A laser projector thermal management system adapted to a wide temperature range

Abstract

The application relates to the field of laser projectors, in particular to a laser projector thermal management system suitable for wide temperature ranges. The internal space of the laser projector is divided into a laser light source chamber and a video processing and imaging chamber. A longitudinal partition is arranged between the laser light source chamber and the video processing and imaging chamber. The internal space of the laser projector forms a first air path, a second air path and a third air path. In a low-temperature heating starting mode, the CPU of an Android mainboard assembly is heated in advance, and the Android mainboard assembly is driven to work when the temperature of the CPU reaches a starting requirement. In a high-temperature refrigeration and heat dissipation mode, the TEC refrigeration sheet working current is controlled to refrigerate and independently control the temperature of the laser light source module and the optical engine module. The low-temperature fan and the heat dissipation fan are controlled in terms of starting, automatic speed regulation and stopping, so that the accurate temperature control of the key components is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of laser projectors, in particular to a laser projector thermal management system suitable for wide temperature range. BACKGROUND

[0002] The working environment requirements of laser projectors in some special fields are extremely harsh, such as requirements for normal start-up and normal long-term work in the environment temperature range of-40 to 55℃, and requirements for high temperature and humidity, dustproof and waterproof of military level. However, the existing projectors, especially laser projectors, cannot meet the above special field applications because the laser light source, DMD and key electronic chips and other device components cannot start and work normally at-40℃ low temperature, and cannot meet the heat dissipation requirements at high temperature above 40℃. SUMMARY

[0003] In view of the above problems, a laser projector thermal management system suitable for wide temperature range is provided, which can meet the intelligent precise temperature control of low temperature heating start-up and high temperature refrigeration heat dissipation in the wide temperature range of-40 to 55℃.

[0004] To solve the problems in the prior art, the technical scheme adopted by the present application is as follows:

[0005] A laser projector thermal management system suitable for wide temperature range, the internal space of the laser projector is divided into a laser light source room and a video processing and imaging room,

[0006] A longitudinal partition plate is arranged between the laser light source room and the video processing and imaging room, and the internal space of the laser projector forms a first air path, a second air path and a third air path;

[0007] A transverse partition plate is arranged in the video processing and imaging room, which divides the video processing and imaging room into a first chamber and a second chamber;

[0008] A first air vent and a second air vent are arranged on the longitudinal partition plate, the first air vent communicates the laser light source room and the first chamber, and the second air vent communicates the laser light source room and the second chamber;

[0009] The airflow of the first air path enters the laser light source room from the right side of the projector and exits the laser projector from the left side of the laser light source room after passing through the bottom of the video processing and imaging room;

[0010] The airflow of the second air path enters the laser light source room from the front side of the projector and exits the laser projector from the left side of the laser light source room;

[0011] The airflow of the third air path enters the laser light source chamber from the rear side of the projector, and the third air path comprises a first airflow branch and a second airflow branch, the airflow of the first airflow branch is discharged from the left side of the laser projector, and the airflow of the second airflow branch is discharged from the left side of the laser projector after sequentially passing through the first air vent and the second air vent.

[0012] Preferably, the transverse partition plate is provided with a third air vent, and a low-temperature fan is installed in the third air vent to introduce the airflow in the first chamber into the second chamber.

[0013] The laser projector comprises a drive board assembly arranged in the video processing imaging chamber, and the drive board assembly is provided with an Android mainboard assembly and a video board assembly in the first chamber, and a thermistor connected with the video board assembly is installed near the CPU of the Android mainboard assembly.

[0014] The PTC heater is installed at the first air vent.

[0015] Preferably, the low-temperature heating start mode is included,

[0016] In this mode, after the laser projector is powered on, the drive board assembly and the video board assembly are powered on to enter standby, the video board assembly detects the temperature of the CPU of the Android mainboard assembly through the thermistor, when the detected temperature is lower than a set temperature t, the drive board assembly controls the PTC heater to be powered on and work at the same time, and the low-temperature fan is started, the external cold air is heated by the PTC heater to generate hot air, which heats the video board assembly and the Android mainboard assembly, when the thermistor detects that the temperature is higher than the set temperature t after heating and rising, the PTC heater is powered off to stop heating, and the Android mainboard assembly is powered on to enable it to enter a working state.

[0017] Preferably, when the temperature detected by the thermistor is t-10 after the Android mainboard assembly is powered on and works, the PTC heater is started again to heat.

