steps:

[0023] After the decision controller receives the start signal, the directional heat dissipation assembly and the guide assembly are started to form a circulating heat dissipation air flow to dissipate heat for the electrical elements in the cabinet.

[0024] The decision controller obtains the environmental temperature T2 in the control cabinet in real time, generates a temperature change curve, and controls the air flow cooling assembly to be started when the environmental temperature T2 in the control cabinet is greater than a preset cabinet temperature threshold C2.

[0025] The n temperature points in a standard period are extracted based on the temperature change curve, the average temperature change value Y is calculated according to a preset temperature change calculation formula, the power gear of the air flow cooling assembly is increased when the average temperature change value Y is greater than a preset temperature change threshold Y1, and the power gear of the air flow cooling assembly is decreased when the average temperature change value Y is less than a preset temperature change threshold Y2; the temperature change calculation formula is:

[0026] Y = (X1+X2+...+Xn) / n-X1, wherein Xn is the temperature value of the n th temperature point in the standard period of the temperature change curve.

[0027] The power gear of the air flow cooling assembly is specifically set as follows: the air flow cooling assembly is pre-programmed to set a plurality of power gears of the air flow cooling assembly based on the number of semiconductor refrigeration pieces started and the starting power.

[0028] Preferably, the environmental monitoring assembly further comprises a humidity sensor arranged on the cabinet for detecting the external humidity, and the decision controller receives the external humidity information collected by the humidity controller in real time, and controls the closed cylinder to drive the control connecting rod to close the air inlet and exhaust heat dissipation holes when the external humidity is greater than a preset humidity threshold.

[0029] In summary, the present application has at least one of the following beneficial technical effects:

[0030] 1. Through the setting of the decision controller, the heat dissipation device and the environment monitoring component, the environmental temperature inside and outside the cabinet is monitored in real time, and based on the internal temperature of the cabinet and the external environmental temperature, the opening and closing of the air cooling component and the adjustment of the power gear are controlled, the intelligent adjustment of the cabinet heat dissipation scheme based on the external environmental temperature is realized, the control cabinet can maintain good heat dissipation performance in various application scenarios, and the equipment scene applicability and the service life of the equipment in the control cabinet are improved;

[0031] 2. Through the setting of the closed interlayer, the closed plate and the control connecting rod, when the external environmental temperature is greater than the pre-set external heat dissipation threshold, the decision controller determines that the control cabinet is in a high-temperature application scenario, and the external air is not suitable as a heat dissipation air source. The closed cylinder is controlled to drive the control connecting rod and the closed plate to slide down, and the air inlet and exhaust holes of the cabinet are closed, the internal circulation of the heat dissipation air flow is realized, and the heat dissipation air flow entering the cooling cavity is continuously cooled by the air cooling component, so that the control cabinet can still maintain high heat dissipation performance when the external environmental temperature is too high, and the equipment scene applicability is effectively improved;

[0032] 3. Through the setting of the supporting rod, the fixing rod and the adjusting rod, when the control connecting rod drives the closed plate to slide out of the closed interlayer to close the air inlet and exhaust holes, the control connecting rod drives the adjusting rod connected thereto to move downward and tilt, and then drives the exhaust fan and the air inlet fan to tilt downward close to the inner side wall of the cabinet, thereby constructing a heat dissipation air flow circulation channel in the cabinet, guiding the high-temperature heat dissipation air flow at the top of the cabinet to blow obliquely downward close to the inner wall of the cabinet, so that the high-temperature heat dissipation air flow enters the cooling cavity for recooling, avoiding the influence of the high-temperature heat dissipation air flow on the electrical components, and helping to construct a stable internal heat dissipation channel, so that the control cabinet can still maintain high heat dissipation performance when the external environmental temperature is too high, and the equipment scene applicability is effectively improved;

