Inductor components

Abstract

The present invention provides an inductor component capable of suppressing the reduction in reliability caused by heat. The inductor component comprises: a main body (20); a first inductor wiring (30) located inside the main body (20) and extending on a virtual plane (S1); and a second inductor wiring (40) located inside the main body (20) and extending parallel to the virtual plane (S1). The inductor component comprises a third inductor wiring (50) located inside the main body (20) between the first inductor wiring (30) and the second inductor wiring (40) and extending parallel to the virtual plane (S1). The inductor component comprises vertical wirings (61 to 63) extending from the first to third inductor wirings (30, 40, 50) through the interior of the main body (20) to the surface of the main body (20) in a direction perpendicular to the virtual plane (S1). The third inductor wiring (50) is a low-resistance inductor wiring (55) having a DC resistance smaller than that of the first inductor wiring (30) and the second inductor wiring (40).

Description

[0001] This application is a divisional application of the invention patent application with application number 202011059295.1, application date September 30, 2020, applicant Murata Manufacturing Co., Ltd., and invention name “Inductor Component”. Technical Field

[0002] The present disclosure relates to inductor components. Background Art

[0003] Among inductor components mounted in electronic devices, for example, as described in Patent Document 1, there is a structure that constitutes an inductor array, which includes: a main body formed by stacking magnetic material layers as a sintered body of ferrite; and a plurality of inductor wirings located on the same virtual plane inside the main body.

[0004] Patent Document 1: Japanese Patent Application Laid-Open No. 2002-110432

[0005] In the inductor component that constitutes the inductor array described above, the multiple inductor wirings are typically formed to have the same wiring width and line length, and the same DC resistance. Furthermore, when the inductor component includes three or more inductor wirings aligned on the same virtual plane, the inductor wirings located at the ends of the inductor wirings are adjacent to the inductor wiring only on one side of the alignment direction. In contrast, the inductor wiring located between the inductor wirings at the ends is adjacent to the inductor wiring on both sides of the alignment direction. Therefore, considering the problem that, when the same current flows through each inductor wiring, the inductor wiring located between the inductor wirings at the ends is more likely to accumulate heat around the inductor wiring compared to the inductor wirings located at the ends, resulting in a temperature increase.

[0006] In addition, some inductor components employ bottom-electrode types for miniaturization and low profile. These bottom-electrode inductor components also include vertical wiring that extends through the main body, perpendicular to the plane in which the inductor wiring extends, from each inductor wiring to the main body surface. External terminals connected to the vertical wiring are exposed only on at least one of the top and bottom surfaces of the inductor component. When soldering these inductor components to a circuit board, the solder adheres only to the bottom surface, reducing the mounting area on the circuit board.

[0007] However, after actually manufacturing a bottom electrode type inductor component, the inventors of the present application discovered that current tends to concentrate at the connection portion between the inductor component and the circuit substrate (i.e., the portion of the solder connecting the external terminal and the circuit substrate), so electromigration is easily generated at this connection portion.

[0008] Here, the electromigration lifetime formula in the thin film (Black's empirical formula) is as follows.

[0009] [Formula 1]

[0010]

[0011] A represents the proportional constant, J represents the current density [A / cm 2 ], n represents the current density dependence coefficient, E a represents the activation energy of life [J], K represents the Boltzmann constant (1.38×10 23 [J / K]), T represents absolute temperature [K].

[0012] The electromigration lifetime formula above shows that the higher the temperature, the shorter the lifetime. Furthermore, it is also known that the lifetime is highly temperature-dependent.

[0013] As described above, the inductor wiring located between the inductor wirings at both ends is susceptible to temperature increases, and therefore electromigration is particularly likely to occur in the vertical wiring connected to the inductor wiring and in the solder connecting the external terminal to the circuit board. Summary of the Invention

[0014] An object of the present disclosure is to provide an inductor component capable of suppressing a decrease in reliability due to heat.

[0015] An inductor component according to one embodiment of the present disclosure includes: a main body; a first inductor wiring located within the main body and extending on a virtual plane; a second inductor wiring located within the main body and extending parallel to the virtual plane; a third inductor wiring located within the main body between the first inductor wiring and the second inductor wiring and extending parallel to the virtual plane; and a vertical wiring extending from the first inductor wiring to the third inductor wiring and extending through the main body in a direction perpendicular to the virtual plane to a surface of the main body, wherein the third inductor wiring is a low-resistance inductor wiring having a lower DC resistance than the first and second inductor wirings.

[0016] According to the above embodiment, even when the same current flows through the first to third inductor wirings, the third inductor wiring, where heat is particularly likely to accumulate, is less likely to heat up than the first and second inductor wirings. This prevents the area near the third inductor wiring from becoming locally hotter than the areas near the first and second inductor wirings, thereby suppressing reliability degradation caused by heat.

[0017] In this specification, the term "inductor wiring" refers to a structure that generates magnetic flux when current flows, thereby imparting inductance to the inductor component, and its structure, shape, material, etc. are not particularly limited.

[0018] An inductor component according to one embodiment of the present disclosure includes: a main body; a plurality of inductor wires arranged in a matrix within the main body; and vertical wires extending through the main body in the direction in which the inductor wires in each column are arranged, from each of the inductor wires to the surface of the main body. Each row includes three or more inductor wires, and the closer the inductor wires are to the center between the two inductor wires located at opposite ends of the row, the lower the DC resistance. Each column includes three or more inductor wires, and the closer the inductor wires are to the center between the two inductor wires located at opposite ends of the column, the lower the DC resistance.

[0019] According to the above aspect, even when the same current flows through each inductor wiring row, the inductor wiring row, where heat is particularly likely to accumulate near the center between the two inductor wiring rows at the ends of the row, is less likely to heat up. Consequently, in each inductor wiring row, localized high temperatures near the inductor wiring row between the two inductor wiring rows at the ends of the row are suppressed.

[0020] Similarly, even when the same current flows through each inductor wiring in each column, the inductor wiring in each column, where heat is particularly likely to accumulate near the center between the two inductor wirings at the ends of the column, is less likely to heat up. Therefore, in each column of inductor wiring, localized high temperatures near the inductor wiring between the two inductor wirings at the ends of the column are suppressed.

[0021] This can suppress a decrease in reliability due to heat.

[0022] According to one embodiment of the present disclosure, it is possible to suppress a decrease in reliability due to heat. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an exploded perspective view of the inductor component in the first embodiment.

[0024] Figure 2 (a) is a perspective top view of the inductor component in the first embodiment, and (b) is a cross-sectional view of the inductor component ( Figure 2 (a) is a sectional view of 2b-2b in FIG), and (c) is a sectional view of the inductor component ( Figure 2 2c-2c cross-sectional view in (a).

[0025] Figure 3 (a) is a perspective top view of the inductor component in the second embodiment, and (b) is a cross-sectional view of the inductor component ( Figure 3 3b-3b sectional view in (a).

[0026] Figure 4 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 4 4b-4b cross-sectional view in (a).

[0027] Figure 5 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 5 5b-5b cross-sectional view in (a).

[0028] Figure 6 It is a perspective plan view of an inductor component according to a modified example.

[0029] Figure 7 It is a perspective plan view of an inductor component according to a modified example.

[0030] Figure 8 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 8 8b-8b cross-sectional view in (a).

[0031] Figure 9 It is a perspective plan view of an inductor component according to a modified example.

[0032] Figure 10 It is a perspective plan view of an inductor component according to a modified example.

[0033] Figure 11 It is a perspective plan view of an inductor component according to a modified example.

[0034] Figure 12 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 12 12b-12b sectional view in (a), (c) is a sectional view of the inductor component ( Figure 12 12c-12c cross-sectional view in (a)).

[0035] Figure 13 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 13 13b-13b cross-sectional view in (a).

[0036] Figure 14(a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 14 14b-14b sectional view in (a), (c) is a sectional view of the inductor component ( Figure 14 14c-14c cross-sectional view in (a).

[0037] Figure 15 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 15 15b-15b sectional view in (a), (c) is a sectional view of the inductor component ( Figure 15 15c-15c cross-sectional view in (a)).

[0038] Figure 16 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 16 16b-16b cross-sectional view in (a).

[0039] Figure 17 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 17 17b-17b cross-sectional view in (a).

[0040] Figure 18 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 18 18b-18b cross-sectional view in (a).

[0041] Figure 19 (a) is a perspective top view of the inductor component of the modification example, and (b) is a cross-sectional view of the inductor component ( Figure 19 19b-19b cross-sectional view in (a).

[0042] Description of Reference Numerals

[0043] 1, 1A, 1B, 1C, 1D, 1E, 1F, 1G, 1H, 1K, 1L, 1M, 1N, 1P, 1Q, 1R, 1S, 1T…inductor component; 20…main body; 20a…upper surface; 20b…first end surface; 20c…second end surface; 20d…lower surface; 20e…first end surface; 20f…second end surface; 21, 22…magnetic material layer; 30, 30A, 160…first inductor wiring; 31, 33, 161…first wiring portion; 32…first connecting portion; 40, 40A, 170…second inductor wiring; 41, 43, 171 ...second wiring portion; 42...second connecting portion; 50, 50C, 50E, 50G, 50H, 50I, 50J, 50K, 50L, 50M, 121, 180A...third inductor wiring portion; 50A, 50D, 50F, 122A, 122B, 180B...fourth inductor wiring portion; 51, 53, 54, 56, 57, 58, 59, 81, 83, 101, 121a, 181a...third wiring portion serving as a low-resistance wiring portion; 51A, 53D, 54F, 122a, 122b, 181b...fourth wiring portion serving as a low-resistance wiring portion Wiring portion; 52… a third connection portion serving as a low-resistance connection portion; 52A… a fourth connection portion serving as a low-resistance connection portion; 52B… a fifth connection portion serving as a low-resistance connection portion; 55, 55A, 55B, 55C, 55D, 55E, 55F, 55G, 55H, 55I, 55J, 185… low-resistance inductor wiring; 61-65, 130, 141… vertical wiring; 71-75, 142… external terminals; 83a, 83b, 101a, 101b… parallel wiring; 111… main wiring; 112… sub-wiring; 123A, 123B… fifth Inductor wiring; 123a, 123b…a fifth wiring portion serving as a low-resistance wiring portion; 143…a virtual terminal; 150…inductor wiring; F1, F2, F3…a direction in which the wiring is arranged in parallel; S1…a virtual plane; S2…a plane; S11…a virtual plane; S21…a virtual plane; T11…a distance; T12…a distance; T13…a distance; T14…a distance; W1 to W5…a wiring width; W11…a wiring width; W21…a wiring width; W31…a wiring width; W31A…a wiring width; W41…a distance; W42…a distance; W43…a distance; W44…a distance. DETAILED DESCRIPTION

[0044] The following describes embodiments of inductor components. In some drawings, components are enlarged for easier understanding. Dimensional ratios of components may differ from actual dimensions or from those shown in other drawings. Furthermore, although hatching is used in cross-sectional views, hatching of some components may be omitted for easier understanding.

[0045] <First embodiment>

[0046] Figure 1 The inductor component 1 shown is a surface-mount inductor component mounted on electronic equipment such as a personal computer, a DVD player, a digital camera, a television, a mobile phone, or automotive electronic equipment.

[0047] like Figure 1 As shown, the inductor component 1 includes a main body 20, a first inductor wiring 30 located within the main body 20 and extending on a virtual plane S1, and a second inductor wiring 40 located within the main body 20 and extending on (parallel to) the virtual plane S1. Furthermore, the inductor component 1 includes a third inductor wiring 50 located within the main body 20 between the first inductor wiring 30 and the second inductor wiring 40 and extending on (parallel to) the virtual plane S1. Furthermore, the inductor component 1 includes vertical wirings 61, 62, and 63 extending from each of the first to third inductor wirings 30, 40, and 50 to the surface of the main body 20, extending through the interior of the main body 20 in a direction perpendicular to the virtual plane S1. The third inductor wiring 50 is a low-resistance inductor wiring 55 having a lower DC resistance than the first and second inductor wirings 30, 40.

[0048] like Figure 1 、 Figure 2 (a) and Figure 2 As shown in FIG. 2( b ), the inductor component 1 of the present embodiment is a laminated inductor component and includes a main body 20 , first to third inductor wirings 30 , 40 , and 50 , and first to third vertical wirings 61 to 63 .

[0049] The main body 20 has a substantially rectangular parallelepiped shape. In the present embodiment, the upper surface 20 a of the main body 20 is a mounting surface that faces the circuit board when the inductor component 1 is mounted on the circuit board.

[0050] The main body 20 is a laminated body formed by stacking material layers. In this embodiment, the main body 20 is a laminated body formed by stacking multiple magnetic material layers 21 and 22. Each magnetic material layer 21 and 22 is in the shape of a rectangular plate. The magnetic material layers 21 and 22 are sintered bodies. As materials, magnetic materials such as ferrite, non-magnetic materials such as glass and alumina can be used. Because the magnetic material layers 21 and 22 are sintered bodies, the inductor wiring 30, 40, and 50 can be formed with high quality and low cost. In addition, the magnetic material layers 21 and 22 are not limited to sintered bodies. As the material of the magnetic material layers 21 and 22, magnetic materials that do not melt at low temperatures can also be used.

[0051] The first inductor wiring 30, the second inductor wiring 40, and the third inductor wiring 50 are located inside the main body 20. The first inductor wiring 30, the second inductor wiring 40, and the third inductor wiring 50 are arranged on the main surface 21a of the magnetic material layer 21. The first inductor wiring 30, the second inductor wiring 40, and the third inductor wiring 50 are arranged to be located on the same virtual plane S1. In addition, in the present embodiment, the virtual plane S1 coincides with the main surface 21a of the magnetic material layer 21. In addition, the third inductor wiring 50 is located between the first inductor wiring 30 and the second inductor wiring 40, and the first to third inductor wirings 30, 40, 50 are aligned and arranged at equal intervals along a direction parallel to the virtual plane S1. The arrangement direction of the first to third inductor wirings 30, 40, 50, that is, the side-by-side arrangement direction F1 is in Figure 2 (a) is the left-right direction. In addition, the first to third inductor wirings 30, 40, 50 have a straight line shape extending in a direction perpendicular to the parallel arrangement direction F1 on the virtual plane S1. The extending direction of the first to third inductor wirings 30, 40, 50 is Figure 2 (a) is the up and down direction.

[0052] Here, of the two end faces of the main body 20 in the alignment direction F1, the end face on the side of the first inductor wiring 30 is referred to as the first end face 20b, and the end face on the side of the second inductor wiring 40 is referred to as the second end face 20c. The first inductor wiring 30 and the first end face 20b are adjacent to each other in the alignment direction F1. Furthermore, the second inductor wiring 40 and the second end face 20c are adjacent to each other in the alignment direction F1. That is, no other inductor wiring is provided between the first inductor wiring 30 and the first end face 20b, and no other inductor wiring is provided between the second inductor wiring 40 and the second end face 20c. Furthermore, the first inductor wiring 30 and the second inductor wiring 40 are the outermost inductor wirings of all the inductor wirings included in the inductor component 1, that is, the inductor wirings located at the two ends of the alignment direction F1.

[0053] The first inductor wiring 30 includes a first wiring portion 31 and first connecting portions 32 provided at both ends of the first wiring portion 31 .

[0054] The first wiring portion 31 is in the form of a strip extending in a straight line in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. The first wiring portion 31 is formed with a constant wiring width W11 and thickness. The first connecting portion 32 is formed integrally with the first wiring portion 31. In this embodiment, the shape of each first connecting portion 32 as viewed from a direction perpendicular to the virtual plane S1 (i.e., in the direction perpendicular to the virtual plane S1) is Figure 2The state shown in (a) of FIG. 3 is a quadrilateral that is roughly square. Moreover, the wiring width W12 of the first connecting portion 32 (the width in the same direction as the wiring width direction of the first wiring portion 31) is thicker than the wiring width W11 of the first wiring portion 31. That is, the boundary between the first wiring portion 31 and the first connecting portion 32 is the position where the wiring width changes. In addition, the central position of the wiring width direction of the first connecting portion 32 in the side-by-side arrangement direction F1 (the same as the side-by-side arrangement direction F1 in this embodiment) is consistent with the central position of the wiring width direction of the first wiring portion 31 in the side-by-side arrangement direction F1. That is, the first wiring portion 31 extends from the central portion of the wiring width direction of one first connecting portion 32 to the central portion of the wiring width direction of the other first connecting portion 32.