[0018] Preferably, the laser light source chamber is provided with a laser light source module, the laser light source module is provided with a light source heat sink A and a light source heat sink B, part of the airflow of the first air path and the airflow of the first airflow branch of the third air path flow through the light source heat sink A, and part of the airflow of the first air path and the airflow of the second air path flow through the light source heat sink B.

[0019] Preferably, the video processing imaging room is provided with a light engine module, the light engine module is provided with a DMD radiator and a light engine radiator, the DMD radiator is arranged in the first chamber, the light engine radiator is installed in the second chamber and located at the outlet of the low-temperature fan, a DC module radiator is also installed in the second chamber, and the second airflow branch of the third air path sequentially flows through the DMD radiator, the low-temperature fan, the light engine radiator and the DC module radiator, and the second airflow branch of the third air path also flows through the Android mainboard assembly and the video board assembly before flowing through the low-temperature fan.

[0020] Preferably, TEC refrigerating sheets are installed between the light source radiator A and the laser light source module and between the light source radiator B and the laser light source module, and a TEC refrigerating sheet is also installed between the light engine module and the DMD radiator; a heat-conducting block is installed between the CPU of the Android mainboard and the rear cover plate of the laser projector.

[0021] Preferably, the laser projector is provided with an air outlet, the laser light source chamber is provided with an air duct assembly covering the air outlet, a heat dissipation fan is installed in the air duct assembly, and the airflows of the first air path, the second air path and the third air path are all collected in the air duct assembly and discharged through the heat dissipation fan.

[0022] Preferably, the mode includes a high-temperature refrigeration and heat dissipation mode,

[0023] In this mode, the driving and temperature control are performed through the driving board assembly and the video board assembly, the working current of the TEC refrigerating sheet is automatically adjusted for refrigeration and accurate temperature control of the light engine module, and the rotation speed of the air outlet heat dissipation fan is automatically adjusted for effective heat dissipation;

[0024] In this mode, the driving and temperature control are performed through the driving board assembly and the video board assembly, the working current of the TEC refrigerating sheet is automatically adjusted for refrigeration and accurate temperature control of the light engine module, and the rotation speed of the low-temperature fan is automatically adjusted according to the temperature control requirement for effective heat dissipation;

[0025] Preferably, the control of all TEC refrigerating sheets is automatically controlled and adjusted through a PID algorithm, and the heat dissipation fan at the air outlet and the low-temperature fan are started, automatically adjusted in speed and stopped according to the temperature control requirement, so as to achieve accurate temperature control of each key component.

[0026] Beneficial effects:

[0027] 1. In the low-temperature heating start mode, the CPU of the Android mainboard assembly is preheated, and the Android mainboard assembly is driven to work only when the temperature of the CPU of the Android mainboard assembly reaches the requirement for starting.

[0028] 2. In the high-temperature cooling and heat dissipation mode, the laser source module and the optomechanical engine module are independently temperature controlled by controlling the working current of the TEC cooling chip. Furthermore, the starting, automatic speed adjustment and shutdown of the low-temperature fan and the cooling fan are controlled to achieve precise temperature control of each key component. Attached Figure Description

[0029] Figure 1 This is a 3D laser projector thermal management system adapted to a wide temperature range. Figure 1 ;

[0030] Figure 2 This is a 3D laser projector thermal management system adapted to a wide temperature range. Figure 2 ;

[0031] Figure 3 This is a localized three-dimensional thermal management system for laser projectors, adaptable to a wide temperature range. Figure 1 ;

[0032] Figure 4 This is a localized three-dimensional thermal management system for laser projectors, adaptable to a wide temperature range. Figure 2 ;

[0033] Figure 5 This is a schematic diagram of the internal structure of a laser projector and the airflow direction of the first, second, and third air paths in a thermal management system for a laser projector that is adaptable to a wide temperature range.

[0034] The numbers on the map are:

[0035] 1. Longitudinal partition; 1a. First ventilation opening; 1b. Second ventilation opening;

[0036] 2. Horizontal partition; 2a. Third ventilation opening;

[0037] 3. Heat dissipation grille strips;

[0038] 4. First air inlet;

[0039] 5. Second air inlet;

[0040] 6. Third air inlet;

[0041] 7. Air outlet;

[0042] 8. Low-temperature fan;

[0043] 9. Driver board assembly; 9a. Android motherboard assembly; 9b. Video board assembly;

[0044] 10. PTC heater;

[0045] 11, laser light source module; 11a, light source heat sink A; 11b, light source heat sink B;

[0046] 12, light engine module; 12a, DMD heat sink; 12b, light engine heat sink;

[0047] 13, DC module heat sink;

[0048] 14, heat dissipation fan;

[0049] 15, air duct assembly;

[0050] 16, heat conduction block. DETAILED DESCRIPTION

[0051] In order to further understand the features, technical means and specific purposes and functions achieved by the present application, the present application will be described in further detail below in combination with the drawings and specific embodiments.