[0033] 4. Through the setting of the humidity sensor, when the external humidity is too high, the control connecting rod is controlled to drive the closed plate to slide out of the closed interlayer to close the air inlet and exhaust holes, and an internal heat dissipation channel is constructed, avoiding the entry of external humid water vapor into the control cabinet to erode the electrical components, and helping to improve the protection performance of the control cabinet and the service life of the electrical components in the cabinet. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a front view structural schematic diagram of the control cabinet in the embodiment of the present application;

[0035] Figure 2 is a rear view structural schematic diagram of the control cabinet in the embodiment of the present application;

[0036] Figure 3 is a system block diagram of the control cabinet in the embodiment of the present application;

[0037] Figure 4 is a side view schematic diagram of a control cabinet in the embodiment of the present application;

[0038] Figure 5 is a structural schematic diagram of a semiconductor refrigeration sheet in the embodiment of the present application;

[0039] Figure 6 is a sectional schematic diagram of an energy storage box in the embodiment of the present application;

[0040] Figure 7 is a structural schematic diagram of a guide assembly in the embodiment of the present application;

[0041] Figure 8 is a partial enlarged schematic diagram of part A in Figure 4

[0042] Figure 9 is a control cabinet heat dissipation mode selection method flow chart in the embodiment of the present application;

[0043] Figure 10 is a method flow chart of power adjustment of a heat dissipation device in the embodiment of the present application.

[0044] BRIEF DESCRIPTION OF DRAWINGS: 1, cabinet body; 11, exhaust heat dissipation hole; 12, suction heat dissipation hole; 13, mounting cavity; 14, cooling cavity; 15, closed interlayer; 151, closing plate; 152, control connecting rod; 153, closing electric cylinder; 16, support rod; 17, fixed rod; 18, adjusting rod; 2, cabinet door; 3, heat dissipation device; 31, directional heat dissipation assembly; 311, exhaust fan; 312, suction fan; 313, directional mounting plate; 314, directional fan; 32, air flow cooling assembly; 321, semiconductor refrigeration sheet; 322, heat dissipation fin; 323, energy storage box; 324, box body; 325, energy storage medium; 33, guide assembly; 331, mounting frame; 332, guide fan; 333, mounting edge plate; 334, partition plate; 335, mounting groove; 336, mounting waist hole; 4, environment monitoring assembly; 41, external temperature sensor; 42, internal temperature sensor; 43, humidity sensor; 5, decision controller. DETAILED DESCRIPTION

[0045] The following will be described in detail in combination with the accompanying drawings Figures 1-10 The present application will be further described in detail.

[0046] The embodiment of the present application discloses a control cabinet. Referring to Figures 1-8 ​The utility model provides a control cabinet, including cabinet 1 and cabinet door 2, cabinet door 2 is hinged to set up cabinet 1 on, install the heat dissipation device 3 for the heat dissipation of electric element in cabinet 1 for monitoring the environmental monitoring assembly 4 and decision controller 5 for monitoring the environmental temperature in and outside cabinet 1 in cabinet 1, the top of one side of cabinet 1 is provided with exhaust heat dissipation hole 11, and the bottom is provided with suction heat dissipation hole 12, heat dissipation device 3 and environmental monitoring assembly 4 are all connected with decision controller 5 communication, heat dissipation device 3 includes the directional heat dissipation assembly 31 for guiding the directional flow heat dissipation of heat dissipation airflow in cabinet 1, the airflow cooling assembly 32 for cooling heat dissipation airflow and the guide assembly 33 for adjusting the direction of heat dissipation airflow, environmental monitoring assembly 4 includes the outside temperature sensor 41 for collecting the environmental temperature outside cabinet 1, the inside temperature sensor 42 for collecting the internal environmental temperature of cabinet 1, decision controller 5 receives the temperature information collected by environmental monitoring assembly 4 in real time, judges the control cabinet application scene adjustment control heat dissipation device 3 opening and closing and heat dissipation power and carries out heat dissipation according to temperature information, through the setting of decision controller 5, heat dissipation device 3 and environmental monitoring assembly 4, the environmental temperature in and outside cabinet 1 is monitored in real time, and based on the internal environmental temperature of cabinet 1 and the environmental temperature outside, the opening and closing and power gear adjustment of airflow cooling assembly 32 are controlled, realize the intelligent adjustment cabinet 1 heat dissipation scheme based on the environmental temperature outside, ensure that the control cabinet can keep good heat dissipation performance under various application scenes, reach the effect of effectively improving equipment scene applicability and improving the service life of equipment in control cabinet.