[0055] The second inductor line 40 extends parallel to the virtual plane S1 and includes a second line portion 41 and second connecting portions 42 provided at both ends of the second line portion 41 . The second inductor line 40 has the same shape and size as the first inductor line 30 .

[0056] The second wiring portion 41 is strip-shaped, extending linearly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. The second wiring portion 41 extends parallel to the first wiring portion 31. Furthermore, the second wiring portion 41 is formed to have a constant wiring width W21 and thickness. Furthermore, the wiring width, thickness, and line length of the second wiring portion 41 are equal to those of the first wiring portion 31.

[0057] The second connection portion 42 is formed integrally with the second wiring portion 41. In this embodiment, the shape of each second connection portion 42 as viewed from a direction perpendicular to the virtual plane S1 (i.e. Figure 2 The state shown in (a) of FIG) is a quadrilateral that is substantially a square and the same as the first connection portion 32. Moreover, the second connection portion 42 is the same size as the first connection portion 32 and has the same thickness as the first connection portion 32. In addition, the wiring width W22 of the second connection portion 42 (the width in the same direction as the wiring width direction of the second wiring portion 41) is thicker than the wiring width W21 of the second wiring portion 41. That is, the boundary between the second wiring portion 41 and the second connection portion 42 is the position where the wiring width changes. In addition, the central position in the wiring width direction of the second connection portion 42 in the side-by-side arrangement direction F1 is consistent with the central position in the wiring width direction of the second wiring portion 41 in the side-by-side arrangement direction F1. That is, the second wiring portion 41 extends from the central portion in the wiring width direction of one second connection portion 42 to the central portion in the wiring width direction of the other second connection portion 42.

[0058] The third inductor wiring 50 extends parallel to the virtual plane S1. The third inductor wiring 50 is a low-resistance inductor wiring 55 having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. The third inductor wiring 50 includes a third wiring portion 51 and third connecting portions 52 provided at both ends of the third wiring portion 51. Furthermore, since the third inductor wiring 50 is a low-resistance inductor wiring 55, the third wiring portion 51 is an example of a low-resistance wiring portion, and the third connecting portions 52 are an example of a low-resistance connecting portion.

[0059] The third wiring portion 51 is strip-shaped, extending linearly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. The third wiring portion 51 extends parallel to the first wiring portion 31 and the second wiring portion 41. The third wiring portion 51 is formed to have a constant wiring width W31 and thickness. Furthermore, the line length and thickness of the third wiring portion 51 are equal to those of the first wiring portion 31 and the second wiring portion 41.

[0060] In this embodiment, at least a portion of the low-resistance inductor wiring 55 has a larger cross-sectional area (the area of ​​a cross section perpendicular to the direction of current flow) than the first inductor wiring 30 and the second inductor wiring 40. In this embodiment, at least a portion of the low-resistance inductor wiring 55 has a larger cross-sectional area than the first inductor wiring 30 and the second inductor wiring 40 because the wiring width is greater than that of the first inductor wiring 30 and the second inductor wiring 40. Specifically, the wiring width of the third wiring portion 51 of the third inductor wiring 50, which serves as the low-resistance inductor wiring 55, is greater than the first wiring portion 31 of the first inductor wiring 30 and the second wiring portion 41 of the second inductor wiring 40. In other words, the wiring width W31 of the third wiring portion 51 is greater than the wiring width W11 of the first wiring portion 31 and the wiring width W21 of the second wiring portion 41. As described above, the third inductor line 50 of this embodiment has a DC resistance smaller than that of the first inductor line 30 and the second inductor line 40 because the line width W31 of the third line portion 51 is larger than the line width W11 of the first line portion 31 and the line width W21 of the second line portion 41 .

[0061] The third connection portion 52 is formed integrally with the third wiring portion 51. In this embodiment, the shape of each third connection portion 52 as viewed from a direction perpendicular to the virtual plane S1 (i.e. Figure 2The state shown in (a) of FIG) is a quadrilateral that is roughly a square, the same as the first connection part 32 and the second connection part 42. Moreover, the third connection part 52 is the same size as the first connection part 32 and the second connection part 42, and the thickness is equal to the first connection part 32 and the second connection part 42. In addition, the wiring width W32 of the third connection part 52 (the width in the same direction as the wiring width direction of the third wiring part 51) is thicker than the wiring width W31 of the third wiring part 51. That is, the boundary between the third wiring part 51 and the third connection part 52 is the position where the wiring width changes. In addition, the central position of the wiring width direction of the third connection part 52 in the side-by-side arrangement direction F1 is consistent with the central position of the wiring width direction of the third wiring part 51 in the side-by-side arrangement direction F1. That is, the third wiring part 51 extends from the central part of the wiring width direction of one third connection part 52 to the central part of the wiring width direction of another third connection part 52.

[0062] One of the first to third connecting portions 32, 42, 52 of the first to third inductor wirings 30, 40, 50 (at Figure 2 (a) is the upper connecting portion) in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1 (in Figure 2 Therefore, the first to third connecting portions 32, 42, 52 of the first to third inductor wirings 30, 40, 50 are aligned along the parallel arrangement direction F1. In addition, the first to third connecting portions 32, 42, 52 are arranged at equal intervals along the parallel arrangement direction F1. Similarly, the other first to third connecting portions 32, 42, 52 of the first to third inductor wirings 30, 40, 50 (in the vertical direction) are aligned along the parallel arrangement direction F1. Figure 2 The positions of the first to third connecting portions 32, 42, and 52 of the first to third inductor traces 30, 40, and 50 (the lower connecting portion in (a)) are equal in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. Therefore, the other first to third connecting portions 32, 42, and 52 of the first to third inductor traces 30, 40, and 50 are aligned along the parallel arrangement direction F1. Furthermore, these first to third connecting portions 32, 42, and 52 are arranged at equal intervals along the parallel arrangement direction F1.

[0063] The main body 20 forms a magnetic circuit through which magnetic flux generated when current flows through the first to third inductor wirings 30, 40, and 50 passes. This imparts significant inductance to the inductor component 1, creating impedance against signals passing through the first to third inductor wirings 30, 40, and 50. Consequently, the inductor component 1 functions as a noise suppression product, dissipating high-frequency noise superimposed on the signal as magnetic losses within the main body 20. However, as long as the inductor component 1 imparts inductance, its function is not limited; it may also include impedance matching, filtering, resonating, smoothing, rectifying, storing electricity, transforming, distributing, coupling, and converting functions.

[0064] The distance W41 between the first wiring portion 31 and the first end surface 20b of the main body 20 is shorter than the distance W42 between the third wiring portion 51 of the low-resistance inductor wiring 55 (third inductor wiring 50) adjacent to the first inductor wiring 30 and the first wiring portion 31. In the main body 20, the portion between the first wiring portion 31 and the first end surface 20b constitutes the magnetic path of the inductor formed by the first inductor wiring 30. Furthermore, in the main body 20, the portion between the third wiring portion 51 of the low-resistance inductor wiring 55 adjacent to the first inductor wiring 30 and the first wiring portion 31 constitutes the magnetic path of the inductor formed by the first inductor wiring 30. Therefore, when viewed from a direction perpendicular to the virtual plane S1, the width of the magnetic path of the inductor formed by the first inductor wiring 30 is narrower on the side of the first inductor wiring 30 closer to the first end surface 20b than on the side of the first inductor wiring 30 closer to the third inductor wiring 50.

[0065] Furthermore, the distance W43 between the second wiring portion 41 and the second end surface 20c of the main body 20 is shorter than the distance W44 between the third wiring portion 51 of the low-resistance inductor wiring 55 (third inductor wiring 50) adjacent to the second inductor wiring 40 and the second wiring portion 41. In the main body 20, the portion between the second wiring portion 41 and the second end surface 20c constitutes the magnetic path of the inductor formed by the second inductor wiring 40. Furthermore, in the main body 20, the portion between the third wiring portion 51 of the low-resistance inductor wiring 55 adjacent to the second inductor wiring 40 and the second wiring portion 41 constitutes the magnetic path of the inductor formed by the second inductor wiring 40. Therefore, when viewed from a direction perpendicular to the virtual plane S1, the width of the magnetic path of the inductor formed by the second inductor wiring 40 is narrower on the side of the second inductor wiring 40 closer to the second end surface 20c than on the side of the second inductor wiring 40 closer to the third inductor wiring 50.

[0066] In this embodiment, the distance W42 between the first wiring portion 31 of the first inductor wiring 30 and the third wiring portion 51 of the third inductor wiring 50 is equal to the distance W44 between the second wiring portion 41 of the second inductor wiring 40 and the third wiring portion 51 of the third inductor wiring 50 .

[0067] In addition, in the main body 20, the distances W41 to W44 do not necessarily need to have the above-mentioned relationship.

[0068] The first vertical wiring 61, the second vertical wiring 62, and the third vertical wiring 63 are provided inside the main body 20. The first to third vertical wirings 61 to 63 are provided in the magnetic material layer 22 and penetrate the magnetic material layer 22 stacked on the main surface 21a of the magnetic material layer 21.

[0069] The first to third vertical wirings 61 to 63 extend through the interior of the main body 20 in a direction perpendicular to the imaginary plane S1, extending from the first to third inductor wirings 30, 40, and 50 to the surface of the main body 20. The phrase "penetrating the interior of the main body 20" means that the first to third vertical wirings 61, 62, and 63 do not protrude from the main body 20, except for the end surfaces of the main body 20 in the direction in which the first to third vertical wirings 61, 62, and 63 extend (the direction perpendicular to the imaginary plane S1). Specifically, this means that the peripheral surfaces of the first to third vertical wirings 61, 62, and 63 do not protrude from the main body 20.

[0070] The first vertical wiring 61 extends from the upper surface (at the top) of the first connecting portion 32 of the first inductor wiring 30 to the Figure 2 The first vertical wiring 61 is electrically connected to the first connecting portion 32. The second vertical wiring 62 extends from the upper surface of the second connecting portion 42 of the second inductor wiring 40 (at the top of the second inductor wiring 40) to the upper surface of the second connecting portion 42 of the second inductor wiring 40. Figure 2 The second vertical wiring 62 is electrically connected to the second connecting portion 42. The third vertical wiring 63 extends from the upper surface of the third connecting portion 52 of the third inductor wiring 50 (at the top of the third inductor wiring 50). Figure 2 The third vertical wiring 63 extends in a direction perpendicular to the virtual plane S1 and penetrates the interior of the magnetic material layer 22 in a direction perpendicular to the virtual plane S1. The upper end surface of the third vertical wiring 63 is exposed from the upper surface 20a of the main body 20 to the outside of the main body 20. In addition, the third vertical wiring 63 is electrically connected to the third connecting portion 52.

[0071] In this embodiment, the cross-sectional areas of the first, second, and third vertical wirings 61, 62, and 63 are equal. Furthermore, the cross-sectional area of ​​a vertical wiring is defined as the area of ​​a cross section perpendicular to the direction of current flow. Therefore, in this embodiment, since current flows in a direction perpendicular to the virtual plane S1 in the first to third vertical wirings 61 to 63, the cross-sectional areas of the first to third vertical wirings 61 to 63 parallel to the virtual plane S1 are equal. Furthermore, the lengths of the first to third vertical wirings 61 to 63 perpendicular to the virtual plane S1 are equal.

[0072] The first to third inductor wirings 30 , 40 , 50 and the first to third vertical wirings 61 to 63 can be made of a good conductor such as silver (Ag), palladium (Pd), copper (Cu), nickel (Ni), gold (Au), aluminum (Al), or alloys containing these metals.

[0073] The first to third external terminals 71 to 73 cover the end surfaces of the first to third vertical wirings 61 to 63 exposed to the outside from the upper surface 20a of the main body 20. The first external terminal 71 is provided on the upper surface 20a of the main body 20 and covers the upper end surface of the first vertical wiring 61 exposed from the upper surface 20a. The second external terminal 72 is provided on the upper surface 20a of the main body 20 and covers the upper end surface of the second vertical wiring 62 exposed from the upper surface 20a. The third external terminal 73 is provided on the upper surface 20a of the main body 20 and covers the upper end surface of the third vertical wiring 63 exposed from the upper surface 20a.

[0074] The inductor component 1 of this embodiment is a bottom-electrode type inductor component, in which the first to third external terminals 71 to 73 connected to the first to third vertical wirings 61 to 63 are exposed only on the upper surface 20a of the main body 20 (corresponding to the upper surface of the inductor component 1 in this embodiment). The inductor component 1 is mounted on a circuit board by soldering the first to third external terminals 71 to 73 to the circuit board with the upper surface 20a facing the circuit board.

[0075] As the material of the first to third external terminals 71 to 73, a material with high solder resistance and solder wettability can be used. For example, metals such as Ni, Cu, tin (Sn), Au, or alloys containing these metals can be used. In addition, the first to third external terminals 71 to 73 can also be formed by multiple layers. For example, a structure in which Cu plating, Ni plating, and Sn plating are stacked in sequence can also be used. In addition, the first to third external terminals 71 to 73 can also be omitted. In this case, the end faces of the first to third vertical wirings 61 to 63 exposed to the outside of the main body 20 can be used instead of the first to third external terminals 71 to 73. This is not applicable when the inductor component 1 is used as a surface-mounted type, but is applicable when it is used as a substrate-embedded type embedded in a circuit substrate.

[0076] Furthermore, in the inductor component 1 of this embodiment, an insulating cover film may be provided on the upper surface 20a and lower surface 20d of the main body 20. This cover film ensures insulation of the outer surface of the main body 20 while exposing the end surfaces of the first to third vertical wirings 61 to 63 and the first to third external terminals 71 to 73 to the outside. Furthermore, the cover film may also serve to define the area within which the first to third external terminals 71 to 73 are formed.

[0077] Next, a summary of a method for manufacturing the above-mentioned inductor component 1 will be described.

[0078] First, a mother laminate is formed. The mother laminate is an unfired body in which multiple main bodies 20 are partially connected in a matrix. Specifically, for example, a plurality of green sheets are prepared. These green sheets are formed by applying a slurry containing ferrite powder dispersed in a resin onto a polyethylene terephthalate (PET) film using a doctor blade method and forming the resulting sheets.

[0079] Next, a conductive paste containing a conductive material is applied by screen printing to the main surface of one of the green sheets in the areas where the first to third inductor wirings 30, 40, and 50 are to be formed. This conductive material is the same as that used for the first to third inductor wirings 30, 40, and 50 and the first to third vertical wirings 61 to 63.

[0080] Next, through-holes are formed in the other green sheets using a laser or other method in the areas where the first to third vertical wirings 61 to 63 are to be formed. A conductive paste is then applied to fill the through-holes. After a predetermined number of green sheets, including these two, are stacked, they are pressure-bonded to form a mother laminate.

[0081] Next, the mother laminate is cut using a saw, guillotine, or other similar method, and singulated into unfired bodies, which serve as the main body 20. The singulated unfired bodies are then fired in a firing furnace or other similar method, thereby forming the main body 20, which has the first to third inductor traces 30, 40, 50 and the first to third vertical traces 61 to 63 therein. Furthermore, when insulating cover films are formed on the upper surface 20a and lower surface 20d of the main body 20, the main body 20 is coated with, for example, a resin material. Furthermore, when the cover films are formed of a fired body made of glass, alumina, or the like, sheets of insulating paste containing glass powder or alumina powder may be laminated and pressure-bonded to the upper and lower surfaces of the mother laminate before singulation.

