Processing apparatus for elemental semiconductors and process thereof

Abstract

The application discloses a kind of processing equipment of elemental semiconductor, including bottom plate, the top of the bottom plate is equipped with sleeve seat, the top of the bottom plate is equipped with four groups of square arrangement support rod, the top of four groups of the support rod is equipped with workbench, the top of the workbench is provided with clamping groove, one side outer wall of the workbench is equipped with two groups of front and rear arrangement fixed plate, the top of the workbench is equipped with N type plate;The inner wall of the sleeve seat is equipped with cylindrical seat, the bottom wall of the sleeve seat is equipped with multiple electric telescopic rods, the top of the cylindrical seat is provided with two groups of parallel arrangement recess, the top of the multiple electric telescopic rods is equipped with comprehensive board.In the application, the hand of staff does not need to be below polishing mechanism, in turn avoid the condition of hand to appear to be hurt, simultaneously, the present equipment can carry out wafer die's turnover operation, and when polishing, the generated waste can be handled synchronously, to ensure the working environment around equipment.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of elemental semiconductor technology, in particular to an elemental semiconductor processing equipment and process thereof. BACKGROUND

[0002] In the process of elemental semiconductor processing, eight steps of wafer processing, oxidation, photolithography, etching, thin film deposition, interconnection, testing and packaging are needed, among which wafer processing needs to go through three steps of ingot casting, ingot cutting and wafer surface polishing. The thin sheet obtained by ingot cutting is called "wafer die", and its surface is uneven. At this time, the surface of the wafer die needs to be processed by a polishing equipment to form a smooth surface.

[0003] The defects of the existing elemental semiconductor processing equipment are:

[0004] 1. In the process of elemental semiconductor processing, wafer processing is needed first, which needs to go through three steps of ingot casting, ingot cutting and wafer surface polishing. The upper and lower outer surfaces of the wafer die obtained by ingot cutting are uneven, so after removing the surface defects by grinding and chemical etching process, the surface of the wafer die needs to be processed by a polishing equipment. However, in the existing wafer die polishing equipment, it is difficult to take and transfer the wafer die after single-sided polishing of the wafer die because its surface is relatively smooth and tightly fits with the working panel.

[0005] 2. The upper and lower outer surfaces of the wafer die obtained by ingot cutting are uneven, so after removing the surface defects by grinding and chemical etching process, the surface of the wafer die needs to be processed by a polishing equipment. However, in the existing wafer die polishing equipment, it is difficult to automatically turn over the wafer die after single-sided polishing of the wafer die, which needs to be manually turned over by the workers, increasing the work scope of the workers.

[0006] 3. During the polishing operation of the wafer die, a large amount of waste will float around the equipment, affecting the working environment of the workers. Long-term inhalation of such waste by the workers can easily cause lung diseases.

[0007] 4. In the existing wafer polishing equipment, the workers need to manually place the wafer die directly below the polishing mechanism. During the process of placing the wafer die, if the polishing mechanism fails, the polishing mechanism may touch the hands of the workers, causing injury to their hands. SUMMARY

[0008] The present application aims to provide an elemental semiconductor processing equipment and process thereof to solve the problems raised in the background.

[0009] In order to achieve the above object, the present application provides the following technical scheme: a processing equipment of elemental semiconductor, comprising a bottom plate, a sleeve seat is installed on the top of the bottom plate, four groups of support rods arranged in a square are installed on the top of the bottom plate, and the four groups of support rods are uniformly arranged around the sleeve seat, a workbench is installed on the top of the four groups of support rods, a clamping groove is arranged on the top of the workbench, two groups of front and rear fixed plates are installed on one side of the outer wall of the workbench, and an N-shaped plate is installed on the top of the workbench;

[0010] A cylindrical seat is installed on the inner wall of the sleeve seat, and the top of the cylindrical seat penetrates the inside of the clamping groove, a plurality of electric telescopic rods are installed on the bottom wall of the sleeve seat, and the top of the plurality of electric telescopic rods extends into the inside of the cylindrical seat, two groups of recesses arranged side by side are arranged on the top of the cylindrical seat, a comprehensive plate is installed on the top of the plurality of electric telescopic rods, two groups of top plates arranged side by side are installed on the top of the comprehensive plate, and the two groups of top plates are arranged in high and low, and two groups of arc-shaped rods arranged symmetrically are installed on the top of the cylindrical seat.

[0011] As preferred, a square plate is installed on the top of the workbench, and the square plate is located on the side of the clamping groove away from the fixed plate, an electric push rod is installed through the outer wall of one side of the square plate, a push plate is installed on one end of the electric push rod, and the push plate is located on the side of the square plate close to the clamping groove.