[0047] Referring to Figures 2-4 , directional heat dissipation assembly 31 includes exhaust fan 311 set in exhaust heat dissipation hole 11 in cabinet 1, suction fan 312 in suction heat dissipation hole 12, directional mounting plate 313 and a plurality of directional fans 314 for transporting heat dissipation airflow upwards and installed on directional mounting plate 313, directional mounting plate 313 is fixedly arranged in cabinet 1 and divides cabinet 1 into mounting cavity 13 and cooling cavity 14, airflow cooling assembly 32 is installed in cooling cavity 14, and suction heat dissipation hole 12 is communicated with cooling cavity 14. Through the setting of exhaust fan 311, suction fan 312 and directional fan 314, stable unidirectional heat dissipation airflow can be formed in cabinet 1, which helps to efficiently heat the electric elements in cabinet 1, avoids the phenomenon of airflow short circuit, and effectively improves the heat dissipation efficiency of the control cabinet.

[0048] Referring to Figures 2-4, the air-cooling assembly 32 comprises a plurality of semiconductor cooling fins 321 arranged at the bottom of the cooling cavity 14, the refrigeration end of each of the plurality of semiconductor cooling fins 321 is located in the cooling cavity 14, and a plurality of cooling fins 322 are arranged on the refrigeration end of the semiconductor cooling fin 321. Through the arrangement of the semiconductor cooling fin 321 and the plurality of cooling fins 322, the semiconductor cooling fin 321 can cool the cooling cavity 14, the cooling fins 322 further increase the contact area of the semiconductor cooling fin 321 and the cooling air flow entering the cooling cavity 14, can efficiently cool and cool the cooling air flow entering the cabinet 1 from the outside, and then send it into the cabinet 1 by the directional fan 314 to blow to the electrical components, further improve the heat dissipation efficiency of the cabinet 1, help to adjust and maintain the ambient temperature in the cabinet 1, ensure that the control cabinet can maintain good heat dissipation performance in various application scenarios, and achieve the effect of effectively improving the equipment scene applicability and prolonging the service life of the equipment in the control cabinet.

[0049] With reference to Figure 5 and Figure 6 , the adjacent cooling fins 322 are provided with energy storage boxes 323, and the plurality of energy storage boxes 323 are fixedly arranged on the refrigeration end of the semiconductor cooling fin 321. The energy storage box 323 comprises a box body 324 and an energy storage medium 325 arranged in the box body 324. The box body 324 is made of a material with high thermal conductivity, and the energy storage medium 325 is made of a material with high specific heat capacity. Through the arrangement of the energy storage box 323, during the process of cooling the cooling air flow entering the cooling cavity 14 after the semiconductor cooling fin 321 is started, the energy storage box 323 loses heat synchronously, and the temperature of the box body 324 and the energy storage medium 325 is reduced. After the semiconductor cooling fin 321 is turned off, the energy storage box 323 continuously absorbs the heat of the cooling air flow, realizes continuous cooling of the cooling air flow entering the cooling cavity 14, realizes heat absorption and release, can absorb the excess refrigeration power of the semiconductor cooling fin 321, and acts as a second refrigeration source to cool the cooling air flow, which helps to shorten the starting time of the semiconductor cooling fin 321, prolongs the service life of the semiconductor, achieves the effect of green environmental protection and energy saving, and improves the control of the heat dissipation performance.