[0082] Next, first to third external terminals 71 to 73 are formed on the upper surface 20a of the main body 20 by plating, sputtering, vapor deposition, coating, or other methods, thereby completing the inductor component 1. The above manufacturing method is merely an example and is not limited thereto. For example, a printing lamination method could be used instead of the sheet lamination method described above. Alternatively, the conductive material used for the first to third inductor traces 30, 40, 50 and the first to third vertical traces 61 to 63 could be formed or patterned by plating, sputtering, or other methods, rather than applying a conductive paste.

[0083] The effects of this embodiment will be described.

[0084] (1-1) Inductor component 1 includes a main body 20, a first inductor wiring 30 located within main body 20 and extending on a virtual plane S1, and a second inductor wiring 40 located within main body 20 and extending parallel to virtual plane S1. Inductor component 1 also includes a third inductor wiring 50 located within main body 20 between the first inductor wiring 30 and the second inductor wiring 40 and extending parallel to virtual plane S1. Inductor component 1 also includes first to third vertical wirings 61 to 63 that extend through main body 20 in a direction perpendicular to virtual plane S1, extending from each of the first to third inductor wirings 30, 40, and 50 to the surface of main body 20. Third inductor wiring 50 is a low-resistance inductor wiring 55 having a lower DC resistance than the first and second inductor wirings 30 and 40.

[0085] According to the above configuration, even when the same current flows through the first to third inductor wirings 30, 40, and 50, the third inductor wiring 50, where heat is particularly likely to accumulate, is less likely to generate heat than the first and second inductor wirings 30 and 40. Therefore, the localized high temperature near the third inductor wiring 50 compared to the first and second inductor wirings 30 and 40 is suppressed, thereby suppressing reliability degradation due to heat.

[0086] In this embodiment, the first and second inductor wirings 30 and 40 located at opposite ends of the parallel arrangement direction F1 have third inductor wiring 50 adjacent only on one side of the parallel arrangement direction F1. Furthermore, the DC resistance of the third inductor wiring 50 located between the first and second inductor wirings 30 and 40 at the opposite ends is lower than that of the first and second inductor wirings 30 and 40. Therefore, even when the third inductor wiring 50, which is a low-resistance inductor wiring 55, is adjacent to inductor wirings (in this embodiment, the first and second inductor wirings 30 and 40) on both sides, heat generation in the third inductor wiring 50 is suppressed, thereby suppressing heat accumulation around the third inductor wiring 50 and thus minimizing temperature increases in the third inductor wiring 50.

[0087] Furthermore, the temperature difference between the first and second inductor wirings 30, 40, and the third inductor wiring 50 is suppressed from increasing. In other words, the third inductor wiring 50 is suppressed from reaching a higher temperature than the first and second inductor wirings 30, 40. Consequently, electromigration can be suppressed at the connection between the third vertical wiring 63 connected to the third inductor wiring 50 and the circuit board on which the inductor component 1 is mounted.

[0088] Thus, in the bottom electrode type inductor component 1 having the first to third inductor wirings 30 , 40 , 50 arranged in alignment, a decrease in reliability due to heat can be suppressed.

[0089] (1-2) The cross-sectional area of ​​at least a portion of the low-resistance inductor wiring 55 is larger than that of the first inductor wiring 30 and the second inductor wiring 40. This makes it easy to make the DC resistance of the low-resistance inductor wiring 55 lower than that of the first inductor wiring 30 and the second inductor wiring 40.

[0090] (1-3) The wiring width of at least a portion of the low-resistance inductor wiring 55 is greater than that of the first inductor wiring 30 and the second inductor wiring 40. This makes it easier to reduce the DC resistance of the low-resistance inductor wiring 55 relative to the DC resistance of the first inductor wiring 30 and the second inductor wiring 40, compared to increasing the cross-sectional area of ​​the low-resistance inductor wiring 55 by increasing its wiring thickness.

[0091] (1-4) The first inductor wiring 30 includes a first wiring portion 31 and first connecting portions 32 provided at both ends of the first wiring portion 31 and connected to a first vertical wiring 61. The second inductor wiring 40 includes a second wiring portion 41 and second connecting portions 42 provided at both ends of the second wiring portion 41 and connected to a second vertical wiring 62. The third inductor wiring 50, serving as a low-resistance inductor wiring 55, includes a third wiring portion 51 serving as a low-resistance wiring portion and third connecting portions 52 serving as low-resistance connecting portions provided at both ends of the third wiring portion 51 and connected to a third vertical wiring 63. Of the two end faces of the main body 20 in the parallel arrangement direction F1 of the first to third inductor wirings 30, 40, and 50, the end face on the first inductor wiring 30 side is designated as a first end face 20b, and the end face on the second inductor wiring 40 side is designated as a second end face 20c. At this time, the distance W41 between the first end surface 20b and the first wiring portion 31 is shorter than the distance W42 between the third wiring portion 51 of the low-resistance inductor wiring 55 adjacent to the first inductor wiring 30 and the first wiring portion 31. The distance W43 between the second end surface 20c and the second wiring portion 41 is shorter than the distance W44 between the third wiring portion 51 of the low-resistance inductor wiring 55 adjacent to the second inductor wiring 40 and the second wiring portion 41.

[0092] Here, consider the case where a third inductor wiring line, having a third wiring portion with a wiring width equal to that of the first wiring portion 31 and the second wiring portion 41, is located between the first inductor wiring line 30 and the second inductor wiring line 40. The first inductor wiring line 30, the second inductor wiring line 40, and the third inductor wiring line are arranged at equal intervals in the parallel arrangement direction F1. For an inductor formed by the third inductor wiring line, the portion between the first wiring portion 31 and the third wiring portion, and the portion between the second wiring portion 41 and the third wiring portion, on both sides of the third inductor wiring line in the parallel arrangement direction F1, form a magnetic path. In contrast, for an inductor formed by the first inductor wiring line 30, the portion between the first end face 20b of the main body 20 and the first wiring portion 31, on one side of the parallel arrangement direction F1, forms a magnetic path. Furthermore, for the inductor formed by the first inductor wiring 30, the portion of the main body 20 between the third wiring portion of the third inductor wiring adjacent to the first inductor wiring 30 and the first wiring portion 31 on the other side of the parallel arrangement direction F1 forms a magnetic path. Furthermore, the distance W41 between the first end face 20b and the first wiring portion 31 is shorter than the distance between the third wiring portion of the third inductor wiring adjacent to the first inductor wiring 30 and the first wiring portion 31. Therefore, the inductor formed by the first inductor wiring 30 has a lower inductance than the inductor formed by the third inductor wiring. Similarly, for the inductor formed by the second inductor wiring 40, the portion of the main body 20 between the third wiring portion of the third inductor wiring adjacent to the second inductor wiring 40 and the second wiring portion 41 on the one side of the parallel arrangement direction F1 forms a magnetic path. Furthermore, for the inductor formed by the second inductor wiring 40, the portion between the second end face 20c of the main body 20 and the second wiring portion 41 on the other side of the parallel arrangement direction F1 forms a magnetic path. Furthermore, the distance W43 between the second end face 20c and the second wiring portion 41 is shorter than the distance between the third wiring portion of the third inductor wiring adjacent to the second inductor wiring 40 and the second wiring portion 41. Therefore, the inductance of the inductor formed by the second inductor wiring 40 is lower than that of the inductor formed by the third inductor wiring. Thus, variations in inductance occur among the three inductors formed by the first inductor wiring 30, the second inductor wiring 40, and the third inductor wiring.

[0093] In this embodiment, by increasing the width W31 of the third wiring portion 51 of the third inductor wiring 50, the distances W42 and W44 in the main body 20 are correspondingly shortened, thereby reducing the inductance of the inductor formed by the third inductor wiring 50. As a result, even if the distance W41 between the first end face 20b and the first wiring portion 31 is shorter than the distance W42 between the third wiring portion 51 and the first wiring portion 31, the variation in inductance between the inductor formed by the first inductor wiring 30 and the inductor formed by the third inductor wiring 50 can be reduced. Similarly, even if the distance W43 between the second end face 20c and the second wiring portion 41 is shorter than the distance W44 between the third wiring portion 51 and the second wiring portion 41, the variation in inductance between the inductor formed by the second inductor wiring 40 and the inductor formed by the third inductor wiring 50 can be reduced.

[0094] (1-5) Main body 20 is a sintered body. Since main body 20, that is, magnetic material layers 21 and 22 constituting main body 20, are sintered bodies, inductor wirings 30, 40, and 50 can be formed at high quality and low cost.

[0095] <Second embodiment>

[0096] Hereinafter, a second embodiment of the inductor component will be described.

[0097] In the present embodiment, components identical to or corresponding to those in the above-described embodiment are denoted by the same reference numerals, and part or all of their description may be omitted.

[0098] Figure 3 (a) and Figure 3 The inductor component 1A shown in (b) is the inductor component 1 of the first embodiment described above, further comprising a fourth inductor trace 50A located within the body 20 between the second inductor trace 40 and the third inductor trace 50 and extending parallel to the virtual plane S1. The fourth inductor trace 50A is a low-resistance inductor trace 55. That is, the number of low-resistance inductor traces 55 in the inductor component 1 of this embodiment differs from that in the inductor component 1 of the first embodiment described above. The inductor component 1A has two low-resistance inductor traces 55 between the first inductor trace 30 and the second inductor trace 40.

[0099] The fourth inductor wiring 50A, located between the second inductor wiring 40 and the third inductor wiring 50, extends parallel to the principal surface 21a of the magnetic material layer 21, similarly to the first to third inductor wirings 30, 40, and 50. Therefore, the first to fourth inductor wirings 30, 40, 50, and 50A are located on the same virtual plane S1. Furthermore, the first to fourth inductor wirings 30, 40, 50, and 50A are aligned and arranged at equal intervals along a direction parallel to the virtual plane S1.

[0100] The fourth inductor wiring 50A is a low-resistance inductor wiring 55 having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. The fourth inductor wiring 50A includes a fourth wiring portion 51A and fourth connecting portions 52A provided at both ends of the fourth wiring portion 51A. Furthermore, since the fourth inductor wiring 50A is a low-resistance inductor wiring 55, the fourth wiring portion 51A is an example of a low-resistance wiring portion, and the fourth connecting portions 52A are an example of a low-resistance connecting portion.

[0101] The fourth wiring portion 51A is in the shape of a strip extending linearly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. The fourth wiring portion 51A extends parallel to the first wiring portion 31 and the second wiring portion 41. The fourth wiring portion 51A is formed so that the wiring width W31A and the thickness are constant. In addition, the line length and thickness of the fourth wiring portion 51A are equal to those of the first wiring portion 31 and the second wiring portion 41. The fourth wiring portion 51A of this embodiment has the same shape as the third wiring portion 51. That is, the wiring width W31A of the fourth wiring portion 51A is equal to the wiring width W31 of the third wiring portion 51. Furthermore, the line length and thickness of the fourth wiring portion 51A are equal to those of the third wiring portion 51. Moreover, the shape of the fourth wiring portion 51A observed from a direction perpendicular to the virtual plane S1 (i.e., in Figure 3 The state shown in (a) of FIG. 5 is in the same strip shape as the third wiring portion 51.

[0102] The fourth connection portion 52A is formed integrally with the fourth wiring portion 51A. In this embodiment, the shape of each fourth connection portion 52A as viewed from a direction perpendicular to the virtual plane S1 (i.e., Figure 3The state shown in (a) of FIG. 5 is a quadrilateral that is roughly a square, the same as the first to third connecting parts 32, 42, and 52. Moreover, the fourth connecting part 52A is the same size as the first to third connecting parts 32, 42, and 52, and has a thickness equal to that of the first to third connecting parts 32, 42, and 52. In addition, the wiring width W32A of the fourth connecting part 52A (the width in the same direction as the wiring width direction of the fourth wiring part 51A) is thicker than the wiring width W31A of the fourth wiring part 51A. That is, the boundary between the fourth wiring part 51A and the fourth connecting part 52A is the position where the wiring width changes. In addition, the central position of the wiring width direction of the fourth connecting part 52A in the parallel arrangement direction F1 is consistent with the central position of the wiring width direction of the fourth wiring part 51A in the parallel arrangement direction F1. That is, the fourth wiring part 51A extends from the central part of the wiring width direction of one fourth connecting part 52A to the central part of the wiring width direction of another fourth connecting part 52A.

[0103] At least a portion of the fourth inductor wiring 50A, serving as the low-resistance inductor wiring 55, has a larger cross-sectional area than the first and second inductor wirings 30 and 40. In this embodiment, at least a portion of the fourth inductor wiring 50A has a larger wiring width than the first and second inductor wirings 30 and 40, resulting in a larger cross-sectional area than the first and second inductor wirings 30 and 40. Specifically, the fourth wiring portion 51A has a wider wiring width than the first and second wiring portions 31 and 41. Consequently, the cross-sectional area (the area of ​​the cross section perpendicular to the direction of current flow) of the fourth wiring portion 51A is larger than the cross-sectional areas of the first and second wiring portions 31 and 41. As described above, because the wiring width W31A of the fourth wiring portion 51A of the fourth inductor wiring 50A is greater than the wiring widths W11 and W21 of the first wiring portion 31 and the second wiring portion 41, that is, because the cross-sectional area of ​​the fourth wiring portion 51A is greater than the cross-sectional areas of the first wiring portion 31 and the second wiring portion 41, the DC resistance is lower than that of the first inductor wiring 30 and the second inductor wiring 40. Furthermore, as long as the wiring width W31A of the fourth wiring portion 51A is greater than the wiring width W11 of the first wiring portion 31 and the wiring width W21 of the second wiring portion 41, it may be different from the wiring width W31 of the third wiring portion 51.

[0104] In the inductor component 1A, the closer the low-resistance inductor wiring 55 is to the middle position between the first inductor wiring 30 and the second inductor wiring 40, the lower the DC resistance. In this embodiment, the closer the third inductor wiring 50 and the fourth inductor wiring 50A are to the middle position between the first inductor wiring 30 and the second inductor wiring 40, the larger the cross-sectional area of ​​the low-resistance wiring portion, that is, the third and fourth wiring portions 51 and 51A. Therefore, the closer the low-resistance inductor wiring 55 is to the middle position between the first inductor wiring 30 and the second inductor wiring 40, the lower the DC resistance. Figure 3 In (a), a dashed line illustrates centerline L1, which passes through the middle of first inductor wiring 30 and second inductor wiring 40 and extends parallel to virtual plane S1. Because third inductor wiring 50 and fourth inductor wiring 50A are equidistant from centerline L1 in parallel arrangement direction F1, the width W31 and thickness of third wiring portion 51 can be made equal to the width W31A and thickness of fourth wiring portion 51A. In other words, the cross-sectional areas of third wiring portion 51 and fourth wiring portion 51A are equal.

[0105] One of the first to fourth connecting portions 32, 42, 52, 52A of the first to fourth inductor wirings 30, 40, 50, 50A (at Figure 3 (a), the upper connection portion) is positioned at the same position in the direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. Therefore, one of the first to fourth connection portions 32, 42, 52, 52A of the first to fourth inductor wirings 30, 40, 50, 50A is aligned along the parallel arrangement direction F1. In addition, the first to fourth connection portions 32, 42, 52, 52A are arranged at equal intervals along the parallel arrangement direction F1. Similarly, the other first to fourth connection portions 32, 42, 52, 52A of the first to fourth inductor wirings 30, 40, 50, 50A (at Figure 3 (a), the lower connection portion) is positioned uniformly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. Therefore, the other first to fourth connection portions 32, 42, 52, 52A of the first to fourth inductor traces 30, 40, 50, 50A are aligned along the parallel arrangement direction F1. Furthermore, these first to fourth connection portions 32, 42, 52, 52A are arranged at equal intervals along the parallel arrangement direction F1.