[0052] In combination Figures 1-5 The laser projector thermal management system shown in the figure is suitable for a wide temperature range, and the internal space of the laser projector is divided into a laser light source chamber and a video processing and imaging chamber,

[0053] A longitudinal partition plate 1 is arranged between the laser light source chamber and the video processing and imaging chamber, and the internal space of the laser projector forms a first air path, a second air path and a third air path;

[0054] A transverse partition plate 2 is arranged in the video processing and imaging chamber, and the transverse partition plate 2 divides the video processing and imaging chamber into a first chamber and a second chamber;

[0055] The longitudinal partition plate 1 is provided with a first air vent 1a and a second air vent 1b, the first air vent 1a communicates the laser light source chamber and the first chamber, and the second air vent 1b communicates the laser light source chamber and the second chamber;

[0056] The airflow of the first air path enters the laser light source chamber from the right side of the projector and the bottom of the video processing and imaging chamber, and then is discharged from the left side of the laser light source chamber;

[0057] The airflow of the second air path enters the laser light source chamber from the front side of the projector and is discharged from the left side of the laser light source chamber;

[0058] The airflow of the third air path enters the laser light source chamber from the rear side of the projector, the third air path includes a first airflow branch and a second airflow branch, the airflow of the first airflow branch is discharged from the left side of the laser light source chamber, and the airflow of the second airflow branch is discharged from the left side of the laser light source chamber after sequentially passing through the first air vent 1a and the second air vent 1b.

[0059] In combination Figure 3 , 4As shown in Figure 5, the airflow in the first airflow path flows from the first air inlet 4 on the right side of the laser projector, passes through the heat dissipation grille 3 at the bottom of the video processing imaging chamber, and then enters the laser source chamber. The cool airflow in the first airflow path carries away the heat from the heat dissipation grille 3 as it flows through the bottom of the video processing imaging chamber, effectively cooling the components within the chamber. The airflow in the second airflow path enters the laser source chamber from the second air inlet 5 on the front side of the laser projector, and the airflow in the third airflow path enters the laser source chamber from the third air inlet 6 on the rear side of the laser projector. In other words, outside air does not directly enter the video processing imaging chamber, effectively preventing dust from the outside air from entering and reducing the possibility of dust accumulation and static electricity generation within the chamber.

[0060] Combination Figure 3 and Figure 4 As shown, a third ventilation opening 2a is provided on the transverse partition 2, and a low-temperature fan 8 is installed at the third ventilation opening 2a to introduce the airflow in the first chamber into the second chamber.

[0061] Reference Figure 5 As shown, the laser projector includes a drive board assembly 9 disposed in a video processing imaging chamber. The drive board assembly is provided with an Android motherboard assembly 9a and a video board assembly 9b located in the first chamber. A thermistor connected to the video board assembly 9b is installed near the CPU of the Android motherboard assembly 9a. A PTC heater 10 is installed at the first vent 1a.

[0062] This includes a low-temperature heating start-up mode. In this mode, after the laser projector is powered on, the driver board assembly 9 and the video board assembly 9b are powered on and enter standby mode. The video board assembly 9b detects the temperature of the CPU of the Android motherboard assembly 9a through a thermistor. When the detected temperature is lower than a set temperature t, the driver board assembly 9 controls the PTC heater 10 to be powered on and simultaneously starts the low-temperature fan 8. The external cold air is heated by the PTC heater 10 and then flows to heat the video board assembly 9b and the Android motherboard assembly 9a. After the temperature rises, when the thermistor detects that the temperature is higher than the set temperature t, the PTC heater 10 is powered off and stops heating, and the Android motherboard assembly 9a is powered on, allowing it to enter the working state.

[0063] After the Android motherboard component 9a is powered on, when the temperature detected by the thermistor is t-10, the PTC heater 10 restarts for heating. To prevent the PTC heater 10 from frequently switching heating at the aforementioned set temperature t, a temperature hysteresis of no less than 10℃ is set. That is, when the temperature detected by the thermistor (specifically the NTC thermistor) is higher than this set temperature t, and the video board component 9b is powered on and enters the working state, the video board component 9b switches the circuit so that the thermistor detection value must be lower than this set temperature t-10, such as t = -15 - 10 = -25℃, before switching back to the heating circuit to continue heating.