[0050] For example, if the temperature preset in the cabinet 1 is 25°, when the ambient temperature in the cabinet 1 is greater than 25°, the decision controller 5 controls the semiconductor cooling fin 321 to start cooling the cooling airflow. If the energy storage box 323 is not set, the semiconductor cooling fin 321 generally needs to be continuously started until the temperature in the cabinet 1 is lower than the preset cooling threshold, such as 20°, and then the semiconductor cooling fin 321 is turned off. Through the setting of the energy storage box 323, the difference between the cooling threshold and the preset temperature can be reduced. The cooling threshold is set to 23°, that is, the semiconductor cooling fin 321 is continuously started until the temperature in the cabinet 1 is lower than 23°, and then the semiconductor cooling fin 321 is turned off. At this time, the energy storage box 323 will continue to absorb heat and cool the cooling airflow entering the cooling cavity 14, which can effectively shorten the starting time of the semiconductor cooling fin 321, help to prolong the service life of the semiconductor, achieve the effect of green environmental protection and energy saving, and improve the control cooling performance.

[0051] With reference to Figure 4 and Figure 7 The guide assembly 33 includes a mounting frame 331 and a plurality of guide fans 332 mounted on the mounting frame 331. The mounting frame 331 includes a plurality of mounting ribs 333 arranged in sequence along the width direction of the cabinet 1. Both ends of the plurality of mounting ribs 333 are fixedly connected to the inside of the cabinet 1. The top of each mounting rib 333 is provided with a partition plate 334. The partition plates 334 of adjacent mounting ribs 333 form a mounting groove 335. Both ends of the plurality of mounting ribs 333 in the width direction are provided with a plurality of mounting waist holes 336 along the length direction. The guide fan 332 is mounted in the mounting groove 335 and fixedly arranged on the mounting frame 331 through the mounting waist hole 336, and the guide fan 332 is arranged towards the high-heat electric components in the cabinet 1. Through the setting of the mounting frame 331, the operator can adjust and determine the position of the guide fan 332 according to the actual components of the electric components in the control cabinet, and then guide the cooling airflow to directly cool the high-heat electric components. This helps to further improve the cooling efficiency of the control cabinet and avoid the phenomenon of the cooling airflow directly blowing the low-heat electric components, achieving the effect of precise control of the cooling airflow.

[0052] With reference to Figure 4 and Figure 8, the exhaust heat dissipation hole 11 of the cabinet body 1 is provided with a closed interlayer 15, a plurality of closing plates 151 for closing the air inlet heat dissipation hole 12 and the exhaust heat dissipation hole are slidably arranged in the closed interlayer 15, the plurality of closing plates 151 are commonly connected with a control connecting rod 152, the cabinet body 1 is provided with a closing electric cylinder 153 at the top, and the piston rod end of the closing electric cylinder 153 is connected with the control connecting rod 152. Through the arrangement of the closed interlayer 15, the closing plate 151 and the control connecting rod 152, when the external environment temperature is greater than the pre-set external heat dissipation threshold value, the decision controller 5 judges that the control cabinet is in a high-temperature application scene, and the external air is not suitable as a heat dissipation air source, and controls the closing electric cylinder 153 to drive the control connecting rod 152 and the closing plate 151 to slide downward, so as to close the air inlet heat dissipation hole 12 and the exhaust heat dissipation hole of the cabinet body 1, realize internal circulation of the heat dissipation airflow, and continuously cool the heat dissipation airflow entering the cooling cavity 14 through the airflow cooling assembly 32, so that the control cabinet can still maintain high-efficiency heat dissipation performance when the external environment temperature is too high, and the effect of effectively improving the equipment scene applicability is achieved.