[0106] The distance W41 between the first wiring portion 31 and the first end face 20b is shorter than the distance W42 between the third wiring portion 51 of the third inductor wiring 50 (low-resistance inductor wiring 55) adjacent to the first inductor wiring 30 and the first wiring portion 31. Furthermore, the distance W43 between the second wiring portion 41 and the second end face 20c is shorter than the distance W44 between the fourth wiring portion 51A of the fourth inductor wiring 50A (low-resistance inductor wiring 55) adjacent to the second inductor wiring 40 and the second wiring portion 41. Furthermore, in this embodiment, the distance W42 between the first wiring portion 31 and the third wiring portion 51 and the distance W44 between the second wiring portion 41 and the fourth wiring portion 51A are equal.

[0107] Furthermore, the distance W45 between the third wiring portion 51 and the fourth wiring portion 51A is shorter than the distance W42 between the first wiring portion 31 and the third wiring portion 51, and the distance W44 between the second wiring portion 41 and the fourth wiring portion 51A. Specifically, the distance W45 between the third wiring portion 51 and the fourth wiring portion 51A is shorter than the distances W42 and W44 by half the difference between the width W31 of the third wiring portion 51 or the width W31A of the fourth wiring portion 51A and the width W11 of the first wiring portion 31 or the width W21 of the second wiring portion 41. In the main body 20, the distances W41 to W45 do not necessarily need to be in the above relationship.

[0108] A fourth vertical wiring 64 is connected to the fourth connection portion 52A of the fourth inductor wiring 50A. The fourth vertical wiring 64 is provided inside the main body 20. The fourth vertical wiring 64 extends from the fourth inductor wiring 50A to the surface of the main body 20, extending perpendicularly to the virtual plane S1, through the interior of the main body 20. Specifically, the fourth vertical wiring 64 extends from the upper surface of the fourth connection portion 52A in a direction perpendicular to the virtual plane S1 and penetrates the interior of the magnetic material layer 22 perpendicularly to the virtual plane S1. The upper end surface of the fourth vertical wiring 64 is exposed from the upper surface 20a of the main body 20 to the exterior of the main body 20. Furthermore, the fourth vertical wiring 64 is electrically connected to the fourth connection portion 52A.

[0109] The upper end surfaces of the fourth vertical wirings 64, which are exposed to the outside from the upper surface 20a of the main body 20, are each covered by a fourth external terminal 74. Furthermore, the inductor component 1A of this embodiment is a bottom-electrode-type inductor component, in which the first to fourth external terminals 71 to 74 connected to the first to fourth vertical wirings 61 to 64 are exposed only on the upper surface 20a of the main body 20 (which corresponds to the upper surface of the inductor component 1A in this embodiment).

[0110] In this embodiment, the fourth inductor wiring 50A is made of the same material as the third inductor wiring 50 , and the fourth vertical wiring 64 is made of the same material as the third vertical wiring 63 . Furthermore, the fourth external terminal 74 is made of the same material as the third external terminal 73 .

[0111] The inductor component 1A of the present embodiment is manufactured by the same method as that of the inductor component 1 of the first embodiment described above.

[0112] The operation of this embodiment will be described.

[0113] In the inductor component 1A, the inductor components consisting of the first to fourth inductor lines 30, 40, 50, and 50A were simulated to simulate changes in inductance when the line width W31 of the third line portion 51 of the third inductor line 50 and the line width W31A of the fourth line portion 51A of the fourth inductor line 50A were varied. The first to fourth inductor lines 30, 40, 50, and 50A were made of Cu, and the spacing between them in the parallel arrangement direction F1 (the spacing between the centers along the line width) was set to 300 μm. Furthermore, the thickness of the first to fourth inductor lines 30, 40, 50, and 50A was set to 50 μm. Furthermore, the line width W11 of the first line portion 31 of the first inductor line 30 and the line width W21 of the second line portion 41 of the second inductor line 40 were both 50 μm. The simulation results show that when the wiring width W31 and the wiring width W31A are each increased by 6.4% relative to the wiring width W11, the inductance of the inductor formed by the third inductor wiring 50 and the inductance of the inductor formed by the fourth inductor wiring 50A are equal to the inductance of the inductor formed by the first inductor wiring 30. Furthermore, when the wiring width W31 and the wiring width W31A are each increased by 6.4% relative to the wiring width W21, the inductance of the inductor formed by the third inductor wiring 50 and the inductance of the inductor formed by the fourth inductor wiring 50A are equal to the inductance of the inductor formed by the second inductor wiring 40.

[0114] According to this embodiment, in addition to the same effects as those of the first embodiment described above, the following effects are also achieved.

[0115] (2-1) The inductor component 1A further includes a fourth inductor line 50A located between the second inductor line 40 and the third inductor line 50 in the body 20 and extending parallel to the virtual plane S1. The fourth inductor line 50A is a low-resistance inductor line 55.

[0116] Generally, in an inductor component comprising multiple inductor wirings having the same wiring width, line length, and DC resistance, when the same current flows through each of the multiple inductor wirings aligned on the same virtual plane, the temperature of the inductor wiring closer to the center of the inductor wirings at the two ends tends to rise more. Therefore, in this embodiment, the third inductor wiring 50 and the fourth inductor wiring 50A located between the first inductor wiring 30 and the second inductor wiring 40 are configured as low-resistance inductor wirings 55 having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. Therefore, even when the same current flows through the first to fourth inductor wirings 30, 40, 50, and 50A, the third inductor wiring 50 and the fourth inductor wiring 50A, where heat is particularly likely to accumulate, are less likely to heat up than the first inductor wiring 30 and the second inductor wiring 40. Therefore, the temperature near the third inductor line 50 and the fourth inductor line 50A is suppressed from being locally high compared to the temperature near the first inductor line 30 and the second inductor line 40 .

[0117] Furthermore, an increase in the temperature difference between the first and second inductor wirings 30 and 40 and the third and fourth inductor wirings 50 and 50A is suppressed. In other words, the third and fourth inductor wirings 50 and 50A are suppressed from reaching higher temperatures than the first and second inductor wirings 30 and 40. Consequently, electromigration can be suppressed not only at the connection between the third vertical wiring 63 connected to the third inductor wiring 50 and the circuit substrate on which the inductor component 1A is mounted, but also at the connection between the fourth vertical wiring 64 connected to the fourth inductor wiring 50A and the circuit substrate on which the inductor component 1A is mounted.

[0118] Thus, in the bottom electrode type inductor component 1A having the first to fourth inductor wirings 30 , 40 , 50 , 50A arranged in alignment, it is possible to suppress a reduction in reliability due to heat.

[0119] (2-2) The first inductor wiring 30 includes a first wiring portion 31 and first connecting portions 32 provided at both ends of the first wiring portion 31 and connected to a first vertical wiring 61. The second inductor wiring 40 includes a second wiring portion 41 and second connecting portions 42 provided at both ends of the second wiring portion 41 and connected to a second vertical wiring 62. The third inductor wiring 50, serving as a low-resistance inductor wiring 55 located between the first inductor wiring 30 and the second inductor wiring 40, includes a third wiring portion 51 and third connecting portions 52 provided at both ends of the third wiring portion 51 and connected to a third vertical wiring 63. The fourth inductor wiring 50A, serving as a low-resistance inductor wiring 55 located between the first inductor wiring 30 and the second inductor wiring 40, includes a fourth wiring portion 51A and fourth connecting portions 52A provided at both ends of the fourth wiring portion 51A and connected to a fourth vertical wiring 64. Furthermore, the closer the low-resistance inductor line 55 is to the middle position between the first inductor line 30 and the second inductor line 40 , the larger the cross-sectional areas of the third and fourth wiring portions 51 and 51A.

[0120] According to this structure, by increasing the cross-sectional area of ​​the third wiring portion 51 and the fourth wiring portion 51A as the low-resistance inductor wiring 55 is positioned closer to the middle between the first inductor wiring 30 and the second inductor wiring 40, the DC resistance of the low-resistance inductor wiring 55 can be reduced as it is positioned closer to the middle between the first inductor wiring 30 and the second inductor wiring 40. Generally, in an inductor component comprising multiple inductor wirings having the same wiring width and line length and the same DC resistance, if the same current flows through each of the multiple inductor wirings aligned on the same virtual plane, the temperature of the inductor wiring closer to the middle between the two end inductor wirings will increase more easily. Therefore, this makes it easier to prevent localized high temperatures near the middle between the first inductor wiring 30 and the second inductor wiring 40. As a result, it is easier to prevent reliability degradation caused by heat.

[0121] <Change Example>

[0122] The above embodiment can be modified and implemented as follows. The above embodiment and the following modifications can be combined and implemented within the scope of technical non-inconsistency. In addition, in each modification, components identical to or corresponding to the above embodiment may be marked with the same reference numerals and their descriptions may be partially or entirely omitted.

[0123] In the second embodiment described above, in the third inductor line 50 serving as the low-resistance inductor line 55, the center position of the third wiring portion 51 in the wiring width direction along the parallel arrangement direction F1 coincides with the center position of the third connecting portion 52 in the wiring width direction along the parallel arrangement direction F1. Furthermore, in the fourth inductor line 50A serving as the low-resistance inductor line 55, the center position of the fourth wiring portion 51A in the wiring width direction along the parallel arrangement direction F1 coincides with the center position of the fourth connecting portion 52A in the wiring width direction along the parallel arrangement direction F1. However, in the third inductor line 50, the center position of the third wiring portion 51 in the wiring width direction along the parallel arrangement direction F1 does not necessarily need to coincide with the center position of the third connecting portion 52 in the wiring width direction along the parallel arrangement direction F1. Similarly, in the fourth inductor wiring 50A, the center position of the fourth wiring portion 51A in the wiring width direction in the parallel arrangement direction F1 does not necessarily need to coincide with the center position of the fourth connecting portion 52A in the wiring width direction in the parallel arrangement direction F1.

[0124] For example, Figure 4 (a) and Figure 4 The inductor component 1B shown in (b) is the inductor component 1A of the second embodiment described above, except that a third inductor wiring 50C is provided in place of the third inductor wiring 50, and a fourth inductor wiring 50D is provided in place of the fourth inductor wiring 50A. The third inductor wiring 50C and the fourth inductor wiring 50D are located on the same virtual plane S1 as the first inductor wiring 30 and the second inductor wiring 40. The first to fourth inductor wirings 30, 40, 50C, and 50D are aligned and arranged at equal intervals along a direction parallel to the virtual plane S1. Furthermore, the third inductor wiring 50C is located between the first inductor wiring 30 and the second inductor wiring 40, and the fourth inductor wiring 50D is located between the second inductor wiring 40 and the third inductor wiring 50C. The first wiring portion 31 and the second wiring portion 41 have the same wiring width.

[0125] The third inductor wiring 50C and the fourth inductor wiring 50D are both low-resistance inductor wiring 55A having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. The thickness of the third inductor wiring 50C and the fourth inductor wiring 50D (thickness in a direction perpendicular to the virtual plane S1) is equal to the thickness of the first inductor wiring 30 and the second inductor wiring 40. The third inductor wiring 50C includes a third wiring portion 53 and third connecting portions 52 provided at both ends of the third wiring portion 53. The fourth inductor wiring 50D includes a fourth wiring portion 53D and fourth connecting portions 52A provided at both ends of the fourth wiring portion 53D. The third wiring portion 53 and the fourth wiring portion 53D each correspond to an example of a low-resistance wiring portion, and the third connecting portion 52 and the fourth connecting portion 52A each correspond to an example of a low-resistance connecting portion. The first to fourth connecting portions 32, 42, 52, 52A located on one end side of the first to fourth wiring portions 31, 41, 53, 53D are arranged at equal intervals in the parallel arrangement direction F1. Furthermore, the first to fourth connecting portions 32, 42, 52, 52A located on the other end side of the first to fourth wiring portions 31, 41, 53, 53D are arranged at equal intervals in the parallel arrangement direction F1.

[0126] The third wiring portion 53 includes a base portion 53a having a wiring width equal to that of the first wiring portion 31 and the second wiring portion 41, and an extension portion 53b provided integrally with the base portion 53a on one side of the base portion 53a in the wiring width direction. Figure 4 In (a), the extended portion 53b is the portion of the third wiring portion 53 within the dashed line shown. Furthermore, the wiring width of the third wiring portion 53 is constant, and the widths of the base portion 53a and the extended portion 53b are also constant. In the third inductor wiring 50C, the center position of the base portion 53a in the wiring width direction in the alignment direction F1 coincides with the center position of the third connecting portion 52 in the wiring width direction in the alignment direction F1.

[0127] The fourth wiring portion 53D includes a base portion 53c having a wiring width equal to that of the first wiring portion 31 and the second wiring portion 41, and an extension portion 53d integrally provided with the base portion 53c on one side in the wiring width direction of the base portion 53c. Figure 4In (a), the extended portion 53d is the portion of the fourth wiring portion 53D within the dashed line shown. Furthermore, the wiring width of the fourth wiring portion 53D is constant, and the widths of the base portion 53c and the extended portion 53d are also constant. In the fourth inductor wiring 50D, the center position of the base portion 53c in the wiring width direction in the parallel arrangement direction F1 coincides with the center position of the fourth connecting portion 52A in the wiring width direction in the parallel arrangement direction F1. Furthermore, the first wiring portion 31, the second wiring portion 41, and the base portions 53a and 53c are positioned at equal intervals in the parallel arrangement direction F1.

[0128] In the third inductor wiring 50C, the extension portion 53b is located on one side of the base portion 53a in the wiring width direction, away from the center line L1 passing through the center of the first inductor wiring 30 and the second inductor wiring 40 and parallel to the virtual plane S1. Figure 4 In (a), centerline L1 is located to the right of third inductor wiring 50C. Furthermore, in third inductor wiring 50C, extension portion 53b is located to the left of base portion 53a, that is, on the side of first inductor wiring 30 adjacent to third inductor wiring 50C. Therefore, third wiring portion 53 of third inductor wiring 50C is located closer to first wiring portion 31 than third connection portion 52 in parallel arrangement direction F1. In other words, the center of third wiring portion 53 in the wiring width direction is located closer to first wiring portion 31 than the center of third connection portion 52 in the wiring width direction in parallel arrangement direction F1.

[0129] In the fourth inductor wiring 50D, the extension portion 53d is located on the side farther from the center line L1 than the base portion 53c in the wiring width direction. Figure 4 In (a), the center line L1 is located to the left of the fourth inductor trace 50D. Furthermore, in the fourth inductor trace 50D, the extension portion 53d is located to the right of the base portion 53c, that is, on the side of the second inductor trace 40 adjacent to the fourth inductor trace 50D. Therefore, the fourth trace portion 53D of the fourth inductor trace 50D is located closer to the second trace portion 41 than the fourth connection portion 52A in the parallel arrangement direction F1. In other words, the center of the fourth trace portion 53D in the trace width direction is located closer to the second trace portion 41 than the center of the fourth connection portion 52A in the trace width direction in the parallel arrangement direction F1.

[0130] The distance W46 between the first wiring portion 31 and the third wiring portion 53 is shorter than the distance W47 between the third wiring portion 53 and the fourth wiring portion 53D by the width of the extension portion 53b. Furthermore, the distance W48 between the second wiring portion 41 and the fourth wiring portion 53D is shorter than the distance W47 between the third wiring portion 53 and the fourth wiring portion 53D by the width of the extension portion 53d. Furthermore, the distance W46 between the first wiring portion 31 and the third wiring portion 53 is equal to the distance W48 between the second wiring portion 41 and the fourth wiring portion 53D.

[0131] With this configuration, the third wiring portion 53 of the third inductor wiring 50C is positioned closer to the first wiring portion 31 than the third connecting portion 52. This reduces the width of the portion of the main body 20 between the first wiring portion 31 and the third wiring portion 53 in the parallel arrangement direction F1. Specifically, the wiring width of the third wiring portion 53 is increased to narrow the magnetic path between the third wiring portion 53 of the third inductor wiring 50C adjacent to the first inductor wiring 30 and the first wiring portion 31. Consequently, the inductance of the inductor formed by the first inductor wiring 30 is suppressed.