[0012] As preferred, a hydraulic cylinder is installed through the top of the N-shaped plate, a H-shaped frame is installed on the bottom of the hydraulic cylinder, a driving motor is installed on the bottom wall of the H-shaped frame, a polishing disc is installed on the output end of the driving motor through a shaft, and the polishing disc is located below the H-shaped frame.

[0013] As preferred, a through groove is arranged on the front of the N-shaped plate, an expansion pipe is installed on the back of the N-shaped plate, a dust collection mechanism is installed on the top of the bottom plate, and the dust collection mechanism is located on one side of the sleeve seat, a connecting pipe is installed through the tail end of the expansion pipe, and the tail end of the connecting pipe is connected with the input end of the dust collection mechanism.

[0014] As preferred, a circular rod is installed on the front of the fixed plate, a connecting pipe is sleeved on the outer surface of the circular rod, a rack is installed on the top of the connecting pipe, a plurality of uniformly arranged rotating rollers are installed through the front of the rack, a conveying belt is installed on the outer surface of the plurality of rotating rollers, a servo motor is installed on the front of the rack, and the output end of the servo motor is attached to the front of one of the rotating rollers, two groups of front and rear connecting groove plates are installed on the bottom of the rack, a sliding block is installed on the inner wall of each of the two groups of connecting groove plates, an electric telescopic rod is installed on the bottom of each of the two groups of sliding blocks, and the bottom of the electric telescopic rod is attached to the top of the bottom plate.

[0015] Preferably, the side wall of the rack is provided with a folding plate, and the side wall of the rack is provided with two groups of micro electric push rods arranged in front and back, and the ends of the two groups of micro electric push rods are provided with combined rods, and the outer surfaces of the two groups of combined rods are attached to the front and back surfaces of the folding plate.

[0016] Preferably, the bottom of the sleeve is provided with a fitting groove, the inner wall of the fitting groove is provided with a connecting disc, the top of the connecting disc is attached to the bottom of the multi-section electric telescopic rod, and the bottom of the bottom plate is provided with a plurality of evenly arranged feet.

[0017] Preferably, the inner wall of the clamping groove is fitted with an annular frame, and the top of the annular frame is provided with a spherical handle.

[0018] Preferably, the process steps of the processing equipment are as follows:

[0019] S1, the staff places the wafer die formed in the process of processing the elemental semiconductor on the conveying belt, and then drives the servo motor to drive the output shaft to drive one group of rotating rollers to rotate in a set direction, so that the conveying belt drives the wafer die above it to move in the direction of the polishing disc, and at the same time, two groups of micro electric push rods are started to extend outward, and the two groups of combined rods generate a pushing force to the folding plate in the direction of the polishing disc, so that it is completely unfolded, and then the two groups of electric telescopic rods are synchronized to extend upward, and the sliding block and the connecting groove plate generate an upward pushing force to the rack, so that the rack, the conveying belt and the folding plate are adjusted to be inclined, and then the wafer die slides to the top of the cylindrical seat, and in the process of sliding, the micro electric push rod shrinks inward at a certain rate, so that the wafer die is completely transferred to the top of the cylindrical seat, and then the electric telescopic rod returns to its original state.

[0020] S2, start the hydraulic cylinder to drive it to extend downward to drive the U-shaped frame, the driving motor and the polishing disc to move downward, and then start the driving motor to drive the polishing disc to rotate, so that the polishing disc adjusted to the appropriate position polishes and grinds the surface of the wafer die;

[0021] S3, after the single side polishing of the wafer die is finished, the hydraulic cylinder is retracted upwards to the original state, and meanwhile the multi-section electric stretching rod is started to promote corresponding upward extension operation so as to generate upward pushing force on the comprehensive plate, then the two sets of top plates are synchronously moved upwards and gradually penetrate the interiors of the two sets of grooves, when the higher top plate near the conveying belt side first penetrates one set of grooves, it can generate upward pushing force on the wafer die placed on the top of the cylindrical seat so as to change the wafer die from the horizontal laying state to the inclined state, then when the other set of top plates gradually penetrates the remaining set of grooves, the wafer die can be gradually turned to the standing state, then the electric push rod is started to extend outwards, which can promote the push plate to push towards the lower place of the wafer die in the standing state, meanwhile the multi-section electric stretching rod is gradually retracted to the original state, after the wafer die is pushed down, the electric push rod returns to the original state, and then the steps in S2 are repeated again.

[0022] S4, in the polishing process of the wafer die, the dust collection mechanism is operated in coordination to promote the polishing waste to enter the storage bin of the dust collection mechanism through the extension pipe and the connecting pipe.