[0053] With reference to Figure 4 and Figure 8 , the exhaust fan 311 and the air inlet fan 312 are provided with support rods 16 at the bottom, the plurality of support rods 16 are hingedly connected with fixing rods 17 at the bottom, and the plurality of fixing rods 17 are fixedly connected with the inside of the cabinet body 1; the exhaust fan 311 and the air inlet fan 312 are hingedly connected with adjusting rods 18 at the top, the plurality of adjusting rods 18 are hingedly connected with the control connecting rod 152, adjusting sliding grooves for the adjusting rods 18 to slide up and down are formed in the inner wall of the cabinet body 1, and the adjusting sliding grooves are communicated with the closed interlayer 15. Through the arrangement of the support rod 16, the fixing rod 17 and the adjusting rod 18, when the control connecting rod 152 drives the closing plate 151 to slide out of the closed interlayer 15 to close the air inlet heat dissipation hole 12 and the exhaust heat dissipation hole, the control connecting rod 152 drives the adjusting rod 18 hingedly connected therewith to move downward and tilt, and then drives the exhaust fan 311 and the air inlet fan 312 to tilt downward and close to the inner side wall of the cabinet body 1, so as to build a heat dissipation airflow circulation channel in the cabinet body 1, guide the high-temperature heat dissipation airflow at the top of the cabinet body 1, blow the high-temperature heat dissipation airflow close to the inner wall of the cabinet body 1 downward, make the high-temperature heat dissipation airflow enter the cooling cavity 14 to be cooled again, avoid the influence of the high-temperature heat dissipation airflow on the electrical elements, and help to build a stable heat dissipation airflow internal circulation channel, so that the control cabinet can still maintain high-efficiency heat dissipation performance when the external environment temperature is too high, and the effect of effectively improving the equipment scene applicability is achieved.

[0054] With reference to Figure 3, the environmental monitoring assembly 4 further comprises a humidity sensor 43 arranged on the cabinet body 1 for detecting the humidity outside, the decision controller 5 receives the humidity information outside collected by the humidity controller in real time, and controls the closed cylinder 153 to drive the control connecting rod 152 to close the air inlet heat dissipation hole 12 and the exhaust heat dissipation hole when the humidity outside is greater than the preset humidity threshold. Through the arrangement of the humidity sensor 43, when the humidity outside is too high, the control connecting rod 152 drives the closing plate 151 to slide out of the closed layer 15 to close the air inlet heat dissipation hole 12 and the exhaust heat dissipation hole, an internal heat dissipation channel is constructed, and the humid water vapor outside is prevented from entering the control cabinet to erode the electrical components, which helps to improve the protection performance of the control cabinet and prolong the service life of the electrical components in the cabinet body 1.

[0055] With reference to Figure 9 , the decision controller 5 receives the temperature information collected by the environmental monitoring assembly 4 in real time, adjusts the opening and closing and the heat dissipation power of the heat dissipation device 3 according to the temperature information to dissipate heat, which specifically includes the following steps:

[0056] S1, receiving the temperature information collected by the environmental monitoring assembly 4 in real time: the decision controller 5 receives the temperature information collected by the environmental monitoring assembly 4 in real time, and the temperature information includes the ambient temperature T1 and the internal temperature T2 of the control cabinet;

[0057] S2, judging whether the ambient temperature T1 is greater than the ambient heat dissipation threshold C1: the decision controller 5 judges whether the ambient temperature T1 is greater than the preset ambient heat dissipation threshold C1 based on the temperature information;

[0058] S3, heat dissipation: if not, the directional heat dissipation assembly 31, the air flow cooling assembly 32 and the guide assembly 33 are controlled to open and close and adjust the power based on the change of the internal temperature T2 of the control cabinet to dissipate heat;