[0132] Similarly, by positioning the fourth wiring portion 53D of the fourth inductor wiring 50D closer to the second wiring portion 41 than the fourth connecting portion 52A, the width of the portion between the second wiring portion 41 and the fourth wiring portion 53D in the main body 20 in the parallel arrangement direction F1 is narrowed. Specifically, the wiring width of the fourth wiring portion 53D is increased to narrow the magnetic path between the fourth wiring portion 53D of the fourth inductor wiring 50D adjacent to the second inductor wiring 40 and the second wiring portion 41. Consequently, the inductance of the inductor formed by the second inductor wiring 40 is suppressed.

[0133] Generally, when two inductor traces are arranged between the first inductor trace 30 and the second inductor trace 40, heat is more likely to accumulate near the center of the first inductor trace 30 and the second inductor trace 40 than when a single inductor trace is arranged between the first inductor trace 30 and the second inductor trace 40. Therefore, even when the same current flows through each inductor trace, the portion of the inductor component near the center of the first inductor trace 30 and the second inductor trace 40 is more likely to generate heat.

[0134] Therefore, in the inductor component 1B, the third wiring portion 53 of the third inductor wiring 50C and the fourth wiring portion 53D of the fourth inductor wiring 50D, which are arranged between the first inductor wiring 30 and the second inductor wiring 40, are made wider than the wiring widths of the first wiring portion 31 and the second wiring portion 41. This reduces heat generation in the third inductor wiring 50C and the fourth inductor wiring 50D, even when the same current flows through the first to fourth inductor wirings 30, 40, 50C, and 50D. When making the wiring widths of the third and fourth wiring portions 53 and 53D wider than the wiring widths of the first and second wiring portions 31 and 41, for example, it is conceivable to simply provide extensions equally spaced on both sides of the base portions 53a and 53c in the wiring width direction to increase the wiring widths of the third and fourth wiring portions 53 and 53D. In this way, the inductor formed by each of the first and second inductor traces 30 and 40 has a lower inductance than the inductor formed by each of the third and fourth inductor traces 50C and 50D. In contrast, in the inductor component 1B, the wiring widths of the third and fourth wiring portions 53 and 53D are increased in a direction extending from the middle between the first and second wiring portions 31 and 41 along the parallel arrangement direction F1 toward the outside of the inductor component 1B. This prevents a decrease in the inductance of each of the third and fourth inductor traces 50C and 50D, while reducing the inductance of each of the first and second inductor traces 30 and 40. Therefore, the inductor component 1B as a whole can be adjusted in a direction that aligns the inductances of the inductors formed by each of the first to fourth inductor traces 30, 40, 50C, and 50D.

[0135] Furthermore, the third wiring portion 53 of the third inductor wiring 50C does not necessarily need to be located closer to the first wiring portion 31 than the third connecting portion 52 .

[0136] In addition, for example, Figure 5 (a) and Figure 5The inductor component 1C shown in (b) is the inductor component 1A of the second embodiment described above, but includes a third inductor wiring 50E in place of the third inductor wiring 50, and a fourth inductor wiring 50F in place of the fourth inductor wiring 50A. The third inductor wiring 50E and the fourth inductor wiring 50F are located on the same virtual plane S1 as the first inductor wiring 30 and the second inductor wiring 40. The first to fourth inductor wirings 30, 40, 50E, and 50F are aligned and arranged at equal intervals along a direction parallel to the virtual plane S1. Furthermore, the third inductor wiring 50E is located between the first inductor wiring 30 and the second inductor wiring 40, and the fourth inductor wiring 50F is located between the second inductor wiring 40 and the third inductor wiring 50E. The first wiring portion 31 and the second wiring portion 41 have the same wiring width.

[0137] The third inductor wiring 50E and the fourth inductor wiring 50F are both low-resistance inductor wirings 55B having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. The thickness of the third inductor wiring 50E and the fourth inductor wiring 50F (thickness in a direction perpendicular to the virtual plane S1) is equal to the thickness of the first inductor wiring 30 and the second inductor wiring 40. The third inductor wiring 50E includes a third wiring portion 54 and third connecting portions 52 provided at both ends of the third wiring portion 54. The fourth inductor wiring 50F includes a fourth wiring portion 54F and fourth connecting portions 52A provided at both ends of the fourth wiring portion 54F. The third wiring portion 54 and the fourth wiring portion 54F each correspond to an example of a low-resistance wiring portion, and the third connecting portion 52 and the fourth connecting portion 52A each correspond to an example of a low-resistance connecting portion.

[0138] The first to fourth connecting portions 32, 42, 52, 52A located on one end side of the first to fourth wiring portions 31, 41, 54, 54F are arranged at equal intervals in the parallel arrangement direction F1. Furthermore, the first to fourth connecting portions 32, 42, 52, 52A located on the other end side of the first to fourth wiring portions 31, 41, 54, 54F are arranged at equal intervals in the parallel arrangement direction F1.

[0139] The third wiring portion 54 includes a base portion 54a having a wiring width equal to that of the first wiring portion 31 and the second wiring portion 41, and an extension portion 54b provided integrally with the base portion 54a on one side of the base portion 54a in the wiring width direction. Figure 5In (a), the extended portion 54b is the portion of the third wiring portion 54 within the dashed line shown. Furthermore, the wiring width of the third wiring portion 54 is constant, and the widths of the base portion 54a and the extended portion 54b are also constant. In the third inductor wiring 50E, the center position of the base portion 54a in the wiring width direction in the alignment direction F1 coincides with the center position of the third connecting portion 52 in the wiring width direction in the alignment direction F1.

[0140] The fourth wiring portion 54F includes a base portion 54c having a wiring width equal to that of the first wiring portion 31 and the second wiring portion 41, and an extension portion 54d provided integrally with the base portion 54c on one side of the base portion 54c in the wiring width direction. Figure 5 In (a), the extended portion 54d is the portion of the fourth wiring portion 54F within the dashed line shown. Furthermore, the wiring width of the fourth wiring portion 54F is constant, and the widths of the base portion 54c and the extended portion 54d are also constant. In the fourth inductor wiring 50F, the center position of the base portion 54c in the wiring width direction in the parallel arrangement direction F1 coincides with the center position of the fourth connecting portion 52A in the wiring width direction in the parallel arrangement direction F1. Furthermore, the first wiring portion 31, the second wiring portion 41, and the base portions 54a and 54c are positioned at equal intervals in the parallel arrangement direction F1.

[0141] In the third inductor wiring 50E, the extension portion 54b is located on one side of the base portion 54a in the wiring width direction, closer to the center line L1 between the first inductor wiring 30 and the second inductor wiring 40. Specifically, Figure 5 In (a), centerline L1 is located to the right of third inductor trace 50E. Furthermore, in third inductor trace 50E, extension portion 54b is located to the right of base portion 54a, that is, closer to centerline L1 and farther from first inductor trace 30 adjacent to third inductor trace 50E. Consequently, third trace portion 54 of third inductor trace 50E is located closer to the center of first trace portion 31 and second trace portion 41 in parallel arrangement direction F1 than third connection portion 52. Specifically, the center of third trace portion 54 in the widthwise direction is located closer to the center of first trace portion 31 and second trace portion 41 in parallel arrangement direction F1 than the center of third connection portion 52 in the widthwise direction.

[0142] In the fourth inductor wiring 50F, the extension portion 54d is located on one side closer to the center line L1 of both sides of the base portion 54c in the wiring width direction. Figure 5In (a), the centerline L1 is located to the left of the fourth inductor trace 50F. Furthermore, in the fourth inductor trace 50F, the extended portion 54d is located to the left of the base portion 54c, that is, closer to the centerline L1 and farther from the second inductor trace 40 adjacent to the fourth inductor trace 50F. Consequently, the fourth wiring portion 54F of the fourth inductor trace 50F is located closer to the center between the first wiring portion 31 and the second wiring portion 41 in the parallel arrangement direction F1 than the fourth connecting portion 52A. In other words, the center of the fourth wiring portion 54F in the wiring width direction is located closer to the center between the first wiring portion 31 and the second wiring portion 41 in the parallel arrangement direction F1 than the center of the fourth connecting portion 52A in the wiring width direction.

[0143] The distance W51 between the third wiring portion 54 and the fourth wiring portion 54F is shorter than the distance W52 between the first wiring portion 31 and the third wiring portion 54 by the width of the extension 54b and the width of the extension 54d. In other words, the distance W52 between the first wiring portion 31 and the third wiring portion 54 is longer than the distance W51 between the third wiring portion 54 and the fourth wiring portion 54F by the width of the extension 54b and the width of the extension 54d. Furthermore, the distance W52 between the first wiring portion 31 and the third wiring portion 54 is equal to the distance W53 between the second wiring portion 41 and the fourth wiring portion 54F.

[0144] According to the above configuration, the third inductor trace 50E adjacent to the first inductor trace 30 has a wider trace width, thereby relatively increasing the distance W52 between the first trace portion 31 and the third trace portion 54. Specifically, the width of the third trace portion 54 is increased, thereby relatively widening the magnetic path between the third trace portion 54 of the third inductor trace 50E adjacent to the first inductor trace 30 and the first trace portion 31. Consequently, the inductance of the inductor formed by the first inductor trace 30 is relatively increased.

[0145] Similarly, the fourth inductor trace 50F adjacent to the second inductor trace 40 has its trace width increased to relatively widen the distance W53 between the second trace portion 41 and the fourth trace portion 54F. Specifically, the width of the fourth trace portion 54F is increased to relatively widen the magnetic path between the fourth trace portion 54F of the fourth inductor trace 50F adjacent to the second inductor trace 40 and the second trace portion 41. Consequently, the inductance of the inductor formed by the second inductor trace 40 is relatively increased.

[0146] By making the wiring widths of the third and fourth wiring portions 54 and 54F wider than those of the first and second wiring portions 31 and 41, the DC resistance of the third and fourth inductor wirings 50E and 50F is reduced compared to the DC resistance of the first and second inductor wirings 30 and 40. In this case, the inductor formed by the first and second inductor wirings 30 and 40, located at both ends of the parallel arrangement direction F1, may have a lower inductance than the inductor formed by the third and fourth inductor wirings 50E and 50F, located between the first and second inductor wirings 30 and 40. In this case, as described above, variations in the inductance of each inductor can be suppressed. That is, the inductor component 1C as a whole can be adjusted in a direction that aligns the inductances of the inductors formed by the first to fourth inductor wirings 30, 40, 50E, and 50F.

[0147] In the first embodiment described above, the third inductor wiring 50 is a low-resistance inductor wiring 55 having a DC resistance lower than that of the first inductor wiring 30 and the second inductor wiring 40 because the wiring width W31 of the third wiring portion 51 is greater than the wiring width W11 of the first wiring portion 31 and the wiring width W21 of the second wiring portion 41. However, the method for making the DC resistance of the third inductor wiring 50 lower than that of the first inductor wiring 30 and the second inductor wiring 40 is not limited to this.

[0148] For example, the DC resistance of the third inductor wiring 50 can be made lower than the DC resistance of the first inductor wiring 30 and the second inductor wiring 40 by making the wiring width of a portion of the third wiring portion 51 wider than that of the first wiring portion 31 and the second wiring portion 41. In this case, the wiring width of the portion of the third wiring portion 51 that is wider than that of the first wiring portion 31 and the second wiring portion 41 is within a range not greater than the wiring width W32 of the third connecting portion 52.

[0149] exist Figure 6 In the inductor component 1D shown, the third wiring portion 56 of the third inductor wiring 50G, which is the low-resistance inductor wiring 55C, has a widened portion 56a in the center portion in the longitudinal direction where the wiring width is partially increased. Figure 6 In the example shown, the wiring width of the portion other than the wide portion 56a in the third wiring portion 56 is equal to the wiring widths W11 and W12 of the first wiring portion 31 and the second wiring portion 41, but can be thinner than the wiring width W32 of the third connecting portion 52, or thicker than the wiring widths W11 and W12 of the first wiring portion 31 and the second wiring portion 41.

[0150] This can suppress heat generation in the longitudinal center portion of the third inductor wiring 50G, where heat is particularly likely to accumulate, and can also suppress a reduction in reliability due to heat.

[0151] In addition, Figure 7 In the inductor component 1E shown, the third wiring portion 57 of the third inductor wiring 50H, which is the low-resistance inductor wiring 55D, has widened portions 57a at both ends where the wiring width is increased. The widened portions 57a are adjacent to the third connecting portion 52 and are continuous with the third connecting portion 52. Figure 7 In the example shown, the wiring width of the portion other than the wide portion 57a ​​in the third wiring portion 57 is equal to the wiring widths W11 and W12 of the first wiring portion 31 and the second wiring portion 41, but can be thinner than the wiring width W32 of the third connecting portion 52, or thicker than the wiring widths W11 and W12 of the first wiring portion 31 and the second wiring portion 41.

[0152] This can suppress heat generation near the third connection portion 52. Consequently, it is possible to suppress temperature increases at the connection portion between the third vertical wiring 63 connected to the third connection portion 52 and the circuit board on which the inductor component 1E is mounted. Consequently, it is easier to suppress electromigration at the connection portion between the third vertical wiring 63 and the circuit board on which the inductor component 1E is mounted. Furthermore, it is possible to suppress reliability degradation caused by heat.

[0153] Furthermore, for example, the wiring width W32 of the third connection portion 52 may be larger than the wiring widths W12 and W22 of the first connection portion 32 and the second connection portion 42 .

[0154] In addition, for example, by making the thickness of at least a portion of the third inductor wiring 50 (the thickness in the direction perpendicular to the virtual plane S1) thicker than the thickness of the first inductor wiring 30 and the second inductor wiring 40, the third inductor wiring 50 can be made into a low-resistance inductor wiring 55 having a DC resistance smaller than that of the first inductor wiring 30 and the second inductor wiring 40.

[0155] Figure 8 (a) and Figure 8 The inductor component 1F shown in (b) includes a third inductor wiring 50I in place of the third inductor wiring 50 in the inductor component 1 of the first embodiment. The third inductor wiring 50I is located on the same virtual plane S1 as the first inductor wiring 30 and the second inductor wiring 40. The first to third inductor wirings 30, 40, and 50I are aligned and arranged at equal intervals in a direction parallel to the virtual plane S1.

[0156] The third inductor wiring 50I is a low-resistance inductor wiring 55E having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. Furthermore, at least a portion of the third inductor wiring 50I is thicker than the first inductor wiring 30 and the second inductor wiring 40 in a direction perpendicular to the virtual plane S1. In this example, the third inductor wiring 50I is formed to have a constant thickness T3, which is thicker than the thickness T1 of the first inductor wiring 30 and the thickness T2 of the second inductor wiring 40. Furthermore, the thickness T1 of the first inductor wiring 30 is equal to the thickness T2 of the second inductor wiring 40. Furthermore, the wiring width W33 and line length of the third wiring portion 58 of the third inductor wiring 50I are equal to the wiring width W11 and line length of the first wiring portion 31, and the wiring width W21 and line length of the second wiring portion 41.

[0157] Even in this case, similar to the first embodiment, it is possible to suppress a decrease in reliability due to heat. Furthermore, by making at least a portion of the third inductor wiring 50I thicker than the first inductor wiring 30 and the second inductor wiring 40, the DC resistance of the third inductor wiring 50I can be easily reduced compared to the DC resistance of the first inductor wiring 30 and the second inductor wiring 40.

[0158] Alternatively, for example, by making the line length of the third inductor wiring 50 shorter than the line lengths of the first inductor wiring 30 and the second inductor wiring 40 , the third inductor wiring 50 can be made into a low-resistance inductor wiring 55 having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40 .