[0023] S5, after the polishing of the upper and lower two sides of the wafer die is finished, the multi-section electric stretching rod is started again to promote the two sets of top plates to push the wafer die upwards so as to gradually separate the wafer die from the top of the cylindrical seat, then the worker takes it out.

[0024] Compared with the prior art, the wafer die polishing device has the following beneficial effects:

[0025] 1、in the present application, after the polishing of the wafer die is finished, the multi-section electric stretching rod is started to promote corresponding upward extension operation so as to generate upward pushing force on the comprehensive plate, then the two sets of top plates are synchronously moved upwards and gradually penetrate the interiors of the two sets of grooves, when the higher top plate near the conveying belt side first penetrates one set of grooves, it can generate upward pushing force on the wafer die placed on the top of the cylindrical seat so as to change the wafer die from the horizontal laying state to the inclined state, then when the other set of top plates gradually penetrates the remaining set of grooves, the wafer die can be gradually turned to the standing state, at this time the worker can take out the wafer die by clamping it with two fingers.

[0026] 2、in the present application, after the multi-section electric stretching rod is extended upwards to promote the two sets of top plates to gradually adjust the wafer die laid horizontally on the top of the cylindrical seat to the standing state, the electric push rod is started to promote outward extension operation to push the push plate towards the lower place of the wafer die in the standing state, meanwhile the multi-section electric stretching rod is gradually retracted to promote the wafer die to be pushed down, and then the wafer die can be turned over.

[0027] 3. In the present invention, by cooperating with the operation of the dust suction mechanism, the internal motor rotates at high speed, and the external air is sucked in from the location of the suction port extension tube of the dust suction mechanism. At this time, the waste chips can be introduced into the interior of the connecting tube through the extension tube, and then enter the storage bin of the dust suction mechanism along the pipeline, thereby effectively reducing the content of waste chips in the air during the polishing operation.

[0028] 4. In the present invention, after the staff places the wafer bare die on the conveyor belt, the servo motor is operated to move the wafer bare die above it toward one side, and two sets of micro electric push rods are extended outward so that the folding plate is pushed to be fully unfolded through the combination rod. Then, the two sets of electric telescopic rods are synchronously extended upward, and an upward pushing force is generated on the frame through the slider and the connecting groove plate so that the frame, the conveyor belt and the folding plate are adjusted to an inclined shape. Then, the wafer bare die slides down to the top of the cylindrical seat. During its sliding process, the micro electric push rods are retracted inward at a certain rate so that the wafer bare die is completely transferred to the top of the cylindrical seat. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0030] Figure 2 Schematic diagram of the installation structure of the workbench and the fixed plate of the present invention;

[0031] Figure 3 Schematic diagram of the installation structure of the workbench, cylindrical base and annular frame of the present invention;

[0032] Figure 4 It is a schematic diagram of the installation structure of the sleeve, cylindrical seat and multi-section electric extension pole of the present invention;

[0033] Figure 5 This is a schematic diagram of the installation structure of the multi-section electric extension pole and the connecting plate of the present invention;

[0034] Figure 6 Schematic diagram of the installation structure of the shaped frame and the drive motor of the present invention;

[0035] Figure 7 Schematic diagram of the installation structure of the round rod, connecting pipe and frame of the present invention;

[0036] Figure 8 It is a schematic diagram of the installation structure of the connecting groove plate and the slider of the present invention.

[0037] In the figure: 1, bottom plate; 2, sleeve; 3, support rod; 4, workbench; 5, snap-fit ​​groove; 6, fixing plate; 7, cylindrical seat; 8, multi-section electric extension rod; 9, groove; 10, integrated plate; 11, top plate; 12, curved rod; 13, square plate; 14, electric push rod; 15, push plate; 16, N-type plate; 17, hydraulic cylinder; 18, 匚-shaped frame; 19, drive motor; 20, polishing plate; 21, through slot; 22 , extension tube; 23. Dust collection mechanism; 24. Connecting tube; 25. Round rod; 26. Connecting tube; 27. Frame; 28. Roller; 29. ​​Conveyor belt; 30. Servo motor; 31. Connecting groove plate; 32. Slider; 33. Electric telescopic rod; 34. Folding plate; 35. Micro electric push rod; 36. Combination rod; 37. Fitting groove; 38. Connecting plate; 39. Foot; 40. Ring frame; 41. Ball handle. DETAILED DESCRIPTION