[0059] S4, closing and cooling the air inlet and outlet holes 12 and 13: if T1>C1, the piston rod of the closing cylinder 153 is controlled to extend to drive the control link 152 to descend, the control link 152 drives the closing plate 151 to slide out of the closed layer 15 to close the air inlet and outlet holes 12 and 13, and the control link 152 drives the adjustment rod 18 to tilt downward, and then drives the air outlet fan 311 and the air inlet fan 312 to tilt downward and approach the inner side wall of the cabinet 1; the directional cooling assembly 31, the airflow cooling assembly 32 and the guide assembly 33 are controlled to open and close and adjust the power based on the change of the temperature T2 in the control cabinet, and cooling is performed. The decision controller 5 monitors the ambient temperature in real time, and when the ambient temperature T1 is greater than the preset ambient cooling threshold C1, it is judged that the control cabinet is in a high-temperature application scene, and the ambient air is not suitable as a cooling air source. The closing cylinder 153 drives the control link 152 and the closing plate 151 to slide downward to close the air inlet and outlet holes 12 and 13 of the cabinet 1, realize internal circulation of the cooling air flow, and continuously cool the cooling air flow entering the cooling cavity 14 through the airflow cooling assembly 32, so that the control cabinet can still maintain high cooling performance when the ambient temperature is too high. The temperature T2 in the control cabinet is monitored, and the directional cooling assembly 31, the airflow cooling assembly 32 and the guide assembly 33 are controlled to open and close and adjust the power based on the change of the temperature T2 in the control cabinet, which helps to maintain high cooling performance while saving cooling energy, achieves the effect of green environmental protection and improves the environmental adaptability of the control cabinet.

[0060] Referring to Figure 10 The above steps S3 and S4 of controlling the directional cooling assembly 31, the airflow cooling assembly 32 and the guide assembly 33 to open and close and adjust the power based on the change of the temperature T2 in the control cabinet for cooling specifically include the following steps:

[0061] A1, starting the directional cooling assembly 31 and the guide assembly 33: after the decision controller 5 receives the start signal, the directional cooling assembly 31 and the guide assembly 33 are started to form a circulating cooling air flow to cool the electrical elements in the cabinet 1;

[0062] A2, controlling the airflow cooling assembly 32 to start: the decision controller 5 obtains the temperature T2 in the control cabinet in real time, generates a temperature change curve, and controls the airflow cooling assembly 32 to start when the temperature T2 in the control cabinet is greater than the preset cabinet temperature threshold C2;

[0063] A3. Calculation formula for adjusting the power level of airflow cooling component 32 based on the average temperature change value Y: Based on a timer, n temperature points within a standard period are extracted from the temperature change curve. The average temperature change value Y is calculated according to a preset temperature change calculation formula. When the average temperature change value Y is greater than the preset temperature change threshold Y1, the power level of airflow cooling component 32 is increased; when the average temperature change value Y is less than the preset temperature change threshold Y2, the power level of airflow cooling component 32 is decreased. The temperature change calculation formula is:

[0064] Y = (X1 + X2 + ... + Xn) / n - X1, where Xn is the temperature value of the nth temperature point within the standard period of the temperature change curve;

[0065] The power settings of the airflow cooling components are specifically as follows: the airflow cooling components 32 are pre-programmed based on the number of activations and activation power of the semiconductor cooling chips 321 to form multiple power levels for the airflow cooling components 32. The decision controller 5 acquires the ambient temperature T2 inside the control cabinet in real time. When the ambient temperature T2 inside the control cabinet is greater than the preset cabinet temperature threshold C2, it controls the airflow cooling components 32 to start, generates a temperature change curve, and periodically calculates the average temperature change value Y, thereby adjusting the airflow cooling components 32. While maintaining efficient heat dissipation performance, it saves heat dissipation energy consumption, achieving the effects of green environmental protection and improving the heat dissipation performance of the control cabinet.