[0159] exist Figure 9 In the inductor component 1G shown, the first wiring portion 33 and the second wiring portion 43 of the first inductor wiring 30A and the second inductor wiring 40A, located at both ends of the parallel arrangement direction F1, are arc-shaped and curved toward the outside of the inductor component 1G. Meanwhile, the third wiring portion 59 of the third inductor wiring 50J, located between the first inductor wiring 30A and the second inductor wiring 40A, extends linearly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. Therefore, the line length of the third inductor wiring 50J is shorter than the line lengths of the first inductor wiring 30A and the second inductor wiring 40A. Furthermore, in Figure 9 In the example shown, the first to third wiring portions 33, 43, and 59 have the same wiring width. With this configuration, the third inductor wiring 50J becomes a low-resistance inductor wiring 55F having a lower DC resistance than the first inductor wiring 30A and the second inductor wiring 40A.

[0160] This makes it easy to make the DC resistance of the third inductor wiring 50J lower than the DC resistance of the first inductor wiring 30A and the second inductor wiring 40A, and also suppresses degradation of reliability due to heat.

[0161] In addition, the shapes of the first wiring portion 33 and the second wiring portion 43 are not limited to Figure 9 The shape shown may be an arc shape, a rectangular shape, a wave shape, or the like that curves toward the inside of the inductor component 1G.

[0162] In addition, Figure 10 In the inductor component 1H shown in FIG, the third connection portion 52 of the third inductor wiring 50K as the low-resistance inductor wiring 55G is located in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1 (in the direction of the virtual plane S1). Figure 10 In the vertical direction (in the vertical direction), it is located inward of the first connecting portion 32 and the second connecting portion 42. This allows the line length of the third inductor wiring 50K to be easily shortened compared to the line lengths of the first inductor wiring 30 and the second inductor wiring 40, even if the shapes of the first to third wiring portions 31, 41, and 81 are complex. Furthermore, the DC resistance of the third inductor wiring 50K can be easily reduced compared to the DC resistances of the first inductor wiring 30 and the second inductor wiring 40. As a result, reliability degradation due to heat can be suppressed.

[0163] Alternatively, for example, the third wiring portion 51 may be composed of a plurality of parallel wirings electrically connected in parallel between the third connecting portions 52. The plurality of parallel wirings is configured so that the DC resistance of the third inductor wiring 50 including these plurality of parallel wirings is lower than the DC resistances of the first inductor wiring 30 and the second inductor wiring 40. By configuring the third wiring portion 51 with a plurality of parallel wirings in this manner, the DC resistance of the third inductor wiring 50 can be easily reduced compared to the DC resistances of the first inductor wiring 30 and the second inductor wiring 40. Furthermore, a decrease in reliability due to heat can be suppressed.

[0164] exist Figure 11 In the inductor component 1K shown, the third wiring portion 83 of the third inductor wiring 50L, which is the low-resistance inductor wiring 55H, is composed of two parallel wirings 83a and 83b electrically connected in parallel between the third connecting portion 52. One of the two parallel wirings 83a and 83b, parallel wiring 83a, is a main wiring 91 extending on a virtual plane S1, and the remaining parallel wiring 83b is a sub-wiring 92 along the main wiring 91. In the inductor component 1K, the sub-wiring 92 and the main wiring 91 are located on the same virtual plane S1. Figure 11In the example shown, the wiring width of the main wiring 91 and the wiring width of the sub-wiring 92 are equal to the wiring width of the first wiring portion 31 and the second wiring portion 41, but they do not necessarily need to be equal. In addition, the wiring width of the main wiring 91 and the wiring width of the sub-wiring 92 can be different. In addition, the line length of the sub-wiring 92 can be longer than the main wiring 91, or shorter than the main wiring 91. For example, the sub-wiring 92 can be shorter than the main wiring 91 and provided along the central portion of the long side direction of the main wiring 91. In addition, Figure 11 In the embodiment, both ends of the sub-wiring 92 are connected to the main wiring 91, but may also be connected to the third connection portion 52. Furthermore, since the third inductor wiring 50L is the low-resistance inductor wiring 55H, the third wiring portion 83 corresponds to an example of a low-resistance wiring portion, and the third connection portions 52 provided at both ends of the third wiring portion 83 correspond to an example of a low-resistance connection portion.

[0165] This makes it easy to make the DC resistance of the third inductor wiring 50L lower than the DC resistance of the first inductor wiring 30 and the second inductor wiring 40. Furthermore, it is possible to suppress a reduction in reliability due to heat.

[0166] In addition, Figure 12 (a) Figure 12 (b) and Figure 12 In the inductor component 1L shown in (c), the third wiring portion 101 of the third inductor wiring 50M, which serves as the low-resistance inductor wiring 55I, is composed of two parallel wirings 101a and 101b electrically connected in parallel across the third connecting portion 52. One of the two parallel wirings 101a and 101b, 101a, is a main wiring 111 extending on a virtual plane S1, while the remaining parallel wiring 101b is a sub-wiring 112 extending parallel to the virtual plane S1 on a plane S2 different from the virtual plane S1. Furthermore, in the inductor component 1L of this example, plane S2 is the main surface of the magnetic material layer having the lower surface 20d among the three magnetic material layers constituting the body 20, and is a plane parallel to the virtual plane S1. The sub-wiring 112 is located so as to overlap with the main wiring 111 in a direction perpendicular to the virtual plane S1. In the inductor component 1L, the sub-wiring 112 is located on the lower surface 20d side (opposite to the mounting surface) of the inductor component 1L relative to the main wiring 111. However, it may be configured to be located on the upper surface 20a side (mounting surface side) of the inductor component 1L relative to the main wiring 111. Both ends of the sub-wiring 112 are connected to both ends of the main wiring 111 via the via wiring 113. Figure 12In the present invention, the wiring width of the main wiring 111 and the wiring width of the sub-wiring 112 are equal to the wiring widths of the first wiring portion 31 and the second wiring portion 41, but they do not necessarily need to be equal. Alternatively, the wiring width of the main wiring 111 and the wiring width of the sub-wiring 112 can be different. Furthermore, the line length of the sub-wiring 112 can be longer or shorter than that of the main wiring 111. For example, the sub-wiring 112 can be shorter than the main wiring 111 and arranged along the center of the longitudinal direction of the main wiring 111. Furthermore, in the inductor component 1L, both ends of the sub-wiring 112 are connected to the main wiring 111, but they can also be connected to the third connecting portion 52. Furthermore, since the third inductor wiring 50M is a low-resistance inductor wiring 55I, the third wiring portion 101 is an example of a low-resistance wiring portion, and the third connecting portions 52 provided at both ends of the third wiring portion 101 are an example of a low-resistance connecting portion.

[0167] This makes it possible to easily make the DC resistance of the third inductor wiring 50M lower than the DC resistance of the first inductor wiring 30 and the second inductor wiring 40. Furthermore, it is possible to suppress a reduction in reliability due to heat.

[0168] The above-described modification example can also be similarly implemented in the fourth inductor line 50A of the second embodiment. In other words, the above-described modification example can also be implemented in any low-resistance inductor line located between the first inductor line 30 and the second inductor line 40 .

[0169] In the second embodiment, the inductor component 1A includes two inductor lines: the third inductor line 50 and the fourth inductor line 50A, between the first inductor line 30 and the second inductor line 40. However, the inductor component 1A may further include a fifth inductor line between the first inductor line 30 and the third inductor line 50.

[0170] For example, Figure 13 (a) and Figure 13The inductor component 1M shown in (b) has a third inductor wiring 121 extending parallel to a virtual plane S1 extending along the first inductor wiring 30 and the second inductor wiring 40. Furthermore, the inductor component 1M has two fourth inductor wirings 122A and 122B extending parallel to the virtual plane S1 between the second inductor wiring 40 and the third inductor wiring 121. Furthermore, the inductor component 1M has two fifth inductor wirings 123A and 123B extending parallel to the virtual plane S1 between the first inductor wiring 30 and the third inductor wiring 121. The third inductor wiring 121, the fourth inductor wirings 122A and 122B, and the fifth inductor wirings 123A and 123B are low-resistance inductor wirings 55J having a lower DC resistance than the first inductor wiring 30 and the second inductor wiring 40. Furthermore, the DC resistance of the third inductor wiring 121 is smaller than that of the fourth inductor wirings 122A and 122B and the fifth inductor wirings 123A and 123B.

[0171] In this example, third inductor wiring 121, fourth inductor wiring 122A, 122B, and fifth inductor wiring 123A, 123B are located on virtual plane S1. Furthermore, fifth inductor wiring 123B, fifth inductor wiring 123A, third inductor wiring 121, fourth inductor wiring 122A, and fourth inductor wiring 122B are arranged at equal intervals in this order, starting from the first inductor wiring 30.

[0172] The third inductor wiring 121 includes a third wiring portion 121a and third connecting portions 52 provided at both ends of the third wiring portion 121a. The fourth inductor wiring 122A, located between the second inductor wiring 40 and the third inductor wiring 121, includes a fourth wiring portion 122a and fourth connecting portions 52A provided at both ends of the fourth wiring portion 122a. The fifth inductor wiring 123A, located between the first inductor wiring 30 and the third inductor wiring 121, includes a fifth wiring portion 123a and fifth connecting portions 52B provided at both ends of the fifth wiring portion 123a. The fourth inductor wiring 122B, located between the second inductor wiring 40 and the fourth inductor wiring 122A, includes a fourth wiring portion 122b and fourth connecting portions 52A provided at both ends of the fourth wiring portion 122b. The fifth inductor wiring 123B, located between the first inductor wiring 30 and the fifth inductor wiring 123A, includes a fifth wiring portion 123b and fifth connecting portions 52B provided at both ends of the fifth wiring portion 123b. Furthermore, since the third to fifth inductor wirings 121, 122A, 122B, 123A, and 123B are all low-resistance inductor wirings 55J, the third wiring portion 121a, the fourth wiring portions 122a and 122b, and the fifth wiring portions 123a and 123b each correspond to an example of a low-resistance wiring portion. Furthermore, the third to fifth connecting portions 52, 52A, and 52B each correspond to an example of a low-resistance connecting portion.

[0173] The fifth wiring portions 123a and 123b are strip-shaped, extending linearly in a direction perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. The fifth wiring portions 123a and 123b extend parallel to the first wiring portion 31 and the second wiring portion 41. The fifth wiring portions 123a and 123b are formed to have constant wiring widths W1 and W2, and constant thickness. Furthermore, the line lengths of the fifth wiring portions 123a and 123b are equal to those of the first wiring portion 31 and the second wiring portion 41.

[0174] The fifth connection portion 52B has the same shape as the third connection portion 52 and the fourth connection portion 52A. However, the fifth connection portion 52B may have a different shape from the third connection portion 52 and the fourth connection portion 52A.

[0175] A fifth vertical wiring 65 is connected to each fifth connecting portion 52B. The fifth vertical wiring 65 is provided inside the main body 20. The fifth vertical wiring 65 extends from each of the fifth inductor wirings 123A and 123B to the surface of the main body 20, extending perpendicularly to the virtual plane S1. Specifically, the fifth vertical wiring 65 extends from the upper surface of the fifth connecting portion 52B in a direction perpendicular to the virtual plane S1 and penetrates the interior of the magnetic material layer 22 perpendicularly to the virtual plane S1. Furthermore, the upper end surface of the fifth vertical wiring 65 is exposed from the upper surface 20a of the main body 20 to the outside of the main body 20. Furthermore, the fifth vertical wiring 65 is electrically connected to the fifth connecting portion 52B. The upper end surfaces of the fifth vertical wiring 65 exposed from the upper surface 20a of the main body 20 are each covered by a fifth external terminal 75. The fifth vertical wiring 65 is formed, for example, from the same material as the first to fourth vertical wirings 61 to 64. In addition, the fifth external terminal 75 is formed of, for example, the same material as that of the first to fourth external terminals 71 to 74 .

[0176] In the inductor component 1M, the DC resistance of the low-resistance inductor wiring 55J decreases as it approaches the middle position between the first inductor wiring 30 and the second inductor wiring 40. Figure 13 In (a), a dashed line illustrates a center line L1, which passes through the middle of the first inductor wiring 30 and the second inductor wiring 40 and extends perpendicular to the parallel arrangement direction F1 and parallel to the virtual plane S1. In this example, the third inductor wiring 121, which is closest to the center line L1, that is, closest to the middle of the first inductor wiring 30 and the second inductor wiring 40, is located on the center line L1. Furthermore, the DC resistance of the third inductor wiring 121 is the smallest among the five low-resistance inductor wirings 55J. The fourth inductor wiring 122A and the fifth inductor wiring 123A, which are second closest to the center line L1, are located on either side of the third inductor wiring 121. The DC resistance of the fourth inductor wiring 122A and the fifth inductor wiring 123A is the second smallest among the five low-resistance inductor wirings 55J. Furthermore, the remaining fourth inductor wiring 122B and fifth inductor wiring 123B are the third closest to the center line L1 and have the third smallest DC resistance among the five low-resistance inductor wirings 55J. Figure 13In the example shown, the thickness of the third to fifth inductor wiring lines 121, 122A, 122B, 123A, and 123B is constant. By varying the wiring widths of the third wiring portion 121a, the fourth wiring portion 122a, 122b, and the fifth wiring portion 123a, 123b, the cross-sectional areas of the third wiring portion 121a, the fourth wiring portion 122a, 122b, and the fifth wiring portion 123a, 123b are varied, thereby varying the DC resistance. Specifically, the wiring width W3 of the third wiring portion 121a of the third inductor wiring line 121, which is closest to the center line L1, is the largest. The wiring widths W4 and W2 of the fourth wiring portion 122a and the fifth wiring portion 123a of the fourth inductor wiring line 122A and the fifth inductor wiring line 123A, which are second closest to the center line L1, are the largest. Furthermore, the wiring widths W5 and W1 of the fourth wiring portion 122b and the fifth wiring portion 123b of the fourth inductor wiring 122B and the fifth inductor wiring 123B, which are located third closest to the center line L1, are made thicker. The wiring widths W5 and W1 of the fourth wiring portion 122b and the fifth wiring portion 123b are thicker than the wiring widths W11 and W21 of the first wiring portion 31 and the second wiring portion 41. As a result, the closer the low-resistance inductor wiring 55J is to the middle between the first inductor wiring 30 and the second inductor wiring 40, the larger the cross-sectional area of ​​the third to fifth wiring portions 121a, 122a, 122b, 123a, and 123b.

[0177] Furthermore, the method of increasing the cross-sectional area of ​​the third to fifth wiring portions 121a, 122a, 122b, 123a, and 123b as the low-resistance inductor wiring 55J approaches the middle position between the first inductor wiring 30 and the second inductor wiring 40 is not limited to this. For example, the wiring widths W1 to W5 may all be constant, and the thickness of the third to fifth wiring portions 121a, 122a, 122b, 123a, and 123b may increase as the low-resistance inductor wiring 55J approaches the middle position between the first inductor wiring 30 and the second inductor wiring 40. Alternatively, the width and thickness of the third to fifth wiring portions 121a, 122a, 122b, 123a, and 123b may increase as the low-resistance inductor wiring 55J approaches the middle position between the first inductor wiring 30 and the second inductor wiring 40.

[0178] Generally speaking, in an inductor component comprising multiple inductor wirings having the same wiring width and line length and the same DC resistance, the temperature of the inductor wiring arranged on the same virtual plane increases the closer it is to the center of the inductor wirings at both ends. Therefore, in this example, by making the DC resistance of third inductor wiring 121 smaller than the DC resistance of fourth inductor wirings 122A and 122B and the DC resistance of fifth inductor wirings 123A and 123B, the DC resistance of low-resistance inductor wiring 55J closest to the center between first inductor wiring 30 and second inductor wiring 40 is minimized. Consequently, even when the same current flows through first to fifth inductor wirings 30, 40, 121, 122A, 122B, 123A, and 123B, heat accumulation, particularly near the center between first inductor wiring 30 and second inductor wiring 40, and the resulting high temperature can be suppressed. As a result, it is possible to suppress a decrease in reliability due to heat.