[0038] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0039] In the description of the present invention, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," "the other end," and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0040] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "provided with," "connected," etc., should be understood in a broad sense. For example, "connected" may refer to a fixed connection, a detachable connection, or an integral connection; it may refer to a mechanical connection or an electrical connection; it may refer to a direct connection or an indirect connection through an intermediate medium; it may refer to internal communication between two components. Those skilled in the art will be able to understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0041] An embodiment provided by the present invention:

[0042] A kind of processing equipment of elemental semiconductor, including bottom plate 1, the top of bottom plate 1 is equipped with sleeve 2, the top of bottom plate 1 is equipped with four groups of square arrangement support rod 3, and four groups of support rod 3 are evenly arranged around sleeve 2, the top of four groups of support rod 3 is equipped with workbench 4, the top of workbench 4 is provided with clamping slot 5, one side outer wall of workbench 4 is equipped with two groups of front and rear arrangement fixed plate 6, the top of workbench 4 is equipped with N type board 16;

[0043] The inner wall of sleeve 2 is equipped with cylindrical seat 7, and the top of cylindrical seat 7 penetrates the inside of clamping slot 5, the bottom wall of sleeve 2 is equipped with multi-section electric telescopic rod 8, and the top of multi-section electric telescopic rod 8 extends into the inside of cylindrical seat 7, the top of cylindrical seat 7 is provided with two groups of side-by-side arrangement recess 9, the top of multi-section electric telescopic rod 8 is equipped with comprehensive board 10, the top of comprehensive board 10 is equipped with two groups of side-by-side arrangement top plate 11, and two groups of top plate 11 are arranged as high and low, the top of cylindrical seat 7 is equipped with two groups of symmetrically arranged arc-shaped rod 12.

[0044] In the process of elemental semiconductor processing, first wafer processing is needed, wafer processing needs to go through ingot casting, ingot cutting and wafer surface polishing three steps, and the upper and lower outer surfaces of wafer die obtained by ingot cutting are uneven, so after removing surface defects by grinding and chemical etching process, the surface of wafer die is treated by polishing equipment, but in the existing wafer die polishing equipment, after single-side polishing of wafer die, because its surface is relatively smooth, and it is tightly closed with work panel, it is difficult to take and transfer, therefore, in the present application, in order to solve this problem, such as Figure 1 、 Figure 2 、 Figure 4 and Figure 5As shown, a plurality of electric stretchers 8 and two groups of high and low top plates 11 are also designed. After the wafer die polishing is completed, the plurality of electric stretchers 8 are started to extend upward to generate an upward pushing force on the comprehensive plate 10. Then, the two groups of top plates 11 are synchronously moved upward and gradually penetrate the inside of the two groups of grooves 9. When the higher top plate 11 near the conveying belt 29 first penetrates one of the two groups of grooves 9, it can generate an upward pushing force on the wafer die placed on the top of the cylindrical seat 7 to change the wafer die from a horizontal state to an inclined state. Then, as the other group of top plates 11 gradually penetrates the other group of grooves 9, the wafer die can gradually change to a standing state. At this time, the worker can pinch the wafer die with two fingers and take it out. The two groups of arc-shaped rods 12 are used to limit the position of the wafer die on the cylindrical seat 7 so that the wafer die is always on the same vertical line as the center of the polishing disc 20. The bottom plate 1 provides a comprehensive assembly site for the top components. The inner wall of the sleeve 2 is provided with internal threads matched with the outer surface of the cylindrical seat 7 to facilitate the detachable combination of the two. Meanwhile, the bottom of the cylindrical seat 7 is provided with a groove with a large space. When the plurality of electric stretchers 8 are retracted to the original state, the two groups of top plates 11 are inside the space of the groove. The fixing plate 6 provides a suitable site for the installation of the cylindrical rod 25.

[0045] A square plate 13 is installed on the top of the workbench 4 and located on the side of the clamping groove 5 away from the fixing plate 6. An electric push rod 14 is installed through one side of the outer wall of the square plate 13. One end of the electric push rod 14 is installed with a push plate 15, and the push plate 15 is located on the side of the square plate 13 close to the clamping groove 5.

[0046] The upper and lower outer surfaces of the wafer die obtained by ingot cutting are uneven, so after removing surface defects through grinding and chemical etching processes, the surface of the wafer die needs to be treated by a polishing device. However, in the existing wafer die polishing device, after single-sided polishing of the wafer die is completed, it cannot automatically turn over and needs to be manually turned over by the worker, which increases the work scope of the worker. Therefore, in the present application, in order to solve this problem, as shown in Figure 1 and Figure 2 A push plate 15 is also designed. After the plurality of electric stretchers 8 extend upward to gradually adjust the wafer die horizontally placed on the top of the cylindrical seat 7 to a standing state, the electric push rod 14 is started to extend outward to push the push plate 15 towards the lower part of the wafer die in a standing state. At the same time, the plurality of electric stretchers 8 are gradually retracted to push the wafer die down and complete the turning over operation. Then, the hydraulic cylinder 17 is extended downward to make the bottom of the polishing disc 20 adhere to the top of the wafer die. Then, the electric push rod 14 is retracted inward until it returns to the original state. The square plate 13 provides a suitable and stable assembly position for the electric push rod 14.