[0066] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. A control cabinet, characterized in that: The application relates to a cabinet, which comprises a cabinet body (1) and a cabinet door (2) hinged to the cabinet body (1); the cabinet body (1) is internally provided with a heat dissipation device (3) for dissipating heat of electrical elements in the cabinet body (1), an environment monitoring assembly (4) for monitoring the temperature of the environment inside and outside the cabinet body (1) and a decision controller (5); an exhaust heat dissipation hole (11) is formed in the top of one side of the cabinet body (1), and an air suction heat dissipation hole (12) is formed in the bottom of the cabinet body (1); the heat dissipation device (3) and the environment monitoring assembly (4) are in communication connection with the decision controller (5); the heat dissipation device (3) comprises a directional heat dissipation assembly (31) for guiding the directional flow of heat dissipation air in the cabinet body (1), an air flow cooling assembly (32) for cooling the heat dissipation air and a guide assembly (33) for adjusting the direction of the heat dissipation air; the directional heat dissipation assembly (31) comprises an exhaust fan (311) arranged at the exhaust heat dissipation hole (11) in the cabinet body (1) and an air suction fan (312) arranged at the air suction heat dissipation hole (12); the environment monitoring assembly (4) comprises an external temperature sensor (41) for collecting the temperature of the environment outside the cabinet body (1) and an internal temperature sensor (42) for collecting the temperature of the environment inside the cabinet body (1); the decision controller (5) receives the temperature information collected by the environment monitoring assembly (4) in real time, judges the control cabinet application scene, adjusts the opening and closing of the heat dissipation device (3) and the heat dissipation power for heat dissipation according to the temperature information; the directional heat dissipation assembly (31) further comprises a directional mounting plate (313) and a plurality of directional fans (314) mounted on the directional mounting plate (313) and used for upwardly conveying the heat dissipation air; the directional mounting plate (313) is fixedly arranged in the cabinet body (1) and divides the cabinet body (1) into a mounting cavity (13) and a cooling cavity (14); the air flow cooling assembly (32) is mounted in the cooling cavity (14); the air suction heat dissipation hole (12) is in communication with the cooling cavity (14); the air flow cooling assembly (32) comprises a plurality of semiconductor refrigerating sheets (321) arranged at the bottom of the cooling cavity (14); the refrigerating ends of the plurality of semiconductor refrigerating sheets (321) are located in the cooling cavity (14); a plurality of heat dissipation fins (322) are arranged on the refrigerating ends of the semiconductor refrigerating sheets (321); energy storage boxes (323) are arranged between adjacent heat dissipation fins (322); the plurality of energy storage boxes (323) are fixedly arranged on the refrigerating ends of the semiconductor refrigerating sheets (321); the energy storage box (323) comprises a box body (324) and energy storage medium (325) arranged in the box body (324); the box body (324) is made of a material with high thermal conductivity; the energy storage medium (325) is made of a material with high specific heat capacity; The exhaust heat dissipation hole (11) of the cabinet body (1) is provided with a closed interlayer (15) on one side, a plurality of closing plates (151) for closing the air inlet heat dissipation hole (12) and the exhaust heat dissipation hole are slidably arranged in the closed interlayer (15), and the plurality of closing plates (151) are commonly connected with a control connecting rod (152); the top of the cabinet body (1) is provided with a closing cylinder (153), and the piston rod end of the closing cylinder (153) is connected with the control connecting rod (152); The bottom of the exhaust fan (311) and the air inlet fan (312) is provided with a supporting rod (16), the bottom of the plurality of supporting rods (16) is hingedly connected with a fixing rod (17), and the plurality of fixing rods (17) are fixedly connected with the inside of the cabinet body (1); the top of the exhaust fan (311) and the air inlet fan (312) is hingedly connected with an adjusting rod (18), the plurality of adjusting rods (18) are hingedly connected with the control connecting rod (152), and an adjusting sliding groove for the up-down sliding of the adjusting rod (18) is formed in the inner wall of the cabinet body (1) and communicates with the closed interlayer (15); The decision controller (5) receives the temperature information collected by the environment monitoring assembly (4) in real time, judges the application scene of the control cabinet according to the temperature information, controls the opening and closing and the heat dissipation power of the heat dissipation device (3) to dissipate heat, and specifically includes the following steps: S1, the decision controller (5) receives the temperature information collected by the environment monitoring assembly (4) in real time, and the temperature information includes the outside environment temperature T1 and the inside environment temperature T2 of the control cabinet; S2, the decision controller (5) judges whether the outside environment temperature T1 is greater than the pre-set outside heat dissipation threshold C1 based on the temperature information; S3, if not, control the opening and closing and the power adjustment of the directional heat dissipation assembly (31), the air flow cooling assembly (32) and the guide assembly (33) based on the change of the inside environment temperature T2 of the control cabinet to dissipate heat; S4, if greater, control the piston rod of the closing cylinder (153) to extend to drive the control connecting rod (152) to descend, the control connecting rod (152) drives the closing plate (151) to slide out of the closed interlayer (15) to close the air inlet heat dissipation hole (12) and the exhaust heat dissipation hole (11), and at the same time, the control connecting rod (152) descends to drive the adjusting rod (18) hingedly connected therewith to move downward and tilt, thereby driving the exhaust fan (311) and the air inlet fan (312) to tilt downward and close to the inner side wall of the cabinet body (1); then control the opening and closing and the power adjustment of the directional heat dissipation assembly (31), the air flow cooling assembly (32) and the guide assembly (33) based on the change of the inside environment temperature T2 of the control cabinet to dissipate heat; The steps S3 and S4 based on the change of the inside environment temperature T2 of the control cabinet to control the opening and closing and the power adjustment of the directional heat dissipation assembly (31), the air flow cooling assembly (32) and the guide assembly (33) to dissipate heat specifically include the following steps: After the decision controller (5) receives the start signal, the directional heat dissipation assembly (31) and the guide assembly (33) are started to form a circulating heat dissipation air flow to dissipate heat for the electrical elements in the cabinet body (1); The decision controller (5) obtains the temperature T2 in the control cabinet in real time, generates a temperature change curve, and controls the airflow cooling assembly (32) to start when the temperature T2 in the control cabinet is greater than a preset cabinet temperature threshold C2; The n temperature points in a standard period are extracted based on the temperature change curve, the average temperature change value Y is calculated according to a preset temperature change calculation formula, the power level of the airflow cooling assembly (32) is increased when the average temperature change value Y is greater than a preset temperature change threshold Y1, and the power level of the airflow cooling assembly (32) is decreased when the average temperature change value Y is less than a preset temperature change threshold Y2; the temperature change calculation formula is: Y = (X1+X2+...+Xn) / n-X1, wherein Xn is the temperature value of the nth temperature point in the standard period of the temperature change curve; The power level of the airflow cooling assembly is set as follows: the airflow cooling assembly (32) is pre-programmed to set the number of semiconductor refrigeration fins (321) started and the starting power to form multiple power levels of the airflow cooling assembly (32).