[0179] Furthermore, the closer the low-resistance inductor wiring 55J is to the middle position between the first inductor wiring 30 and the second inductor wiring 40, the larger the cross-sectional area of ​​the third to fifth wiring portions 121a, 122a, 122b, 123a, and 123b. This makes it easy to achieve a structure in which the DC resistance decreases the closer the low-resistance inductor wiring 55J is to the middle position between the first inductor wiring 30 and the second inductor wiring 40. Furthermore, even when the same current flows through the first to fifth inductor wirings 30, 40, 121, 122A, 122B, 123A, and 123B, the closer the low-resistance inductor wiring 55J is to the middle position between the first inductor wiring 30 and the second inductor wiring 40, the more heat generation can be suppressed.

[0180] Furthermore, the number of the plurality of low-resistance inductor wirings 55J arranged between the first inductor wiring 30 and the second inductor wiring 40 is not limited to five. For example, the number of fourth inductor wirings serving as low-resistance inductor wirings 55J located between the second inductor wiring 40 and the third inductor wiring 121 may be one or three or more. Furthermore, for example, the number of fifth inductor wirings serving as low-resistance inductor wirings 55J located between the first inductor wiring 30 and the third inductor wiring 121 may be one or three or more.

[0181] Furthermore, when multiple low-resistance inductor lines are located between the first inductor line 30 and the second inductor line 40, it is not necessary to configure the low-resistance inductor lines to have a lower DC resistance as they are closer to the middle of the first inductor line 30 and the second inductor line 40. For example, the DC resistance of all low-resistance inductor lines may be equal.

[0182] Furthermore, when multiple inductor lines are located between the first inductor line 30 and the second inductor line 40, not all of the inductor lines need to be low-resistance inductor lines. Alternatively, at least one of the multiple inductor lines located between the first inductor line 30 and the second inductor line 40 may be a third inductor line, i.e., a low-resistance inductor line.

[0183] In the first embodiment described above, all of the first to third vertical wirings 61 to 63 have the same cross-sectional area. However, the cross-sectional areas of the first to third vertical wirings 61 to 63 may be different from one another. The cross-sectional area of ​​a vertical wiring refers to the area through which current flows, specifically the area of ​​a cross section parallel to a virtual plane.

[0184] For example, in Figure 14 (a) Figure 14 (b) and Figure 14 In the inductor component 1N shown in (c), the cross-sectional area of ​​the third vertical wiring 130 connected to the third inductor wiring 50, which serves as the low-resistance inductor wiring 55, is larger than the first vertical wiring 61 connected to the first inductor wiring 30 and the second vertical wiring 62 connected to the second inductor wiring 40. In the inductor component 1N, the diameter of the third vertical wiring 130 is larger than the diameters of the first vertical wiring 61 and the second vertical wiring 62. By increasing the cross-sectional area of ​​the third vertical wiring 130 near the connection portion with the circuit substrate, where electromigration is likely to occur, heat generation in the third vertical wiring 130 can be suppressed and heat dissipation can be improved. This further reduces electromigration at the connection portion between the inductor component 1N and the circuit substrate. Similar modifications can also be made to the second embodiment described above.

[0185] ·like Figure 15 (a) Figure 15 (b) and Figure 15 As shown in (c), a third external terminal 142 may also be provided on the lower surface 20d of the main body 20, which is parallel to the virtual plane S1. The third external terminal 142 is exposed externally and connected to the third inductor wiring 50, which serves as the low-resistance inductor wiring 55, via a third vertical wiring 141. In this example, the third vertical wiring 141 extends through the main body 20 in a direction perpendicular to the virtual plane S1, from the lower surface of the third connecting portion 52 to the lower surface 20d of the main body 20. Furthermore, the third external terminal 142 covers the lower end surface of the third vertical wiring 141 exposed from the lower surface 20d of the main body 20. Furthermore, the third vertical wiring 141 is electrically connected to the third connecting portion 52 and the third external terminal 142.

[0186] This improves the degree of freedom in mounting the inductor component 1P. Furthermore, heat generated by the low-resistance inductor wiring 55 can be dissipated through the third external terminal 142, which is exposed to the outside from the lower surface 20d. This improves the heat dissipation of the low-resistance inductor wiring 55, thereby suppressing electromigration at the connection between the low-resistance inductor wiring 55 and the circuit board. Consequently, a reduction in reliability due to heat can be further suppressed. Furthermore, similar modifications can be made to the second embodiment described above.

[0187] ·like Figure 16 (a) and Figure 16 As with the inductor component 1Q shown in FIG. 1 (b), a dummy terminal 143 may be provided on at least one of the upper surface 20a and lower surface 20d of the main body 20, which are parallel to the imaginary plane S1, and which is not electrically connected to the first to third vertical wirings 61 to 63. In this example, the dummy terminal 143 is provided on the lower surface 20d of the main body 20. Furthermore, in this example, the dummy terminal 143 is provided on the lower surface 20d of the main body 20 at a position that overlaps with the third connection portion 52 of the third inductor wiring 50, which serves as the low-resistance inductor wiring 55, and the third vertical wiring 63, in a direction perpendicular to the imaginary plane S1. This allows heat to be dissipated from the dummy terminal 143, further suppressing reliability degradation caused by heat.

[0188] In the first embodiment described above, the first to third inductor traces 30 , 40 , and 50 are located on the same virtual plane S1 and are arranged in the planar direction of virtual plane S1 . However, the arrangement direction of the first to third inductor traces 30 , 40 , and 50 is not limited to this.

[0189] Figure 17 (a) and Figure 17 The inductor component 1R shown in (b) includes a main body 20, a first inductor wiring 30 located on a first imaginary plane S11 within the main body 20, and a second inductor wiring 40 extending parallel to the first imaginary plane S11 within the main body 20. Furthermore, the inductor component 1R includes a third inductor wiring 50 located between the first inductor wiring 30 and the second inductor wiring 40 within the main body 20 and extending parallel to the first imaginary plane S11. Furthermore, the inductor component 1R includes a vertical wiring extending from each of the first to third inductor wirings 30, 40, and 50 and penetrating the main body 20 in a direction perpendicular to the first imaginary plane S11.

[0190] exist Figure 17In (a), the portion of the inductor component 1R located above the first inductor wiring 30 is omitted and not shown. The second inductor wiring 40 is located on a second virtual plane S12 parallel to the first virtual plane S11. The third inductor wiring 50 is located between the first virtual plane S11 and the second virtual plane S12 and is arranged along the first and second inductor wirings 30, 40 along the parallel arrangement direction F2. In other words, the first to third inductor wirings 30, 40, 50 are arranged in a direction perpendicular to the first virtual plane S11.

[0191] The first to third inductor wirings 30, 40, 50 are connected in a direction perpendicular to the first virtual plane S11 (in Figure 17 In (b), the first to third inductor traces 30, 40, and 50 are stacked in the vertical direction (in the vertical direction) and arranged at equal intervals in a direction perpendicular to the first virtual plane S11. Therefore, the parallel arrangement direction F2 of the first to third inductor traces 30, 40, and 50 is perpendicular to the first virtual plane S11. Furthermore, although partially omitted from the illustration, the first connection portion 32 of the first inductor trace 30, the second connection portion of the second inductor trace 40, and the third connection portion of the third inductor trace 50 are offset in the planar direction of the first virtual plane S11. Furthermore, vertical traces (not shown) extend from each of the first to third connection portions to the surface of the main body 20. These vertical traces penetrate the main body 20 in the parallel arrangement direction F2 and are exposed to the outside of the main body 20. If, of the two end faces of the main body 20 in the parallel arrangement direction F2, the end face on the first inductor trace 30 side is designated as the first end face 20e, and the end face on the second inductor trace 40 side is designated as the second end face 20f, the vertical traces, for example, are exposed to the outside of the main body 20 from the first end face 20e. These vertical wirings are similar to the first to third vertical wirings 61 to 63 of the above-described embodiment. The end surfaces of the vertical wirings exposed to the outside of the main body 20 are covered by external terminals (not shown). However, the end surfaces of the vertical wirings exposed to the outside of the main body 20 do not necessarily need to be covered by external terminals.

[0192] The third inductor wiring 50 is a low-resistance inductor wiring 55 having a lower DC resistance than the first and second inductor wirings 30 and 40. In this example, the first to third inductor wirings 30, 40, and 50 have equal thickness. Furthermore, the wiring width W11 of the first wiring portion 31 of the first inductor wiring 30 is equal to the wiring width W21 of the second wiring portion 41 of the second inductor wiring 40. Furthermore, the wiring width W31 of the third wiring portion 51 of the third inductor wiring 50 is thicker than the wiring widths W11 and W21 of the first and second wiring portions 31 and 41, respectively. Consequently, the DC resistance of the third inductor wiring 50 is lower than that of the first and second inductor wirings 30 and 40. The method for making the DC resistance of the third inductor wiring 50, which is the low-resistance inductor wiring 55, lower than that of the first and second inductor wirings 30 and 40 is not limited to this method; the method described in the above-mentioned modification example can also be used.

[0193] According to the above configuration, the same effects as (1-1), (1-2), (1-3), and (1-5) of the above-mentioned first embodiment can be obtained.

[0194] In this example, the distance T11 between the first end face 20e adjacent to the first inductor line 30 and the first wiring portion 31 can be made shorter than the distance T12 between the third wiring portion 51 of the third inductor line 50, which serves as the low-resistance inductor line 55 adjacent to the first inductor line 30, and the first wiring portion 31. Furthermore, the distance T13 between the second end face 20f adjacent to the second inductor line 40 and the second wiring portion 41 can be made shorter than the distance T14 between the third wiring portion 51 of the third inductor line 50, which serves as the low-resistance inductor line 55 adjacent to the second inductor line 40, and the second wiring portion 41. In this case, the same operational effects as those of (1-4) of the first embodiment can be achieved.

[0195] Furthermore, in the inductor component 1R, a fourth inductor wiring line serving as a low-resistance inductor wiring line may be arranged between the second inductor wiring line 40 and the third inductor wiring line 50. Furthermore, a fifth inductor wiring line serving as a low-resistance inductor wiring line may be arranged between the first inductor wiring line 30 and the third inductor wiring line 50. Even in this manner, since heat generation is suppressed near the low-resistance inductor wiring line 55, a decrease in reliability due to heat can be suppressed.

[0196] The inductor component may have a structure including a plurality of inductor wirings arranged in a matrix.

[0197] For example, Figure 18 (a) and Figure 18The inductor component 1S shown in (b) includes a main body 20, a plurality of inductor wirings 150 arranged in a matrix within the main body 20, and vertical wiring extending from each inductor wiring 150 to the surface of the main body 20, extending through the interior of the main body 20 in the direction F3 in which the inductor wirings 150 in each column are arranged. Each row of inductor wirings 150 has three or more inductor wirings, and the closer the inductor wirings 150 are to the center between the two inductor wirings 150 at the ends of the row, the lower the DC resistance. Furthermore, each column of inductor wirings 150 has three or more inductor wirings, and the closer the inductor wirings 150 are to the center between the two inductor wirings 150 at the ends of the column, the lower the DC resistance.

[0198] The inductor component 1S, for example, has nine inductor wirings 150 arranged in a matrix of three rows and three columns. The main body 20, in which these inductor wirings 150 are located, is stacked with, for example, four layers of magnetic material, similar to the magnetic material layers 21 and 22 of the above-described embodiment. Three of the nine inductor wirings 150 are arranged at equal intervals on a first virtual plane S21 within the main body 20, with the wiring width direction forming a side-by-side arrangement. Furthermore, the other three inductor wirings 150 are arranged at equal intervals on a second virtual plane S22 within the main body 20, parallel to the first virtual plane S21, with the wiring width direction forming a side-by-side arrangement. Furthermore, the remaining three inductor wirings 150 are arranged at equal intervals on a third virtual plane S23 within the main body 20, parallel to the first virtual plane S21 and located between the first and second virtual planes S21 and S22, with the wiring width direction forming a side-by-side arrangement. Each of the three inductor wirings 150 arranged on each virtual plane S21, S22, and S23 constitutes a row. Figure 18 In (a) of FIG. 1 , only three inductor wirings 150 located on the first virtual plane S21 are shown among the nine inductor wirings 150 .

[0199] Furthermore, the three inductor wiring lines 150 on the first virtual plane S21, the three inductor wiring lines 150 on the second virtual plane S22, and the three inductor wiring lines 150 on the third virtual plane S23 are stacked so that three inductor wiring lines 150 are arranged in a direction perpendicular to the first virtual plane S21. Furthermore, each three inductor wiring lines 150 arranged in a direction perpendicular to the first virtual plane S21 forms a column. That is, each three inductor wiring lines 150 forming each column are arranged in a direction perpendicular to the first virtual plane S21.

[0200] Each inductor wiring 150 includes a wiring portion 151 and connection portions 152 provided at both ends of the wiring portion 151. The wiring portions 151 of the nine inductor wirings 150 are parallel to each other. The connection portions 152 of each inductor wiring 150 are offset in the planar direction of the first virtual plane S21. Furthermore, a vertical wiring (not shown) is connected to each connection portion 152. This vertical wiring extends from the connection portion 152 to the surface of the main body 20 in the direction F3 in which the inductor wiring 150 in each column is arranged (in this example, the direction perpendicular to the first virtual plane S21) and is exposed to the outside of the main body 20. This vertical wiring is similar to the first to fourth vertical wirings 61 to 64 in the above-mentioned embodiment. The end surfaces of the vertical wiring exposed to the outside of the main body 20 are covered by external terminals (not shown). These external terminals are similar to the first to fourth external terminals 71 to 74 in the above-mentioned embodiment. However, the end surfaces of the vertical wiring exposed to the outside of the main body 20 do not necessarily need to be covered by external terminals.

[0201] The closer the inductor wiring 150 in each row is to the inductor wiring 150 located in the middle of the two inductor wirings 150 at both ends of the row, the smaller the DC resistance. In this example, the thickness of each inductor wiring 150 is equal. In addition, the wiring width of the wiring portion 151 of the two inductor wirings 150 located at both ends of the row (in Figure 18 (b), the width in the left-right direction) is equal. Furthermore, the wiring portion 151 of the inductor wiring 150 in the center of the row has a larger wiring width than the two inductor wirings 150 at both ends of the row. Consequently, the DC resistance of the inductor wiring 150 in the center of the row is smaller than that of the two inductor wirings 150 at both ends of the row. The method for reducing the DC resistance of the inductor wiring 150 in the center of the row relative to the two inductor wirings 150 at both ends of the row is not limited to this method; the method described in the above-mentioned modification example can also be used.

[0202] Furthermore, the closer the inductor wiring 150 in each column is to the inductor wiring located midway between the two inductor wirings 150 at the ends of the column, the lower its DC resistance. In this example, the wiring portions 151 of the two inductor wirings 150 at the ends of the column have the same wiring width. Furthermore, the wiring portion 151 of the inductor wiring 150 in the center of the column has a greater width than the two inductor wirings 150 at the ends of the column. Consequently, the DC resistance of the inductor wiring 150 in the center of the column is lower than that of the two inductor wirings 150 at the ends of the column. Furthermore, the method for making the DC resistance of the inductor wiring 150 in the center of the column lower than that of the two inductor wirings 150 at the ends of the column is not limited to this method; the method described in the above-mentioned modification example can also be used.

[0203] In this way, even when the same current flows through each row of inductor wiring 150, the inductor wiring 150 in each row, where heat is particularly likely to accumulate, is less likely to heat up near the center of the two inductor wirings 150 located at the two ends of the row. Consequently, in each row of inductor wiring 150, localized high temperatures near the inductor wiring 150 located between the two inductor wirings 150 located at the two ends of the row are suppressed. As a result, reliability degradation due to heat can be suppressed.