[0047] The top of the N-shaped plate 16 is provided with a hydraulic cylinder 17, the bottom of the hydraulic cylinder 17 is provided with a frame 18, the bottom wall of the frame 18 is provided with a driving motor 19, the output end of the driving motor 19 is provided with a polishing disc 20 through a shaft, and the polishing disc 20 is located below the frame 18.

[0048] As shown in Figure 1 and Figure 6 , when polishing, first run the hydraulic cylinder 17 to drive the frame 18, the driving motor 19 and the polishing disc 20 to move downward, then start the driving motor 19 to drive the polishing disc 20 to rotate, so that the polishing disc 20 in the appropriate position polishes the surface of the wafer die, and the frame 18 provides a stable combination site for the driving motor 19.

[0049] The front surface of the N-shaped plate 16 is provided with a through slot 21, the back surface of the N-shaped plate 16 is provided with an extension pipe 22, the top of the bottom plate 1 is provided with a dust collection mechanism 23, the dust collection mechanism 23 is located on one side of the sleeve 2, the tail end of the extension pipe 22 is provided with a connecting pipe 24, and the tail end of the connecting pipe 24 is connected with the input end of the dust collection mechanism 23.

[0050] In order to effectively avoid the waste generated during the polishing process of the wafer die from floating around the equipment and affecting the working environment of the workers, as shown in Figure 1 , in the present application, during the polishing process, the dust collection mechanism 23 is operated, which has the same structure as a vacuum cleaner, and the waste can be introduced into the inside of the connecting pipe 24 through the extension pipe 22, and then enters the storage bin of the dust collection mechanism 23 along the pipeline, thereby effectively reducing the content of waste in the air during polishing.

[0051] The front surface of the fixed plate 6 is provided with a round rod 25, the outer surface of the round rod 25 is sleeved with a connecting pipe 26, the top of the connecting pipe 26 is provided with a rack 27, a plurality of groups of uniformly arranged rotating rollers 28 are penetrated and arranged on the front surface of the rack 27, the outer surfaces of the plurality of groups of rotating rollers 28 are provided with a conveying belt 29, a servo motor 30 is arranged on the front surface of the rack 27, and the output end of the servo motor 30 is attached to the front surface of one group of rotating rollers 28, the bottom of the rack 27 is provided with two groups of front and rear arranged connecting groove plates 31, the inner walls of the two groups of connecting groove plates 31 are both provided with sliding blocks 32, the bottoms of the two groups of sliding blocks 32 are both provided with electric telescopic rods 33, and the bottoms of the electric telescopic rods 33 are attached to the top of the bottom plate 1, the outer wall of the rack 27 is provided with a folding plate 34, the outer wall of the rack 27 is provided with two groups of front and rear arranged micro electric push rods 35, one end of the two groups of micro electric push rods 35 is provided with a combined rod 36, and the outer surfaces of the two groups of combined rods 36 are respectively attached to the front surface and the back surface of the folding plate 34.

[0052] In the existing wafer polishing device, the worker needs to manually place the wafer die directly below the polishing mechanism. During the process of placing the wafer die, if the polishing mechanism fails, the polishing mechanism may touch the worker's hand, causing the hand to be injured. To solve this problem, as shown in Figure 1 、 Figure 2 、 Figure 7 and Figure 8 , in the present application, a conveying belt 29 is additionally provided to avoid the worker's hand being directly below the polishing mechanism. After the worker places the wafer die on the conveying belt 29, the servo motor 30 is operated to drive the rotating rollers 28 to rotate the conveying belt 29 in a designated direction, and the two groups of micro electric push rods 35 are extended outward. The combined rod 36 generates a pushing force on the folding plate 34 in the direction of the polishing disc 20 to fully unfold the folding plate 34. Then, the two groups of electric telescopic rods 33 are synchronously extended upward, and the sliding blocks 32 and the connecting groove plates 31 generate an upward pushing force on the rack 27 to adjust the rack 27, the conveying belt 29, and the folding plate 34 to be inclined. After that, the wafer die slides down to the top of the cylindrical seat 7. During the sliding process, the micro electric push rods 35 are retracted inward at a certain rate to facilitate the wafer die to be completely transferred to the top of the cylindrical seat 7. The electric telescopic rods 33 return to their original state.