2. A control cabinet according to claim 1, characterised in that: The guide assembly (33) includes a mounting rack (331) and a plurality of guide fans (332) mounted on the mounting rack (331). The mounting rack (331) includes a plurality of mounting rib plates (333) arranged in sequence along the width direction of the cabinet body (1). Both ends of the plurality of mounting rib plates (333) are fixedly connected to the inside of the cabinet body (1). The top of each mounting rib plate (333) is provided with a partition plate (334). The partition plates (334) of adjacent mounting rib plates (333) form a mounting groove (335). Both ends of the mounting rib plate (333) in the width direction are provided with a plurality of mounting waist holes (336) along the length direction. The guide fan (332) is mounted in the mounting groove (335) and fixedly arranged on the mounting rack (331) through the mounting waist hole (336), and the guide fan (332) is arranged towards the high-heat electric element in the cabinet body (1).

3. A control cabinet according to claim 1, characterized in that: The environmental monitoring assembly (4) further includes a humidity sensor (43) arranged on the cabinet body (1) for detecting the external humidity. The decision controller (5) receives the external humidity information collected by the humidity controller in real time, and controls the closed cabinet (153) to drive the control connecting rod (152) to close the air inlet heat dissipation hole (12) and the air outlet heat dissipation hole (11) when the external humidity is greater than a preset humidity threshold.

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