[0064] Referring to Figure 5 As shown in the figure, the laser light source chamber is provided with a laser light source module 11, the laser light source module 11 is provided with a light source heat sink A11a and a light source heat sink B11b, part of the airflow of the first air path and the airflow of the first airflow branch of the third air path flow through the light source heat sink A11a, and part of the airflow of the first air path and the airflow of the second air path flow through the light source heat sink B11b. The video processing imaging chamber is provided with a light engine module 12, the light engine module 12 is provided with a DMD heat sink 12a and a light engine heat sink 12b, the DMD heat sink 12a is arranged in the first chamber, the light engine heat sink 12b is installed in the second chamber and located at the air outlet 7 of the low-temperature fan 8, and a DC module heat sink 13 is also installed in the second chamber. The second airflow branch of the third air path flows through the DMD heat sink 12a, the low-temperature fan 8, the light engine heat sink 12b and the DC module heat sink 13 in sequence, and the second airflow branch of the third air path also flows through the Android mainboard assembly 9a and the video board assembly 9b before flowing through the low-temperature fan 8.

[0065] TEC refrigeration pieces are installed between the light source heat sink A11a and the laser light source module 11, between the light source heat sink B11b and the laser light source module 11, and between the light engine module 12 and the DMD heat sink 12a;

[0066] Referring to Figure 3 As shown in the figure, a heat conduction block 16 is installed between the CPU of the Android board mainboard and the back cover plate of the laser projector.

[0067] Search Figure 2 , 3 and Figure 5 As shown in the figure, the laser projector is provided with an air outlet 7, the laser light source chamber is provided with an air duct assembly 15 covering the air outlet 7, a heat dissipation fan 14 is installed in the air duct assembly 15, and the airflows of the first air path, the second air path and the third air path are all collected into the air duct assembly 15 and discharged through the heat dissipation fan 14.

[0068] It includes a high-temperature refrigeration heat dissipation mode, in which the driving and temperature control of the driving board assembly 9 and the video board assembly 9b are performed, the working current of the TEC refrigeration piece is automatically adjusted for refrigeration and accurate temperature control of the light source module, and the rotating speed of the air outlet 7 heat dissipation fan 14 is automatically adjusted for effective heat dissipation; in this mode, the driving and temperature control of the driving board assembly 9 and the video board assembly 9b are performed, the working current of the TEC refrigeration piece is automatically adjusted for refrigeration and accurate temperature control of the light engine module 12, and the low-temperature fan 8 automatically adjusts the rotating speed according to the temperature control requirement for effective heat dissipation;

[0069] The control of all TEC refrigeration pieces is automatically controlled and adjusted by a PID algorithm, and the heat dissipation fan 14 at the air outlet 7 and the low-temperature fan 8 are started, automatically speed-adjusted and stopped according to the temperature control requirement, so as to achieve accurate temperature control of each key component.