[0053] The bottom of the sleeve seat 2 is provided with a fitting groove 37, the inner wall of the fitting groove 37 is provided with a connecting disc 38, and the top of the connecting disc 38 is attached to the bottom of the multi-section electric telescopic rod 8. The bottom of the bottom plate 1 is provided with a plurality of groups of uniformly arranged feet 39, the inner wall of the clamping groove 5 is fitted with an annular frame 40, and the top of the annular frame 40 is provided with a round ball handle 41.

[0054] As shown in Figure 1 、 Figure 3 ,Figure 4 and Figure 5 As shown in the figure, the setting of the embedded groove 37 is used to engage the adapter disc 38, and the two are in a non-fixed state. The adapter disc 38 is used to increase the connection between the multi-section electric stretching rod 8 and the sleeve 2. The setting of the pad foot 39 can effectively avoid the contact between the bottom of the bottom plate 1 and the bottom surface, thereby effectively reducing the wear thereof. The setting of the annular frame 40 can be used to collect the substances scattered on the workbench 4. The setting of the spherical handle 41 facilitates the upward pulling force applied to the annular frame 40, which is fitted into the clamping groove 5 and taken out.

[0055] The process steps of the processing equipment are as follows:

[0056] S1, the staff places the wafer die formed in the element semiconductor processing process on the conveying belt 29, and then operates the servo motor 30 to drive the output shaft to drive one set of rotating rollers 28 to rotate in a designated direction, so that the conveying belt 29 drives the wafer die above it to move in the direction of the polishing disc 20. At the same time, start two sets of micro electric push rods 35 to extend outward, and through two sets of combination rods 36, the folding plate 34 is pushed in the direction of the polishing disc 20 to completely unfold. Then, the two sets of electric telescopic rods 33 are synchronized to extend upward, and through the sliding block 32 and the adapter groove plate 31, the rack 27 is pushed upward, so that the rack 27, the conveying belt 29 and the folding plate 34 are adjusted to be inclined. Then, the wafer die slides down to the top of the cylindrical seat 7. During the sliding process, the micro electric push rod 35 retracts inward at a certain rate to facilitate the wafer die to completely pass to the top of the cylindrical seat 7. Then, the electric telescopic rod 33 returns to the original state;

[0057] S2, start the hydraulic cylinder 17 to extend downward to drive the U-shaped frame 18, the driving motor 19 and the polishing disc 20 to move downward. Then start the driving motor 19, and the output shaft drives the polishing disc 20 to rotate, so that the polishing disc 20 adjusted to the appropriate position polishes and grinds the surface of the wafer die;

[0058] S3, after the single side polishing of the wafer die is finished, the hydraulic cylinder 17 is retracted to the original state, and the multi-section electric telescopic rod 8 is started to extend upward to push the integrated plate 10 upward, then the two sets of top plates 11 are moved upward synchronously and gradually penetrate the inside of the two sets of grooves 9, when the higher top plate 11 near the conveying belt 29 first penetrates one set of grooves 9, it can push the wafer die on the top of the cylindrical seat 7 upward to change its horizontal state to an inclined state, then as the other set of top plates 11 gradually penetrates the remaining set of grooves 9, the wafer die can gradually change to a standing state, then the electric push rod 14 is started to extend outward to push the push plate 15 toward the lower part of the wafer die in a standing state, and the multi-section electric telescopic rod 8 is gradually retracted to the original state, after the wafer die is pushed down, the electric push rod 14 returns to the original state, and then the steps in S2 are repeated again;

[0059] S4, during the polishing of the wafer die, the dust collection mechanism 23 is operated to make the polishing waste generated during the polishing process enter the storage bin of the dust collection mechanism 23 through the extension pipe 22 and the connecting pipe 24;

[0060] S5, after the polishing of the upper and lower surfaces of the wafer die is finished, the multi-section electric telescopic rod 8 is started again to push the wafer die upward with the two sets of top plates 11 to gradually separate it from the top of the cylindrical seat 7, then the staff takes it out.