[0204] Furthermore, in each row of inductor wiring 150, the inductor wiring 150 located between the two inductor wirings 150 at the ends of the row is prevented from reaching a higher temperature than the two inductor wirings 150 at the ends of the row. Therefore, in each row of inductor wiring 150, electromigration can be suppressed at the connection portion between the vertical wiring connecting the inductor wiring 150 located between the two inductor wirings 150 at the ends of the row and the circuit board on which the inductor component 1S is mounted.

[0205] Similarly, even when the same current flows through each inductor wiring 150 in each column, the closer to the center between the two inductor wirings 150 at the two ends of the column, where heat is particularly likely to accumulate, the less likely the inductor wiring 150 in each column will heat up. Therefore, in each column of inductor wiring 150, localized high temperatures near the inductor wiring 150 between the two inductor wirings 150 at the two ends of the column are suppressed. As a result, reliability degradation due to heat can be suppressed.

[0206] Furthermore, in each column of inductor wiring 150, the inductor wiring 150 located between the two inductor wirings 150 at the ends of the column is prevented from reaching a higher temperature than the two inductor wirings 150 at the ends of the column. Therefore, in each column of inductor wiring 150, electromigration can be suppressed at the connection portion between the vertical wiring connecting the inductor wiring 150 located between the two inductor wirings 150 at the ends of the column and the circuit board on which the inductor component 1S is mounted.

[0207] In the above embodiments, the first inductor wiring 30, the second inductor wiring 40, the third inductor wiring 50, and the fourth inductor wiring 50A extend in a straight line. However, the shape of the inductor wiring is not limited to this; for example, a spiral wiring may be used. A spiral wiring is a wiring that forms a curve (a two-dimensional curve) extending on a plane (including an imaginary plane). The number of turns drawn by this curve may be more than one, less than one, or may include a partially straight portion. Furthermore, the inductor wiring may also use known shapes such as a zigzag shape.

[0208] Furthermore, the first to fourth connecting portions 32, 42, 52, 52A are not limited to being substantially square, but may be substantially rectangular. Furthermore, the first to fourth connecting portions 32, 42, 52, 52A are not limited to being quadrilateral, but may be circular, elliptical, polygonal, or a combination thereof.

[0209] For example, Figure 19 (a) and Figure 19 The first to fourth inductor wirings 160, 170, 180A, and 180B of the inductor component 1T shown in (b) are spiral wirings wound in a spiral shape on the virtual plane S1. Figure 19 Although not shown in the figure, the first to fourth inductor wirings 160, 170, 180A, 180B are formed in two layers so as to look like a spiral when viewed from a direction perpendicular to the virtual plane S1. Specifically, when each of the first to fourth inductor wirings 160, 170, 180A, 180B rotates one circle from one end on the virtual plane S1, that is, Figure 19 In (a), near the intersection of the wiring, the wiring moves to the upper layer or the lower layer through the via hole, and further extends to the other end in the layer after the movement.

[0210] Third inductor wiring 180A, located between first inductor wiring 160 and second inductor wiring 170, is low-resistance inductor wiring 185 having a lower DC resistance than first inductor wiring 160 and second inductor wiring 170. Furthermore, fourth inductor wiring 180B, located between second inductor wiring 170 and third inductor wiring 180A, is low-resistance inductor wiring 185 having a lower DC resistance than first inductor wiring 160 and second inductor wiring 170.

[0211] In this example, the first to fourth inductor traces 160, 170, 180A, and 180B have equal thickness. Furthermore, the width of the third trace portion 181a of the third inductor trace 180A is greater than the width of the first trace portion 161 of the first inductor trace 160 and the width of the second trace portion 171 of the second inductor trace 170. Furthermore, the width of the fourth trace portion 181b of the fourth inductor trace 180B is greater than the width of the first trace portion 161 and the width of the second trace portion 171. By making the widths of the third trace portion 181a and the fourth trace portion 181b greater than the widths of the first trace portion 161 and the second trace portion 171, the DC resistance of the third and fourth inductor traces 180A and 180B can be made smaller than the DC resistance of the first and second inductor traces 160 and 170. Therefore, heat generation of the third inductor wiring 180A and the fourth inductor wiring 180B is suppressed, and thus a decrease in reliability due to heat can be suppressed.

[0212] Furthermore, since third inductor wiring 180A is low-resistance inductor wiring 185, third wiring portion 181a corresponds to an example of a low-resistance wiring portion, and third connecting portions 52 provided at both ends of third wiring portion 181a correspond to an example of a low-resistance connecting portion. Furthermore, since fourth inductor wiring 180B is low-resistance inductor wiring 185, fourth wiring portion 181b corresponds to an example of a low-resistance wiring portion, and fourth connecting portions 52A provided at both ends of fourth wiring portion 181b correspond to an example of a low-resistance connecting portion.

[0213] In each of the above embodiments, the magnetic material layers 21 and 22 may be formed from an insulating resin containing magnetic powder such as metal magnetic powder or ferrite powder. In this case, an insulating layer having electrical insulation properties may be further provided between the surfaces of the first to fourth inductor traces 30, 40, 50, and 50A and the main body 20. Furthermore, the main body 20 need not necessarily include the magnetic material layers 21 and 22. Instead of including the magnetic material layers 21 and 22, the main body 20 may be laminated with an insulating layer composed of a non-magnetic sintered body such as non-magnetic ferrite, glass, or alumina, or a non-magnetic insulating resin containing no magnetic material, such as epoxy resin containing silica filler. Inductor components having such a main body 20 can also suppress thermal degradation of reliability.

Claims

1. An inductor component comprising: main body; a first inductor wiring located inside the main body and extending on a virtual plane; a second inductor wiring located inside the main body and extending parallel to the virtual plane; a third inductor wiring located between the first inductor wiring and the second inductor wiring within the main body and extending parallel to the virtual plane; a fourth inductor wiring located between the second inductor wiring and the third inductor wiring within the main body and extending parallel to the virtual plane; as well as a vertical wiring extending from each of the first inductor wiring to the third inductor wiring to the surface of the main body and penetrating the interior of the main body in a direction perpendicular to the virtual plane; The third inductor wiring and the fourth inductor wiring are low-resistance inductor wirings having a DC resistance lower than that of the first inductor wiring and the second inductor wiring. The first inductor wiring includes a first wiring portion and a first connecting portion, wherein the first connecting portion is provided at both ends of the first wiring portion and is connected to the vertical wiring. The second inductor wiring includes a second wiring portion and a second connecting portion, wherein the second connecting portion is provided at both ends of the second wiring portion and is connected to the vertical wiring. The plurality of low-resistance inductor wirings located between the first inductor wiring and the second inductor wiring each include a low-resistance wiring portion and a low-resistance connecting portion, wherein the low-resistance connecting portion is provided at both ends of the low-resistance wiring portion and is connected to the vertical wiring. The closer the low-resistance inductor wiring is to a position intermediate between the first wiring portion and the second wiring portion, the larger the cross-sectional area of ​​the low-resistance wiring portion.

2. The inductor component according to claim 1, wherein A cross-sectional area of ​​at least a portion of the low-resistance inductor wiring is larger than a cross-sectional area of ​​the first inductor wiring and the second inductor wiring.

3. The inductor component according to claim 1, wherein A wiring width of at least a portion of the low-resistance inductor wiring is larger than a wiring width of the first inductor wiring and the second inductor wiring.

4. The inductor component according to claim 1, wherein further comprising a fifth inductor wiring, the fifth inductor wiring being located between the first inductor wiring and the third inductor wiring within the main body and extending parallel to the virtual plane; The fifth inductor wiring is the low-resistance inductor wiring. The DC resistance of the third inductor wiring is smaller than the DC resistance of the fourth inductor wiring and the fifth inductor wiring.

5. The inductor component according to claim 1, wherein The first inductor wiring includes a first wiring portion and a first connecting portion, wherein the first connecting portion is provided at both ends of the first wiring portion and is connected to the vertical wiring. The second inductor wiring includes a second wiring portion and a second connecting portion, wherein the second connecting portion is provided at both ends of the second wiring portion and is connected to the vertical wiring. The low-resistance inductor wiring includes a low-resistance wiring portion and a low-resistance connecting portion, wherein the low-resistance connecting portion is provided at both ends of the low-resistance wiring portion and is connected to the vertical wiring. When, of the two end faces of the main body in the direction in which the first to third inductor wires are arranged side by side, the end face on the first inductor wire side is defined as a first end face, and the end face on the second inductor wire side is defined as a second end face, The distance between the first end surface and the first wiring portion is shorter than the distance between the low-resistance wiring portion of the low-resistance inductor wiring adjacent to the first inductor wiring and the first wiring portion. A distance between the second end surface and the second wiring portion is shorter than a distance between the second wiring portion and the low-resistance wiring portion of the low-resistance inductor wiring adjacent to the second inductor wiring. The inductor component according to claim 1 , wherein: The first inductor wiring includes a first wiring portion and a first connecting portion, wherein the first connecting portion is provided at both ends of the first wiring portion and is connected to the vertical wiring. The second inductor wiring includes a second wiring portion and a second connecting portion, wherein the second connecting portion is provided at both ends of the second wiring portion and is connected to the vertical wiring. The third inductor wiring includes a third wiring portion and a third connecting portion, wherein the third connecting portion is provided at both ends of the third wiring portion and is connected to the vertical wiring. The fourth inductor wiring includes a fourth wiring portion and a fourth connecting portion, wherein the fourth connecting portion is provided at both ends of the fourth wiring portion and is connected to the vertical wiring. The first wiring portion and the second wiring portion have the same wiring width. The fourth wiring portion is located closer to the second wiring portion than the fourth connecting portion.

7. The inductor component according to claim 1, wherein The low-resistance inductor wiring has a shorter line length than the first inductor wiring and the second inductor wiring.

8. The inductor component according to claim 1, wherein The low-resistance inductor wiring includes a low-resistance wiring portion and a low-resistance connecting portion, wherein the low-resistance connecting portion is provided at both ends of the low-resistance wiring portion and is connected to the vertical wiring. The low-resistance wiring portion is composed of a plurality of parallel wirings electrically connected in parallel between the low-resistance connection portions.

9. The inductor component according to claim 8, wherein The second inductor wiring extends on the virtual plane. One of the plurality of parallel wirings is a main wiring extending on the virtual plane, and the remaining parallel wirings are sub-wirings extending in parallel with the virtual plane on a plane different from the virtual plane.

10. The inductor component according to claim 9, wherein The sub-wiring is located at a position overlapping with the main wiring in a direction perpendicular to the virtual plane.

11. The inductor component according to claim 1, wherein The vertical wiring connected to the low-resistance inductor wiring has a larger cross-sectional area than the vertical wiring connected to the first inductor wiring and the vertical wiring connected to the second inductor wiring.

12. The inductor component according to claim 1, wherein The main body has external terminals on its upper and lower surfaces, which are parallel to the virtual plane. The external terminals are exposed to the outside and connected to the low-resistance inductor wiring via the vertical wiring.

13. The inductor component according to claim 1, wherein A dummy terminal is provided on at least one of an upper surface and a lower surface of the main body that are parallel to the dummy plane. The dummy terminal is exposed to the outside and is electrically connected to the vertical wiring.

14. The inductor component according to claim 1, wherein The main body is a sintered body.

15. The inductor component according to claim 1, wherein The main body includes a magnetic material layer made of an insulating resin containing magnetic powder.

16. The inductor component according to claim 1, wherein The first to third inductor wirings are arranged in a direction perpendicular to the virtual plane.

17. An inductor component comprising: main body; a first inductor wiring located inside the main body and extending on a virtual plane; a second inductor wiring located inside the main body and extending parallel to the virtual plane; a third inductor wiring located between the first inductor wiring and the second inductor wiring within the main body and extending parallel to the virtual plane; a fourth inductor wiring located between the second inductor wiring and the third inductor wiring within the main body and extending parallel to the virtual plane; as well as a vertical wiring extending from each of the first inductor wiring to the third inductor wiring to the surface of the main body and penetrating the interior of the main body in a direction perpendicular to the virtual plane; The third inductor wiring and the fourth inductor wiring are low-resistance inductor wirings having a DC resistance lower than that of the first inductor wiring and the second inductor wiring. The first inductor wiring includes a first wiring portion and a first connecting portion, wherein the first connecting portion is provided at both ends of the first wiring portion and is connected to the vertical wiring. The second inductor wiring includes a second wiring portion and a second connecting portion, wherein the second connecting portion is provided at both ends of the second wiring portion and is connected to the vertical wiring. The third inductor wiring includes a third wiring portion and a third connecting portion, wherein the third connecting portion is provided at both ends of the third wiring portion and is connected to the vertical wiring. The fourth inductor wiring includes a fourth wiring portion and a fourth connecting portion, wherein the fourth connecting portion is provided at both ends of the fourth wiring portion and is connected to the vertical wiring. The first wiring portion and the second wiring portion have the same wiring width. The fourth wiring portion is located closer to the second wiring portion than the fourth connecting portion.

18. An inductor component comprising: main body; a first inductor wiring located inside the main body and extending on a virtual plane; a second inductor wiring located inside the main body and extending parallel to the virtual plane; a third inductor wiring located between the first inductor wiring and the second inductor wiring within the main body and extending parallel to the virtual plane; a fourth inductor wiring located between the second inductor wiring and the third inductor wiring within the main body and extending parallel to the virtual plane; a fifth inductor wiring located between the first inductor wiring and the third inductor wiring within the main body and extending parallel to the virtual plane; and a vertical wiring extending from each of the first inductor wiring to the third inductor wiring to the surface of the main body and penetrating the interior of the main body in a direction perpendicular to the virtual plane; The third inductor wiring, the fourth inductor wiring, and the fifth inductor wiring are low-resistance inductor wirings having a DC resistance lower than that of the first inductor wiring and the second inductor wiring. The third inductor wiring has a DC resistance smaller than the DC resistance of the fourth inductor wiring and the fifth inductor wiring.

19. An inductor component comprising: main body; a first inductor wiring located inside the main body and extending on a virtual plane; a second inductor wiring located inside the main body and extending parallel to the virtual plane; a third inductor wiring located between the first inductor wiring and the second inductor wiring within the main body and extending parallel to the virtual plane; as well as a vertical wiring extending from each of the first inductor wiring to the third inductor wiring to the surface of the main body and penetrating the interior of the main body in a direction perpendicular to the virtual plane; The third inductor wiring is a low-resistance inductor wiring having a DC resistance smaller than that of the first inductor wiring and the second inductor wiring. The first inductor wiring includes a first wiring portion and a first connecting portion, wherein the first connecting portion is provided at both ends of the first wiring portion and is connected to the vertical wiring. The second inductor wiring includes a second wiring portion and a second connecting portion, wherein the second connecting portion is provided at both ends of the second wiring portion and is connected to the vertical wiring. The low-resistance inductor wiring includes a low-resistance wiring portion and a low-resistance connecting portion, wherein the low-resistance connecting portion is provided at both ends of the low-resistance wiring portion and is connected to the vertical wiring. The low-resistance wiring portion is composed of a plurality of parallel wirings electrically connected in parallel between the low-resistance connection portions.

20. An inductor component comprising: main body; a first inductor wiring located inside the main body and extending on a virtual plane; a second inductor wiring located inside the main body and extending parallel to the virtual plane; a third inductor wiring located between the first inductor wiring and the second inductor wiring within the main body and extending parallel to the virtual plane; as well as a vertical wiring extending from each of the first inductor wiring to the third inductor wiring to the surface of the main body and penetrating the interior of the main body in a direction perpendicular to the virtual plane; The third inductor wiring is a low-resistance inductor wiring having a DC resistance smaller than that of the first inductor wiring and the second inductor wiring. When the end faces on the first inductor wiring side of the two end faces of the main body in the parallel arrangement direction of the first inductor wiring to the third inductor wiring are defined as first end faces, The first inductor wiring has a shape that is convex toward the first end surface.

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