[0070] The above embodiments only express one or several embodiments of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the patent scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A laser projector thermal management system suitable for wide temperature range adaptation, the interior space of the laser projector is divided into a laser light source chamber and a video processing and imaging chamber, characterized in that: a longitudinal partition (1) is arranged between the laser light source chamber and the video processing and imaging chamber, and the interior of the laser projector forms a first air path, a second air path and a third air path; a transverse partition (2) is arranged in the video processing and imaging chamber, and the transverse partition (2) divides the video processing and imaging chamber into a first chamber and a second chamber; a first air vent (1a) and a second air vent (1b) are arranged on the longitudinal partition (1), the first air vent (1a) is connected with the laser light source chamber and the first chamber, and the second air vent (1b) is connected with the laser light source chamber and the second chamber; the airflow of the first air path enters the laser light source chamber from the right side of the projector and the bottom of the video processing and imaging chamber, and then is discharged from the left side of the laser light source chamber; the airflow of the second air path enters the laser light source chamber from the front side of the projector and is discharged from the left side of the laser light source chamber; the airflow of the third air path enters the laser light source chamber from the rear side of the projector, the third air path includes a first airflow branch and a second airflow branch, the airflow of the first airflow branch is discharged from the left side of the laser light source chamber, and the airflow of the second airflow branch is discharged from the left side of the laser light source chamber after sequentially passing through the first air vent (1a) and the second air vent (1b); a third air vent (2a) is arranged on the transverse partition (2), and a low-temperature fan (8) for guiding the airflow in the first chamber into the second chamber is arranged in the third air vent (2a); the laser projector comprises a drive board assembly (9) arranged in the video processing and imaging chamber, the drive board assembly is provided with an Android mainboard assembly (9a) located in the first chamber and a video board assembly (9b), a thermistor connected with the video board assembly (9b) is arranged near the CPU of the Android mainboard assembly (9a); a PTC heater (10) is arranged at the first air vent (1a); a laser light source module (11) is arranged in the laser light source chamber, the laser light source module (11) is provided with a light source heat sink A (11a) and a light source heat sink B (11b), part of the airflow of the first air path and the airflow of the first airflow branch of the third air path flow through the light source heat sink A (11a), and part of the airflow of the first air path and the airflow of the second air path flow through the light source heat sink B (11b); TEC refrigerating sheets are arranged between the light source heat sink A (11a) and the laser light source module (11) and between the light source heat sink B (11b) and the laser light source module (11), and a TEC refrigerating sheet is also arranged between a light engine module (12) and a DMD heat sink (12a); a heat conduction block (16) is arranged between the CPU of the Android mainboard assembly (9a) and the rear cover plate of the laser projector. The system includes a low-temperature heating start mode, ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 2. The thermal management system for a laser projector adapted for a wide temperature range according to claim 1, wherein: ​ In this mode, after the laser projector is powered on, the drive board assembly (9) and the video board assembly (9b) are powered on to enter standby, and the video board assembly (9b) detects the temperature of the CPU of the Android mainboard assembly (9a) through the thermistor. When the detected temperature is lower than a set temperature t, the drive board assembly (9) controls the PTC heater (10) to be powered on and work at the same time, and starts the low-temperature fan (8). The heated air flow after the external cold air passes through the PTC heater (10) heats the video board assembly (9b) and the Android mainboard assembly (9a). After heating and warming up, when the thermistor detects that the temperature is higher than the set temperature t, the PTC heater (10) is powered off to stop heating, and the Android mainboard assembly (9a) is powered on so that it can enter a working state.

3. The thermal management system for a laser projector adapted for a wide temperature range according to claim 1, wherein: After the Android mainboard assembly (9a) is powered on and works, when the thermistor detects that the temperature is t-10, the PTC heater (10) is started again to heat.

4. The thermal management system for a laser projector adapted for a wide temperature range according to claim 1, wherein: The video processing imaging chamber is provided with a light engine module (12), and the light engine module (12) is provided with a DMD heat sink (12a) and a light engine heat sink (12b). The DMD heat sink (12a) is arranged in the first chamber, and the light engine heat sink (12b) is installed in the second chamber and located at the air outlet (7) of the low-temperature fan (8). A DC module heat sink (13) is also installed in the second chamber. The second air flow branch of the third air path flows through the DMD heat sink (12a), the low-temperature fan (8), the light engine heat sink (12b), and the DC module heat sink (13) in sequence. The second air flow branch of the third air path also flows through the Android mainboard assembly (9a) and the video board assembly (9b) before flowing through the low-temperature fan (8).

5. The thermal management system for a laser projector adapted for a wide temperature range according to claim 1, wherein: The laser projector is provided with an air outlet (7), and the laser source chamber is provided with an air duct assembly (15) covering the air outlet (7). The air duct assembly (15) is installed with a cooling fan (14). The air flows of the first air path, the second air path, and the third air path are all collected in the air duct assembly (15) and discharged through the cooling fan (14).

6. The thermal management system for a laser projector adapted for a wide temperature range according to claim 5, wherein: It includes a high-temperature refrigeration and heat dissipation mode, In this mode, the drive board assembly (9) and the video board assembly (9b) are driven and temperature-controlled, the working current of the TEC refrigeration sheet is automatically adjusted for refrigeration and accurate temperature control of the light source module, and the speed of the cooling fan (14) at the air outlet (7) is automatically adjusted for effective heat dissipation. In this mode, the drive board assembly (9) and the video board assembly (9b) are driven and temperature-controlled, the working current of the TEC refrigeration sheet is automatically adjusted for refrigeration and accurate temperature control of the light engine module (12), and the low-temperature fan (8) automatically adjusts the speed according to the temperature control requirement for effective heat dissipation.

7. The thermal management system for a laser projector adapted for a wide temperature range according to claim 6, wherein: The control of all TEC refrigeration sheets is automatically adjusted by the PID algorithm. The cooling fan (14) at the air outlet (7) and the low-temperature fan (8) are started, automatically adjusted in speed, and stopped according to the temperature control requirement, so as to achieve accurate temperature control of each key component.

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