[0061] Working principle: through the operation of servo motor 30, it can promote the transfer belt 29 to transfer the wafer die placed on it, and cooperate with two groups of micro electric push rod 35 to stretch out the folding plate 34, at this time one end of the folding plate 34 is directly above the cylindrical seat 7, then cooperate with the electric telescopic rod 33 to extend upward, through the sliding block 32, the adapter groove plate 31 to the rack 27 to produce upward pushing force, so that the rack 27, the transfer belt 29 and the folding plate 34 are adjusted to be inclined, and then the wafer die slides down to the top of the cylindrical seat 7, during the sliding process, the micro electric push rod 35 shrinks inward at a certain rate, so as to completely transfer the wafer die to the top of the cylindrical seat 7, through the upward extension work of the multi-section electric telescopic rod 8, it can produce upward pushing force to the integrated plate 10, when the higher top plate 11 near the transfer belt 29 side first penetrates one group of grooves 9, it can produce upward pushing force to the wafer die placed on the top of the cylindrical seat 7, so as to change from horizontal state to inclined state, after another group of top plate 11 gradually penetrates the remaining group of grooves 9, this wafer die can gradually turn to standing state, then start the electric push rod 14, which extends outward at the same time, can promote the push plate 15 to push towards the lower side of the wafer die in standing state, at the same time, the multi-section electric telescopic rod 8 gradually shrinks back to the original state, the wafer die is pushed down and turned over, through the operation of dust collection mechanism 23 in the polishing process, it can promote the waste produced in the polishing process to enter the storage bin of dust collection mechanism 23 through the expansion pipe 22 and the connecting pipe 24, thereby effectively reducing the content of waste in the air around the equipment.

[0062] It is apparent to those skilled in the art that the application is not limited to the details of the above-described exemplary embodiments, and that the application can be implemented in other concrete forms without departing from the spirit or essential characteristics of the application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, the scope of the application being defined by the appended claims rather than by the above description, and it is intended that all changes that come within the meaning and range of equivalency of the claims are embraced therein. Any reference signs in the claims should not be construed as limiting the claims concerned.

Claims

1. A processing device for elemental semiconductors, characterized in that: The invention comprises a base plate (1), a sleeve (2) is installed on the top of the base plate (1), four groups of support rods (3) arranged in a square shape are installed on the top of the base plate (1), and the four groups of support rods (3) are evenly arranged around the sleeve (2), a workbench (4) is installed on the top of the four groups of support rods (3), a locking groove (5) is provided on the top of the workbench (4), two groups of fixing plates (6) arranged front and back are installed on the outer wall of one side of the workbench (4), and an N-shaped plate (16) is installed on the top of the workbench (4); The inner wall of the sleeve (2) is provided with a cylindrical seat (7), and the top of the cylindrical seat (7) passes through the interior of the engaging groove (5); the bottom wall of the sleeve (2) is provided with a multi-section electric extension rod (8), and the top of the multi-section electric extension rod (8) extends into the interior of the cylindrical seat (7); the top of the cylindrical seat (7) is provided with two groups of grooves (9) arranged side by side; the top of the multi-section electric extension rod (8) is provided with an integrated board (10); the top of the integrated board (10) is provided with two groups of top plates (11) arranged side by side, and the two groups of top plates (11) are arranged one high and one low; the top of the cylindrical seat (7) is provided with two groups of symmetrically arranged arc rods (12); A round rod (25) is installed on the front of the fixed plate (6), and a connecting tube (26) is sleeved on the outer surface of the round rod (25). A frame (27) is installed on the top of the connecting tube (26). A plurality of groups of evenly arranged rollers (28) are installed on the front of the frame (27). Conveyor belts (29) are installed on the outer surfaces of the plurality of groups of rollers (28). A servo motor (30) is installed on the front of the frame (27), and the output end of the servo motor (30) is in contact with the front of one group of rollers (28). Two groups of connecting slot plates ( 31), the inner walls of the two groups of connecting groove plates (31) are both installed with sliders (32), the bottoms of the two groups of sliders (32) are both installed with electric telescopic rods (33), and the bottoms of the electric telescopic rods (33) are in contact with the top of the bottom plate (1); a folding plate (34) is installed on one side outer wall of the frame (27), and two groups of front-to-back arranged micro electric push rods (35) are installed on one side outer wall of the frame (27), and one end of the two groups of micro electric push rods (35) are both installed with combination rods (36), and the outer surfaces of the two groups of combination rods (36) are in contact with the front and back sides of the folding plate (34) respectively.

2. The elemental semiconductor processing equipment according to claim 1, characterized in that: A square plate (13) is installed on the top of the workbench (4), and the square plate (13) is located on the side of the engaging groove (5) away from the fixed plate (6); an electric push rod (14) is installed through the outer wall of one side of the square plate (13); a push plate (15) is installed at one end of the electric push rod (14), and the push plate (15) is located on the side of the square plate (13) close to the engaging groove (5).

3. The elemental semiconductor processing equipment according to claim 1, characterized in that: A hydraulic cylinder (17) is installed through the top of the N-shaped plate (16). A U-shaped frame (18) is installed at the bottom of the hydraulic cylinder (17). A driving motor (19) is installed on the bottom wall of the U-shaped frame (18). The output end of the driving motor (19) is installed with a polishing disc (20) through a shaft, and the polishing disc (20) is located below the U-shaped frame (18).

4. The elemental semiconductor processing equipment according to claim 1, characterized in that: A through groove (21) is provided on the front surface of the N-shaped plate (16). An extension pipe (22) is installed on the back surface of the N-shaped plate (16). A dust suction mechanism (23) is installed on the top of the bottom plate (1), and the dust suction mechanism (23) is located on one side of the socket (2). The tail end of the extension pipe (22) is installed with a connecting pipe (24) through it, and the tail end of the connecting pipe (24) is connected to the input end of the dust suction mechanism (23).

5. The elemental semiconductor processing equipment according to claim 1, characterized in that: A fitting groove (37) is provided at the bottom of the socket (2). A connecting disk (38) is installed on the inner wall of the fitting groove (37), and the top of the connecting disk (38) is in contact with the bottom of the multi-section electric telescopic rod (8). A plurality of groups of uniformly arranged cushion feet (39) are installed at the bottom of the bottom plate (1).

6. The elemental semiconductor processing equipment according to claim 1, characterized in that: A ring frame (40) is fitted and installed on the inner wall of the engaging groove (5). A spherical grip (41) is installed on the top of the ring frame (40).

7. The element semiconductor processing equipment according to any one of claims 1 to 6, characterized in that: The processing steps of this processing equipment are as follows: S1. The staff places the wafer bare chip formed during the processing of elemental semiconductors on the conveyor belt (29). Then, the servo motor (30) is run to cause its output shaft to drive one of the rollers (28) to rotate in a set direction, so that the conveyor belt (29) drives the wafer bare chip above it to move in the direction of the polishing disc (20). At the same time, two sets of micro electric push rods (35) are started to cause them to extend outward. Through the two sets of combined rods (36), a driving force towards the direction of the polishing disc (20) is generated on the folding plate (34), so that it fully expands. Then, the two sets of electric telescopic rods (33) simultaneously extend upward. Through the slider (32) and the connecting groove plate (31), an upward driving force is generated on the frame (27), so that the frame (27), the conveyor belt (29) and the folding plate (34) are adjusted to an inclined state. Then, the wafer bare chip slides down to the top of the cylindrical seat (7). During its sliding process, the micro electric push rod (35) contracts inward at a certain rate, so that the wafer bare chip is completely transferred to the top of the cylindrical seat (7). Then, the electric telescopic rod (33) returns to its original state; S2. Start the hydraulic cylinder (17) to cause it to extend downward correspondingly, so as to drive the U-shaped frame (18), the driving motor (19) and the polishing disc (20) to move downward. Then, start the driving motor (19), and its output shaft drives the polishing disc (20) to rotate, so that the polishing disc (20) adjusted to the appropriate position polishes the surface of the wafer bare chip; S3. After the single-side polishing of the wafer is completed, the hydraulic cylinder (17) shrinks upward to its original shape and simultaneously starts the multi-section electric extension rod (8) to cause it to extend upward accordingly, so as to generate an upward driving force on the integrated plate (10). After that, the two groups of top plates (11) move upward synchronously and gradually penetrate the interior of the two groups of grooves (9). When the higher top plate (11) on the side close to the conveyor belt (29) first penetrates one of the groups of grooves (9), it can generate an upward driving force on the wafer placed on the top of the cylindrical seat (7). The wafer is transformed from a horizontally placed state to an inclined state, and then as another set of top plates (11) gradually penetrates the remaining set of grooves (9), the wafer can gradually turn to a standing state, and then the electric push rod (14) is started. When it extends outward, it can push the push plate (15) toward the lower part of the wafer in the standing state, and at the same time, the multi-section electric extension rod (8) gradually shrinks downward to its original state. After the wafer is pushed down, the electric push rod (14) returns to its original state, and then the steps in S2 are repeated again; S4, during the polishing process of the bare wafer, the dust collecting mechanism (23) is operated in conjunction with the operation of the dust collecting mechanism (23), so that the waste chips generated during the polishing process enter the storage bin of the dust collecting mechanism (23) through the extension tube (22) and the connecting tube (24); S5. After polishing of the upper and lower surfaces of the wafer is completed, the multi-section electric extension rod (8) is started again to prompt the two sets of top plates (11) to push the wafer upward so that it gradually breaks away from contact with the top of the cylindrical seat (7), and then the staff takes it out.

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